cld-ap202 rev 4a cree xlamp xhp family leds · 2018. 11. 1. · 2 xlamp ® xhp family led soldering...
TRANSCRIPT
SOLDERING & HANDLING
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
Cree, Inc.4600 Silicon Drive
Durham, NC 27703USA Tel: +1.919.313.5300
WW
W.C
REE.
CO
M/X
LAM
PC
LD-A
P202 R
EV 5
Cree® XLamp® XHP Family LEDs
INTRODUCTION
This application note applies to XLamp® XHP Family LEDs,
which have order codes in the following format.
XHPxxx-xx-xxxx-xxxxxxxxx
This application note explains how XLamp XHP Family LEDs
and assemblies containing these LEDs should be handled
during manufacturing. Please read the entire document to
understand how to properly handle XLamp XHP Family LEDs.
TABLE OF CONTENTS
Handling XLamp® XHP Family LEDs ........................................2
Circuit Board Preparation & Layouts ........................................6
Case Temperature (Ts) Measurement Point ............................9
Notes on Soldering XLamp® XHP Family LEDs .................... 10
Moisture Sensitivity ............................................................... 11
XLamp® XHP Family LED Reflow Soldering
Characteristics ....................................................................... 12
Chemicals & Conformal Coatings ......................................... 13
Assembly Storage & Handling ............................................... 14
Tape and Reel ......................................................................... 15
Packaging & Labels ............................................................... 19
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
2
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
HANDLING XLAMP® XHP FAMILy LEDS
Manual HandlingUse tweezers to grab XLamp XHP Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers.
Do not push on the lens.
Do not apply more than 1000 g of shear force directly onto the lens. Excessive force on the lens could damage the LED.
PCORRECT
X WRONG
Cree recommends the following at all times when handling XLamp XHP Family LEDs or assemblies containing these LEDs:
• Avoid putting mechanical stress on the LED lens.
• Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect
the optical performance of the LED.
• Cree recommends always handling XHP Family LEDs with appropriate ESD grounding.
• Cree recommends handling XHP Family LEDs wearing clean, lint-free gloves.
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
3
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
HANDLING XLAMP® XHP FAMILy LEDS - CONTINUED
Whenever possible, Cree recommends the use of one of the following pick & place tools to remove XLamp XHP Family LEDs from the
factory tape & reel packaging. The following diagrams show examples of pick & place tools to remove XLamp XHP Family LEDs from the
factory tape & reel packaging. Cree and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane.
XHP35 High Density, XHP35.2 High DensityAll dimensions in mm [in]
Tolerance: ±0.025 [0.001]3.175[ø0.125]
3.683[ø0.145]
1.016[ø0.040]
A
A
5
[0.197]
118°
0.188[0.007]
SECTION A-A
Top View Side View
Side View
3.175[ø0.125]
3.683[ø0.145]
1.016[ø0.040]
A
A
5
[0.197]
118°
0.188[0.007]
SECTION A-A
5[0.197]
3.175[ø0.125]
3.683[ø0.145]
1.016[ø0.040]
A
A
5
[0.197]
118°
0.188[0.007]
SECTION A-A
3.175[Ø0.125]
1.016[Ø0.040]
3.683[Ø0.145] 0.188
[0.007]
118°
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
4
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
HANDLING XLAMP® XHP FAMILy LEDS - CONTINUED
XHP35 High Intensity, XHP35.2 High IntensityCree recommends using a spring-relieved pick and place nozzle with a spring constant of 0.05 lb-ft (0.07 N-m).
All dimensions in mm
Tolerance: ±0.001
XHP50, XHP50.2All dimensions in mm [in]
.500 3.400
3.400
.500
Ø 1.000
3.300
.300
2.400
3.300.300
2.400
Top View Side View
.500 3.400
3.400
.500
Ø 1.000
3.300
.300
2.400.500 3.400
3.400
.500
Ø 1.000
3.300
.300
2.400
3.400
.500
.500 3.400
Ø1.000
90.000 ˚
2.157.650
� 5.300
� 4.991
� 3.692
5.300 [Ø 0.209]4.991
[Ø 0.196]
3.692[Ø 0.145]
2.157 [0.085]
0.650 [0.024]
90°
90.000 ˚
2.157.650
� 5.300
� 4.991
� 3.692
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
5
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
HANDLING XLAMP® XHP FAMILy LEDS - CONTINUED
XHP70, XHP70.2All dimensions in mm
2.6950.106
1.1420.045
90°
7.3000.287
6.6840.263 4.400
0.173
A
B
C
D
CAD GENERATED DRAWING,DO NOT MANUALLY UPDATE
SCALE
SIZE
CAD FILE:
DWG. NO.A
SHEET OF
REV.
