cdcm6208 evaluation board - tij.co.jpcml, hcsl, or lvcmos, from one of two inputs that can feature a...

User's GuideSCAU049A–May 2012–Revised January 2013

CDCM6208 Evaluation Board

Contents1 Features ...................................................................................................................... 22 General Description ......................................................................................................... 33 Signal Path and Control .................................................................................................... 44 Software-Selectable Option ................................................................................................ 45 Installing the EVM Control Software and USB Driver .................................................................. 4

5.1 CDCM6208 Control User Interface .............................................................................. 46 Using the EVM Control Software ......................................................................................... 5

6.1 Primary and Secondary Reference Signal Type Selection ................................................... 56.2 Input Divider For Primary Reference ®) Selection ............................................................ 56.3 Input MUX Selection ............................................................................................... 66.4 Input Divider (M) For the PLL Selection ........................................................................ 66.5 Charge Pump Current Selection ................................................................................. 66.6 Loop Filter (3rd Pole only) Selection .............................................................................. 66.7 Feedback Divider Selection ....................................................................................... 66.8 Prescalar Dividers (PS_A and PS_B) Selection ............................................................... 66.9 VCO Frequency Selection ........................................................................................ 66.10 Output MUX Selection ............................................................................................. 66.11 Output Dividers ..................................................................................................... 66.12 Output Signal Type Selection .................................................................................... 76.13 Additional Features ................................................................................................ 7

7 Configuring the Board ...................................................................................................... 77.1 Selecting the Interface Connection .............................................................................. 77.2 Configuring the Power Supply .................................................................................... 77.3 Configuring the Reference Inputs ................................................................................ 87.4 Configuring the Control Pins ...................................................................................... 97.5 Selecting the Loop Filter ......................................................................................... 107.6 Configuring the Outputs ......................................................................................... 107.7 Using the MSP430 as a Bootloader ............................................................................ 10

8 A Step by Step Guide on Updating the TUSB3210 Firmware for I2C communication on the CDCM6208EVM ......................................................................................................................... 118.1 Required Software and Hardware .............................................................................. 118.2 Installing TI USB EEPROM Burner Software ................................................................. 118.3 Programming the CDCM6208 EVM’s TUSB3210 ............................................................ 11

9 CDCM6208V2 EVM Board Schematic ................................................................................. 14

List of Figures

1 CDCM6208 Evaluation Board ............................................................................................. 3

2 Initial GUI Screen .......................................................................................................... 5

3 Jumper Configuration For USB Power Supply .......................................................................... 8

4 EVM SW4 Location ....................................................................................................... 12

5 TUSB3210 EEPROM Burner Software ................................................................................. 13

6 CDCM6208V1/CDCM6208V2 EVM Control Modes .................................................................. 14

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1SCAU049A–May 2012–Revised January 2013 CDCM6208 Evaluation BoardSubmit Documentation Feedback

Copyright © 2012–2013, Texas Instruments Incorporated

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Features www.ti.com

7 CDCM6208V1/CDCM6208V2 EVM Device Pins and Bypassing ................................................... 15

8 CDCM6208V1/CDCM6208V2 EVM Reference Inputs ............................................................... 16

9 CDCM6208V1/CDCM6208V2 EVM Outputs 0 to 3 ................................................................... 17

10 CDCM6208V1/CDCM6208V2 EVM Outputs 4 to 7 ................................................................... 18

11 CDCM6208V1/CDCM6208V2 EVM Power Supplies ................................................................. 19

12 Onboard MSP430G2001 ................................................................................................ 20

List of Tables

1 Input Selection Jumper Settings .......................................................................................... 9

2 Mode Selection Jumper Settings ......................................................................................... 9

3 STATUS1 Functional Description ....................................................................................... 10

4 Device Control Pin Functions ............................................................................................ 10

1 Features• Easy-to-use evaluation module generating low-phase noise clocks up to 800 MHz

• Easy device programming via host-powered USB port or control pins

• Rapid configuration with provided EVM Control Software

• Powered from the USB port, or by an external 3.3-, 2.5-, or 1.8-V power supply

• Single-ended or differential input; external crystal for use with on-chip oscillator

Words shown in bold italics in this document show the same name and label on the EVM board itself.

2 CDCM6208 Evaluation Board SCAU049A–May 2012–Revised January 2013Submit Documentation Feedback


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www.ti.com General Description

Figure 1. CDCM6208 Evaluation Board

2 General Description

The CDCM6208 is a highly-versatile, low-jitter, low-power frequency synthesizer generating up to eightclock outputs, selectable between LVPECL-like high-swing CML, normal-swing CML, LVDS-like low-powerCML, HCSL, or LVCMOS, from one of two inputs that can feature a low frequency crystal or CML,LVPECL, LVDS, or LVCMOS signals. It also features an innovative fractional divider architecture for fourof its outputs generating any frequency with better than 1 ppm frequency accuracy. The device is easilyconfigured through I2C or SPI programming interfaces. In the absence of serial interface, pin-programmingmode is available and can set the device in many distinct preprogrammed configurations using controlpins. Two versions are available, (CDCM62008V1 and CDCM6208V2) depending on the VCO frequencyranges.

The CDCM6208 is programmed through an SPI or I2C interface using the supplied EVM programminggraphical user interface (GUI).



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Signal Path and Control www.ti.com

The CDCM6208 evaluation module (EVM) demonstrates the electrical performance of the device. Thisfully-assembled, factory-tested evaluation board allows complete validation of all device functions. Foroptimum performance, the board is equipped with 50-Ω SMA connectors and well-controlled 50-Ωimpedance micro strip transmission lines.

3 Signal Path and Control

The CDCM6208 provides two selectable inputs – PRI_REF and SEC_REF. The PRI_REF and SEC_REFaccept either differential- (CML, LVDS) or single-ended LVCMOS signals, up to 250 MHz. Besides theexternal clocks, SEC_REF allows the use of an external crystal in the frequency range of 10 MHz to 50MHz. The EVM provides a PC-board footprint for mounting a 3.2 mm × 2.5 mm SMD crystal. If theSEC_REF is driven through the SMA connector, the on-board crystal and R72 and R73 must be removedand R87 must be populated with a 0-Ω resistor (R89 must also be populated with a 0-Ω resistor for adifferential input signal). The device does not have any internal termination or biasing, therefore, properbiasing and termination options are available on the EVM, if needed.

