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International Exhibition and Conferencefor Power Electronics, Intelligent Motion,Renewable Energy and Energy ManagementNuremberg, 16 – 18 May 2017pcim-europe.com

7 Seminars on 14 May 2017

11 Tutorials on 15 May 2017

Conference from 16 –18 May 2017

Conference Program

3

Welcome Address 3

Board 4

Conference Program at a Glance 6

Seminars 8

Tutorials 12

Awards 19

Keynotes 20

Tuesday Oral Sessions 22

Tuesday Poster Dialogue Sessions 26

Dear PCIM Europe participants,

I am very pleased to welcome all of you to the PCIM Europe Conference 2017 in Nuremberg. Power electronics is one of the most successful industries in Europe with a variety of advanced research fields, very competitive and successful industrial companies, and many leading academic laboratories in different countries. The PCIM Europe serves as a technical and scientific platform for decision makers, engineers and researchers engaged to power electronics and its fields of applications.

Precise first hand transfer of knowledgeThe technical program for this year’s conference comprises a variety of topics. New materials for semiconductor devices including wide bandgap power electronics, reliability issues for power modules and advanced systems as well as design regulations to manage ultrafast switching de-vices in the circuit, form the backbone of the PCIM Europe Conference 2017. The other subjects range from advanced technologies for power semiconductor devices and passive components up to control and drive strategies for high efficient high density power converters, drive systems for e-vehicles and renewable energy technologies. As a conference participant you will gain complete access to specialized knowledge within the power electronics industry as well as an overview of the market as well.

Taking a look aheadThe keynote papers are a further highlight of the PCIM Europe 2017 Conference. They cover the development of trends for e-vehicles including charging infrastructure, the impact of power elec-tronics for the future SMART factory (Industry 4.0) as well as the evolution of power supply topol-ogies as a result of new semiconductor devices and enabling technologies. Besides the keynotes, the special sessions deal with advanced passive components and capacitors in addition to smart grid and communication.

Special attention has been paid on the research carried out by young engineers and the presenta-tion of the Young Engineer and Best Paper Awards at the opening ceremony of the PCIM Europe Conference 2017 ranks amongst the conference highlights.

With this outstanding conference agenda and high-quality discussion platform, I am convinced that the PCIM Europe Conference will serve as an international knowledge platform. You will get an overview of key technology developments concerning trends in power electronics and be in-spired to pursue new business opportunities.

I wish you an enjoyable and successful conference, packed with new ideas for your future business.

Welcome AddressTable of Content

Leo Lorenz, General Conference Director, Germany

Wednesday Oral Sessions 30

Wednesday Poster Dialogue Sessions 34

Industry Forum 37

Thursday Oral Sessions 38

List of Exhibitors 42

Industry Forum 44

Room Plan 45

Registration Information 46

General Information 47

PCIM Worldwide 48

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Board

Advisory Board

Bodo Arlt, A Media, Germany

Francisco Javier Azcondo, University of Cantabria, Spain

Mark M. Bakran, University of Bayreuth, Germany

Pavol Bauer, Delft University of Technology, Netherlands

Werner Berns, Texas Instruments, Germany

Frede Blaabjerg, Aalborg University, Denmark

Serge Bontemps, Microsemi PMP Europe, France

Eric Carroll, EIC Consultancy, France

Bruce Carsten, Bruce Carsten Associates, USA

Daniel Chatroux, CEA-LITEN, France

Silvio Colombi, General Electric, Switzerland

Hilmar Darrelmann, Darrelmann + Partner Ingenieure, Germany

Enrique J. Dede, University of Valencia, Spain

Drazen Dujic, Power Electronics Laboratory, EPFL, Switzerland

Hans-Günter Eckel, University of Rostock, Germany

Hans Ertl, Vienna University of Technology, Austria

J. A. Ferreira, Delft University of Technology, Netherlands

Petar J. Grbovic, Huawei Technologies, Germany

Steffan Hansen, Siemens Wind Power, Denmark

Klaus F. Hoffmann, Helmut-Schmidt-University, Germany

Edward Hopper, MACCON, Germany

Ionel Dan Jitaru, Rompower, USA

Nando Kaminski, University of Bremen, Germany

Peter Kanschat, Infineon Technologies, Germany

Ulrich Kirchenberger, STMicroelectronics, Germany

Philip C. Kjaer, Vestas Wind Systems, Denmark

Christopher Kocon, Texas Instruments, USA

Jacques Laeuffer, Dtalents, France

Stéphane Lefebvre, SATIE, France

Romeo Letor, STMicroelectronics, Italy

Andreas Lindemann, Otto-von-Guericke-University Magdeburg, Germany

Stefan Linder, Alpiq, Switzerland

Marco Liserre, Christian-Albrechts-University of Kiel, Germany

Martin März, FhG – IISB, Germany

Gourab Majumdar, Mitsubishi Electric, Japan

Klaus Marahrens, SEW-Eurodrive, Germany

Elison Matioli, POWERlab, EPFL, Switzerland

Mike Meinhardt, SMA Solar Technology, Germany

Thomas Neyer, Fairchild Semiconductor, Germany

Yasuyuki Nishida, Chiba Institute of Technology, Japan

Geraldo Nojima, Eaton Corporation, USA

Yasuhiro Okuma, Fuji Electric, Japan

Masahito Otsuki, Fuji Electric, Japan

Nejila Parspour, University of Stuttgart, Germany

Robert J. Pasterczyk, Schneider Electric, France

Volker Pickert, University of Newcastle, United Kingdom

Bernhard Piepenbreier, University of Erlangen, Germany

Munaf Rahimo, ABB Switzerland, Switzerland

Kaushik (Raja) Rajashekara, University of Houston, USA

Chris Rexer, ON Semiconductor, USA

Katsuaki Saito, Hitachi Europe, Great Britain

Franck Sarrus, Mersen France, France

Andrew Sawle, Infineon Technologies, Great Britain

Achim Scharf, Techmedia International, Germany

Hubert Schierling, Siemens, Germany

Manfred Schlenk, Infineon Technologies, Germany

Manfred Schrödl, Vienna University of Technology, Austria

Walter Schumacher, Braunschweig University of Technology, Germany

Toshihisa Shimizu, Tokyo Metropolitan University, Japan

Christopher A. Soule, Thermshield, USA

Elmar Stachorra, KoCoS Power Grid Services, Germany

Peter Steimer, ABB Switzerland, Switzerland

Bernhard Strzalkowski, Analog Devices, Germany

Wolfram Teppan, LEM Intellectual Property SA, Switzerland

Giuseppe Tomasso, University of Cassino and South Lazio, Italy

Joël Turchi, On Semiconductor, France

Yoshiyuki Uchida, Japan Fine Ceramics, Japan

Peter Wallmeier, Delta Energy Systems, Germany

Dehong Xu, Zhejiang University, China

Peter Zacharias, University of Kassel, Germany

Jean-Paul Beaudet Schneider Electric, France

Eric FavreIMI Precision Engineering, Switzerland

Friedrich-Wilhelm Fuchs Christian-Albrechts-University of Kiel, Germany

Johann Walter KolarETH Zürich, Switzerland

Philippe Ladoux University of Toulouse, France

Josef LutzChemnitz University of Technology, Germany

Jose Mario PacasUniversity of Siegen, Germany

Uwe ScheuermannSemikron Elektronik, Germany

General Conference DirectorLeo Lorenz ECPE, Germany

Honorary Board

Helmut Knöll, University for Applied Sciences Würzburg-Schweinfurt, Germany

Jean-Marie Peter, France

Gerhard Pfaff, University of Erlangen, Germany

Alfred Rufer, EPFL, Switzerland

Board of Directors

Consultatory Board

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Tuesday, 16 May 2017

09:00 Brüssel Conference Opening and Award Ceremony

09:45 Brüssel KEYNOTE »Long Distance Charging Solutions for BEVs: from now to 2030«

10:30 Coffee Break

11:00 Brüssel 1HV-SiC-MOSFET

Brüssel 2Power Converters with Wide Bandgap Devices I

München 1Materials

München 2Sensorless Drives

MailandModular Multilevel Con-verter for HV Applications

13:00 Lunch Break

14:00 Brüssel SiC MOSFET

Brüssel 2Power Converter Design

München 1Current Sensors

München 2New and Renewable Energy Systems

MailandSPECIAL SESSION »Smart Grid & Communication«

15:30 Foyer Entrance NCC MittePoster/Dialogue Session

17:15 Exhibition Party

Wednesday, 17 May 2017

08:45 Brüssel KEYNOTE »The Smart Future of Power Electronics and its Applications«

09:30 Coffee Break

10:00 Brüssel 1Power Converters with Wide Bandgap Devices II

Brüssel 2IGBT

München 1Module Design

München 2Control Techniques in Intelligent Motion Systems

MailandSPECIAL SESSION »Passive Components«

12:00 Lunch Break

14:00 Brüssel 1SiC-Systems

Brüssel 2Power Electronics Optimization

München 1Cooling Thermal Management

München 2Metering and Diagnos- tics and Standards

MailandPassive Components and New Materials

15:30 Foyer Entrance NCC Mitte

Poster/Dialogue Session

Conference Program at a Glance

Sunday, 14 May 2017

14:00 – 17:30 Hotel Arvena Park Görlitzer Str. 51, D-90473 Nuremberg Seminars

Monday, 15 May 2017

09:00 – 17:00 Hotel Arvena Park Görlitzer Str. 51, D-90473 Nuremberg Tutorials

Thursday, 18 May 2017

08:45 Brüssel KEYNOTE »Evolution in Topologies as a Result of New Devices and Enabling Technologies«

09:30 Coffee Break

10:00 Brüssel 1Advanced Wide Bandgap - GaN

München 1Power Electronics in Automotive

München 2Control and Drive Strate-gies in Power Converters

MailandSPECIAL SESSION »Capacitors«

12:00 Lunch Break

14:00 Brüssel 1SiC Modules Diodes

München 1Power Converters with Wide Bandgap Devices III

München 2System Reliability

MailandEnergy Storage and Power Quality Solutions

As of March 2017/subject to change without notice.

Benefit from early-bird rates until 10 April 2017 and save up to 100 Euro!pcim-europe.com/registration

All seminar attendees will receive all seminar documenta-tions. The same applies for the tutorial documentations.

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Seminar 2

Multi-Kilowatt Flyback Converters; Advantages and Practical Design ConsiderationsBruce Carsten, Bruce Carsten Associates, USA

About the instructorBruce Carsten has 46 years of experience in the design and de-velopment of switchmode power converters from 100 mW to 10 kW and 20 kHz to 1 MHz. Although his specialities have become HF magnetics and design for low EMI, his background covers all aspects of switchmode design, from new control methodologies to new topologies, including the active clamp forward converter. He has authored or co-authored 59 papers, and has 17 patents.

Contents

Flyback converters are commonly considered to be of low performance, suit-able only for low power levels where circuit simplicity is important. This is not the case; I have shown that flyback converters are fundamentally similar to forward converters in nearly all aspects, but are actually superior in the utiliza-tion of the power magnetics.

All efficient regulating power converters require an inductor, and all isolated converters also require a transformer. In the flyback converter these are uniquely integrated into a single device, which is smaller, lighter and more ef-ficient than separate transformers and indictors, even compared to other inte-grated magnetic structures.

As a buck-boost topology, flyback converters excel at working over a wide range of input and/or output voltages. They can function well as isolated ac input power factor corrected (PFC) converters, and as such are finding increas-ing use in LED luminaires up to a few 100 watts. This concept has been ex-tended to a 4.5 kW, 50 kHz PFC converter, with 95% efficiency over a wide load range (despite a dissipative voltage clamp), utilizing SiC FETs and Schottky rectifiers.

Flyback converters do have some potential disadvantages, including: pulsating input and output currents; a RHP zero in the control function; and the need to deal with the leakage inductance energy stored in the transformer. As with other basic single stage PFC converters, there is also a twice line frequency ripple on the output voltage, although in 3 phase applications this issue iseasily overcome.

Much of the seminar will deal with solutions to problems in utilizing an exist-ing PFC flyback controller at power levels well beyond the intended applica-tion. The pulsating input and output currents are best dealt with interleaved converters, which require that the controllers be synchronized to a master po-ly-phase clock, and also must be able to share current. All problems encoun-tered and their solutions will be presented, including: noise sensitivity of IC controllers; the slow control loop required of PFC controllers which allows the output voltage to overshoot dramatically on startup and load removal, and in-convenient „features“ built into the controllers which need to be overcome.

Who should attend?This seminar is intended for design engineers who have a potential interest in extending the application of the simple flyback converter to high power levels, but who also want to avoid many of the pitfalls that can occur.

Seminars Sunday, 14 May 2017, 14:00 – 17:30Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg

Seminar 3

What a Design Engineer Should Know About Current-Mode ControlRichard Redl, Redl Consulting, Switzerland

About the instructorDr. Redl is a power-electronics consultant in Switzerland, specializ-ing in power supplies, UPSs, inverters, electronic ballasts, battery chargers and battery management systems, and integrated circuits for power management. He holds twenty-two patents, has written over hundred technical papers and three book chapters, and co-au-thored a book on the dynamic analysis of power converters.

Contents

Current-mode control was introduced in the 1960s and over the years it has be-come one of the most popular control techniques for dc-dc converters. The reason for this is that it has many advantages, including simplified compensation of the feedback loop, increased stability and robustness, inherent pulse-by-pulse current limiting, reduced sensitivity to variations in the input voltage and to circuit pa-rameter values, and easy load-current feedforward for superior load transient re-sponse. It has several flavors to choose from and unlike some other two-loop control techniques (V2, R3) it can be used with all types of square-wave converters. The concept can also be extended to resonant converters, e.g., the LLC converter. This seminar presents an overview and critical comparison of the various cur-rent-mode control techniques, discusses the latest developments in modeling and stability analysis, and provides design guidelines.

The following topics will be covered: 1. Introduction 1.1. Basic concept of current-mode control 1.2. Advantages and disadvantages 1.3. History 2. Classification and characteristics 2.1. Constant-frequency control (peak, valley, PWM conductance) 2.1.1. Stability of the current loop 2.2. Variable-frequency control (constant-off-time, constant-on-time, hysteretic) 2.3. Derivatives and improvements (average-current control, charge control, inductor-voltage-integral control, emulated current control, line-voltage and load-current feedforward combined with current-mode control, capacitor-current control, combining current-mode control with ripple- based voltage-mode control) 3. Large-signal and small-signal modeling, feedback-loop design, high- frequency stability analysis 3.1. Simplified large-signal model 3.2. The Ridley model (large-signal, small-signal) 3.2.1. Z-transform based analysis of the current loop 3.3. Describing function analysis and small-signal model by Li and Lee 3.4. Feedback-loop design considerations 3.5. Harmonic balance based fast-scale stability analysis of the feedback- regulated current-mode-controlled converters by Fang and Redl (frequency shift of the hysteretic converter, period-doubling instability of the constant-on-time, constant-off-time or constant-frequency converters) 4. Practical issues 4.1. Current-sensing solutions (switch current, diode/synchronous rectifier current, inductor current, capacitor current) 4.2. Using the current loop for current limiting 4.3. Feedback-loop design for droop 4.4. Current-mode control of multi-phase converters

Who should attend?The target audience of this seminar is power-supply design engineers, power-management IC designers, system designers, project managers, engineering students, and all other profession-als interested in the theory and application of current-mode control of dc-dc converters.

Seminar 4

Modern Magnetic Technologies for High Efficiency and High Power DensityIonel Dan Jitaru, Rompower, USA

About the instructorIonel “Dan“ Jitaru is the founder of Rompower Inc. an interna-tionally recognized engineering firm in the field of power conver-sion, later Ascom Rompower Inc. and Delta Energy Systems (Arizona) Inc. Presently he is the president of Rompower Energy Systems Inc. He has published 52 papers wherein several of them have received the best paper award, and held 45 profes-sional seminars at different International Conferences in the power conversion field. Mr. Jitaru has pioneered several trends in power conversion technologies such as “Soft Switching PWM”, “Full integrated multilayer PCB Magnetic”, “Synchro-nized rectification” and recently “True Soft Switching technolo-gies” wherein the primary switchers turn on at zero voltage and the secondary switchers turn off at zero current. Some of these technologies have been covered by 63 intellectual properties wherein 37 are granted patents.

Contents

This seminar will present a comprehensive overview of the modern magnetic technologies presently used in power conversion and new trends in magnetic technologies developed to address the new demands. In the quest for higher power densities and higher efficiency, magnetic technologies were forced to adapt. New magnetic structures have been developed as a result. In spite of the significant progress in the semiconductor industry, the magnetics technol-ogy lags behind. Presently, in most of the advanced implementations, the power dissipation in magnetics is the largest percentage of the total power dissipation. The seminar will start by presenting several key characteristics of magnetics such as leakage inductance, stray inductance, inter-winding and in-tra-winding capacitances and their impact in power conversion performance. Methods of measuring and controlling these parasitic elements are also pre-sented. The seminar will present the most suitable magnetic technology for different topologies designed to enhance the efficiency and power density. A chapter is dedicated to quasi-integrated and integrated magnetics. Methods of calculating and simulating such structures will be presented. A particular im-plementation wherein two independent transformers are placed on the same magnetic core without mutual interference, this will highlight the presenta-tion, by offering a better understanding of the flux distribution in the magnetic core. Magnetic technologies for specific applications such as very low voltage and high current will be presented together with experimental results. The seminar will also show some present and future trends in magnetics for higher frequency operation. The presentation will be highlighted with design guid-ance, design example and experimental results.

Who should attend?This seminar is designed for power conversion engineers, magnetic engineers, and technicalmanagers who are involved in state-of-art power conversion. The attendees will get familiarwith the latest advancement in magnetics in power conversion aimed to increase theperformance and reduce the total cost.

Seminar 1

Basics of Electromagnetic Compatibility (EMC) of Power SystemsJacques Laeuffer, Dtalents, France

About the instructorJacques Laeuffer has a 35 years’ experience of R&D in Power Electronics, inside international companies, with powers from 10 W up to 10 MW, including HF resonant converters and high voltage transformers, electric machines and inverters for hybrid cars. He is inventor of 27 granted patents and author of over 80 technical papers. Affiliated professor at Ensta-ParisTech, he is also a teacher at CentraleSupelec, France, and for inter and intra companies international trainings, about power electron-ics, EMC, electric machines, digital control, mechatronics, cars powertrains, and history of physics.

Contents

Fast semiconductors commutations are required for efficiency of high fre-quency (HF) power converters and drives, and their wide bandwidth control electronics. These sudden front edges generate perturbations in control cir-cuits, especially analog ones, and on public utility power networks. This seminar shows step by step how perturbations propagate, as Differential Mode (DM) and Common Mode (CM), how to reduce noisy oscillations from the beginning, how to design and implement robust control electronics, how to calculate and optimize DM and CM filters for EMC standards compliance, how to avoid expensive shielding and improve reliability. Number of practical designs are analytically calculated, showing orders of magnitudes for a wide range of powers and frequencies.

Differential Mode (DM) management and filtering Within control: resistive, inductive and capacitive coupling. Reduction by

ground planes. Wiring strategies evolution form “star connection” to “net connection”. Switching power supply operating sequence as EMI source. Distur-

bances from transistors and diodes. Spectrum analysis. Line diodes recovery. Line inductance effect.

Disturbances calculations. Measurement according to Standards by L.I.S.N. and Spectrum Analyzer.

DM filter calculation, including damping. Design of L, C and R components.

Some MHz perturbations evaluations. Reduction means. Common Mode (CM) management and filtering Within control: implementation and interconnection between PCBs and

between cabinets. CM parasitic coupling calculation and reduction. Signal transmission by lines and by optics.

Switching power supply operating sequence as EMI source. CM capacitances of heatsinks, transformers, screens, electric machines stators. Disturbances calculations. Measurement according to Standards. CM filter calculation. Leakage current constraint. Coupled inductance design.

EMC Commutation Control of Power Semiconductors Tuning commutation times as a trade-off between switching losses and EMC. Calculation of di/dt and dv/dt front edges of semiconductors according to

gate drive. Gate drive circuit designs for MOS and IGBTs.

Who should attend?This seminar is targeted towards engineers and project managers, who design, specify, sim-ulate, tune, integrate high frequency power supplies, converters, EMC filters, electric ma-chines, and intelligent motion including inverter + power cable + electric machine, for high efficiency conversion, low global cost and high reliability.

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Seminar 5

Power Electronics and Control for Battery SystemsRegine Mallwitz, Technische Universität Braunschweig, GermanyMike Meinhardt, SMA Solar Technology, Germany

About the instructorsProf. Regine Mallwitz has been held the professorship for Power Electronics at the Technische Universität Braunschweig for 2 years. Before, she worked in R&D positions in different areas of power electronics for instance in the semiconductor module de-velopment at Infineon Technology AG, Germany, and PV inverter development at SMA Solar Technology AG, Germany.

Prof. Mike Meinhardt is head of Innovation Management at SMA Solar Technology AG, Germany and has over 20 years of experience in photovoltaic and off-grid inverters in industrial R&D as well as research institutes and universities. He is honor-ary professor at the University of Kassel.

