R. E. Demaray

December 2012 Page 1

Ernest Demaray, Ph.D. 190 Fawn Lane, Portola VA, CA. 94028

650-529-9027 office, 650-283-7765 mobile/text, ernest.demaray@gmail.com

BS Physical Chemistry, CSU Hayward, CA 1972PhD Chemical Physics UCSC, Santa Cruz, CA 1977NSF Post Doc. SUNNY Stony Brook, NY 1977-79Sr. Physicist DOE/Airco Temescal, Berkeley CA 1980-87Manager R&D, Varian Thin Film Systems, Palo Alto, CA 1987-92GM Applied Komatsu PVD Div. Santa Clara, CA 1992-98Founder, President & CTO, Symmorphix, Sunnyvale, CA 1998-07Founder & President Antropy, Inc. Portola Valley, CA 1997- present

Professional Experience

Founder and Managing Partner, Demaray LLC July 2012 to present,

Demaray LLC formed to license and manage the portfolio of thin film energy related patents acquired by in 2012 from Springworks Receivership for advanced amorphous thin films;

Demaray LLC & Antropy Inc. Symmrophix Portfolio of 53 + US and international Patents acquired by Ernest in February of

2012 together with licenses in the areas of energy conversion and storage and advanced thin film materials and devices for solid state Li+ ion battery and MEMS device production.

Breakthrough patent applications for planar optical coupler transformer die products filed in 2012 disclosing advanced high index optical films enabling long anticipated optical coupling for solar concentration, optical transmission and energy and chemical conversion and storage.

An ARPAe award for $1.6M was awarded to the team formed by Ernest with Prof. N. Kobayashi of UCSC and NASA ASL laboratories and Tango Systems of San Jose, CA. to demonstrate manufacture and license advanced solar fiber coupler, Nov. 2012.

Multiple Licenses, national and inter-national for 54 Demaray patents under management.

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Founder and President, Antropy Inc. Sept. 2007 to present, Advanced technology and new IP for thin film materials, process, device, manufacturing.

Plasma modeling, simulation, design and fabrication of thin film sources and tooling for;

Electro-optical, solid state lighting, photovoltaic, and energy transfer & storage technology products.

IP services, technology licensing, technical product development and marketing and consultation.

CTO, Symmorphix Inc. Sept. 2005 – Aug. 2007,

Developed and delivered, wide area $5M “Phoenix”, 5 chamber cluster tool to IPS for “the world’s first volume manufacturing facility dedicated to the production of its revolutionary thin-film micro-energy cell (MEC™) products”. Under continuing NDA.

Continued ~ 50+ US thin film patents for equipment, materials, process and device for dielectric MEMS applications, see patent publications.

Helped closed $34.7M A –round funding for IPS; Polaris, W.D. Shaw, AMAT …1

CEO Symmorphix Inc. February 2004 – Sept. 2005,

Lead $27.5M private buyout of Symmorphix by Digital Power and Crescendo Partners, Feb. 2004.

Licensed my patents and shipped a new design, 400 X 400mm nano-technology manufacturing cluster tool to STMicro R&D , Catania Sicily, $5M for dielectric energy conversion and flexible

electronics applications,2

Licensed my patents with service and supply contracts for Li +Ion battery manufacture, $8M to Infinite Power Systems IPS ( Dow-Corning, Springworks, Unisys and Applied Materials) April 15, 2005.

Demonstrated and patented basic new method and materials for the complete fabrication of solid state Li + Ion micro-battery for low temperature metal foil; Dec. 2004.

Demonstrated OLED active, single layer oxide barrier film on Dupont Tejin PEN with WVTR ~ E-6 g/m2-day , Konarka.

Completed USDC grant,3 “Scanning Magnetron PVD for TCOs & OLED Encapsulation”, Symmorphix,

Rich Wessel, Dupont, $2.19M for “single layer, ultra barrier process on polymer substrates and for OLED and wide area electronics applications”.

Founder and CTO, Symmorphix Inc. Oct. 1998 – Feb. 2004,

1278 Reamwood Ave., Sunnyvale, CA 94089

November 1998, founded Symmorphix with Bob Conner at Applied Komatsu-Santa Clara for purchase of AKT PVD Division assets; Corning Glass joint venture contract, ~$200k/mo. for wide area production of “microcrystalline” thin film Silicon for poly-Si TFT-LCD manufacture, 13 months.

Secured $3.5M Angel round from private investors, 2000.

Symmorphix Secures $25M in Venture Financing for next-generation micro-optical amplifier-

Integrated Components (APICs) using proprietary thin-film process technology, 4

Symmorphix Secures $13M in funding, 5 metro micro-optical component development.

Funded and carried out Stanford-LLNL program for ELA-TFT poly silicon transistors .

