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CELLPHONE & TABLET CORE CHIP MARKETS '13

Market Analysis of Baseband, Application Processor, RF & Power Management Chips and More

Author:

Carter L. Horney

Editor & Contributor:

Will Strauss

Report No. 1310 February, 2013

About the Author

Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is the author of this report. Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning. He was formerly Division Planner for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager for Rockwell’s Semiconductor Products Division. Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and high-speed modem chip market. He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations. Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

About the Editor

Will Strauss, President of Forward Concepts, is the editor and significant contributor for this report. Mr. Strauss is internationally recognized as the leading authority on markets driven by digital signal processing (DSP), and wireless is the largest DSP market.

Copyright © 2013 by Carter L. Horney for the exclusive use of Forward Concepts Company. All rights, including that of translation into other languages are specifically reserved. No part of the this publication may be reproduced in any form, stored in a retrieval systems or transmitted by any method or means, electrically, mechanically, photographic or otherwise, without the express permission of Carter L. Horney, (d\b\a Teletronix) P.O Box 487 San Clemente, California 92674. (Tel 949-492-8885: Fax: 949-361-8885). Personal E-mail: chorney@cox.net

FORWARD CONCEPTS and the stylized FC Logo are registered trademarks of Forward Concepts Co. ® Reg. U.S. Patent & Trademark Office.

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I. EXECUTIVE SUMMARY ......................................................................................... 1A. Overview ............................................................................................................ 1B. Market Drivers .................................................................................................... 1C. Baseband Processors ....................................................................................... 5D. Application Processors ................................................................................... 11E. Radio Frequency (RF) Transceiver Chips ...................................................... 15F. Power Amplifier Modules ................................................................................ 17G. Power Management Units ............................................................................... 17

II. BASEBAND PROCESSORS ................................................................................ 20A. Overall Baseband Processor Market Shares ................................................. 21B. Digital Baseband Processor Forecast by Air Type........................................ 27C. 3G/4G LTE Technology ................................................................................... 30D. LTE Technology Migration .............................................................................. 31E. LTE Operator Status and Global Bands of Deployment ............................... 33

1. United States and Canada ........................................................................................ 362. Europe ..................................................................................................................... 373. Russian Federation................................................................................................... 384. South Korea ............................................................................................................. 395. Japan ....................................................................................................................... 396. India ......................................................................................................................... 407. China........................................................................................................................ 418. Other Asia Pacific ..................................................................................................... 429. Middle East and Africa .............................................................................................. 4310. Central and South America ................................................................................... 43

F. LTE Smartphone Market Shares ..................................................................... 45G. Digital Baseband LTE Forecast ...................................................................... 46H. LTE Supplier Market Shares ........................................................................... 50I. LTE Baseband Supplier Profiles ..................................................................... 52

1. Altair Semiconductor Ltd. .......................................................................................... 542. Broadcom (4G LTE UE Class 4 Baseband) ............................................................... 553. Huawei-HiSilicon (LTE/3G Rel.9 baseband chip)....................................................... 564. Innofidei (P4 LTE and LTE/TD-SCDMA Modem) ....................................................... 565. Intel Mobile Communications (LTE RF and 3G/LTE basebands) ............................... 576. Leadcore Technology (LTE/TD-SCDMA Platform) .................................................... 587. GCT Semiconductor (GDM7240 LTE Cat3 Baseband/Transceiver) ........................... 588. Marvell (PXA1802 multimode LTE/3G TD-SCDMA modem) ...................................... 599. MediaTek (TD-LTE + TD-SCDMA Com-processor) ................................................... 6010. NVIDIA-ICERA (LTE and 21 Mbps HSPA+ platform) ............................................ 6011. Qualcomm (MDM 9xxx LTE/ EVDO or DC-HSPA+ modem) .................................. 6112. Renesas Mobile Corp. (SP2530/31 LTE/3G DC-HSPA+ Modem) .......................... 6213. Samsung (CMC221 LTE Baseband only).............................................................. 6214. Sequans Communications (LTE and WiMAX Baseband Chip only) ....................... 6315. Spreadtrum (LTE/TD-SCDMA/GSM baseband platform) ....................................... 63

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16. ST-Ericsson (M7400 LTE 4/3G modem – DBB, ABB and RF) ............................... 64

J. WCDMA Baseband Market & Vendor Shares ................................................. 66K. WCDMA/HEDGE Standalone Baseband Chip Profiles .................................. 67

1. Broadcom (7.2Mbps HSDPA / HSUPA Basebands) .................................................. 682. NVIDIA (21 Mbps HSPA+ Receive Diversity Modem) ................................................ 693. Intel (Release 7 diversity HSPA+ 21/11 Mbps Baseband Platform) ........................... 704. MediaTek (MT6268/76 384/3.6 Kbps Othello WEDGE Platform) .............................. 725. Qualcomm (Up to 42Mbps DC-HSPA+ Platforms) ..................................................... 736. Qualcomm Gobi (Gobi MDM Series of Thin Modems) ............................................... 747. Renesas Mobile (SP2531 3G/LTE BB/RF Modem) ................................................... 758. ST-Ericsson (7.2 and 21 Mbps HSPA+ Connect Platforms) ....................................... 77