Contents

Renewable energies will play a major role in future electric energy supply. With the growing portion of renewable energies in relation to conventionalenergy sources in public grids the need for energy storage and grid connected battery systems is also growing. Otherwise smaller off-grid battery systems are known for several years. For grid-tied battery energy systems power elec-tronics are needed to convert the DC power of the battery to AC power and vice versa. These systems coupled to the public grid and have to fulfill the spe-cific grid codes. However, off-grid battery inverters deliver stable, sinusoidal AC Voltage and at the same time high AC currents to trip fuses. In this way, each type of system is characterized by specific requirements which affects the power electronics but also the control strategies. These power electronics aspects and control strategies are in the main focus of this seminar. Require-ment and functionality are derived and solutions are presented as well as one example of a commercially available battery inverter. The seminar discusses also the most important battery types and gives a systematic overview about the different types of battery systems on the market today and in the future.

Who should attend?This seminar is interesting to beginners and advanced participants from university and in-dustry (incl. utilities) as it includes a perfect mixture of different aspects of power electron-ics and control strategies. The seminar comprises theoretical parts on power electronic topologies and control structures as well as practical aspects on design consideration of off-the-shelf inverters for battery applications.

Seminar 6

Power Supply Design Review: Achieving 98% Efficient Power Supplies Using GaN FETsEric Persson, Infineon Technologies, USA

About the instructorEric Persson’s career spans 20 years of hands-on power converter and inverter design, followed by 17 years of applications engi-neering in the semiconductor industry at International Rectifier, now Infineon Technologies. He is presently heading GaN Applica-tions worldwide for Infineon. Eric has presented more than 80 tu-torials and papers at various international conferences. He is a regular lecturer, presenting short courses and tutorials at UW Madison, the University of Minnesota (his Alma Mater) and Pur-due University. He is Chairman of the Power Source Manufactur-ers Association (PSMA) board of directors, and Program Chair for APEC 2017. Mr. Persson holds 13 patents, and is a recipient of the IEEE Third Millennium Medal.

Contents

Achieving an overall peak efficiency of 98% in a server/telecom power supply has been a challenge for many years. To do so while also meeting density and cost goals is now a reality, by taking advantage of the performance benefits of GaN transistors. This seminar takes you through a complete power supply de-sign in the 1-3 kW range. We will compare conventional high-efficiency silicon designs to even higher efficiency designs based on GaN HEMTs. The compari-sons are based on actual reference designs using the latest devices. The seminar is in two parts, first for the PFC front-end, and the second for the LLC back-end DC-DC converter.

The PFC section covers: Totem-pole full-bridge topology The tradeoffs of Continuous versus Critical Conduction Mode Balancing switching versus conduction loss Control strategy Magnetic considerations Gate drive EMI filter design Thermal management Handling line cycle drops and surge Performance example

LLC DC-DC converter stage: Control strategy, LLC vs LCLC Optimizing magnetizing current, deadtime versus GaN Qoss Magnetic design options Primary-side gate drive Synchronous Rectifier: Control, FET options and gate drive Thermal management Output filter design Managing fault conditions Performance example

Overall system performance, summary and conclusions.

Who should attend?This seminar is intended for designers and engineers involved in high efficiency power sup-ply design. It assumes a working knowledge of power electronic fundamentals, and a famil-iarity with power supply topologies and design principles.

Seminar 7

Design of Magnetic Components for High Power Electronics ConvertersTomás Pagá, Enerdrive, Switzerland

About the instructorTomás Pagá, born in Venezuela in 1969, received his B.S andM.S. degrees from Simón Bolívar University in Caracas, Venezu-ela in 1994 and 1999 respectively. He was university professor and researcher until 2000. From 2001, he has been Power Elec-tronics Converter Designer for industry, railway and renewable energy applications. Currently he works as consultant in High Power Electronics for Enerdrive GmbH in Zurich, for manufactur-ers of multi-megawatt wind energy and drives power converters. His research interests include high power electronics convertersdesign, magnetic components modeling and design, modelingof power electronics components, thermal management and high frequency converters.

Contents

Filter chokes and transformers for high power converters, ranging from hun-dreds to thousands of kW, are commonly one of the most costly and difficult components to design. Desired electrical performance and tight restrictions in weight, volume and cooling represent a challenging compromise for the de-signer. In this seminar he addresses topics from how to specify the compo-nents for outsourcing to how to get deep inside the detailed design itself. References, test results and failure examples from real cases are presented. The seminar will be based on a design case, where the main design problems for each step will be addressed. Analytic, Finite Element Method and Circuit Simulation tools will be used during the design. Losses calculation and mea-suring are treated in detail. Losses produced by the switching high frequency components are often miscalculated resulting in poor thermal performance. High frequency losses curves of laminated magnetic steel are commonly not available from the suppliers, so the designer faces with the need of high fre-quency losses measuring methods. Losses measurement error sources, like low power factor and angle errors, are explained in detail and methods to overcome those issues will be discussed. Additional sources of losses due to winding resistance, skin/proximity effect and fringe flux on the air-gaps will also be addressed. Finally, cooling methods and mechanical design consider-ations for robustness and acoustic noise reduction are discussed.

Fields of application: Grid Connected Converters

- Solar Inverters - Wind Generators - UPS systems

Electrical Drives - Traction Drives - Wind Generators

Isolated Grid Supplies - Railway Auxiliary Converters - UPS systems

Simulation and measurement methods for validation.Cooling and mechanical design topics.

Who should attend?Engineers and project managers involved on the design, specification and integration of transformers and inductors for high power electronics converters. High power electronics converter designers. Magnetic components, inductors and transformers, designers andmanufacturers.

Program: Field of application. Magnetic design basic concepts. Design case. Analytical calculation. Finite Element modeling. Interaction with the PE converter. High frequency losses estimation. Additional losses.

Seminars Sunday, 14 May 2017, 14:00 – 17:30Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg

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Tutorials Monday, 15 May 2017, 09:00 – 17:00Venue: Arvena Park Hotel Nuremberg, Görlitzer Str. 51, 90473 Nuremberg

Tutorial 1

New Trends in Power Conversion for Very High Efficiencyand High Power DensityIonel Dan Jitaru, Rompower, USA

About the instructorIonel “Dan“ Jitaru is the founder of Rompower Inc. an interna-tionally recognized engineering firm in the field of power conver-sion, later Ascom Rompower Inc. and Delta Energy Systems (Arizona) Inc. Presently he is the president of Rompower Energy Systems Inc. He has published 52 papers wherein several of them have received the best paper award, and held 45 profes-sional seminars at different International Conferences in the power conversion field. Mr. Jitaru has pioneered several trends in power conversion technologies such as “Soft Switching PWM”, “Full integrated multilayer PCB Magnetic”, “Synchro-nized rectification” and recently “True Soft Switching technolo-gies” wherein the primary switchers turn on at zero voltage and the secondary switchers turn off at zero current. Some of these technologies have been covered by 63 intellectual properties wherein 37 are granted patents.

Contents

Presently, we are reaching 99% efficiency in PFC and DC-DC Converters by using the latest technologies, ranging from topology, magnetics and control. The developments in semiconductor technology such as GaN and SiC have en-abled us to further improve the efficiency exceeding the 99% efficiency in some applications. The goal of this seminar is to teach how to increase the ef-ficiency and power density in power converters. The first part of the seminar will identify the loss mechanisms in different power conversion applications. The next chapter will be dedicated to the latest improvements in topologies designed to minimize these loss mechanisms. Soft switching topologies have become popular in many applications in the last thirty years. Though we have such a long tradition in soft switching technologies, some of these topologies, have added too much complexity and their practical use become questionable due to the hardware cost and complexity. The goal is to have a simple and low cost hardware and an intelligent control designed to minimize the losses under different operating conditions. This seminar will present topologies which pro-vide true soft switching. In the true soft switching topologies, the primary switching devices are turning on at zero voltage and the secondary switching devices are turning off at zero current. There is neither ringing nor spikes across any of the switching devices during operation, without the use of any snubbers. These topologies are derived from the classical topologies, such as flyback, boost, two transistor forward, half bridge, and full bridge with some minor modification with the use of intelligent control to obtain true soft switching. A detailed power dissipation analysis in several applications will highlight the need for magnetic optimization. In spite of the significant prog-ress in the semiconductor industry, the magnetics technology lags behind. The seminar will describe the impact of the parasitic elements in the magnetics in optimizing the performance of the power converters. In the quest for 99% effi-ciency the magnetics and the packaging become key factors in efficiency opti-mization. The seminar will present the impact of intelligent power processing in optimizing the efficiency and even in converting a traditional hard switching topology into a soft switching topology. The presentation will be highlighted with many design examples and experimental results such as 99%+ efficiency PFC with power densities above 1000W/in3, and 99% efficiency isolated DC-DC Converter.

Who should attend?This course is designed for power conversion engineers, magnetic engineers, and technicalmanagers who are involved in state-of-art power conversion. The participants will get famil-iar with the latest advancement in magnetics in power conversion aimed to increase the per-formance and reduce the total cost.

Tutorial 2

What a Design Engineer Should Know About Power Factor CorrectionRichard Redl, Redl Consulting, Switzerland

About the instructorDr. Redl is a power-electronics consultant in Switzerland, special-izing in power supplies, UPSs, inverters, electronic ballasts, bat-tery chargers and battery management systems, and integrated circuits for power management. He holds twenty-two patents, has written over hundred technical papers and three book chap-ters, and co-authored a book on the dynamic analysis of power converters.

Contents

The European norms EN61000-3-2 and EN61000-3-12 require that the current harmonics of all line-connected equipment stay below the limits set by those norms. In the case of equipment with a rectifier front end this is usually achieved by adding a power-factor correction (PFC) circuit to the system. This tutorial presents the causes of, and motivations for, PFC (nonlinear loads, line-current distortion and its effects on power transmission and power qual-ity, harmonic regulations), discusses the energy storage considerations, intro-duces the basic passive and active solutions for single-phase and three-phase PFC, and reviews and evaluates the most interesting new developments.

The following topics will be covered:1. Introduction 1.1. Power factor definitions 1.2. Causes and effects of line-current harmonics 1.3. Overview of the harmonic regulations

2. Single-phase PFC solutions 2.1. Passive PFC (choke, LC and LLC waveshaping) 2.2. Active PFC 2.2.1. Energy storage considerations 2.2.2. Power-circuit topologies 2.2.2.1. Boost PFC and its derivatives (voltage-doubler, interleaved, multilevel) 2.2.2.2. Other nonisolated converters (buck, two-switch buck-boost, SEPIC, Cuk, hybrid resonant) 2.2.3. Isolated PFC (flyback without or with high-efficiency postregula- tion, isolated boost, transformer-coupled higher-order converters, bridgeless isolated converters, nonisolated PFC and isolated down- stream converter combination, isolated single-stage converters with energy storage on the input side, charge-pump PFC) 2.2.4. Control techniques 2.2.4.1. Standard average-current control 2.2.4.2. Boundary conduction control 2.2.4.3. Inductor current control with modulated ramp 2.2.4.4. Voltage-follower control with distortion reduction 2.2.4.5. Controlling the two-switch buck-boost PFC 2.2.4.6. Current reference signal generation 2.2.4.7. Control for high efficiency 2.2.4.8. Reducing capacitor current stress 2.2.4.9. Design examples 2.2.5. Practical issues (inrush current limit, generating bias power, protection, EMI reduction)

3. Three-phase PFC solutions 3.1. Passive PFC 3.1.1. Rectifier bridge with dc-side or ac-side inductors 3.1.2. Harmonic filter 3.1.3. Multi-pulse rectification 3.2. Active PFC 3.2.1. Rectifier bridge and dc-side CCM boost converter combination 3.2.2. Boost PFC in discontinuous inductor current mode 3.2.2.1. Single-switch boost 3.2.2.1.1. Distortion reduction by harmonic injection 3.2.2.2. Two-switch zero-voltage-switching boost (“Taipei rectifier”) 3.2.2.3. Three-level Taipei rectifier 3.2.3. Buck PFC in discontinuous capacitor voltage mode 3.2.4. Boost PFC in CCM 3.2.4.1. Two-level Y and Δ converters 3.2.4.2. Two-level bidirectional PFC 3.2.4.3. Three-level PFC 3.2.4.3.1. Low-frequency (“slow-switching”) version 3.2.4.3.2. High-frequency version (“Vienna rectifier”) 3.2.4.3.2.1. Topologies 3.2.4.3.2.2. Control 3.2.5. Buck PFC 3.2.6. Four-switch buck-boost PFC 3.2.7. Phase-modular and single-stage isolated PFCs

Who should attend?This seminar is recommended to power-supply design engineers, system designers, manag-ers, engineering students, PFC IC designers, and all other professionals interested in pow-er-factor correction or line-harmonics reduction

Tutorial 3

Electromagnetic Design of High Frequency Convertersand DrivesJacques Laeuffer, Dtalents, France

About the instructorJacques Laeuffer has a 35 years’ experience of R&D in Power Electronics, inside international companies, with powers from 10 W up to 10 MW, including HF resonant converters and high volt-age transformers, electric machines and inverters for hybrid cars. He is inventor of 27 granted patents and author of over 80 techni-cal papers. Affiliated professor at Ensta-ParisTech, he is also a teacher at CentraleSupelec, France, and for inter and intra com-panies international trainings, about power electronics, EMC, electric machines, digital control, mechatronics, cars power-trains, and history of physics.

Contents

Increasing high frequencies (HF), i.e. with wide bandgap semiconductors, lead to new challenges. The “wiring inductance” issue is dramatically increased. Windings show “parasitic capacitances”. Electric machines suffer insulation breakdowns by HF ringing over voltages.

As a matter of fact, reduced commutations times become smaller than electro-magnetic propagation delays, inside power conversion and intelligent motion systems. Thus conventional “electric circuit” equations do not operate any-more as before. The tutorial shows a new appropriate physical analysis to un-derstand what happens, and make designs without noisy resonances and emissions, over voltages, extra losses. This way, full benefits from new semi-conductors become possible. The tutorial shows 3D distributions of energies and powers, and focus on main phenomena to lead to simpler calculations.

Number of practical designs are calculated, analytically and/or by simulation, showing orders of magnitudes for a wide range of powers, frequencies and im-pedances.

Introduction Examples of issues. Noisy ringing inside converters and magnetics.

Damping. Expected and non-expected actions of electromagnetic fields. Conduction and radiation. Differential mode (DM) and common mode (CM). Magnetic dominant and electric dominant fields.Tracks and Wiring Design

Propagation on lines. Four impedances and speed. Power propagation, or filtering, or oscillation. Examples. Design bifilar, coaxial, and strip lines accordingly.

Commutation loop with semiconductors and DC capacitor. SMD semiconductors and stacked capacitor layout. Power module, DC capacitor and busbars geometry.Capacitors and Windings Design

Medium frequency (MF) capacitors sizing. Capacitors HF propagation management.

MF sizing of foil, planar and multi-layers transformers. Sizing of electric machines stators windings. HF propagation in these windings.

Windings equivalent schematics and simulation. Propagation delays calculation. How to avoid ringing. Design workflow for low EMI and low HF losses.

Proximity effect and optimization.Converters and Drives Design

Power propagation in converters. SiC and GaN. Cases of flyback, forward, bridge, ZVS and ZCS.

Matching components and layout HF impedances. Intelligent motion drive made of inverter, electric machine, cable, shielding

and ground, as DM and CM. HF simulation algorithms of the system, and design workflow for low EMI.

Radiations Reduction Examples of emissions of electric and magnetic fields. Fields measurements and reduction. Neighbor field and far field identification. Examples. Wiring, grounding, shielding, packaging.

Who should attend?This tutorial is targeted towards engineers and project managers, who design, specify, simu-late, tune, integrate high frequency power supplies, converters, EMC filters, electric ma-chines, and intelligent motion including inverter + power cable + electric machine, for high efficiency conversion, low global cost and high reliability..

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Tutorial 4

High Performance Control of Power ConvertersChristian Peter Dick, Jens Onno Krah, Cologne University of Applied Sciences, Germany

About the instructorChristian P. Dick studied Electrical Engineering at RWTH Aachen University, Germany, where he also received his PhD degree. Be-ginning of 2011 he joined SMA Solar Technology AG as director for advance development of solar converters up to 20kW. He is now professor for power electronics and electrical drives at Co-logne University of Applied Sciences. Since years, Christian Dick is member of VDE and IEEE. His main research interests are reso-nant converters and the large-scale utilization of renewable en-ergy, including automation and safety aspects.

Prof. Dr. Ing. Jens Onno Krah studied electrical engineering at the University Wuppertal and obtained his PhD 1993 by Prof. Holtz within electrical drives research. Until February 2004 he worked as technical director for Kollmorgen, formerly Seidel Servo Drives. He was responsible for the development of the Koll-morgen Servo Drives. Since March 2004 Prof. Krah teaches con-trol engineering at the University of Applied Sciences Cologne.

Contents

Utilizing power electronic based converter technology is a key approach to build energy efficient solutions. Due to the innovation cycles of the semicon-ductor suppliers the size and the cost of the more and more complex inverter systems is not increasing. However, especially the new fast switching wide bandgap devices (SiC & GaN) are challenging the control hardware. The ad-vanced control architectures are covered by discussing algorithms and possi-ble implementations using μC, DSP and FPGA technology. Robust controller designs with well-defined set up procedures or reliable self-tuning algorithms can help to use these innovations utilizing a reasonable set-up time.

1. Converter Design Basics IGBT, MOSFET, SiC Buck, 2-Quadrant Chopper State-machine based dead time generation 2-Level / 3-Level Inverter - including Energy Efficiency Classes Gate driver basics Flyback, resonant LLC

2. Inverter Modulation Techniques Single Phase Modulator Pulse Width vs. Pulse Frequency Modulation 2-Level / 3-Level SVM

3. Analog to Digital Conversion Sigma-Delta DAC versus R-2R DAC and PWM Sigma-Delta Modulation Sinc³ decimation filtering Efficient FIR implementations, Demonstration, Examples

4. Current Sensing Transducer versus shunt Synchronous sampling Aliasing, EMI suppression 2 vs. 3 current probes in 3~ Loads

5. Current Control Hysteresis Control Sampling Control Synchronous Control (FOC): Clarke, Park, decoupling Hybrid control (single-phase) PLL Dead-Time Compensation Buck, Flyback, resonant LLC

6. Current Prediction Modeling the Plant Smith Predictor Current Observer

7. Parameter Tuning Theoretical background Parameter estimation

8. Conclusion and Future Trends

Who should attend?This tutorial will be especially valuable for engineers and PhD’s who address the following control aspects:

Digital Motion Control

Mains Control, including PFC

High-Bandwidth Sensor Circuitry including Robust Signal Transmission

Modulation Techniques

Controller Implementation using FPGA

Controls-Related Novel Converter Issues like Wide-Bandgap Devices

Tutorial 5

Advanced System Design with Ultra-Fast Si/SiC/GaN Power Semiconductor DevicesTobias Reimann, ISLE Steuerungstechnik und Leistungselektronik, GermanyThomas Basler, Infineon Technologies, Germany

About the instructorTobias Reimann received 1994 his PhD from the Technische Uni-versität Ilmenau in the field of power semiconductor applications for hard and soft switching converters. In 1994 he was one of the founders of the company ISLE GmbH which is engaged in system development for power electronics and electrical drives. He is re-sponsible for the operational business of this company. In addi-tion, since July 2009 he is Professor for Industrial Electronics at the Technische Universität Ilmenau. Prof. Reimann is a member of scientific board of “Thuringian Center of Excellence in Mobility (ThIMo)” at the Technische Universität Ilmenau in the field of au-tomotive electronics.

Thomas Basler received his Diploma in Electrical Engineering from Chemnitz University of Technology in 2009. His Diploma thesis was on the robustness of power diodes. Between 2009 and 2013 he was a member of the scientific staff at the Chair of Power Electronics and Electromagnetic Compatibility at Chemnitz University of Technology. At the beginning of 2014 he received his PhD. His thesis is about short-circuit and surge-current rug-gedness of IGBTs and was supervised by Prof. Dr. Josef Lutz. 2014 he joined Infineon Technologies AG, Neubiberg, Germany, where he works on the development of SiC MOSFETs, diodes and Si IGBTs.

Contents

Fast Power Devices / Modules / Reliability New developments in fast power devices (SiC/Si MOSFETs, IGBTs, GaN

devices, freewheeling diodes) Device design, properties and suitable applications Reliability topics of (new) devices, e.g. gate oxide, dynamic Ron, cosmic ray

ruggedness Power module layouts and optimal design for low inductivity Thermal mismatch, thermal stress, power cycling capability

Drive and Protection Principles, technical realizations Special driver requirements for fast power devices (Si, SiC, GaN) Failure modes, failure detection

Topology-dependent Power Losses

dc/dc-converter dc/ac-converter Load Cycles Calculation of heat sink

Device Induced Electromagnetic Disturbance Parasitics Oscillations in Power Modules

Special Topics of ApplicationConsideration of special problems and questions of participants, for example:

Parallel/series connection of power devices Special effects in ZVS/ZCS topologies Special problems related to new device technologies Short-circuit ruggedness of IGBTs and SiC MOSFETs

Who should attend?Engineers designing converters equipped with fast power semiconductors like Si/SiC MOS-FETs, IGBTs and diodes having basic knowledge in power devices and power converters.

