Building a world without wires!Building a world without wires!

October 6, 2000October 6, 2000

Kichul ChangKichul ChangPrincipal EngineerPrincipal Engineer

LG Innotek Co., Ltd.LG Innotek Co., Ltd.kcchang@lginnotek.comkcchang@lginnotek.com

http://carpc.co.krhttp://carpc.co.kr

AGENDAAGENDA

Bluetooth IntroductionBluetooth Introduction Future of BluetoothFuture of Bluetooth Market OverviewMarket Overview Chipset & Module TrendChipset & Module Trend ConclusionConclusion

BluetoothBluetoothIntroduction Introduction

- 4 -

Personal Ad-hoc Personal Ad-hoc ConnectivityConnectivity

Cable Cable ReplacementReplacement

Landline

Data/Voice Data/Voice Access PointsAccess Points

Bluetooth VisionBluetooth Vision The best low-cost radio link technologyThe best low-cost radio link technology

Perfect for mobile devices – small, low power, and low cost, but good Perfect for mobile devices – small, low power, and low cost, but good performanceperformance

Open, royalty free specificationOpen, royalty free specification

- 5 -

Bluetooth SIG HistoryBluetooth SIG History Ericsson Invented the Concept - '94Ericsson Invented the Concept - '94 Invited Other Industry Leaders to Help Develop the Concept - '97Invited Other Industry Leaders to Help Develop the Concept - '97 Technology Announced - May '98Technology Announced - May '98 Nine Lead Promoter CompaniesNine Lead Promoter Companies

- Ericsson, Nokia, Toshiba, Intel, IBM - Ericsson, Nokia, Toshiba, Intel, IBM

- Microsoft, Motorola, 3Com, Lucent (Dec '99) - Microsoft, Motorola, 3Com, Lucent (Dec '99) Unprecendented Industry Acceptance of the Bluetooth Wireless TechnologyUnprecendented Industry Acceptance of the Bluetooth Wireless Technology

- Over 2000 Adopter and Associate Companies Have Joined the SIG!- Over 2000 Adopter and Associate Companies Have Joined the SIG!

- Many Market Segments and Usage Models Have Been Defined- Many Market Segments and Usage Models Have Been Defined v1.0 Specification Published - July '99v1.0 Specification Published - July '99 v1.0b Update Published - Dec '99v1.0b Update Published - Dec '99 v1.1 Update will be Published - Nov '00v1.1 Update will be Published - Nov '00

- New Member Web-Site Opened (http://www.opengroup.org/bluetooth)- New Member Web-Site Opened (http://www.opengroup.org/bluetooth) Products Are Starting to Enter the Market NowProducts Are Starting to Enter the Market Now

- Mobile Phones, Headsets, Mobile PCs, Data Access Points- Mobile Phones, Headsets, Mobile PCs, Data Access Points

- 6 -

Korean SIG MembersKorean SIG Members

•Advanced Semiconductor Business Inc.Advanced Semiconductor Business Inc.•Belco International Co., LtdBelco International Co., Ltd•Bellwave, Inc.Bellwave, Inc.•C&S TechnologyC&S Technology•Commax.co.ltdCommax.co.ltd•CyberbankCyberbank•D.O.TelD.O.Tel•Dacom CorpDacom Corp•Daewoo Telecom LTDDaewoo Telecom LTD•DAIC MicrosystemsDAIC Microsystems•Doshin Electroniks Corp.Doshin Electroniks Corp.•DreamTelDreamTel•DSI Inc.DSI Inc.•EST(Embedded Solution Technology Inc.)EST(Embedded Solution Technology Inc.)•ETRIETRI•FlinstonFlinston•Gmate, Inc. / ASIC design Lab.Gmate, Inc. / ASIC design Lab.•Hanchang CorpHanchang Corp•Hansei UniversityHansei University•HASSNetHASSNet•HC Telecom Co., Ltd.HC Telecom Co., Ltd.•Hutel Inc.Hutel Inc.

•IWingzIWingz•JATY ELECTRONICS CO., LTDJATY ELECTRONICS CO., LTD•Joohong Information and communicationJoohong Information and communication•JTEL Co. LtdJTEL Co. Ltd•KetiKeti•KiRyung Electronics Co., LtdKiRyung Electronics Co., Ltd•Korea Electronics Technology InstituteKorea Electronics Technology Institute•Kortronics Enterprise Co., LtdKortronics Enterprise Co., Ltd•LG Electronics Inc./ Media-Communication Lab.LG Electronics Inc./ Media-Communication Lab.•LG Information & Communications,LtdLG Information & Communications,Ltd•LG Innotek Co., Ltd.LG Innotek Co., Ltd.•LG TelecomLG Telecom•Maxon ElectronicsMaxon Electronics•MiengineMiengine•MMC Technology, Inc.MMC Technology, Inc.•N3 Technologies IncN3 Technologies Inc•NavtronNavtron•Netnaru Ltd.Netnaru Ltd.•Nexcell Telecom CO, LtdNexcell Telecom CO, Ltd•Nong Shim Data System Co, Ltd.Nong Shim Data System Co, Ltd.•NuArk Co., Ltd.NuArk Co., Ltd.•Open SolutionOpen Solution

•Opentech Inc.Opentech Inc.•Powerlink Corp.Powerlink Corp.•Radionix Inc.Radionix Inc.•RFSSRFSS•S&S Technology, Inc.S&S Technology, Inc.•SamsungSamsung•SANION CO.,LTD.SANION CO.,LTD.•Sejin Electron Inc.Sejin Electron Inc.•SENA Technologies, Inc.SENA Technologies, Inc.•SEWON TELECOM LTDSEWON TELECOM LTD•Simplex InvestmentSimplex Investment•SK TelecomSK Telecom•SysOnChip, Inc.SysOnChip, Inc.•TeleTek Inc.TeleTek Inc.•Telian CorporationTelian Corporation•Tescom co. ltd.Tescom co. ltd.•UNO Systems Co., LtdUNO Systems Co., Ltd•Wide Telecom, Inc.Wide Telecom, Inc.

