bulk micromachining of silicon for mems mustafa g. guvench, ph.d. university of southern maine
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![Page 1: Bulk Micromachining of Silicon for MEMS Mustafa G. Guvench, Ph.D. University of Southern Maine](https://reader033.vdocuments.net/reader033/viewer/2022051116/56649d575503460f94a36a1a/html5/thumbnails/1.jpg)
Bulk Micromachining Bulk Micromachining of of
Silicon for MEMSSilicon for MEMS
Mustafa G. Guvench, Ph.D.Mustafa G. Guvench, Ph.D.
University of Southern MaineUniversity of Southern Maine
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Single Crystal Silicon for MEMS
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Mechanical Material
SILICON?
Stiff => Stiff => Thinning is required for appreciable strainThinning is required for appreciable strain
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Single Crystal Silicon for MEMS
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Single Crystal Silicon for MEMS
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Structure of Single Crystal Silicon
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Miller Indices for Single Crystal Silicon
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Miller Indices for Single Crystal Silicon
SCS has SCS has anisotropic anisotropic properties:properties:
Electrical, Electrical, Thermal, Thermal, Mechanical, Mechanical, ChemicalChemical
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ETCHING for BULK MICROMACHINING(Isotropic/Anisotropic)
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ETCHING for BULK MICROMACHINING(Isotropic/Anisotropic)
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ETCHING for BULK MICROMACHINING(Cavity/Cantilever Anisotropic)
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DRY (Plasma) ETCHING
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Deep Reactive Ion Etch (DRIE)
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Single Crystal Silicon for MEMS
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Single Crystal Silicon for MEMS
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Single Crystal Silicon for MEMS
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What is MICRO-MACHINING?
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What can Micromachined Parts/Systems do for us?
Be a Conduit to Microscopic Domain:
1. Sensing (Information)2. Information Processing 3. Communication4. Manipulation (Actuation and Control)
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Why / Why not
SILICON?
Semiconductor: Semiconductor: Active Devices + SensorsActive Devices + Sensors(Photo-Magneto-Strain Sensing)(Photo-Magneto-Strain Sensing)
Insulator:Insulator: SiOSiO22 , Si , Si33NN44 , Glass , Glass
Thin Film Conductor:Thin Film Conductor: Aluminum, Gold, SilicidesAluminum, Gold, Silicides
PhotoLithography:PhotoLithography: Planar control (+ & -)Planar control (+ & -)
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Mechanical Material
SILICON?
Stiff => Stiff => Thinning is required for appreciable strainThinning is required for appreciable strain
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Micromachining of
SILICON?
MICROMACHINING of SILICON => MICROMACHINING of SILICON => (a) (a) BULK (substrate)BULK (substrate)(b) (b) SURFACE (films)SURFACE (films)
Additive Processes: Additive Processes: Chemical and Physical DepositionChemical and Physical Deposition(Thin Layers only) (Single/Poly)(Thin Layers only) (Single/Poly)
Removal Processes:Removal Processes: Chemical and Physical EtchingChemical and Physical Etching(Wet/Dry/Plasma/Inert/Reactive)(Wet/Dry/Plasma/Inert/Reactive)
(Bulk/Film) (Anisotropic/Isotropic)(Bulk/Film) (Anisotropic/Isotropic)
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BULK MICROMACHINING(Etchants: Isotropic/Anisotropic)
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BULK MICROMACHINED(Silicon Capillary for Insulin Infuser)
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BULK MICROMACHINED(Silicon Capillary for Insulin Infuser)
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BULK MICROMACHINED(Silicon Capillary for Insulin Infuser)
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BULK MICROMACHINED(Silicon Mask for Cylindrical Micromotion Sensor)
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BULK MICROMACHINED(Series Connected Photovoltaic Converter Battery)
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BULK MICROMACHINED(Series Connected Photovoltaic Converter Battery)
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BULK MICROMACHINED(Series Connected Photovoltaic Converter Battery)
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MOTION? HANDLING? ASSEMBLY?COUPLING? =>
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MicroElectroMechanicalSytems
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M (CMOS-IC Technology) + E (CMOS-IC Technology) +
M (Silicon and Sacrificial Layers) +
O (Aluminum) +
S (IC Packaging Technology)
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Three-Layer Poly-Silicon Surface Micromachining Process
(to build Mechanical Parts on CMOS IC)
Final cross sectional view with 7 layersFinal cross sectional view with 7 layers
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Three-Layer Poly-Silicon Surface Micromachining Process
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Surface Micromachined
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Micromachining of Projection Camera
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M (CMOS-IC Technology) + E (CMOS-IC Technology) +
M (Silicon and Sacrificial Layers) +
O (Aluminum) +
S (IC Packaging Technology)
M.G.GuvenchM.G.Guvench
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Surface Micromachined Silicon SensorsSurface Micromachined Silicon Sensors
M.G.GuvenchM.G.Guvench
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Surface Micromachined Silicon SensorsSurface Micromachined Silicon Sensors
M.G.GuvenchM.G.Guvench
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Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
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Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
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Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
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Mass (Absorption/Deposition) SensorMass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench
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Mass (Absorption/Deposition) SensorMass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench
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Mass (Absorption/Deposition) SensorMass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench
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Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
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Flow Skin Friction SensorsFlow Skin Friction Sensors
M.G.GuvenchM.G.Guvench
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Flow Skin Friction SensorsFlow Skin Friction Sensors
M.G.GuvenchM.G.Guvench
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CMOS Analog Chip Design (Operational Amplifier)CMOS Analog Chip Design (Operational Amplifier)
M.G.GuvenchM.G.Guvench
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MicroFab Laboratory
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Programmable Diffusion/Oxidation System’s Programmable Diffusion/Oxidation System’s Controller in The MicroFab LaboratoryController in The MicroFab Laboratory
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Double-Diffused PDouble-Diffused P++NNNN++ Junction PhotoDiode Junction PhotoDiode Made Being Tested in The MicroFabrication Lab.Made Being Tested in The MicroFabrication Lab.
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MicroFab Laboratory
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Surface Micromachined Silicon SensorsSurface Micromachined Silicon Sensors
M.G.GuvenchM.G.Guvench
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3-Poly Surface Micromachining ProcessedSensors
Cross SectionCross Section
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MEMS Switch
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MEMS MicromotorMEMS Micromotor
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A Mass (Absorption/Deposition) SensorA Mass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench
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