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ConnectCore® for i.MX6

Hardware Reference Manual

Revision history—90001394

Revision Date Description

D April 2017 Updated resistor list and pinout table; clarified currentconsumption note; updated power domain tables; add LDOoutput voltages; minor editorial corrections. Rebranded.

E June 2017 Modified regulatory and certification information as requiredby RED (Radio Equipment Directive).

F November 2017 Replaced reflow profile with ten-zone oven profile.

G March 2018 Added power consumption data, made minor edits andclarifications.

H April 2018 Replaced GEN_3V3 with VGEN_3V3.

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ConnectCore® for i.MX6 Hardware Reference Manual 2

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Contents

About the ConnectCore 6Features and functionality 6Block diagram 7Power supply architecture 8Bootstrap 11Wireless interfaces 12

WLAN standard 13Data rates 13Antenna ports 14Modulation 15Security/Interoperability 15Frequency bands 165 GHz HT20 and HT40 channel available 17Receive sensitivity 18Transmit power 18Bluetooth 18

Module variants 18MCA hardware 19

Supported devices 19MCA pinout 20Shared I2C bus 29Shared SPI bus 30

Modules without eMMC flash 31CryptoAuthentication device 31Module pinout 32Signal usage limitations 82

Specifications for the ConnectCore 6Electrical characteristics 85

Voltage supplies 85Power consumption 85

Power consumption use cases 85Global power consumption 86

Mechanical specifications 86Host PCB footprint 88

Environmental specifications 88Linux - Android users 89



Assembly instructionsMoisture sensitivity and shelf life 91Mounting 91

Solder Paste 91Solder paste print 91Stencil 91Coplanarity 92SMT pick and place 92SMT process parameter reference 92Reflow profile 92

Regulatory information and certificationsMaximum power and frequency specifications 95United States FCC 95

For WiFi/Bluetooth variant 95For WiFi only variant 95FCC notices 95FCC-approved antennas 96RF exposure 97

Canada (IC) 98Labeling requirements 98Transmitters with detachable antennas 98

Europe ETSI 99OEM labeling requirements 99CE labeling requirements 99Declarations of Conformity 99Approved antennas 100

Japan 101

About the ConnectCore 6

The ConnectCore 6 is an ultra-compact and highly integrated system-on-module solution based on theNXP i.MX6QP Cortex-A9 processor family.With processor speeds up to 1.2 GHz and fully interchangeable single-/dual-/quad-core variants, theConnectCore 6 offers a truly future-proof platform solution with scalable performance and pre-certified wireless 802.11a/b/g/n and Bluetooth 4.0, including Bluetooth Low Energy connectivity.Its innovative and scalable design maximizes integration flexibility and significantly reduces designrisk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal thermalmanagement even in the most demanding quad-core system configurations.Seamless Cloud Connector integration as part of the Digi Linux and Android software platform supportoffers secure remote management and web services capabilities through the scalable Digi RemoteManager.In addition, Digi offers custom Remote Manager hardware and wireless design services as well as end-to-end solutions services for cloud integration and app development.

Features and functionality 6Block diagram 7Power supply architecture 8Bootstrap 11Wireless interfaces 12Module variants 18MCA hardware 19Modules without eMMC flash 31CryptoAuthentication device 31Module pinout 32Signal usage limitations 82


About the ConnectCore 6 Features and functionality


Note To serve our customers most effectively, Digi International Inc. has consolidated our cloudservices, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phasedprocess does not affect device functionality or the functionality of the web services and otherfeatures. However, you will find instances of both Device Cloud and Digi Remote Manager in somedocumentation, firmware, and user interfaces.

Features and functionalityThe ConnectCore 6 module is based on the i.MX6QP processor from NXP. This processor offers a highnumber of interfaces. Most of these interfaces are multiplexed and are not available simultaneously.The module has the following features:

n i.MX6QP single/dual/quad ARM Cortex-A9 cores operating at speeds up to 1.2 GHzl 32 Kbytes L1 Instruction cache

l 32 Kbytes L1 Data cache

l Up to 1 MB unified Instruction/Data L2 cache

l NEON MPE (Media Processing Engine) co-processor

n Graphical hardware accelerators:l IPU (Image Processing Unit)

l Optional VPU (Video Processing Unit)

l Optional 2D/3D GPU (Graphics Processing Unit)

n 64-bit DDR3-1066 memory interface with a density up to 2 GBytes

n 8-bit eMMC support

n Dialog DA9063 power management IC (PMIC)l 6x DC/DC buck converters

l 11x LDO regulators

l RTC with rechargeable coin cell battery support

l 10-bit ADC channels

l GPIO pins

n Optional IEEE802.11a/b/g/n WLAN interface with spatial diversity supportl SoftAP (Software Access Point) support