DATEAPPROVALS
DRAWN
CHECKED
RESP ENG
MFG ENG
QUAL ENG
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES
TOLERANCES ARE:DECIMALS ANGLES
XX = .002XXX = .001
MATERIAL
FINISH
32DO NOT SCALE DRAWING
ITEMNO.
PART ORIDENTIFYING NO.
NOMENCLATUREOR DESCRIPTION
MATERIAL SPECIFICATION
QTYREQD
PARTS LIST
12345678
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OFCOUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTTHE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
A
B
C
D
12345678
XXXX = .0002
1/2
REVISIONSRev. DESCRIPTION DATE APPROVED
A PRINT RELEASE JDL
3/9/2015
XHP 70 Nozzle Tip
3/9/2015
Tuesday, February 24, 2015 9:04:20 AM
2.6950.106
1.1420.045
90°
7.3000.287
6.6840.263 4.400
0.173
A
B
C
D
CAD GENERATED DRAWING,DO NOT MANUALLY UPDATE
SCALE
SIZE
CAD FILE:
DWG. NO.A
SHEET OF
REV.
DATEAPPROVALS
DRAWN
CHECKED
RESP ENG
MFG ENG
QUAL ENG
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES
TOLERANCES ARE:DECIMALS ANGLES
XX = .002XXX = .001
MATERIAL
FINISH
32DO NOT SCALE DRAWING
ITEMNO.
PART ORIDENTIFYING NO.
NOMENCLATUREOR DESCRIPTION
MATERIAL SPECIFICATION
QTYREQD
PARTS LIST
12345678
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OFCOUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTTHE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
A
B
C
D
12345678
XXXX = .0002
1/2
REVISIONSRev. DESCRIPTION DATE APPROVED
A PRINT RELEASE JDL
3/9/2015
XHP 70 Nozzle Tip
3/9/2015
Tuesday, February 24, 2015 9:04:20 AM
90°
[7.300]Ø 0.287
[2.695]Ø 0.106
[4.400]Ø 0.173
[1.142]Ø 0.045
[6.684]Ø 0.263
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
6
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
CIRCUIT BOARD PREPARATION & LAyOUTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
soldering XLamp XHP Family LEDs onto the PCB.
The diagrams below show the recommended PCB solder pad layouts for XLamp XHP Family LEDs. All dimensions are ±.13 mm unless
otherwise indicated.
XHP35 High Density, XHP35 High Intensity, XHP35.2 High Density, XHP35.2 High Intensity
Notes:• Cree recommends using thermal pad kickouts to maximize component thermal performance.• Cree recommends using white solder mask material to minimize system optical loss.* This stencil has been tested and optimized for the avoidance of voiding when using ALPHA® LUMET® P30 Maxrel solder paste. For
other solder pastes, a “window pane” design for the thermal pad stencil may result in a lower voiding percentage. Contact your local Cree Field Applications Engineer for consultation regarding your specific application.
Recommended Copper Layout Recommended Stencil Openings*
3.45
3.45
2.65
3.50 3.30
1.501.30
.30
.30.50.50
.50
.56
.70
.50
.503.30
2.30
1.30
3.30
3.30
3.30
.56.56
.83
.18
.18
.18
3.30
.18
.50
.50
.56
.29
.43
.09
OPTICALREFERENCE
OPTICAL REFERENCE
3.50
R1.85
3.45
3.45
2.65
3.50 3.30
1.501.30
.30
.30.50.50
.50
.56
.70
.50
.503.30
2.30
1.30
3.30
3.30
3.30
.56.56
.83
.18
.18
.18
3.30
.18
.50
.50
.56
.29
.43
.09
OPTICALREFERENCE
OPTICAL REFERENCE
3.50
R1.85
Recommended Solder Pad(Solder Resist Pattern)
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
7
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
CIRCUIT BOARD PREPARATION & LAyOUTS - CONTINUED
XHP50, XHP50.2
Recommended PCB Solder Pad 12 V Configuration(thermal pad is connected to anode and cathode and is
not electrically isolated)
Recommended PCB Solder Pad 6 V Configuration (thermal pad is electrically isolated)
