bonding-unisula.ppt

8/10/2019 Bonding-unisula.ppt

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Bonding

Siti Sunarintyas

Biomaterial, FKG - UGM


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PRINCIPLE OF ADHESION(BONDING)


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Definition

Adhesion

unlike molecules are attracted e.g. A-B

Cohesionsame kindof molecules are attracted e.g. B-B

Adhesive

material or film added to produce the adhesion B Adherend/substrate

material to which adhesive is applied A

A B A


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Adhesion can be measured from the spreading of liquid

droplets on enamel surfaces.


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Adherend 1 Adherend 2

Adhesive Systemor Luting Cement

Interface 2Interface 1

DENTAL

JOINT

ENAMEL, DENTIN >Liner, Base, Cement >

Post and Core >Dental Amalgam >

Implant >

< Composite, Amalgam< Cast Inlay, Onlay, or Crown< All-Ceramic Inlay, Onlay, or Crown< Veneers, Maryland Bridges

< Orthodontic Brackets

AdhesiveInterface 1DENTAL

ADHESION


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FORMING GOOD ADHESION

(1) Clean adheren

(2) Good wetting

(3) Close adaptation

(4) Bonding

(5) Good curing

physicalbonding

chemicalbonding mechanical

bonding

+


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(1) OPERATORTechnical skill, ages, view, ...

(2) DesainBevel, Outline Form, .

(3) MATERIALSComposition, expire date, T, %RH, ...

(4) INTRAORAL LOCATION

Anterior-Posterior, Maxillary-Mandibular,Lingual-Facial, Premolar-Molar, ...

(5) PATIENTF-exposure, Diet, Oral Hygiene, IQ, Caries Risk, ...

Factor influencing the appearance


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EMAIL BONDING SYSTEM

89v/o HA,6% Organic,5% Water

FROSTY

APPEARANCE

SBS = 20 MPa


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e f

g


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Intertubular dentin

Peritubular dentin

Dentinal tubule

Residual smear

layer particles

Residual smear

plug particles

Macrotag Microtag

Condit ion ing

Pr iming

Bonding

COMPOSITE

HYBRID LAYER: resin microtags that are within

intertubular dentin and surround collagen fibers.

Collagen fibers

B. Removing of smear layer and hybrid layers

BONDING SYSTEM

A. Classification of bonding system :1. Substrate type (email, dentin)2. Generation3. Component amount


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Prime&Bond

Dentsply International

(Acetone solvent system)

Single Bond

3M Dental Products Division

(Ethanol and water solvent system)

Scotchbond Multipurpose Plus

3M Dental Products Division

(Ethanol and water solvent system)

One-Step

BISCO

(Acetone solvent system)

HOW

MUCH

SOLVENT?


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Designing Bonding Systems

BONDING AGENTPRIMER

ETCHANT

E+nP+B

US Companies

2 =

1 =

E+nPB

Japanese Companies

= 2

= 1

or nEP+BSelf-Etching

Primer

???

nEPBSelf-Etching

Adhesive

hydrophilic tooth structure

hydrophobic restorative material

Total Etch Systems


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E + nP+ B or nEP+ BE + nPB nEPBSelf-Etching Primer

Self-Etching Adh

nP =HEMA, ,(Polymers),

Alcohol, H2O, Acet

E =H3PO4,H2O

B =Bis-GMA, TEGDMA

Acetone or Alcohol

E =H3PO4,H2O

nPB =HEMA, , TEGDMA(Polymers),

Alcohol, H2O, Acet

B =MMA, Bis-GMA, TEGDMA,

(Polymers),

Acetone or Alcohol

Acid Monomer,HEMA,

H2O

nEP =Acid Monomer,HEMA,

Polymer,

(TEGDMA),

H2O, Alcohol

nEP =


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BONDING SYSTEM: pH

3-Component (E+P+B), Total Etch 10% H3PO4 0.8 35% H3PO4 0.1

2-Component (E+PB), Total Etch One-Step 0.8 + 4.7 Bond 1 0.8 + 3.9

SingleBond 0.8 + 3.6 (5.1) Optibond S 0.8 + 2.8 Prime&Bond NT 0.8 + 2.6 (3.2) Cabrio 0.8 + 2.5 PQ1 0.8 + 2.2

2-Component (EP+B), Self-Etching Primer SE Bond 2.6 Tyrian SPE 0.4

1-Component (EPB), Self-Etching Adhesive Panavia 2.9 (A+B) iBond 2.4 One-Up 2.3 Prompt L-Pop 1.3

Xeno III 1.1

7.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

6.0

Basic

Acidic

Effectifity of Etching Variable


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E+nP+B E+nPB nEP+B

Self-EtchingPrimer

nEPB

Self-EtchingAdhesive

Total-Etch Systems Self-Etch Systems

Reliable Bo nd ing No Posto perat ive Sensit iv i ty

1. Keep in refrigerator.

2. Use steel burs or carbide burs (not diamonds)for dentin bonding.

3. Application of multiple layers by applicator.

4. Use etching of H3PO4, if enamel is contributed.

HybridLayer

HybridLayer

HybridLayer

HybridLayer

hydrophi l ic

hydrophob ic


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BONDING SYSTEM2-COMPONENT SYSTEMS (nEP + B) Clearfil SE Bond & LinerBond 2v (Kuraray) Tyrian SPE (Bisco) Optibond Solo SE Plus (Kerr) Fluoro Bond (Shofu) UniFil Bond (GC) Mac Bond II (Tokuyama) NanoBond (Pentron)

1-COMPONENT SYSTEMS (nEPB) AQBond (Sun Medical) or Touch-and-Bond (Parkell) Adper Prompt or LP3 (3M-ESPE) Solist (One-bottle-bond) (DMG Hamburg) iBond (Hereaus-Kulzer) Xeno III (Dentsply)

3-COMPONENT SYSTEMS (E + nP + B) Scotchbond Multipurpose Plus (3M) Permaquick (Ultradent) Bond-It (Jeneric / Pentron) All-Bond 2 (BISCO) Tenure A/B/S (Denmat) ProBond (Dentsply)

2-COMPONENT SYSTEMS (E + nPB)

Syntac Single Component (Ivoclar) Ecusit Primer/Mono (DMG Hamburg) One Coat Bond (Coltene / Whaledent) Bond-1 (Jeneric / Pentron) Tenure Quik with Fluoride (Denmat) Solid Bond (Hereaus-Kulzer) Imperva Bond (Shofu) EG Bond (Sun Chemical)

PQ1 (Ultradent) Easy Bond (Parkell) Paama 2 and Stae (SDI) Prime&Bond NT (Dentsply) Single-Bond (3M) Optibond Solo and Solo Plus (Kerr) One-Step (BISCO) Excite (Ivoclar/Vivadent) OSB Bonding System (ESPE) IntegraBond (Premier)


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ENAMEL or

DENTINDENTALAMALGAM

AMALGAM

BONDING SYSTEM

Amalgam ReactionProduct Matrix

ResidualAmalgam Alloy

AMALGAM BONDINGMechanical Interlocking

Interfacial Interlocking of phases

Amalgambond Plus

(Parkell)


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ENAMEL

CERAMICINLAYAcid-etchedenameland dentin

Dentinbonding

system

Silanated /Bonded surface

HF acid-etchedsurface

RESIN

INLAY

CEMENT

CERAMIC BONDING

Resin Cement= Composite

HF ETCHING

High-Leucite Porcelains High-Alumina Porcelains

Alumina Cores (ProCera) Zirconia Cores (Cercon, Lava)

DENTIN

bonding-unisula.ppt

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