circuits multi-projets - mycmp · teledyne dalsa midis platform cmp annual users meeting, 4 feb....

Circuits Multi-Projets

MPW Services Center for IC / MEMS Prototyping

http://cmp.imag.fr

Grenoble - France

CMP annual users meeting, 4 Feb. 2016, PARIS

MEMS Prototyping

Bulk Micromachining

MUMPs from MEMSCAP

Teledyne DALSA MIDIS

Micralyne MicraGEM-Si

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MEMS Processes at CMP


• Compatible with electronics• Front side bulk micromachining• ams 0.35µ CMOS, SiGe, High Voltage

MPW run turnaround : 8/10 Weeks

Post process turnaround : 5 weeks

Suspended passive device

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Bulk micromachining on CMOS


• Compatible with electronics• Front side bulk micromachining• ams 0.8µ BiCMOS • Anisotropic Etching without

additional mask

Cross section

Suspended passive device

Suspended beams

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Bulk micromachining on BiCMOS


MEMs accelerometer and signal

conditioning

MPW A35C14_5

• Front-end electronics close to MEMS sensor for better signal to noise ratio

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Bulk micromachining designs


Test sensor structures

Fondazione Bruno Kessler

MPW A35C11_5

Thermal inertial sensor

LIRMM – MPW A35C11_6

A CMOS Compatible Ultrasonic Transducer Fabricated With Deep Reactive Ion EtchingLibor Rufer, Christian C. Domingues, Salvador Mir, Valérie Petrini, Jean-Claude Jeannot, and Patrick DelobelleJOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 6, DECEMBER 2006

• Applications : piezoresistive devices, pressure sensors, transducers• Discussions ongoing to provide such MEMS process along with ams 0.35 µ CMOS

Backside bulk micromachining

Integration of MEMS sensor and front-end electronics

Membrane and suspend structure on top of cavity

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Backside bulk micromachining


Design Kit

• Standard DK for the 0.35µ CMOS process C35B4C3 from ams

• Design Rule Manual and technology files provided for MEMS

structures

• MEMS DK for :

Fabrication schedule

• ams C35B4C3 : next run starts on June 13th

Price list

• 650 €/mm² (4 mm² mini) + 3700 € for 10 chips

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Access to bulk micromachining


• Company created in 1997, technology

available through CMP since 1998

• 4 different processes :

PolyMUMPs

SOIMUMPs

MetalMUMPs

PiezoMUMPs

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MEMSCAP


Features• 2 mechanical and 1 electrical layer of polysilicon

• 2 sacrificial layers

• 1 electrical conduction layer

• 1 electrical isolation layer

• Optional post process : etching/release, CO2 drying, sawing

POLY 2

Applications• Acoustics

(microphones)

• Accelerometers

• Micro-fluidics

• Display Technologies

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PolyMUMPs


Features• Silicon On Insulator substrate • Reactive-Ion Etching (RIE)• 10 to 25 µm structural layer• 2 Metal layers

Si

Substrate

METAL

OXYDE

SOIMUMPs

Applications• Gyros• Optical devices• Display technology

Cross section of RIE etching

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SOIMUMPs


Substrate

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MetalMUMPs


Features• Thick metal layers : electroplating Nickel

(18-22 µm)

• Surface and Bulk Micromachining

• Metallization on the walls

Applications• Relays

• Microfluidics

• Magnetic Switches

• RF Devices

Features• Based on SOIMUMPs process

• 0.5 µm Aluminium Nitride piezoelectric layer

• Active piezoelectric device

• 2 Metal layers

Applications• Energy harvesting

• Ultrasonic transducers

• Microphones

• Actuators

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PiezoMUMPs


Design kits and CAD tools• Physical design, DRC :

• Specific MEMS CAD tools :

Fabrication Schedule • PolyMUMPs : 4 runs in 2016 • SOIMUMPs : 3 runs in 2016 • MetalMUMPs : 1 runs in 2016 • PiezoMUMPs : 3 runs in 2016

Price list1

• PolyMUMPs : 3700 $2/4600 $3 (added cost for optional post-process)• SOIMUMPs : 3700 $2/4600 $3

• MetalMUMPs : 3700 $2/4600 $3

• PiezoMUMPs : 3700 $2/4600 $3

1: for 15 identical chips 1cmx1cm fixed size except for SOIMUMPs 0,9x0,9cm2: price for Educational Institutions and Research Laboratories3: price for Industrial Companies

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Access to MUMPs


MEMS Integrated Design for Inertial Sensors (MIDIS™)

Features

• Getter-free high-vacuum sealing allows resonator Q factors > 20,000

• Efficient wafer-level packaging minimizes overall die size

• 1.5 μm feature size in a 30 μm thick membrane

• Comb height control allows out-of-plane sensing

• TSV allows compact design ready for co-packaging

Applications

• Accelerometers

• Gyroscopes

• Resonators

• Inertial sensor combos (Sensor fusion)Inertial sensorCourtesy of CMC

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Teledyne DALSA MIDIS platform


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Cross section of Typical MIDIS process

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Process Design Kit from Teledyne DALSA• Process parameters specifications• Design rules• DRC deck• Technology files for solid model generation• MIDIS solid model generation • Offers a truly representative 3D view of your design• Ready for design review• Multi-physics simulations

Fabrication schedule• 2 runs scheduled for 2016 (1st run March 10th/devices shipment 31st July)

Price list• 9830 $ per 4x4mm minimum for 40 chips

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Access to MIDIS


MicraGEM-Si PlatformMicraGEM‐SiTM technology based on a Silicon‐on‐insulator (SOI) MEMS process features two thick SOI structure layers and gold metallization on the top surface, enabling the design of vertical comb drive actuators along with optically flat silicon surface. Target applications include variable optical attenuators (VOA) and wavelength selective switch (WSS) modules as well as resonators and bio sensors. Horizontal comb drives can also be created for use in inertial sensors.

Academic Price : $4,800 (4mm x 4mm) Fixed sizePrice for Industry : $6,000 (4mm x 4mm) Fixed size

Micralyne MicraGEM-Si process

CMP annual users meeting, 4 Feb. 2016, PARIS 18

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MEMS offer overview


Leveraging MEMS prototyping platforms for research and commercialization

Tuesday, February 23, 2016

9:00am and 2:00pm EST

Webinar offered at different times for your convenience

Webinar organized by CMC Microsystems

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Webinar MEMS 23rd of February

Presentations:• Development and fabrication of micro-electrostatic actuators using a

piston-tube configuration leading to large force generation

• Ultra-clean wafer-level vacuum encapsulation of MEMS devices

Registration :http://www.cmc.ca/NewsAndEvents/Webinars/MEMSWebinar.aspx


http://www.cmc.ca/NewsAndEvents/Webinars/MEMSWebinar.aspx

Thank you !


circuits multi-projets - mycmp · teledyne dalsa midis platform cmp annual users meeting, 4 feb....

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