Total 62 Company/University/Institute (19/July/'00)Total 62 Company/University/Institute (19/July/'00) About 200+ Companies participate in Bluetooth Developments.About 200+ Companies participate in Bluetooth Developments. Main Application is Mobile Phone and AccessaryMain Application is Mobile Phone and Accessary

- 7 -

BQRB = Bluetooth Qualification Review Board

BTAB = Bluetooth Technical Advisor Board

BQA = Bluetooth Qualification Administrator

BQB = Bluetooth Qualification Body

Program ManagementBoard

(PM Board)

LegalCommittee

(LEGAL)

ManagementServices(ADMIN)

Marketing(MKTG)

QualificationReviewBoard

(BQRB)

Test andInterop(TEST)

ArchitectureReviewBoard

(BARB)

Regulatory(GOV)

TechnicalWorkingGroups

RFRegulations

AviationRegulations

SecurityRegulations

JapanRegulations

BTAB

BQA

BQB

ExpertGroups

Errata Owner and Review pool

Sub-groups

- Promoter- Associate- Early Adopter- Independent

ChinaRegulations

Bluetooth SIG StructureBluetooth SIG Structure

- 8 -

Application Framework and Support

Link Manager and L2CAP

Radio & Baseband

Host Controller Interface

RF

Baseband

AudioLink Manager

L2CAP

TCP/IP HID RFCOMM

Applications

Data

Con

trol

Spec OverviewSpec Overview

Test Specification

- 9 -

Frequency band & Channel Arrangement : ISM BandFrequency band & Channel Arrangement : ISM Band- USA 2.4000 - 2.4835 GHz f = 2402 + k MHz, k=0, …78- Europe 2.4000 - 2.4835 GHz f = 2402 + k MHz, k=0, …78- Spain 2.4450 - 2.4750 GHz f = 2449 + k MHz, k=0, …22- France 2.4465 - 2.4835 GHz f = 2454 + k MHz, k=0, …22

Transmitter PowerTransmitter Power - 0 dBm (Class 3)- 4 dBm (Class 2)- 20 dBm (Class 1)

Power ConsumptionPower Consumption- 0.3 mA (Standby mode), 30mA (Operating Mode)

ModulationModulation - GFSK (BT = 0.5; 0.28 < h < 0.35) - 1 MSymbols/s

Receiver SensitivityReceiver Sensitivity- -70dBm @ 0.1% BER

Spec Overview (Radio)Spec Overview (Radio)

- 10 -

Spec Overview (Baseband)Spec Overview (Baseband) Channel Channel

- Data channel + 3 Voice Channel - Data Rate : 723.2 kbps / 57.6 kbps (Asymmetric),

432.6 kbps / 432.6 kbps (Symmetric)- Voice : 64 kbps for each channel

FEC (Forward Error Correction)FEC (Forward Error Correction)- 1/3 Rate FEC, 2/3 Rate FEC- ARQ scheme for the data

SecuritySecurity- Robust Authentication and Encryption : Key Length up to 128 bits- Fast Frequency Hopping : 79 channels- Low transmission Power : Range typically 10 meters

AudioAudio- CVSD (Continuous Variable Slope Delta Modulation)- 64k samples /s linear PCM data

Support up to 8 devices / piconet, Max 10 piconet (71 devices)Support up to 8 devices / piconet, Max 10 piconet (71 devices)

- 11 -

SCO (Synchronous Connection Oriented) - 1 대 1 의 대향 Link 를 형성 . 1 Packet / 1 SlotACL (Asynchronous Connection-Less) - Packet 교환형 , 1,3,5 등 3 종류의 Slot 점유

Spec Overview (Link)Spec Overview (Link)

Forward ReverseDM1 1 17 2/3 yes 1 800 800 108.8 108.8 108.8DH1 1 27 no yes 1 800 800 172.8 172.8 172.8DM3 2 121 2/3 yes 3 400 267 258.1 387.2 54.4DH3 2 183 no yes 3 400 267 390.4 585.6 86.4DM5 2 224 2/3 yes 5 267 160 286.7 477.9 36.3DH5 2 339 no yes 5 267 160 433.9 723.2 57.6AUX 1 29 no no 1 800 800 185.6 185.6 185.6HV1 na 10 1/3 no 1 - 800 64.0HV2 na 20 2/3 no 2 - 400 64.0HV3 na 30 no no 3 - 267 64.0