n Optional Bluetooth 4.0 dual mode

n Optional Cortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

n Debug interfaces:l Standard JTAG controller IEEE 1149.1

l ETM/ETB support

About the ConnectCore 6 Block diagram


n Support of i.MX6QP typical interfaces:l 16/32-bit data/address bus

l SATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)

l Display supporto HDMI

o 24-bit parallel bus

o Dual LVDS

o MIPI/DSI

l 2x camera (20-bit parallel bus, MIPI/CSI)

l MMC/SD/SDIO

l 1x USB OTG with integrated PHY

l 3x USB Host

l PCI Express Gen 2.0 lane

l 10/100/1000 M Ethernet MAC

l UART, SPI, I2C, PWM, CAN, I2S and GPIO

n Ultra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads

n Security accelerators:l ARM TrustZone

l CAAM (cryptographic acceleration and assurance module)

l SNVS (secure non-volatile storage)

l CSU (central security unit)

l A-HABv4 (advanced high-assurance boot)

Block diagramThe figure below shows the block diagram of the NXP i.MX6QP application processor.Not all functions are available on all processor variants.

About the ConnectCore 6 Power supply architecture


Power supply architectureThe ConnectCore 6 provides a primary 5 V power supply input. This supply is the main power domainto the on-module Dialog DA9063 power management IC (PMIC), which generates all required supplyvoltages for the module components as well as the carrier board.



The module provides support for a backup battery (coin-cell or super cap) powering the real-timeclock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are alsosupported.The PMIC generates the following power domains that are available on the module pads:

n 3.3 V (VGEN_3V3)

n Moreover, 5x PMIC LDO outputs are also available on the module pads:l VLDO3

l VLDO4

l VLDO6

l VLDO7

l VLDO8

Powerdomain

Regulatortype

Outputaccuracy

Maximumcurrent

Dropoutvoltage(MAX)

Turn ontime(MAX)

Turnofftime(MAX)

Quiescentcurrent inOFF mode(TYP)

3.3 V DC/DC +/-3% 1500 mA - 1 µA 1.2 ms -

Note The maximum current consumption mentioned in the previous table is a combination of thecurrent consumed by the module (max 500mA) and by the carrier board for external use (1000mA).

The table below provides the characteristics of the optional LDO outputs:

Primary5Vpowersupplyinput

Inputvoltage

Outputvoltage

Outputaccuracy

Defaultvoltage

Maximumcurrent

Dropoutputvoltage(MAX)

Quiescentcurrent inOFF mode(TYP)

Turnontime(MAX)

Turnofftime(MAX)

VLDO2 +5VDC 0.6-1.86V

+/-3% 1.8 V 200 mA 150 mV 1 µA 150µs

1 ms

VLDO3 +5VDC 0.9-3.44V

+/-3% 3.3 V 200 mA 150 mV 1 µA 300µs

1 ms

VLDO4 +5VDC 0.9-3.44V

+/-3% 3.3 V 200 mA 150 mV 1 µA 300µs

1 ms

VLDO6 +5VDC 0.9-3.6V

+/-3% 3.3 V 200 mA 150 mV 1 µA 200µs

1 ms

VLDO8 +5VDC 0.9-3.6V

+/-3% 3.3 V 200 mA 150 mV 1 µA 300µs

1 ms

Note For information about using the LDO options, please contact Digi.VLDO3 is used for supplying MCA processor on the module.



The power management IC located on the module is responsible for generating all required i.MX6QPprocessor supply voltages. The following i.MX6QPx supplies are available on the module pads:Some of the I/O supplies are set on the module. See the following table:

Power domain Connection

NVCC_GPIO VGEN_3V3

NVCC_JTAG VGEN_3V3

NVCC_NANDF VGEN_3V3

NVCC_SD1 VGEN_3V3

NVCC_SD2 VGEN_3V3

NVCC_SD3 VGEN_3V3

PCIE_VPH 2.5V (VDDHIGH_CAP_2V5)

The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 module.See the following table for operating ranges of the remaining I/O supplies.

