centro de electrónica industrial · 2013. 2. 8. · vinm dc/dc 28vin 12vout no reg 5vout reg...
TRANSCRIPT
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www.cei.upm.es
ce
i@u
pm
.es
Universidad Politécnica de Madrid
Centro de
Electrónica Industrial
Power Electronics Modeling Activities
2011 2
Sasp
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2011 3
PTModel
2011 4
Powercad
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2011 5
PowerSim
Bypass
Line
Battery
PFC Boost
Average current control
HBCC
Voltage mode
2011 6
Tramst
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2011 7
Demomag
2011 8
Scope
Automovile
Aeronautics
Aerospace
Data Servers
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2011 9
From the COMPONENT
to the SYSTEM
Virtual Prorotyping
2011 10
Component Level
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2011 11
PExprt Model
Over-Voltage at the Switch because
of the leakage Inductance
Converter Losses: 1.7 W
Saturation & Hysteresis
Virtual Prototyping
2011 12
Virtual Prototyping
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2011 13
But for SYSTEM INTEGRATION,
you need top-down approach
Virtual Prototyping
2011 14
System level
28VDC
12VDC
Intermediate
bus
EMI Filter
Protections
28VDC
28VDC_REG Parallel DC/DC
converters
Multi-Output
Converter
15VDC 5VDC
DC/DC
converter
DC/DC
converter
Distributed power system d
c/d
c c
on
ve
rters
d
c/d
c c
on
ve
rte
rs
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2011 15
Emergency
Emergency
Normal
28VDC
12VDC
Intermediate
bus
EMI Filter
Protections
28VDC
28VDC_REG Parallel DC/DC
converters
Multi-Output
Converter
15VDC 5VDC
DC/DC
converter
DC/DC
converter
System level
Load
Load
Load
18,5V
36V
24V
32V
Power budget
2011 16
28VDC 12VDC
Intermediate
bus
EMI Filter
Protections
28VDC
28VDC_REG Parallel DC/DC
converters
Multi-Output
Converter
15VDC 5VDC
DC/DC
converter
DC/DC
converter
System level
Dynamic analysis
0s 100us 200us 300us 400us 500us
0V
2.0V
4.0V
6.0V
stability?
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2011 17
28VDC
12VDC
Intermediate
bus
EMI Filter
Protections
28VDC
28VDC_REG Parallel DC/DC
converters
Multi-Output
Converter
15VDC 5VDC
DC/DC
converter
DC/DC
converter
System level
Analysis of protections
SSPC
protection?
Inrush current
2011 18
28VDC
12VDC
Intermediate
bus
EMI Filter
Protections
28VDC
28VDC_REG Parallel DC/DC
converters
Multi-Output
Converter
15VDC 5VDC
DC/DC
converter
DC/DC
converter
System level
Large signal stability analysis
SSPC
Input current
-1
0
1
2
3
4
5
6
7
8
9
0,00E+00 5,00E-02 1,00E-01 1,50E-01 2,00E-01 2,50E-01 Large signal stability?
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2011 19
28VDC
12VDC
Intermediate
bus
EMI Filter
Protections
28VDC
28V_REG Parallel DC/DC
converters
Multi-Output
Converter
15VDC 5VDC
DC/DC
converter
DC/DC
converter
Cross regulation
Coupling?
System level
2011 20
28VDC
12VDC
Intermediate
bus
EMI Filter
Protections
28VDC
28V_REG Parallel DC/DC
converters
Multi-Output
Converter
15VDC 5VDC
DC/DC
converter
DC/DC
converter
System level
Paralleling converters
Load sharing?
Stable?