1 09-06-2006 | IPS Raises $34.7M for Manufacturing 2 http://us.st.com/stonline/press/news/year2003/t1355h.htm 3 RFP03-83 4 http://www.highbeam.com/doc/1G1-67455420.html 5http://www.prnewswire.com/cgi-bin/stories.pl?ACCT=104&STORY=/www/story/04-24-2001/0001476474&EDATE

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Delivered ‘Er+3 ion doped’ planar waveguide amplifier’ to Telcordia/Bellcore specifications for gain, noise, PDL, PDEG; 8 channel C -band module on silicon with integrated mode size converter to JDSU,

Lucent, Perelli, STMicro; Stanford & FOM contracts; many planar optical device and method patents. 6 , 7

Ran out of venture money, ran on empty many months, kept team together.

Restarted Symmorphix with Digital Power Capitol-Crescendo Ventures round ~$5.8M for new electronic and barrier dielectric film application business.

Negotiated and closed STMicro, Agrate Italy, $2.5M R&D license for Symmorphix Intellectual Property, w. Dr. Bruno Murrari.

Closed contract for $2.4M, dielectric “nano-technology” PVD cluster tool, November 2003 to Dr. S. Coffa, STMicro, Catania, Sicilia R&D Lab.

Demonstrated and published high k gate oxide film process for high performance polymer transistor w. Prof. Alan Heagar, UCSB.

Won USDC grant, “Scanning Magnetron PVD for TCOs & OLED Encapsulation”, Symmorphix, ref. Rich

Wessel, Dupont Elec., $2.19M, Q3/2003. 8

General Manager PVD Division, Applied KomatsuTechnolog , Sept. 1992-Oct. 1998, 3110 Scott Blvd. Santa Clara, Ca. 95054

Won Sony Gen. IV-poly silicon TFT-LCD PVD cluster tool business for amorphous silicon deposition.

Established manufacturing record 500 hr MTBF, 90% availability for multiple Gen IV tools at ADI, Kumomoto with Japanese team lead by Dr. Susumu Sawada. Record Samsung install with Korean team.

Developed first wide area, semiconductor class, linear scanning magnetron and process technology; prototype chamber compatible with ADT-AMLCD-CVD cluster tool mainframe for 360 X 450 mm TFT_LCD refractory metal/metal nitride and ITO production in first year, scaled five times to Gen. IV products,

Won first TFT-LCD Gen II PVD system order with Sharp U.S., Camus, Washington. Established PVD Division for AMAT Display Technology Division (DTI) and Komatsu Industries to form

Applied Komatsu Technology (AKT) PVD Division; develop, manufacture and deliver wide area PVD cluster tools for manufacture TFT- LCD displays; 20 wide area Gen II and III PVD systems, $65M revenue US, Japan and Korea.

Director of Strategic Marketing, Varian Thin Film Systems Division (TFS) May 1990 - Sept 1992, Palo Alto, CA

Technology roadmap and planning portfolio for Tokyo Electron (TEL) -Varian product planning, including promotional and Beta site programs. Sales, $90M FY 90-91.

Won SEMITECH “REMATCH” purchase of M-2000 4 chamber cluster tool for “Collimated Ti-TiN and Reflow Aluminum Via Fill Program” , production release of processes for Ti-TiN barrier and aluminum via metallization, adopted world wide, including Applied production 200mm PVD tools. Resulted in major litigation in which my Varian TFS patents were up held in interference, averse to IBM and AMAT; ~$48M settlement in ‘05 from Applied to Varian/Novellus in 2005.

6 http://www.kigre.com/files/er132.pdf 7 http://www.eetimes.com/showArticle.jhtml?articleID=16503518 8 http://www.usdc.org/newsroom/archived_releases/Symmorphix_PR_03_5_04.htm

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R&D Director Semiconductor Equipment Products, Varian Associates, Thin Film

Systems, Palo Alto, CA, April 1987 to March 1989

Patented “Luv ” full target erosion magnetron source design, low pressure collimated deposition, first full face erosion, first monolithic target, first uniform erosion, now industry standards world wide. 200mm”Quantum Source”, low cost, “polymer net-cast” sputter source, most profitable product in Varian TFS history.

Originated , developed and patented collimated PVD process, demonstrated to Fujitsu, IBM and TI.

Demonstrated hillock/void free bottom gate process with novel Ti/aluminum process later published by Sharp.

New Products Manager, Airco-Temescal Division of BOC,

7th St Berkeley CA. January 1984-1986 PVD vertical metallic magnetic recording media disk products for IMB General Products, San Jose and Fuji

Electric, Japan. First CVD “First I-carbon” coated disk media products (Prof. Dave Bogy, UCSBME). Many UC Berkeley student interns.

Developed and patented a ‘ring type’ magnetron sputter source to replace the “S-gun” product of Varian Assoc.