Tutorial 6

Design Considerations for High Frequency Linear MagneticsBruce Carsten, Bruce Carsten Associates, USA

About the instructorBruce Carsten has 46 years of experience in the design and de-velopment of switchmode power converters from 100 mW to 10 kW and 20 kHz to 1 MHz. Although his specialities have become HF magnetics and design for low EMI, his background covers all aspects of switchmode design, from new control methodologies to new topologies, including the active clamp forward converter. He has authored or co-authored 59 papers, and has 17 patents.

Contents

In this tutorial the potential advantages of using internal cooling passages for significantly improved heat dissipation and power density in larger power mag-netics will be shown. A comprehensive survey and ranking is provided on the propensity of various transformer, inductor and ‘hybrid’ or integrated magnetic structures to generate external magnetic fields, and thus significant potential EMI problems. Some new material will discuss the myths and misunderstand-ings of “coaxial” transformers, and their evident confusion with transmission line transformers. As in earlier versions, the tutorial focuses on an intuitiveunderstanding of transformers and inductors. The basic design equations are provided, along with practical information “learned the hard way” which is not found in the text books.

Topics include: The basics: Ferromagnetic Materials, Magnetic Energy Storage & Electro-

magnetic Energy Coupling Inductor Design: Maximizing Energy Storage, Winding Capacitances &

Stray Fields Transformer Design: Leakage Inductance, Stray Fields, and use of Faraday

Shields Measurement of Transformer Magnetizing and Leakage Inductances Calculation vs Measurement of Transformer Winding Capacitances Design Optimization Scaling Laws beyond the “Area Product”; Exploring Size and Shape Effects Thermal Management Considerations Magnetics Design Guidelines

Who should attend?The tutorial is directed towards engineers who design or specify high frequency transform-ers and inductors, but any power electronic designer or project manager will benefit from an improved understanding of their capabilities, characteristics and limitations.

Tutorial 7

Reliability of Si and SiC Power Devices and PackagesJosef Lutz, Chemnitz University of Technology, Germany

About the instructorJosef Lutz joined Semikron Electronics, Nuremberg, Germany in 1983. First he worked in the development of GTO Thyristors, then in the field of fast recovery diodes. He introduced the Controlled Axial Lifetime (CAL) diode. Since August 2001 he is Professor for Power Electronics and Electromagnetic Compatibility at the Chemnitz University of Technology, Germany. His main fields of research are ruggedness and reliability of power devices. He is involved in several national and international research projects regarding power cycling lifetime of IGBT modules and further reli-ability aspects. He is one of the authors of the book “Semicon-ductor Power Devices – Physics, Characteristics, Reliability”, published by Springer 2011.

Contents

This tutorial focuses on thermal problems and other lifetime-limiting mecha-nisms in power devices; aspects going from Si to SiC are considered.

1. Basic architecture of Si and SiC power modules and discrete packages2. Materials, substrates and interconnection technologies 3. Heat transport, thermal resistance, thermal impedance, cooling methods4. Temperature determination

Virtual junction temperature: Definition, measurement Temperature sensitive electrical parameters in Si, SiC, GaN

5. Fatigue processes, fatigue detection, related tests6. Power cycling as main method to determine package related lifetime expectation

Experimental setup, test strategies Test according to the German automotive standard LV 324 New methods for state-of-health analysis Temperature measurement accuracy improvement

7. Empirical models for lifetime prediction LESIT model, CIPS 2008 model Application of available models, limits, work on new models Special aspects with SiC devices Special aspects with discrete packages

8. Improved technologies and future trends for increased lifetime expectation Diffusion sintering, Diffusion soldering, Improved bond wires, Improved substrates

9. Gate oxide reliability in Si and SiC 10. Some aspects on cosmic ray reliability

Who should attend?Engineers in design of converters with IGBTs and SiC devices with interest in reliability, be-ginners as well as experienced engineers are welcome.


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Tutorial 8

Driving Electric - Power Train, Battery, Wireless Charging and Autonomous DrivingNejila Parspour, Peter Birke, Dan Keilhoff, University of Stuttgart, GermanyMartin Doppelbauer, Karlsruhe Institute of Technology, Germany

About the instructorsNejila Parspour is Professor of Electrical Energy Conversion at the University of Stuttgart and director of the Institute of Electrical Energy Conversion (iew). She received her Master in electrical engineering in 1991 and her PhD in 1995, both from Technical University of Berlin. Before joining the University of Stuttgart and after a Postdoc work at the University of Berkley, she collected five years of industrial experience at Philips as senior manager in the area of industrial X-ray and six years of scientific experience at the University of Bremen. Her research and teaching activities are in the field of electrical machines and drives with a focus on machine design and in the field of contactless energy transfer with a focus on inductive charging systems. In the field of elec-tromobility Nejila Parspour has meanwhile acquired in-depth knowledge due to her intensive scientific work during the last14 years, particularly in developing position-tolerant inductive charging systems and high efficiency electrical motors.

Prof. Dr Kai Peter Birke obtained his PhD in materials science (ion conducting ceramics) from the University of Kiel in 1997. In 1998, he joined the Fraunhofer-Institute for Silicon Technology, Itzehoe, Germany, to work on the development of proprietary Li-Ion lami-nated cell with a functional ceramic separator and co-founded two spin-offs to put this technology into production. After being involved in the development and production of pouch type lami-nated (PoLiFlex) Li-Ion cells at Varta for five years, Dr. Birke joined Continental AG in Berlin in 2005, first as a project leader in energy-storage systems. He became senior technical expert in battery technology and team leader in cell technology, and in 2010 was appointed Head of Battery Module and Electromechan-ics. Dr. Birke has 22 years of experience in research, develop-ment, and production of energy storage systems with a focus on Li-Ion technology. Since 2015 he has been a full Professor at the University of Stuttgart, covering the field of Electrical Energy Storage Systems.

Dr. Dan Keilhoff received his diploma in Automotive Engineering in 2004. He worked 8 years at the Daimler AG, being responsible for the development of software functions for the exhaust gas af-tertreatment system. He joined the Stuttgart University in 2012. His topic for the following 4 years was research regarding opera-tion strategies for hybrid powertrains and powertrain simulation. After receiving his PhD in 2016 he became the assistant of Prof. Reuss, who holds the chair for Automotive Mechatronics. The work field of Dr. Keilhoff is research and teaching in terms of au-tomated and connected driving.

Prof. Doppelbauer worked for 15 years in the industry, lastly as Senior Manager of the Electric Motor R&D department at SEW Eurodrive, Bruchsal. He joined the Karlsruhe Institute of Technol-ogy in 2011 where he holds a chair for Hybrid Electric Vehicles at the Institute of Electrical Engineering. Prof. Doppelbauer is also actively working in international standardization of rotating elec-tric machines and currently the chairman of IEC Technical Com-mittee 2.

Contents

This tutorial aims giving an overview about the state of the art in electric driv-ing and showing the newest trends in research and technology. In particular, four subjects will be introduced and discussed. These are powertrain, induc-tive charging, battery system and autonomous driving. Each subject will be treated in a session including a presentation followed by a question and answer part. The tutorial will start with the presentation entitled Inductive Charging. After a brief review of transformer basics, requirements and specific behavior of inductive charging systems are identified. Besides analytical calculation,

especially with different reactive power compensation topologies, a classifica-tion as well as the principles of operation will be explained and safety and reli-ability of contactless energy transfer will be discussed. The second presentation entitled Battery systems deals with actual and future battery technologies and will give an introduction to the principle of function of Lithi-um-Ione cells followed by a discussion of the power density and energy den-sity development, materials, new battery trends, cell technology and the vision of electric energy storage and the operating range. The third presentation is entitled Electric Drives of Hybrid and Battery Electric Vehicles. Main contents are drive configurations as well as operating principles and behaviors of elec-tric machines and drivetrains. Further, special features of permanent magnet synchronous motors will be introduced. The presentation closes with an over-view of new electric motor designs and an outlook to future developments. The tutorial will be closed by the presentation entitled Automated driving of electric vehicles. Starting with a definition and classification of the autono-mous driving, the focus of this presentation will be on the partial automation of electric vehicles in order to improve energy consumption as well as on field studies with volunteers to investigate the acceptance of automated driving.s

Who should attend?People who want to get an overview on current developments in the field of electrical driv-ing, particularly on power train, inductive charging, battery system and autonomous driving.

Tutorial 9

Design Challenges for High Frequency Magnetic Circuit Design for Power ConversionWilliam Gerard Hurley, Werner Hugo Wölfle, National University of Ireland, Ireland

About the instructorsWilliam Gerard Hurley received the B.E. degree in Electrical Engi-neering from the National University of Ireland, Cork in 1974, the M.S. degree in Electrical Engineering from the Massachusetts In-stitute of Technology, Cambridge MA, in 1976 and the PhD de-gree at the National University of Ireland, Galway in 1988. He worked for Honeywell Controls and Ontario Hydro in Canada from 1977 to 1983. He is currently Director of the Power Electronics Research Centre at the National University of Ireland, Galway. He is a Fellow of the IEEE. He received the IEEE Power Electronics Society Middlebrook Technical Achievement Award in 2013 and was appointed Distinguished Lecturer of the IEEE for 2014-2017. He has co-authored a text book on magnetics for power electronics.

Werner Hugo Wölfle graduated from the University of Stuttgart in Germany in 1981 as a Diplom-Ingenieur in Power Electronics. He completed a PhD degree at the National University of Ireland, Galway in 2003. He worked for various companies in the field of Power Electronics as a Development Engineer for power convert-ers in space craft, military and high grade industrial applications. Since 1989 he is Managing Director and head of the R&D Depart-ment of Traco Power Solutions in Ireland. Traco Power Solutions develops high reliability power converters and power supplies for industrial applications. Mr. Wölfle is currently an adjunct profes-sor in Electrical Engineering at the National University of Ireland, Galway. He has co-authored a text book on magnetics for power electronics.

Contents

The key to reducing the size of power supplies is high frequency operation and magnetic components can play a critical role. The tutorial begins with the de-sign rules for inductor design and examples of different types of inductors are given. A special example is the inductor in a flyback converter, since it has more than one coil. This is followed by the general design methodology for transformers and many examples from switched mode power supplies and res-onant converters are given. The main focus is placed on modern circuits where non-sinusoidal waveforms are encountered. General rules are established for optimising the design of windings under various excitation and operating con-

ditions. The skin effect and the proximity effect give rise to increased losses in conductors due to the non-uniform distribution of current in the conductors. A new approach to high frequency losses that avoids cumbersome Fourier analy-sis will be presented to optimise the winding design, for non-sinusoidal wave-form encountered in practical power electronics. Core losses for both sinusoidal and non-sinusoidal flux will be covered. This tutorial is based on a textbook authored by the speakers: Transformers and Inductors for Power Electronics: Theory, Design and Applications, Wiley, 2013.

Content: Introduction

The Introduction covers the fundamental concepts of magnetic components that serve to underpin the later sections.

Inductor DesignIn Section I, the design rules for inductor design are established and examples of different types of inductors are given. The single coil inductor, be it in air or with a ferromagnetic core or substrate, is the energy storage device for mag-netic fields. A special example is the inductor in a flyback converter, since it has more than one coil. Examples include: forward, flyback, pushpull and LLC resonant converters; filter chokes.

Transformer DesignSection II deals with the general design methodology for transformers. Partic-ular emphasis is placed on modern circuits where non-sinusoidal waveforms are encountered and power factor calculations for non-sinusoidal waveforms are covered. Examples include: forward, pushpull and resonant converters.

High Frequency DesignThere is an inverse relationship between the size of a transformer and its fre-quency of operation. However, losses increase at high frequency. There is skin effect loss and proximity effect loss in the windings due to the non-uniform distribution of the current in the conductors. The core loss increases due to the eddy currents circulating in the magnetic core and due to hysteresis. General rules are established for optimising the design of windings under various exci-tation and operating conditions. A new approach to high frequency losses that avoid cumbersome Fourier analysis will be presented to optimise the winding design. Losses that result from fringing effect of the magnetic field around an air-gap will be covered. The use of litz wire for mitigating skin and proximity effects will be treated. The application of interleaving to reduce proximity ef-fects will be explained.

Who should attend?This tutorial is of interest to and practising engineers working with power supplies and en-ergy conversion systems; students of electrical engineering and electrical energy systems; graduate students dealing with specialised inductor and transformer design for high fre-quency operation

Tutorial 1 0

Reliability Engineering in Power Electronic SystemsFrede Blaabjerg, Francesco Iannuzzo, Huai Wang, Aalborg University, Denmark

About the instructorsFrede Blaabjerg is currently a Professor with the Department of Energy Technology and the Director of Center of Reliable Power Electronics (CORPE), Aalborg University, Denmark. He has inten-sive research work on power electronics and its applications in motor drives, wind turbines, PV systems, harmonics, and the reli-ability of power electronic systems. He has held more than 300 lectures national and international, most of them in the last de-cade are invited and as keynotes at conferences, covering various

topics on power electronics, including the reliability. He has contributed more than 300 jour-nal papers, and given more than 300 invited national/international lectures. Among other awards, Dr. Blaabjerg received the IEEE William E. Newell Power Electronics Award in 2014.

Francesco Iannuzzo is currently a Professor of Reliable Power Electronics at the Aalborg University, Denmark, and CORPE (Cen-ter of Reliable Power Electronics). His research interests are in the field of reliability of power devices, including against cosmic rays, power device failure modelling and testing of power mod-ules under extreme conditions. He has contributed more than 120 journal and conference papers in the field. Prof. Iannuzzo was the Technical Chair in two editions of ESREF, the European Sympo-sium on Reliability and Failure analysis.

Huai Wang is currently an Associate Professor with the Center of Reliable Power Electronics (CORPE), Aalborg University, Den-mark. His research addresses the fundamental challenges in modelling and validation of the failure mechanisms of power electronic components, and application issues in system-level predictability, circuit architecture, and robustness design. Prof. Wang received the IEEE PELS Richard M. Bass Outstanding Young Power Electronics Engineer Award, in 2016. He has served as an Associate Editor of IEEE Transactions on Power Electronics since 2015.

Contents

In many mission-critical applications of energy conversions such as renew-ables, industry, electric vehicles, and aircrafts, etc., power electronics should be extremely reliable and robust to avoid high cost of failures. In order to meet this challenging requirement, there is an ongoing paradigm shift in this field from the statistics-based assessment to the physic-of-failures based analysis. In this shift, the stress and strength models of the power electronics systems need to be accurately built, and both of the factors are closely related to the operating conditions or mission profiles of the whole systems. These mission profiles will involve multi-disciplinary knowledge and new engineering ap-proaches for the design of reliability performances.

In this tutorial, the paradigm shift in reliability research on power electronics as well as some reliability engineering concepts are first introduced. After-wards some basics about reliability engineering are presented, followed by a specific section on abnormal condition testing, and another one on condition monitoring and active thermal control. Based on these results, a series of new modelling and control concepts are given to evaluate/improve the reliability performances of power electronics systems considering mission profiles with several examples on renewable energy and motor drives. Finally, the tutorial will also present the views of the instructors on the future research opportuni-ties in the area of reliability of power electronics. The approaches presented in the tutorial are also the common interest for the companies involved in the Center of Reliable Power Electronics (CORPE) at Aalborg University.

Content: Towards Reliable Power Electronics Motivations, field experiences and challenges Ongoing paradigm shift in reliability research Design for reliability concept Basics about reliability engineering and metrics Weibull distribution, Reliability, Failure rates, and Bx lifetime Concepts of FMEA, HALT, CALT, Six sigma design, etc. Importance of mission profiles

Abnormal condition testing basics for power electronic components Impact of severe and abnormal events on the reliability performances Basic of instabilities and related phenomena Instabilities during short circuit of IGBTs


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Non-destructive testing technique and setups Condition monitoring and active thermal control for improved reliability Basics ideas and control freedoms Thermal measurement and monitoring Control under normal operations of converter Control under severe and abnormal conditions Advanced Design Tool for Reliability of Power Electronics Systems Multi timescales modelling of power electronics system New thermal models of IGBT for mission profile translation Rain flow counting, accumulated damages and Monte Carlo simulation Examples on Wind power, PV power and LED lighting systems Case study: a 5kW fuel-cell system From system level requirement to component level reliability allocation Select proper commercially available components to fulfill the system

level reliability requirement Future Research Opportunities in Reliability of Power Electronics Interdisciplinary efforts and opportunities ahead

Who should attend?Engineers or researchers in power electronics design and testing with interest in improving reliability performance. Beginners as well as experienced engineers are both welcome. Focus is more on the reliability engineering including testing and modelling aspects from components to system level.

Tutorial 11

Energy Storage - Systems and ComponentsAlfred Rufer, EPFL, Switzerland

About the instructorAlfred Rufer is honorary professor in power electronics at the Swiss Federal Institute of Technology EPFL, Lausanne Switzer-land. He has been leading the Industrial Electronics Lab (LEI-EPFL) from 1997 to 2016. Beneath many research projects in power electronic circuits and applications, he has initialized sev-eral activities in energy storage systems and components, from the design and modeling of supercapacitor based power assis-tance systems to multiphysics modeling of complex storage de-vices as Vanadium Redox Flow Batteries or CAES, Compressed Air Energy Storage. Alfred Rufer has authored or co-authored more than 250 scientific papers in international conferences and journals. He has supervised over 30 PhD students. Prof. Rufer is a fellow of the IEEE and has received many IEEE Transactions or Conference Prize Paper Awards. In addition, Alfred Rufer is a honorary board member of the PCIM conference where he served as a General Conference Director.

Contents

From the second half of the 20st century, large facilities for electrical energy storage have been built in the context of matching the variable power demand with installations of large nuclear power stations known for their mostly con-stant power production. More recently, another tendency has appeared with the development of Renewable Energy Sources. From the classical centralized utility of today, a clear movement goes in the direction of distributed utility, to-gether with the appearance of Smart Grids. Renewable energy sources are known by their variation in time, or available power related to meteorology conditions. This is a new motivation for the development and realization of new energy storage techniques. The use of RES, but also the integration of storage devices is mainly achieved with interconnection to electrical systems and need appropriate electric power conversion.

General and technical definitions on energy storage Energy storage technologies Comparative ratings and properties The theory of Ragone plots Modeling, electrical models, thermal modeling, multiphysics modeling Electrochemical energy storage Energy storage by means of supercapacitors Energy storage systems based on compressed air Hydropower pumped storage facilities (Variable speed) Energy storage based on hydrogen Dedicated power electronic circuits Examples of design, examples of applications, calculation of efficiency,

thermal models, etc.

Who should attend?The tutorial is addressed to all engineers active in power, power systems, renewable energy sources, automotive, traction systems and all applications where energy saving potential ex-ists. The tutorial is oriented on an « engineer approach », presenting tools and definitions helping the design of dedicated systems. The tutorial is a complement to the matter teached in classical university orientations, bridging the knowledge between basic sciences and en-gineering sciences, covering an interdisciplinary range.

Awards

Young Engineer AwardThe Young Engineer Award goes to the three best lectures from engineers not older than 35 years and will be also honoured in the PCIM Europe Conference opening ceremony.

The nominees are:

IGBT Gate Driver with Accurate Measurement of Junction Temperature and Inverter Output CurrentMarco Denk, Mark-M. Bakran, University of Bayreuth, D

Air Cooled SiC Three Level Inverter with High Power Density for Industrial ApplicationsAlexander Hensler, Thomas Bigl, Stephan Neugebauer, Stefan Pfefferlein, Siemens, D

Medium Frequency Transformer Design and OptimizationMarko Mogorovic, Drazen Dujic, École Polytechnique Fédérale de Lausanne, CH

Design and Performance of a 200 kHz GaN Motor Inverter with Sine Wave FilterFranz Stubenrauch, Norbert Seliger, University of Applied Sciences Rosenheim, D

IGCT based Modular Multilevel Converter for an AC-AC Rail Power SupplyDavid Weiss, Michail Vasiladiotis, Noemi Drack, ABB Switzerland, CH; Andrea Grondona, ABB, SE

Design Method for the Minimization of CM Inductor Volume with Consideration of Core Saturation in EMI FiltersBilel Zaidi, Arnaud Videt, Nadir Idir, University of Lille (L2EP), F

Best Paper AwardThe Best Paper Award honours the best paper of the conference. The award ceremony and speech will be part of the PCIM Europe Conference opening ceremony.