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2011 21
System level
Share
Vinp
Vom
Vop
Vinm
DC/DC
28V/5V
(parallel option)
Share
Vinp
Vom
Vop
Vinm
DC/DC
28V/5V
(parallel option)
A
A
A
R5VP
Imbalance
AM1
AM2
AM3
Vinp
Vom
Vop
Vinm
DC/DC
270V/28V
+
V V28V
Share
Vinp
Vom
Vop
Vinm
DC/DC
28V/5V
(parallel option)
Vinn
Vinp
BatterySubsystem
+
V Vbat
STEP1
A
AM4
A
AM5
Vinp
Vom
Vop
Vinm
DC/DC
28V/12V
MonosalidaRegUnidireccionalConLimitadorRendVariable
Vinp
Vom
Vop
Vinm
270V/48V
DC/DC
MonosalidaRegUnidireccionalResistSalidaVariableRendVariable1
Vinp
Vom
Vop
Vinm
DC/DC
270V/28V
MonosalidaRegUnidireccionalResistSalidaVariableRendVariable2
E270V
R48V R12V
TRAPEZ1 TRAPEZ2
V2on
V2op
Vinp
Vom
Vop
Vinm
DC/DC
28VIn
12Vout no reg
5Vout reg
(without Io limiter)
(with Io limiter)
MultisalidaUnidireccional
R12VM
R5VM
TRAPEZ4
TRAPEZ5
12V carga regulada
12V carga no regulada
5V carga regulada
5V carga regulada de
alta potencia
Parallel converters
Main bus
270V
Secondary bus 24V 48V no regulated
Battery
DC/DC ?
Library
2011 22
Protections
dc/dc converters
Filters
Drivers
Non-linear loads
Validation
SABER sketch
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2011 23
-0,31%
-1,20%
1,15%
0,00%
-2,00%
-1,50%
-1,00%
-0,50%
0,00%
0,50%
1,00%
1,50%
2,00%
20 25,5 28 32
Error at the input current
Input voltage
Input current
2
2,5
3
3,5
4
4,5
20 25 30
Maximum error
1.2%
Validation
Power Consumptions I
Input voltage
measurements
simulation
2011 24
Validation
Power Consumptions II
-0,40%
-0,04%
1,05%
-1,26% -2,00%
-1,50%
-1,00%
-0,50%
0,00%
0,50%
1,00%
1,50%
2,00%
20 25,5 28 32
Input voltage
Error at the input current
Maximum error
1.26%
76
77
78
79
80
81
82
83
84
85
20 22 24 26 28 30 32
Measurements
Simulation
Input power
Input voltage
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2011 25
inrush current (32V)
-2
0
2
4
6
8
10
12
14
0,04 0,05 0,06 0,07 0,08
iin_meas
iin_sim
11.39 A
10.58 A
Vg = 32V Voltage drop at bus 1.5V
simulation
measurements
Inrush current
Transients Validation
power-up 20V
-2
0
2
4
6
8
10
0,00E+00 5,00E-02 1,00E-01 1,50E-01 2,00E-01 2,50E-01
iin_meas
iin_sim
simulation
measurements
Vg = 20V Voltage drop at bus 0.4V
2011 26
Large signal instability
(during start-up)
Caída 0.4V Start-up
Validation
power-up 20V
-2
0
2
4
6
8
10
0,00E+00 5,00E-02 1,00E-01 1,50E-01 2,00E-01 2,50E-01
iin_meas
iin_sim
simulation
measurements
Vg = 20V Voltage drop at bus 0.4V
-1
0
1
2
3
4
5
6
7
8
9
0,00E+00 5,00E-02 1,00E-01 1,50E-01 2,00E-01 2,50E-01
Vg = 20V Caída en bus 1.5V
-1
0
1
2
3
4
5
6
7
8
9
0,00E+00 5,00E-02 1,00E-01 1,50E-01 2,00E-01 2,50E-01
Vg = 20V Voltage drop at bus 1.5V
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2011 27
BR&TE
Li-Ion
Battery
Fuel-Cell
Stacks
Inverter
Motor + Load
Series
Boost Converters
Contactors
Contactors
Non-linear
Loads
co-simulation
Maned Fuel Cell Plane
2011 28
Modeling Power Electronics for Space
LISA Pathfinder
Solid State Power Controllers (SSPCs) Modeling and simulation of solar powered distributed power architectures
http://www.activemedia.com.sg/IMAGES/MATLAB-logo.JPGhttp://crisa.es/index.htm
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2011 29
Fuel Cell powered Power Electronics
•More Electric Aircraft Arquitectures modeling and simulation •High Voltage Distribution Network (270VDC) •Intelligent load management •Auxiliary Power Units based on Fuel Cells
INNOVA “Power distribution and management of High Voltage loads”
CENIT DEIMOS “ Development and Innovation on Polimer Membrane and Solid Oxid Fuel Cells
2011 30
BATTERY MODELING
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2011 31
BATTERY MODEL
INTERNAL PARAMETERS
INPUTS
-INSTANT CURRENT
-INSTANT TEMPERATURE
-NUMBER OF CELLS
OUTPUTS
-STATE OF CHARGE
-CELL VOLTAGE
-BATTERY VOLTAGE
-INSTANT AND GLOBAL
DISCHARGE TIME
2011 32
Simplorer Development
BLOCKS
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2011 33
Validation
LI-IÓN
BATTERY HP 1100mAh 3.7v
Current discharge 0.27C
0 0.5 1 1.5 2 2.5 3 3.5 40
0.5
1
1.5
2
2.5
3
3.5
4
4.5
t(h)
vcel
(v)
modelo
ensayo
ce
i@u
pm
.es
Universidad Politécnica de Madrid
Circuit Breakers
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2011 35
Motivation
Every electric circuit requires protection against shortcircuits and
overloads.
