eInfochips Board & System Software Practice Overview

April 2014

2

Product Engineering Services Company

Bangalore ChennaiPune

AhmedabadNoida Tokyo

LondonBostonChicago

DallasAustin

Cedar Rapids

CincinnatiRaleigh

Sunnyvale

10 Design Centers

12 Sales Offices

1200Professionals

19 YearsSolid Track Record

Stable & SecureCash Positive, Debt-free and Profitable

BOARD DESIGN & DEVELOPMENTeInfochips Offerings

3

Product Level CapabilitiesVertex

SpartanKintex

CycloneFlexNios

A3P Series

High Speed

• USB 2.0• DDR2 / DDR3• HDMI• PCIe• SRIO• XAUI / 10G Ethernet• Serial ATA

Wireless

• GSM / CDMA• GPS• Wi-Fi a/b/g/n• Zigbee• Bluetooth• RFID

Display

• LVDS• DVI• SDI• HDMI• LCD• Component• Composite

Others

• PoE• NAND• I2C• SPI• RS232 / RS485• CAN• Touch Screen

Design Tools

•Cadence OrCAD•Mentor DxDesigner•Allegro•PADS•Expedition•Betasoft•Hyperlinx•Spectra-Quest

4

Board-Level Capabilities

•400+ Product Design•150+ Hardware Design to Prototype/Production•15+ CMs in 6 Countries

Summary

•Multi-core SoC design•Multi-processor (8 dual-core on a single board) designs•FPGA based designs

Processors

•Size: 1.5 to 140+ square inches•Layers: Up to 16 Layer PCB•Frequency: Few KHz to 3.0 Gbps•Technology: HDI (2-level micro vias, Via on Pad)

Board

•4200 + with 25 BGAs• - 1031 pins with 0.65mm pitch

Components

5%3%

71%

21%

Layout density >10.5 to 0.90.1 to 0.490.05 to 0.09<0.05

31%

28%

41%

PCB layer countUp to 8 layers8 to 10 layers10 to 16 layers

38%

35%

26%

Board Frequencies>1GHz500MHz to 1GHz<500MHz

5

Testing and Production Capabilities•Assembly Inspection•Power up•Boot prompt•Kernel Prompt

Bring-up Testing

•Peripheral test•Performance Optimization •Diagnostics Code

Functional Test

•Timing Analysis•Waveform Shaping•Performance Analysis•Boundary Conditions Testing

EDVT

•Reliability test•Thermal•Humidity•Destructive Testing

Stress Testing

•Pre-Compliance Testing•FCC, CE, IC (Class A/B)

•Environment testing (Shock, Bump, Vibration)

•Safety test (UL294 etc)

Prototype Testing

•DFM measures•Test Jig/Fixture•Penalization Requirements•Pilot Production•Ensure high first pass yields

Contract Manufacturer

6

Design PhaseDetailed design

• Use case Analysis• Component Selection• Power tree & Clock tree• Protection Circuits• Circuit Simulations

Multi-pass reviews

• Requirement Traceability Matrix

• Schematics Review Tracker• Layout Guidelines Document

Tools

• DOORS (Requirements)• PREP (Reviews)• CLEARQUEST (CRN)• ARENA (BOM)• Others (Proprietary)

Component Selection Criteria

Reusability Lead Time Cost

Product Family Package Footprint

Special Properties Vendor Alternates

Manufacturer Temperature Value

Tolerance RoHS / REACH Part Life Status

Software Re-usability

Schematic Tools

Cadence OrCAD

Mentor DxDesigner

7

Development Phase Layout• Mixed Signal Designs• PoE, Protections (ARINC), Cross Talk, • GbE, PCIe, SRIO, SDI Video, DDR3, SATA etc• Multi processor Designs• Electro-Mechanical Integration• Blind and Buried Vias• Special high performance dielectric materials

Layout

Allegro

PADS

Expedition

Thermal Analysis

Betasoft

Signal Integrity Analysis

Hyperlinx

Spectra-Quest

8

Industrial Design

Tools• Autovue• eDrawings• Solidworks

Design Experience• IP65 Designs• MIL-STD-810F• Fan-Less Designs• Power Hungry designs• High level of modularity• Aesthetics + Ergonomics