The CDCM6208 provides up to eight differential signals. Out of eight outputs, four differential outputs canconvert into eight singled LVCMOS signals. A maximum of eight differential or 4 differential and eightsingled LVCMOS clocks or any of the various combinations are possible.

The device operates as a jitter cleaner or as a frequency synthesizer. The CDCM6208 requires a partially-external loop filter. The EVM provides four loop filter options – two filters are for synthesizer mode and theother two for jitter-cleaning mode. The loop-filter selection affects the phase noise and loop stability of thePLL.

In pin mode, the device option is selected by five control pins. In programming mode, options are selectedby programming the on-chip registers. The CDCM6208 data sheet provides the detailed informationneeded for configuration and use of this device.

Four outputs (Y0-Y3) are configurable as an LVDS, CML, or LVPECL and another four outputs (Y4-Y7)are configurable as LVDS, HCSL, or LVCMOS. All outputs are connected to SMA with AC coupling. Y4-Y7outputs provide the options of 50 Ω to ground (for HCSL outputs).

The LVCMOS outputs can operate at frequencies up to 200 MHz. The HS-CML and NS-CML outputsoperate at up to 800 MHz. The LP-CML and HCSL outputs operate at up to 400 MHz.

4 Software-Selectable Option

The EVM control software communicates with the CDCM6208 through a USB interface and theCDCM6208 SPI or I2C port. The USB controller is normally powered over the USB cable. When theUSB/SPI or USB/I2C programming interface is available for use, the on-board LED, D3, is illuminated.

The CDCM6208 GUI can save device configurations into a configuration file (.INI), which are loaded at alater time restoring the saved settings.

5 Installing the EVM Control Software and USB Driver

Start the EVM software installation by double-clicking on the file named CDCM6208_Installer.exe. TheMicrosoft .NET Framework 4.0 is automatically downloaded and installed on the computer, if it is notalready installed. The installer attempts installation of the EVM hardware driver.

5.1 CDCM6208 Control User Interface

The following represents the initial screen of the GUI:



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www.ti.com Using the EVM Control Software

Figure 2. Initial GUI Screen

6 Using the EVM Control Software

The graphical layout of the programming software is based on the functional structure of the CDCM6208.The following settings are changed with this tool:

• Input frequency

• Input divider

• Input type

• Input selection to the PLL

• Charge-pump current

• Internal loop filter components (3rd Pole)

• Pre-scalar and feedback divider

• Output MUX selection

• Output divider or frequency

• Output type

This software also sets input and output buffer supply voltage bits (1.8 V or 2.5/3.3 V)..

6.1 Primary and Secondary Reference Signal Type Selection

Using the pull-down menu, input clock type is selected or input buffer is disabled. The input signal type forPrimary clock and Secondary clock are set to either LVDS, CML, or LVCMOS. Additionally, crystal input isselectable for Secondary input.

6.2 Input Divider For Primary Reference ®) Selection

The primary reference has a 4-bit divider ®), therefore, up to 16 appropriate divider values are available.



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Using the EVM Control Software www.ti.com

6.3 Input MUX Selection

The CDCM6208 employs a smart MUX selecting the input clock for the PLL. The input clock is eitherprimary reference only, secondary reference only, or in automatic selection mode. Toggling the connectionline, the proper reference input is selected. If the Auto box is selected, automatic input selection mode isactivated.

6.4 Input Divider (M) For the PLL Selection

The input (M) divider is a continuous 14-b counter (1–16384) that is present after the Smart Input MUX.The output of the M divider sets the PFD frequency to the PLL and must be in the range of 8 kHz to 100MHz.

6.5 Charge Pump Current Selection

The charge-pump current value is chosen from the pull-down menu. The allowable range of the charge-pump current is from 500 µA to 4 mA.

6.6 Loop Filter (3rd Pole only) Selection

C1, R2, and C2 are external loop filter components connected to the ELF pin, but the 3rd pole of the loopfilter is internal to the device with R3 and C3 register-selectable. Appropriate C3 and R3 values areselected using the pull-down menu.

6.7 Feedback Divider Selection

The feedback divider (N) is made up of a cascaded 8-b counter divider (1–256) and a 10-b counter divider(1–1024) present on the feedback path of the PLL. If the divider value is available, the softwareautomatically selects the proper combination from the two cascaded dividers. The output of the N dividersets the PFD frequency to the PLL and must be in the range of 8 kHz to 100 MHz.

6.8 Prescalar Dividers (PS_A and PS_B) Selection

The prescaler (PS) dividers are fed by the output of the VCO and are distributed to the output dividers(PS_A to the dividers for outputs Y0, Y1, Y4, and Y5. PS_B to the dividers for outputs Y2, Y3, Y6, andY7). PS_A also completes the PLL, driving the input of the feedback divider (N). Appropriate values areset for each prescalar using the pull-down menu.

6.9 VCO Frequency Selection

The VCO frequency value depends on the selection of reference input frequency and input dividers,prescalar (PS_A), and feedback dividers. The software automatically calculates the VCO frequency, basedon the selection, and provides the value. If the calculated VCO frequency is outside of the range, it flashsred.

6.10 Output MUX Selection

Both Y4 and Y5 outputs have multiplexers which select one of the three inputs (PRI_REF, SEC_REF, orPS_A) for the outputs. The proper input is selected for the outputs by dragging the connection line.

6.11 Output Dividers

Outputs Y0 and Y1 share one 8-bit continuous integer divider and outputs Y2 and Y3 share another 8-bitcontinuous integer divider; therefore, these pairs of outputs have the same frequency. Each of the outputsY4, Y5, Y6, and Y7 have 8-bit continuous integer dividers and in addition, 20-bit fractional dividers. Thesoftware automatically chooses the right divider values for Y4–Y7 outputs from the integer and fractionaldividers, if the expected output frequency in the desired output box is provided.



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www.ti.com Configuring the Board

6.12 Output Signal Type Selection

Outputs Y0–Y3 offer LP-CML (LVDS like), CML or HS-CML (LVPECL like) signaling types. Using the pull-down menu, one of the signal types is selected for each output or can disable the output channelcompletely. Outputs Y4–Y7 offer LP-CML (LVDS like), HCSL or LVCMOS signaling types. Using the pull-down menu, one of the signal types is selected for each output or can disable the output channelcompletely. If the LVCMOS signal type is selected, check Enable boxes, enabling the outputs individually.

