bga 267 pitch 1 - 3d plus · e 1.00 max. weight: tbd parameter symbol min max unit supply voltage...

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3D PLUS reserves the right to cancel or change specifications without notice. MEMORY MODULE 3D4D32G72LB2758 3D4D32G72LB2758 32Gbit DDR4 SDRAM organized as 512Mbx72 Industry standard ball-out 267-ball BGA – Lead-free RoHS Configuration 512M x 72 V DD /V DDQ = 1.2V±0.06V V PP = 2.375V to 2.75V Interface: Pseudo Open Drain (POD) 8n-bit prefetch architecture 8 internal banks x72 (2 groups of 4 banks each) On-die termination (ODT) : nominal values of RZQ/7, RZQ/5 (RZQ=240Ω) Programmable CAS latency ON-Die, internal, adjustable V REFDQ generation Fixed burst lengths of 8 and burst chop (BC) of 4 Write leveling Self refresh mode Temperature control refresh (TCR) Nominal, park and dynamic on-die termination (ODT) 3D PLUS offers a new 32 Gbit DDR4 SDRAM compatible with the industry standard footprint. It is organized as 512Mx72 Our products are available at 2400 Mbps in Commercial, Industrial and Military temperature range. Thanks to the high density patented technology the memories are embedded in a small form factor device without compromising electrical or thermal performance. This device is ideal for high density memory applications that require high speed transfer and compatibility with standard servers and networking equipment. DDR4 SDRAM BGA 267 Pitch 1.00 GENERAL DESCRIPTION 3DFP-0758-0 — April 2020 KEY FEATURES PIN ASSIGNMENT (top view) A B C D E F G H J K L M N P R T U V W Y AA AB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 AC AD AE AF VSS VSS VSS VDD VDD VDD DQ54 DQ52 DQ48 DM7_N DQ60 DQ58 VSS NC NC NC VDD VSS DQ18 DQ16 DQS2_T DQS2-C DQ62 DQ56 DQS6_C DQS6_T VSS NC NC NC NC NC DQ22 DQ20 VSS VSS VSS VDD VDD DQ50 NC NC NC NC NC NC VSS DQ19 VSS VSS VSS VSS DQ55 DQ51 NC VSS VSS VSS VSS VDD DQ53 DQ49 VSS VDD VDD VDD DM3_N DQ28 VSS DM6_N VDD VDD VDD VSS DQ30 DQ26 DQS7_T DQS7_C VSS VDD VDD VDD VDD DQ24 DQ59 DQ57 VDD NC NC NC VSS VSS DQ61 DQ63 NC NC NC NC VDD VSS DQ64 DQ66 NC VSS VSS VSS DQ31 DQ27 DQS3_T DQS3_C VDD NC NC NC DQ29 DQ25 DQS8_C DQS8_C VDD NC VREFCA VREFCA VSS VDD DQ68 DQ70 RESET_N VTT VREFCA VREFCA VSS DQ12 DQ71 DQ67 VTT VTT VREFCA VREFCA DM1_N DQ10 DQ69 DQ65 VTT VTT NC VDD DQ14 DQ8 VSS DM8_N VTT VTT NC CKE VDD VDD VSS DM5_N VTT VTT VDD A14 VSS VSS DQ46 DQ44 VTT A6 BA0 BG0 DQ11 DQS1_C DQ40 DQ42 VDD A8 A4 A10 DQ13 DQS1_T DQS4_T DQS4_C A11 A2 A0 ACT_N DQ15 DQ9 VSS DQ32 PAR A1 A3 A12 VDD CK_T ODT DQ4 DQ0 DQS0_T DQS0_C VSS VSS DQ34 A9 A7 A5 BA1 CS_N CK_C VSS DQ6 DQ2 VSS VSS VSS DQ36 DQ38 A13 ALERT_N VDD VSS A15 A16 DQ7 DQ3 VDD DQ1 DM0_N VSS DQ35 DQ33 VSS VPP VPP VPP VDD VDD VSS DQ5 DQ37 DQ47 DQ45 DQ41 DQS5_C DQS5_T VPP VPP VPP VPP VDD VDD VSS VSS DQ39 DM4_N VSS VDD DQ43 VSS VSS NC VSS DQ23 DQ21 DQ17 DM2_N

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Page 1: BGA 267 Pitch 1 - 3D PLUS · e 1.00 Max. weight: TBD Parameter Symbol Min Max Unit Supply Voltage VDD 1.14 1.26 V Supply Voltage VPP 2.375 2.75 V Parameter Symbol Value Unit Voltage

3D PLUS reserves the right to cancel or change specifications without notice.

MEMORY MODULE

3D4D32G72LB2758

3D4D32G72LB2758

32Gbit DDR4 SDRAM organized as 512Mbx72

Industry standard ball-out

267-ball BGA – Lead-free RoHS

Configuration 512M x 72

VDD/VDDQ = 1.2V±0.06V

VPP = 2.375V to 2.75V

Interface: Pseudo Open Drain (POD)

8n-bit prefetch architecture

8 internal banks x72 (2 groups of 4 banks each)

On-die termination (ODT) : nominal values of RZQ/7,

RZQ/5 (RZQ=240Ω)

Programmable CAS latency

ON-Die, internal, adjustable VREFDQ generation

Fixed burst lengths of 8 and burst chop (BC) of 4

Write leveling

Self refresh mode

Temperature control refresh (TCR)

Nominal, park and dynamic on-die termination (ODT)

3D PLUS offers a new 32 Gbit DDR4 SDRAM compatible with

the industry standard footprint. It is organized as 512Mx72

Our products are available at 2400 Mbps in Commercial,

Industrial and Military temperature range.