These awards are sponsored by:

This award is sponsored by:

The nominees are:

Development of a High Efficient MPPT for Space Applications Using GaN Power TransistorsCornelius Armbruster, Christian Schöner, Fraunhofer Institute ISE, D; Torben Schönbett, Alfons Klönne, Rainer Merz, University of Applied Sciences Karlsruhe, D

IGBT Gate Driver with Accurate Measurement of Junction Temperature and Inverter Output CurrentMarco Denk, Mark-M. Bakran, University of Bayreuth, D

Reducing dv/dt of Motor Inverters by Staggered- Edge Switching of Multiple Parallel SiC Half- Bridge CellsThomas Fuchslueger, Hans Ertl, Technical University of Vienna, AT; Markus A. Vogels-berger, Bombardier Transportation, AT

Air Cooled SiC Three Level Inverter with High Power Density for Industrial ApplicationsAlexander Hensler, Thomas Bigl, Stephan Neugebauer, Stefan Pfefferlein, Siemens, D

Parasitic Inductance Analysis of a Fast Switching 100 kW Full SiC InverterMatthias Kegeleers, Julian Körner, Stefan Matlok, Maximilian Hofmann, Martin März, Fraunhofer Institute IISB, D

Digital Control of Hard Switched Converters by Phase Modulated Pulse Width Modulation PMPWMStefan Matlok, Bernd Eckardt, Bernd Seliger, Martin März, Fraunhofer Institute IISB, D

Dual Side-Gate HiGT Breaking Through the Limitation of IGBT Loss ReductionTomoyuki Miyoshi, Yujiro Takeuchi, Tomoyasu Furukawa, Masaki Shiraishi, and Mutsuhiro Mori, Hitachi, J

Medium Frequency Transformer Design and OptimizationMarko Mogorovic, Drazen Dujic, École Polytechnique Fédérale de Lausanne, CH

Power Loss Evaluation of 2.5 MHz High Frequency Inverter Based on Frequency Multiplying MethodKoji Orikawa, Satoshi Ogasawara, Hokkaido University, J; Jun-ichi Itoh, Nagaoka University of Technology, J

Design and Performance of a 200 kHz GaN Motor Inverter with Sine Wave FilterFranz Stubenrauch, Norbert Seliger, University of Applied Sciences Rosenheim, D

IGCT based Modular Multilevel Converter for an AC-AC Rail Power SupplyDavid Weiss, Michail Vasiladiotis, Noemi Drack, ABB Switzerland, CH; Andrea Grondona, ABB, SE

Design Method for the Minimization of CM Inductor Volume with Consideration of CoreSaturation in EMI FiltersBilel Zaidi, Arnaud Videt, Nadir Idir, University of Lille (L2EP), F


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which will be demonstrated as an example. This keynote aims to outline how this fundamen-tal change of the well-known applications in the field of intralogistics as well as materials handling technology may look and what consequences it will lead to.

Thursday, 18 May 2017

Evolution in Topologies as a Result of New Devices and Enabling Technologies Ionel Dan Jitaru, Rompower, USA

The topic that new topologies may be needed as the progress in semiconductor industry and other enabling technologies are emerging, has been raised with different occasions. In order to make a prediction of such developments we need to look into the evolution of the basic topologies in the last thirty years and analyze the impact introduced by the new semiconduc-tor devices, magnetic technologies and control ICs. Though in the last thirty years no more topologies were introduced, we noticed a clear shift in the “preferred topologies” used by engineers in power conversion. That shift did occur mostly due to the progress in semicon-ductor devices. Another key role was played by the type of applications in power electronics which changed some of the specifications and favored some topologies over others. Recently the availability of digital control has opened the door to intelligent power processing, and al-lowed us, for example, to take a conventional topology and convert it in “soft switching to-pology” without any changes in the hardware. This presentation will look at the progress of some topologies over the years such as flyback topology, forward derived topologies including the two transistors forward, half and full bridge topologies and the changes made in order to further improve the performances. Though some of the “old” topologies were not fundamentally changed, modifications did occur for performance enhancement. As an example, the flyback topology evolved over the years initially through the magnetic optimization, and further through control methodology, wherein in the latest flyback topology the energy contained in all the parasitic elements in harvested and the performances greatly improved, achieving soft switching in primary and secondary with minimum hardware changes. The same does apply for the half bridge and full bridge topology, wherein the latest generation of half bridge and full bridge topologies do have soft switching both in primary and secondary across the synchronous rectifiers and this is done mostly through the intelligent power processing, possible today due to the digi-tal control. Even in the case of two transistor forward topology, one of the most popular to-pology over many years, has recently benefited by some key improvements. The latest two transistor forward topology achieves soft switching both in primary and secondary, with minor hardware changes and through intelligent control. The same evolution is achieved also in the traditional boost converter, which evolved in the latest applications in PFC wherein the efficiency went above 99% mostly due to the GaNs and intelligent control. Though the basic boost topology remained the same, some modifications were introduced to improve the per-formances and convert it into a true soft switching topology. After scanning the improve-ments in the last 30 years in power conversion it is concluded that the traditional topologies were not replaced but they evolved especially in the last ten years due to the introduction of new devices and the availability of intelligent power processing through digital control. The paper will be highlighted with design examples of such improvements of the basic topologies over the years.

Speaker: Ionel Dan Jitaru, Rompower, USAChairperson: Philippe Ladoux, University ofToulouse, France

Keynotes

Tuesday, 16 May 2017

Long distance charging solutions for BEVs: from now to 2030Robert Lassartesses, Renault, F

This keynote will describe different charging solutions which are already available for a long-distance drive with a BEV (battery electrical vehicle) today as well as the trends for the future. Pro and contra will be shown. The today trend is to increase the battery and the fix charger power. However, this trend limits the mass market for BEVs. The keynote will show some of these limits on the car point of view (battery cost/packaging/weight, uncertainty on specific material availability and environmental consideration). Game changer as charging during driving could solve these mass market car roadblocks. Charging during driving trans-fers an important investment part from BEV to infrastructure by reducing battery size or in other words transfers investment from the BEVs owners to the public. If we consider that 5000 euros could be saved by reducing the needed battery size and if we consider 30 % EVs to be sold each year, it would represent 3 billion euros investment each year for road infra-structure only for a country like France. In any case, hundreds of billions will be needed though the world to equip the road in coherence with the high number of BEV expected from now to 2030. To insure profit, each investment needs to be secure for a least 10 years. A very good long term common understanding in the system BEV+ charging infrastructure roadmap is needed between partners to insure BEV success. Even today, if the mainstream of the EV industry invests in huge numbers of powerful fix charger (right now from 43 kW AC to DC 350 kW), many solutions could arrive aside the mainstreams to insure possible lack of fix chargers in dedicated areas or specific timeslots (winter vacations…).

Wednesday, 17 May 2017

The Smart Future of Power Electronics and its ApplicationsHans Krattenmacher, SEW-Eurodrive, D

Power electronic components have been used for decades in devices in the field of electric drives e.g. inverters, power supplies etc. One of the most important devices is the conven-tional frequency inverter which is employed in countless applications of the conveyor technol-ogy, materials handling technology as well as the field of machine automation. The technology and therefore the power electronics have been adjusted, improved, optimized and perfected to fit the applications throughout the years. However, the application itself hardly changed as the main focus lied on making it faster, more efficient and more robust. The scope of Industry 4.0 possibly brings fundamental changes to the manufacturers of these plant automation technologies leading to completely different tasks, ways of thinking and re-quirements and therefore different solutions. The traditional stationary materials handling technology, in which many gearmotors and elec-tronic components are built into, will be replaced by mobile materials handling systems. Based on this knowledge it can be concluded that the product in its current form will no lon-ger be needed in the solutions of tomorrow.The production philosophy for the future SMART Factory will be organized and operated in a completely new way. Power Electronics will remain an enabling technology however the con-verter technology will become “SMART”. SEW as a trendsetter for the future SMART Factory

Speaker: Robert Lassar-tesses, Renault, FranceChairperson: Jean-Paul Beaudet, Schneider Electric, France

Speaker: Hans Kratten-macher, SEW-Eurodrive, GermanyChairperson: Leo Lorenz, ECPE, Germany

Top-class keynotes each conference day

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Room Brüssel 1

HV-SiC-MOSFET

Chairperson: Gourab Majumdar, Mitsubishi Electric Corporation, J

11:00 3.3 kV/450 A Full-SiC nHPD2 (next High Power Density Dual) with Smooth SwitchingTakashi Ishigaki, Seiichi Hayakawa, Tatunori Murata, Tet-suo Oda, Yuji Takayanagi, Renichi Yamada, Hitachi Power Semiconductor Device, J; Toru Masuda, Naoki Tega, Akio Shima, Hitachi, J; Katsuaki Saito, Hitachi Europe, GB

11:30 Characterization of 3.3kV and 6.5kV SiC MOSFETsTakui Sakaguchi, Masatoshi Aketa, Takashi Nakamura, ROHM, J; Masaharu Nakanishi, ROHM Semiconductor, D; Munaf Rahimo,ABB Switzerland, CH

12:00 Dynamic Characterization of Next Generation Medium Voltage (3.3 kV, 10 kV) Silicon Carbide Power ModulesTy McNutt, Jonathan Hayes, Lauren Kegley, William A. Curbow, Daniel Martin,Brett Sparkman, Wolfspeed, USA

12:30 3.3kV All-SiC Power Module for Traction System UseTetsu Negishi, Ryo Tsuda, Kenji Ota, Shini-chi Iura, Hiroshi Yamaguchi, Mitsubishi Electric Corporation, J; Eckhard Thal, Mit-subishi Electric Europe, D

Room Brüssel 2

Power Converters with Wide Bandgap Devices I

Chairperson: Francisco Azcondo, University of Cantabria, ES

11:00 Two-Switch Quasi-Resonant Flyback Converter with SiC SwitchesStefan Schmitt, Watts & Bytes, F; Jens Marten, BLOCK Transformatoren, D

11:30 Characterization of 1.7 kV SiC MOSFET Modules for Me-dium/High Power Current Source Inverter in Photovol-taic ApplicationsLuis Gabriel Alves Rodrigues, Jérémy Martin, Stéphane Catellani, Commissariat à l´Énergie Atomique et aux Énergies Alternatives, F; Jean-Paul Ferrieux, G2Elab, F

12:00 Power Loss Evaluation of 2.5 MHz High Frequency Inverter Based on Frequency Multiplying Method

Koji Orikawa, Satoshi Ogasawara, Hokkaido University, J; Jun-ichi Itoh, Nagaoka University of Technology, J

12:30 Gate Driver Architectures for High Speed Power Devices in Series ConnectionJean-Christophe Crebier, Van-Sang Nguyen, Pierre LeFranc, G2Elab, F

Room München 1

Materials

Chairperson: Nando Kaminski, University of Bremen, D

11:00 Reliable Interconnection Technologies for High-Tem-perature Operation of SiC MOSFETsFabian Mohn, Chunlei Liu, Jürgen Schuderer, ABB Swit-zerland, CH

11:30 Sintering Copper Die-Bonding Paste Curable Under Pressureless ConditionsHideo Nakako, Dai Ishikawa, Chie Sugama, Yuki Kawana, Motohiro Negishi, Yoshinori Ejiri Hitachi Chemical, J

12:00 Taking Power Semiconductors to the Next Level: Novel Plug & Play High Thermal Performance Insu-latedChristian Kasztelan, Thomas Basler, Infineon Technolo-gies, D

12:30 Development of Thermal Fatigue-Toler-ant Active Metal Brazing Substrates Using Highly-Thermal Conductive Sili-con Nitrides with High ToughnessHiroyuki Miyazaki, You Zhou, Kiyoshi Hirao, Shinji Fukuda, Noriya Izu, Hideki Hyuga, National Institute of Advanced In-dustrial Science and Technology (AIST), J; Shoji Iwakiri, Hideki Hirotsuru, Denka Com-pany Limited, J

Room München 2

Sensorless Drives

Chairperson: Manfred Schrödl, Vienna U niversity of Technology, AT

11:00 Initial Rotor Position Determination of a Soft Starter Driven Synchronous MotorHauke Nannen, Heiko Zatocil, Siemens, D

11:30 A Robust Encoderless Predictive Current Control Using Novel MRAS Observer for Surface-Mounted Perma-nent-Magnet Synchronous GeneratorsMohamed Abdelrahem, Christoph Hackl, Ralph Kennel, Technical University of Munich, D

12:00 FPGA–based Sensorless Control of a PMSM at Low–Speed RangeFernando David Ramirez Figueroa, Mario Pacas, University of Siegen, D; Cesar Gonzalez, Tecnologico de Monterrey, MX

12:30 Application of a Position Sensorless Control to a Re-luctance Synchronous Drive Including Flux WeakeningMatthias Hofer, Manfred Schrödl, Vienna University of Technology, AT

Room Mailand

Modular Multilevel Converter for HighVoltage Applications

Chairperson: Drazen Dujic, Power Electronics Laboratory, EPFL, CH

11:00 Four-Level MMC Cell Type with DC Fault BlockingCapability for HVDCViktor Hofmann, Mark M. Bakran,University of Bayreuth, D

11:30 Virtual Submodule Concept Applied to the Modular Multilevel ConverterAlexandre Christe, Drazen Dujic,EPFL - Ecole polytechnique fédérale de Lausanne, CH

12:00 IGCT based Modular Multilevel Converter for an AC-AC Rail

Power SupplyDavid Weiss, Michail Vasiladiotis, Noemi Drack, ABB Switzerland, CH; AndreaGrondona, ABB, SE

12:30 Development of A Full-Bridge Sub-Module for HVDC and STATCOM MarketsJerome Perrier, GE’s Grid Solutions, GB;Tianning Xu, Alstom Grid, GB

09:00 Room Brüssel 1 Conference Opening and Award Ceremony

09:45 Room Brüssel 1 KEYNOTE:Long Distance Charging Solutions for BEVs: from now to 2030, Robert Lassartesses, Renault,F

Conference Tuesday, 16 May 2017Morning Oral Sessions

12:30 – 14:00 Lunch Break

10:30 Coffee Break

Award nominee. More information on page 19.

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Room Brüssel 1

SiC MOSFET

Chairperson: Andreas Lindemann, Otto-von-Guericke-UniversityMagdeburg, D

14:00 The new CoolSiC™ Trench MOSFET Technology for Low Gate Oxide Stress and High Performance Dethard Peters, Thomas Basler, BerndZippelius, Infineon Technologies, D

14:30 Short-Circuit Robustness of Discrete Silicon Carbide MOSFETs in Half-Bridge ConfigurationNicolas Degrenne, Anthony Roy, Johan Le Lesle, Erwan David, Stefan Mollov, Mitsubishi Electric, F

15:00 Design Rules To Adapt The Desaturation Detection For SiC MOSFET ModulesTeresa Bertelshofer, Andreas März, Mark-M. Bakran, Uni-versity of Bayreuth, D

15:30 Device Simulation Modeling of 1200 V SiC MOSFETsBenedetto Buono, Martin Domeij, Kwangwon Lee, Krister Gumaelius, Jimmy Franchi, Fredrik Allerstam, Fairchild Se-miconductor, SE ; James Victory, Mehrdad Baghaie Yazdi, Thomas Neyer, Fairchild Semiconductor, D

Room Brüssel 2

Power Converter Design

Chairperson: Stéphane Lefebvre, SATIE, F

14:00 Enhancing Power Density and Efficiency of Variable Speed Drives with 1200V SiC-TMOSFETsBenjamin Sahan, Anastasia Brodt, Daniel Heer, Ulrich Schwarzer, Maximilian Slawinski, Tim Villbusch, Klaus Vogel, Infineon Technologies, D

14:30 Air Cooled SiC Three Level Inverter with High Power Density for Industrial

ApplicationsAlexander Hensler, Thomas Bigl, StephanNeugebauer, Stefan Pfefferlein, Siemens, D

15:00 Generic Approach for Design, Configuration and Control of Modular ConvertersLyubomir Kerachev, CMP, F; Yves Lembeye, Jean-Christophe Crebier, G2Elab, F

Room München 1

Current Sensors

Chairperson: Bernhard Strzalkowski, Analog Devices, D

14:00 IGBT Gate Driver with Accurate Measurement of Junction Tempera-

ture and Inverter Output CurrentMarco Denk, Mark-M. Bakran, University of Bayreuth, D

14:30 An Inverted Rogowski Coil: A High Speed, Wide-Band, Compact Current Transducer With High Immunity to Voltage TransientsChris Hewson, Pemuk, GB

15:00 Design of a 300 Amps Pulsed Current Source with Slopes up to 27 Amps per Nanosecond for Current Probe AnalysisNathan Tröster, Dennis Bura, Julian Wölfle, Martin Stempfle, Jörg Roth-Stielow, Univer-sity of Stuttgart, D

Room München 2

New and Renewable Energy Systems

Chairperson: Friedrich-Wilhelm Fuchs, Christian-Albrechts-University of Kiel, D

14:00 A 70 kW Next Generation Three-phase Solar Inverter with Multiple MPPTs using Advanced Cooling Concept and Stacked-PCB ArchitectureRemi Freiche, Sebastian Franz, Stephan Liese, Marc Fink, Fraunhofer Institute ISE, D

14:30 Enhanced Current Control Scheme for Large-Scale Solar InvertersTomomichi Ito, Hitachi, J

15:00 Improved Bias Supply Scheme for a Maximum Power Point Tracking Universal Topology for Low-Voltage Elec-tromagnetic Harvesters in Battery Powered ApplicationsMahmoud Shousha, Dragan Dinulovic, Martin Haug, Würth Elektronik eiSos, D

Room Mailand

SPECIAL SESSION: Smart Grid & Communication

Chairperson: Jean-Paul Beaudet, Schneider Electric, F

14:00 A New Configuration for a Grid Former Converter in AC Isolated MicrogridHélio Antunes, Sidelmo Silva, Braz Filho, Reginaldo Fer-reira, Danilo Iglesias Brandão, Federal University of Minas Gerais, BR

14:30 Design and Control of a DC Grid for Railway StationsSabah Siad, Gilney Damm, Paris Saclay University, F; Lilia Galai Dol, Alexandre de Bernardinis, EFFICACITY, F

15:00 Distributed Nonlinear Control for a MicroGrid Embed-ding Renewables, Train’s Energy Recovery System and Storages Alessio Iovine, Lilia Galai Dol, EFFICACITY, F; Elena De San-tis, Marika Di Benedetto, L’Aquila University, I;; Gilney Damm, Paris Saclay University, F

15:30 Reliability Enhancement of Modular Smart Transform-ers by Uneven Loading of CellsVivek Raveendran, Markus Andresen, Levy Ferreira Costa, Giampaolo Buticchi, Marco Liserre, University of Kiel, D

Conference Tuesday, 16 May 2017Afternoon Oral Sessions

15:30 – 17:30 Foyer Ground Floor Entrance NCC Mitte Poster/Dialogue Session

15:30 Coffee Break


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Conference Tuesday, 16 May 2017, Poster Dialogue Sessions15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte

Wide Bandgap Devices I

Chairperson: Thomas Neyer,Fairchild Semiconductor, D

PP012 Measurement Scheme to Model an SiC MOSFET for Simulating its Switching Behaviors Tatsuya Yanagi, Hiroyuki Sakairi, Hirotaka Otake, Naotaka Kuroda, Ken Nakahara, ROHM, J; Hiroaki Tanigawa, Keysight Technologies, J

PP013 A Performance Comparison of SiC Power Modules with Schottky and Body Diodes Christopher Schmidt, Martin Röblitz, SEMIKRON Elektronik, D

PP014 Comparison between 1200V 5th generation SiC MPS Diode and Silicon Power Diode in DC/AC Hy-brid Circuit Breaker

Kenan Askan, Michael Bartonek, Eaton Industries, AT; Fabio Brucchi, Infineon Technologies,

PP015 Impact of Dynamic On-Resistance of High Voltage GaN Switches on the Overall Conduction Losses

Eduardo de Oliveira, Christian Nöding, Peter Zacharias, University of Kassel, D

PP016 Calorimetric Measurement of Wide Bandgap Semiconductors Switching Losses Sven Bolte, Norbert Fröhleke, Joachim Böcker, Univer-

sity of Paderborn, D

PP017 System Level Comparison of Si IGBTs and SiC MOSFETs

Levi Gant, Sujit Banerjee, Xuning Zhang, Gin Sheh, Monolith Semiconductor, USA; Andrew Lemmon, Ali Shahabi, The University of Alabama, USA

PP018 Comparison of the Short Circuit Capability of Pla-nar and Trench SiC MOSFETs

Douglas Pappis, Lucas de Menezes, Peter Zacharias, University of Kassel, D

PP019 Characterization and Optimization of SiC Freewheel-ing Diode for Switching Losses Minimization Over Wide Temperature Range

Xuning Zhang, Levi Gant, Gin Sheh, Sujit Banerjee, Monolith Semiconductor, USA

PP020 On Developing a dV/dt Rating for Commercial 650V- and 1200V-Rated SiC Schottky Diodes Thomas Barbieri, Gang-Yao Wang, Edward Van Brunt, Brett Hull, Jim Richmond, John Palmour, Wolfspeed, USA

PP021 SiC power MOSFET with Monolithically Integrated Schottky Barrier Diode for Improved Switching Per-formances

Huaping Jiang, Xiaoping Dai, Maolong Ke, Dynex Semi-conductor, GB

PP022 Dual On-State Gate Driver Concept for Improved Drive of Silicon Carbide MOSFETs Sebastian Fahlbusch, Fabian Fisahn, Michael Meissner,

Ulf Müter, Sebastian Klötzer, Klaus F. Hoffmann, Helmut Schmidt University- University of the Federal Armed Forces Hamburg, D

PP023 High Speed, Thermally Enhanced, Small Footprint SiC Power Modules for Cost Sensitive Applications