6.13 Additional Features

The EVM software GUI comes with tools that are helpful in optimizing the device settings for bestperformance. These include a Frequency Planning Tool, the Loop Filter Simulator, and the Phase-NoiseSimulator. Each of these tools are described in detail in the Help documentation provided in the GUI.

7 Configuring the Board

The CDCM6208 is a programmable clock driver with many options. The EVM was designed withmaximum flexibility so engineers can configure the EVM for operation at its desired mode.

7.1 Selecting the Interface Connection

The CDCM6208 is configurable via the serial interface or control pins. Both SPI and I2C interface optionsare available for configuring the device. Switch SW1 is dedicated for the SPI interface and switch SW2 isfor the I2C interface. The selected interface switch must be turned on and the other switch must be turnedoff. Both switches must be turned off for Pin control mode.

Header JMP9 also connects an external host to SPI or I2C.

7.2 Configuring the Power Supply

The device is powered up with an external power supply or on-board regulators powered by an attachedUSB cable. The EVM has options for 1.8-, 2.5-, and 3.3-V power supplies. These supply voltages areexternal to, or internal from the regulators. It has five different rails – two for outputs, one for PLL, one fordigital logic, and one for reference input power supplies.

The banana jacks (P2, P3, and P4) are external 3.3 V, 2.5 V, and 1.8 V, respectively. Banana jack P1 isfor GND. Low-dropout regulators U6, U7, and U8, generate 3.3 V, 2.5 V, and 1.8 V, respectively. Thejumper on header JP_3_10 selects between an external or internal 3.3 V, the jumper on header JP_3_11selects between an external or internal 2.5 V, and the jumper on header JP_3_12 selects between anexternal or internal 1.8 V.

The jumpers on the header JMP5 select for the DVDD power rail, JMP1 selects for the PLL power rails,JMP3 selects for the output power rails (Y2, Y3, Y6, and Y7), JPM2 selects for the output power rails (Y0,Y1, Y4, and Y5) and JPM4 selects for the reference input power rails from 3.3-, 2.5-, and 1.8-V powersupplies. Mixed power supplies for this device are possible, using these headers.

NOTE: A USB cable must be connected for biasing voltage generation of 1.2 V and 0.9 V for thereference inputs. These biasing voltages are generated by the on-board regulators which relyon the USB supply. Figure 3 shows the jumper configuration for a USB power supply. TheEVM settings drive the device from the USB with 1.8-V and 3.3-V supplies. Jumpers for theheader JP_3_10 are set to 3.3-V regulator and for JP_3_3_12 header to 1.8-V regulator.DVDD (JMP5), VDD_PLL (JMP1), VDD_IN (JMP4), and VDD_OUTB (JMP3) supplies areset to 1.8 V and VDD_OUTA (JMP2) supply is set to 3.3 V. The entire device is running at1.8 V, except the Y0, Y1, Y4, and Y5 outputs which are running at 3.3 V.



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Configuring the Board www.ti.com

Figure 3. Jumper Configuration For USB Power Supply

7.3 Configuring the Reference Inputs

The CDCM62008 offers two inputs (PRI_REF and SEC_REF). SMA J18 and J19 are dedicated forPRI_REF (IN1p and IN1n) and SMA J20 and J21 are dedicated for SEC_REF (1N2p and 1N2n). Bothinputs in the EVM are AC-coupled, by default, using coupling capacitors (C25 and C26 for PRI_REF andC29 and C30 for SEC_REF). CDCM6208 does NOT have any internal termination or biasing; so, externalbiasing is required after AC coupling. Headers JMP10 and JPM11 provide the options for PRI_REF inputbiasing and SEC_REF input biasing, respectively. Depending on the input signaling level and powersupply selection, proper biasing must be selected, see Table 1.



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www.ti.com Configuring the Board

Table 1. Input Selection Jumper Settings

Input Signaling Level Input Supply Voltage JPM10 and JPM11 Selection

CML 1.8 V/2.5 V/3.3 V DVDD

LVDS 2.5 V/3.3 V 1P2V

LVDS 1.8 V 0P9V

LVCMOS 1.8 V/2.5 V/3.3 V GND (1)

Disabled N.A. None(1) This 50 Ω to GND is only required if a signal generator is used.

R83, R84, R85, and R86 resistors (49.9 Ω) provide the termination for 50-Ω trace.

Place 0-Ω resistors in R87 and R89 and remove R72 and R73 resistors for the external clock to SEC_REFconnection.

LVCMOS inputs are single ended and only the positive pins (IN1p for PRI_REF and IN2p for SEC_REF)of the inputs are used and DC terminations are recommended. Replace C25 with a 0-Ω resistor forPRI_REF and C29 with a 0-Ω resistor for SEC_REF.

SEC_REF accepts crystal input. SEC_REF input is configured for crystal input by default and a 25-MHzcrystal is placed in Y1. C27 and C28 provide the load capacitance options for the crystal.

7.4 Configuring the Control Pins

The device has multiple dedicated pins controlling and configuring the operation. These pins must be setas instructed for correct device operation.

Power Down Pin (PDN): This pin has an internal 50-kΩ pull-up resistor. For normal operation, the PDNpin should be left open or connect the jumper (header PDN) to DVDD. For power-down mode, connect thejumper to GND.

Synchronization Pin (SYNCN): This pin has an internal 50-kΩ pull-up resistor. For normal operation, theSYNCN pin should be left open or connect the jumper (header SYNC) to DVDD. An external signal usesthis header to synchronize the outputs. In addition to the header, button SW7 toggles the SYNCN pin.

Mode Selection Pins (SI_MODE0 and SI_MODE1): These two pins select the mode of deviceconfiguration. The SI_MODE1 pin has an internal pull-up resistor and the SI_MODE0 pin has an internalpull-down resistor. The jumpers on the header, SI_MODE0 and SI_MODE1, must be set as shown inTable 2.