The rest of components need to be protected and isolated from
the source of failure.
There are many kinds of switches available:
Fuses Circuit Breakers SSPCs
2011 36
Model scope
Many types of switches - difficult development of a general model if
trying to reproduce its physical components.
Air Circuit
Breaker
Bimetalic
strip
Magnetic
Circuit Breaker
X-ray
Thermal Circuit
Breaker
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2011 37
Behavioral Model
Main Circuit
Model I – Calculates the Trip time according
to the Tripping-Time Characteristics
Input – I (A) Output – t
(s)
Model II – Data acquisition (Left) and
Simimulation Data Comparator (Right)
Model III – Arc Extinction
The main strength of this model is that
its parameters: R4, R5, C3, C4 can be
readjusted to emulate the behavior of
any switching device tested.
Data acquisition and
Look-up Table Configuration
Values can be reset for any device.
Verifies Delay Time (MI) vs. Delay
Time (Look-up Tables)
Verification Stage
2011 38
Results obtained
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0
100
200
300
400
500
600
i2t
Model
Real Data
1.5 2 2.5 3 3.5 4 0
20
40
60
80
100
120
140
160
180
200
i2t
Model
Real Data
A true i2t used as a tripping control device predicts a wrong behavior for
higher currents.
Correct behavior for the highest currents.
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ce
i@u
pm
.es
Universidad Politécnica de Madrid
Power Distribution
Architectures Design Tool
Leonardo Laguna Ruiz
2011 40
Introduction
Examples of power systems:
Mobile devices
Computers
Airplanes
Automobiles
Critical design factors:
Time to market
Size
Energy efficiency
Cost
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2011 41
Introduction
Main problems when designing a power system:
Many possible solutions
Prototyping is unfeasible
Solution: Simulation
Problems with simulation
Still many possible solutions
Complex models are time
consuming
Our approach: Analyze a LARGE number of solutions with a little less accuracy
After that: Analyze the BETTER solutions with more detail
Option 1) or 2) ???
Which converters in each case ???
1)
2)
2011 42
Design tool description
Characteristics of the design tool:
Analyze a wide range of
possibilities (architectures &
components)
Establish a trade-off among
Efficiency, Cost and Area
Other valuable characteristics
Follows a Top-Down design
methodology
Can interact with other tools
Provides a generic optimization
framework
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2011 43
Example application
Feed 3 loads from a source using 100 converters from a database:
Source → 12 V
Load1 → 1.1 V
Load2 → 3.3 V
Load3 → 5.0 V
Step 1: Architecture Generator
Problem definition Converter database
(Some) Possible architectures
Converters with Losses, area and cost models
Input:
?
