challenges of vacuum roll-to-roll processing of organic solar cells … · 2018-10-08 ·...
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Challenges of vacuumroll-to-roll processing of organic solar cells and encapsulation processesEritt, Michael; Falkenberg, Christiane; Wichtendahl, Ralph
Heliatek GmbH
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Agenda
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1. HeliaFilm® – motivation and benefits
2. Current processes for OPV
3. Upscaling – from pilot to production
4. Summary and outlook
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HeliaFilm®
Motivation and benefits
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com 4
The urban landscape of the futureBuildings will have active façades and cars will be emission free
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HELIAFILM®
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com 5
Key material features of HeliaFilm®The freedom of possibilities
Flexible Exhibiting minimum radius of 10 cm
Ultra-lightWith an extremely low weight of 500g/m²
TransparentAchieving up to 50% transmission
Light with 6 % efficiency
Ultra-thinLess than 1 mm thin solar film
Numerous colorspossible in shades
of grey, blue and green
Custom-designedFlexible dimensions
in lengths
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CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Physics: p-i-n tandem devices
6
Stack design and engineering
TCO front electrode
-
+
p
n
p
n
Organic vacuum deposited layers:
Total thickness 250 nm
Plastic substrate
+ + + + + + + + + + + + + + +
Organic absorber 1
- - - - - - - - - - - - - - -+ + + + + + + + + + + + + + +
Organic absorber 2
- - - - - - - - - - - - - - -Metal back electrode
d
Optical engineering:
Absorber layers are placed in the respective interference maxima.
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CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Efficiency Development
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0
2
4
6
8
10
12
14
16
2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
Roadmap
Actual
Continuous progress towards higher efficiencies
Effic
ienc
y [%
]
10.7%9.8%
8.3%
World Record13.2%
12%
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HeliaFilm®
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First pilot line implementing vacuum roll-to-roll production
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HeliaFilm®: Enabling partner innovation
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Concrete
GlassPolymer
sheetsFoils
PVC membrane
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Steel Aluminum
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Current processes for OPV
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Process tools for OPV manufacturing
1) Substrate structuring
at Heliatek
laser
nitrogen
vacuum
curinglamination
Encapsulationcassette
lasers
2) Vacuum deposition
org. stack
back electrode
back film
Pilot line
300 mm film with
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Unique R2R vacuum vapor process
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Precise and homogenous production process for little upscaling losses
Roll-to-roll processContinuous process500 m long rolls300 mm wide web
Vapor depositionLinear sourcesHomogenous depositionMulti-layer stackLow temperature (120 °C)
Laser structuringPrecise processUltra narrow scribes Minimum area losses
Heliatek Company Presentation
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com 14AIMCAL 2016
Manufacturing Process – front endSequential processes
Cross section: Module out of the front end
TCO coated PET substrate
Substrate, PETTCO
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Manufacturing Process – front endSequential processes
P1Cross section: Module out of the front end
P1 – scribing of the front contact
SubstrateTCO
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Manufacturing Process – front endSequential processes
P1Cross section: Module out of the front end
Evaporation of the organic multi-layer stack
Substrate, PET
Tandem absorberTCO
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Manufacturing Process – front endSequential processes
P1P2Cross section: Module out of the front end
P2 – scribing of the organic
Substrate, PET
Tandem absorberTCO
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Manufacturing Process – front endSequential processes
P1P2Cross section: Module out of the front end
Evaporation of the transparent or opaque back contact
Substrate, PET
Tandem absorberBack contact
TCO
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Manufacturing Process – front endSequential processes
P1P2P3Substrate, PET
Tandem absorberBack contact
TCO
Cross section: Module out of the front end
P3 – patterning of the back contact
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Manufacturing Process – front endSequential processes
P1P2P3Substrate, PET
Tandem absorberBack contact
TCO
Back film
Cross section: Module out of the front end
Back film lamination