Table 2. Mode Selection Jumper Settings

Jumper On SI_MODE1 Header Jumper On SI_MODE0 Header Mode of Configuration

GND Open or GND SPI mode

GND DVDD I2C mode

Open or DVDD Open or GND Pin mode

Reset or Supply Control Pin (RESETN_PWR): This pin has dual functions, depending on the modeselection. This pin acts as a RESETN pin in Interface-programming mode or controls the device core andoutput supply voltage setting. Button SW6 and RESET_PWR header are dedicated for this pin. This pinhas an internal 50-kΩ pull-up resistor. In Interface-programming mode, the header (RESET_PWR) is leftopen or connects the jumper to DVDD. Connecting the jumper to GND or pressing the button (SW6) putsthe device in reset mode. In Pin mode, set the jumper to GND for a 1.8-V power supply and to DVDD for a2.5-V/3.3-V power supply.

Reference Select Pin (REF_SEL): This pin has an internal 50-kΩ pull-up resistor. Connect the headerREF_SEL to GND for PRI_REF input and leave open or connect to DVDD for SEC_REF input selection.See Table 34 in the data sheet (CDCM6208) for a detailed description.



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Configuring the Board www.ti.com

Status Pin (STATUS1/PIN0): Depending on the operation mode, this is either an input or output pin. InInterface-programming mode, this pin (header STATUS1_PIN0) provides the indication of a particularreference clock selection to the PLL or PLL lock and/or unlock or loss of references depending onRegister 3 Bit 10-12 settings. See Table 3 for a full description:

Table 3. STATUS1 Functional Description

Status Signal Signal Type Register Bit DescriptionName

SEL_REF LVCMOS R3.12 Indicates reference selected for PLL:“0” → Primary“1” → Secondary

LOSS_REF LVCMOS R3.11 Loss of reference input observed at input, Smart MUX output in observationwindow for PLL:“0” → Reference input present“1” → Loss of reference inputs

PLL_UNLOCK LVCMOS R3.10 Indicates unlock status for PLL:“0” → PLL locked“1” → PLL unlocked

In pin mode, this becomes an input pin and the header pin, STATUS1_PIN0, is controlled by PIN0 whichconnects to GND or DVDD.

Device Control Pins (SDI/SDA/PIN1, SDO/AD0/PIN2, SCS/AD1/PIN3 and SCL/PIN4): These four pinshave multiple functions depending on the device’s programming interface (SPI or I2C) and pin-controlmodes. See the data sheet (CDCM6208) for detailed descriptions and see Table 4 for jumperconnections.

Table 4. Device Control Pin Functions

Programming Header Header Header Header RemarksMode SDI_SDA_PIN1 SDO_AD0_PIN2 SCS_ADI_PIN3 SCL_PIN4

SPI Open Open Open Open Jumpers must not be connected in this mode

Open GND (1) GND (1) Open Header SDO_ADO_PIN2 and SCS_ADI_PIN3I2Cprovide the I2C address option

Pin Mode DVDD or GND DVDD or GND DVDD or GND DVDD or GND The pin selections determine the predefined device’sfunctional condition

(1) The control software assumes the default address bit settings for AD[1:0] is 00.

7.5 Selecting the Loop Filter

The CDCM6208 includes an on-chip PLL with a partially-integrated loop filter. External loop components(C1, C2 and R2) are required to complete the PLL. The external loop filter is chosen by selecting one fromthe four available options on the CDCM6208EVM using the dip switch, SW5. Depending upon the device’soperation mode, synthesizer or jitter cleaning, selecting appropriate loop filter values is critical. Two loopfilters, 1 and 2, are for synthesizer mode and the other two filters, 3 and 4, are for jitter cleaning mode. Ifdifferent RC components are required based on the customer’s PLL configuration, these componentsmust be replaced by appropriate resistor and capacitors.

7.6 Configuring the Outputs

All eight outputs are connected to SMA through AC-coupling. Output Y4-Y7 can provide HCSL clocks.These outputs have 50 Ω-to-GND (not populated) and series-resistors (0-Ω populated) options. Placing50-Ω resistors and possibly adjusting the series resistor values (up to 33 Ω) improves ringing if the outputsare configured as HCSL.

7.7 Using the MSP430 as a Bootloader

The onboard MSP430G2001 is a bootloader for the CDCM6208. A separate application note describeshow to generate, debug, and load the needed software for the MSP430.



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www.ti.com A Step by Step Guide on Updating the TUSB3210 Firmware for I2C communication on the CDCM6208 EVM

SW1 and SW2 must be in the OFF position while SW3 must be in the ON position for communication withthe MSP430 (U10) via JTAG (P12) and for communication of the MSP430 with the CDCM6208. Also notethat the MSP430 requires a minimum of 1.8 V for nominal operation. Once the program is loaded to theMSP430, resetting power to the MSP430 makes the bootloader execute again – after this occurs, theMSP430 enters a low-power mode.

8 A Step by Step Guide on Updating the TUSB3210 Firmware for I2C communicationon the CDCM6208 EVM

Older EVM revisions might require to update the TUSB3210 firmware to enable the correct I2Ccommunication between CDCM6208 and TUSB3210. The following steps explain how to update thefirmware.

8.1 Required Software and Hardware

In order to update the TUSB3210 Firmware on the CDCM6208 EVM, the following items are required:

• TI USB EEPROM Burner Utility for the TUSB2136 and TUSB3210

• PC with Windows XP

• USB Cable (Male A to Male B)

• Latest version of TUSB3210 Firmware for the CDCM6208 EVM (SLAC550)

8.2 Installing TI USB EEPROM Burner Software

The TI USB EEPROM Burner software is available on TI’s product page for the TUSB3210 for free. Thisdownload is available at the following URL. The file is located under Software & Development Toolssection.http://www.ti.com/product/tusb3210

Once the .ZIP file is successfully downloaded and extracted, setup and installation can begin by openingthe “DISK1” directory and running the “setup.exe” program. The program will prompt the user uponsuccessful installation.

8.3 Programming the CDCM6208 EVM’s TUSB3210

Step 1 – Powering Up the EVM

The TUSB3210 chip is interfaced with an external EEPROM on the EVM. To ensure propercommunication between the Burner software and the TUSB3210, turn Switch 4 (SW4) to the OFF positionbefore connecting the USB cable to the EVM. SW4 is circled below and is shown in the ON position (seeFigure 4).