Adam Barkley, Scott Alan, Marcelo Schupbach, Wolfspeed, USA

Power Modules

Chairperson: Hans Ertl, Vienna University of Technology, A

PP024 A Power Cycling Test Bench Dedicated to the Test of Power Modules in a Large Range of Cycling Frequency

Jean-Jacques Huselstein, Francois Forest, Guillaume Pellecuer, University of Montpellier, F; Serge Bontemps, Microsemi PMP, F

PP025 Resin Flow Simulation for Transfer Molding Technology Ken Sakamoto, Yutaro Hanawa, Mitsubishi Electric Cor-

poration, J

PP026 Development of High Thermal Performance Automotive Power Modules with Dual Sided Cooling Capability

Yangang Wang, Steve Jones, Xiaoping Dai, Dynex Semi-conductor, GB

PP027 Intelligent Power Modules with Common Footprint for Both Single-Phase and Three-Phase AC Input Power

Jonathan Harper, ON Semiconductor, D

PP028 Optimized Layout of 1700V LoPak1 IGBT Power Mod-ule by Holistic Design Approach

Sven Matthias, Samuel Hartmann, Athanasios Meseman-olis, Raffael Schnell, ABB Switzerland, CH

PP029 Paralleling of LinPak Power Modules Andreas Baschnagel, Daniel Prindle, Silvan Geissmann, Fabian Fischer, Samuel Hartmann, Raffael Schnell, Gontran Pâques, Arnost Kopta, ABB Switzerland, CH

PP030 A New Generation of 600V Smart Power Module for Motor Drive Applications

Bumseung Jin, Samuell Shin, HyunSoo Bae, Taesung Kwon, Fairchild Korea Semiconductor, ROKPP031 Super Mini DIPIPM for Automobile Naoki Ikeda, Hiroyuki Hata, Hongbo Zhang, Mitsubishi Electric Corporation, J

Cooling Systems

Chairperson: Masahito Otsuki,Fuji Electric, J

PP032 Thermal Characterization Analysis of IGBT Power Module Integrated with a Vapour Chamber and Pin- Fin Heat Sink Yiyi Chen, Bo Li, Yuying Yan, University of Nottingham, GB; Fang Qi, Yangang Wang, Steve Jones, Dynex Semiconductor, GB

PP033 Silicone-Based Enablers for Thermal Management in Power Electronics

Thomas Seldrum, Dow Corning Europe, BE

PP034 Innovative Design in IGBT Cold Plate Chihwei Wei, Kevin Wu, Larry Lin, Amulaire Thermal Technology, TW

PP035 Reliability of the Direct Cooling Type Cold Plate with Ni Clad Layer

Kazuhiko Minami, Atsushi Otaki, Ichiro Ota, Showa Denko, J

PP036 Testing, Selecting, and Applying Metallic Thermal Interface Materials for Harsh Environment Applica-tions

David Saums, DSA LLC, USA; Timothy Jensen, Indium Corporation, USA

PP037 Two-Phase Liquid Cooling for Electric Vehicle IGBT Power Module Thermal Management

Itxaso Aranzabal, Inigo Martinez de Alegria, Inigo Kortabarria, University of the Basque Country (UPV/EHU), ES; Nicola Delmonte, Paolo Cova, University of Parma, I

PP038 Evaluation of Leadframe Power Modules for Auto-motive Drive Applications

Bao Ngoc An, Maurizio Kempf, Michael Meisser, Ben-jamin Leyrer, Thomas Blank, Marc Weber, Karlsruhe

Institute of Technology (KIT), D; Johannes Kolb, Schaeffler Technologies, D

PP039 Exploring Novel Second Level Cooling Methods for Low Profile IPMs Khatri Danish, Rajeev Krishna Vytla, Okawa Katsumi,

Jin Pei, Infineon Technologies Americas, USA

Reliability

Chairperson: Serge Bontemps,Microsemi PMP Europe, F

PP040 Inverter Power Module Lifetime Estimation for HEV and EV

JeHwan Lee, HanGeun Jang, SangChul Shin, KiYoung Jang, JinHwan Jung, Hyundai Motors, ROK

PP041 The Enhanced Reliability of the Double Sided Cooled Package with Integrated Internal Isolation

Inpil Yoo, Marina Schmitz, Infineon Technologies, D

PP042 Determination of State-of-Health and Remaining Lifetime of Power Modules

Jörg Franke, Christian Herold, Josef Lutz, Lukas Tinschert, Technical University Chemnitz, D

PP043 Shoot Through and Avalanche Behavior of High Speed Fet Converter

Florian Kapaun, Rainer Marquardt, Christopher Dahmen, University of the Federal Armed Forces Munich, D

PP044 Reliability Investigation of SiC Based Diode and MOSFET Modules Developed for High Power Con-version

Alexander Otto, Rainer Dudek, Sven Rzepka, Fraun- hofer-Institute ENAS, D; Mohamad Abo Ras, Tobias von Essen, Berliner Nanotest & Design, D; Markus Bast, FuE-Zentrum FH Kiel, D; Ulf Müter, Helmut- Schmidt University, D; Arne Lunding, Philips Medical Systems, D

PP045 Mission Profile Based Reliability Evaluation of Building Blocks for Modular Power Converters Frederik Hahn, Markus Andresen, Giampaolo Buticchi,

Marco Liserre, Christian-Albrechts-University, D

PP046 Thermal Calculation Methodology for Lifetime Esti-mation of Semiconductor Devices in MMC Applica-tion Yijun

Yijun Ye, Josef Lutz, Guang Zeng, Technical University of Chemnitz, D; Rodrigo Alvarez, Pablo Correa, Siemens, D

Thermal Management and Packaging I

Chairperson: J. A. Ferreira,Delft University of Technology, NL

PP047 In-Situ Transient Testing of Run-in and Degrad- tion Effects of Thermal Interface Sheets in Power Switch Assemblies Gabor Farkas, Zoltan Sarkany, Attila Szel, Mentor

Graphics, HU

PP048 Material Design and Process Conditions of Pre- sureless Sintered Silver for 200/-40 ºC Thermal Cycling Reliability Masafumi Takesue, Tomofumi Watanabe, Naoya Nakajima, Bando Chemical Industries, J

PP049 Performance Comparison of fast Silicon and Silicon Carbide Devices Used with Conventional PCBs and Embedded Into PCBs

Peter Zacharias, Juliane Hinze, University of Kassel, D

PP050 Power Electronic Package for Double Sided Cooling Utilizing Tile-Level Assembly

Maximilian Schmid, Gordon Elger, Johannes Pforr, Technical University of Applied Sciences Ingolstadt, D

PP051 Packaging Solutions for Mitigating IGBT Short- Circuit Instabilities Paula Diaz Reigosa, Francesco Iannuzzo, Frede Blaab-

jerg, Aalborg University, DK

PP052 Thermo-Mechanical Optimisation of Press Pack IGBT Packaging Using Finite Element Method

Simulation Michael Varley, Ashley Plumpton, Dynex Semiconductor, GB

PP053 Thermal Impedance Matrix Characterization of Co-Packed Discrete IGBT and Diode

Alberto Salinaro, Fairchild Semiconductor, D; Hans- Peter Hoenes, ON Semiconductor, D

PP054 The Influence of Y Doped ZrO2 Particles for High- Strength AlN Ceramics Jong Seol Yoon, Ki Soo Jun, Kyong Hwan Kim, KCC

Corporation, ROK

PP055 HT Lead-free and Sinter Materials for WBG Power Semiconductors Minoru Ueshima, Tetsu Takemasa, Senju Metal Indus-

try, J; Shijo Nagao, Katsuaki Suganuma, Osaka Univer-sity, J

PP056 Passive and Active Two-Phase Cooling for Power Electronics Applications

Devin Pellicone, Advanced Cooling Technologies, USA

PP057 Feasibility Study, Combining High-Power MOSFETs in a Power Module Using Advanced Thermal Management Martin Schulz, Maximilian Slawinski, Infineon Tech- nologies, D

DC-DC Converters

Chairperson: Werner Berns, Texas Instruments, D

PP058 Hybrib Power Converter Using Si IGBT Power Module & SiC MOSFET Benoit Peron, Joseph Magniez, Centum Adetel, F

PP059 Application of a Buck-Boost Converter for Highly Dynamic Power Smoothing in Industrial Applica-tions

Jochen Staiger, Swen Bosch, Heinrich Steinhart, HTW Aalen, D

PP060 High Power Density GaN Interleaved Bidirectional Boost Converter with Extended Cooling Capability

Konstantin Siebke, Thorben Schobre, Niklas Lang- maack, Regine Mallwitz, Technical University Braun- schweig, D

PP061 Single-Ended Boost DC-DC Converter Cascade System for High Boost Rate and High Efficiency in Residential Fuel-Cell System Ryoga Kiguchi, Yasuyuki, Nishida, Chiba Institute of

Technology, J

PP062 An Isolated Bidirectional DC-DC Converter for En-ergy Storage Systems

Mofakkharul Islam, Bebro Electronic, D

PP063 Modeling of ZVS DC-DC Converter for Charging and Voltage Balancing of Energy Storage Elements Dimitar Arnaudov, Nikolay Hinov, George Kraev, Ger-

gana Vacheva, Technical University of Sofia, BG

PP064 Modeling of Multiphase Converter for Charging of Energy Storage Elements

Stoyan Vuchev, Dimitar Arnaudov, Nikolay Hinov, Ivan Nedyalkov, Technical University of Sofia, BG

PP065 Advanced Power Converters for Energy Storage Systems for Light Traction Vehicles Miroslav Hruška, Skoda Electric, CZ; Martin Schulz, Infineon Technologies, D

PP066 Compact Diode-Less Bidirectional GaN Based Buck Converter for Mobile DC-DC Applications Sebastian Klötzer, Ulf Müter, Sebastian Fahlbusch, Klaus F. Hoffmann, Helmut Schmidt University- University of the Federal Armed Forces Hamburg, D

PP067 High-Voltage Gain DC-DC Boost Converter with Interleaved Inductors for a PV System to Supply Data Centers Fernando Luiz Marcelo Antunes, Katiuscia Lopes dos Santos, Federal University of Ceara, BR

PP068 Seven Reasons why Power Designers Should Im-plement 48V to 1V Direct Conversion

Bob Cantrell, Ericsson Power Modules, SE

PP069 Inductor Current Mapping Analog Controllers for Power Inverters and DC/DC Converters Alexei Nikitin, Avatekh, USA; Ruslan L. Davidchack, University of Leicester, GB

Advanced Si Power Semiconductors

Chairperson: Stefan Linder,Alpiq, CH

PP001 A Scaled PIN Diode SPICE Model for Power System Optimization

Mehrdad Baghaie Yazdi, James Victory, Kangwei Mao, Fairchild Semiconductor, D; Dongsoo Kim, Fairchild Korea, ROK

PP002 Diode Parameters Design Simulation and Experi mental Validation against Silver Migration Phe- nomena in High Voltage Switching Application Mattia Gianfranco Gentile, Ettore Vittone, University of Turin, I; Paolo Mirone, University of Naples Federico II, I; Luigi Merlin, Vishay Intertechnology, I

PP003 Reliability Improving of Power Semiconductor Dis-charge Switch by Means of LTJT Technology

Alexey Grishanin, Valentin A. Martynenko, Alexey Kha-pugin, Mikhail Malygin, Oleg Frolov, JSC Electrovi-pryamitel, RU; Konstantin Nishchev, Mikhail Novopoltsev, Ogarev Mordovia State University, RU

PP004 New Generation Large Area Thyristor for UHVDC Transmission

Jan Vobecky, Karlheinz Stiegler, Marco Bellini, Urban Meier, ABB Switzerland, CH

PP005 The Next Generation 4500V / 3000A BIGT Stakpak Modules

Franc Dugal, Andreas Baschnagel, Munaf Rahimo, Ar- nost Kopta, ABB Switzerland, CH

PP006 The New ST Super-Junction Technology with Fast Intrinsic Diode Ideal for the Most Demanding High Efficiency Bridge Topologies and ZVS Phase-Shift Converters- Comparison Analysis in 2kW AC-DC Switch Mode Power Supply

Antonino Gaito, Alfio Scuto, Cristiano Gianluca Stella, Giuseppe Sorrentino, STMicroelectronics, I

PP007 Low Voltage AC/DC Over-Current Breaker with 650-V IGBTs

Jan Fuhrmann, David Hammes, Hans-Günter Eckel, University of Rostock, D

PP008 An Advanced Si-IGBT Chip for Delivering Maximum Overall System Performance

Narender Lakshmanan, Thomas Radke, Mitsubishi Electric Europe, D

PP009 High Energy Harvesting in High Current/Voltage Induction Heating Application Using the new Ultra Filed Stop IGBTs Technology Vittorio Crisafulli, ON Semiconductor, D; Leon Zhang,

ON Semiconductor, CN

PP010 An Automated Testbench for the Measurement of Si-IGBT and SiC-MOSFET Hybrid Switches

Michael Meissner, Sebastian Fahlbusch, Klaus F. Hoff-mann, Helmut Schmidt University- University of the Federal Armed Forces Hamburg, D

PP011 New-Generation Trench Schottky Rectifiers (TSR) with Superior Electrical Performance

Ju-Hsu Chuang, Wesley Chih-Wei Hsu, Jia-Jan Guo, Yu-Hung Chang, Sung-Yin Wu, Lite-on Semiconductor, TW, D

2928

Conference Tuesday, 16 May 2017, Poster Dialogue Sessions15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte

Passive Components and New Materials

Chairperson: Klaus Marahrens, SEW-EURODRIVE GmbH, D

PP082 Comprehensive AC Performance Analysis of Ceramic Capacitors for DC Link usage Kirill Klein, Eckart Hoene, Klaus-Dieter Lang, Frau- hofer-Institute IZM, D

PP083 High Performance DC Link Capacitor/Bus Sourcing Dual Infineon HybridPACKTM Drive Inverters for EV Applications

Michael A. Brubaker, Terry Hosking, Wayne Liu, SBE, USA; Tomas Reiter, Infineon Technologies, D; Carsten Wüst, David Kuschnarew, hofer eds GmbH, D

PP084 An Evaluation Circuits for DC-Link Capacitors Used in a Single-Phase PWM Inverter

Kazunori Hasegawa, Ichiro Omura, Shin-ichi Nishizawa, Kyushu Institute of Technology / National Institute of AIST, J

PP085 IGBT Switching Behavior With Parallel Surge Ar-rester For Medium Voltage Applictation

Fabian Hohmann, Mark-M. Bakran, University of Bayreuth, D

PP086 Using Powder Materials to Replace Air-Gaps for Fringing Flux Reduction Paul Winkler, Wulf Günther, Acal BFi Germany, D

PP087 Partial Discharge of Inductives in a High Frequency Application Herbert Jungwirth, Michael Schmidhuber, SUMIDA

Components Modules, D

PP088 Design of Inductive Components for Triangular Current Mode (TCM) Inverters up to 500 kW Tobias Appel, Spezial-Transformatoren-Stockach, D; Jan

Fuhrmann, Hans-Günter Eckel, University of Rostock, D

PP089 Study of the Influence of an Air Gap on Dimen-sional Resonance in MnZn-Ferrite Cores

Wolfgang Hauser, Manfred Albach, Friedrich-Alexan-der-University Erlangen, D

PP090 A Novel Approach to Calculate the Reluctance of Air-Gaps in Ferrite Cores Erika Stenglein, Manfred Albach, Friedrich-Alexan-

der-University Erlangen, D

PP091 Inductive Components for Solar Power Conversion in a Harsh Next Decade Environment Michael Schmidhuber, SUMIDA Components Modules, D; Marco Jung, Fraunhofer Institute IWES, D

PP092 Systemsimulations with EMI-Filter in an Automo- tive HighVolt Environment Stefan Schefler, Stefan Weber, EPCOS, D; Christoph Keller, Robert Bosch, D

Power Converters for Efficiency andRenewable Energy

Chairperson: Mike Meinhardt,SMA Solar Technology, D

PP070 Analysis of a Novel Buck-Buck Single Stage LED-Ballast

Alexander Pawellek, Thomas Dürbaum, Friedrich-Alex-ander-University Erlangen, D

PP071 Energy Efficient, GHz Excited Plasma Lighting System Kamil Kompa, Slawomir Niespodziany, KOMPA Sp. z o.o, PLPP072 Constant-Current Paralleling Controller fo Mid-Power LED Michael Heidinger, Christoph Simon, Fabian Denk, Wolfgang Heering, Rainer Kling, Karlsruhe Institute of Technology (KIT), D

PP073 A Novel Mains Operated LED Driver Using a GaN AC Switch

Dominique Bergogne, CEA-Léti, F

PP074 Electronic Ballast for Gas Discharge Lamp Based on Input- Series Output- Series Resonant Converter

Kaspars Kroics, Riga Technical University, LV

PP075 Control Loop Design for Closed-Loop Class-D Am-plifiers with 4th Order Output Filter

Franz Maislinger, Hans Ertl, Technical University of Vienna, AT; Goran Stojcic, Florian Holzner, Bernecker + Rainer Industrie-Elektronik, AT

PP076 Novel Gate Driver Technology for the Series Connection of Power Semiconductors Johannes Kemper, Hako, D; Boris Fiedler, Max Planck

Institute for the Structure and Dynamics of Matter, D; Klaus F. Hoffmann, Helmut-Schmidt University, D

PP077 Redundant Operation Mode of the Three-Level Advanced-Active-Neutral-Point-Clamped Converter for Wind Energy Application David Hammes, Sidney Gierschner, Hans-Günter Eckel,

University of Rostock, D

PP078 Implementation of Extended Kalman Filter for PMSG Considering the Dynamics of the Mechanical System Mohamed Abdelrahem, Christoph Hackl, Ralph Kennel, Technical University of Munich, D

PP079 Evolution of Bidirectional Power Architectures David Bourner, Vicor Corporation, USA PP080 Modular and Compact 1 MW Inverter in One 19 Inch Rack for Storage and PV Patrick Hercegfi, Stefan Schönberger, Fraunhofer Insti-

tute ISE, D

PP081 A New Step Towards the Power Electronics Design Automation Lyubomir Kerachev, CMP, F; Yves Lembeye, Jean- Christophe Crebier, G2Elab, F

Sensors, Metering, Diagnostics

Chairperson: Philip C. Kjaer,Vestas Wind Systems, DK

PP093 Current Measurement Device for High and Fast Changing Currents

Felix Himmelstoss, Karl Edelmoser, Technikum Vienna, AT

PP094 Measurement of Current and Magnetic Field in a Power Electronic Building Block using Coupled Inductors Patrick Deck, Christian Peter Dick, Jan Hannig, TH

Köln, D

PP095 Comparative Analysis of the Measurement Tech-niques to Characterize SiC-Power-Modules

Zhiyu Cao, Christian Schulte-Overbeck, AEG Power Solutions, D

PP096 An Open-Loop Hall-Cell Based Current Transducer with an Integrated Sigma-Delta Modulator Fabrice Salvi, David Jobling, Pierre Turpin, LEM Swit-

zerland, CH

PP097 Magnetoresistive Sensors for Angle, Position and Speed Measurement in Small-and Micro-actuators

Rolf Slatter, Rene Buß, Sensitec, D

PP098 Insulation Health State Monitoring of Traction Machines Based on Online Switching Transien Exploitation Markus A. Vogelsberger, Bombardier Transportation Austria, AT; Clemens Zoeller, Thomas M. Wolbank, Hans Ertl, Technical University of Vienna, AT

PP099 Comparison of Fundamental Active and Reactive Power Determination Methods in Single- Phase Systems Swen Bosch, Heinrich Steinhart, HTW Aalen, D

PP100 Practical Experience with EMI of Radio-Communi- cation System Versus Power Electronics Based on the SiC Jan Leuchter, University of Defence, CZ

3130

Room Brüssel 1

Power Converters with Wide Bandgap Devices II

Chairperson: Ulrich Kirchenberger, STMicroelectronics, D

10:00 800 V Three-Phase LLC Series Resonant DC/DC Con-verter Using SiC MOSFETsYusuke Nakakohara, Hirotaka Otake, Ken Nakahara, ROHM, J; Tomohiko Yoshida, Mamoru Tsuruya, Power Assist Technology, J

10:30 The Destructive Energy Hidden in Supply Lines Roland Kratz, Würth Elektronik, D

11:00 Optimization of a DCDC Dual Active Bridge Converter for Aircraft Applica-tionMaximin Blanc, Yves Lembeye, Jean-Paul Ferrieux, G2Elab, F; Corentin Rizet, Sirepe, F; Arnaud Mahe, Taoufik Bensalah, Thales AES, F

11:30 Highly Integrated Silicon Carbide 80 kW Resonant In-verter for High Voltage Generation Switching at 500 kHzUlf Müter, Klaus F. Hoffmann, Helmut Schmidt University - University of the Federal Armed Forces Hamburg, D; Arne Lunding, Bernhard Wagner, Philips Medical Sys-tems, D

Room Brüssel 2

IGBT

Chairperson: Katsuaki Saito,Hitachi Europe, GB

10:00 Dual Side-Gate HiGT Breaking Through the Limita-tion of IGBT Loss Reduction