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Manufacturing Process – front endSequential processes
P1P2P3Substrate, PET
Tandem absorberBack contact
TCO
Back filmactive areaactive area
Cross section: Module out of the front end
Functional principle of HeliaFilm
Series interconnection of diodes
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Transfer from vacuum tool
Contacting with metal stripe
Adhesive application front and back side
Lamination process
Curing step
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Atmosphere
Inert atmosphere
R2R-encapsulation system
Adhesive
Metal stripe
Back filmBacksheet
Cross section: Module out of the back end
FrontsheetSubstrate, PET
Manufacturing Process – back endSequential processes
Protect active OPV film against moisture/oxygen
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Upscaling – from pilot to production
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Challenges for (pilot) production
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Pilot manufacturing line
- Material based on polyester film
- Flexible film material and HeliaFilm product
- 300 mm film width
Front end
- vacuum processes
- film handling without surface contact
Back end
- encapsulation in inert atmosphere
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Vacuum processing
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Organic stack and metal electrode deposition in high vacuum continuously
Structuring by laser processes
- Organic stack
- Metal electrode
Transport without contact of deposited film surface
- film handling
- defined temperature control
Deposition tool
- Laser process in vacuum
- Clean process no shorts by re-deposited particles
- Handling in pilot tool ~ 50 m (w/o surface contact)
- Homogeneous substrate heating
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Encapsulation process
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Film handling and process in inert atmosphere
Material transfer via cassette
Gas flow
- conditioning: nitrogen flooding
- process: N2+pre-treatment exhaust
Critical parameter: oxygen
- tracking the oxygen concentration encapsulation tool
cassettew/substrate
N2inlets
barrierfilm
valve
encaps.HeliaFilm
lamination
pre-treatment
curing
exhaust
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Encapsulation process – inert atmosphere
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Base level of oxygen concentration 100 ppm
- w/o process
Start of pre-treatment process exhaust open
- immediate increase of oxygen level
Root cause
- Leakage of chambers – contamination w/ air
Optimized process: slight increase but stable
optimization
process start
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Encapsulation process – inert atmosphere
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Encapsulation of 250 modules
Barrier film material exchange after 150 modules
Short interruption of N2 atmosphere
Lead to decrease of Gsext until #170
After recovery of N2 atmosphere normal Gsext
O2 concentration
cha
nge
of
ba
rrier
film
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
From ramp up to current production
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curve of best module out of current production
PCE is 7,7%
Fill factor is 66.4%
transfer of lab results successfulI-V-curve from a module out of the production
present results
Industrialization the patterning of organic solar cells
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 10 20 30 40 50
I in
A
V in V
aggregated data
VOC 41.15 VISC 1113.5 mAFF 66.4%
Vmpp 31.89 VImpp 953.6 mAPmpp 30.409 W
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Summary
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Results proven in pilot line
- Transfer from lab to R2R manufacturing – film handling / deposition /encapsulation
- Complete roll-to-roll process for OPV manufacturing
- Lifetime capabilities of R2R process
- Highest power conversion efficiency (PCE) of active area 7,7%
First pilot projects together with partners installed
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Realized pilot installations
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HeliaFilm
glass facade
… on PVC membrane … on concrete
CONFIDENTIAL / 2016 June 2nd© Heliatek GmbH www.heliatek.com
Outlook
32
Next generation of manufacturing tools
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Upscaling of pilot line processes to mass production project Fab2 started
Requirements
- current pilot line with 300 mm film width upscaling to 1200 mm
- accurate film handling / deposition equipment – defined temperature regime
- sequencing of proven laser patterning across wider web
- improved encapsulation process
- flexible product layout in width and length of the solar film
Next gen of OPV production tools will be deployed in Dresden
Thank youfor your attentionwww.heliatek.com
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Dr. Michael ErittManager Back End
Heliatek GmbHTreidlerstraße 301139 Dresden, GermanyT (+49-351) 213 034-432F (+49-351) 213 034-40
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