Shipped the first single wafer vacuum to vacuum sputter tool to Thompson Grenoble utilizing REI load lock soft clean process. Made ideal Tungsten Silicide diodes with Thompson Grenoble for fast ddl logic applications with damage free RIE plasma cleaning process,

Sr. Physicist, Turbine Coating Group, Airco-Temescal,

7th St Berkeley CA1980 -1983

Managed DOE Combustion Zone Durability Program Grant R&D, ~$.5M for development of ceramic thermal barrier coatings, CTBC, for turbine engine blades and vanes.

Designed and built 50kVA electron-beam furnace for batch evaporation of ceramic coatings for turbine engine blades and vanes.

Developed and patented adherent ceramic thermal barrier coating (TBC) process for ~ 250 micron, stabilized c-Zirconia TBC over MCrAlY coated superalloy turbine blades and vanes. This process is bill of materials for turbine engines world wide and has saved 1% of the specific fuel consumption of all turbine engines since the mid eighties. My patent for adhesion enabled patents for layer coating by others (T. Strangman-GTEC). However it was classified by the State Department and remained a secret of the cold war for ~ 10years. (B. Halnan-Airco Temescal)

Demonstrated 20,000 cycles TBC durability at NASA LEWIS and GTEC burner rig tests on MCrAlY coated super alloy test parts and blades.

Derived method and theory of failure free adhesion of high temperature ceramic coatings on super alloy components in the presence of interfacial defect distributions, J. Oxidation Metals, 1983

Job Corps Councilor, Camp Parks Job Corps Center,

Pleasanton Calif.1969 - 1972

Crisis Intervention Mobile Group Life for West Oakland and San Francisco hospitality facilities, metropolitan areas with 40 hr. weekend service,

Avocational and athletic instructor, inc. Red Cross WSI drown-proofing program for 3,000+ young men for. Taught the young Mr. George Forman water safety to overcome negative buoyancy.

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Education

Post Doctoral Fellow, Petroleum Research Foundation,

State University of New York, Stony Brook, N.Y. 1977- 1979

Developed method to measure Heisenberg limited molecular electronic excited states in the vacuum UV including pulsed, super-sonic, seeded molecular beam sample preperation ; Resonance Enhanced Multiphoton Photoionization (RMPI) Spectroscopy, Prof. Phil Johnson.

Designed and fabricated duel-grating, pulsed tunable dye laser and integrated with a super-sonic, pulsed molecular beam source for use with tunable multi photon resonant ionization (RMPPI) method.

Reported “multiphoton induced collisions” and “relaxation intermediate state for Benzene singlet state relaxation”.

Ph.D. Chemical Physics, University of California at Santa Cruz,

1972-1977, Prof. Roger Anderson

Conversion of single vibration quanta to single polarized photons in state to state collision with crossed supersonic molecular N2/CO and Rubidium atoms in crossed beams.

Measured polarization ratios, calculated Rubidium atom nuclear hyperfine Clepsch-Gordon transition moments for Sigma and Pi molecular fluorescent transitions now used for GPS Rb atomic clocks.

B.S. Physical Chemistry, California State University at Hayward, 1972, Prof. Kevin Cadogan

Double major in electro-chemistry and excited state physical chemistry.

Senior Thesis; “UV Photo conductivity of Conjugated Amines and Carboxylic acid analogs of Rhodopsin in N-Pentane ice, at 77deg K.”

American Chemical Society Certification, German Chemistry Literature Exam Awarded.

University collaborations

Ernest became the first private individual affiliated NASA-AMES and U.C. Santa Cruz Advanced

Systems Laboratory (ASL), Mountain View CA. with office and laboratory for advanced thin film materials and devices co-located with Prof. Nobuhiko Kobayashi, N239/R165 Moffett Field, CA 94035 U.S.A. 2012.

UCSC collaboration for advanced energy conversion and device technology, 2010

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Turbine engine ceramic thermal barrier coatings (CTCB)development with with UCB Ceramics Dept. DOE, Battelle PNL, Garrette TEC (Tom Strangman), UC Berkeley, Mat. Sci. Prof. Tony Evans,

Very high cycle, (>E6) 3D mechanical simulation and design for vacuum gate valves, Prof. Al Pizano.

Prof. Roger Anderson, UCSC; for Collimation modeling ref. Varian/AMAT lawsuit, patents.

Stanford Micro Electronics User Facility for ELA Polysilicon transistor gate oxide deposition, Stanford/LLNL, Prof. Tom Sigmund.

Prof. Albert Poleman and group FOM for planar micro-optical amplifier modeling, metrology, design and testing, rare earth doped optical and electrical films and devices.

UCB ME Tribology and Recording lab, Prof. Dave Bogy.

UCSD, Center for magnetic recording, Prof. Frank Talkie.