Power domain Min Type Max

NVCC_ENET 1.65 V 1.8 V 3.6 V

NVCC_EIM 1.65 V 2.8 V 3.6 V

NVCC_LCD 1.65 V 3.3 V 3.6 V

NVCC_CSI 1.65 V - 3.6 V

NVCC_RGMII in HSIC 1.2 V mode 1.15 V - 1.30 V

NVCC_RGMII in RGMII 1.5 V mode 1.43 V - 1.58 V



As shown in the table above, the supplies have a wide operating range. In order to provide the mostcost-effective and flexible solution for a given use-case, the supplies listed in the table need to beprovided by the carrier board integrating the ConnectCore 6 module. However, PMIC power domains3.3 V—and LDO3/4/6/7/8 options—are dedicated power sources for supplying i.MX6QP powerdomains.The MCU - assist specific power domain (LDO3_MCA) available on the ConnectCore 6 LGA pads is apower supply output powering the on-module Kinetis processor.

About the ConnectCore 6 Bootstrap


The following diagram outlines the power supply approach of the ConnectCore 6. Inputs are markedred, blue marks are outputs.

BootstrapThe ConnectCore 6 is configured by default to boot in “Internal boot” mode. See the following table:

About the ConnectCore 6 Wireless interfaces


BOOT_MODE [1:0] Boot type

00 Boot from fuses

01 Serial downloader

10 Internal boot (default)

11 Reserved

Note 10K pull-up populated on BOOT_MODE110K pull-down populated on BOOT_MODE0

By default, the boot media configured on the ConnectCore 6 module is the on-module eMMC. This isachieved by having the following resistors populated on the module:

n 10K pull-down on EIM_DA4 (BOOT_CFG1[4])

n 10K pull-up on EIM_DA5 (BOOT_CFG1[5])


n 10K pull-down on EIM_DA7 (BOOT_CFG1[7]



When selecting “Internal Boot”, bootstrap pins shall be protected to insure a proper boot process.“Internal Boot” has the benefit that multiple boot media can be supported. For mass production, Digirecommends to use “Boot from fuses” for more security.For booting from the on-module eMMC, following resistors must be populated on the carrier board:

ConnectCore 6 signal (pad) Boot configuration Resistor Comment

EIM_DA13 (V20) BOOT_CFG2[5] 1K pull-up toNVCC_EIM

Selecting 4-bit buswidth

EIM_DA14 (W21) BOOT_CFG2[6] 1K pull-down Selecting 4-bit buswidth

CAUTION! Make sure that EIM_EB3 (pad AA18) is not pulled high during boot. Pulling thissignal high enables an infinite loop at start of boot ROM. This feature is exclusively usedfor debugging purposes.

Wireless interfacesThe ConnectCore 6 system-on-module combines a wireless local area network (WLAN) and Bluetoothdual solution to support IEEE802.11 a/b/g/n/ac WLAN standards and Bluetooth 4.2, enabling seamlessintegration of WLAN/Bluetooth and Low Energy technology.Digi also offers a non-wireless variant of i.MX6QP module.The following sections include specifications for the wireless interfaces available on the i.MX6QPmodule.



WLAN standardn IEEE 802.11a/b/g/n standards

n HT20, and HT40 IEEE 802.11n

Data ratesn 802.11b: 1, 2, 5.5, 11 Mbps

n 802.11a/g: 6, 9, 12, 18, 24, 35, 48, 54 Mbps

n 802.11n HT20 FGI: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps

n 802.11n HT20 HGI: 7.2, 14.4, 21.7, 29.9, 43.3, 57.8, 65, 72.2 Mbps

n 802.11n HT40 FGI (5GHz only): 13.5, 27, 40.5, 54, 81, 108, 121.5, 135 Mbps

n 802.11n HT40 HGI (5GHz only): 15, 30, 45, 60, 90, 120, 135, 150 Mbps



Antenna portsConnectCore 6 module variants supporting both Bluetooth andWLAN are populated with one singleantenna port covering both 2.4 and 5 GHz frequencies.Module variants supporting only WLAN provide additionally antenna diversity feature. Two antennaports supporting the same transmit and receive signals are populated on the product. The softwarerunning on the ConnectCore 6 SOM switches from one antenna port to the other depending on theRSSI (Receive Signal Strength Indication) of the received beacon, which guarantees that the antennawith the best signal is always used and thus improve the quality and reliability of the wireless link. Theinterval between comparisons of RSSI values on the two antennas is by default 10 seconds, but can beconfigured in software. Furthermore, when the RSSI measured is too low, the software willautomatically switch to the other antenna regardless of the 10 second interval. Hence, antennadiversity is an option and it is absolutely safe to mount only one antenna in the system, connected forinstance to the primary antenna port.The picture below shows the location of the primary and secondary antennas.

Note Modules with Bluetooth capabilities will not support spatial diversity.



