board users manual xmc link-v1 r1.0 final

User's Manual R1.0

www.infineon.com 2015-12-11

UG_201512_PL30_004

XMC™ Link

Based on SEGGER J-Link Technology

About this document

Scope and purpose

This is the user’s manual for the XMC™ Link also called isolated debug probe, providing technical information

and hints on how to use it.

Intended audience

This document is intended for anyone who wants to use the XMC™ Link.

Table of contents

About this document .............................................................................................................................................1

Table of contents ...................................................................................................................................................1

1 Introduction.......................................................................................................................................2

1.1 Block diagram..........................................................................................................................................2

1.2 Getting started.........................................................................................................................................3

2 Hardware description ........................................................................................................................4

2.1 Known limitation.....................................................................................................................................4

2.2 Debug connector.....................................................................................................................................4

2.2.1 Pinout of debug connectors ..............................................................................................................5

2.3 Power supply ...........................................................................................................................................6

2.4 Virtual COM Port (UART-to-USB Bridge) .................................................................................................6

3 Production data .................................................................................................................................7

3.1 Schematics ..............................................................................................................................................7

3.1.1 Differences in hardware versions ......................................................................................................7

3.2 Components placement and geometry .................................................................................................9

3.3 List of material.........................................................................................................................................9

Revision history ...................................................................................................................................................11

User's Manual 2 R1.0

2015-12-11

Table of contents

XMC™ LinkBased on SEGGER J-Link Technology

1 Introduction

This document describes the features and hardware details of the XMC™ Link. XMC™ Link is an isolated debug

probe for all XMC™ microcontrollers.

The debug probe is based on SEGGER J-Link debug firmware, which enables use with DAVE™ and all major

third-party compiler/IDEs known from the wide ARM® ecosystem. Table 1 shows its specification.

Table 1 XMC™ Link specification

Supported Processor All Infineon Cortex®-M based XMC™ Microcontroller

Dimensions 62 x 33 mm (without cables plugged in)

Power PC side: 5 V via Micro-AB USB Connector

Target side: 2.5 V – 5 .5V via one of the debug connector (VDD)

Connectors • 10-pin Cortex® Debug Connector

• 8-pin XMC™ MCU Debug Connector

• Micro –AB USB Connector

Supported Protocols • Serial Wire Debug (SWD)

• Single Pin Debug (SPD)

• Serial Wire Viewer (SWV via SWO pin)

• JTAG

• UART-to-USB Bride, Virtual COM (VCOM)

Others • 1 kV functional isolation

1.1 Block diagram

The block diagram in Figure 1 shows the main components of the XMC™ Link and their interconnections. There

are following main building blocks:

• XMC4200 Microcontroller in a VQFN42 package

• Isolating Device

• 10-pin Cortex® Debug Connector

• 8-pin XMC™ MCU Debug Connector

• Micro-AB USB Connector

• 2 LEDs: Debug LED and Communication LED

• 12 MHz Crystal


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Figure 1 Block diagram of the XMC™ Link

1.2 Getting started

To operate the XMC™ Link the installation of the J-Link Driver is required.

1. Please download the latest version from https://www.segger.com/jlink-software.html and install it on your

PC/laptop.

Note: The J-Link driver is also part of the typical installation of DAVE™ and 3rd party tools supporting SEGGER J-

Link.

2. Connect XMC™ Link with your PC/laptop using the Micro USB cable.

3. A proper connection and installation of the J-Link driver is indicated by a constantly illuminated DEBUGLED.

4. Connect your XMC™ target board with XMC™ Link using one of the enclosed cables.

5. Select SEGGER J-Link as debugger in your preferred IDE e.g. DAVE™

6. Start the flash programming and debugging session

XMC4200Micro-

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U0C0

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SWD

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SWV

RESET

2.5V -5.5V

8-pin XMC™ MCUDebug Connector

IsolatingDevice

CCU80


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2 Hardware description

The following chapters provide a detailed description of the hardware and how it can be used. The hardware is

depicted in Figure 2.

Figure 2 PCB of the XMC™ Link

2.1 Known limitation

XMC Link™ V1 has a minor known limitation which could occur only during programming the BMI of a XMC1000

device in ASC-BSL mode to another BMI mode. This limitation is solved in the PCB version V1.1. The versionnumber is printed on the bottom side of the PCB below the USB connector.

The limitation can be avoided if the XMC™ Link V1 is powered before the target XMC™ will be powered.