DV- A na 10 no no 1 - 800 64.0DV- D 1 9 2/3 yes 1 - 800 57.6

Asymmetric

ACL

FEC CRC Max.Slot

MaxAsym

Packet Type PayloadHeader

UserPayload

SCO

Max SymSlot/sec

Symmetric

- 12 -

Piconets & ScatternetsPiconets & Scatternets

MasterMasterPiconet 1Piconet 1

Slave 3Slave 3Slave 1Slave 1

Slave 2Slave 2

MasterMasterPiconet 3Piconet 3

Slave 7Slave 7Slave 6Slave 6

Slave 8Slave 8

MasterMasterPiconet 2Piconet 2

Slave 5Slave 5Slave 4Slave 4

A master and up to 7 slaveA master and up to 7 slaves from a Piconets from a Piconet

Master controls the PiconetMaster controls the Piconet

Slaves only communicate wSlaves only communicate with the masterith the master

Up to 10 Piconets in a ScatUp to 10 Piconets in a Scatternet before performance ternet before performance starts to degradestarts to degrade

Total 71 devices can be coTotal 71 devices can be connected togethernnected together(= 7*9 + 8)(= 7*9 + 8)

- 13 -

Bluetooth ProfileBluetooth Profile Profiles provide a vertical slice through the protocol stackProfiles provide a vertical slice through the protocol stack

- Each profile defines mandatory and optional features of each protocol- Each profile defines mandatory and optional features of each protocol One profile defined per usage modelOne profile defined per usage model Profiles are the basis for interoperability and logo requirementsProfiles are the basis for interoperability and logo requirements Each Bluetooth device supports one or more profileEach Bluetooth device supports one or more profile

Profiles

Pro

toco

lsP

roto

cols

ApplicationsApplications

- 14 -

Profiles Equipments

Headset Headset

Intercom Handset, CT Phone

Dial-up Networking Modem

FAX FAX

LAN Access Router, Gateway

File Transfer PC, Notebook

Synchronization PDA, Notebook

Intercom ImageIntercom Image

VOICE

MobilePhone

MobilePhone

Bluetooth ProfileBluetooth Profile

Dialup Networking ImageDialup Networking Image

DATA

DATA

MobilePhone

Modem

Bluetooth ProfileBluetooth Profile

Object Push Handset, PC

Cordless Telephone Handset, CT Phone

Generic OBEX ProfileGeneric OBEX ProfileSerial Port ProfileSerial Port ProfileSDP (Service Discovery Profile)SDP (Service Discovery Profile)GAP (Generic Access Profile)GAP (Generic Access Profile)

- 15 -

Qualification Program(Bluetooth Identity)

Qualification Program(Bluetooth Identity)

Regulatory Type Approval (License to sell)

Regulatory Type Approval (License to sell)

Bluetooth QualificationBluetooth QualificationGoal : To ensure interoperability between different Bluetooth devices even from differ

ent vendors

BQTF

BQBManufacturer

BQA

Product tested

Declaration and documentation

review

Qualified products lists

Documents pulled from web side

Test report checked by BQB

Qualification Program Documents

RF

EMC

SAR

RF

EMC

SAR

USAUSA

EUROPEEUROPE

ETS 300328

ETS 300826

ES 59005

ETS 300328

ETS 300826

ES 59005

Deliverry

: 5 Week

Cost :

: USD 15k

Deliverry

: 5 Week

Cost :

: USD 15k

FCC Part 15

FCC Part 15

FCC Part 2

FCC Part 15

FCC Part 15

FCC Part 2

Delivery

: 6 Week

Cost

: USD 10k

Delivery

: 6 Week

Cost

: USD 10k

RF

EMC

SAR

RF

EMC

SAR

- 16 -

DATE: 5 - 9th November 2000 (Sunday - Thursday).DATE: 5 - 9th November 2000 (Sunday - Thursday).

LOCATION: Bellevue, Washington, U.S.ALOCATION: Bellevue, Washington, U.S.A (located near Seattle on the North West coast of the USA. Hosted by (located near Seattle on the North West coast of the USA. Hosted by Microsoft). Microsoft).

WHO IS INVITED?WHO IS INVITED? Engineers who meet ALL of the following criteria: Engineers who meet ALL of the following criteria: - Are developing Bluetooth components, firmware or software - Are developing Bluetooth components, firmware or software - Have a unique implementation - Have a unique implementation - Are able to fix problems with the portion of the product that they are testing - Are able to fix problems with the portion of the product that they are testing - Are members of the Bluetooth SIG - Are members of the Bluetooth SIG

THOSE **NOT** INVITED:THOSE **NOT** INVITED: - System integrators who are bringing third party products for evaluation - System integrators who are bringing third party products for evaluation - Marketing Staff - Marketing Staff - Observers, Press, Sales Representatives, Students - Observers, Press, Sales Representatives, Students

HOW WILL TESTING BE CONDUCTEDHOW WILL TESTING BE CONDUCTED - Category-1 (RF, BB, LM), - Category-1 (RF, BB, LM), - Category-2 (L2CAP, SDP, RFCOMM, TCS)- Category-2 (L2CAP, SDP, RFCOMM, TCS) - Category-3 (Application profiles). - Category-3 (Application profiles).