Modulation

ModeDatarate Modulation Mode

Datarate Modulation Mode

Datarate Modulation

802.11b 1 DBPSK 802.11g 6 BPSK 802.11a 6 BPSK

2 DQPSK 9 BPSK 9 BPSK

5.5 CCK 12 QPSK 12 QPSK

11 CCK 18 QPSK 18 QSPK

24 16-QAM 24 16-QAM

35 16-QAM 35 16-QAM

48 64-QAM 48 64-QAM

54 64-QAM 54 64-QAM

Mode MCS Modulation Data rate

802.11n HT20 (2.4 GHz and 5 GHz) HT40 (5 GHz only)

FGI HGI FGI HGI

MCS0 BPSK 6.5 7.2 13.5 15

MCS1 QPSK 13 14.4 27 30

MCS2 QPSK 19.5 21.7 40.5 45

MCS3 16-QAM 26 29.9 54 60

MCS4 16-QAM 39 43.3 81 90

MCS5 64-QAM 52 57.8 108 120

MCS6 64-QAM 58.5 65 121.5 135

MCS7 64-QAM 65 72.2 135 150

Security/Interoperabilityn WPA-PSK

n WPA-Enterprise

n WPA2-Personal

n WPA2-Enterprise

n Wi-Fi Direct

n Soft AP



n WAPI (optional, China)

n Cisco CCXv4 ASD certification ready (optional)

n Wi-Fi Alliance Logo certification ready

The listed capabilities are dependent on software platform in use. Refer to the correspondingsoftware platform documentation for additional information.Contact Digi if your end product requires a Wi-Fi Alliance Logo and/or Cisco CCX certification.

Frequency bands

US, Canadan 2.412 to 2.462 GHz; 11 channels

n 5.180 to 5.320 GHz; 8 channels

n 5.500 to 5.700 GHz, 8 channels (excludes 5.600 to 5.650 GHz)


Europen 2.412 to 2.472 GHz; 13 channels


n 5.500 to 5.700 GHz, 8 channels (excludes 5.600 to 5.640 GHz)

Australia, New Zealandn 2.412 to 2.462 GHz; 11 channels



Japann 2.412 to 2.472 GHz; 13 channels



Ad-hoc mode channelsn 2.4 GHz Band - Channels 10 and 11

n 5 GHz Band US, Australia, New Zealand - Channels 36, 40, 44, 45, 149, 157, 161, and 165Channels 36, 40, 44, and 45 are for indoor use only

n 5 GHz Band Europe and Japan - per 802.11d



5 GHz HT20 and HT40 channel available

Channel number Frequency (MHz) Mode Secondary channel allowed

36 5180 HT40 PLUS

38 5190 HT20

40 5200 HT40 MINUS

44 5220 HT40 PLUS

46 5230 HT20

48 5240 HT40 MINUS

52 5260 HT40 PLUS

54 5270 HT20

56 5280 HT40 MINUS

60 5300 HT40 PLUS

62 5310 HT20

64 5320 HT40 MINUS

100 5500 HT40 PLUS

102 5510 HT20

104 5520 HT40 MINUS

108 5540 HT40 PLUS

110 5550 HT20

112 5560 HT40 MINUS

116 5580 HT40 PLUS

118 5590 HT20

120 5600 HT40 MINUS

124 5620 HT40 PLUS

126 5630 HT20

128 5640 HT40 MINUS

132 5660 HT40 PLUS

134 5670 HT20

136 5680 HT40 MINUS

140 5700 HT20

About the ConnectCore 6 Module variants


Channel number Frequency (MHz) Mode Secondary channel allowed

159 5745 HT40 PLUS

151 5755 HT20

153 5765 HT40 MINUS

157 5785 HT40 PLUS

159 5795 HT20

161 5805 HT40 MINUS

165 5825 HT20

Receive sensitivity

Network type Sensitivity

802.11b -88 dBm

802.11g -88 dBm

802.11n (2.4 GHz) -89 dBm

802.11a -90 dBm

802.11n (5 GHz, HT20) -90 dBm

802.11n (5 GHz, HT40) -86 dBm

Transmit power

Network type Transmit power

802.11b 10.5 dBm

802.11g/n 11 dBm

802.11a/n 13 dBm

Bluetoothn Bluetooth 4.0

n Bluetooth 3.0 + HS (BT3.0 + HS)

n Class 1.5 Bluetooth with integrated TX/RX switch

Module variantsThe ConnectCore 6 module supports population options such as network interface (Wi-Fi), memory(flash, RAM), MCU-assist, processor (single, dual and quad-cores), and others.

