brian subirana & sanjay sarma, mit subirana & sanjay sarma, mit. history z 1998: disc...
TRANSCRIPT
History
z 1998: DISC founded z 1999: Auto-ID Center founded Auto-ID Field Trial
started 2000 z 2001: First standards presented z 2002: Gillette orders 500,000,000 tags from Alien z 2003: Wal-Mart, DoD Mandates
EPCglobal launched, Center retired z 2004: More mandates
Outline, Part I
z RFID and the Auto-ID Center z What and why of RFID z The cost issue z Manufacturing low-cost RFID z Handling the data z Current status
z An in-depth look at some issues
Outline, Part I
z RFID and the Auto-ID Center z What and why of RFID z The cost issue z Manufacturing low-cost RFID z Handling the data z Current status
z An in-depth look at some issues
Magnitude of Challenges
z Inventory Management: z Inventory uncertainty:
z 65 % of 370,000 records inaccurate (HBS study of one major retailer) z Transportation uncertainty: Perfect delivery is dismal
z Stock-outs:z Average 9% out of stock in retailers world-widez Lost sales due to stock-outs: 4%
z Overstock: Huge channel inventoriesz CPG average 11 weeks inventoryz Retailers average 7 weeks inventoryz Locked up capital, industry-wide
z Brand Management: z Counterfeit:
z $500B pharmaceuticals business, $50B counterfeit z Diversion:
z Market size difficult to estimate
The problems are everywhere (
0.0 4.0 8.0 10.0
l i
Across geographies
Hai
Toil i
Sal
)
Across product lines
Overall OOS Extent Averages)
7.9
8.6 8.2
8.3
2.0 6.0
USA
Europe
Other Regions
Wor dw de
Percent OOS
OOS Averages by Category
9.8
7.7
7.0
6.8
6.6
5.3
8.3
0.0 2.0 4.0 6.0 8.0 10.0 12.0
r Care
Laundry
Diapers
Fem Hygiene
et T ssue
ty Snacks
World Avg (18 categories
Percent
(
7.3
9.1
Fri
Across time
OOS by Day of Week Average of 13 studies)
10.9
8.7
9.8
10.0
10.9
0.0 2.0 4.0 6.0 8.0 10.0 12.0
Sun
Sat
Thur
Wed
Tues
Mon
Percent
Other Cause 4% Store Forecasting
Retail HQ or 13% Manufacturer
14%
Distribution Center 10%
Store Ordering 34%
Store Shelving25%
Across the supply chain
The Vicious CycleUpstream In-store
causes causes Demand variations
28% 59% 13% 14%
Upstream problems
50% Store Problems at ordering
manufacturer’s DC Shelf 35%
Problems at retailer’s DC
Replenishment
8% Manufacturer Manufacturer’s DC Retailer’s DC Retailer World
11 weeks inventory Wide
6 weeks inventory
Consider stock-outs
Why is RFID expensive today?
reduce functionality
increased chip sizegreater functionality
(Networking & software)
reduce chip size (handle small chips)
Cheap protocol
10 20 30 40 50 60 70 80 90
i i
100
Noi
se
Gauss an F t 0.8 912 100 2 Meters, 4 KHz, SQW, 1 dBm
905 910 915 920
Frequency (MHz)
0
are
context- ware router
context-aware router
router
context-rout
router
co
the hypothesis or bet01. 203D2A. 916E8B. 8719BAE03C
Header 8 bits Serial Number 40 bits
Product 24 bits
Manufacturer 24 bits
z Place unique number on tag z Electronic Product Code, EPC z 64 bit, 96 bit, and upwards
z Develop manufacturing technology for small chips and tags
z Move data on the network z Network service for resolving EPC z Network architecture for gathering
and routing data
a
er
context-aw router context-aware
router
context-aware
aware context-aware
context-aware router
ntext-aware router
context-aware router
context-aware router
sensor sensor sensor sensor
Outline, Part I
z RFID and the Auto-ID Center z What and why of RFID z The cost issue z Manufacturing low-cost RFID z Handling the data z Current status
z An in-depth look at some issues
ICDesign
Low cost RFID
Antenna Manufacture
EndIC Manufacture
IC Antenna/IC Assembly
Conversion to Package users Design
$X Million 20¢ 5¢ 5¢ 20¢ Billions Number of tags
1-2¢ 1¢1¢1¢
Challenges of IC minimalism
z 0.25 mm2: does it make life tougher? z ……..