Output:
2011 44
Evaluation criteria
Problem specification
16 different architectures: (3-6 converters each)
3 brands, 6 different output power for
each converter
Selection criteria
Cost ≈ cost of components
Area ≈ area of components
Efficiency: depending on the loads
behavior
Step 2: Architecture and component
selection
Total combinations: 44,113,248 But we want only the best 8
%
Cost Area
Losses
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2011 45
Optimization (search) of best solutions
▪ How to find the best 8 among 44,113,248 solutions? Evolutionary algorithms
• Harmony search
• Genetic algorithms
• Tabu search
Using Harmony Search less than 0.05% of solution space is explored to find the optimal solution
- Objective function of the 8th solution
- Objective function of the 1th solution
Searching the best solutions with Harmony Search
ce
i@u
pm
.es
Universidad Politécnica de Madrid
Modeling a Power Delivery
Network (PDN)
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2011 47
Introduction
The power supply cannot be connected directly to the Vdd and Gnd terminals of the IC. It is necessary to use wires, these wires creates both a DC drop and time-varying fluctuation of the voltage. The voltage fluctuation can cause the following problems:
Reduction in voltage across the power supply terminals of the IC that slows down the transistor or prevents the transistor from switching states.
Increase in voltage across the power supply terminals of the IC, which creates reliability problems.
Timing margin errors caused by degraded waveforms at the output of the drivers.
2011 48
PDN elements and the range of operations
frequencies
Nabil, S.M.; El-Rouby, A.B.; Hussin, A.; “A complete solution for the power delivery system (PDS) design for high-speed deigital systems”;Design & Technology of Integrated Systems in Nanoscal Era, 2009. DTIS '09. 4th International Conference on; 2009 , Page(s): 179 - 183
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2011 49
VRM
Provides the power to the chip.
The main influence is in low frequency (below of megahertz range).
L. D. Smith, R. E. Anderson, D. W. Forehand, T. J. Pelc, and T. Roy, “Power distribution system design methodology and capacitor selection for modern CMOS technology,” IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp. 284-291, Aug. 1999.
2011 50
Decoupling capacitors
The capacitors are surface mount devices (SMDs) attached to pads on the PCB or package. When SMD capacitors supply charge (or current), the current leaves the voltage plane, travels through the voltage via, flows through the capacitor, and returns through the ground via and then to the ground plane. These contributes to increase the ESL.
L. D. Smith, R. E. Anderson, D. W. Forehand, T. J. Pelc, and T. Roy, “Power distribution system design methodology and capacitor selection for modern CMOS technology,” IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp. 284-291, Aug. 1999
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2011 51
Modeling the planes
Planes play a very important role at high frequencies by acting as high-frequency capacitors, serving as conduit for the transportation of current, and supporting the return currents of the signal lines referenced to it. Planes are large metal structures separated by a thin dielectric and are invariably used in all high-frequency packages and boards for power delivery and shielding.
Madhavan Swaminathan; A. Ege Engin, Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007.
2011 52
Vias and chip characteristics
Each new technology generation results in a rapid increase in circuit densities and interconnect resistance, faster device switching speeds, and lower operating voltages. These trends lead to microprocessor designs with increased current densities and transition rates and reduced noise margins. The large currents and interconnect resistance cause large, resistiveIR voltage drops, while the fast transition rates cause large inductive LdI/dt voltage drops in on-chip power distribution networks.
M. Swaminathan, J. Kim, I. Novak, and J. P. Libous, “Power distribution networks for system on package: status and challenges,” IEEE Transactions on Advanced Packaging, vol. 27, no. 2, pp. 286-300, May 2004
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2011 53
PCB simulated in Q3D Extractor
2011 54
Model in Simplorer
The parameters extracted form the PCB are simulated using a signal in a trace and showing the efects of this parameters in one point of the trace and in an adjacent trace.
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2011 55
Results @ 100 MHz
The signal has a small delay and a voltage drop.
The adjacent trace has a reflected signal.
Signal Signal affected by the parameters Signal reflected in other trace
2011 56
Results @ 1GHz
The signal is afected by the PCBs parameters.
The adjacent trace continues having a reflected signal.
Signal Signal affected by the parameters Signal reflected in other trace
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2011 57
PCB Buck converter simulated in Q3D Extractor
2011 58
Simplorer simulation
The PCB of the typical VRM (Buck converter) is simulated with Q3D Extractor and the parameters are simulated in Simplorer.
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2011 59
Results
The graph shows the output voltage of the VRM before and after the PCB parameters.
It can be noticed that the voltage after the PCB parameters the voltage is lower.
Voltage before the PCB parameters Voltage after the PCB parameters
2011 60