2.2 Debug connector

The XMC™ Link can be connected to the XMC™ target microcontroller by either of the debug connectors:

• 8-pin XMC™ MCU Debug Connector (2 x 4 pin, 0.1”, 2.54mm)

• 10-pin Cortex™ Debug Connector (2 x 5 pin, 0.05”, 1.27mm)

The 8-pin XMC™ MCU Debug Connector is mainly used for the XMC1000 applications. The 10-pin Cortex™ Debug

Connector can be used for all XMC™ families but is focusing on the XMC4000 family supporting Serial Wire

Viewer (SWV) via the SWO pin.


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The common debug protocol supported by both connectors is Serial Wire Debug (SWD). Figure 3 provides anoverview on all supported debug protocols and communication channels.

XMC1000 Family XMC4000 Family

8-pin XMC™ MCUDebug Connector



Serial Wire Debug(SWD)

Single Pin Debug(SPD)

Serial Wire Viewer(SWV/SWO)

Virtual COM Port(UART-to-USB Bridge)

JTAG

Figure 3 Supported debug protocols

2.2.1 Pinout of debug connectors

The pinout of both debug connectors and to which pins of the XMC™ the debugger must be connected can be

found in Table 2 and Table 3.

Table 2 Pinout of the 10-pin Cortex™ debug connector

Pin Function XMC1000 Connection (Pin name) XMC4000 Connection (Pin name)

1 VCC Power Supply 2.5 V – 5.5 V (VDD) Power Supply VDDP 3.3 V (VDDP)

2 SWIO/TMS Serial Wire Data (P0.14 | P1.3) Serial Wire Data, JTAG-TMS (TMS)

3 GND Ground (VSS) Ground (VSS)

4 SWCLK/TCK Serial Wire Clock (P0.15 | P1.2) Serial Wire Clock, JTAG-TCK (TCK)

5 GND Ground (VSS) Ground (VSS)

6 SWO/TDO Not connected Serial Wire Output, JTAG-TDO (P2.1) (optional)

7 KEY Not connected Not connected

8 TDI Not connected JTAG-TDI (P0.7)(optional)

9 GNDDetect Can be used to switch off an on-board debug probe (PORST# of OBD) (optional)

10 RESET# Not connected PORST# (mandatory)

Table 3 Pinout of the 8-pin XMC™ MCU debug connector

Pin Function XMC1000 Connection (Pin name)

1 SC Serial Wire Clock (P0.15 | P1.2)

2 SD Serial Wire Data (P0.14 | P1.3)


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Pin Function XMC1000 Connection (Pin name)

3 + Power supply 2.5 V – 5.5 V (VDD)

4 0 Ground (VSS)

5 0 Ground (VSS)

6 + Power supply 2.5 V – 5.5 V (VDD)

7 TX (PC-TX)) Transmissstion line of PC/laptop, receive line of XMC™ device (optional)

8 RX (PC-RX) Receive line of PC/laptop, transmission line of of XMC™ device (optional)

2.3 Power supply

XMC™ Link is powered from the Micro USB plug and typically draws about 70 mA. The on-board voltage

regulator IFX54441LDV33 generates the required 3.3 V for the XMC4200 microcontroller out of the 5 V USBvoltage. The debug probe is not designed to provide power for the target device.

The target application must power the isolated part of the debugger. The isolated side the XMC™ Link draws afew mA of current from the target application.

2.4 Virtual COM Port (UART-to-USB Bridge)

The 8-pin XMC™ MCU Debug Connector supports communication between a PC/laptop and target XMC™ device

via Virtual COM Port (UART-to-USB Bridge). Therefore UART pins of the target XMC™ device needs to beconnected to TX/RX pins of the debug connector (see Table 3).

Note: Take care of the UART cross connection: TX pin of debugger needs to be connected to RX pin of the

XMC device. RX pin of debugger needs to be connected to TX pin of the XMC device.


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3 Production data

This chapter covers schematics, board dimensions, component placement and the list of material.

3.1 Schematics

Figure 4 shows the schematics of XMC™ Link V1 in hardware version 1.1.

3.1.1 Differences in hardware versions

In hardware version 1.1 compared to hardware version v1.0 (V1) the pull-down resistor R20 was added to the TX

line. The version number is printed on the bottom side of the PCB below the USB connector.


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Figure 4 Schematic of the XMC™ Link V1 (Hardware Version 1.1)

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3.2 Components placement and geometry

Figure 5 shows the board dimensions and the placement of components on the PCB.

Figure 5 Components placement and geometry

3.3 List of material

The list of material is valid for the XMC™ Link V1 in hardware version 1.1.