L. CDMA Baseband Market & Vendor Shares .................................................... 80M. CDMA2000 Baseband Supplier Profiles ......................................................... 81

1. VIA Telecom ............................................................................................................. 822. Qualcomm (CDMA2000 1x Advanced Chip Set) ....................................................... 823. Qualcomm (CDMA2000 EV-DO Rel. 0 and Rel. A) ................................................... 834. Qualcomm (Tri-mode CDMA1x EV-DO Rev. A, HSPA+/EDGE) ................................ 83

N. TD-SCDMA Baseband Supplier Profiles......................................................... 841. Leadcore Technology Co Ltd. (TD-HSDPA IP) .......................................................... 852. MediaTek (TD-SCDMA/TD-HSPA Baseband & 2 RFs) ............................................. 863. Marvell (TD-SCDMA, TD-HSPA Com -Processor) ..................................................... 874. Spreadtrum (TD-HSPA DBB & RF, Triple-SIM) ......................................................... 885. Spreadtrum (SC8810 TD-HSPA EDGE/GPRS/GSM Com-Processor ........................ 906. Spreadtrum (LTE and TD-HSPA-SCDMA Baseband) ................................................ 927. ST-Ericsson- (T6718 TD-HSPA Baseband, RF, ABB) ............................................... 92

O. TD-SCDMA Baseband Market & Vendor Shares ............................................ 93P. GSM/GPRS & EDGE Baseband Market & Vendor Shares ............................. 96Q. GSM, GPRS & EDGE Baseband Supplier Profiles ......................................... 99

1. MediaTek (MT6236 312MHz ARM9 EDGE Platforms) ............................................. 992. Spreadtrum Communications (Multichip GSM/GPRS Baseband) ............................ 1003. ST-Ericsson (Quad GPRS or EDGE-RX monolithic modem) ................................... 101

III. INTEGRATED BASEBAND & RF CHIPS ........................................................... 102A. ULC Modem Market Size & Vendor Shares .................................................. 103B. ULC Modem Market Forecast........................................................................ 107C. Ultra-Low-Cost (BB/RF) Modem Supplier Profiles ...................................... 110

1. Broadcom (65nm Monolithic EDGE Modem, H.264) ................................................ 1132. Intel (65nm Monolithic GSM and EDGE, MPEG4) .................................................. 1143. MediaTek, Inc. (GSM/GPRS 1-SIP RF, 2-Die hybrid MCP) ..................................... 1154. MediaTek, Inc (EDGE/GPRS/GSM-TRx + MCP) ..................................................... 1165. RDA Microelectronics (Single-Chip GSM/GPRS DBB +BT/FM) ............................... 1166. Spreadtrum Communications (GSM/GPRS 1SIP RFx, 2 die MCP) .......................... 1177. ST-Ericsson (Monolithic GSM/GPRS and EDGE DSDS) ......................................... 1188. Qualcomm (WCDMA/HSDPA Single-Package Modems)......................................... 1219. Qualcomm (WCDMA/HSUPA 10Mbps/5.76 MCP Modem) ...................................... 12210. Qualcomm (CDMA 1x Single-Chip & MCP Modems) .......................................... 122

IV. STAND-ALONE APPLICATION PROCESSORS ............................................ 125

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A. Overview ........................................................................................................ 125B. Smartphone Market Share and Forecast...................................................... 126

1. Smartphone Forecast and Segmentation ................................................................ 1272. Smartphone Consumption by Operating System ..................................................... 1283. Global Distribution of Smartphones by Region ........................................................ 1294. LTE Smartphone Distribution by Geographical Region ............................................ 1305. Smartphone Market Share Leaders ........................................................................ 131

C. Media Tablet Market Share and Forecast ..................................................... 1351. Media Tablet Statistics ............................................................................................ 1352. Tablet Market Share by Operating Systems ............................................................ 1373. Media Tablet Market Shares ................................................................................... 139

D. Application Processor Trends ...................................................................... 1421. Screen Size, Resolution and 1080P Video .............................................................. 1422. High Dynamic Range Photography ......................................................................... 1453. Wireless Connectivity Integration Opportunities ...................................................... 1464. Application Processor Differentiation ....................................................................... 1465. GPU Comparison and Trends ................................................................................. 1486. CPU Advancements ............................................................................................... 1517. Process Technology Access ................................................................................... 153

E. Com-Processor vs. Standalone Processor .................................................. 154F. Application Processor Market & Vendor Shares ......................................... 156G. Application Processor and Com-Processor Forecast ................................. 159H. Stand-alone Application Processor Suppliers............................................. 160