UnPlugFest-4

- 17 -

SD Client

LC Driver Timer Driver

HCI - Host Driver

IRQ Driver

L2CAP

RFCOMM

PPP

UDP TCP

ATCommands

vCard/vCal

SD Server TCS BIN

HCI

IP

WAE

Baseband w/ Link Controller ASIC

Bluetooth RF Module

Audio

HCI Transport/Drivers

HCI Transport/Drivers

Host Controller

Link Manager

OBEX WAP

USB Serial PCMCIA

USB Serial PCMCIA

RTOS

Flash Driver

Flash Loader

SSI

SCM DBM

Virt

ual O

S L

ayer

Bluetooth SoftwareBluetooth SoftwareA

pplic

atio

nS

oftw

are

Bas

eban

dF

irmw

are

Future ofFuture ofBluetooth Bluetooth

- 19 -

BluetoothBluetooth HomeRFHomeRF IEEE 802.11IEEE 802.11

Major CompanyMajor CompanyEricsson, Intel, IBMEricsson, Intel, IBM

Nokia, ToshibaNokia, ToshibaMicrosoft, Intel, IBMMicrosoft, Intel, IBM

HP, CompactHP, CompactHarris,3COM,Lucent SyHarris,3COM,Lucent Symbol, Aironet,mbol, Aironet,

StandardStandard

StatusStatus SIG 1.0bSIG 1.0b SWAP 1.11 (‘99.6)SWAP 1.11 (‘99.6) IEEE 802.11 Rev D10IEEE 802.11 Rev D10

TechnologyTechnology

PowerPower

Symbol RateSymbol Rate

RangeRange

TopologyTopology

SecuritySecurity

RF 2.4GHz, FHSSRF 2.4GHz, FHSS RF 2.4GHz, FHSSRF 2.4GHz, FHSSRF 2.4GHzRF 2.4GHz

FHSS, DSSS, irDAFHSS, DSSS, irDA0 ~ 20 dBm0 ~ 20 dBm

(1mW ~ 100mW)(1mW ~ 100mW)< 20 dBm < 20 dBm (100mW)(100mW)

1MS/s1MS/s 0.8/1.6 MS/s0.8/1.6 MS/s 11MS/s11MS/s10 m10 m100m(Optional)100m(Optional) 50/100 m50/100 m 30 m30 m

8 (Piconet),Ponit-to-Multi8 (Piconet),Ponit-to-Multi

AuthenticationAuthenticationEncryptionEncryption OptionalOptional Optional, WEPOptional, WEP

< 20 dBm< 20 dBm(100mW)(100mW)

128128CSMACSMA

128128CSMACSMA

Freq HOPFreq HOP 79ch, 1600 hop/sec79ch, 1600 hop/sec 79ch, 50 hop/sec79ch, 50 hop/sec 79ch, 2.5hop/sec79ch, 2.5hop/sec

ApplicationApplicationMobile PhoneMobile Phone

Mobil ComputerMobil Computer Home WLANHome WLAN WLANWLAN

MAC ProtocolMAC ProtocolLink ManagementLink ManagementL2CAPL2CAP

EthernetEthernet EthernetEthernet

VoiceVoice 3Ch, 64kb/ch3Ch, 64kb/chCVSD, Log PCMCVSD, Log PCM

DECTDECT6Ch, 32Kbps ADPCM6Ch, 32Kbps ADPCM XX

ModulationModulation 2GFSK2GFSK2GFSK2GFSK4GFSK4GFSK

FHSS(2GFSK,4GFSK)FHSS(2GFSK,4GFSK)DSSS(DBPSK,DQPSK)DSSS(DBPSK,DQPSK)

Time to MarketTime to Market Q3, 2000Q3, 2000 ?? On MarketOn Market

Comparsion with Other Spec.Comparsion with Other Spec.

- 20 -

IEEE 802.15 WPANIEEE 802.15 WPAN Task Group 1 (TG1)Task Group 1 (TG1)

- Bluetooth - IEEE Standards making efforts- Bluetooth - IEEE Standards making efforts- To publish an approved standard early next year- To publish an approved standard early next year

Task Group 2 (TG2)Task Group 2 (TG2)- Coexistence between 802.11 and 802.15 Wireless Network- Coexistence between 802.11 and 802.15 Wireless Network- Target Completion Date : Mar 2001- Target Completion Date : Mar 2001

Task Group 3 (TG3)Task Group 3 (TG3)- High Rate Study Group (>20Mbps) - High Rate Study Group (>20Mbps) - Target Completion Date : Nov 2001- Target Completion Date : Nov 2001

MC (Marketing Committee)MC (Marketing Committee)

R2SG (Radio 2 Study Group)R2SG (Radio 2 Study Group)

LRSG (WPAN Low Rate Study Group) LRSG (WPAN Low Rate Study Group)

- 21 -

Bluetooth Spec 2.0 (Radio 2)Bluetooth Spec 2.0 (Radio 2) Improved Mode : 2MbpsImproved Mode : 2Mbps

Higher Rate Mode : 10MbpsHigher Rate Mode : 10Mbps

Fully backward interoperable with Bluetooth Specification 1.0Fully backward interoperable with Bluetooth Specification 1.0

To meet cost/power requirements, SIG did not want larger bandwidth applicationTo meet cost/power requirements, SIG did not want larger bandwidth application

Conflict with IEEE 802.15.3 (TG3)Conflict with IEEE 802.15.3 (TG3)