U. Arkansas, HiDEC for integrated passive electronic design and fabrication, Prof. Len Schaper, Rick Ulrich; Infinion ‘H3’ filter project, Nokia, STMicro products.

U. Georgia/Stanford, James A. Meindel for on chip high k dielectric decoupling design and calculations.

UCSB high k gate oxide for polymer transistor, Prof. Alan Heeger, m 805-893-3184 ajhe@physics.ucsb.edu.

Richard E. Demaray; US Patents by Patent Number “INORGANIC MATERIALS, METHODS AND APPARATUS FOR MAKING SAME,

AND USES THEREOF” Apparatus, method and Devices for high rate deposition of Hexagonal and Cubic Aluminum Nitride; filed an

application for United States Letters patent on September 29,2011, amended fall 2012, as U.S. Provisional Patent Application No.

61/540.558- Morgan AMG, with D.Brors, et. al. 61/725,400 - 2012 adiabatic planar waveguide coupler Transformer, Richard E. Demaray, Assigned to R. E. Demaray 61/540,558 - 2012 Inorganic materials, methods and apparatus for making same, and uses there of. D. L. Brors, R. E. Demaray and D. L. Shultz – Assigned to Morgan Advanced Materials 8,173,482 – 2012 Devices and methods of protecting a cadmium sulfide for further processing, J.

Drayton, R.E.Demaray – Assigned to G.E. PrimeStar Division, Arvada Colorado. 8,105,466 – 2012 Biased pulse DC reactive sputtering of oxide films – use of 2MHz bias for wide area

processing of dielectric films. 8,076,005 -2011 Physical vapor deposition of titanium oxides and sub-oxides. Demaray, et. Al. 8,045,832 B2 -2011 Mode Size Converter for a Planar Waveguide, Tao Pan, Richard Demaray, Yu Chen,

Youg Jin Xie, Ravi Pethe, Oct 25, 2011- Coupling efficiencies to 95%; single mode fiber waveguide, 8 claims

7,959,769 -2011 Deposition of LiCoO.sub2, Demaray et. al. 7,469,558 As-deposited planar optical waveguides with low scattering loss and methods for their

manufacture – thin film planar optical waveguides with ion enhanced processes that minimize scattering loss (<-80db) due to sidewall roughness, 12 claims

7,413,998 Biased pulse DC reactive sputtering of oxide film, - rare earth doped optical waveguide multiplexer and amplifiers with attenuation control and gain, 13 claims.

7,404,877 Low temperature Zirconia based thermal barrier layer by PVD ,- for low laser fluence conversion of a-Si to p-Si, reduction of ELA full melt threshold, including transistors on polymer web, 6 claims.

7,381,657 Biased pulse DC reactive sputtering of oxide films, transition mode , -very high rate transition mode reactive oxide deposition inc. rare earth doped oxides, 21 claims.

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7,378,356 Biased pulse DC reactive sputtering of oxide films , - claim 18 is the basic method for biased deposition of dense oxide films employing electrical charge control with reverse pulsed DC reactive process, including wide area manufacture; USPTO, “long anticipated results”, 35 claims.

7,262,131 Dielectric barrier layer films, - l single layer ceramic ultrabarrier “flexible micro-glass” film with ~ 100 nanometer low stress “Indium metal breath” process for low stress on polymer as barrier and on OLED/Solar as transparent encapsulation over live devices, 24 claims.

7,238,628 Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides, - record dielectric strength for titania films with and without Er+3 doping, record high polymer transistor with high k titania gate, immune indifferent implantable, impermeable, high k implantable array gate oxide, record dielectric strength for 10nm film with and without rare earth doping, Magnelli phase control from conductive TiO targets for n-type Protonic oxide fuel cell membranes and un- depleted electrode/oxide interface devices, 42 claims.

7,205,662 , Dielectric barrier layer films – USDC verified, ~ 150nm, single layer ultrabarrier “flexible amorphous micro-glass” film including on PEN/PET web, performance claim all single layer films < E-2gr/M2-day permeation in damp heat, 24 claims. In pilot production at STMicro Electronics for integrated planar electronics on glass and products to Nokia.

6,884,327 Mode size converter for a planar waveguide , planar adiabatic mode size converter with <-80dB visible and IR, birefringence neutral, for mode size processing and fiber to die coupling of C-band optical signals including amplification of signal levels to ~ -40dB, 11 claims.

6,881,305 Heated and cooled vacuum chamber shield , adopted by PVD and CVD thin film manufacturing systems worldwide for improved particle control and high MTBF/MTTR, improved vacuum thin film quality, 6 claims.

6,827,826 Planar optical devices and methods for their manufacture, divisional with method of treating the cathode plate holding a wide area array of target tiles so as to eliminate contamination from the cathode without tile overlap or edge to edge contact, 5 claims.