1. Apple A5 (1.0 GHz Single Core Cortex A8 SGX543MP) .......................................... 1652. Apple A5X (1.0 GHz dual-core Cortex A8 SGX543MP) ........................................... 1663. Apple A6 (1.3 GHz dual-core Cortex Swift SGX543MP3) ........................................ 1664. Apple A6X (1.4 GHz dual-core Cortex Swift SGX544MP4) ...................................... 1675. Freescale (imX535 1.0 GHz Single Core Cortex A8) ............................................... 1676. Freescale (1.2 GHz Single, Dual and Quad-core Cortex A9) ................................... 1687. Fuzhou Rockchip Electronics .................................................................................. 1688. Huawei (HiSilicon K3, MW-Mobile 6.5 Professional) ................................................ 1699. Huawei (HiSilicon K3V@ 1.2-1.5 GHz K3V2Quad Cortex A9, 720P) ....................... 16910. Intel (Z2460 x86HT processor, SGX540 GPU HD 1080P) ................................... 16911. Intel (Z2420 1.2GHz x86HT processor, SGX540 GPU HD 1080P) ...................... 17112. Intel (Z2760 Dual Processor, SGX544MP2 GPU HD 1080P) .............................. 17113. Intel (Z2580 1.8MHz Dual Processor, SGX544MP GPU, HD 1080P) .................. 17114. Marvell (ARMADA Applications Processors) ....................................................... 17215. Nufront (Dual Cortex A9+Mali400 Applications Processor) .................................. 17216. NVIDIA (Tegra2 Dual A9 Standalone Applications Processor) ............................ 17317. NVIDIA (Tegra3 Quad Cortex A9-12core GeForce Processor) ............................ 17518. NVIDIA (Tegra4 Quad Cortex A15-72 Core GPU Processor, 1440P) .................. 17619. Qualcomm (APQ8060A and APQ8064 S4 dual-core Krait)................................. 17720. Renesas (APE5R Dual Cortex-A9, SGX543 GPU, 1080P codec) ........................ 17821. Renesas Mobile (MP6530 dual Cortex A15/dual Cortex A7+SGX544 Processor) 18222. ST-Ericsson (Nova A9500 dual Cortex-A9s and A15) ......................................... 18323. Samsung Exynos3 (Single1 GHz Cortex-A8 Mali400 Processor) ........................ 18524. Samsung Exynos4 (1.2 GHz Dual Cortex-A9+ Mali400 1080P) ........................... 18725. Samsung Exynos4 (1.4 GHz Quad Cortex A9+Mali400, 1080P ........................... 18826. Samsung Exynos 5 (1.7 GHz Dual Cortex A15+ Mali-T604GPU) ........................ 18927. Samsung Exynos 5 Octa (1.7 GHz Quad Cortex 15+ SGX544MP3).................... 190

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28. Telechips (1.2 GHz Single Core Cortex A8+ Mali400) ......................................... 19029. Texas Instruments OMAP3 (Cortex A8-SGX530 Processors) ............................. 19130. Texas Instruments OMAP4 (Dual-A9+2M3 CPU+SGX544, 1080P) ..................... 19231. Texas Instruments OMAP5 (2GHz dual-Cortex-A15 + SGX544MP2) .................. 19432. VIA Technologies/Wonder Media ........................................................................ 196

V. COMMUNICATION PROCESSORS ................................................................... 198A. Com-Processor Statistics ............................................................................. 201B. Communications Processor Market Share Leaders .................................... 204C. Communications Processor Forecasts ........................................................ 206D. Communications Processor Supplier Profiles ............................................ 207

