company profile - :+:dnp corporation - 신뢰를 넘어 감동을 전달하는 … ·...
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![Page 1: Company Profile - :+:DNP Corporation - 신뢰를 넘어 감동을 전달하는 … · 2009-09-22 · 5 거래현황 Mobile Phone 32.8% Memory Module 16.3% Display& Network 18.3% Substrate](https://reader031.vdocuments.net/reader031/viewer/2022022805/5ca94ae688c9939f3e8c4802/html5/thumbnails/1.jpg)
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Company Profile
January, 2009
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회사 개요
DNP Resume 1998 DNP 창설 1999 ‘이수 페타시스 ‘ Network PCB Drill
거래
2002 ‘Samsung’ Mobile PCB Drill 거래 2005 증평 공장 증설 2005 ‘SIMMTECH’ Package Sub. &
Memory Module Drill 거래 2006 안산 공장 증설
2007 ‘Samsung’ Package Sub Drill &
Laser 거래 2007 ‘DAP’ Mobile PCB Drill & Laser 거래 2007 ‘KCC’ Package Sub. & Memory
Module Drill & Laser 거래 2007 ‘대덕’ Network & Memory Module
Drill 거래 2008 ‘LG 전자’ Mobile PCB Drill & Laser
거래
대구(본사)
안산
3개 공장 270명 근무- 증평 공장 130명 근무
PCB Drill 업계 10년 이력 사항
증평
•품질 보증서•2001 ISO 9001
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품질 관리/연구 개발
품질 관리
연구 개발
안산 공장대구 공장(본 사)
생산 관리
기술 개발
증평 공장
설비 관리
회사 조직도
생산 관리
기술 개발
설비 관리
생산 관리
기술 개발
설비 관리
영업/경영 지원
영업
경영 지원
DNPCorperation
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DNP 조직도
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거래 현황
Mobile Phone32.8%
Memory Module16.3%
Display& Network18.3%
Substrate 32.5%
2008년 Total Remark
생산 금액 400억 원 Module:86억 원
투자 금액 70억 원 CNC:30, Laser : 17
Capacity(CNC)
(증평 공장 )
140Km2/월(70Km2/월)
176k hole/m2
(195 k hole/m2)
Capacity(Laser)
(증평 공장 )
20Km2/month
(12Km2/month)
560 k hole/m2
(1000 k hole/m2)
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Customers
Mobile Phone
Memory Module
Substrate
Display& Network
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공 장Mech. Drill
Laser Drill
HoleAnalyzer
X-rayInspector
Remark
대 구 52 - 1 3CNC, LaserHitachi 社제작
증 평 86 20 2 3
안 산 34 8 1 2
Total 172 28 4 8
장비 보유 현황
● CNC Drill : 300 Krpm(6), 350 Krpm(14), 200Krpm(104) ,160 Krpm (30), 125 Krpm(18)
● Laser Drill : 2 Beam 2 Panel(28)
● Stacking (4), Taping (4)
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Micro Scope Hole Inspector Hole Analyzer BIT 검사기
Olympus Olympus HITACHI HOTWO
계측 장비 현황
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Technology
Hole Diameter : min. 0.050 ㎜ / RPM : 330,000 RPM
IT Board (High Layer) : 32 Layer / 3.2T / 0.25φ
Laser : BVH / Copper Direct / ~0.065φ
Depth Drill : ~0.075φ
Blind Via Hole by Mechanical Drill : Possible (Depth Drill)
<IT Board> <Laser> <Depth Drill><6 Layer/0.2φ>
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Drill Process Flow
Stacking Double Side
Double Side / MLB
Multi Stack Machine
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Drill Process Flow
Stacking Multi Layer
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Drill Process Flow
Taping
Taping Machine
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Drill Process Flow
Taping → Drill 인계
가공 Data Loading 제품 역장착 여부 확인 제품 표면 검사 Drill 가공
Inner LayerInspection
BDD
Drilling
X-Ray 검사기 X-Ray로 내층 검사
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Drill Process Flow
해체 검사
Lot 구분 적치 디피닝M/C에서 STACK PIN 해체 Entry, Back up Board 해체
Hole Burr 검사 3축만 상,하판 구분 Lot 수량 완료 출하검사 공정 이동 대기
하판 미관통 검사
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Drill Process Flow
출하 검사
Tooling Hole 직경 검사
X-Ray 검사
미관통 검사 표면 검사 Hole 직경 검사 검사 성적서 작성 및 확인 출하 대기
Hole 위치정도 측정기 3D 검사 측정기 Pin Gauge
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모델명 및 DATA 확인 조건 입력 LOADER SETTING
UNLOADER SETTINGTABLE SETTING G.COMP 확인
Laser Drill Process Flow
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Laser Drill Process Flow
POWER 확인 초품 가공 초품 확인
중품 확인양산 가공 말품 확인
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RCC SBL 단면 이미지
170 * 171 168 * 170
153 * 152 150 * 152
RCC SBL 현미경 이미지
Micro Scope Image
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FR-4 SEMI(150) 단면 이미지
152 * 152 158 * 161
133 * 136
FR-4 SEMI(150) 현미경 이미지
115 * 114
Micro Scope Image
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MBL 단면 이미지
290 * 286 183 * 181
288 * 284
MBL 현미경 이미지
187 * 188
161 * 163
167 * 169
Micro Scope Image