6,821,562 Method of forming an electrically insulating sealing structure for use in a semiconductor manufacturing apparatus , replaces single piece main ceramic insulators for large scanning magnetrons with polymer/ceramic insulator construction, 20 claims.

6,773,562 Shadow frame for substrate processing, electrical control for the substrate perimeter shield for wide area substrates such as glass or metal foil, eliminates foil based edge damage and particles, 2 claims.

6,533,907 Method of producing amorphous silicon for hard mask and waveguide applications, dense amorphous silicon by harmonic conversion of merged AC and DC power, dense, oxidation resistant SI films for smooth hard mask and core optical wave guide devices, 4 claims.

6,506,289 Planar optical devices and methods for their manufacture, method of planarization of wave guide cladding, >~ ‘BSQ’ process pioneered by IBM for planarization, duel RF process utilized for defect free LIPON electrolyte glass over LiCo2 for solid state Li+ ion battery, see .pdf of [20070125638 Deposition of LiCoO2 ] for figures, 32 claims.

6,436,509 Electrically insulating sealing structure and its method of use in a semiconductor manufacturing apparatus ,

6,432,203 Heated and cooled vacuum chamber shield , reactor liner for particle control of chamber, high MTBF/MTTR, improved vacuum thin film stress and first article quality with isothermal hearth side operation under transient high power processing, 12 claims.

6,362,097 Collimated sputtering of semiconductor and other films – wide area ‘MBE’ process and equipment for directed neutral vapor deposition of semiconductor films, including protection from plasma damage, fluorescent silicon films, assigned to AMAT, 31 claims.

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6,257,045 Automated substrate processing systems and methods – position feedback using optical or contact, edge detection for real time next glass/wafer positional hand off, >500hr MTBF transfers for TFT-LCD/Solar cluster tool production without edge damage/breakage, 29 claims.

6,205,870 Automated substrate processing systems and methods – apparatus with in situ position sensing including location specific acoustical detection to robot transfer and placement of wide area glass for Solar/TFT-LCD manufacture, 22 claims.

6,199,259 Autoclave bonding of sputtering target assembly - 6,170,082 Taking corrective action in computer programs during instruction processing 6,033,483 Electrically insulating sealing structure and its method of use in a high vacuum physical vapor

deposition apparatus 5,855,744 Non-planar magnet tracking during magnetron sputtering - scanning design/method to

overcome the double curvature electron trap at opposite corners of a magnetron circuit and achieve ~ 1% 1 sigma film uniformity and low COO production, 42 claims.

5,799,860 Preparation and bonding of work pieces to form sputtering targets and other assemblies – vacuum super-plastic lamination of metallurgical sheets for high strength bonding including sputter backing plates and metallurgical targets, 16 claims.

5,676,803 Sputtering device – “PVD target backside vacuum-elegant design” adopted worldwide for TFT-LCD wide area PVD, AMAT withdrawn due to prior art; 1950 English magazine article, 12 claims.

5,635,036 Collimated deposition apparatus and method – storied, controversial PVD process invented and assigned to Varian/Novellus for directional Ti/TiN contact barrier metallization, required full face, low pressure sputter “Quantum” and “Endura” PVD source developments, Varian TFS Palo Alto won SEMATECH 200mm cluster tool competition/purchase for M-2000 vs. AMAT Endura (Dr. Jim Stimmell), qualified by 4 PVD vendors with customers worldwide, upheld in interference proceedings with AMAT– IBM due to extensive prior Monte Carlo simulation of the scattering process at Varian/UCSC (ref. Prof. R. Anderson), settled out of court,” collimation” currently qualified for 200mm production with W and Cu metallization , 19 claims.

5,603,816 Sputtering device and target with cover to hold cooling fluid – elastomeric main insulator for target assembly, 2 claims

5,595,337 Sputtering device and target with cover to hold cooling fluid - a cooled target backing plate assembly with no water to vacuum seals and low aspect ratio to support high magnetic field sputtering for wide area, high power production of vacuum thin films, 3 claims

5,565,071 Integrated sputtering target assembly – a cooled target backing plate assembly with no water to vacuum seals and low aspect ratio to support high magnetic field sputtering for wide area, high power production of vacuum thin films ,11 claims.

5,518,593 Shield configuration for vacuum chamber – a radiantly heated, grounded dark space shield to prevent spurious plasma about the radial edge of the sputter cathode, is self aligning and self centered over thermal cycle excursions of +/- 500 deg. C with location variation < ~ +/- .010” for isothermal manufacture about a stationary wide area sputter target , eliminates overburden flaking and particles, improves edge to center reflectance and resistivity uniformity, 34 claims.

5,487,822 Integrated sputtering target assembly – first allowance for cooled target backing plate assembly with no water to vacuum seals and low aspect ratio to support high magnetic field sputtering for wide area, high power production of vacuum thin films , 9 claims.