5.00
5.00
R2.85
4.78
4.78
.50
.50.50
2.78
2.14
.50
.73
3.58
2.78
4.78
.50 .50
.50
4.78
4.78
.50
.50
2.14
2.14
.50
.50
.50
.50
4.78
4.78
4.78 .50
.50
.80
.25
.97
.80
.25
2.14
4.78 REF.
4.78 REF.
RECOMMENDED PCB SOLDER PAD6V
RECOMMENDED PCB SOLDER PAD12V
RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)
6v/12v
PRIMARY ALTERNATIVE
5.00
5.00
R2.85
4.78
4.78
.50
.50.50
2.78
2.14
.50
.73
3.58
2.78
4.78
.50 .50
.50
4.78
4.78
.50
.50
2.14
2.14
.50
.50
.50
.50
4.78
4.78
4.78 .50
.50
.80
.25
.97
.80
.25
2.14
4.78 REF.
4.78 REF.
RECOMMENDED PCB SOLDER PAD6V
RECOMMENDED PCB SOLDER PAD12V
RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)
6v/12v
PRIMARY ALTERNATIVE
.50.50
.50.50
.50 .50
2.14
4.78
2.14
4.784.78
.50
.50
.50
4.78
2.78
Recommended Stencil Pattern6 V & 12 V Configurations
(hatched area is open)
5.00
5.00
R2.85
4.78
4.78
.50
.50.50
2.78
2.14
.50
.73
3.58
2.78
4.78
.50 .50
.50
4.78
4.78
.50
.50
2.14
2.14
.50
.50
.50
.50
4.78
4.78
4.78 .50
.50
.80
.25
.97
.80
.25
2.14
4.78 REF.
4.78 REF.
RECOMMENDED PCB SOLDER PAD6V
RECOMMENDED PCB SOLDER PAD12V
RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)
6v/12v
PRIMARY ALTERNATIVE
4.78
4.78
.80
2.14
.80
.97
.50
.50
.25
.25
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
8
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
CIRCUIT BOARD PREPARATION & LAyOUTS - CONTINUED
XHP70, XHP70.2
7.00
7.00
.73
R3.76
4.49
3.90
.70
6.70
.70
6.76
3.13
.50
3.90
6.70.70
.70
6.76
.706.70
.70
.70
6.76.50
3.13
3.13
.50
.70.70
6.76
.50
.70
1.24
.25.70
6.70
1.29
1.29
.25
3.13
6.70 REF.
6.76 REF.
RECOMMENDED PCB SOLDER PAD6v
RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)
6v/12vRECOMMENDED PCB SOLDER PAD
12v
PRIMARY ALTERNATIVE
7.00
7.00
.73
R3.76
4.49
3.90
.70
6.70
.70
6.76
3.13
.50
3.90
6.70.70
.70
6.76
.706.70
.70
.70
6.76.50
3.13
3.13
.50
.70.70
6.76
.50
.70
1.24
.25.70
6.70
1.29
1.29
.25
3.13
6.70 REF.
6.76 REF.
RECOMMENDED PCB SOLDER PAD6v
RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)
6v/12vRECOMMENDED PCB SOLDER PAD
12v
PRIMARY ALTERNATIVE
6.76
6.70
6.76
6.70.70
3.13
.70 .70
.70.70
.70.70
3.13
3.90
.50.50
Recommended PCB Solder Pad 6 V Configuration (thermal pad is electrically isolated)
Recommended PCB Solder Pad 12 V Configuration (thermal pad is connected to anode and cathode and is
not electrically isolated)
Recommended Stencil Pattern6 V & 12 V Configurations
(hatched area is open)
7.00
7.00
.73
R3.76
4.49
3.90
.70
6.70
.70
6.76
3.13
.50
3.90
6.70.70
.70
6.76
.706.70
.70
.70
6.76.50
3.13
3.13
.50
.70.70
6.76
.50
.70
1.24
.25.70
6.70
1.29
1.29
.25
3.13
6.70 REF.
6.76 REF.
RECOMMENDED PCB SOLDER PAD6v
RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)
6v/12vRECOMMENDED PCB SOLDER PAD
12v
PRIMARY ALTERNATIVE
6.76
3.13
6.70
.70 .70
.50
.25
.25
1.24
1.29
1.29
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
9
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
CASE TEMPERATURE (TS) MEASUREMENT POINT
XLamp XHP Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible.