1. Broadcom (BCM2157 500MHz ARM11 HSDPA-Processor) .................................... 2132. Broadcom (BCM21553 832MHz ARM11 Mbps HSPA-Processor) ........................... 2133. Broadcom (BCM2164 832MHz CortexA9/A4+VC4 HSUPA-Processor) ................... 2144. Broadcom (BCM28155 1.2GHz dual A9+VC4 HSPA+ with 1080P) ......................... 2155. Leadcore Technology LC1810 (CortexA9+ Mali400 LTE/TD-SCDMA-processor) .... 2166. MediaTek MT6516 (416MHz ARM926 GSM/EDGE-processor) ............................... 2177. MediaTek MT6573 (650MHz ARM11+SGX523 HSPA-Processor with QHD video).. 2178. MediaTek MT6575 (1GHz A9+SGX531 HSUPA-720P Processor) .......................... 2189. MediaTek MT6577 (1GHz DualA9+SGX531 HSPA-720P Processor) ...................... 21810. MediaTek MT6583 (1.2GHz DualA9 HSPA+SGX544 720P) ............................... 21911. MediaTek MT6589 (1.0GHz Quad-A7+SGX544 HSPA+ 720P Processor) .......... 21912. MediaTek MT6517 (1GHz A9+SGX531-720P TD-SCDMA Processor) ................ 22013. Marvell (PXA930 1GHz ARMv7+Vivante HEDGE–Processor-1080P) ................. 22014. Marvell (PXA920H 1GHz ARMv7+Vivante TD-SCDMA-Processor with 720P) ..... 22115. Renesas Mobile (MP5225 1.2 GHz dual A9- SGX543MP HSPA+/LTE-processor) 22216. Renesas (MP5232 LTE-Cat4/DC-HSPA+SGX543MP Com-Processor) ............... 22417. Renesas (MP6530 DualA15/DualA7-SGX544 LTE-Cat4/3G Processor) .............. 22518. Qualcomm (MSM7x30 800 MHz S2 HSPA–Processor with 720P)....................... 22619. Qualcomm (QSD8x50A 1.2 GHz S1 HSPA - HD Com-Processor)....................... 22620. Qualcomm (MSM7x27 600 MHz ARM11 HSPA WQVGA Video .......................... 23021. Qualcomm (MSM7x27A 1 GHz Cortex A5 HSUPA 480P) ................................... 23122. Qualcomm (MSM7x25A 800 MHz Cortex A5 HSDPA 480P) ............................... 23123. Qualcomm (MSM8x25Q Quad Cortex A5 HSPA 720P) ....................................... 23124. Qualcomm (MSM8930 1.2 GHz Dual Krait LTE/HSPA+/EVDO with 1080P) ........ 23225. Qualcomm (MSM8x55 1.2 GHz S2 Scorpion HSPA+ with 720P)......................... 23226. Qualcomm (MSM8x60 1.2-1.7 GHz DualS3 HSPA+ with 1080P) ........................ 23327. Qualcomm (MSM8x60A 1.7GHz DualS4 DC-HSPA+/SVDO 1080P) ................... 23328. Qualcomm (MSM8960T 1.7GHz Dual S4 DC-HSPA+/SVDO 1080P) .................. 23429. Spreadtrum (SC8810 1GHz Cortex A5+Mali400 TD-SCDMA HD video).............. 23530. ST-Ericsson (L8530 LTE/HSPA+ Dual A9+SGX544 Com-Processor .................. 23631. ST-Ericsson (L8580 LTE/HSPA+ Dual-A9+SGX544 Com-Processor .................. 23632. ST-Ericsson (U8500 Dual A9+Mali400 HSDPA+ Com-Processor)....................... 237

VI. RADIO TRANSCEIVERS ................................................................................ 239A. Overview ........................................................................................................ 239B. LTE Radio Technology Evolution ................................................................. 239C. Overall RF Transceiver Market Shares ......................................................... 244D. GSM/GPRS and EDGE Transceiver Market Shares ..................................... 245

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E. CDMA Transceiver Market Shares ................................................................ 246F. WCDMA/UMTS Transceiver Market Shares ................................................. 247G. TD-SCDMA Transceiver Market Shares........................................................ 248H. LTE Transceiver Market Shares .................................................................... 249I. Radio Transceiver Forecast .......................................................................... 249J. 2G/3G/4G RF Transceiver Supplier Profiles ................................................. 251

1. AKM (Tri-band WCDMA/HSDPA Xceiver) ............................................................... 2552. MediaTek (TD-SCDMA and WCDMA Xceiver ......................................................... 2553. MediaTek (CMOS quad GSM/GPRS Xceiver) ......................................................... 2564. Broadcom (BCM2085 Polar EDGE Xceiver & EDGE ULC) ...................................... 2565. Broadcom (BCM2091 Bands I-X WCDMA/HSPA/EDGE Xceiver ............................ 2566. Fujitsu (90nm 10-band HSPA/ EDGE RF Subsystems) ........................................... 2577. GCT Semiconductor (CMOS CDMA2000 Xceiver) .................................................. 2588. Intel (130nm CMOS WEDGE & LTE Xceivers) ........................................................ 2609. ST-Ericsson (3GPP Rel 6 WCDMA/HSPA Xceiver) ................................................. 26110. ST-Ericsson (Cat 7/8 GSM/GPRS/EDGE/WCDMA Xceiver)................................ 26211. ST-Ericsson (130nm dual-band CMOS TD-SCDMA Xceiver) .............................. 26212. Qualcomm (CMOS Diversity WEDGE Xceiver + GLONASS GPS) ...................... 26313. RDA Microelectronics (CMOS GSM/GPRS and EDGE Xceivers) ........................ 26314. RDA Microelectronics (CMOS TD-SCDMA, TD-HSUPA Xceivers) ...................... 26415. Renesas (SOI BiCMOS 8-band HEDGE & EDGE Xceiver) ................................. 26516. Skyworks Solutions (WEDGE & EDGE Xceivers) ................................................ 26617. Icera (CMOS 7-band WCDMA/HEDGE Xceiver) ................................................. 26718. Sony Semiconductor (SiGe BiCMOS WCDMA/HSPA Xceiver)............................ 26719. Spreadtrum (7-band CMOS WEDGE, TD-SCDMA Xceiver) ................................ 267