About the ConnectCore 6 MCA hardware


MCA hardware

Supported devicesThe ConnectCore 6 module is designed to support a Kinetis processor in a QFN48 package. See belowfor a list of compatible Kinetis processors that can be used in this package size:

n MKL14Z32VFT4

n MKL14Z64VFT4

n MKL15Z128VFT4

n MKL15Z32VFT4

n MKL15Z64VFT4

n MKL24Z32VFT4

n MKL24Z64VFT4

n MKL25Z128VFT4

n MKL25Z32VFT4

n MKL25Z64VFT4

n MKL26Z128VFT4

n MKL26Z64VFT4

n MKL26Z32VFT4

n K10P48M50SF0

n K20P48M50SF0

By default, NXP MKL14Z32VFT4 is populated on the module variants supporting the MCA unit.



MCA pinoutThe table below contains the pinouts for the MCA unit on ConnectCore 6 module. The pinoutinformation assumes the use of NXP MKL14Z32VFT4 microcontroller. Using a different Kinetismicrocontroller may change the functions available on the MCA pins.

MCA ConnectCore 6

PinNr

Signalname

PadNr Signal name Usage on module

1 VDD - LDO3_MCA MCA power supply1x 100nF + 1x1µF capacitors connected to GND areplaced close to this pin on ConnectCore 6 SOM.

2 VSS - GND MCA ground

3 ADC0_SE1PTE16SPI0_PCS0UART2_TXTPM_CLKIN0---

N20 MCA_IO/USB0_P

Not used onmodule.For KL24, KL25 and K20 processors, this pin is USB0_DP.MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20)have been routed as differential pair for supportingUSB functionality on KL24, KL25 and K20 processors.

4 ADC0_SE5aPTE17SPI0_SCKUART2_RXTPM_CLKIN1-LPTMR0_ALT3-

P20 MCA_IO/USB0_N

Not used onmodule.For KL24, KL25 and K20 processors, this pin is USB0_DN.MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20)have been routed as differential pair for supportingUSB functionality on KL24, KL25 and K20 processors.

5 ADC0_SE2PTE18SPI0_MOSI-I2C0_SDASPI0_MISO--

Y22 MCA_IO27 Not used onmodule.For KL24 and K20 processors, this pin is VOUT33.ConnectCore 6 SOM has a 0R resistor foreseen on thispin for connecting this signal to LDO3_MCA. By default,the resistor is not populated and MCA_IO27 isavailable on module pad.



MCA ConnectCore 6

PinNr

Signalname


6 ADC0_SE6aPTE19SPI0_MISO-I2C0_SCLSPI0_MOSI--

P21 MCA_IO14 Not used onmodule.

7 ADC0_SE0PTE20-TPM1_CH0UART0_TX---

T23 MCA_IO0 Not used onmodule.

8 ADC0_SE4aPTE21-TPM1_CH1UART0_RX---


9 VDDA - LDO3_MCA MCA power supplyA 100 nF capacitor connected to GND is placed close tothis pin on ConnectCore 6 SOM.

10 VREFH AC10 MCA_VREFH Not used onmodule.A 100 nF capacitor connected to GND is placed close tothis pin on ConnectCore 6 SOM.

11 VREFL - GND MCA ground

12 VSSA - GND MCA ground

13 CMP0_IN5/ADC0_SE4bPTE29-TPM0_CH2TPM_CLKIN0---

Y23 MCA_IO23 Not used onmodule.



MCA ConnectCore 6

PinNr

Signalname


14 ADC0_SE23/CMP0_IN4PTE30-TPM0_CH3TPM_CLKIN1---

- - This MCA pin is connected to the gate of an N-channelMOSFET. A 10K pull-down resistor is connected to GNDon this signal too. The drain of the MOSFET isconnected to ConnectCore 6 signal ON/OFF (pad D18).The source of the MOSFET is connected to GND.This signal is reserved on the module and allows MCAto control ON/OFF signal over software.

15 -PTE24-TPM0_CH0-I2C0_SCL--

- KINETIS_32K This MCA pin is connected to 32K output of the PMIC.It’s the clock input of the MCA processor.

16 -PTE25-TPM0_CH1-I2C0_SDA--

AC21 MCA_IO28 Not used onmodule.For K10 and K20 processors, this pin is VBAT.ConnectCore 6 SOM has a 0R resistor foreseen on thispin for connecting this signal to LDO3_MCA. By default,the resistor is not populated and MCA_IO28 isavailable on module pad.1x 100 nF + 1x1 µF capacitors connected to GND areplaced close to this pin on ConnectCore 6 SOM.