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A Step by Step Guide on Updating the TUSB3210 Firmware for I2C communication on the CDCM6208 EVM www.ti.com

Figure 4. EVM SW4 Location

NOTE: Once the board is powered up, turn SW4 back to the ON position to enable communicationbetween the EEPROM and the TUSB3210 chip. The board is now ready for programming.

Step 2 – Using the TI EEPROM Burner Software

To use the EEPROM Burner Software, simply boot up the program and appropriately fill out the pull downmenus. If the CDCM6208 EVM is recognized by the Burner software and driver, an option under the“Select the USB Device:” should appear named “TI TUSB3210 EEPROMBurner”. This indicates the driverhas successfully connected to the TUSB3210 on the CDCM6208 EVM.

The EVM features 512kbits of EEPROM, so select this option on the ”Select EEPROM Size:” drop downmenu. Finally, locate the location of the new firmware .BIN file. Use the Browse button near the “SelectEEPROM Image:” to locate the .BIN file location. A screenshot of the Burner software is provided inFigure 5.



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www.ti.com A Step by Step Guide on Updating the TUSB3210 Firmware for I2C communication on the CDCM6208 EVM

Figure 5. TUSB3210 EEPROM Burner Software

To begin the programming sequence, press the Program EEPROM button. The status of the process isshown below the progress bar. Once the programming is complete, a dialog box will appear reading“EEPROM Programmed Successfully!”. This completes upgrading the CDCM6208 EVM Firmware.



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MMBT4401

NPN Controller Power

SPI Solution

Device Communication

I2C Solution

CLK

MOSI

MISO

LE

SPI Mode

Level Translation

SWITCH ON TO UPLOAD

TUSB3210 FIRMWARE

Device Power

Control Pins

Group 1

Control Pins

Group 2 - Pin ModesNOTE: (Leave these pins open if setting

SW1, SW2, or SW3 to SPI or I2C Modes)

DEVICE RESET

PLL Lock

Retain option to use native I2C

from controller if needed.

1) Pin Control - Use Pin jumpers (Group 2)

2) SPI - Set SW1 to On position

3) I2C - Set SW2 to On position

4) Bootloader - Set SW3 to On position (page 7)

(Select only one control mode at a time - Turn switches

off or remove jumpers for non-selected modes)