5,433,835 Sputtering device and target with cover to hold cooling fluid – first allowance for a cooled target backing plate assembly with no water to vacuum seals and low aspect ratio to support high magnetic field sputtering for wide area, high power production of vacuum thin films , 26 claims

5,330,628 Collimated deposition apparatus and method - storied, controversial PVD process invented and assigned to Varian/Novellus for directional Ti/TiN contact barrier metallization, required full

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face, low pressure sputter “Quantum” and “Endura” PVD source developments, Varian TFS Palo Alto, 15 claims.

5,252,194 Rotating sputtering apparatus for selected erosion- design of a rotating magnetic assembly that can provide full face erosion for particle control and arbitrary target erosion and film thickness profiles using the “Arc(r)/r “design rule produces magnets that are ‘heart shaped’ hence the “LUV” magnet designation. All semiconductor sputter sources utilize this design rule today, 28 claims

4,834,860 Magnetron sputtering targets – a pre-grooved, annular sputter target with a fixed magnetron can have improved target life and film uniformity, 13 claims.

4,676,994 Adherent ceramic coatings – thermal barrier coatings utilized on all turbine engines worldwide by this process and equipment. Failure free ceramic adhesion of cubic zirconia ceramic coatings up to many hundreds of microns is achieved in high rate production according to this invention. An initial coating of sub-stoichiometric zirconium oxide has liquid like nucleation and wetting of alumina forming super-alloy when coated at turbine engine operating conditions. This first process layer forms a transient “black liquid layer” ~ 5 microns thick which becomes transparent and solid when exposed to additional oxygen as the remainder of the low density, columnar “white popcorn” Zirconia ceramic layer is deposited on up to 24 blades and vanes in about 10 minutes. The fully oxidized coating is segmented through thickness and failure free in tension. It has the lowest thermal conductivity of known materials for high temperature combustion zone service and allows fuel efficient higher temperature turbine operation. The thick adherent ceramic layer obtains high fracture toughness and is failure free in compression at lower temperatures due to the fully dense adherent layer. This process is used on all turbine engine first and second hot section blades and vanes, 17 claims. It has saved 1-2% of all jet A fuel worldwide since the mid 1980s when it went into full production.

(Foreign Patents Available on Request)

Selected Non-confidential Publications and Presentations 1. “A New Global Interconnect Paradigm: MIM Power-Ground Plane Capacitors,” D.C. Sekar, Ernest

Demaray, H. Zhang, James D. Meindl, Proc. IITC , Jan. 2006. 2. “PVD Ceramic Ultra-Barrier Membranes; Development, Metrology and Applications”, SRI Invited

Talk, Dec. 4, 2006 3. “Single Layer Ultra Barrier Films for Electronics and Display Fabrication” USDC, San Francisco Display

Technology & Supply Chain Investment Conference, Sept. 22, 2005, Symmorphix, Inc., Dr. Ernest Demaray, CEO

4. “Design and Fabrication of Integrated Thin Film RF Filters on Glass A ‘Moore’s Law’ Platform for Low Cost Passive Integration” January 26, 2005 IMAPS, Marko Island, Fl, E. Demaray, Symmorphix Inc. Sunnyvale Ca. ernest_demaray@symmorphix.com Richard K. Ulrich and Leonard W. Schaper, Univ. Arkansas / Xanodics LLC schaper@uark.edu

5. “Poly (3-hexylthiophen) field effect transistors with high dielectric constant gate insulator” J. Apl. Phys V95, no1, 1 Jan. 2004. Wang, A . Heeger, M. Zhang, M. Narasimhan and E. Demaray,

6. “Aluminosilicate Barrier and Encapsulation Technology for Polymer Electronics” USDC Flexible Displays & Electronics Conference, Phoenix Ar. Feb. 2005

7. “High dielectric strength, high k TiO2 films by pulsed DC, reactive sputter deposition” CARTS Conference 2003, Hongmei Zhang and Ernest Demaray

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8. “Declaration of R. Ernest Demaray in Support of Novellus’s Opposition to Applied Material’s Motion for Summary Judgment of Invalidity of the ‘036 Patent on the best Mode Grounds, and Cross-Motion for (1) an Order that Applied is not Entitled to Assert a Best Mode Defense, or,… (2) Summary Judgment that No

Asserted Claim of the US ‘036 Patent is Invalid on Best mode Grounds.”, R. Ernest Demaray, IRELL & MANELLA LLP, Proc. U. S. District Court, Northern District of California, San Jose Div. Case No. C-97-20551 RMW (EAI), Oct. 11, 2002.

9. “High Dielectric Strength, High K TiO2 Films by Pulsed DC, Reactive Sputter Deposition”, CARTS 2003, H. Zhang and Ernest Demaray, Huntsville, Al. 35801, 256-536-1304.