17 -PTA0-TPM0_CH5---SWD_CLK

L23 MCA_SWD_CLK Not used onmodule.

18 -PTA1UART0_RXTPM2_CH0----

AA22 MCA_IO25 Not used onmodule.



MCA ConnectCore 6

PinNr

Signalname


19 -PTA2UART0_TXTPM2_CH1----

AA23 MCA_IO6/PMIC_GP_FB2

Connected on ConnectCore 6 SOM to PMIC signal GP_FB2.

20 -PTA3I2C1_SCLTPM0_CH0---SWD_DIO

M23 MCA_SWD_DIO Not used onmodule.

21 -PTA4I2C1_SDATPM0_CH1---NMI_b


22 VDD - LDO3_MCA MCA power supply1x 100 nF + 1x1 µF capacitors connected to GND areplaced close to this pin on ConnectCore 6 SOM.

23 VSS - GND MCA ground

24 EXTAL0PTA18-UART1_RXTPM_CLKIN0---

- PMIC_STBY_REQ

Connected on ConnectCore 6 SOM to i.MX6QPprocessor signal PMIC_STBY_REQ (ball F11) and PMICsignal SYS_EN/GPIO8 (ball B9).



MCA ConnectCore 6

PinNr

Signalname


25 XTAL0PTA19-UART1_TXTPM_CLKIN1-LPTMR0_ALT1-


26 RESET_bPTA20

N23 #MCA_RESET Not used onmodule.

27 ADC0_SE8PTB0/LLWU_P5I2C0_SCLTPM1_CH0----

R23 MCA_IO2 Not used onmodule.

28 ADC0_SE9PTB1I2C0_SDATPM1_CH1----

H21 NANDF_CS1/#MCA_INT

Connected to i.MX6QP processor signal NANDF_CS1(ball C16).

29 ADC0_SE12PTB2I2C0_SCLTPM2_CH0----

- INTERNAL_I2C_SCL

Connected directly to PMIC I2C_SCL signal and toi.MX6QP processor I2C2_SCL/KEY_COL3 signal (ballU5) over N-channel MOSFET.

30 ADC0_SE13PTB3I2C0_SDATPM2_CH1----

- INTERNAL_I2C_SDA

Connected directly to PMIC I2C_SDA signal and toi.MX6QP processor I2C2_SDA/KEY_ROW3 signal (ballT7) over N-channel MOSFET.



MCA ConnectCore 6

PinNr

Signalname


31 -PTB16SPI1_MOSIUART0_RXTPM_CLKIN0SPI1_MISO--

N22 MCA_IO7 Not used onmodule.

32 -PTB17SPI1_MISOUART0_TXTPM_CLKIN1SPI1_MOSI--


33 ADC0_SE14PTC0-EXTRG_IN-CMP0_OUT--

U24 MCA_IO4 Not used onmodule.

34 ADC0_SE15PTC1/LLWU_P6/RTC_CLKINI2C1_SCL-TPM0_CH0---

- KINETIS_32K This MCA pin is connected to 32K output of the PMIC.For KL14, KL15, KL24 and KL25 this pin can beconfigured as RTC_CLKIN signal.

35 ADC0_SE11PTC2I2C1_SDA-TPM0_CH1---




MCA ConnectCore 6

PinNr

Signalname


36 -PTC3/LLWU_P7-UART1_RXTPM0_CH2CLKOUT--


37 -PTC4/LLWU_P8SPI0_PCS0UART1_TXTPM0_CH3---

U22 MCA_IO11 Not used onmodule.

38 -PTC5/LLWU_P9SPI0_SCKLPTMR0_ALT2--CMP0_OUT-

M21 MCA_IO12 Not used onmodule.

39 CMP0_IN0PTC6/LLWU_P10SPI0_MOSIEXTRG_IN-SPI0_MISO--

N21 MCA_IO13 Not used onmodule.

40 CMP0_IN1PTC7SPI0_MISO--SPI0_MOSI--




MCA ConnectCore 6

PinNr

Signalname


41 -PTD0SPI0_PCS0-TPM0_CH0---

A6 CSI0_DAT11/ECSPI2_SS0

Connected to i.MX6QP processor signal CSI0_DAT11(ball M3) and to LGA pad A6.This pin can be configured as a SPI chip select sharedbetween MCA and i.MX6QP processor.

42 ADC0_SE5bPTD1SPI0_SCK-TPM0_CH1---

D6 CSI0_DAT8/ECSPI2_SCLK

Connected to i.MX6QP processor signal CSI0_DAT8(ball N6) and to LGA pad D6.This pin can be configured as a SPI clock sharedbetween MCA and i.MX6QP processor.

