Coming Challenges and Opportunities for MEMS Testing Supply Chain

Wendy Chen Sr. Director of KYEC RD center

“The Challenges - Past, Present and Future”

MEMS Testing - Supply Chain

Challenges from Market Demand

15.8 Billion units

~ 2.2 X 16 Billion units

2011 YOLE report 2015 YOLE report

~ 2 X 30 Billion units

2011 YOLE report

19.5 Billion

14% CAGR 14 Billion

21 Billion 8.9% CAGR

2015 YOLE report

Market Volume Forecast is on Track Market Value Forecast is Difference

Unit Price Drop Dramatically

13 Billion

18 Billion

ASP Drop Down Dramatically

Challenges - Cost Reduction

May 2016 YOLE report update

MEMS Fusion Sensor Trend

2010 2016 2020

IMU senor

Accelerometer

Gyro

Magnetic sensor

Microphone

Pressure sensor

High acceleration

Shaking

Angular rotation

Sinusoidal velocity

Sound generator

Wide range, High SPL

Magnetic field

3 axis, high precious

Air Pressure

Barometer

E-Compass

Air Pressure -Precious resolution

Angular rotation -Constant velocity

Acceleration - Gravity

Acceleration –Gravity

Magnetic field - 1 axis + Geomagnetic

In-Door Navigation

Humidity

Temperature

Environment Sensor

Humidity generator

Thermal control,

VOC gas generator

Particle generator

Gas Sensor

Particle Sensor

Ambient light sensor

FIR / Thermopiles

Micro bolometer

Optical Sensor

Microfluidics

Bio-Chip

Force Sensor

Microphone Sound generator

Wider frequency range,

High SPL, High S/N

Ultrasonic Sensor

2011 2013

500

0

1.500

1,000

2,000

2,500

The Cost Trend of Test Equipment

Pri

ce/s

et

(K U

S$)

2015 2017

Test equipment

3 DOF

6 DOF

9 DOF

10 DOF

Source from ITRS 2011 MEMS edition

Challenges - The Test Complexities Raise Up Cost of Test Equipment and Test Procedure

Fusion Sensor Increase Test Complexity

Combo Sensor increase sensor value and slow down ASP erosion

Gyro, Accelerometer combine to IMU fusion sensor.

Environment sensor continually combine more and more sensors such as Barometer, Humidify, Thermal, Gas, Particle…. microphone in the near future.

Testing Bio-MEMS device for Healthcare application increase the criteria level of Reliability and Safety concern. The consumer Healthcare Bio-MEMS sensor such as Accelerometer、Gyro、 Microphone、

Pressure and Temperature sensor also need to consider Reliability 、Lower Power Consumption (uA)、Higher S/N ratio 、 and Miniaturized size of device.

Testing Emerging implantable Bio-MEMS sensor , Reliability is more severe and Burn In Test and test environment Safety level & GMP Certification become needed.

Another Blooming Application of MEMS Sensor is Automotive. The Burn In Test is necessary test procedure for Reliability.

There are diffident Reliability quality level requirement of MEMS Sensor for Passive-Safety and NON-Safety such as Navigation assistance、Anti-theft systems、 Infotainment.

Reliability & Burn In Test is getting Important

Time

Failu

re R

ate

Infant Mortality

Useful life Low Failure Rate

End of Life Increasing Failure Rate

Early Failure Period

Wear-Out Period

Product History Reliability “ Bathtub cure “

MEMS Sensor Fail Mechanism

Mechanical Defect

Electromechanical break-down

Thermal stresses by mismatch of CTE

Excessive intrinsic stress

Packaging problem

Local stress

Surface roughness

Thermal stress

Mismatch of CTE

Delamination

of thin layers

Challenges – MEMS Sensor Burn In Test still lack of Standard

“The Opportunities “ of

MEMS Testing - Supply Chain

Share Investment Risk IDM and New Start up Design companies started to outsource to manufacture

supply chain to reduce investment risk.

Outsource to Supply Chain Trend - Fab-light or Fabless

- MEMS manufacture industry follow

Semiconductor Vertical Integration Supply Chain ( Wafer Foundry, Testing Service, Assembly & Packaging)

MEMS Sensor Vendor

IDM Design House

Design House

Design House

Design House

KYEC MEMS Sensor Test Service

• KYEC started MEMS Sensor test service from 2008.

• KYEC MEMS Sensor test services are various such as Accelerometer, Gyro, Magnetic

sensor , Microphone, Light sensor, Pressure sensor ... Continually grow.

• Over 200 million units MEMS sensor were testing in KYEC factories during 2015.

• The MEMS sensor testing capacity is continually growing in Taiwan and China factory.

KYEC Allocated Special MEMS Testing Floor

KYEC built new factory and reserved Basement floor for testing MEMS Sensor in 2014

We done a lot of efforts to prepare Test Environment for Sensor testing.

The capacity of test system is growing Rapidly.