K. 4G LTE RF Transceiver Chip Suppliers........................................................ 2691. Altair Semiconductor (1.9-2.7 GHz CMOS Transceiver) .......................................... 2712. Broadcom (LTE/3G Baseband and Transceiver) ..................................................... 2713. Fujitsu Semiconductor (LTE FDD1-17, TDD-34, 38 Transceiver) ............................. 2724. Fujitsu Semiconductor (Simultaneous LTE/3G Transceiver) .................................... 2735. Fujitsu Semiconductor (Multiband, multimode LTE/3G/2G Xceiver) ......................... 2736. GCT Semiconductor (R8 FDD Multiband +700 MHz) .............................................. 2747. Intel (LTE/3GPP Rel. 7/8, 1-IX band Transceiver) ................................................... 2748. Maxim-GenAsic (2.3-2.7 GHz TD-LTE Transceiver) ................................................ 2759. Maxim (2.3-2.7 GHz TD-LTE Transceiver) .............................................................. 27510. NVIDIA (FDD LTE/HSPA+ Transceiver) .............................................................. 27611. Qualcomm (LTE/3G/2G Cat 4 Transceivers) ....................................................... 27612. Renesas (FD LTE Cat4 / HSPA+/GSM/GPRS/EDGE) ........................................ 27713. Silicon Motion (FD LTE Cat3 and LTE/CDMA Cat3 Transceiver) ......................... 27814. Spreadtrum Communications (4G TD LTE/3G TD-SCDMA/WEDGE) .................. 27915. ST-Ericsson (LTE 4/HSPA+Transceiver) ............................................................ 279

VII. CELLPHONE POWER AMPLIFIERS .............................................................. 280A. Overview ........................................................................................................ 280B. Cellphone Power Amplifier Market Share Leaders ...................................... 282C. Cellphone Power Amplifier Segmentation ................................................... 282D. Mobile Power Amplifier Five Year Forecast ................................................. 287E. Cellular PA Supplier Profiles ........................................................................ 291

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1. Anadigics................................................................................................................ 2912. Avago Technologies ............................................................................................... 2933. Black Sand Technologies ....................................................................................... 2934. Maxim Semiconductor (CDMA, PDC and AMP) ..................................................... 2945. Mitsubishi Electronic Devices (GaAs Hybrid CDMA and WCDMA) .......................... 2946. Renesas Technology Corp...................................................................................... 2957. RF Micro Devices ................................................................................................... 2968. RDA Microelectronics (Quad GSM & TD-SCDMA 1800) ......................................... 2989. Skyworks ................................................................................................................ 29910. TriQuint Semiconductor ...................................................................................... 301

F. LTE PA Supplier Profiles ............................................................................... 3031. Anadigics (FDD 1, 2, 7, 8, 20, 3/4/9/10, 5/6/18/19, 12/17, 13/14; TDD 38, 40) ......... 3032. Mitsubishi Electric (Six LTE-Compliant Power Amplifiers) ........................................ 3043. Skyworks (FDD 1, 4/9, 5/6, 7, 8, 9, 13/14, 12/17 and TDD 38/40) ............................ 3044. Nujira...................................................................................................................... 3055. RFMD (LTE Single bands 3, 4,7,11,13,17,20 and 21) ............................................. 3066. TriQuint Semiconductor (band 13, 17 of the USA 700 MHz) .................................... 308

VIII. POWER MANAGEMENT UNITS ..................................................................... 309A. Overview ........................................................................................................ 309B. PMU Audio Codec/Speakerphone Drivers ................................................... 312

1. AKM Semiconductor (CMOS 24-bit Audio) .............................................................. 3122. Cirrus Logic (CMOS Audio Codec).......................................................................... 3133. Texas Instruments (Audio Codec+ USB and miniDSP)............................................ 3134. Maxim (Stereo Audio Codec) .................................................................................. 3145. Wolfson Microelectronics (Stereo Codec with SPKR drivers and Class W headphone) 315

C. PMU Market Shares ....................................................................................... 316D. PMU Five-Year Forecast ................................................................................ 319E. PMU Company Profiles ................................................................................. 320

1. Anpec Electronics (Battery charge management) .................................................... 3212. Broadcom ............................................................................................................... 3213. Dialog Semiconductor (CMOS PMU/Audio subsystem) ........................................... 3214. Intel (RF-Baseband Power Management) ............................................................... 3225. Linear Technology (Energy Management)............................................................... 3236. Maxim Integrated Products ..................................................................................... 3247. MediaTek (Baseband) ............................................................................................ 3258. Micrel (BiCMOS, discrete specific PMUs)................................................................ 3259. National Semiconductor .......................................................................................... 32610. Qualcomm (Cellular Power Management) ........................................................... 32711. Ricoh Electronic Devices (7 channel PMU + white LED driver) ............................ 32712. ST-Ericsson (Application Processor PMU) .......................................................... 32813. Texas Instruments (Processor PMUs) ................................................................. 32914. Wolfson Microelectronics (Audio Codec, MEMS Mics) ........................................ 330