43 -PTD2SPI0_MOSIUART2_RXTPM0_CH2SPI0_MISO--

K5 CSI0_DAT10/ECSPI2_MISO

Connected to i.MX6QP processor signal CSI0_DAT10(ball M1) and to LGA pad K5.This pin can be configured as a SPI MISO sharedbetween MCA and i.MX6QP processor.

44 -PTD3SPI0_MISOUART2_TXTPM0_CH3SPI0_MOSI--

D5 CSI0_DAT9/ECSPI2_MOSI

Connected to i.MX6QP processor signal CSI0_DAT9(ball N5) and to LGA pad D5.This pin can be configured as a SPI MOSI sharedbetween MCA and i.MX6QP processor.

45 -PTD4/LLWU_P14SPI1_PCS0UART2_RXTPM0_CH4---




MCA ConnectCore 6

PinNr

Signalname


46 ADC0_SE6bPTD5SPI1_SCKUART2_TXTPM0_CH5---


47 ADC0_SE7bPTD6/LLWU_P15SPI1_MOSIUART0_RX-SPI1_MISO--


48 -PTD7SPI1_MISOUART0_TX-SPI1_MOSI--


The i.MX6QP pads listed above are connected to ConnectCore 6 pads. If the MCAmicrocontrollerfirmware doesn’t use these signals, they are available on the carrier board and can be used in any ofthe alternative functions listed above.



Shared I2C busThe screenshot below shows how the I2C bus (I2C2) is used on ConnectCore 6 module. The bus isshared between i.MX6QP processor and the PMIC/MCAmicrocontroller. The usage of N-channelMOSFET ensures the bus is fully isolated and allows the i.MX6QP processor to be shut off while MCAand PMIC are powered.The 0R resistors (R88 and R99) are populated onmodules without MCA processor.



Shared SPI busIn addition to an I2C interface, i.MX6QP shares an SPI bus with the MCAmicrocontroller. The tablebelow shows this connection:

SPI function i.MX6QP pad MCA I/O

SPI Chip Select CSI0_DAT11 (ConnectCore 6 LGA pad A6):Alt0: IPU1_CSI0_DATA11Alt1: AUD3_RXFSAlt2: ECSPI2_SS0Alt3: UART1_RX_DATAAlt4: -Alt5: GPIO6_IO03Alt6: -Alt7: ARM_TRACE14

PTD0 (MCA pin 41):|Alt0: -Alt1: PTD0Alt2: SPI0_PCS0Alt3: -Alt4: -Alt5: TPM0_CH0Alt6: -Alt7: -

SPI Clock CSI0_DAT8 (ConnectCore 6 LGA pad D6):Alt0: IPU1_CSI0_DATA08Alt1: EIM_DATA06Alt2: ECSPI2_SCLKAlt3: KEY_COL7Alt4: I2C1_SDAAlt5: GPIO5_IO26Alt6: -Alt7: ARM_TRACE05

PTD1 (MCA pin 42):Alt0: ADC0_SE5bAlt1: PTD1Alt2: SPI0_SCKAlt3: -Alt4: TPM0_CH1Alt5: -Alt6: -Alt7: -

SPI MISO CSI0_DAT10 (ConnectCore 6 LGA pad K5):Alt0: IPU1_CSI0_DATA10Alt1: AUD3_RXCAlt2: ECSPI2_MISOAlt3: UART1_TX_DATAAlt4: -Alt5: GPIO5_IO28Alt6: -Alt7: ARM_TRACE07

PTD2 (MCA pin 43):Alt0: -Alt1: PTD2Alt2: SPI0_MOSIAlt3: UART2_RXAlt4: TPM0_CH2Alt5: SPI0_MISOAlt6: -Alt7: -

SPI MOSI CSI0_DAT9 (ConnectCore 6 LGA pad D5):Alt0: IPU1_CSI0_DATA09Alt1: EIM_DATA07Alt2: ECSPI2_MOSIAlt3: KEY_ROW7Alt4: I2C1_SCLAlt5: GPIO5_IO27Alt6: -Alt7: ARM_TRACE06

PTD3 (MCA pin 44):Alt0: -Alt1: PTD3Alt2: SPI0_MISOAlt3: UART2_TXAlt4: TPM0_CH3Alt5: SPI0_MOSIAlt6: -Alt7: -

