ch7 plasma -...
TRANSCRIPT
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Ch7 Plasma
Introduction to Semiconductor Processing
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What is a Plasma?4th state matterIonized gasIons, electrons, and neutral species
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Plasma Characteristics
0.001%
(non equilibrium)
HDP 1%(100%)
Large number of species
Ar
O
O2 O2+
Ar+
e-O+ nn, Tn
ne, Teni, Ti
ni,~ nenn>>ni,ne
Te>>Ti, Tn
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- RF
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Photo Courtesy: UT Dallas
Wafer location:
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(Ionization)
e + A A+ + 2 e
Threshold energy ~ ionization energy
Electron-Impact Reactions -- Ionization
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:
e- + AB A + B + e-
CVD Not important for sputtering (Why?) Eg.: O2 + e
Cl2 + e SiH4 + e
Electron-Impact Reactions -- Dissociation
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- (Excitation Relaxation)
e + A A* + e
A* A + h (Photos)
endpoint
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Endpoint Detection
Forming Cl radicalsCl2 + e 2Cl + e
Al etching:Al + x Cl AlClx (x=1~3)
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CF4
e + CF4 CF3 + F + e
4F + SiO2 SiF4(g) + O2(g)
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PECVD SiH4 NO2 ()e + SiH4 SiH2 + 2H + e
e + N2O N2 + O + e
SiH2 + 3O SiO2 + H2O
PECVD
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Mean Free Path vs. Plasma Stability
?1. (fast electron
vs. slow molecules/atoms)2. (
),
3. (760 torr)(Electric field)(glow-to-arc transition)Calculation of mfp:
=
n: density, : cross section
Ground
d
V
V/d E E/N
d
Low P
High P
VGround
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vs.
1 eV = 11594 K (~2 eV)
v ~ 5.9 *107 cm/sec ~ 1.33 * 107 mph Ar+ (~0.05 eV)
v ~ 3.46 *104 cm/sec ~ 774 mph Room Temperature ( ~0.026 eV)
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:
F = qvB
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, E
f(E)
2 - 3 eV
(Boltzmann Distribution)
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Sheath Formation
*Figure Courtesy: Michael A. Lieberman, Principles of Plasma Discharges and Materials Processing
Why + potential??
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+-+-+-+-+-++
++-+-+-+-++
++-+-+-+++
+++-+-+++
+++-++++
+++++++
Vp
Vf
x
(Ion Bombardment)
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Spatial and Temporal Potential Distribution
*Figure Courtesy: Michael A. Lieberman, Principles of Plasma Discharges and Materials Processing
Plasma always remains positive in the bulk. The time-averaged bulk potential depends on the driving electrode voltage amplitude. When the frequency is high, electrons see the change of the field; ions (heavy) only see the averaged field.
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CVD
Vp = 10 20 V
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V 2
A2
A1
V1/V2 =(A2/A1)
V1 = 200 to 1000 V
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V1
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Plasma
Shower head:
ESC ( )
BSC ( )
B-field
Key challenge:
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H2O, O2
OO H
H2O, CO2,
O O OH H
Remote-plasma key features:1.
2.
Major idea:1. Electron decays rapidly
upon formation2. No E-field to heat the
electrons at the downstream
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ICP (Inductively Coupled Plasma)
RF
ICP Key Feature: independent control of
_________________ and ___________________
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RF
ECR
ECR
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Advantages/Uniqueness of Plasma Processes
Existing of reactive radicals under low temperatureUnique reaction pathwayAdjustable ion bombardment energyGap filling capability (e.g. 50 nm trench)Low operating cost (gas vs. wet chemicals)System (chamber) cleaning (gas phase process).
/ColorImageDict > /JPEG2000ColorACSImageDict > /JPEG2000ColorImageDict > /AntiAliasGrayImages false /DownsampleGrayImages true /GrayImageDownsampleType /Bicubic /GrayImageResolution 300 /GrayImageDepth -1 /GrayImageDownsampleThreshold 1.50000 /EncodeGrayImages true /GrayImageFilter /DCTEncode /AutoFilterGrayImages true /GrayImageAutoFilterStrategy /JPEG /GrayACSImageDict > /GrayImageDict > /JPEG2000GrayACSImageDict > /JPEG2000GrayImageDict > /AntiAliasMonoImages false /DownsampleMonoImages true /MonoImageDownsampleType /Bicubic /MonoImageResolution 1200 /MonoImageDepth -1 /MonoImageDownsampleThreshold 1.50000 /EncodeMonoImages true /MonoImageFilter /CCITTFaxEncode /MonoImageDict > /AllowPSXObjects false /PDFX1aCheck false /PDFX3Check false /PDFXCompliantPDFOnly false /PDFXNoTrimBoxError true /PDFXTrimBoxToMediaBoxOffset [ 0.00000 0.00000 0.00000 0.00000 ] /PDFXSetBleedBoxToMediaBox true /PDFXBleedBoxToTrimBoxOffset [ 0.00000 0.00000 0.00000 0.00000 ] /PDFXOutputIntentProfile () /PDFXOutputCondition () /PDFXRegistryName (http://www.color.org) /PDFXTrapped /Unknown
/Description >>> setdistillerparams> setpagedevice