Table 4 List of material

Value Device Qty Reference Designator

15pF 50V 10% 0402 Capacitor COG 2 C5, C6

10uF 10V 20% 0603 Capacitor X5R 8

C2, C3, C14, C15, C19, C23, C24,

C25

100nF 16V 10% 0402 Capacitor X7R 13

C4, C7, C8, C9, C10, C11, C12,

C16, C17, C18, C20, C21, C22

10nF 16V 10% 0402 Capacitor X7R 1 C1

4u7F 6.3V +-10% 0603 Capacitor X7R 1 C13

ZX62-AB-5PA Connector Micro USB AB SMD Hirose 1 X3

12MHz 3.2x2.5 Crystal 12MHz 4Pad NX3225SA NDK 1 Q1

ESD8V0L2B-03L TSLP-3-1 Diode Protection Infineon 1 V2

BLM18PG600SN1D 0603 Ferrite Bead 60R 500mA Murata 1 L1

SI8652BB-B-IS1 NB-SOIC-16 Isolation IC 2 U3, U6

LSQ971-Z LED-GN 0603 LED SMD gn 1 LED1

LSQ976-Z LED-RT 0603 LED SMD rt 1 LED2

74LVC1G126GW TSSOP5 Line Driver 1 U4

60mm

30m

m

ADJ_1ADJ_1

ADJ_2ADJ_2

ADJ_3ADJ_3

C1C1

C2

C2

C3C3

C4C4

C5

C5

C6

C6

C7

C7

C8C8

C9C9

C10C10 C11

C11

C12C12

C13

C13

C14C14

C15C15

C16C16

C17C17

C18

C18

C19

C19

C20C20

C21

C21

C22

C22

C23C23

C24C24

C25

C25

L1

L1

LE

D1

LE

D1

LE

D2

LE

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Q1

Q1

R1

R1

R2R2

R3R3

R4

R4

R5R5

R6

R6

R7R7

R8

R8

R9

R9

R10R10

R11

R11

R12R12

R13R13

R14R14

R15

R15

R16

R16

R17R17

R18R18

R19

R19

R20R20

R21R21

U1

U1

U2

U2

U3

U3

U4

U4

U5

U5

U6

U6

V2

V2

X1

X1

X2X2

X3

X3

X4X4


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Value Device Qty Reference Designator

SN74LVC1G07 SC70-5 Line Driver 1 U5

XMC4200-Q48K256 QFN48 Microcontroller XMC4200 Infineon 1 U2

FTS-105-01-L-DV 2x5pin

0.05" Pin Header SMD Samtec 1

X1

TSM-104-01-F-DH-A 2x4pin

0.1" Pin Header SMD Samtec 1X2

no ass. 1x5pin 0.1" Pin Header THT 1 X4

100R 1% 0402 Resistor 7 R12, R13, R14, R15, R16, R17, R18

100k 1% 0402 Resistor 3 R9, R10, R11

10k 1% 0402 Resistor 3 R7, R20, R21

1M 1% 0603 Resistor 1 R8

22R 1% 0402 Resistor 2 R3, R5

4k7 1% 0402 Resistor 1 R6

510R 1% 0402 Resistor 1 R4

680R 1% 0603 Resistor 2 R1, R2

no ass. 0R 0603 Resistor 1 R19

IFX54441LDV33 PG-TSON-10 Voltage Regulator 3.3 V Infineon 1 U1


2015-12-11

Revision history


Revision history

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Trademarks of Infineon Technologies AGµHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™,DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™,HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™,OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™,SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™

Trademarks updated November 2015

Other TrademarksAll referenced product or service names and trademarks are the property of their respective owners.

Edition 2015-12-11

UG_201512_PL30_004

Published by

Infineon Technologies AG

81726 Munich, Germany

© 2016 Infineon Technologies AG.

All Rights Reserved.

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IMPORTANT NOTICEThe information contained in this application noteis given as a hint for the implementation of theproduct only and shall in no event be regarded as adescription or warranty of a certain functionality,condition or quality of the product. Beforeimplementation of the product, the recipient of thisapplication note must verify any function and othertechnical information given herein in the realapplication. Infineon Technologies herebydisclaims any and all warranties and liabilities ofany kind (including without limitation warranties ofnon-infringement of intellectual property rights ofany third party) with respect to any and allinformation given in this application note.

The data contained in this document is exclusivelyintended for technically trained staff. It is theresponsibility of customer’s technical departmentsto evaluate the suitability of the product for theintended application and the completeness of theproduct information given in this document withrespect to such application.

For further information on the product, technology,delivery terms and conditions and prices pleasecontact your nearest Infineon Technologies office(www.infineon.com).

WARNINGSDue to technical requirements products maycontain dangerous substances. For information onthe types in question please contact your nearestInfineon Technologies office.

Except as otherwise explicitly approved by InfineonTechnologies in a written document signed byauthorized representatives of InfineonTechnologies, Infineon Technologies’ products maynot be used in any applications where a failure ofthe product or any consequences of the use thereofcan reasonably be expected to result in personalinjury.

board users manual xmc link-v1 r1.0 final

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