z Street width will dominate
z Still have to test the IC’s (?)z Die handling costs are high
z Die-attach/wire-bonding techniques do not scale
z Street width will dominate
z Still have to test the IC’s (?)z Die handling costs are high
z Street width will dominate
z Still have to test the IC’s (?)z Die handling costs are high
z Street width will dominate
z Still have to test the IC’s (?)z Die handling costs are high
z Street width will dominate
z Still have to test the IC’s (?)z Die handling costs are high
z Street width will dominate
z Still have to test the IC’s (?)z Die handling costs are high
low cost rfid challenges
Antenna Manufacture
IC Manufacture
Antenna/IC Assembly
Conversion to Package
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢ 1¢ 1¢
Testing
z Economics today: z $500 - $1000 per wafer
z But minimal functionality means z High reliability z Don’t test on wafer z Test wirelessly at conversion
Slicing and Dicing
z
z Instead, use separation by thinning
Standard saw-dicing wasteful
C. Landesberger, S. Scherbaum, G. Schwinn, H. Spöhrle: “New Process Scheme for Wafer Thinning and Stress-free Separation of Ultra Thin IC’s,” Proceedings of Microsystems Technologies 2001, Mesago, Stuttgart, pp. 431-436, 2001.
Low cost RFID challenges
Antenna Manufacture
IC Manufacture
Antenna/IC Assembly
Conversion to Package
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢ 1¢ 1¢
Low cost RFID challenges
Antenna Manufacture
IC Manufacture
Antenna/IC Assembly
Conversion to Package
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢1¢ 1¢
Vibratory AssemblyChip
Assembly Chip
Inlet
End User/ Design
Label Converting Assembly
Silicon Manufacturing
Antenna Manufacturing
Label Tag Manufacturing
Wafer Treatment
Low cost RFID challenges
Antenna Manufacture
IC Manufacture
Antenna/IC Assembly
Conversion to Package
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢ 1¢ 1¢
Conversion
z Paper/package/label industry expertise z Scales well with mass production z Capital equipment expenditure
software
paperhardware
Outline, Part I
z RFID and the Auto-ID Center z What and why of RFID z The cost issue z Manufacturing low-cost RFID z Handling the data z Current status
z An in-depth look at some issues
Architecture: Local
Reader
Local database
Reader
Local network
Data Processing
Middleware
01.203D2A.916E8B.8719BAE03C
Tag
AE03C
Architecture: Global
Reader
Local database
Reader
Local network
Local system
ONS
Internet <EPC= >
</EPC> </TIME>
????
Quality control specialist
XQL
PML Server
18.72.100.100
18.72.100.100
PML
… … ...
40 DEG C </MaximumTempearture>
5 DEG C
Data Processing
Middleware
01.203D2A.916E8B.8719BAE03C
<PML> <TIME=2000.4.28:10:05.05HRS>
01.203D2A.916E8B.8719BAE03C <TEMPERATURE=15 DEG C>
</PML>
01.203D2A.916E8B.8719B <PML>
<MaximumTempearture>
<MinimumTemperature>
</MinimumTempearture> </PML>
23AB.36C2.AB21.6733
AE03C
Tag
Reader
Local database
Reader
Local network
Local system
ONS
Internet <EPC= >
15 DEG C> </EPC>
</TIME>
????
Quality control specialist
XQL
PML Server
18.72.100.100
18.72.100.100
PML
… … ...
40 DEG C
5 DEG C
Data Processing
Inference Temperature OK
Middleware
<PML> <TIME=2000.4.28:10:05.05HRS>
01.203D2A.916E8B.8719BAE03C <TEMPERATURE=
</PML>
01.203D2A.916E8B.8719B <PML>
<MaximumTempearture>
</MaximumTempearture> <MinimumTemperature>
</MinimumTempearture> </PML>
01.203D2A.916E8B.8719BAE03C
Trading PartnersTrading Part
Three Layers of an EPC Architecture
ONS
EPC Enterprise •EPC Enterprise data store
nersTrading Partners
Business IDs + •Data migration from Edge
•Standard API •Enterprise systems •Trading partners
Enterprise
Edge
Edge 3EPC Edge Edge 2 object Edge 1
loc time
•••
•EPC Edge data store ••
Exis
ting
Syst
ems
/ EA
I
RF Abstraction layer Device mgmt Event mgmt
Standard API Data migration to Enterprise
Software
Hardware Readers •Physical data capture
Tags
Outline, Part I
z RFID and the Auto-ID Center z What and why of RFID z The cost issue z Manufacturing low-cost RFID z Handling the data z Current status
z An in-depth look at some issues
Field Trial
II
II I I
I
I IO
COCA COLA BOTTLER CLEVELAND, TN
JOHNSON & JOHNSON OL VE BRANCH, TN
KRAFT FOODS FORTH WORTH, TX
GILLETTE D ST. CENTER CHICAGO IL
PILOT TEST FAC LITY BENTONV LLE, AR
WAL-M ART DEPOT BENTONV LLE, AR.