This measurement point is shown in the picture below.
XHP35High Density
XHP35High Intensity
XHP35.2High Density
XHP35.2High Intensity
XHP50 XHP50.2
XHP70 XHP70.2
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XHP Family LED itself. In testing, Cree has
found such a solder pad to have insignificant impact on the resulting Ts measurement.
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
10
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
NOTES ON SOLDERING XLAMP® XHP FAMILy LEDS
XLamp XHP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the
PCB on a hotplate and following the reflow soldering profile listed on page 12.
Do not wave solder XLamp XHP Family LEDs. Do not hand solder XLamp XHP Family LEDs.
Solder Paste TypeCree strongly recommends using “no clean” solder paste with XLamp XHP Family LEDs so that cleaning the PCB after reflow soldering is
not required. Cree uses Kester® R276 solder paste internally.
Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste ThicknessThe choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil
(102-μm) bond line, i.e., the solder joint thickness after reflow soldering.
X WRONG
PCORRECT
PCORRECT
PCORRECT
X WRONG
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
11
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
NOTES ON SOLDERING XLAMP® XHP FAMILy LEDS - CONTINUED
After SolderingAfter soldering, allow XLamp XHP Family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the lens, could result in damage to the LED.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After
shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After SolderingCree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,
Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
MOISTURE SENSITIVITy
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XHP Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs
in the original MBP.
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
12
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
XLAMP® XHP FAMILy LED REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XHP Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp) 1.2 °C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax) 170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL) 217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classification Temperature (Tp) 235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25 °C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
IPC/JEDEC J-STD-020C
TP
TL
Tem
pera
ture
Timet 25˚C to Peak
Preheatts
tS
tP
25
Ramp-down
Ramp-up
Critical ZoneTL to TP
Tsmax
Tsmin
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
13
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
CHEMICALS & CONFORMAL COATINGS
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and
current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application
Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.
Recommended Cleaning SolutionsCree has found the following chemicals to be safe to use with XHP Family LEDs.
• Water
• Isopropyl alcohol (IPA)
Chemicals Tested as HarmfulIn general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to
XHP Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XHP Family LEDs. The
fumes from even small amounts of the chemicals may damage the LEDs.
• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
• Methyl acetate or ethyl acetate (i.e., nail polish remover)
• Cyanoacrylates (i.e., “Superglue”)
• Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
• Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)
Hermetically Sealing LuminairesFor proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
14
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
ASSEMBLy STORAGE & HANDLING
Do not stack PCBs or assemblies containing XLamp XHP Family LEDs so that anything rests on the LED lens. Force applied to the LED
lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XHP Family LEDs should be stacked in a way to
allow at least 1-cm clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp XHP Family LEDs. Force from the bubble wrap can potentially damage the LED.
PCORRECT
X WRONG
PCORRECT
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
15
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
TAPE AND REEL
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
All dimensions are ±.13 mm unless otherwise indicated.
XHP35 High Density, XHP35.2 High Density
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
3456
6 5 4 3 2 1
A
B
C
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6 1/11.000
A2402-00040
Carrier Tape, XPL
5/16/14 D. CRONIN
.30 [.012]T
Ao3.60 [.142]
3.00 [.118]Ko
3.0 °
3.0 °
3.60 [.142]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø1.50+.10-.00
Ø1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZE
Ao - 3.60 mm [.142"]
Bo - 3.60 mm [.142"]
Ko - 3.00 mm [.118"]CATHODE SIDE
ANODE SIDE
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
3456
6 5 4 3 2 1
A
B
C
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6 1/11.000
A2402-00040
Carrier Tape, XPL
5/16/14 D. CRONIN
.30 [.012]T
Ao3.60 [.142]
3.00 [.118]Ko
3.0 °
3.0 °
3.60 [.142]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø1.50+.10-.00
Ø1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZE
Ao - 3.60 mm [.142"]
Bo - 3.60 mm [.142"]
Ko - 3.00 mm [.118"]CATHODE SIDE
ANODE SIDE
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
3456
6 5 4 3 2 1
A
B
C
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6 1/11.000
A2402-00040
Carrier Tape, XPL
5/16/14 D. CRONIN
.30 [.012]T
Ao3.60 [.142]
3.00 [.118]Ko
3.0 °
3.0 °
3.60 [.142]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø1.50+.10-.00
Ø1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZE
Ao - 3.60 mm [.142"]
Bo - 3.60 mm [.142"]
Ko - 3.00 mm [.118"]CATHODE SIDE
ANODE SIDE
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
3456
6 5 4 3 2 1
A
B
C
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6 1/11.000
A2402-00040
Carrier Tape, XPL
5/16/14 D. CRONIN
.30 [.012]T
Ao3.60 [.142]
3.00 [.118]Ko
3.0 °
3.0 °
3.60 [.142]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø1.50+.10-.00
Ø1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZE
Ao - 3.60 mm [.142"]
Bo - 3.60 mm [.142"]
Ko - 3.00 mm [.118"]CATHODE SIDE
ANODE SIDE XHP35 High Density
Anode Side
XHP35.2 High Density
Anode Side
Loaded Pockets(500 Lamps) Leader
400 mm (min.) ofempty pockets with
at least 100 mmsealed by tape
(50 empty pockets min.)