CDCM6208 EVM Control Modes

1

2

3

PUR

S2

pull-up power

+3V3+5V+5V

+3V3 +3V3 +3V3

+3V3

+3V3

+3V3 +3V3

+3V3+3V3

+3V3

DVDD

+3V3

+3V3

DVDD

+3V3 DVDD

DVDDDVDD

DVDDDVDD

DVDD DVDD

+3V3 +3V3

DVDD DVDD

DVDD

+3V3

SDA SCLSDA SCL

DVDD

POR

POR SCL_PIN4 2

SCS_AD1_PIN3 2

SDI_SDA_PIN1 2

SDO_AD0_PIN2 2

SDI_SDA_PIN1 2

REF_SEL 2 PDN 2

SI_MODE0 2 SI_MODE1 2

STATUS1_PIN0 2

SDI_SDA_PIN1 2

SCL_PIN4 2

SDO_AD0_PIN2 2

SCL_PIN4 2

SDO_AD0_PIN2 2

SCS_AD1_PIN3 2

SCS_AD1_PIN3 2

RESET_PWR 2

STATUS0 2

R522kR522k

12

C43

1uF

C43

1uF

4.7k

R9

4.7k

1

4.7k

R13

4.7k

12

4.7k

R17

4.7k

1

R30 1.5kR30 1.5k

1 2

4.7k

R19

4.7k

12

4.7k

R11

4.7k

1

U1

TUSB3210

U1

TUSB3210

DM019 DP018

SDA11

X161

X260

GND224 GND15

SCL12

PUR17

TEST115 TEST014

GND342

RST13

GND459

VCC110

VCC239

P3.0/RxD/S058

P3.1/TxD/S157

P3.256

P3.4/T054

P0.043

P0.144

P0.245

P0.346

P0.447

P0.548

P0.649

P0.750

VCC362

SUSP16

P1.031

P1.132

P1.233

P1.334

P1.435

P1.536

P1.640

P1.741

P2.022

P2.123

P2.225

P2.326

P2.427

P2.528

P2.629

P2.730

VREN38

VDDOUT37

S28

S39

P3.3/INT1#55

P3.553

P3.652

P3.751

SELF/BUS21

TEST220

11

22

33

44

66

77

63

63

64

64

+5V

DM

DP

GND

J1

Type B USB-Shield

+5V

DM

DP

GND

J1

Type B USB-Shield

3

1

2

45

6R25301

1 2

JP

_3

_1

JP

_3

_1

13

2

-NPR44

-NP1 2

-NPR47

-NP1 2

R515k R515k12

C41

0.1uF

C40

0.1uF

R23

4.7k

C45

33pF

C45

33pF

12

SW10SW10

12

43

5

JP

_3

_3

JP

_3

_3

13

2

JP

_3

_1

3JP

_3

_1

31

3

2

-NPR48

-NP1 2

R79

10k

R79

10k

12

4.7k

R14

4.7k

1

R20 0R20 012

JP

_3

_6

JP

_3

_6

13

2

R28

10k

R28

10k

12

C550.1uF C550.1uF

4.7k

R71

4.7k

1

C42

0.1uF

SW1

TDA04H0SK1

SW1

TDA04H0SK1

1

2

8

7

3

4

6

5

R3410k

12

R532kR532k

12

4.7k

R15

4.7k

1

R22

4.7k

12

12MHZ1

SE3409-ND

12MHZ1

SE3409-ND

1 2

SW4 SDA01H0SBRSW4 SDA01H0SBR1 2

R2910kR2910k

12

R491.5kR491.5k

12

4.7k

R18

4.7k

12

D4LED GREEN

D4LED GREEN 2 1

R511.5kR511.5k

12

C70

10uF/6.3V

C70

10uF/6.3V

R2115K

R2115K

1 2

JP

_3

_2

JP

_3

_2

13

24.7k

R12

4.7k

1

R370.0

1 2

R24

4.7k

12

R50

1M

1 2

C47

0.1uF

D1

LED GREEN

D1

LED GREEN

2 1D2D2

MB

RS

20

40

LT

3

21

R41.5k R41.5k1 2

JP

_3

_7

JP

_3

_7

13

2

R80.0 R80.01 2

C46

1uF

C46

1uF

R45-NP

R45-NP1 2

R35 NP

12

SW2

TDA04H0SK1

SW2

TDA04H0SK1

1

2

8

7

3

4

6

5

-NPR42

-NP1 2

4.7k

R10

4.7k

1

U9

TXB0102

U9

TXB0102

VB+7

GND2

VA+3

A15

A24

OE6B2

1 B18

4.7k

R16

4.7k

12

R26301

1 2

R36301

1 2R733 R7331 2

R27301

1 2

JP

_3

_5

JP

_3

_5

13

2

R39DNIR39DNI

12

R633 R6331 2

JP

_3

_4

JP

_3

_4

13

2

D5LED GREEN

D5LED GREEN 2 1

R57-NP

R57-NP1 2

-NPR43

-NP1 2

U4

24LC512

U4

24LC512

Vcc8

SDA5

A01

A12

A33

Vss4 SCL

6WP7

U2

TPS77333DGK

U2

TPS77333DGK

EN#3

IN15

OUT17

SENSE1

OUT28

IN26

GND4

RESET#2

D3

LED GREEN

D3

LED GREEN

2 1

JMP9

Header 5x1

1

JMP9

Header 5x1

-NPR46

-NP1 2Q12N2222AQ12N2222A

3

1

2

JP

_3

_8

JP

_3

_8

13

C44

33pF

C44

33pF

12

R31 1.5kR31 1.5k1 2

R38DNIR38DNI

12

JP

_3

_9

JP

_3

_9

13

2

CDCM6208V2 EVM Board Schematic www.ti.com

9 CDCM6208V2 EVM Board Schematic

Figure 6. CDCM6208V1/CDCM6208V2 EVM Control Modes



http://www.ti.com


Place 10uF close todevice pinto minimize seriesresistance.

Place 0.1uF caps as close aspossible to device pins.

Device Pins and Bypassing

SYNC_PULSEDEVICE RESET

CDCM6208 is a new part number

in our library. Need to attach package

information - including power-pad

dimensions.

VDD_OUTA

VDD_OUTB

VDD_IN

DVDD

VDD_PLL_A

VDD_OUTB

VD

D_O

UT

B

VD

D_O

UT

B

VD

D_O

UTA

VD

D_O

UTA

DV

DD

VD

D_P

LL

VDD_IN

VDD_IN

VDD_OUTB

VDD_OUTA

VDD_OUTA

REG_CAPR

EG

_C

AP

VDD_PLL

VD

D_

PL

L_

A

SYNCNRESET_PWR

SYNCN

YP7 5

YN7 5

YP6 5

YN6 5

YP5 5

YN5 5

YP4 5

YN4 5

REF_SEL1

SCL_PIN41

SCS_AD1_PIN31

SDO_AD0_PIN21

SDI_SDA_PIN11

SI_MODE01

PRI_REFP3

PRI_REFN3

SEC_REFP3

SEC_REFN3

YP

04

YN

04

YN

14

YP

14

YP

24

YN

24

YN

34

YP

34

EL

F3

SY

NC

N1

PD

N1

RE

SE

T_

PW

R1

STA

TU

S1

_P

IN0

1

STA

TU

S0

1

SI_

MO

DE

11

R2 1.5k

1 2

CDCM6208

U3

CDCM6208

U3

SI_MODE01

SDI/SDA/PIN12

SDO/AD0/PIN23

SCS/AD1/PIN34

SCL/PIN45

REF_SEL6

VDD_PRI_REF7

PRI_REFP8

PRI_REFN9

VDD_SEC_REF10

SEC_REFP11

SEC_REFN12

Y4_N25

Y4_P26

VDD_Y427

Y5_N28

Y5_P29

VDD_Y530

VDD_Y631

Y6_P32

Y6_N33

VDD_Y734

Y7_P35

Y7_N36

VD

D_P

LL1

37

VD

D_P

LL2

38

VD

D_V

CO

39

RE

G_C

AP

40

EL

F41

SY

NC

N42

PD

N43

RE

SE

TN

/PW

R44

STA

TU

S1

/PIN

045

STA

TU

S0

46

SI_

MO

DE

147

DV

DD

48

PO

WE

R_

PA

D49

VD

D1

_Y

0_

Y1

13

Y0

_P

14

Y0

_N

15

Y1

_N

16

Y1

_P

17

VD

D2

_Y

0_

Y1

18

VD

D1

_Y

2_

Y3

19

Y2

_P

20

Y2

_N

21

Y3

_N

22

Y3

_P

23

VD

D2

_Y

2_

Y3

24

0201 X7R

0.1uF

0201 X7RC280

0.1uF

1uF

C279

1uF

0201 X7R

0201 X7RC274

0.1uF

10uF

C281

10uF

0201 X7R

0201 X7RC207

0.1uF

L1BLM15HD102SN1D

L1BLM15HD102SN1D1 2

R1 1.5k

1 2

1uF

C291

1uF

DNI

C294

DNI JP_3_16JP_3_16

13

2SW6SW6

12

43

5

0201 X7R

DNI

0201 X7R C283

DNI

C82C82

10uF/6.3V

10uF

C275

10uF

1uF

C293

1uF

0201 X7R

0201 X7RC284

0.1uF

0201 X7R

0201 X7RC288

0.1uF

0201 X7R

0201 X7RC209

0.1uF 10uF

C276

10uF

0201 X7R

0201 X7RC287

0.1uF

0201 X7R

0201 X7RC285

0.01uF

10uF

C277

10uF

0201 X7R

0.1uF

0201 X7R C298

0.1uF

0201 X7R

0201 X7RC289

0.1uF

DNI

C295

DNI

0201 X7R

0201 X7RC286

0.1uF

1uF

C282

1uF

10uF

C278

10uF

0201 X7R

0201 X7RC290

0.1uF

0201 X7R

0201 X7RC211

0.1uF

SW7SW7

12

43

5

1uF

C292

1uF

www.ti.com CDCM6208V2 EVM Board Schematic

Figure 7. CDCM6208V1/CDCM6208V2 EVM Device Pins and Bypassing



http://www.ti.com


PRIMARY REFERENCE INPUT

SECONDARY REFERENCE INPUT

FILTER 1

FILTER 2

FILTER 3

FILTER 4

LOOP FILTER

25MHz for V1 EVM

30.72MHz for V2 EVM

V1: C1=100pF, R2=500, C2=22nF (BW = 300kHz when

PFD=25MHZ, ICP=2.5mA,R3=100, C3=242.5pF)