10. Planar Er+3 doped aluminosilicate waveguide amplifier with more than 10dB gain across the C-band, Proc. Optical Society of America 2002, T. Pan, H. Zang, E. Demaray

11. “Microcrystalline-silicon thin films by physical vapor deposition for wide area low temperature polysilicon production” Ernest Demaray, JSID 9/1, 2001

12. “Polysilicon Thin Film Transistors Obtained by Solid Phase Crystallization of DC Sputtered Amorphous Silicon Films” J. Proc. Group de Microslsctronique et Visualization, Universite de Rennes 1, FR, 2001

13. “High Dielectric Strength, High K TiO2 Films by Pulsed DC, Reactive Sputter Deposition”, CARTS 2003, CTI Inc. 904, H. Zhang and Ernest Demaray, Huntsville, Al. 35801, 256-536-1304.

14. “Sputtered Silicon Thin Films for the Fabrication of Low Temperature Polycrystalline Silicon Devices”, W. K. Kwak, E. Demaray, R. Mullapudi, K. A. Wang, D. Toet, J. SID 2002

15. Microcrystalline-silicon thin films by physical vapor deposition for wide-area low-temperature polysilicon production, Ernest Demaray, J. Soc. Inf. Display 9 15 (2001)

16. D. Toet, E. Demaray, R. Mullapudi and K. A. Wang: Dig. Tech. Pap. Int. Workshop on Active-Matrix Liquid-Crystal Displays 2000, Tokyo, p. 117.

17. E. Demaray, B. Lee, R. Mullapudi and K.-A. Wang: Proc. Sixth Int. Display Workshops, 1999 (Sendai International Center, Sendai, 1999) p. 155.

18. Microcrystalline Silicon Thin Films By PVD For Wide-Area Low-Temperature Polysilicon Production Ernest Demaray, SID Symposium Digest 30 853 (1999)

19. “Real-time substrate misalignment monitor and automatic recalibration” A. Hosokawa, E. Demaray, R. Mullapudi, M. Inagawa, J. Vac. Sci. Technol. A 16(3), May/June 1998.

20. “Structure engineering for hillock-free pure aluminum sputter deposition for gate and source line fabrication in active-matrix liquid crystal displays”, Apostolos T. Voutsas and Yoshi Hibino, Rajiv Pethe and Ernest Demaray J. Vac. Sci. Technol. A Volume 16, Issue 4, pp. 2668-2677 (July 1998)

21. "Deposition of Precursor Poly-Silicon Films for Flat Panel Display Applications" by R. Pethe, C. Deshpandey, S. Dixit, E. Demaray, D. Meakin, D. Orgill, N. Turner published in Mat. Res. Soc. Symp. Proc. vol. 471, 1997, pp 3-

22. “M2000 Modular Sputtering System, The Next Generation with the Versa-MagTM, Planar Moving Magnet” G. Price, E. Demaray, Proc. Varian Semiconductor Equipment Group, Thin Film Systems Div. Process Symposium, Palo alto, Calif. Aug. 1989.

23. “ULSIC Manufacturing Reliability Improvement through Parallel Processing with Standby Redundancy, the Application for Modular Thin Film Production Sputtering’” E. Demaray, R. Hill IEEE J. Aerospace, 1987

24. “Aluminum Alloy Planarization for Topography Control of Multilevel VLSI Interconnect”. E. Demaray. J. van Gogh, R. Kolenkow, Proc. VLSI Multilevel Interconnect Conference (VMIC0), June 1987, Santa Clara Calif. IEEE J. Elec. Materials, 1987.

25. “Damage and Polymerization Free RIE Process of n-Si/Metal Schottky Diode Junctions,” C. Mallardeau, E. Demaray, J. Van Gogh, Proc. IEEE Electronic Materials Conference 1987, IEEE J. Elec. Materials, 1987.

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26. “Low Damage RIE Process for Ideal TiW/n-Si Schottky Diodes” R. E. Demaray, R. K. Kolenkow, G. Mathias, Proc. SEMICON EAST Boston, p 38, 1986,

27. “Measurement and Characterization of Surface Roughness of Rigid Disk Magnetic Memory Substrates”, T. T. Dao, D.B. Bogy, E. Demaray, F.E. Talke, University of California College of Engineering Technical Report NO. 1984-ME-1 , Dec. 1984

28. “On the Mechanical Behavior of brittle Coatings and Layers,” A. G. Evans, R.E. Demaray, G. B. Crumley, Oxidation of metals, Vol. 20, Nos. 5/6, 1983.

29. “Physical Vapor Deposition of Ceramic Coatings for Gas Turbine Engine Components.” R. E. Demaray, D. H. Boone, J. W. Fairbanks, Proc. ASME, 1982 Gas Turbine Conference, London England.