Trailer160 mm (min.) ofempty pockets
sealed with tape(20 pockets min.)
STARTENDUser Feed Direction
Loaded Pockets(1,000 Lamps) Leader
400mm (min) ofempty pockets with
at least 100mmsealed by tape
(50 empty pockets min.)
Trailer160mm (min) ofempty pockets
sealed with tape(20 pockets min.)
STARTEND
Cathode Side
Anode Side(denoted by + and circle)
160.0
A
A
B
2.5±.1
SECTION A-A SCALE 2 : 1
1.5±.1
8.0±.1
4.0±.1
1.75±.10
12.0 .0+.3
DETAIL B SCALE 2 : 1
13mm7"
Cover Tape
Pocket Tape
User Feed Direction
User Feed Direction
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
16
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
TAPE AND REEL - CONTINUED
XHP35 High Intensity, XHP35.2 High Intensity
.30 [.012]T
Ao3.70 [.146]
1.20 [.047]Ko
3.0°
3.0°
3.70 [.146]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do
Ø 1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZEAo - 3.70 mm [.146"]Bo - 3.70 mm [.146"]Ko - 1.20 mm [.047"]
ANODE SIDE
CATHODE SIDE
.30 [.012]T
Ao3.70 [.146]
1.20 [.047]Ko
3.0°
3.0°
3.70 [.146]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do
Ø 1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZEAo - 3.70 mm [.146"]Bo - 3.70 mm [.146"]Ko - 1.20 mm [.047"]
ANODE SIDE
CATHODE SIDE
.30 [.012]T
Ao3.70 [.146]
1.20 [.047]Ko
3.0°
3.0°
3.70 [.146]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do
Ø 1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZEAo - 3.70 mm [.146"]Bo - 3.70 mm [.146"]Ko - 1.20 mm [.047"]
ANODE SIDE
CATHODE SIDE
.30 [.012]T
Ao3.70 [.146]
1.20 [.047]Ko
3.0°
3.0°
3.70 [.146]Bo
10.25[.404]
E2
P22.00 [.079]
Po4.00 [.157]
Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do
Ø 1.50[.059]D1MIN
12.00 [.472]NOMINAL
12.30 [.484]
MAXW
1.75 [.069]E1
5.50 [.217]F
8.00 [.315]P
POCKET SIZEAo - 3.70 mm [.146"]Bo - 3.70 mm [.146"]Ko - 1.20 mm [.047"]
ANODE SIDE
CATHODE SIDE
XHP35 High Intensity
Anode Side
XHP35.2 High Intensity
Anode Side
Loaded Pockets(1,000 Lamps) Leader
400mm (min) ofempty pockets with
at least 100mmsealed by tape
(50 empty pockets min.)
Trailer160mm (min) ofempty pockets
sealed with tape(20 pockets min.)
STARTEND
Cathode Side
Anode Side(denoted by + and circle)
160.0
A
A
B
2.5±.1
SECTION A-A SCALE 2 : 1
1.5±.1
8.0±.1
4.0±.1
1.75±.10
12.0 .0+.3
DETAIL B SCALE 2 : 1
13mm7"
Cover Tape
Pocket Tape
User Feed Direction
User Feed Direction
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
17
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
TAPE AND REEL - CONTINUED
XHP50, XHP50.2
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6
Trailer160mm (min) of
empty pocketssealed with tape
(15 pockets min.)