BluetoothBluetooth

802.15802.15

Radio 1Radio 1

2.4G, 1Mbps2.4G, 1Mbps

2.4G, 1Mbps2.4G, 1Mbps

Radio 2Radio 2

2.4G, 2~10Mbps2.4G, 2~10Mbps

2.4G, 20Mbps2.4G, 20Mbps

Radio 3Radio 3

5G(?), 20Mbps5G(?), 20Mbps

- 22 -

Developed by Philips, Sony, Toshiba, Ericsson and NokiaDeveloped by Philips, Sony, Toshiba, Ericsson and Nokia

Classes:Classes: Sound distribution: high quality audio to headphones and speaker setsSound distribution: high quality audio to headphones and speaker sets Surround distribution: wireless surround sound systemsSurround distribution: wireless surround sound systems Video distribution: observation camera, video projectorVideo distribution: observation camera, video projector Video conferencing: 3Video conferencing: 3rdrd generation mobile phones generation mobile phones Audio/video control: control signalsAudio/video control: control signals

Key aspects: Quality of service and choice of right codecsKey aspects: Quality of service and choice of right codecs

Audio Compression : MP3Audio Compression : MP3

Video Compression : MPEG4Video Compression : MPEG4

MPEG1(1.5Mbps) & MPEG2(>5Mbps) will realize in ver2.0 or higherMPEG1(1.5Mbps) & MPEG2(>5Mbps) will realize in ver2.0 or higher

A/V Profile W/G

- 23 -

Accessing the CarAccessing the Car Authorize for Car AccessAuthorize for Car Access Personalized SettingPersonalized Setting Authorize car embedded equipmentAuthorize car embedded equipment Authorize for ServiceAuthorize for Service

Vehicle Area LAN ExtensionVehicle Area LAN Extension

Portable Device FunctionalityPortable Device Functionality Portable Smart CardPortable Smart Card Portable PhonebookPortable Phonebook Portable Voice RecognitionPortable Voice Recognition

Public Access ProfilePublic Access Profile Authorized Workshop, Gas Station, Authorized Workshop, Gas Station,

etc.etc. Anonymous AccessAnonymous Access

AutomotiveAutomotive&&

BluetoothBluetooth

Automotive W/G

- 24 -

Car Hands Free 운전중 휴대폰 사용 금지 법제화 추진 운전중 휴대폰 사용 금지 법제화 추진 ('01('01 년 입법화 예정년 입법화 예정 )) Headset, Ear PieceHeadset, Ear Piece 의 사용 여부 미결정의 사용 여부 미결정 Navigation System, A/V System Navigation System, A/V System 등에 장착 예정등에 장착 예정

BluetoothBluetoothControl UnitControl Unit

Bluetooth MobBluetooth Mobile Phoneile Phone

BluetoothBluetoothMicrophoneMicrophone

BluetoothBluetoothInterfaceInterface

Source : KenwoodSource : Kenwood

BluetoothBluetoothMarket OverviewMarket Overview

- 26 -

SiliconSiliconVendorVendorSiliconSiliconVendorVendor

ModuleModuleVendorVendorModuleModuleVendorVendor

SetSetMakerMakerSetSet

MakerMaker

S/WS/WVendorVendor

S/WS/WVendorVendor

BluetoothBluetoothQualificationQualificationBluetoothBluetoothQualificationQualification

NitchNitchMarketMarketNitchNitch

MarketMarket

PhilipsPhilipsInfineonInfineonCSRCSRATMELATMEL

EricssonEricssonALPSALPSLucentLucentMACOMACO

SSLSSLS3S3

IVTIVTExtended SystemExtended System

Salutation Con.Salutation Con.CetecomCetecom7Layer7LayerTUVTUV

Modile PhoneModile PhonePC MakerPC MakerConsumerConsumeretc...etc...

????

Bluetooth Business Model

BluetoothS/W Stack

Ver 1.0

Open, Global MarketOpen, Global Market Over 2,000 Company Participate in Bluetooth BusinessOver 2,000 Company Participate in Bluetooth Business

- 27 -

Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000

FAXFAX

Notebooks,Notebooks,HHPCsHHPCs

DesktopDesktopPCsPCs

Palm Palm ComputersComputers

VideoVideoProjectorsProjectors

HomeHomeNetworkingNetworking

AutomotiveAutomotiveCellularCellular

PhotoPhotoPrintersPrinters

Set TopSet TopBoxesBoxes

Cellular/PCSCellular/PCS

HeadsetsHeadsets

CordlessCordlessPhonesPhones

PBXPBX

PrintersPrinters

OfficeOfficeNetworksNetworks

DigitalDigitalCamerasCameras

Potential Bluetooth MarketsPotential Bluetooth Markets

- 28 -

PhonePhonePhonePhone

20032003200220022001200120002000

DongleType

BT Module을 내장

Baseband 기능을 Host Chip 에 내장하고 RF 부분만 Module 화

• 핸즈프리핸즈프리• 명함 교환명함 교환

• 데이터 교환데이터 교환• 3 in 1 Phone3 in 1 Phone

• 리모콘리모콘• 전자상거래전자상거래

NotebookNotebookPDAPDA

NotebookNotebookPDAPDA

USB DonglePCMCIA Card

본체내 Module 내장

• 인터넷연결인터넷연결• 화일교환화일교환

• WLANWLAN• 주소록교환주소록교환

• 주변기기연결주변기기연결 (Printer,(Printer, 카메라등카메라등 ))

Desktop-Desktop-PCPC

Desktop-Desktop-PCPC

PC CardUSB Adapter

본체내 Module 내장

• WLANWLAN• 주소록 교환주소록 교환

• 주변기기연결주변기기연결 (Printer(Printer 등등 ,,카메라카메라 ))

• 주변기기연결주변기기연결 (( 마우스마우스 ,, 키보드키보드등등 ))

AccessaryAccessary&&

Etc.Etc.