30. “Development of Electron Beam Reactive Physical Vapor Deposition of Ceramic Thermal Barrier Coatings,” EPRI Proceedings, Second Conference on Advanced Materials for Alternative Fuel Capable Heat Engines, Navy Postgraduate School, Monterey, Calif. 1981

31. “Development of Improved Corrosion and Erosion Coatings for Gas Turbine Airfoils,” DOE/Battelle PHL Subcontract, DE-AC03-78ET-12292 , Phase III, August 31, 1981.

32. “Ceramic Thermal Barrier Coatings by Electron beam Physical Vapor Deposition, Micro- structural Dependence on Temperature of Formation,” DOE/Battelle PNL Subcontract Report DE-AC03-78ET-12292 Phase III, August 31, 1981.

33. “Development of Improved Corrosion and Erosion Coatings for Gas Turbine Airfoils,” DOE/Battelle PHL Subcontract, DE-AC03-78ET-12292, Phase I & II, April 30, 1980.

34. “Linewidths and high R=resolution structure of the Benzene 1B2u from 1A1g two photon transition by multiphoton ionization-supersonic beam technique”, K. Aron, C. Otis, R.E. Demaray, Phil Johnson, J. Chemical Physics, Nov. 1, 1980.

35. “Laser enhanced collisional effects in the multiphoton Ionization of Molecules in Supersonic Expansions”, R. E. Demaray, C. Otis, K. Aron, Phil Johnson, J. Chemical Physics, May 15, 1980.

36. “Conversion of Translational and Vibrational Energy into Electronic Energy,” R. W. Anderson, R. E. Demaray, A. W. Karp, Symposium on Energy Transfer and Chemical Reactions of Electronically-Excited Atoms and Molecules, IV, ASC/CSJ 1979 Chemical Congress, Honolulu (C&EN, Jan 15, 1979, p100)

37. “Crossed Molecular Beam-Tunable laser Determination of the Velocity Dependence of the Intermultiplet Mixing: K(4p, 2P ½) + He to k(4p, 2P 3/2) + He*, J. Chemical Physics, 64(10), May 1976.

38. “Transvibronic Excitation of Rubidium Atoms in Crossed Molecular Beams with Nitrogen and Carbon Monoxide”, Ph.D. Dissertation, University of California Santa Cruz, Prof. Roger Anderson, University Microfilms, 7905665, 1978

References Dr. Dan Maydan, President, ret. AMAT President and Founder, ret. Applied Komatsu Technology Los Altos, CA, Home 650-941-1132 dmaydan@gmail.com Prof. Dr. Albert Polman, Faculteit der Natuur – en Sterrenkunde, Universiteit Utrecht FOM-Institute for Atomic and Molecular Physics Kruislaan 407, 1098 SJ Amsterdam, Netherlands polman@amolf.nl, Home: 9 011 31 20 638 6890 (primary) Work: 9-011-31-20-6081234 Dr. Susumu Sawada, President (ret.) Japan Energy President (ret.) Unaxis Japan Co., Ltd., 3-2-1 Shinjuku-ku, Tokyo 160-0022, Japan

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susumu.sawada@r2.dion.ne.jp, Home: 011-81-42-536-7548 (primary), Mobile: 011-81-90-7019-7916 Dr. Salvatore Coffa , Director, Opto Electronics, Bio and Nano Systems Corporate Technology R&D, STMicroelectronics, Stradale Primosole 50, Catania 95121, Italy salvo.coffa@st.com, Work +39-0957-407353 Mobile +39-3387-620142 Secretary; Valeria Formica, +39 09574 07749 Dr. Richard M Levy, Chairman, Varian Medical Systems 3100 Hansen Way Palo Alto, California 94304-1030 richard.levy@varianmedical.com Phone: 650-493-4000. Fax: 650-424-6822 Dr. Russel J. Hill, CTO Airco Temescal Division, 7th St. Berkeley Calif. 8502 Buckingham drive, El CerritoCa. 94530 Hillsq@pacbell.net, Home +510-237-6064 Prof. Roger W. Anderson, Professor of Chemistry and Biochemistry UCSC, Santa Cruz. 1156 High Street, CA. 95064 anderso@ucsc.edu, Work (831) 459-2854 Mr. Bill Halnan, General Manager, Airco Temescal Turbine Coating , 7th ST. Berkeley, Calif. Home:(510) 524-0654 (primary) Mobile:(510) 502-9624 whalnan@comcast.net Mr. Geroge Danko, President, Springworks LLC. Minneapolis, Min. Board Member, Symmorphix, Sunnyvale Calif. Green Trees Road, Wayzata, MN 55391 george.danko@jumptech.com Mobile:952-215-5024 (primary), Home 952-404-1895

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