Loaded Pockets(500 Lamps)
Leader400mm (min.) of
empty pockets with at least 100mmsealed by tape
(40 empty pockets min.)
12
1.754
8 3.7
1.54
5.3
0.36
7.0"
1/13.000
A2402-00055
XHP50 LOADING SPEC
--
--
----
----
12/9/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
END START
User Feed Direction
CATHODE SIDE
ANODE SIDE
User Feed Direction
13mm
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6
Trailer160mm (min) of
empty pocketssealed with tape
(15 pockets min.)
Loaded Pockets(500 Lamps)
Leader400mm (min.) of
empty pockets with at least 100mmsealed by tape
(40 empty pockets min.)
12
1.754
8 3.7
1.54
5.3
0.36
7.0"
1/13.000
A2402-00055
XHP50 LOADING SPEC
--
--
----
----
12/9/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
END START
User Feed Direction
CATHODE SIDE
ANODE SIDE
User Feed Direction
13mm
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
18
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
TAPE AND REEL - CONTINUED
XHP70, XHP70.2
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6
Trailer180mm (min) of
empty pocketssealed with tape
(100 pockets min.)
Loaded Pockets(1000Lamps)
12±.14.6
16+.3-.0
1.75±.104±.10
Leader420mm (min) of
empty pocketssealed with tape
(40 pockets min.)
7.4
0.36
"13
13mm
1/13.000
A2402-00056
XHP70 LOADING SPEC
--
--
----
----
12/9/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
END START
User Feed Direction
CATHODE SIDE
ANODE SIDE
User Feed Direction
1.5± .1
SIZE
TITLE
OF
REV.
SHEET
CDRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone (919) 313-5300Fax (919) 313-5558
4600 Silicon DriveDurham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125X° ± .5 °
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH: 1.6
Trailer180mm (min) of
empty pocketssealed with tape
(100 pockets min.)
Loaded Pockets(1000Lamps)
12±.14.6
16+.3-.0
1.75±.104±.10
Leader420mm (min) of
empty pocketssealed with tape
(40 pockets min.)
7.4
0.36
"13
13mm
1/13.000
A2402-00056
XHP70 LOADING SPEC
--
--
----
----
12/9/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
END START
User Feed Direction
CATHODE SIDE
ANODE SIDE
User Feed Direction
1.5± .1
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
19
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
PACKAGING & LABELS
The diagrams below show the packaging and labels Cree uses to ship XLamp XHP Family LEDs. XLamp XHP Family LEDs are shipped in
tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.
XHP35, XHP35.2, XHP50, XHP50.2
Patent Label(on bottom of box)
Label with Cree Bin Code, Quantity, Reel ID
Label with Cree Bin Code, Quantity, Reel ID
Label with Cree Order Code, Quantity, Reel ID, PO #
Label with Cree Order Code, Quantity, Reel ID, PO #
Label with Cree Bin Code, Quantity, Reel ID
Unpackaged Reel
Packaged Reel
Boxed Reel
CREE Bin Code& Barcode Label
Vacuum-SealedMoisture Barrier Bag
Label with CustomerP/N, Qty, Lot #, PO #
Label with Cree Bin Code, Qty, Lot #
Label with Cree Bin Code, Qty, Lot #
Vacuum-Sealed Moisture Barrier Bag
Patent Label
Label with Customer Order Code, Qty, Reel ID, PO #
Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
20
XLAMP® XHP FAMILy LED SOLDERING & HANDLING
PACKAGING & LABELS - CONTINUED
XHP70, XHP70.2
Label with Cree Bin Code, Qty, Lot #
Label with Cree Bin Code, Qty, Lot #
Vacuum-Sealed Moisture Barrier Bag
Dessicant (inside bag)
Humidity Indicator Card (inside bag)
Patent Label
Label with Customer Order Code, Qty, Reel ID, PO #
Patent Label
Label with Cree Bin Code, Quantity, Reel ID
Label with Cree Bin Code, Quantity, Reel ID
Label with Cree Order Code, Quantity, Reel ID, PO #
Label with Cree Order Code, Quantity, Reel ID, PO #
Label with Cree Bin Code, Quantity, Reel ID
Unpackaged Reel
Packaged Reel
Boxed Reel