2014_1 2014_3 2014_6 2015 2016

Window Tour

Increase test parallelism

Reduce test time

Innovative way to overcome upcoming challenges

New Innovation for Test Cost Reduction

Not Enough

MEMS sensors + ASIC + MCU

ASIC + MCU function include

Convertor : I to V or C to V

Multiplex + PGA (Programmable Gain Amplifier)

Noise Filter + A/D (analog to digital converter)

DSP ( Digital Signal Processor ) + I/O Protocol

Circuit Integration Innovative Concept

ASIC + Multi-MCU + Smart Firmware open new opportunity for BISX

12

Sensor

Sensor

sensor

Sensor

ASIC

Multi-MCU

+ DFT ( BIST + BISD+ BISC )

Process Integration Innovative Concept

MEMS SOC manufacture by CMOS process

3DS Process integration:

Multi- MEMS Sensors integrate ASIC CMOS wafer through 3DS process

I/O communication such as optical or RF integrated into MEMS sensor through 3DS process.

SOC ( System On Chip ) platform by CMOS process

MEMS devices and ASIC manufacture by CMOS process

13

3DS Process Integration

Test Innovative Concept

The Innovative Circuit and Process Integration achieve MEMS sensor DFT

( Design For Test ) to Come True.

Build In Self Test Cell include physical stimulus structure and control circuit.

The imitated Physical Stimulation signal be generated from ASIC to enable BIST cell.

Not all of MEMS sensor design could apply DFT which be limited by sensor structure.

CX

CX

Self-test

Proof mass

sp

rin

g

With Built-In Actuator

Accelerometer Magnetic sensor

Built-In

Coil

MEMS sensor DFT is getting important , but still long way to go

14

Enable BIST Cell

Physical Stimulation

generate electrical signal

Sensing signal

A/D

Modulation

D/A

Calibration ENG

MC

U +

Mem

ory

15

Off

Physical Stimulus

Firmware in Test Innovative Concept Develop Smart Firmware to enable BISD ( Build In Self Diagnostic ) and BISC

( Build In Self Calibration/ Compensation ) for MEMS Sensor

During testing, Smart Firmware could be implanted into BIST cell of device.

Device’s performance could be improved through self compensation.

After working on application system, device could do self diagnostic and self correlation with

compensation to increase device’s reliability.

BISD and BISC provide Effective Reliability Solution MEMS sensor

BIST

MCU Memory

BISD BISC

New Test Skill for MEMS Sensor Testing Traceability :

Record device’s ID into chip during probing SOC or 3DS wafer then trace test result of device before

and after packaging process to monitor failure mechanism for yield improvement.

Central system could Tracking Sensor Performance after working on application system through device’s ID and monitor the information from self diagnostic and self correlation.

Intelligent data mining :

Functional test is not enough. Intelligent data mining could predict and analysis process variation such as Adaptive testing concept.

Testing play an important role as a Hub of data mining and reconfigure sensor gene with smart firmware.

Burn In Test :

DFT ( Design For Test ) is Key skill to enable Cost Effective Wafer Level Burn In. Designer should design suitable self-test structure fulfill testing strategy to apply parametric test on wafer level reliability testing.

The Package level Burn In Test will depend on the strategy of quality. Some strategies apply Build In Self-Diagnostic、Calibration/ Compensation skill after work on application system to overcome

the coverage rate of Package level Burn In test by standard IC Burn In solution.

16

Smart Sensing system

Change the Game Rule !!

Test budget for probing ASIC wafer is getting more then MEMS sensing structure

MEMS Sensor performance could be optimized by written parameter into ASIC during Testing

Share Test Capacity of Semiconductor Supply Chain could reduce Cost of Test

ASIC

MEMS Sensor

ASIC

MEMS Sensor

MEMS Sensor Testing Game Rule also be Changed

Tester Numbers Over 2000 Sets And

Continuously Growing

China (Suzhou) Mass Production center

Japan

R&D and Biz Center

Singapore Biz Center

USA

Biz Center

Taiwan Center of Excellence

Chu-Nan, Hsin -Chu , Tong-Lo Factory

KYEC Testing Service KYEC founded in May 1st ,1987 and IPO in May 9,2001.

KYEC test service coverage Wafer Probe、Final Test 、 Burn In Test、 Pre- Assembly、

Test Solution Development、 Global Logistics.

KYEC Group pure test service is ranking 2nd in 2015.

KYEC Testing Service KYEC Test System Capacity :

ATE auto Test Equipment over 3000 sets ↑

Prober > 2000 sets (8” : 12” ~= 50% ↓ : 50% ↑)

Handler > 1000 sets

The Image Sensor Testing Service: Clean level of Test Environment : Wafer probing class10 , Final test class 100.

Probing capacity up to 850,000 pcs wafer shipment during 2015.

Burn In Test Service: KYEC all of Burn In Overs developed by KYEC RD and also sale out to Failure analysis company.

Over 400 sets of Burn In systems operated by Networking Solution.

19

KYEC RD

Core

Technology

Test system Design

Technology

Automation Control

Technology

Strong R&D Test Team provide Flexible Test solution

20

Tool/ Modeling

Technology

Summary

Consumer MEMS Sensor drive 1st wave of Evolution

The 2nd wave of Evolution is coming ---Smart Sensing System

Cost Reduction Change Supply Chain Model.

New Innovation of Design and Process benefit Test Cost

Reduction.

DFT open new solutions for upcoming Reliability Challenges.

21

22

Changes and Challenges

give us

Opportunities.