Research

• Scope•Audit• Interview•Observations•Personas

Product Goals

•Concept• Scenarios•Elements• Framework•Performance

Specifications

9

SUCCESS STORIESBoard design & Development

10

Multiprocessor Dome Camera

Key Highlights• Multi Processor, FPGA Design, Industrial Grade

Applications• Surveillancee

Processor & Peripheral Highlights• Multi-processors + FPGA based Complex Hardware Platform• TI – DaVinci• Freescale PowerPC • Maxim – Video Encoder SoC• Nethra Image Signal Processor• Sony CMOS Imager and • Altera Cyclone- III

• Gigabit Ethernet Support with POE Powered Option• USB 2.0 Interface for Mass Storage application• SATA Hard disc support (In-built Hard disc recording – DVR

functionality)• IP66 rated design

Special Features• FCC Class-B Certified Product• Wide temperature range including sub zero temperatures

11

High-Resolution Surveillance Camera

• FPGA RTL design and integration with third party IPs• Video Scaling from 4K x 3K to 320 x 240• Video Compression (H264 and MJPEG), Audio Compression (AAC)• Device driver development and porting for Linux v2.6.37• Record and/or live play of up-to four 3M pixel MJPEG streams• WebUI to configure camera parameters

• 12M Pixel surveillance camera product involving Software, Hardware and FPGA based design

• Support for Auto/manual White Balance, Auto Focus, Auto Exposure, Gain control, Flip, Tilt

• Contrast, Brightness, Sharpness support• Image Enhancement Pipeline (Pixel correction, CFA Interpolation,

Color conversion, Gamma Correction, Noise reduction, Edge enhancement etc.)

TI DM8168

TI AM3894 4 x 3MPix MJPEG

2 x 1080P HD

2 x SD

1 x QSD

FPGA

Image Sensor12M Pixel OR 4 x 3M Pixel

RAW Data

2 x HD Video Ports

PCI-ExpressImage Enhancement

Pipeline

12

Product DesignApplications:Surveillance, Video Processing

Special Features: 4x DDR3-800| 2DDR2-400| Gigabit Ethernet | Portable | SATA | HDMI |AV Encoding + Decoding |4-channel video|

13

Design before Processor was in the market!• TI DM8168 based design• One of the first few Netra Designs in the world• Multi-pass Design reviews• Reviews by Semiconductor vendors design team• Back up Plan: Dual Processor Design• Flexible architecture for 8 product variants• Fan-less Design (14W)• High Speed interconnects• Dual Processor Design• Scalable architecture

Mobile Network Video Recorder

Applications: Video Surveillance | Driver behavior Analysis

Special Features:12 IP camera recording | 3G Module with GPS | LCD connectivity | Temperature range -20°C to +60°C

14

• High Definition Recording • Seamless Connectivity • Vibration Proof (MIL-STD-810F method 514.5C)• Modular design for multiple product variants

roadmap• Scalable Architecture by cascading multiple units• RS232, USB, MicroUSB, Dual Gigabit Ethernet

Interfaces• 128GB SSD, 1TB HDD, 32GB SDHC Storage • Power to 12 Cameras on PoE• 3-axis accelerometer• Redundant Power supply

Case Study - Handheld HD Live Video StreamingApplications:Live video broadcasting over GSM network for professional applications like media coverage

Special Features:Modular design to support various video interfaces | 4 different PCAs in a system| Wide operating temperature -40°C to +85°C | Optimized power consumption | Wireless modem support

15

Processor & Peripheral Highlights:• Multi-processors + FPGA based multi board

Complex Hardware Platform• TI – DaVinci (DM6467T) , Sitara (AM3505)

and MSP430• Xilinx – Spartan-6 FPGA

• DDR3-800, NAND, SD Card• SDI, HDMI and Analog Audio/Video support• Four 3G Modems• Fast Ethernet • 802.11 b/g/n WLAN (Wi-Fi)• Bluetooth 2.1• USB 2.0 OTG and SD CARD Interface for Mass

Storage application• 4.3” LCD with Touch Screen• Battery Operated

Thank you

For more information, write us at marketing@einfochips.com

or visit www.einfochips.com