IX. APPENDIX ...................................................................................................... 331A. WIRELESS & MULTIMEDIA ACRONYMS & ABBREVIATIONS .................... 331

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FIGURES

Figure 1 Mobile Terminal Revenue by Type: 2012 .......................................................... 2Figure 2 Cellphone Unit Shipments by Type: 2012 .......................................................... 2Figure 3 Growth of Mobile Phones & Computing Tablets ................................................ 3Figure 4 Handset Shipments by Region: 2012 ................................................................ 4Figure 5 Smartphone Shipments by Region: 2012 .......................................................... 4Figure 6 Growth of 3G/4G Cellular Basebands by Standard ............................................ 6Figure 7 3G & 4G Shipments by Geographical Region: 2012. ......................................... 7Figure 8 LTE Smartphone Global Shipments by Region: 2012 ........................................ 8Figure 9 Global Growth of LTE by Region ....................................................................... 9Figure 10 Cellphone Digital Processor Summary Forecast ............................................ 10Figure 11 APPS-DBB Integrated Com-Processor Market Shares: 2012 ........................ 12Figure 12 Standalone Smartphone Application Processor Market Shares: 2012 ........... 13Figure 13 Standalone Tablet Application Processors by Vendor: 2012.......................... 14Figure 14 Application Processor and Co- Processor Forecast ....................................... 15Figure 15 LTE Frequency Band Growth (by band count) ............................................... 16Figure 16 Analog Baseband, RF and Power Amplifier Chip Revenue Forecast ............. 19Figure 17 Total Baseband Processor Market by Category: 2012 ................................... 21Figure 18 Distribution of Non-Smart Handset Shipments: 2012 ..................................... 22Figure 19 Digital Baseband Vendor Market Shares: 2012 ............................................. 22Figure 20 Stand-Alone Baseband Market Revenue by Cellular Standard: 2012 ............ 24Figure 21 China’s Domestic Handset Consumption by Standard: 2012 ......................... 25Figure 22 CDMA Handset Shipments by Region. .......................................................... 26Figure 23 UMTS Baseband Shipments by Specific Air Standard: 2012 ......................... 27Figure 24 Forecast of Handset Shipments by Air Interface: ’11-‘17 ............................... 28Figure 25 LTE/3G Smartphone Consumption by region: 2012 ...................................... 34Figure 26 LTE Mobile Baseband Growth by Region ...................................................... 35Figure 27 Forecast of LTE Baseband Processors in Asia .............................................. 42Figure 28 LTE Baseband Shipments by Type: 2012. ..................................................... 46Figure 29 Standalone vs. Com Processor LTE Shipment Detail: 2012 .......................... 47Figure 30 Distribution of CPU Type in LTE Smartphones: 2012. ................................... 48Figure 31 Multi- and Single-mode FDD-LTE Baseband Suppliers: 2012 ....................... 51Figure 32 WCDMA/HSPA/TD-SCDMA Baseband Vendor Market Shares: '12 .............. 66Figure 33 Renesas G4 Cortex-A8 DBB Com-Processor ................................................ 77Figure 34 CDMA Stand-Alone Baseband Vendor Market Shares: '12 ........................... 81Figure 35 Spreadtrum SC800G TD-SCDMA Baseband Block Diagram......................... 89Figure 36 Spreadtrum’s SC8810 Com-Processor Chip Block Diagram.......................... 90Figure 37 DBB/AP TD-SCDMA Integrated Com-Processor Vendor Shares: '12 ............ 94Figure 38 Standalone TD-SCDMA Baseband Vendor Market Shares: '12 ..................... 94Figure 39 TD-SCDMA DBB & integrated APs Com-Processor Vendor Shares: '12 ....... 95Figure 40 Chinese Handset Production by Air Type: 2012 ............................................ 96Figure 41 GSM/GPRS Baseband Market by Vendor: '12 ............................................... 97Figure 42 GSM/GPRS/EDGE Baseband Market by Vendor: '12 .................................... 98Figure 43 Cellular Monolithic BB/RF Modem Chip Market by Vendor: '12 ................... 104Figure 44 Cellular Monolithic BB/RF Modem Unit Shipments by Vendor: '12 .............. 104Figure 45 Monolithic Baseband/RF Sales by Cellular Standard: 2012 ......................... 105Figure 46 Dual-SIM, Dual-Standby Shipment Growth: '12-'17 ..................................... 106Figure 47 Distribution of Mobile Phones by Cellular Standard: 2012 ........................... 107Figure 48 ULC Unit Shipment Growth by Technology: ‘11-‘17 ..................................... 108