Tomoyuki Miyoshi, Yujiro Takeuchi, Tomoyasu Furukawa, Ma-saki Shiraishi, and Mutsuhiro Mori, Hitachi, J

10:30 An Optimized Plug-In BIGT with No Requirements for Gate Control AdaptationsMunaf Rahimo, Charalampos Papadopoulos, Chiara Corvasce, Arnost Kopta, ABB Switzerland, CH

11:00 Power Rating Extension with 7th Generation IGBT and Thermal Management by Newly Developed Package TechnologiesKenichi Yoshida, Shinichi Yoshiwatari, Mutsumi Sawada, Yui-chi Onozawa, Osamu Ikawa, Fuji Electric, J

11:30 The Next Generation High Power Modules with Enhanced Trench BIGT TechnologyCharalampos Papadopoulos, Munaf Rahimo, Chiara Corvasce, Maxi Andenna, Arnost Kopta, ABB Switzerland , CH

12:00 High Efficient and Soft IGBT TechnologySuguru Hondo, Yu Enomoto, Yuta Kawamoto, Akihiro Hikasa, Kazuhide Ino, ROHM, J

Room München 2

Control Techniques in Intelligent Motion Systems

Chairperson: Walter Schumacher,Braun-schweig University of Technology, D

10:00 Harmonic Speed Control in RepetitiveMechanical SystemsVan Trang Phung, Mario Pacas, Universityof Siegen, D

10:30 Hybrid Curent and Acceleration Control of Servo DrivesJosef Wittmann, Rainer Hagl, University of Applied Sciences Rosenheim, D; RalphKennel, Technical University Munich, D

11:00 Analysis of Instantaneous Switching Frequency of a Hys-teresis Based PWM for Control of Power ElectronicsMalte Thielmann, Axel Klein, Michael Homann, Walter Schumacher, Technical University of Braunschweig, D

11:30 Natural-Sampled, Quasi-Continuous and Synchronous Pulse Width Modulator En-ables Field Oriented Control for High Speed DrivesJens Onno Krah, Markus Höltgen, Technical University Cologne, D; Christoph Klarenbach, Beckhoff Automation, D

Room Mailand

SPECIAL SESSION: Passive Components

Chairperson: Petar J. Grbovic, Huawei Technologies, D and Wolfram Teppan, LEM Intellectual Property SA, CH

10:00 Estimating the Pulse Performance of Wirewound Power ResistorsBertram Schott, Vishay Electronic, D

10:30 Inductance versus DC Current Measurements on the Anhysteresis of Magnetic MaterialJörn Schliewe, Stefan Schefler, Stefan Weber, Matthias Köppen, Achim Siersch, EPCOS, D

11:00 Experimental Evaluation of Capacitors for High Power Resonant ConvertersPetar J. Grbovic, Huawei Technologies, D; Miroslav Vasić, Jesús A. Oliver, Pedro Alou, Jose A. Cobos, University of Madrid, ES

11:30 Medium Frequency Transformer Design and Optimization

Marko Mogorovic, Drazen Dujic, ÉcolePolytechnique Fédérale de Lausanne, CH

Room München 1

Module Design

Chairperson: Peter Kanschat,Infineon Technologies, D

10:00 A New Intelligent IGBT Module forQuasi-Resonant Inverter ApplicationsBum-Seok Suh, Wonjin Cho, Alpha and Omega Semicon-ductor, ROK

10:30 Relaxing Thermal Stress by SLC Techno- logy and New PC-TIMKoichi Masuda, Yoshitaka Otsubo, Tomohiro Hieda, Mit-subishi Electric Corporation, J

11:00 Lifetime Estimation Model of HVIGBT Considering Hu-midityYumie Kitajima, Kenji Hatori, Shinichi Iura, Keiichi Na-kamura, Yasutaka Kusakabe, Kazuhiro Kurachi, Mitsubishi Electric Corporation, J; Eugen Wiesner, Mitsubishi Electric, D

11:30 Effects of Influencing the Individual Leg Inductance in Case of Paralleling Mo-dules on Basis of XHP 3 and EconoDUALMatthias Wissen, Waleri Brekel, Daniel Domes, Infineon Technologies, D

12:00 Breakdown of Gate Oxide of SiC-MOSFETs and Si-IGBTs Under High Temperature and High Gate VoltageMenia Beier-Möbius, Josef Lutz, Technical University of Chemnitz, D

08:45 Room Brüssel 1 KEYNOTE:The Smart Future of Power Electronics and its Applications, Hans Krattenmacher, SEW-Eurodrive, D

Conference Wednesday, 17 May 2017Morning Oral Sessions

09:30 Coffee Break



3332

Room Brüssel 1

SiC-Systems

Chairperson: Peter Steimer, ABB Switzerland, CH

14:00 A Novel Gate Drive Concept to Eliminate Parasitic Turn-on of SiC MOSFET in Low Inductance Power Mod-ulesAndreas März, Teresa Bertelshofer, Mark-M. Bakran, Uni-versity of Bayreuth, D; Martin Helsper, Siemens, D

14:30 Evaluation of Current Measurement Ac-curacy for a Power Module with Inte-grated Shunt ResistorsMatthias Spang, Niklas Hofstoetter, SE-MIKRON Elektronik, D

15:00 Optical Power Isolation Enables Novel IGBT and Sensor ApplicationsJan-Gustav Werthen, Mort Cohen, L2W En-ergy, USA

Room Brüssel 2

Power Electronics Optimization

Chairperson: Mark M. Bakran, Univer-sity of Bayreuth, D

14:00 Development of a High Efficient MPPT for Space Applications Using GaN

Power Transistors Cornelius Armbruster, Christian Schöner, Fraunhofer Institute ISE, D; Torben Schönbett, Alfons Klönne, Rainer Merz, University of Ap-plied Sciences Karlsruhe, D

14:30 Parasitic Inductance Analysis of a Fast Switching 100 kW Full SiC Inverter

Matthias Kegeleers, Julian Körner, Stefan Mat-lok, Maximilian Hofmann, Martin März, Fraun-hofer Institute IISB, D

15:00 Design Method for the Minimization of CM Inductor Volume with Consider-

ation of Core Saturation in EMI FiltersBilel Zaidi, Arnaud Videt, Nadir Idir, University of Lille (L2EP), F

Room München 1

Cooling Thermal Management

Chairperson: Josef Lutz, Chemnitz University of Technology, D

14:00 Temperature Swing Issue, How a Passive Two-Phase Cooling Loop Can Improve the Power Electronic LifetimeVincent Dupont, Cyrille Billet, Thomas Nicolle, CALYOS, BE

14:30 Real-Time Junction Temperature Estimation of Multi-chip Power Module Used in a Motor DriveMerouane Ouhab, Radoslava Mitova,Miao-Xin Wang, Schneider Electric, F; Zoubir Khatir, Ali Ibrahim, Jean-Pierre Ousten, IFSTTAR, F

15:00 A Double Side Cooled Electronic Power ModuleJacques Favre, APSI3D, F; Jean-Michel Reynes, IRT Saint Exupery, F; Jean-Pierre Fradin, Claudia Cadile, Sébastien Sanchez, Dominique Elzo, ICAM, F; Emmanuel Marcault, CEA Tech, F

Room München 2

Metering and Diagnostics and Standards

Chairperson: Enrique J. Dede, Univer-sity of Valencia, E

14:00 Monitoring of Current Balance in Paral-lel-connected Power ConvertersLorenzo Giuntini, GE Consumer & Industrial, CH

14:30 Online IGBT Temperature Measurement Method Using a Greybox ModelGeorg Pangalos, Malte Päsler, Holger Kapels, Fraunhofer Institute ISIT, D

15:00 Impact of Temperature Imbalance on Junction Tem-perature Identification for Multiple Chip Modules Using TSEPsJose Ortiz Gonzalez, Olayiwola Alatise, Li Ran, Philip Mawby, University of Warwick, GB

Room Mailand

Passive Components and New Materials

Chairperson: Eric Favre, IMI Precision Engineering, CH

14:00 Evolution of Magnetics in Power Electronics Applications and Facing the Challenges of Future Electronics IndustryKapila Warnakulasuriya, Andrea Polti, Murata Power Solutions, GB; Farhad Nabhani, Teesside University, GB

14:30 High Performance Common-Differential Mode Chokes for High Efficient EMI FiltersThiemo Kleeb, Juliane Hinze, Peter Zacharias, University of Kassel, D

15:00 Dimensioning and Testing Planar Inductors for High Fre-quency OperationGérard Delette, CEA-Léti, F

Conference Wednesday, 17 May 2017Afternoon Oral Sessions

15:30 – 17:30 Foyer Poster/Dialogue Session

15:30 Coffee Break


3534

Conference Wednesday, 17 May 2017, Poster Dialogue Sessions15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte

PP110 A New Alternative Non-Pressure Silver Sinter Process by Using IR Wolfgang Schmitt, Ly May Chew, Heraeus Germany, D

PP111 High Reliability Large Area Substrate Solder Inter-connect with Embedded Mesh Technique

James Booth, Kim Evans, Xiaoping Dai, Michael Varley, Dynex Semiconductor, GB; Karthik Vijay, Indium Corporation, GB

PP112 Transient Current Distribution with Paralleling Dies and Paralleling Half Bridges in Multichip Power Modules Measurement Scheme to Model an SiC MOSFET for Simulating its Switching Behaviors Helong Li, Wei Zhou, Daohui Li, Steve Jones, Xiaoping Dai, Dynex Semiconductor, GB

PP113 Influence of the Power Semiconductor Packaging on the Failure Characteristic for Safety-Critical Applications Michael Gleißner, Mark-M. Bakran, University of

Bayreuth, D; Hussein Khalid, Mitsubishi Electric Europe, D

PP114 Double Side Sintered IGBT 650V/200A in a TO-247 Package for Extreme Performance and Reliability

Francois LeHenaff, Alpha Metals Lötsysteme, D; Gus- tavo Greca, Paul Salerno, Monnir Boureghda, Alpha Assembly Solutions, USA; Anna Lifton, Apha, NL; Jean Claude Harel, Renesas Electronics, USA; Weikun He, Mentor Graphics, GB

Control of Power Electronic Converters

Chairperson: Geraldo Nojima, Eaton Corporation, USA

PP115 Reactive Power Operation of a Single Phase AC-AC DAB Converter

Martin Jagau, Michael Patt, Technologienetzwerk All-gäu, D

PP116 Use of FPGAs to Develop Energy-Saving DC-DC Control

Ben Jeppesen, Intel FPGA, GB; Ge Gao, Imperial Col- lege London, GB

PP117 Comparison of Three Model Based Junction Tem-perature Control Systems to Increase the Lifetime of IGBT-Power- Modules

Maximilian Nitzsche, Julian Wölfle, Nathan Tröster, Mar-tin Stempfle, Jörg Roth-Stielow, University of Stuttgart, D

PP118 A New Modulation Technique to Control the Switching Losses for Single Phase Three-Level Ac-tive-Neutral-Point-Clamped-Inverters

Johannes Ruthardt, Julian Wölfle, Matthias Zehelein, Jörg Roth-Stielow, University of Stuttgart, D

PP119 Comparison of FPGA Based Control Strategies (DDSRF-PI vs. State-Space Control) for Grid Con- nected Inverters under Grid Disturbances Emanuel Mittwede, Johannes Kern, Stefan Schön- berger, Benjamin Stickan, Fraunhofer Institute ISE, D

PP120 STNRGPF01: A New Driver for Interleaved PFC Based on Mixed Signal Control Sebastiano Messina, Marco Torrisi STMicroelectronics, I

PP121 Quasi-Constant Frequency Secondary Side Con- trolled Flyback Concept with Variable ON-Time Alexander Connaughton, Graz University of Technology,

AT; Arash Pake Talei, Kin Kennith Leong, Infineon Technologies Austria AG, AT

PP122 Sensorless Control of a Bridgeless PFC Using a Low Pass Filter Model and a Linear PR Controller

Francisco Azcondo, Felipe López, Alberto Pigazo, Paula Lamo, University of Cantabria, ES

PP123 Optimised Modulation of Five-Phase Open-End Winding Drive

Ivan Zoric, Martin Jones, Liverpool John Moores Univer- sity, GB; Milan Darijevic, Siemens AG, D

PP124 Characterizing the Conducted EMI Performance of a Power Module Through Passive Measurement

Yu Liu, Infineon Technologies, D; Sergey Kochetov, BMW, D; Thomas Smazinka, Fraunhofer Institute IISB, D; Andreas Lindemann, Otto-von-Guericke-University, D

PP125 A New Approach for Digital Controlled Power Supplies Regarding Pulsed Plasma Nitriding Systems Lisa Franke, Lutz Zacharias, Mirko Bodach, Ringo Leh-

mann, Westsächsische Hochschule Zwickau, D; Andreas Böhm, Plasmanitriertechnik Dr. Böhm, D

Power Supplies, Control and Drive

Chairperson: Manfred Schlenk, Infineon Technologies, D

PP126 Combination of Forward-Voltage Measurement and Short-Circuit Detection for High-Voltage IGBTs Patrick Münster, Daniel Lexow, Hans-Günter Eckel, Uni- versity of Rostock, D

PP127 Gate Driver IC for GaN GIT for High Slew Rate and Cross Conduction Protection

Aaron Qingwei Cai, Arnel Carrera Herreria, Howard Ban How Sin, Panasonic Industrial Devices Semiconductor Asia, SG; Liter Siek, Nanyang Technological University, SG

PP128 Gate Drivers For Medium Voltage Applications Pierre Lefranc, Sokchea Am, Benoit Sarrazin, Rachelle Hanna, David Frey, G2Elab, F

PP129 Diode Effects Bring Liefetime Risks to Series Resistors Wolfgang Frank, Infineon Technologies, D

PP130 FPGA Based Control of an Three Level Neutral Point Clamped Inverter

Markus Schaefer, Martin Hofmann, Sebastian Raab, Ansgar Ackva, University of Applied Sciences Wuerz- burg-Schweinfurt, D

PP131 Investigation of Magnetical Coupler Immunity Against External High Frequency and Density Mag- netic Field Bernhard Strzalkowski, Analog Devices, D

PP132 1000 V/80 W Auxiliary Power Supply as a Demon-stration Vehicle for Wide Bandgap Power Electron-ics System Design

Mehrdad Baghaie Yazdi, Xiaomin Wu, Peter Haaf, Klaus Neumaier, Fairchild Semiconductor, D; Martin Domeij, Fairchild Semiconductor, SE

PP133 Ultra Linear Switching Rectifiers (ULSRs) for High- Quality Regulated 3-Phase AC to DC Conversion Alexei Nikitin, Avatekh, USA; Arlie Stonestreet II, Ultra Electronics ICE, USA

PP134 Start-Up Operation of Active Three-Phase Third Har-monic Injection Rectifiers

Markus Makoschitz, AIT Austrian Institute of Tech- nology, AT; Michael Hartmann, Schneider Electric, AT; Hans Ertl, Vienna University of Technology, AT

PP135 State-of-the-Art GaN Power IC-based 150 W AC-DC Adapter Tom Ribarich, Stephen Oliver, Navitas Semiconductor, USA

PP136 Which Should Be Chosen in Three-Phase Diode Rectifier, Single-Bridge or Double-Bridge? Ryu Kawakubo, Yasuyuki Nishida, Chiba Institute of Technology, J

PP137 Digital Control of Active Resistance Emulation in Three Phase Rectifiers with Current Injection Prin-ciple

Radoš Vreljakovic, Predrag Pejovic, School of Electrical Engineering, RS; Milan Darijevic, Siemens, D

Power Inverters

Chairperson: Silvio Colombi, General Electric, CH

PP138 Noise Mitigation in HV Tests Sourced by A Static Frequency Converter by Means Of Changing PWM Signal’s Carrier Frequency

Mazen Alzatari, Janusz Szczechowski, ABB, D

PP139 Novel Active Ripple Filtering Schemes Used In Little Box Inverter Radoslava Mitova, Miao-Xin Wang, Schneider Electric, F; Rajesh Ghosh, Mudiyula Srikanth, Schneider Electric, IN; Damir Klikic, Schneider Electric, USA

PP140 Experimental Study of Si- and SiC-Based Voltage Source Klaus Sobe, Fabio Brucchi, Infineon Technologies Austria, AT

PP141 Double-Loop Controlled Grid-Connected Inverter Yury Skorokhod, Dimitriy Nitkin, Sergey Dyakin, Transconverter, RU; Sergey Volskiy, Moscow State Aviation Institute Technical University, RU

PP142 Design and Realization of a 100kHz-100kW Series Resonant Inverter with SiC-MOSFETs Connected in Parallel for a High Frequency Induction Heating Application Yildiray Baskurt, Dokuz Eylul Universitesi, TK

PP143 AC-Sweep Analysis and Verification of an AC Power Source with Virtual Output Impedance for Validation of Grid Connected Components Peter Jonke, Markus Makoschitz, Johannes Stöckl, AIT Austrian Institute of Technology, AT; Hans Ertl, Vienna University of Technology, AT

PP144 Technological Possibilities of New Silicon-Carbide Mosfets in Power-Inverter for the Inductive Energy Transfer

Martin Warkentin, Faical Turki, Thomas Vosshagen, Paul Vahle, D

PP145 Five-Level Cascaded Flying-Capacitor Converter Sidney Gierschner, David Hammes, Hans-Günter Eckel, University of Rostock, D; Max Beuermann, Siemens, D

PP146 Safe IGBT Turn Off In Three-Level Neutral Point Clamped Type 2 (NPC2) Topology During the Special Case of Short Circuit at 1000V DC Voltage Vladan Jerinic, Reiner Hinken, Danfoss Silicon Power, D; Kevin Lenz, Power Integrations, D

PP147 A Generalized Approach to the Analysis and Control of Modular Multilevel Converters

Patrick Himmelmann, Marc Hiller, Karlsruhe Institute of Technology (KIT), D

PP148 On Energy Balancing for a Full-Bridge MMC with Distributed Energy Storage Devices

Gerrit Henke, Mark-M. Bakran, University of Bayreuth, D

PP149 Comparison and Evaluation of Modular Multilevel Converter Topologies for Li-Ion Battery Systems Matthias Luh, Thomas Blank, Marc Weber, Karlsruhe

Institute of Technology (KIT), D

Improved Efficiency Power Converters

Chairperson: Jacques Laeuffer,Dtalents, F

PP150 Progress of High Power Multilevel Converters: Combining Silicon And Silicon Carbide Christopher Dahmen, Rainer Marquardt, University of

the Federal Armed Forces Munich, D

PP151 Direct Torque Control with Variable Level Discreti- zation for Automotive Drives Eduard Specht, Stefan Goetz, Christoph Aschauer, Christian Korte, Porsche Engineering Group, D

PP152 Analysis and Modeling of Efficiency Curve Dip in VRM with Low Output Inductance Ann Starks, Zhiyang Chen, ON Semiconductor, USA

PP153 EMI Considerations on MHz Inverters Christoph Simon, Fabian Denk, Michael Heidinger, Karlsruhe Institute of Technology (KIT), D

PP154 Analysis of the Impact of Silicon Carbide Modules in Wind and Traction Applications

Itziar Kortazar, David Ortega, Igor Larrazabal, Ingeteam, ES; Mrinal Das, Wolfspeed, USA

PP155 High Efficiency LLC Based AC-DC Converter for Wide Load Voltage Range

Navid Daniali, Syed Inam Ul Murtaza Shah, Euro Engineering, D

PP156 A Novel Approach to Reduce Losses in Boost PFC Stage of a 90W-Adapter Eva Schmidt, Daniel Kübrich, Thomas Dürbaum, Friedrich-Alexander-University Erlangen, D

PP157 How the heck do I Measure a Gate Drive Slewing at 70kV/Us? Bart Schroder, Cleverscope, NZ

PP158 Thyristor Rectifier for Permanent Magnet Wind Generators Philip C. Kjaer, Ionut Trintis, Morten Risskov Knudsen,

Stig Lund Pallesgaard, Vestas Wind systems A/S, DK; Peter Mongeau, Vestas Wind Systems, USA

PP159 Evaluation of an Isolated DC-DC Converter Naoki Koike, Shinichiro Nagai, Pony Electric, J; Hiroki Watanabe, Jun-ichi Itoh, Nagaoka University of Tech- nology, J

PP160 STMicroelectronics’s Super-Junction and Ultra- FAST MOSFET vs IGBT Technologies in Low Power Motor Drives Carmelo Parisi, Gaetano Belverde, Alessio Corsaro, STMicroelectronics, I

PP161 Active Switch Impact on CCM Totem-Pole PFC Efficiency Matt OGrady, Ke Zhu, Jonathan Dodge, United Silicon Carbide, USA

PP162 Dc Bus In Industry A New Way Towards Energy Efficiency Fernando Luiz Marcelo Antunes, Andre dos Santos Lima, Antonio Alisson Alencar Freitas, Aderaldo Racarte Guedes, Edilson Meneiro Sá Jr. Federal Univer- sity of Ceara, BR