AccessaryAccessary&&

Etc.Etc.

휴대폰전용 H/F

차량용 /PC 용H/F

가정용H/F

PSTN GatewayLAN Access Point

마우스키보드

CNS,A/VREKES

가전 , 게임기장남감

BT 적용

RF 적용

Bluetooth Product TrendBluetooth Product Trend

- 29 -

0

200

400

600

800

1000

1200

1400

1999 2000 2001 2002 2003 2004 2005

Industrial & MedicalAutomotiveOther/MiscOutput EquipmentDigital Still CameraComputingCommunications

Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000

Bluetooth Worldwide Market Growth Europe and Japanese Markets take off faster than in North America.Europe and Japanese Markets take off faster than in North America. Total 1,375Million Unit in 2005Total 1,375Million Unit in 2005

0.060.06 2.492.4930.630.6

166.7166.7

442.4442.4

811.0811.0

1,3751,375

Million UnitMillion Unit

- 30 -

MobileMobilePhonesPhones45.6%45.6%

PC Cards &PC Cards &AdaptersAdapters

32.9%32.9%

Printer &Printer &FaxFax

7.0%7.0%

Desktop PCsDesktop PCs6.4%6.4%

Notebook PCsNotebook PCs3.4%3.4%

CordlessCordlessPhonesPhones2.6%2.6%

OtherOther2.1%2.1%

2001 = 31M 2001 = 31M UnitsUnits

MobileMobilePhonesPhones73.2%73.2%

Desktop PCsDesktop PCs5.9%5.9%

HeadsetsHeadsets4.6%4.6%

Printer & FaxPrinter & Fax4.1%4.1%

Notebook PCsNotebook PCs3.8%3.8%

PC Cards &PC Cards &AdaptersAdapters

3.6%3.6%

OtherOther4.9%4.9%

2005 = 1,375M Units2005 = 1,375M Units

Top 6 Bluetooth Application Digital Mobile Phone's Bluetooth Market grows from 45.6% to 73.2%Digital Mobile Phone's Bluetooth Market grows from 45.6% to 73.2% As more products integrate Bluetooth, the percentage of PC Cards/Adapters will As more products integrate Bluetooth, the percentage of PC Cards/Adapters will

shrink.shrink.

Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000

- 31 -

Semiconductor Revenue vs. ASP Total 6 year CAGR of 256% in revenueTotal 6 year CAGR of 256% in revenue 29% decline in average sales price, from 1999 to 200529% decline in average sales price, from 1999 to 2005

0

1,000

2,000

3,000

4,000

5,000

6,000

1999 2000 2001 2002 2003 2004 2005

0

5

10

15

20

25

30

Revenue

ASP

Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000

Million US$Million US$ US$US$

- 32 -

Bluetooth Equipment Maker 3Com - Bluetooth Modem Card for Notebook PCs3Com - Bluetooth Modem Card for Notebook PCs Acer NeWeb - licensed WIDCOMM's dongle, PCMCIA, CFAcer NeWeb - licensed WIDCOMM's dongle, PCMCIA, CF Alcatel - OneTouch 500, 700 GSM PhoneAlcatel - OneTouch 500, 700 GSM Phone Axis Communications - Access PointAxis Communications - Access Point Compaq - Psion's PC Cards, USB DongleCompaq - Psion's PC Cards, USB Dongle Dell - Psion's PC Cards, USB DongleDell - Psion's PC Cards, USB Dongle Motorola/Digianswer A/S - PCMCIA, USB Adapter, Car-KitMotorola/Digianswer A/S - PCMCIA, USB Adapter, Car-Kit Ericsson - T36 GSM Phone, HeadsetEricsson - T36 GSM Phone, Headset Handspring - Acer Nweb's ProductHandspring - Acer Nweb's Product IBM - Motorola and TDK's PC CardIBM - Motorola and TDK's PC Card Socket Communication - CompactFlash CardSocket Communication - CompactFlash Card TDK - PC Cards, USB Adapter, CF, LAN Access PointTDK - PC Cards, USB Adapter, CF, LAN Access Point Toshiba - Note Book PCsToshiba - Note Book PCs Xircom - PC Cards, USB Dongle, CFXircom - PC Cards, USB Dongle, CF

MotorolaMotorola AxisAxis IBMIBM WidcommWidcomm

TDKTDK

BluetoothBluetoothChipset & ModuleChipset & Module

TrendTrend

- 34 -

Voicein/out

PowerMgmt

PowerMgmt

PLLClocksPLL

ClocksRF

InterfaceRF

Interface

TransmitBuffer

TransmitBuffer

1/3, 2/3FEC

1/3, 2/3FEC

DataWhitening

DataWhitening

CVSD/PCM

CVSD/PCM

ClockRecovery

ClockRecovery

1/3, 2/3FEC

1/3, 2/3FEC

OffsetCanceller

OffsetCanceller

ReceiveBuffer

ReceiveBuffer

SlidingCorrelator

SlidingCorrelator

LinkController

LinkController

UARTUART

PCMPCM ROMROM

A/D(RSSI)A/D

(RSSI)