WAL M ART STORE CLEVELAND, TN
Warehouse Retail Floor Staging Area Retail Floor
SAM'S DEPOT KANSAS C TY, M O
WAL-MART STORE BROKEN ARROW, OK
SAM'S STORE TULSA
P & G FACTORY CAPE G RADEAU , MO
UNILIVER DIST. CENTER BALT MORE, MD
P & G DC IOWA CITY,
Pilot facility is being used as a mini warehouse
The Commercialization of EPC
z Landmark Event: EPCglobal is formed z Many companies have significant tests and pilots underway z Mandates: z DoD
z Marks & Spencerz Tesco
z Wal-Martz Metro Group
z Targetz Albertsons
z Best Buyz Other major retailers are continuing to announce their strategies
RFID Status
z 3 protocols z Class 0 UHF z Class I UHF z Class I HF
z Tens of manufacturers z Tags: Alien, Matrics, Philips, ST Micro, Rafsec, …. z Readers: Alien, Matrics, AWID, ThingMagic, Tyco, Symbol,
Samsys,…
z New versions being designed z Gen 2 taking off z Intermec patent still issue
Key philosophy #2: Layers
Communicate with Classes IV and V.
Active tags with
Clsemi-passive RFID tags
Clpassive tags with additional
functionality
read-only passive tags
Upw
ard
com
patib
ility
Dow
nwar
d fa
ilsaf
e
Class V tags Readers. Can power other Class I, II and III tags;
Class IV tags:
broad-band peer-to-peer communication
ass III tags:
ass II tags:
Class 0/Class I:
Vendors
z Chips: Alien, Matrics, Philips, ST Micro
z Readers: Alien, Matrics, Philips, Tagsys, Samsys, ThingMagic, Tyco, Symbol, Markem, AWID
z Software: Sun, Oat Systems, Manhattan, Globe Ranger, Conecterra, SAP, Tibco, Verisign, Vizional, ..
z Systems: Accenture, PWC/IBM, GEA, … z End-Users: Gillette, Wal*Mart, P&G, TESCO, Metro,
Target, Wegmans, ….
Research Issues
z Tag anti-collision z Reader anti-collision z Security and privacy z Advanced sensor networks z Data routing and handling z IC Design z IC manufacturing
z Silicon processing z Chip assembly
z Polymers z Controls/automation z Manufacturing systems z System Synthesis z Supply chain issues
Outline, Part I
z RFID and the Auto-ID Center z What and why of RFID z The cost issue z Manufacturing low-cost RFID z Handling the data z Current status
z An in-depth look at some issues
Outline, Part II
z RFID and the Auto-ID Center z An in-depth look at some issues z A peek at the protocol z Security and Privacy Issues z Software z Vibration analysis z Silicon manufacturing
reader to tag: modulation
100%
10%
Low Time
45%
45%
Reader to Tag ModulationUHFEnvelope
On Off Keying (OOK), Min 90% Modulation Depth
Modulation: reader to tag
16 us
Cl i li
62.5 Khz
k Low nterva for data = 1
Clk Low nterval for data = 0
tag to reader
0
1
1 Bit Cell• Bit Cell Time: ~8 µs Tag to Reader (128 kbs) • 2 Transitions = 0• 4 Transitions = 1• Always Transitions Within a Bit
• Bit Cell Time: ~8 µs Tag to Reader (128 kbs) • 2 Transitions = 0• 4 Transitions = 1• Always Transitions Within a Bit
Anti-collision
z A Reader Talks First (RTF) System z Commands Issued from Reader z Tags Reply at a Later Time While Reader
Listens
z Transactions are Self-Contained Operations (Minimal Persistent State Information Required)
Contention Detection
Anti-Collision Algorithm Relies on Detecting Contention (When More than One Tag is Responding to a Reader Command).