Automotive, Traction and Aerospace

Chairperson: Martin März, Fraunhofer Institute IISB, D

PP163 The Highest Power Density IGBT Module in the World for xEV Power Train

Akihiro Osawa, Keiichi Higuchi, Akio Kitamura, Daisuke Inoue, Yoshikazu Takamiya, Souichi Yoshida, Hiromichi Gohara, Masahito Otsuki, Fuji Electric, J

PP164 J1-Series Modules with Integrated Cooler for Electric and Hybrid Vehicles Tatsuya Kawase, Shinsuke Godo, Noburu Miyamoto, Kazuaki Hiyama, Mikio Ishihara, Yosuke Nakata, Mitsubishi Electric Corporation, J

PP165 Power MOSFETs for Low Voltage and High Current Automotive Applications- 48V Bus Systems

Rajagopalan Jagannathan, Marco Atzeri, Hans-Peter Hoenes, ON Semiconductor, D

PP166 Electrothermal Stresses in SiC MOSFET and Si IGBT 3L-NPC Converters for Motor Drive Applications

Zarina Davletzhanova, Olayiwola Alatise, Roozbeh Bon-yadi, Sylvia Konaklieva, Jose Ortiz Gonzalez, Li Ran, Philip Mawby, University of Warwick, GB

PP167 High Efficiency and Ruggedness Intelligent IGBT Technology for EV/HEV Vittorio Crisafulli, ON Semiconductor, D

PP168 Highly Integrated Power Unit Based on Double Sided Cooling IGBT Module Vincent Li, William Zhu, Dynex Semiconductor, GB

PP169 Efficiency Increasing by a Variable DC Link Voltage in Combination with a Bang-Bang Controlled In-verter for an Automotive Application

Magnus Böh, Andreas Lohner, TH Köln, D

PP170 Magnetic Leakage Field Pattern of a 7kw Wireless Electric Charging System in Different Environments

Leandro Percebon, Daniel Kuerschner, Qualcomm CDMA Technologies,

PP171 Innovations for IGBT Based Power Modules in HEV Drivetrain Applications

Thomas Geinzer, Martin Gleich, Alexander Schwarz, Infineon Technologies, D

PP172 Estimation of the Losses in Si and SiC Power Modules for Automotive Application Dounia Oustad, Menouar Ameziani, Dominique Lhotellier, VEDECOM, F; Stéphane Lefebvre, Meckael Petit, ENS Cachan, F

PP173 DC/DC-Converter with Optimised Power Density for Integration of Multifunctional Fuel Cell Systems in Modern Aircraft Application Mathias Warncke, Klaus F. Hoffmann, Sebastian Fahl- busch, Helmut Schmidt University- University of the Federal Armed Forces Hamburg, D

Wide Bandgap Devices II

Chairperson: Chris Rexer,ON Semiconductor, USA

PP101 Short Circuit Capability of 650 V Normally Off GaN E-HEMT and MOSFET-HEMT Cascode

Douglas Pappis, Kevin Göbel, Peter Zacharias, Univer- sity of Kassel, D

PP102 Advantages Using 650V SiC MOSFET in High Frequency DC-DC Converter Antonino Gaito, Giuseppe Sorrentino, STMicroelec- tronics, I

PP103 Cross Conduction of GaN HFETs in Half-Bridge Converters Jan Böcker, Carsten Kuring, Sibylle Dieckerhoff, Tech- nical University Berlin, D; Oliver Hilt, Joachim Würfl, FBH Ferdinand-Braun-Institute Berlin, D

PP104 Design Rules for Paralleling of Silicon Carbide Power MOSFETs

Salvatore La Mantia, STMicroelectronics Application, D; Luigi Abbatelli, Giuseppe Catalisano, Maurizio Melito, STMicroelectronics, I

PP105 Influence of an Emitter Sense Pin on the Switching Behavior of SiC BJTs in Standard Discrete Housings

Christian Bödeker, Melanie Adelmund, Nando Ka- minski, University of Bremen, D; Ranbir Singh, GeneSiC Semiconductor, USA

PP106 Designing Manufacturable and Reliable Printed Circuit Boards Employing Chip Scale eGaN® FETs Michael de Rooij, Alana Nakata, Efficient Power Con- version (EPC) Corporation, USA

PP107 Impact of Circuit Carrier Technologies on MHz-switching of GaN Half-Bridge Circuits

Norbert Seliger, Franz Stubenrauch, University of Applied Sciences Rosenheim, D; Christian Brendel, Dr. Johannes Heidenahain, D; Doris Schmitt-Landsiedel, Technical University of Munich, D

Thermal Management and Packaging II

Chairperson: Toshihisa Shimizu, Tokyo Metropolitan University, Japan

PP108 MMC AlSiC as Alternative for Molybdenum in Power Press-Pack Semiconductor Design. Investi-gations of Electric Conductivity Properties of AlSiC

Alexey Grishanin, Valentin A. Martynenko, Vyacheslav Eliseev, Anton Samoylov, JSC Electrovipryamitel, RU; Konstantin Nishchev, Mikhail Novopoltsev, Ogarev Mordovia State University, RU

PP109 Sintered Ag Joints on Copper Lead Frame TO220 by Pressure Sintering Process with Improved Reliability and Bonding Strength Ly May Chew, Wolfgang Schmitt, Jens Nachreiner, Heraeus Deutschland, D

3736

Conference Wednesday, 17 May 2017, Poster Dialogue Sessions15:30 – 17:30, Foyer Ground Floor Entrance NCC Mitte

PP181 Approach of Optimization of Power Leveling Sys-tem Using Multi-energy Storage Devices

Toshihiro Shimao, Koji Kato, Yoichi Ito, Sanken Electric, J

PP182 Single-Phase PWM-Based Unity Power Factor Rectifier with Adaptive Predictive Current Control Swen Bosch, Jochen Staiger, Heinrich Steinhart, HTW Aalen, D

PP183 1.5kW Digital Totem Pole PFC Design for Air- Conditioner and Performance Comparison Using IGBT, SiC and GaN Wei Wu, Infineon Technologies Americas, USA

Software Tools and Applications

Chairperson: Peter Zacharias, University of Kassel, D

PP184 Design of Test-system for EMC Investigations of Systems with Magnetron Jan Leuchter, Quang Huy Dong, University of Defence, CZ

PP185 Development of LabVIEW Models for Resonant Power Converters Tsveti Hranov, Nikolay Hinov, Technical University of Sofia, BG

PP186 A Novel Detailed Analysis Of The Flyback Converter Utilizing A Transformer With Nonlinear Magnetiz- ing Inductance Panagiotis Mantzanas, Thomas Duerbaum, Friedrich- Alexander-University Erlangen, DPP187 eDesignSuite: A New Design Tool for Digital Power Solutions Carmelo Giuseppe Viccica, Marcello Palano, Natale Porto, STMicroelectronics, I

High Perfomance Power Electronics

Chairperson: Dehong Xu, ZhejiangUniversity, CN

PP174 Influence of Different Switching Frequencies and Modulation Techniques on IPMSM and Inverter Losses Optimizing the Overall Drive Train Efficiency Martin Stempfle, Yuying Han, Julian Wölfle, Nathan Tröster, Jörg Roth-Stielow, University of Stuttgart, D

PP175 Finite Control Set Model Predictive Control of a PMSM Fed by a Multilevel Inverter

Cristian Vargas, Simon Feuersänger, Mario Pacas, Univer- sity of Siegen, D

PP176 Current Control Delay Reduction for FPGA-Based Servodrive Lev Rassudov, Balkovoi Aleksandr, Moscow Power Engineering Institute, RU

PP177 An Optimal Coreless Transformer Topology for Power Transfer Yohan Wanderoild, Romain Grezaud, Dominique Bergogne, Adrien Morel, CEA-Léti, F; Hubert Razik, Laboratoire Ampère, F

PP178 Switching Loss Minimization Using Two-Confi- guration Predictive Control for a Thermo-Hydraulic Linear PMSG Daniel Bernet, Karlsruhe Institute of Technologie (KIT), D

PP179 Energy Storage Battery Protection System with Ex-ternaly Triggered Melting Fuses

Mitja Koprivsek, ETI, SL

PP180 Software-Defined Battery Technology: Novel Approach to Battery Management Eric Macris, Maxim Integrated, USA

PP188 Design Concept of MMC-based Multi-port DC Hub for Multiterminal HVDC Grids

Epameinondas Kontos, Pavol Bauer, Delft University of Technology, NL

PP189 Direct-Model Predictive Control for Fault Ride-Through Capability Enhancement of DFIG

Mohamed Abdelrahem, Ralph Kennel, Technical Uni- versity of Munich, D

PP190 AutoCrear- A Novel Software Tool for Automatic 3D Creepage and Clearance Analysis Michael Martinek, e-laborate Innovations, D

PP191 Power-Hardware-In-Loop Setup for Power Elec- tronics Tests Giovanni De Carne, Xiang Gao, Marco Liserre, Christian-Albrechts-University, D

PP192 Ensuring Fast Turn-Around Times for A Program- mable Digital Power Controller Markus Schnell, Jörg Oehmen, Infineon Technologies, D

PP193 A New Optimization Algorithm for Power Electron-ics Using the Mixed Integer Linear Programming Method

Marco Schilling, Tobias Reimann, Technical University Ilmenau, D; Ulf Schwalbe, ISLE Steuerungstechnik und Leistungselektronik, D

PP194 Novel Efficient and Reliable Network Simulation by Means of Lipschitz Constants Carsten Kuring, Technical University Berlin, D; Julian Dobusch, Thomas Dürbaum, Friedrich-Alexander- University Erlangen, D

PP195 Hardware-in-the-Loop Parallelization for Fully Automated Testing of “AVL E-Storage BTE” Selimcan Deda, Roland Greul, Guenter Prochart, AVL LIST, AT

Exhibitor Forum Hall 7 Booth 507

As of March 2017/subject to change without notice

Tuesday, 16 May 2017 10:00 – 16:40

Wednesday, 17 May 2017 09:40 – 16:40

Thursday, 18 May 2017 10:00 – 16:00

MES Manz Electronic Systeme OHG | Alpha Assembly Solutions | Mentor Graphics | Rohde & Schwarz GmbH & Co KG. |

Sekels GmbH | Panasonic Automotive & Industrial Systems Europe GmbH | Siebel Elektronik GmbH | RECOM Power GmbH

Monolith Semiconductor, Inc. | A.L.M.T. Corp. | Advanced Cooling Technologies Inc. | ON Semiconductor | KEMET Electron-

ics Corporation | Littelfuse | AMS Technologies AG | ROGERS Corporation |Indium Corporation of Europe | Proton-Electrotex

| dSPACE GmbH | EPCOS AG, A TDK Group Company | Traftor Europe | Hitachi Metals Europe GmbH | Mitsubishi Electric

Europe B.V. | Vincotech GmbH | Kapteos S.A.S. | ABB Switzerland Ltd. - Semiconductors | SEMIKRON International GmbH |

Allegro MicroSystems, LLC | POCO Holding Co., Ltd. | HEIDEN power GmbH | ROHM Semiconductor GmbH | Diotec Semicon-

ductor AG | Tamura-Europe Ltd. | Yole Developpement SA | VACUUMSCHMELZE GmbH & Co. KG | EPCOS AG, A TDK Group

Company | Jianghai Europe Electronic Components GmbH | Sumitomo Electric Industries, Ltd. | FuG Elektronik GmbH | Hol-

lmén & Co Ltd | Honeywell Europe N.V. | POWERSYS | Analog Devices GmbH | Aperam Alloys Amilly | EpiGaN nv | SET Power

Systems GmbH | Exagan S.A. | MB Electronic AG | Amulaire Thermal Technology | Wolverine Tube Inc. MicroCool Division |

AC Power Corp. | Magnetics Inc. | Hangzhou Firstack | Technology Co., Ltd. | 3 M Deutschland | tesema Leistungselektronik |

GT elektronik GmbH & Co. KG | DEWETRON GmbH | Panasonic Automotive & Industrial Systems Europe GmbH | Vincotech GmbH

On all three exhibition days, a great variety of exhibitors present their latest product developments andstate-of-the-art solutions in 20-minutes slots.

The following exhibitors are represented:

Full program available on pcim-europe.com

3938

Room Brüssel 1

Advanced Wide Bandgap - GaN

Chairperson: Peter Wallmeier, Delta Energy Systems, D

10:00 Investigation of GaN-HEMTs in Reverse ConductionRichard Reiner, Patrick Waltereit, Beatrix Weiss, Rüdiger Quay, Oliver Ambacher, Fraunhofer-Institute IAF, D

10:30 Short-Circuit Robustness for 650 V E-Mode GaN Tran-sistors, Current Measurement for High Speed Protec-tionCircuitMatthieu Landel, Cyrille Gautier, Denis Labrousse, Stéphane Levebvre, ENS Cachan - SATIE, F

11:00 Mechatronic Design of 2 kW SiC DC/AC Converter with 200 W/inchThomas Menrath, Stefan Matlok, StefanEndres, Stefan Zeltner, Bernd Eckardt, Fraunhofer Institute IISB, D

11:30 A Full SiC Module Operational at 200°C Junction Real-ized by a New Fatigue-Free StructureHiroshi Notsu, National Institutee ofAdvanced Industrial Science and Techno-logy (AIST), J

12:00 A Novel SiC Power Module with 3DIntegrationJinchang Zhou, ON Semiconductor, USA

Room München 1

Power Electronics in Automotive

Chairperson: Giuseppe Tomasso, Univer-sity of Cassino and South Lazio, I

10:00 Influences of WPT-Coil Losses and Coupling Coefficient on the Resonance Circuits of Wireless Power Transfer SystemsChristof Ziegler, Stefan Weber, EPCOS, D; Georg Heiland, Finepower D; Denis Kraus, Technical University of Munich, D

10:30 6 kW Bidirectional, Insulated On-board Charger With Nor-mally-Off GaN Gate Injection TransistorsStefan Endres, Christoph Seßler, Bernd Eckardt, Stefan Zeltner, Fraunhofer Institute IISB, D;Tatsuo Morita, Panasonic Corporation, J

11:00 650V, 7mOhm SiC MOSFET Development for Dual-Side Sol-dered or Sintered Power ModulesMonty Hayes, Delphi Automotive Systems, USA; Brett Hull, Jeffrey Casady, John Palmour, Wolfspeed, USA

11:30 Spectral Control of an Automotive DC-DCConverterChristian Korte, Stefan Götz, Eduard Specht, Porsche Engineering Group, D

Room Mailand

SPECIAL SESSION:Capacitors

Chairperson: Klaus F. Hoffmann, Helmut-Schmidt-University, D

10:00 Ceramic Power Capacitors and Optimized PackagingMarkus Koini, EPCOS, AT

10:30 Ultra Capacitors - Capacitor Based Energy StorageJan-Hendrik Ernst, Maxwell Technologies, D; Robert Lynds, Catalin Popescu, Mark Sutherland, Maxwell Technologies, USA

11:00 Review of Film Capacitor Trends andDesign Changes as a Result of Improved Technologies in Power ElectronicsAyse Kartal, EPCOS, D

11:30 New Concepts of Capacitor Designs in Power ElectronicsThomas Ebel, FTCAP, D

Room München 2

Control and Drive Strategies in Power Converters

Chairperson: Hans-Günter Eckel, University of Rostock, D

10:00 Digital Control of Hard Switched Converters by Phase Modulated

Pulse Width Modulation PMPWMStefan Matlok, Bernd Eckardt, Bernd Seliger, Martin März, Fraunhofer Institute IISB, D

10:30 Non-Linearities Compensation Technique for VSI Fed AC DrivesMauro Di Monaco, Giuseppe Tomasso, Ciro Attaianese, Umberto Abronzini, University of Cassino and Southern Lazio, I

11:00 Novel Control Scheme for the Internal Energies and Cir-culating Currents of Modular Multilevel ConverterYeqi Wang, Rainer Marquardt, University of the Federal Armed Forces Munich, D

11:30 Suitable Turn-Off Strategies for IGBTs with a High Desaturation Current During Short Circuit Failures Detected with the 2D – Short Circuit Detection MethodStefan Hain, Mark-M. Bakran, University of Bayreuth, D

08:45 Room Brüssel 1 KEYNOTE: Evolution in Topologies as a Result of New Devices and Enabling Technologies, Ionel Dan Jitaru, Rompower, USA

Conference Thursday, 18 May 2017Morning Oral Sessions


09:30 Coffee Break


4140

Room Brüssel 1

SiC Modules Diodes

Chairperson: Munaf Rahimo,ABB Switzerland, CH

14:00 Design and Analysis of a Low-Inductive Power-Semi-conductor Module with SiC T-MOSFET and Si IGBT in Parallel OperationChristian Müller, Infineon Technologies, D

14:30 1.7 kV High-Current SiC Power Module Based on Multi- Level Substrate Concept and Exploiting MOS-FET Body Diode during OperationSlavo Kicin, ABB Corporate Research, CH; Enea Bianda Francisco Canales, Samuel Hartmann, Fabian Fischer, ABB Switzerland, CH

15:00 All SiC Module with 1st Generation Trench Gate SiC MOSFETs and New Concept PackageThomas Heinzel, Fuji Electric Europe, D; Yoshinori Iwasaki, Mikiya Chounabayashi, Masayoshi Nakazawa, Susumu Iwamoto,Yasuhiko Oonishi, Motohito Hori, HideakiKakiki, Osamu Ikawa, Fuji Electric, J

15:30 Robust SiC JBS Diodes for the Application in Hybrid ModulesLukas Kranz, Renato Amaral Minamisawa, Lars Knoll, Sven Matthias, Andrei Mihaila, Charalampos Papadopoulos, Athanasios Mesemanolis, Elena Mengotti, Giovanni Alfieri,Vinoth Kumar Sundaramoorthy Enea Bianda, Munaf Ra-himo, ABB Switzerland, CH

Room München 1

Power Converters with Wide Bandgap Devices III

Chairperson: Hubert Schierling,Siemens, D

14:00 Design and Performance of a 200 kHz GaN Motor Inverter with Sine Wave Filter

Franz Stubenrauch, Norbert Seliger, University of Applied Sciences Rosenheim, D; Doris Schmitt- Landsiedel, Technical University Munich, D

14:30 Reducing dv/dt of Motor Inverters by Staggered- Edge Switching of Multiple

Parallel SiC Half- Bridge CellsThomas Fuchslueger, Hans Ertl, Technical Univer-sity of Vienna, AT; Markus A. Vogelsberger, Bom-bardier Transportation, AT

15:00 Highly-Reliable Flyback-Based PV Micro-Inverter Applying Power Decoupling Capability Without Additional Compo-nentsHiroki Watanabe, Jun-Ichi Itoh, Nagaoka University of Technol-ogy, J

15:30 Compact Highly Efficient 3-kW MHz Inverter Based on SMT SiC MOSFETsFabian Denk, Christoph Simon, Michael Heidinger, Rainer Kling, Wolfgang Heering, Karlsruhe Institute of Technology (KIT), D

Room München 2

System Reliability

Chairperson: Uwe Scheuermann,Semikron Elektronik, D

14:00 Power Cycle Testing of Sintered SiC- MOSFETs Ralf Schmidt, Ronny Werner, Siemens, D; Jeffrey Casady, Brett Hull, Adam Barkley, Wolfspeed, USA

14:30 Synchronous Observing Methodology of Surface Images and Energy Data at Power Chip DestructionToshiya Tadakuma, Akiko Goto, Teruaki Nagahara, Junji Yamada, Mitsubishi Electric Corporation, J

15:00 Active Current Trajectory Control (ACTC) - for Hot Swap, Capacitor Discharge,Circuit Breaker and Current ShapingJuan Sanchez, Kennith Kin Leong, Infineon Technologies Austria , AT

15:30 Impact of Humidity on Railway ConvertersChristian Zorn, Nando Kaminski, University of Bremen, D; Michel Piton, ALSTOM, F

Room Mailand

Energy Storage and Power Quality Solutions

Chairperson: Daniel Chatroux, CEA-LITEN, F

14:00 A Comparative Study on Si-SJ-MOSFETs vs. GaN-HEMTs Used for LLC-Single-Stage Battery ChargerLukas Keuck, Patrick Hosemann, Benjamin Strothmann, Joachim Böcker, University of Paderborn, D

14:30 Investigation and Optimization of theAccuracy of Current Sensors for High Voltage LFP- BatteriesSimon Bischof, Thomas Blank, Marc Weber, KarlsruheInstitute of Technology (KIT), D

15:00 High-Efficiency UPS Protection for Indus-trial ApplicationsLorenzo Giuntini, Massimiliano Brioschi, GE Consumer & Industrial, CH

15:30 A Battery and Super Capacitor Hybrid Energy Storage System for Power Flow Smoothing in Low Voltage GridsBernd Bohnet, Michael Braun, KarlsruheInstitute of Technology (KIT), D