PFD=30.72MHZ, ICP=2.5mA,R3=100, C3=242.5pF)

Input jumpers

Connect center pin to

* 0.9V for 1.8V LVDS

* 1.2V for LVDS

* GND for LVCMOS

* DVDD for CML - also replace

series caps with 0 ohms

V1: C1=1uF, R2=1.3k, C2=22uF (BW = 50Hz when

PFD=8kHZ, ICP=500uA,R3=4010, C3=562.5pF)

V2: C1=5uF, R2=100, C2=100uF (BW = 100Hz when


V1: C1=4.7uF, R2=145, C2=47uF (BW = 40Hz when


V2: C1=4.7uF, R2=10, C2=100uF (BW = 600Hz when

PFD=9.6MHZ, ICP=500uA,R3=4010, C3=562.5pF)


PFD=30.72MHZ, ICP=2.5mA,R3=100, C3=242.5pF)


PFD=25MHZ, ICP=2.5mA,R3=100, C3=242.5pF)

DVDD1p2V0p9V

DVDD1p2V0p9V

PRI_REFP 2

PRI_REFN 2

SEC_REFP 2

SEC_REFN 2

ELF2

R89

DNI1 2

R73

0.0

R73

0.01

2

C25

1uF

C25

1uF

R88

1.3k1 2

C27

10pF

C27

10pF

C30

1uF

C30

1uF

R72

0.0

R72

0.0

12

SW5SW5

TDA04H0SK1

1

2

8

7

3

4

6

5

220pFC20

220pFC26

1uF

C26

1uF

5

JMP10

Header T 5pin

JMP10

Header T 5pin

R83

49.91 2

22nFC19

22nF

C48 DNI

25MHz

Y1

25MHz

Y1

NX3225SA 25MHz

1

1GND1

2

3

3GND0

4

R87R87

DNI1 2

R75R75

4001 2

1uF

C297

1uF

C49DNIC49DNI

MS A

RVE

J18 MS A

RVE

J18 1

2,3,4,5

JMP11

Header T 5pin

5

JMP11

Header T 5pin

0R81 01 2

100pFC18

100pF

MS A

RVE

J20 MS A

RVE

J20 1

R85

49.91 2

MS A

RVE

J19 MS A

RVE

J19 1

C29

1uF

C29

1uF

R84

49.91 2

C22

4.7uF

22nFC17

22nF

R86

49.91 2

C21 47uF

C50 DNI

C28

10pF

C28

10pF

R74R74

5001 2

1uFC24

1uF

MS A

RVE

J21 MS A

RVE

J21 1

R76R76

1451 2

C23 22uF

1uF

C296

1uF

2,3,4,5

2,3,4,5

2,3,4,5


Figure 8. CDCM6208V1/CDCM6208V2 EVM Reference Inputs



http://www.ti.com


Outputs 0 to 3

Outputs 0 to 3 have option for LP_CML, CML, and HS_CML

YP02

YN02

YP12

YN12

YP22

YN22

YP32

YN32

C3

1uF

C3

1uF

MSA

R VE

MSA

R VE

J61

C7

1uF

C7

1uF

MSA

R VE

MSA

R VE

J21

2,3,4,5

MSA

R VE

MSA

R VE

J51

MSA

R VE

MSA

R VE

J81

C4

1uF

C4

1uF

MSA

R VE

MSA

R VE

J71

MSA

R VE

MSA

R VE

J91

C8

1uF

C8

1uF

C1

1uF

C1

1uF

MSA

R VE

MSA

R VE

J31

C5

1uF

C5

1uF

C2

1uF

C2

1uF

C6

1uF

C6

1uF

MSA

R VE

MSA

R VE

J41

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5


Figure 9. CDCM6208V1/CDCM6208V2 EVM Outputs 0 to 3



http://www.ti.com


Outputs 4 to 7

Outputs 4 to 7 have option for HCSL, LVCMOS, LPCML

For HCSL, install 50 ohm termination resistors and adjust

series resistor between 0 and 33 ohms to improve ringing.