0 1 0 1 1 0 0 10
100% Tags, Same Clock Rate, 1-Bit Difference
Contention- Two
Anti-Collision
0110
01100 01101
011001 011011
0111
01110 01111
011100 011101 011110
0
00 01
001 010 011
1
10 11
100 101 110 111
001 100 111
[CMD] = 00001000 (Ping)[PTR] = 00000000 [LEN] = 00000011 (3)[VALUE] = 011
[CMD] = 00001000 (Ping)[PTR] = 00000000 [LEN] = 00000000 (0)[VALUE] = 0
011000 011010 011111
000
Query 1
Query 2
000 010 011 101 110
Functions
z Write address z Lock address z Preload address mask z Read ID (anti-collision) z Read payload z Write payload z Sleep z Wake z Destroy
Outline, Part II
z RFID and the Auto-ID Center z An in-depth look at some issues z A peek at the protocol z Security and Privacy Issues z Software z Vibration analysis z Silicon manufacturing
Does protocol compromise privacy?
Not necessarily. Your choice.
z You can destroy the tag and opt out
z or
z You can keep tag for later use z (physics is your friend)
Mass hijack of tags
z Could happen in destroy or re-programming
z Physics our friend z Bandwidth limited: 100’s of tags a second anti
collision
z Destroy must be individually addressed
z So it takes time to killz Surveillance
Issues
z Tags are light-weight
z Anyone can read the tags (promiscuity) z The same number shows up all the time z Channel is open and shared
01. 203D2A. 916E8B. 8719BAE03C
Header 8 bits Serial Number 40 bits
Product 24 bits
Manufacturer 24 bits
Problem: unique and promiscuous
Kill Serial number?z Product still readable
z Person can be tracked by constellation
Personalize the number?z Repeated reads yield same numberz You could still be tracked by constellation
Outline, Part II
z RFID and the Auto-ID Center z An in-depth look at some issues z A peek at the protocol z Security and Privacy Issues z Software z Vibration analysis z Silicon manufacturing
Outline, Part II
z RFID and the Auto-ID Center z An in-depth look at some issues z A peek at the protocol z Security and Privacy Issues z Software z Vibration analysis z Silicon manufacturing
Outline
z Introduction
z Kinematics z In-plane surface motion z Out-of-plane motion
z Adhesion and fluid effects z Experiments z Conclusions
Introduction
Motivation
z Need methods for handling of smallmicroscopic parts in tag production processes
z A traditional technique to solve scalingproblems is parallelization
Outline
z Introduction z Kinematics z In-plane surface motion z Out-of-plane motion
z Adhesion and fluid effects z Conclusions
Vibration Kinematics
z Want relative motion z Approaches: z Surface micro-features
z MEMS cilia, rollers, etc. z Gas flow nozzle arrays
z Electrical/magnetic fields z Moving Fluid medium flowing over surface
z Fluidic Self Assembly (FSA Alien Tech’s) z Vibrating surfaces
z Time asymmetric in-plane vibrations z Out-of-plane vibrations (such as in Bowl Feeders)
Vibrating Surfaces
In-plane vibrations of a surface if time-asymmetric
z Part moves if surface acceleration is more than friction
z Forward-backward motion? z Much literature
Out-of-plane vibrations
z Vertical vibration: extra degree offreedom
z Create hop, move platen back z Small-scale forces z Increased accelerations may be
needed to compensate
Part in flight
Hopping example
Surface accelerating faster than gravity downwards
Gravity friction cone
Possible return path
Part in collision with surface
Outline
z Introduction z Kinematics z In-plane surface motion z Out-of-plane motion
z Adhesion and fluid effects z Conclusions
Adhesion
z Adhesion effects become important at smallscales
z Van der Waals forces z Due to static and quantum mechanically induced dipoles z Strong role in inter-molecular and surface phenomena z Become important at < 100nm surface separation z Adhesion surface energies of ~100mJ/m2