Thanks to the high density patented technology the memories

are embedded in a small form factor device without

compromising electrical or thermal performance.

This device is ideal for high density memory applications that

require high speed transfer and compatibility with standard

servers and networking equipment.

DDR4 SDRAM

BGA 267 Pitch 1.00

GENERAL DESCRIPTION

3DFP-0758-0 — April 2020

KEY FEATURES

PIN ASSIGNMENT (top view)

A

B

C

D

E

F

G

H

J

KL

M

N

P

R

T

U

V

W

Y

AA

AB

1 2 3 4 5 6 7 8 9 10 11 12 13 14

AC

AD

AE

AF

VSS VSS VSS VDD VDD VDD DQ54 DQ52 DQ48 DM7_N DQ60 DQ58 VSS

NC NC NC VDD VSS DQ18 DQ16 DQS2_T DQS2-C DQ62 DQ56 DQS6_C DQS6_TVSS

NC NC NC NC NC DQ22 DQ20 VSS VSS VSS VDD VDD DQ50NC

NC NC NC NC NC VSS DQ19 VSS VSS VSS VSS DQ55 DQ51NC

VSS VSS VSS VSS VDD DQ53 DQ49VSS

VDD VDD VDD DM3_N DQ28 VSS DM6_NVDD

VDD VDD VSS DQ30 DQ26 DQS7_T DQS7_CVSS

VDD VDD VDD VDD DQ24 DQ59 DQ57VDD

NC NC NC VSS VSS DQ61 DQ63NC

NC NC NC VDD VSS DQ64 DQ66NC

VSS VSS VSS DQ31 DQ27 DQS3_T DQS3_CVDD

NC NC NC DQ29 DQ25 DQS8_C DQS8_CVDD

NC VREFCA VREFCA VSS VDD DQ68 DQ70RESET_N

VTT VREFCA VREFCA VSS DQ12 DQ71 DQ67VTT

VTT VREFCA VREFCA DM1_N DQ10 DQ69 DQ65VTT

VTT NC VDD DQ14 DQ8 VSS DM8_NVTT

VTT NC CKE VDD VDD VSS DM5_NVTT

VTT VDD A14 VSS VSS DQ46 DQ44VTT

A6 BA0 BG0 DQ11 DQS1_C DQ40 DQ42VDD

A8 A4 A10 DQ13 DQS1_T DQS4_T DQS4_CA11

A2 A0 ACT_N DQ15 DQ9 VSS DQ32PAR

A1 A3 A12 VDD CK_T ODT DQ4 DQ0 DQS0_T DQS0_C VSS VSS DQ34A9

A7 A5 BA1 CS_N CK_C VSS DQ6 DQ2 VSS VSS VSS DQ36 DQ38A13

ALERT_N VDD VSS A15 A16 DQ7 DQ3 VDD DQ1 DM0_N VSS DQ35 DQ33VSS

VPP VPP VPP VDD VDD VSS DQ5 DQ37 DQ47 DQ45 DQ41 DQS5_C DQS5_TVPP

VPP VPP VPP VDD VDD VSS VSS DQ39 DM4_N VSS VDD DQ43 VSSVSS

NC VSS DQ23 DQ21 DQ17 DM2_N

Page 2: BGA 267 Pitch 1 - 3D PLUS · e 1.00 Max. weight: TBD Parameter Symbol Min Max Unit Supply Voltage VDD 1.14 1.26 V Supply Voltage VPP 2.375 2.75 V Parameter Symbol Value Unit Voltage

3D PLUS reserves the right to cancel or change specifications without notice.

DC Operating Conditions and Characteristics

Dimensions (mm)

Min Max

A 4.20 4.60

A1 0.30 0.60

D 29.80 30.20

E1 18.80 19.20

b 0.50

e 1.00

Max. weight: TBD

Parameter Symbol Min Max Unit

Supply Voltage VDD 1.14 1.26 V

Supply Voltage VPP 2.375 2.75 V

Parameter Symbol Value Unit

Voltage on any ball relative to VSS

VIN, VOUT -0.4 1.5 V

Voltage on VPP pin in relative to VSS

VPP -4 +4 µA

Storage temperature TSTG -55 +150 °C

DC Characteristics

Absolute Maximum Ratings

Parameter Symbol Value Unit

Operating Current (one bank active) IDD1 100 mA

Typical Standby Current IDD3N 47 mA

Note: Permanent device damage may occur if "Absolute maximum ratings” are exceeded. Functional operation should be restricted to recommended operating condition.

Exposure to higher than recommended voltage for extended periods of time could affect device reliability.

HEADQUARTERS (FRANCE) TECHNICAL CENTER (USA) DISTRIBUTOR

408, rue Hélène Boucher - ZI 78530 Buc

Tel: +33 (0)1 30 83 26 50 E-mail: [email protected]

www.3d-plus.com

151 Callan Avenue - Suite #310 San Leandro, CA 94577

Tel: (510) 824-5591 E-mail: [email protected]

3DFP-0758-0 — April 2020

MODULE MARKING

MEMORY MODULE

3D4D32G72LB2758

32Gbit DDR4 SDRAM organized as 512Mbx72

DDR4 SDRAM

MECHANICAL DRAWING

3D4D32G72LB2758 X X

Temperature Range

C = (0°C to +70°C)

I = (-40°C to +85°C)

S = (-40°C to +95°C)

M = (-55°C to +125°C)

Quality Level

N = Commercial Grade

B = Industrial Grade

3D PLUS SALES OFFICES

E1

D

e

A

A1 b