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Figure 49 Mobile Phone Market by Type: 2012 ........................................................... 108Figure 50 Mobile Phone Market by Type: 2016 ........................................................... 109Figure 51 Spreadtrum's SC6530 Baseband MCP Block Diagram ................................ 118Figure 52 ST-ER G4852 GPRS/EDGE Modem Block Diagram ................................... 120Figure 53 Smartphone Growth versus other Handsets: 2011-2017 ............................. 126Figure 54 Segmentation of the Smartphone Market: '10-'17 ........................................ 127Figure 55 Estimated Smartphone Shipments by Operating System: '12 ...................... 129Figure 56 Smartphone Consumption by Geographical Region: 2012 .......................... 130Figure 57 LTE/3G Smartphone Shipments by Geographical Regions ......................... 131Figure 58 Top Twenty Smartphone Suppliers: 2012. ................................................... 131Figure 59 Samsung Smartphone Shipments by Model: 2012 ...................................... 134Figure 60 Application Processors by Core Count in Tablets: 2012 .............................. 135Figure 61 Primary Camera Pixel Support in Media Tablets: 2012 ................................ 136Figure 62 Percentage of Media Tablets with 1080P Video Recording ......................... 137Figure 63 Tablet Market Share by OS Standard: 2012 ................................................ 137Figure 64 Estimated Tablet Shipments by Vendor: 2012 ............................................. 138Figure 65 Top 10 Media Tablet Suppliers: 2012 .......................................................... 139Figure 66 GLBenchmark Comparison of Qualcomm Adreno GPUs ............................. 150Figure 67 Com-Processor vs. Apps Processor Revenues: ‘12..................................... 154Figure 68 Standalone Application Processor vs. Com-Processor Growths .................. 155Figure 69 Integrated Com-processor Growth by Cellular Standard: '11-'17 ................. 156Figure 70 Standalone Application Processor Vendor Market Shares: ‘12 .................... 157Figure 71 Tablet Application Processor Vendor Market Shares: '12 ............................ 158Figure 72 Intel’s Single-core Z2460 Mobile Application Processor .............................. 170Figure 73 NEC Mobile Application Processor Migration Plan ...................................... 179Figure 74 Renesas Mobile MP6530 Platform Diagram ................................................ 183Figure 75 Exynos3 Application Processor Block Diagram ........................................... 186Figure 76 Telechips TCC88xx Application Processor Block Diagram .......................... 191Figure 77 TI OMAP44x Block Diagram ........................................................................ 193Figure 78 Block Diagram of OMAP5430 Standalone Application Processor ................ 195Figure 79 Smartphone Segmentation Growth Trends: '10-'17 ..................................... 198Figure 80 Digital Baseband Com-Processors by Air Interface: 2012 ........................... 201Figure 81 Digital Baseband Com-Processors by Air Interface: 2017 ........................... 201Figure 82 LTE/3G Standalone versus Com Processor Usage in 2012......................... 202Figure 83 LTE/3G Smartphones by Core Count: 2012 ................................................ 203Figure 84 Com-processor Growth by Air-Type: '11-'17 ................................................ 203Figure 85 Communications Processor Vendor Market Shares: '12 .............................. 204Figure 86 TD-SCDMA Communications Processor Market Shares: '12 ....................... 204Figure 87 Leadcore Technology TD-SCDMA Com-Processor Block Diagram ............. 216Figure 88 Renesas MP5232 LTE Communication Processor Diagram ........................ 224Figure 89 ST-Ericsson U8500 HSPA Dual Com-Processor ......................................... 237Figure 90 Overall Cellular RF Transceiver Market by Vendor: ‘12 ............................... 244Figure 91 GSM/GPRS RF Transceiver Shipments by Vendor: '12............................... 245Figure 92 CDMA/1xEV-DO Radio Transceiver Shipments by Vendor: '12 ................... 246Figure 93 WCDMA RF Transceiver Shipments by Vendor: '12 .................................... 247Figure 94 TD-SCDMA RF Transceiver Shipments by Vendor: '12 ............................... 248Figure 95 TD-SCDMA RF Transceiver Shipments by Vendor: '12 ............................... 249Figure 96 Fujitsu’s MB86L01A: Multiband WCDMA/EDGE Radio Block Diagram........ 258Figure 97 Cellphone Power Amplifier Market by Vendor: 2012 .................................... 282Figure 98 3G/4G Cellular Handset Growth: '11-'17 ...................................................... 283

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Figure 99 Cellular Terminal Growth by Type: '11-'17 ................................................... 286Figure 100 TI Stereo Audio Codec Block Diagram ...................................................... 314Figure 101 PMU Revenue by Type ABB, CPU, Battery Charge, and Audio Hub: '12 .. 317Figure 102 PMU Revenue Market Share Leaders: 2012 ............................................. 318