z Clean atomically smooth surfaces in contact may haveadhesion pressures of the order of thousands ofatmospheres
Adhesion effect on vibratory transport z Larger accelerations are needed
z Too contaminated or too clean are bad
z Can be alleviated by: Roughening or Surfactants
z Strong secondary excitation can “levitate” the parts
z If done for fractions of the cycle, “creeping” transport can be achieved, where the part moves when vibrations are on and sticks when they are off
Example: hopping with adhesion
adhesion friction cone
collision
Flight after unstick
Surface acceleration
Sticky
Fluid dynamic scaling
z Sticking due tofluids
z Alleviation z use surfaces that
are “leaky” z Make chip
surface bumpy z Run in vacuum
velocity loss due to film damping
Frequency effect on
gap effect on
400 µm dia. 200 µ
damping
Starting
damping
Si disk
m thick
Outline
z Introduction z Kinematics z In-plane surface motion z Out-of-plane motion
z Adhesion and fluid effects z Conclusions
Conclusions
z Basic physics
z Ongoing work: z Measurements z Effects of geometries z Test methods
z Design: z Chip delivery methods and roll to roll packaging
Outline, Part II
z RFID and the Auto-ID Center z An in-depth look at some issues z A peek at the protocol z Security and Privacy Issues z Software z Vibration analysis z Silicon manufacturing
Outline
z Components of an RFID tag z Understanding the Experiment z Manufacture zSemiconductor zTag
z Results z Worldwide Fab Capacity
Results
z Total RFID Cost zIC + Traditional Assembly: 4.351¢ zIC + Flip Chip Assembly: 3.311¢
z IC Cost: 1.151¢
z Antenna Cost: 11¢
z Assembly: 2.25c ~ 1.15 1¢
z At 10’s of billion tags a year
Inputs to modelProcess StepsEquipment Benchmarkz Throughputz Raw material & Utilitiesz Laborz Yield
Overhead Maintenance Depreciation
Process modeling
z R. Leachman, J. Plummer & N. Sato-Misawa, “Understanding fab economics” Competitive Semiconductor Manufacturing, University of California, Berkeley, 1999.
z Leachman & Hodges, “Berkeley Semiconductor Manufacturing” IEEE Transactions on Semiconductor Manufacturing, May 1996.
z J. Bloomsburg, “RFID Tag Manufacturing” MIT UROP, 2002.
z R. Wright, “Cost Resource Model Detail” Economic Model Workshop, International Sematech, 2001.
semiconductor process modeling
z Sematechdeveloped benchmark
z 250_A1_82 Process Benchmarkz 0.25 micron
z 282 Step
z 19 Mask
z 3 Metalz 2 Poly
Driving Variables
z Mask, Metal and Poly Layers
z Wafer starts: 300,000 per year
z 100,000 dies/wafer z Wafer size: 200mm
Assembly Process
z Assembly Process Steps z Thinning z Dicing z Assembly z Traditional z Flip Chip z Fluidic Self Assembly z Vibratory Assembly
z Tag Test
Results
z Total RFID Cost zIC + Traditional Assembly: 4.351¢ zIC + Flip Chip Assembly: 3.311¢
z IC Cost: 1.151¢
z Antenna Cost: 11¢
z Assembly: 2.25c ~ 1.15 1¢
z At 10’s of billion tags a year
Unit Machine
Results: Cumulative Assembly Cost
Dici ily
Li i
Dicing Flily
imi Uni i
Assembly Costs
0.00002772 0.00005651
0.02922279 0.03025432
0.000342826 0.000650941
0.032175597 0.036584412
0.00001000
0.00010000
0.00100000
0.01000000
0.10000000
1.00000000 Thinning ng Tradit onal
AssembTag Test
$ C
os t
Pe r
Die
ne Max mized
Assembly Costs
0.00002772
0.00083171
0.01857550 0.01959650
0.000342826
$0.00142614
0.024655643 0.026883013
0.00001000
0.00010000
0.00100000
0.01000000
0.10000000
1.00000000 Thinning p Chip
AssembTag Test
$ C
ost P
e r D
ie
Line Max zed t Mach ne
Worldwide Fab Capacity z Assume 1 billion
tags a day z 100,000 dies/wafer
z 20% of world silicon capacity
z Fabs 15% idle today
Outline, Part II
z RFID and the Auto-ID Center z An in-depth look at some issues z A peek at the protocol z Security and Privacy Issues z Software z Vibration analysis z Silicon manufacturing