VCO

PD N/APre-

scaler

2

PLL andcontrol logic

PLL andcontrol logic

DemodDemod

S & HS & H

PowerManagement

PowerManagement

Low IFReceiver

LNA

Datain/out

BB ChipRF Chip

RF Module

Bluetooth Module & Components

AntennaAntennaBand Pass FilterBand Pass Filter

RF SwitchRF Switch

CrystalCrystal

Substrate (FR-4)Substrate (FR-4)

BalunBalunRF ShieldRF Shield

RegulatorRegulator

RF ChipRF Chip

BB ChipBB Chip

Flash MemoryFlash MemorySubstrate (LTCC)Substrate (LTCC)

Radio ModuleRadio Module Bluetooth ModuleBluetooth Module

- 35 -

Radio IC BiCMOS Technology - Low Power ConsumptionBiCMOS Technology - Low Power Consumption Low IF or Direct ConversionLow IF or Direct Conversion Qualcomm MSM InterfaceQualcomm MSM Interface BlueRF InterfaceBlueRF Interface VendorVendor

Philips (UAA3558, BiCMOS)Philips (UAA3558, BiCMOS)Conexant/Philsar (PH2401, SiGe-BiCMOS)Conexant/Philsar (PH2401, SiGe-BiCMOS)Siliconwave (SiW015, SOI BiCMOS)Siliconwave (SiW015, SOI BiCMOS)Broadcomm/Innovent (NVT1003, CMOS)Broadcomm/Innovent (NVT1003, CMOS)Infineon (PMB6615, BiCMOS)Infineon (PMB6615, BiCMOS)Lucent (W7020, BiCMOS)Lucent (W7020, BiCMOS)National Semiconductor (LMX3162, BiCMOS)National Semiconductor (LMX3162, BiCMOS)OKI (ML7050LA, CMOS)OKI (ML7050LA, CMOS)Atmel/TEMIC (T2901, SiGe-BiCMOS)Atmel/TEMIC (T2901, SiGe-BiCMOS)

PackagePackageTSSOP-38, BGA-48, TQFP-48 TSSOP-38, BGA-48, TQFP-48

- 36 -

CPU Core16~32bit RISC

INTERRUPTCONTROLLER

DEBUG I/F

PORT

ROM

RAM

SYSTEMCONTROLLER UART I/F

USB I/F

PCM I/F

TIMERWATCHDOG

LINK CONTROLLER

CVSD

ADC & DAC

RF I/F

XTAL

Amp & SPK

-Phone

POWERMANAGEMENT

VOLTAGEREGULATOR

EEPROMor

FLASH

RFMODULE

HOSTI/F

Baseband Structure

- 37 -

Baseband IC Processing Power - 3 to 4 MIPSProcessing Power - 3 to 4 MIPS ARM7 Core - Ericsson & Philips, Nokia, Xircom, 3Com, Lucent, AtmelARM7 Core - Ericsson & Philips, Nokia, Xircom, 3Com, Lucent, Atmel

Mitel Semiconductor, Conexant/Philsar, Alcatel MicroelectronicsMitel Semiconductor, Conexant/Philsar, Alcatel Microelectronics Other Baseband CoreOther Baseband Core

CSR : 16bit RISCCSR : 16bit RISCBroadcom(Innovent) : 8051Broadcom(Innovent) : 8051Hitachi : H8Hitachi : H8National : CR16National : CR16Digianswer : DSPDigianswer : DSP

External Flash Memory for Firmware (2Mbits to 4Mbits)- To reduce riskExternal Flash Memory for Firmware (2Mbits to 4Mbits)- To reduce riskSpecification is not fixed!Specification is not fixed!

CMOS Technology - One ChipCMOS Technology - One Chip Package - BGA-96, TQFP-100/144, FPBGA-96Package - BGA-96, TQFP-100/144, FPBGA-96 Include Voice Codec Include Voice Codec Full 3 SCO SupportFull 3 SCO Support

- 38 -

RADIO ONLYRADIO ONLY

Portable phones! Phones contain powerful processors and memory capable of providing baseband and control functions

A cost-effective solution is often to provide a module containing only the radio function

RADIO + BASEBANDRADIO + BASEBAND

….if phone processor does not have excess capacity to support Bluetooth TX data formatting and RX synchronization.

RADIO + BASEBAND + MICROCONTROLLER + MEMORYRADIO + BASEBAND + MICROCONTROLLER + MEMORY

For retrofit upgrade and unhosted applications - headsets, PC cards

Appropriate to include crystal and voltage regulation also

Types of Bluetooth Module

- 39 -

BasebandFlash

Memory

RF

Rx

Tx

Ballun

Ballun

SWBPF

VCO

X-tal

Regulator

PA

Low IF, Direct Conversion Low IF, Direct Conversion 기술 적용기술 적용SiGe-BiCMOS SiGe-BiCMOS 기술기술 -- 저전력화저전력화