YP52

YN52

YP62

YN62

YP72

YN72

YP42

YN42

R61

DNI_49.9

R61

DNI_49.9

12

R67

DNI_49.9

R67

DNI_49.9

12

MSA

R VE

MSA

R VE

J161

C11

1uF

C11

1uF

C15

1uF

C15

1uF

R2260R2260

1 2

R2300R2300

1 2

R2280R2280

1 2

C10

1uF

C10

1uF

MSA

R VE

MSA

R VE

J111

MSA

R VE

MSA

R VE

J171

MSA

R VE

MSA

R VE

J141

R2320R2320

1 2

MSA

R VE

MSA

R VE

J121

R2290R2290

1 2

C14

1uF

C14

1uF

R2310R2310

1 2

R62

DNI_49.9

R62

DNI_49.9

12

C9

1uF

C9

1uF

R2250R2250

1 2

R64

DNI_49.9

R64

DNI_49.9

12

C13

1uF

C13

1uF

R2270R2270

1 2MSA

R VE

MSA

R VE

J151

MSA

R VE

MSA

R VE

J131

R63

DNI_49.9

R63

DNI_49.9

12

R65

DNI_49.9

R65

DNI_49.9

12

C12

1uF

C12

1uFR66

DNI_49.9

R66

DNI_49.9

12

R60

DNI_49.9

R60

DNI_49.91

2

C16

1uF

C16

1uF

MSA

R VE

J10MSA

R VE

1

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5

2,3,4,5


Figure 10. CDCM6208V1/CDCM6208V2 EVM Outputs 4 to 7



http://www.ti.com


3.3V Power Supply

2.5V Power Supply

MANY VIAS with Heat Sink

1.8V Power Supply



1.2V and 0.9V LVDS

Common Mode Voltages

3p3V

2p5V

VDD_PLL

VDD_OUTA

VDD_OUTB

VDD_IN

3p3V2p5V

1p8V

3p3V2p5V

1p8V

3p3V2p5V

1p8V

3p3V2p5V

1p8V

DVDD

1p8V2p5V

3p3V

+5V

+5V

1p8V

+5V

1p2V

0p9V

R69R695.9k

12

TPS7A8001

U6

TPS7A8001

U6

OUT11

OUT22

FB3

GND4

EN5

NR6

IN27

IN18

GN

D_P

AD

9

R5910k

12

JP_3_12JP_3_12

13

2

C35

10uF/6.3V

P2

VDD 3.3V

C61750pFC61750pF

JP_3_10JP_3_10

13

2

C3910uF/6.3VC3910uF/6.3V

C650.01uFC650.01uF

TPS7A8001

U8

TPS7A8001

U8

OUT11

OUT22

FB3

GND4

EN5

NR6

IN27

IN18

GN

D_P

AD

9

R32

0

R32

0

R4110k

R4110k

12

C37510pFC37510pF

C620.01uFC620.01uF

R5410k

12

JMP2

Header T 4pin

1

4

Header T 4pin

R56

0

R56

0

R55

0

R55

0

R70R7017.8k

12

C31

10uF/6.3V

R68R6825.5k

12

P3

VDD 2.5V

R40R4030.9k

12

Header T 4pin

1

4

JMP5

Header T 4pin

C36

10uF/6.3V

TPS7A8001

U7

TPS7A8001

U7

OUT11

OUT22

FB3

GND4

EN5

NR6

IN27

IN18

GN

D_P

AD

9

C6610uF/6.3V

C380.01uFC380.01uF

JP_3_11JP_3_11

13

2

C641300pF

Header T 4pin

1

4

JMP3

Header T 4pin

C34

10uF/6.3V

P1

GND

P1

GND

C6310uF/6.3V

Header T 4pin

1

4

JMP1

Header T 4pin

VDD 1.8V

P4

R3321k

12

C32

10uF/6.3V

R5812.5k

12

Header T 4pin

1

4

JMP4

Header T 4pin

C33

10uF/6.3V


Figure 11. CDCM6208V1/CDCM6208V2 EVM Power Supplies



http://www.ti.com


SPI CLK

SPI data to 6208

SPI Enable

RESET to be held low until

SPI operations are complete

Microcontroller can be programmed to load device registers

at power up. RESETN is help low during SPI operations.

When register loading is complete, RESETN is set high and

MSP430 enters low-power mode. MSP430 supply needs to be at

least 1.8V for proper operation.

Optional Inputs for MSP430 Firmware

Use to select between different register preload options.

4

DVDD

DVDD

DVDD

DVDD

DVDD

P1p1

DVDD

P1p0

P1p0

P1p1

SCL_PIN4 2

SCS_AD1_PIN3 2

SDI_SDA_PIN1 2

RESETN 2

R77

4.7k

1

R3R347k

12

C672.2nF

P12

TSM-107-01-S-DV

FET Tool Connector

1 2468101214

3579

1113 0

201 X7R C68

0.1uF

JP

_3

_1

5JP

_3_15

13

2 R78

4.7k

1

MSP430G2001

U10

MSP430G2001

U10

RST / SBWTDIO10

TEST / SBWTCK11

XOUT12

XIN13

P1.02

P1.13

P1.24

P1.35

P1.46

P1.5 / SCLK7

P1.6 / SDO / SCL8

P1.7 / SDI / SDA9

VC

C1

VS

S14

JP

_3

_1

4JP

_3_14

13

2

SW3SW3

TDA04H0SK1

1

2

8

7

3

4

6

5


Figure 12. Onboard MSP430G2001



http://www.ti.com


EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMSTexas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TOBUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTHABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIALDAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safetyprograms, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, andtherefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATIONAs noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the FederalCommunications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumeruse. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computingdevices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequencyinterference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense willbe required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radioUser Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency andpower limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with locallaws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate thisradio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited andunauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatoryauthorities, which is responsibility of user including its acceptable authorization.

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

CautionThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not causeharmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate theequipment.

FCC Interference Statement for Class A EVM devicesThis equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercialenvironment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with theinstruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely tocause harmful interference in which case the user will be required to correct the interference at his own expense.

http://www.ti.com/corp/docs/csr/environment/ESHPolicyandPrinciples.shtml

FCC Interference Statement for Class B EVM devicesThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipmentgenerates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may causeharmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. Ifthis equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off andon, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate theequipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) thisdevice may not cause interference, and (2) this device must accept any interference, including interference that may cause undesiredoperation of the device.

Concerning EVMs including detachable antennasUnder Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gainapproved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain shouldbe so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximumpermissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gaingreater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité del'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation estautorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter toutbrouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gainmaximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique àl'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manueld’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus danscette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

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【【Important Notice for Users of this Product in Japan】】This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs andCommunications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law ofJapan,

2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to thisproduct, or

3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan withrespect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please notethat if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

http://www.tij.co.jp

【ご使用にあたっての注】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビルhttp://www.tij.co.jp

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EVALUATION BOARD/KIT/MODULE (EVM)WARNINGS, RESTRICTIONS AND DISCLAIMERS

For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finishedelectrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation inlaboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risksassociated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished endproduct.

Your Sole Responsibility and Risk. You acknowledge, represent and agree that:

1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and DrugAdministration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.

2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicableregulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents tominimize the risk of electrical shock hazard.

3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, evenif the EVM should fail to perform as described or expected.

4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.

Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per theuser guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, andenvironmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contacta TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of thespecified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/orinterface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to theload specification, please contact a TI field representative. During normal operation, some circuit components may have case temperaturesgreater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components includebut are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using theEVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, pleasebe aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeablein electronic measurement and diagnostics normally found in development environments should use these EVMs.

Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representativesharmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or inconnection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claimsarise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.

Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (suchas life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as deviceswhich are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separateAssurance and Indemnity Agreement.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2012, Texas Instruments Incorporated

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2013, Texas Instruments Incorporated

http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

http://www.ti.com/security

http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

http://e2e.ti.com

http://www.ti.com/wirelessconnectivity

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