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TABLES

Table 1 Migration of Baseband Modems from 2G to 4G+ ................................................ 8Table 2 DBB Processor Forecasts by Air Type: '12-'17 ................................................. 29Table 3 Comparison of 4G Technologies: WiMAX versus Cat 2-LTE ............................ 30Table 4 TDD Exclusive features .................................................................................... 31Table 5 LTE Spectrum and Active Global Operator Summary ....................................... 33Table 6 LTE/3G Smartphone Supplier Quarterly Shipments: 2011 & 2012. ................... 45Table 7 Standalone LTE Digital Baseband Forecasts by Type: '12-'17 .......................... 47Table 8 LTE/3G Baseband Application Processor Forecasts: ’12-17 ............................. 48Table 9 Qualcomm’s Thin Modem Lineup ..................................................................... 74Table 10 Integrated BB/Radio Chip Forecast: '12-'17 .................................................. 109Table 11 Comparison of Single-Chip GSM & EDGE Modems ..................................... 111Table 12 Comparison of Multi-Chip, Single-Package GSM, & EDGE Modems ............ 112Table 13 Comparison of Single-Chip GSM & EDGE Modems ..................................... 113Table 14 Five-Year Forecast for Smartphone and Media Tablets ................................ 127Table 15 Smartphone Forecast by Segment from 2011-2017 ..................................... 128Table 16 Top 40 Smartphone Supplier Unit Market Shipments by Qtr. '11-'12 ............ 133Table 17 Media Tablet Forecast: 2012-2017 ............................................................... 138Table 18 Tablets Supplier Shipments and Market Shares '11-'12 ................................ 141Table 19 Most Popular Video Screen Sizes & Screen Ratios ...................................... 144Table 20 Resolutions of Common 4K Video Formats .................................................. 145Table 21 Enhancements of Snapdragon S3 CPU 28nm over Cortex A9 Licensees..... 147Table 22 GPU Comparison Performance in Multiply & Adds ....................................... 149Table 23 Brief Comparison of CPUs Used In Application Processors .......................... 151Table 24 ARM CPU Usage by Application Processor Vendors .................................... 152Table 25 Application & Com-Processor 5-Year Forecast by Type: '12-'17 ................... 159Table 26 High Performance Standalone Application Processors ................................. 161Table 27 High Performance Standalone Application Processors (Continued).............. 162Table 28 Standalone Application Processor Features & Usage ................................... 163Table 29 Stand-alone Application Processor Features & Usage (continued 1) ............ 164Table 30 Stand-alone Application Processor Features & Usage (continued 2) ............ 165Table 31: NVIDIA Tegra 250 Applications Processor Features.................................... 174Table 32 NEC EMMA ARM-based Application Processor Family ................................ 181Table 33: TI OMAP34x, OMAP36x & OMAP44x Applications Processors ................... 192Table 34 Communication Processor Forecast ’12-‘17 ................................................. 206Table 35 Single, Dual and Quad-core Communications Processors ............................ 207Table 36 Single, Dual and Quad-core Communications Processors (continued) ......... 208Table 37 3G DBB Communication Processor Capability ............................................. 209Table 38 3G DBB Communication Processor (Continued) .......................................... 212Table 39: Qualcomm Snapdragon Communication Processors ................................... 228Table 40 LTE Spectrum FDD Bands 1-20 and Region of Usage ................................. 241Table 41 LTE FDD Spectrum Bands 21-28 and Regions of Usage ............................. 242Table 42 LTE TDD Spectrum Bands 33-44 ................................................................. 243Table 43 Radio Transceiver 5-Year Forecast by Wireless Technology ........................ 250Table 44 2G/3G/4G RF Transceiver Supplier Profiles ................................................. 251Table 45 Frequency Bands & Channel Widths for LTE ................................................ 270Table 46 Qualcomm Cellular Baseband/Transceiver Modes Supported ...................... 277Table 47 Global UMTS-FDD Paired bands and Regions of Coverage ......................... 284Table 48 Cellular Power Amplifier Unit Forecast by Air Technology: '12-'17 ................ 287

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Table 49 Smartphone Band Usage for Apple and Samsung During 2012 ................... 288Table 50 Cellular Power Amplifier Unit Forecast by Handset Type: '12-'17.................. 289Table 51 Cellular Power Amplifier (PA & PAM) Forecast by Type: '12-'17 ................... 290Table 52 Anadigics Amplifier Modules for CDMA, GSM & HSPA ................................ 292Table 53 Avago’s Lineup of CDMA & WCDMA Power Amplifiers ................................ 293Table 54 Mitsubishi GaAs Hybrid Devices for CDMA & WCDMA ................................ 295Table 55 RFMD’s 3G WCDMA/HSPA and CDMA EV-DO Power Amplifiers................ 297Table 56 Skyworks' Cellular 2G & 3G PA/FEM Product Line ....................................... 300Table 57 TriQuint’s Lineup of WCDMA/HSUPA & HEDGE Power Amplifiers .............. 302Table 58 RFMD 3G/4G LTE Most Recent Power Amplifiers ........................................ 307Table 59 Cellphone Power Management Unit Forecast by Type: '12-'17 ..................... 319