cliff morton snapdragon, beyond mobile - … beyond mobile qualcomm)3g ... the snapdragon™...

Intrinsyc Confiden/al

“Results with Integrity”

Cliff Morton Snapdragon, beyond Mobile

Qualcomm 3G/LTE Summit


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Agenda

¨ Intrinsyc Overview ¨ Why Snapdragon for Embedded and IoT? ¨ Intrinsyc’s SnapdragonTM Solutions ¨ Snapdragon Based Product Examples


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Intrinsyc Technologies Overview

Hardware Development • Schema/cs • BoMs • PCB Layout (HDI) • Simula/on & modelling • Prototypes • Design verifica/on

BSP Development • Board Bring Up • Boot-‐loaders • Kernels • HAL drivers • Mul/media & cameras • DSPs • FPGAs • Remote upda/ng

Wireless Integra/on • 2G/3G/4G • BT/Wi-‐Fi • GPS • NFC • Wireless Charging • Toshiba TransferJet

Power Management • Design-‐in approach • Covers both H/W & S/W • Power modelling • Lower power consump/on •  Increase baWery life

New Product Introduc/on • Cer/fica/on & Regulatory • Design for manufacturing • Design for procurement • Supply chain co-‐ordina/on • Factory test soXware • Pilot runs

Product Development Company that helps companies accelerate development and add innova/on to mobile and embedded devices from concept through to produc/on Trusted Partner with more than 800 Customer Projects Successfully Delivered Founded 1996 and Listed on TSX (T.ICS) – Headquarters/Engineering: Vancouver, BC


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Intrinsyc enables new applications for Snapdragon


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Why use Snapdragon for embedded and IoT?

¨  Technology advantages ¨  Heterogeneous computing environment

¨  Hardware - CPU, DSP, GPU, ISP etc. ¨  Software – Android, Hexagon, Adreno SDK, OpenCL, Facial Processing, Augmented Reality

¨  Performance leader – CPU, DSP, GPU, camera, multimedia, etc. ¨  Leading thermal and power efficiency

¨  The Snapdragon™ processor ecosystem offers in-depth support for product developers: ¨  Longevity ¨  Tools ¨  Documentation ¨  Developer web site ¨  A variety of development platforms – development kits, SoMs, SBCs & community boards

¨  Solid history of innovation and future technology roadmaps ¨  Range of price vs performance embedded processors


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SnapdragonTM Solutions ¨  Intrinsyc is a Qualcomm licensee that builds products for the

embedded and mobile device markets utilizing Qualcomm’s industry leading Snapdragon processors: 400, 410, 600, 800, 805, 810.

¨  Intrinsyc’s Snapdragon solutions include: ¨  Development Platforms

¨  Production Ready System on Modules (SOMs) ¨  Custom Development of Embedded Solutions - SOM and SBC ¨  Android and Embedded Linux BSPs ¨  Complete Platform and Product Development Services ¨  Technical Support


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Development Platforms

Embedded Development Pla0orm (EDP) •  Open plagorm for technology companies and

embedded device makers.

•  Full access to soXware and I/O

•  Snapdragon 400, 410, 600, 800, 805 & 810

Mobile Development Pla0orm (MDP) •  Earliest access to next genera/on Qualcomm

technology for applica/on developers. •  Pre-‐integrated advanced power and performance

profiling soXware •  Snapdragon 805 & 810 Phone and Tablet

Automo8ve Development Pla0orm (ADP) •  Open plagorm for Tier 1 Automo/ve Suppliers

•  602A Automo/ve Grade Processor •  Provides an op/mized development

environment for rapid development in the automo/ve space


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Open-QTM System on Modules ¨  Off-the-shelf System on Modules (SOM) for embedded devices based on Snapdragon processors

¨  410 (APQ8016) – 800 (APQ8074) – 805 (APQ8084) – 810 (APQ8094) ¨  Custom computing platforms developed and manufactured to precise customer requirements

System on Modules (SOM) are complete embedded computers built on a single circuit board. The SOM is integrated with a carrier board which provides addi/onal peripherals and connec/vity for specific embedded applica/ons.

