blast media

1
tions containing flow modifiers prepared by controlled radical po- lymerization. BLAST MEDIA U.S. Patent 6,197,951. Mar. 6, 2001 R.P. Lenz, assignor to Archer Daniels Midland Co., Decatur, Ill. A polymeric blast media compris- ing a starch polymer backbone; and a grafted polymer, which is chemically bonded onto the starch polymer backbone. SUPEBABBASIVE WHEEL WITH ACTIVE BOND U.S. Patent 6,200,208. Mar. 13, 2001 R.M. Andrews et al., assignors to Norton Co., Worcester, Mass. An abrasive wheel comprising a straight, grain-reinforced abra- sive disk having a uniform width consisting essentially of abrasive grains and a complemental amount of a metal bond. ABRASIVE TOOL U.S. 6,200,360. Mar. 13, 2001 T. Imai et al., assignors to Toyoda Koki KK, Kariya and Toyoda Van Moppes KK, Okazaki, both of Japan An abrasive tool comprising an electroformed layer having su- perabrasive grains electroplated on a surface of the electroformed layer; and a plurality of dimples arranged on the surface of the electroformed layer. RECYCLING CONSISTENT PLATING SOLUTION U.S. Patent 6,200,436. Mar. 13, 2001 C.M-C. Woo, assignor to Advanced Micro Devices, Inc., Sunnyvale, Calif: A system for plating objects com- prising a container capable of holding plating solution; a con- tainer capable of holding an addi- tive for the plating solution; a plating solution reservoir con- nected to the plating solution con- tainer and additive container for mixing plating solution with the additive; a plating cell connected to the plating solution reservoir and capable of containing an ob- ject to be plated; a filtration unit connected to the plating cell; a return valve connected to the plating cell for selectively con- necting the plating cell to the plating solution reservoir and to the filtration unit; and an additive valve disposed between the addi- tive container and plating solu- tion reservoir for controlling the flow of additive therebetween. plating electronic i\ one of the world’s leadmg developers and manufacturers of power supplies for the electroplating industry We meet our customers’ demands with great flexibility, highest quality-standards and the indrviduality of custom made rolutions. plating electronic - a story of worldwide success DC Power Supplies l up to 6000 A (single unit) W up to 20000 A (parallel units) q indivrdual casmgs available m many different control and operating options m air- or watercooled IPC Show Booth #203 AESF Week Booth #I16 hendor-pe IK WwWhLOdOl-OL corn CH Phcme: (8.56~ (54. I 152 F<Ix: (8.56) .3.54-6.3.37 NC. www,rrt,~ntrrh.c-o,n E-rnail: ixrt~sln~res~ntec.h.c-ol~ 1980 Old Cuthbrrt Road Chorrv Hill. New tersev 08054-1409 Circle 030 on reader card or go to www.thru.to/webconnect Circle 056 on reader card or go to www.thru.to/webConnect January 2002 89

Upload: doanthu

Post on 01-Jan-2017

228 views

Category:

Documents


0 download

TRANSCRIPT

tions containing flow modifiers prepared by controlled radical po- lymerization.

BLAST MEDIA

U.S. Patent 6,197,951. Mar. 6, 2001 R.P. Lenz, assignor to Archer Daniels Midland Co., Decatur, Ill.

A polymeric blast media compris- ing a starch polymer backbone; and a grafted polymer, which is chemically bonded onto the starch polymer backbone.

SUPEBABBASIVE WHEEL WITH ACTIVE BOND U.S. Patent 6,200,208. Mar. 13, 2001 R.M. Andrews et al., assignors to Norton Co., Worcester, Mass.

An abrasive wheel comprising a straight, grain-reinforced abra- sive disk having a uniform width consisting essentially of abrasive

grains and a complemental amount of a metal bond.

ABRASIVE TOOL U.S. 6,200,360. Mar. 13, 2001 T. Imai et al., assignors to Toyoda Koki KK, Kariya and Toyoda Van Moppes KK, Okazaki, both of Japan

An abrasive tool comprising an electroformed layer having su- perabrasive grains electroplated on a surface of the electroformed layer; and a plurality of dimples arranged on the surface of the electroformed layer.

RECYCLING CONSISTENT PLATING SOLUTION U.S. Patent 6,200,436. Mar. 13, 2001 C.M-C. Woo, assignor to Advanced Micro Devices, Inc., Sunnyvale, Calif:

A system for plating objects com-

prising a container capable of holding plating solution; a con- tainer capable of holding an addi- tive for the plating solution; a plating solution reservoir con- nected to the plating solution con- tainer and additive container for mixing plating solution with the additive; a plating cell connected to the plating solution reservoir and capable of containing an ob- ject to be plated; a filtration unit connected to the plating cell; a return valve connected to the plating cell for selectively con- necting the plating cell to the plating solution reservoir and to the filtration unit; and an additive valve disposed between the addi- tive container and plating solu- tion reservoir for controlling the flow of additive therebetween.

plating electronic i\ one of the world’s leadmg developers and

manufacturers of power supplies for the electroplating industry

We meet our customers’ demands with great flexibility, highest

quality-standards and the indrviduality of custom made rolutions.

plating electronic - a story of worldwide success

DC Power Supplies

l up to 6000 A (single unit)

W up to 20000 A (parallel units)

q indivrdual casmgs available

m many different control

and operating options

m air- or watercooled

IPC Show Booth #203

AESF Week Booth #I16

hendor-pe IK

WwWhLOdOl-OL corn

CH Phcme: (8.56~ (54. I 152 F<Ix: (8.56) .3.54-6.3.37

NC. www,rrt,~ntrrh.c-o,n E-rnail: ixrt~sln~res~ntec.h.c-ol~ 1980 Old Cuthbrrt Road Chorrv Hill. New tersev 08054-1409

Circle 030 on reader card or go to www.thru.to/webconnect Circle 056 on reader card or go to www.thru.to/webConnect

January 2002 89