Conference Thursday, 18 May 2017Afternoon Oral Sessions


4342

List of Exhibitors

3M Deutschland, DA Media Bodo’s Power Systems, DA.L.M.T., JAavid Kunze, DAavid Thermalloy, IABB Switzerland – Semiconductors, CHAC Power, TWAdvanced Cooling Technologies, USAAdvanced Techne – PRIATHERM DIVISION, IAdvanced Technology & Materials, CNAdvice Electronics, ILAgileSwitch, USA AIC Europe, DAIT Austrian Institute of Technology, AAixControl, DALCON Electronics, INDalfatec, DAlisha Coils & Transformers, INDAllegro MicroSystems Europe, GBAllray, CNAlpha and Omega Semiconductor, USAAlpha Assembly SolutionsALPHA-Numerics, Dalpitronic, Ialttec, DAlutronic Kühlkörper, DAmantys Power Electronics, GBAMS Technologies, DAmulaire Thermal Technology, TWAnalog Devices, DAnhui Astromagnet, CNAPAQ Technology, GBAperam Alloys Amilly, FAPM Technologies (Dongguan), CNAPOJEE, DApplied Micro Electronics AME, NLArcel, FArthur Behrens, DASM Assembly Systems, DAT & S Austria Technologie & Systemtechnik, AAtherm, FATV Technologie, Dausterlitz electronic, DAutomatisierungsTechnik VoigtAutosplice Europe, DAUXEL, FAVX, GBBehlke Power Electronics, DBeijing Deepcool Industries, CNBeijing Sunking Power Electronic Technology, CNBestbright Electronics, CNBINDER tecsys, DBLOCK Transformatoren-Elektronik, DBluestar Silicones France, FBourns Sensors, DBrightek (Europe), GBBroadcom Europe, DBROXING, CHBruckewell Technology, TWCaltest Instruments, DCascade Microtech, USACEFEM INDUSTRIES, FCEJN-Product, DCelem Passive Components, ILCeramTec, DChang Sung, ROKChina Amorphous Technology, CNCHROMA ATE EUROPE, NLCixi ULO Electronics, CNCKE Products by Dean Technology, USACleverscope, NZCluster Leistungselektronik im ECPE, DCMC Klebetechnik, DCMP, FColumbia-Staver, GBConstellium Singen, D

Cool Tec Electronic, DCOOLTECH, ICoorsTek, DCosmo Ferrites, INDCPS Technologies, USACST, DCTX Thermal Solutions, DCystech Electronics, TWDACO Semiconductor, TWDanfoss Silicon Power, DDanotherm Electric, DKdataTec, DDAU GmbH & Co., ADean Technology, USADenka Chemicals, DDETAKTA Isolier- und Meßtechnik, DDEWESoft, DDEWETRON Deutschland, DDFA Media, GBDiotec Semiconductor, DDODUCO, DDoublecircle Electronics Group, CNDOWA HD Europe, DdSPACE, DDSW Elektronik, DDucati Energia, IDuPont de Nemours (Luxemburg), LDYNETICS, DDynex Semiconductor, GBEA Elektro-AutomatikEBG Elektronische Bauelemente, AEBV ElektronikECOMAL Europe, DECPE European Center for Power Electronics, Ded-k, DEKL, DElectrohms Pvt., INDElectronic Concepts (Europe), IRLELECTRONICON Kondensatoren, DElectrovipryamitel JSC, RUSELEKTRISOLA Dr. Gerd Schildbach, DElektronik-Kontor Messtechnik, DELSCHUKOM Elektroschutzkomponentenbau, DEpiGaN, BESKA Erich SchweizerET System electronic, DETI Elektroelement d.d., SLOExagan, FExxelia Supply, FF & K Delvotec Bondtechnik, DFerroxcube Deutschland, DFilcap, DFinepower, DFirecomms, IRLFischer Elektronik, DFlux, DKFoshan City Shunde District ShengYe Electrical, CNFoshan city Xinyuan Electronic, CNFranz Steger Transformatorenbau, DFraunhofer Institut für Integrierte Systeme und

Bauelementetechnologie IISB, DFraunhofer Institut für Solare Energiesysteme ISE, DFraunhofer-Institut für Zuverlässigkeit und

Mikro integration IZM, DFrizlen, DFTCAP, DFuG Elektronik, DFuji Electric Europe, DFurukawa Electric, JGaN Systems, CDNGaotune Technologies, CNGemballa Electronics, DGeneral Components, TWGES Electronic & Service, DGlobal Power Technologies Group, USAGLYN, D

GrafTech, USAGT elektronik, DGuangdong Fengming Electronic Tech, CNGutre, DGvA Leistungselektronik, DHAHN, DHaining Ferriwo Electronics Co., CNHangzhou Firstack Technology, CNHangzhou Liansheng, CNHangzhou Xenbo Heat transfer Science & Technology, CNHBM, DHE System Electronic, DHefei Shengda Electronics Technology Industry, CNHEIDEN power, DHengdian Group DMEGC Magnetics, CNHenkel, DHeraeus Deutschland, DHERVER-9, EHesse GmbH, DHF Instruments, DHigh Voltage Power Solutions Products

by Dean Technology, USAHimag Planar Magnetics, GBHitachi Europe, GBHitachi Metals Europe, DHöganäs AB, SHollmén & Co, FINHoneywell Europe, BHubei Ruiyuan Electronic Co., CNHuhn-Rohrbacher, DHV Components Associates Products

by Dean Technology, USAHVP High Voltage Products, DHVR International, DHYDRA Components, DHY-LINE Power Components Vertriebs, DI.C.E., IIB-Billmann, DIC Teplocom, RUSICAR – INDUSTRIA CONDENSATORI, IICC Media, DICEL, IILFAIMS-TIGER electronics, DIndium Corporation of Europe, GBInduComp Kft., HInductive Systems Europe, NLIneltron, DInfineon Technologies, DIngenieurbüro Federer, CHinnovatek OS, DInPower Systems, DIntego, DINTEGRATED Engineering Software, CDNINTENSA Technische Dienstleistungen, AInterplex NAS Electronics, DInTiCa Systems, DIsabellenhütte Heusler, DIS-POWER a Division of IS-Line, DITELCOND, IIWATSU TEST INSTRUMENTS, JIXYS Semiconductor, DJ&D Electronics, ROKJentech Precision Industrial, TWJFE Steel, JJGD Semiconductor, CNJianghai Europe Electronic Components, DJohann Lasslop, DJunior Kühlkörper, DKanthal Globar Sandvik Heating Technology, USAKapteos, FKarlsruher Institut für Technologie, DKaschke Components, DKCC, ROKKEMET Electronics, USAKendeil, I

KERAFOL – Keramische Folien, DKeysight Technologies Deutschland, DKLEINER Stanztechnik, DKOA Europe, DKRAH Elektronische BauelementeKYOCERA Fineceramics, DLCP Laser Cut Processing, DLeclanché Capacitors, CHLeicht + Müller Stanztechnik, DLeistungselektronik JENA, DLEM Europe, DLittelfuse Europe, DLS Mtron, ROKMACCON, DMacMic Science & Technology, CNMagDev, GBMagnachip Semiconductor, ROKMagna-Power Electronics, DMagnetec, DMagnetics, USAMalico, TWMan Yue Electronics, HKMareton d.o.o., HRMarini Mario & C., IMB Electronic, DMecc. AL, IMentor Graphics (Deutschland), DMersen France, FMES Manz Electronic Systeme, DMEV Elektronik Service, DMichael Koch, DMicro Commercial Components, USAMicrochip Technology, DMicrometals, USAMicrosemi, USAMinDCet, BMitsubishi Electric Europe, DMJC Elektrotechnik, DMonolith Semiconductor, USAMornsun Guangzhou Science & Technology, CNMS Power, DMUECAP Bauelemente, DMulti Measuring Instruments, JMurata Electronics Europe, NLMyrra Deutschland, DNanjing New Conda Magnetic Industrial, CNNGK Electronics Devices, JNingbo Degson Electrical, CNNORWE, USANORWE;DNucon Energy, RUSNWL Capacitors, USAOMICRON Lab, AON Semiconductor, GBOnline Engineering, DOtto Brenscheidt, DPADA Engineering, IPanasonic Automotive & Industrial Systems Europe, DPARKER OVERSEAS, INDPayton Planar Magnetics, ILPBF Group, NLPeniel Electronics, ROKPETERCEM, FPHOENIX CONTACT Deutschland, DPHOENIX MECANO Power Quality, DPiciesse Elettronica, IPikatron, DPLANSEE SE, APlexim, CHPMK Mess- & Kommunikationstechnik, DPOCO Holding, CNPOMCEG ELECTRONICS, EPower Electronic Measurements, GBPower Integrations, DPOWERSEM, DPOWERSYS, F

PPM - Pforzheimer Präzisions MechanikPrima Electro, IProfiltech Stufenbandprofile, DPromet, CHProNova, DProTek Devices, USAPulse Magnetic & Power Electronics, INDR & D Electronics International, HKR3Tec, DRara Electronics, ROKRECOM Power, ARichardson RFPD Germany, DRISSE electronic, DRM Prüftechnik, DROGERS Germany, DRohde & Schwarz Vertriebs, DROHM Semiconductor, DRSG Electronic Components, DRubadue Wire, USARudolf Pack LitzWire, DRUTRONIK Elektronische Bauelemente, DSamwha Europe, DSanRex Europe Branch, FINSanRex, USASarnikon Metal ve Elektronik San. ve Tic, TRSAS IDEALEC, FSBA-Trafobau Jena, DSBA-TrafoTech, DSBE, USASchmidbauer Transformatoren und Gerätebau, DSCHROEDER + BAUER Werkzeugbau Stanztechnik, DSchukat Electronic, DSchulz Stanz- u. Umformtechnik, DSchulz-Electronic, DSchunk Hoffmann Carbon Technology, ASchunk Sonosystems, Dschwa-medico Transformatorenbau & Industrieprodukte, DSchweizer Electronic, DSCR, FSeifert electronic, DSekels, DSEMIKRON International, DSensitec, DSerigroup, ISERTO, DSET, DSET Power Systems, DShanghai EAGTOP Electronic TechnologyShenzhen Belta Technology, CNShenzhen BYD Microelectronics, CNShenzhen Cectn Technology, CNShenzhen ChuangShiDing Electronic, CNShenzhen Click Technology, CNShenzhen Gaoyu Electronic Technology, CNShenzhen Yamaxi ElectronicsShindengen UK, GBSiba, DSIBO Electronic Vertriebs, DSiebel Elektronik, DSiemens, DSIGNALTEC, DSika Deutschland, DSINUS Electronic, DSIR Resistor, ISIRECTIFIER ELECTRONICS TECHNOLOGY, CNSIRIO ELETTRONICA, ISK Electric Hong Kong, CNSMP, DSMT Maschinen- und Vertriebs, DSontronic, DSpecial-Ind Deutschland, DStandexMeder Electronics, DStarpower Europe, CHStercom Power Solutions, D STMicroelectronics International, CHStrohheker Kunststoffteile und Metallwaren

STS, DSu Zhou OCA Microelectronics, CNSUMIDA Components & Modules, DSumitomo Electric Industries, JSunrise Power Transformers, DSupreme Power Solutions, CNSycomp, DSystem Plus Consulting, FTaiwan Chinsan Electronic Industrial, TWTaiwan Semiconductor Europe, DTamura, JTamura-Europe, GBTCT Tores Composants Technologies, FTDG Holding, CNTDK Europe, DTech Semiconductors, CNTechnagon, DTechnix, FTECNOAL, ITECNOMEC, ITektronix, DTELCON, GBTeledyne LeCroy, Dtesema Leistungselektronik Zweign. der Pikatron, DTH Proton-Electrotex, RUSTHALES MICROELECTRONICS, FThomas Waidner, DTianjin Century Electronics, CNTianyi Electronic Technolog, CNTigris Elektronik, DTOELLNER Electronic Instrumente, DToshiba Electronics Europe, DToshiba Materials, Jtrafomodern Transformatorengesellschaft, ATraftor Technology (Shenzhen) , CNTRAMAG Transformatorenfabrik, DUnisonic Technologies, TWUnited Silicon Carbide, USAUniversity of Nottingham, GBVACUUMSCHMELZE, DVicor Germany, DVinatech, ROKVincotech, DVishay Europe Sales, DVISIC Technologies, ILVogel Business Media, DWAGO KontakttechnikWalther-Präzision, DWARMES, DWayne Kerr Europe, DWebra Industri, SWeEn Semiconductors UK, GBWeidmüller Interface, DWell Ascent Electronic, CNWEVO-Chemie, Dwidap electronic components, DWieland-Werke, D Wijdeven Inductive Solutions, NLWIMA, DWolfspeed, A Cree Company, USAWolverine Tube MicroCool Division, USAWÜRTH ELEKTRONIK eiSos, DWürth Elektronik ICS, DXi’an Miqam Microelectronics Materials, CNXi’an TRUSUNG Advanced Material, CNYangzhou Pairui, CNYangzhou Yangjie Electronic Technology, CNYokogawa Deutschland, DYole Developpement, FZeasset Electronic Technology, CNZES ZIMMER Electronic Systems, DZEZ SILKO, CZZhuzhou CRRC Times Electronic, CNZurich Instruments, CH

As of March 2017/subject to change without notice.

At PCIM Europe 2017, more than 450 exhibitors from 28 nations showcase products and services as well as the most recent innovations in the fields of power electronics, intelligent motion, renewable energy andenergy management.

Siver-Sponsor Media Partner

4544

Room Plan

Karl-Schönleben-Straße Karl-Schönleben-Straße

Otto-Bärnreuther-Straße

Münchener Straß

e

WestEinfahrt . Access

OstEinfahrt . Access

Betriebs-hof

im Bauunderconstruction

Messepark

12

3

4

5

6

789

7A

4A

3A3C

U-Bahn / SubwayMesse

S 11

S 1

S 1/2S 4/5

S 7

S 4

S 2/3/4

S 1Mitte

S 3/4

Operation Center

Service-Center Mitte

Rotunde

ServicePartnerCenter

ParkhausParking

Ost

Süd-Ost 2Parking Conference

VIP Ost 2

VIP Ost 1

Süd-Ost 1

VIP West/ Mitte

Ost

NCCMitte

NCC West Franken-halle

NCCMitte

NCCMitte

NCC Ost

50 100m0

12

11 10

OstEingangEntrance

MitteEingangEntrance

NCC Mitte, Level 0Halle 12Hall 12

Rotunde

Nizza

FoyerBrüssel/

München

Brüssel

Halle 10Hall 10

NCC West

Nizza

FoyerBrüssel/

München

Brüssel

Service-CenterMitte

Hall 9

Hall 1

NCC WestEingangEntrance

Venedig

Frankenhalle

NCC MitteEntrance

NCC Mitte

PosterSession

ConferenceLunch

Service 9Mitte

NCC Mitte, Level 1Halle 12Hall 12

Presse Center West

Madrid

Frankenhalle

Hall 9

Piazza

VIP

München

FoyerBrüssel/

München

Brüssel

Hall 10

NCC West

Rotunde

Mailand

Verona

Lissabon

Basel

Athen

Nizza

1 2

12

Advisory Board/ Speaker‘s Room

Entrances and ServicesPCIM Europe 2017 Conference

Exhibition Centre Nuremberg

ConferenceCounter

SMT Hybrid Packaging 2017

Industry ForumHall 6 Booth 6143

Time Topic Company

Tuesday, 16 May 201710:30 – 11:00 Research activities of the University of Rostock for future

off-shore wind gridsUniversität Rostock

11:00 – 11:30 3.3kV SiC hybrid technology combined with HPnC package Fuji Electric Europe

11:30 – 12:00 Mehrwert-Batteriemanagementsysteme – Gleiche Hardware, mehr Informationen, mehr Sicherheit, mehr Zuverlässigkeit

RWTH Aachen University

12:15 – 13:15 Developing the next generation of power supplies Power Systems Design

13:30 – 14:00 Monolithically integrated GaN circuits Fraunhofer IAF

14:00 – 14:30 Der PLANETENMOTOR – Eine neue, unkonventionelle Kombination von Elektromotor und Planetengetriebe für kompakte elektrische Antriebe

Technische Universität Wien

14:30 – 15:30 Benefits and reliability of SiC devices for industrial andautomotive applications

ROHM Semiconductor

15:30 – 16:30 Presentations of the Conference Award winner 2017

Wednesday, 17 May 201710:00 – 11:30 Status and perspectives in the power semiconductor

(Si, SiC, GaN) businessYole Développement

11:30 – 12:30 Automotive electronics battleground:semiconductor vs. tier-1 business model

Roland Berger

12:30 – 13:30 Next steps in the industrialization of SiC power switches Infineon Technologies

13:30 – 14:30 SIC – design, EMC and measurement A Media, Bodo’s Power Systems

14:30– 15:30 GaN – design, EMC and measurement A Media, Bodo’s Power Systems

15:30– 16:30 Software and hardware solutions for HIL und RCP applications in power electronics

Plexim

Thursday, 18 May 201710:00 – 10:30 Optimized high current IGBT gate driver improves

system efficiency On Semiconductor

10:30 – 11:30 Kühltechnologie: Verlustleistung, eine Leistung die keiner haben will. Was tun?

Rohde & Schwarz

11:30 – 12:30 Einführung in den Students' Day ECPE

12:30 – 13:00 SiC MOSFETs – How can we match the success of SiC diodes?

Monolith Semiconductor

13:30 – 14:00 NPI - A balancing act for engineers--Global Components Sourcing--

Brightek (Europe)

14:00 – 15:00 Boosting battery energy storage systems: three-level power modules using SiC MOSFET

Danfoss Silicon Power

As of March 2017/subject to change without notice

4746

General Information

VenueThe seminars on Sunday, 14 May 2017 and the tutorials on Monday, 15 May 2017 will take place at Arvena Park Hotel, Görlitzer Str. 51, 90473 Nuremberg, phone: +49-911-89220.

The conference from Tuesday, 16 May 2017 until Thursday,18 May 2017 will take place at Conference Center Mitte, NürnbergMesse, Otto-Bärnreuther-Strasse, 90471 Nuremberg.

AccommodationFor hotel booking please contact the hotel directly.PCIM Europe Head Quarter HotelHotel Arvena ParkGörlitzer Str. 51D-90473 NürnbergPhone: +49 911 89 22 [email protected] min. by underground U1 to the conference site.

Registration Counter Opening hoursArvena Park HotelSunday 14 May 2017 from 13.00 until 17.00Monday 15 May 2017 from 8.00 until 14.00

NCC Mitte, NürnbergMesseMonday 15 May 2017 from 16.00 until 18.0016 – 18 May 2017 from 8.00 until 17.00

Questions?Ms. Daniela KäserPhone: +49 711 [email protected]

Travel

There are several non-stop flights to Nuremberg daily. In addition, Nuremberg´s closeness to international airports such as Frankfurt, Munich, Zurich, Amsterdam or Paris ensures optimum connections to the intercontinental flight network. Getting from the airport to the exhibition centre is fast and easy. The airport is close to the city with direct underground and taxi connections to the exhibition centre. The underground takes you in 20 minutes from the airport to the exhibition centre. At Nuremberg Airport, taxis to the exhibition centre are available around the clock. Take the taxi directly to the exhibition centre. Journey time from the airport to the exhibition centre by taxi is approximately 15 minutes and costs about 25 EUR.

You can reach Nuremberg´s main train station ‘Nürnberg Hauptbahnhof’ conveniently from every German city with the following trains: ICE, IC or EC. There are also frequent train connections from major European cities such as Paris, Brussels, Zurich, Vienna, Amsterdam or Prague. From ‘Nürnberg Hauptbahnhof’ the underground U1 or U11 (direction: ‘Langwasser Süd’) will take you directly to the exhibition centre in only 8 minutes. At the main train station in Nuremberg there are several taxis waiting for you. By taxi you reach the exhibition centre within 10 min-utes.

Nuremberg is centrally located in the South of Germany. Its excellent connections to the European motorway and direct feeder roads make it easy and convenient to reach the exhibition centre by car. Destination address for your navigation system: NürnbergMesse, Karl-Schönleben-Str., Messeplatz 1, 90471 Nuremberg

For more travel and hotel information please visit pcim-europe.com

Registration Information

Until 10 April 2017

From 11 April 2017

These are per named delegate as follows:

One Conference Day 650 EUR 750 EUR

Two Conference Days 1,090 EUR 1,190 EUR

Three Conference Days 1,290 EUR 1,390 EUR

Tutorial Full Day 690 EUR 790 EUR

Seminar Half Day 345 EUR 395 EUR

University Staff* 920 EUR 920 EUR

Students 40 % Discount 40 % Discount

Exhibitor special rate** 250 EUR 250 EUR

Registration Fees

* University staff and students may only register for the full conference at a reduced rate and must enclose a copy of their university ID-card. A student discount of 40 % is available upon request. This discount cannot be combined with the University Staff fee. Please contact Ms. Daniela Käser at [email protected] for registration.

** A transferable ticket valid for the three keynote presentations including the conference proceedings is only available to PCIM Europe 2017 exhibitors. A special registration is required.

On-site registration: please add 30 EUR per participant.All fees plus 19% VAT.

Registration andterms and conditionson pcim-europe.com

48

PCIM Worldwide

# pcimeurope

27 – 29 June 2017, Shanghai, Chinapcimasia-expo.com

05 – 07 June 2018, Nuremberg, Germanypcim-europe.com

Organizer

Mesago PCIM GmbHRotebuehlstr. 83 – 8570178 Stuttgart

Phone: +49 711 [email protected] pcim-europe.com

conference program - download.mesago.de€¦ · international exhibition and conference ... as well...

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