The OPEN-‐QTM SOM allows embedded developers to get to market faster – avoiding ground-‐up electronics design without compromising customiza/on


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OPEN-Q™ 410 System On Module ¨  SoC (Snapdragon 410)

¨  Quad Core ARM Cortex A53 64 bit CPUs ¨  Adreno 306 GPU ¨  Hexagon v5 DSP

¨  Memory: 8GB eMMC 4.5 and 1GB LPDDR3 RAM in a Multi-Chip Package

¨  PMIC (PM8916) – inc. audio codec support ¨  Wi-Fi (802.11b/g/n) 2.4 GHz & BT 4.0 + BLE

Module (WGR3360) ¨  GLONASS GPS (WGR7640) ¨  Expansion interface is via a two 100 pin Board to

Board connectors – USB 2.0, 2*MIPI-CSI, MIPI-DSI, GPIO, I2C, SPI, audio i/o, etc.

¨  Android and Linux Support ¨  44mm x 26mm

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Software Support for Snapdragon Embedded

¨  Multiple high resolution cameras ¨  High resolution displays ¨  Video streaming ¨  Sensor suites ¨  Network connections – Ethernet, Wi-Fi, BT,

NFC, GPS ¨  Power management ¨  High end processing capability

¨  Analytics ¨  Feature extraction and image processing ¨  Navigation

¨  VR and AR applications

¨  Android and Linux Development ¨  Display and sensor drivers, cameras, inc

stereoscopic support ¨  Bridge chip drivers ¨  Power management

¨  DSP Development (Hexagon) ¨  Audio ¨  Sensors

¨  Graphic and Image Processing ¨  FPGA Integration

¨  Video processing ¨  Motor control e.g. robotics

¨  SW Tools ¨  SW Profiler, Tepin, De-Buggers, etc

Key Customer Features Key Technology Areas


“Results with Integrity”

Snapdragon Based Product Examples


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Retail Analytics Customer

¨  In-store analytics

¨  Based upon the Snapdragon 805 running Android with dual, synchronized cameras and PoE.

¨  Advanced image processing with high resolution stereoscopic vision and

Product Description Development Stages

SoXware Development: 805 Development Kit

Produc/on Units: Dual Boards with Enclosure


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Body Worn Video Camera

¨  Body worn camera

¨  Based upon the Snapdragon 410 running Android with a cellular modem and wireless charging

¨  Cost effective, small, power efficient with great camera features, including image stabilization using an IMU

¨  Fast-track development process


SoXware Development: 410 Development Kit

Prototype in 2 Months: 2 boards -‐ SoM + CCB

Produc/on units in process: Single Board


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Stream TV

¨  A Glasses-less 3D Smart TV

¨  Based upon the Snapdragon 800 running Android

¨  High performance, power and thermally efficient SoC with multimedia and UHD (4K) support

¨  Fast-track development process


Proof of Concept: 800 Dev Kit and Eval Boards

Prototype and Demo Units: 2 board solu/on, SoM + CCB

Produc/on Units: Single Board


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THANK YOU

Cliff Morton VP Client Solutions Intrinsyc Technologies Corporation

www.intrinsyc.com


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Advantages of the Embedded Development Platforms

¨  Early access to next generation Qualcomm technology for product development companies and OEMs

¨  Comprehensive and open software support, with access to a developer community Web site. ¨  Access to software upgrades and a build environment where almost anything can be modified ¨  Advanced software performance profiling software ¨  Development takes place on target HW ¨  The SoM is easily integrated into custom carrier boards to create a fully customized solution, but

without the full up design effort: ¨  Production ready module ¨  Easily expandable ¨  Compact form factor

¨  In summary, the SoM approach reduces product development costs while decreasing time to market and technical risk.


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OPEN-Q™ 810 System On Module ¨  SoC (Snapdragon 810)

¨  Quad Core ARM Cortex 64 bit A53 CPUs & Quad Core 64 bit A57 CPUs

¨  Adreno 430 GPU ¨  Hexagon v5 DSP

¨  Memory: 16MB eMMC 5.0 & 4GB PoP LPDDR4 RAM ¨  Dual PMICs: PM8994 & PMI8994 ¨  Wi-Fi (802.11a/b/g/n/ac) & BT 4.1/BLE Module

(QAC6167) ¨  GLOSNASS GPS (WGR7640) ¨  Expansion interface is via a 314-pin edge connector -

USB 2.0, USB 3.0, 3*MIPI-CSI, 2*MIPI-DSI, HDMI, GPIO, I2C, SPI, audio i/o, etc.

¨  Android Support ¨  82mm x 40mm

cliff morton snapdragon, beyond mobile - … beyond mobile qualcomm)3g ... the snapdragon™...

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