Firmware Firmware 안정화에 의한안정화에 의한BasebandBaseband 내 내장내 내장

CODEC, MP3 CODEC, MP3 기능 내장기능 내장다양한 다양한 Embedded Embedded SolutionSolution

Host Host 부분과의 최대한 부분과의 최대한 공용화로 원가 절감공용화로 원가 절감

PCBPCB 내층에 내층에 PatternPattern 으로으로설계설계

BPF 2BPF 2 개 사용으로 개 사용으로 SW SW 삭제삭제

다양한 형태의 다양한 형태의 AntennaAntennaSolutionSolution 등장등장

InterfaceInterface 의 표준화의 표준화(BlueRF)(BlueRF)

Bluetooth Module Trend

- 40 -

Ericsson ComponentsEricsson ComponentsFull Module/RF ModuleFull Module/RF Module(PCB Substrate & LTCC)(PCB Substrate & LTCC)

LucentLucent PhilipsPhilips 출하중출하중'00/10 ~ 100'00/10 ~ 100 만개만개 // 월월

LucentLucentRF ModuleRF Module(LTCC)(LTCC)

LucentLucent --출하중출하중Ericsson Ericsson 대응대응

MACOMACO(( 마쯔시다전자부품마쯔시다전자부품 ))

Full Module/RF ModuleFull Module/RF Module(ALIVH Substrate)(ALIVH Substrate)

PhilsarPhilsar MitelMitel'00/6 Sample'00/6 Sample'01/Q1 '01/Q1 양산양산

ALPSALPS 전기전기 Full ModuleFull Module(PCB)(PCB)

CSRCSR CSRCSR'00/5 Sample'00/5 Sample'00/12 '00/12 양산양산

Taiyo YudenTaiyo YudenFull ModuleFull Module(?)(?)

Silicon Silicon WaveWave

HitachiHitachi '00/Q3 Sample'00/Q3 Sample

Murata Murata 제작소제작소 RF ModuleRF Module(LTCC)(LTCC)

LucentLucent등등 -- 출하중출하중

AtmelAtmelFull ModuleFull Module(PCB)(PCB)

TemicTemic AtmelAtmel 20002000 년내 양산년내 양산

AlcatelAlcatelFull ModuleFull Module(LTCC)(LTCC) 자사 자사 (One Chip)(One Chip) '01/Q1 '01/Q1 양산양산

JTDCJTDCFull ModuleFull Module(PCB)(PCB)

PhilsarPhilsar MitelMitel ??

미쯔미전기미쯔미전기 Full Module/RF ModuleFull Module/RF Module CSRCSR '01/Q1 '01/Q1 양산양산CSRCSR

Maker Module& PCB Type RF Chip BB Chip Status

Bluetooth Module Maker

- 41 -

10 mm 12 mm

PhilipsPhilipsEricssonEricsson MurataMurata

Radio Module

14mm

10.2

mm

Substrate : LTCC (Low Temperature Co-Substrate : LTCC (Low Temperature Co-Fired Ceramic)Fired Ceramic)

Flip-Chip, Wire BondedFlip-Chip, Wire Bonded BGA PackagingBGA Packaging Target Application : Mobile Phone, Full Target Application : Mobile Phone, Full

ModuleModule

(6mm x (6mm x

8mm)8mm)

- 42 -

BlueRFTM

Standard Interface for RF and BasebandStandard Interface for RF and Baseband BenefitsBenefits

- SoC designers need not to have expertise in RF design- SoC designers need not to have expertise in RF design- SoC vendors will have confidence there will be multiple RF parts- SoC vendors will have confidence there will be multiple RF parts- RF designers will have one design for multiple SoC applications- RF designers will have one design for multiple SoC applications

Receive Path - RxMode1,2,3Receive Path - RxMode1,2,3 Transmit Path - One ConfigurationTransmit Path - One Configuration Control Register Interface - JTAG, DBusControl Register Interface - JTAG, DBus Contact to bluerf@arm.com to get the specificationContact to bluerf@arm.com to get the specification

- 43 -

http://www.opengroup.org/bluetoothhttp://www.opengroup.org/bluetooth

http://www.palowireless.com/bluetoothhttp://www.palowireless.com/bluetooth

http://developer.axis.comhttp://developer.axis.com

http://ne.nikkeibp.co.jp/IEEE1394/bluetoothtop_.htmlhttp://ne.nikkeibp.co.jp/IEEE1394/bluetoothtop_.html

http://grouper.ieee.org/groups/802/15/index.htmlhttp://grouper.ieee.org/groups/802/15/index.html

http://new.topsitelists.com/bestsites/bluetooth/topsites.htmlhttp://new.topsitelists.com/bestsites/bluetooth/topsites.html

http://www.egroups.com/group/bluetoothhttp://www.egroups.com/group/bluetooth

http://www.egroups.com/group/bluetooth-koreahttp://www.egroups.com/group/bluetooth-korea

http://www.bluetooth.or.krhttp://www.bluetooth.or.kr

Useful Web-Site for Bluetooth

- 44 -

Conclusion / Q&A

Who will be win in Bluetooth Business?Who will be win in Bluetooth Business?

Mobile Phone Air Time LossMobile Phone Air Time Loss- 3-in-1 Phone, WAP Kiosk etc.- 3-in-1 Phone, WAP Kiosk etc.

Real Royalty Free Technology?Real Royalty Free Technology?

Thanks for Listening!Thanks for Listening!

All presentation material will be hosted inAll presentation material will be hosted inmy personal Homepagemy personal Homepage

http://carpc.co.krhttp://carpc.co.kr