About the ConnectCore 6 Modules without eMMC flash


Modules without eMMC flashSome variants of the ConnectCore 6 module can be ordered without an eMMC flash populated. Forthese modules, the bootloader and the operating system must be programmed using external bootmedia. Digi recommends booting from the i.MX6QP uSDHC-2 port, which corresponds to theConnectCore 6 Single-Board Computer microSD port.For booting from the i.MX6QP uSDHC-2 port, following resistors must be populated:

ConnectCore 6 signal(pad)

Bootconfiguration Resistor Comment

EIM_DA5 (AA19) BOOT_CFG1[5] 1K pull-down Selecting SD/eSD/SDXC

EIM_DA12 (V22) BOOT_CFG2[4] 1K pull-down Selecting uSDHC-2

EIM_DA13 (V20) BOOT_CFG2[5] 1K pull-up to NVCC_EIM

Selecting 4-bit buswidth

CryptoAuthentication deviceThe ConnectCore 6 includes an Atmel CryptoAuthentication Device. This is a highly securecryptographic co-processor with secure hardware-based key storage. It includes the followingfeatures:

n Performs high-speed public key (PKI) algorithms (ECDSA and ECDH).

n NIST standard P256 elliptic curve support.

n SHA-256 hash algorithm with HMAC option.

n 256-bit key length.

n Storage for up to 16 keys.

n Two high-endurance monotonic counters.

n Guaranteed unique 72-bit serial number.

n Internal High-quality FIPS Random Number Generator (RNG).

n 10 Kb EEPROM memory.

See the software documentation for information about supported cryptoauthentication features.

http://www.digi.com/resources/documentation/digidocs/90001547/#landing_pages/trustfence_index_yocto.htm

About the ConnectCore 6 Module pinout


Module pinoutThe module has a LGA pad structure based on 400 pads. See the following diagram for the generallayout, which shows the top view of the module pinouts.

The following table provides the pinout of the ConnectCore 6 module.Additional timing and electrical information can be found in either NXP i.MX6QP processor datasheet(www.nxp.com) or in Dialog DA9063 product datasheet (www.dialog-semiconductor.com).

LGApad Pad name Multiplexing Power group Comments

A5 CSI0_MCLK ALT0: IPU1_CSI0_HSYNCALT1:ALT2:ALT3: CCM_CLKO1ALT4:ALT5: GPIO5_IO19ALT6:ALT7: ARM_TRACE_CTL

NVCC_CSI

http://www.nxp.com/

http://www.dialog-semiconductor.com/




A6 CSI0_DAT11 ALT0: IPU1_CSI0_DATA11ALT1: AUD3_RXFSALT2: ECSPI2_SS0ALT3: UART1_RX_DATAALT4:ALT5: GPIO5_IO29ALT6:ALT7: ARM_TRACE08

NVCC_CSI Connected to theon-module MCAmicrocontroller.

A7 CSI0_DAT17 ALT0: IPU1_CSI0_DATA17ALT1: EIM_DATA13ALT2:ALT3: UART4_CTS_BALT4:ALT5: GPIO6_IO03ALT6:ALT7: ARM_TRACE14

NVCC_CSI

A8 GND -

A9 HDMI_D0_N HDMI_VPH

A10 GND -

A11 CSI_CLK0_P NVCC_MIPI

A12 GND -

A13 CSI_D1_N NVCC_MIPI

A14 PCIE_RX_N PCIE_VPH

A15 PCIE_TX_N PCIE_VPH

A16 CLK2_P VDD_HIGH_CAP

A17 GND -

A18 CLK1_P VDD_HIGH_CAP

A19 MLB_DP VDD_HIGH_CAP

A20 MLB_DN VDD_HIGH_CAP

B4 LVDS0_TX2_P NVCC_LVDS_2P5

B5 GND -

B6 CSI0_DAT14 ALT0: IPU1_CSI0_DATA14ALT1: EIM_DATA10ALT2:ALT3: UART5_TX_DATAALT4:ALT5: GPIO6_IO00ALT6:ALT7: ARM_TRACE11

NVCC_CSI




B7 CSI0_DAT4 ALT0: IPU1_CSI0_DATA04ALT1: EIM_DATA02ALT2: ECSPI1_SCLKALT3: KEY_COL5ALT4: AUD3_TXCALT5: GPIO5_IO22ALT6:ALT7: ARM_TRACE01

NVCC_CSI

B8 HDMI_D1_N HDMI_VPH

B9 HDMI_D0_P HDMI_VPH

B10 DSI_D0_P NVCC_MIPI

B11 CSI_CLK0_N NVCC_MIPI

B12 CSI_D2_N NVCC_MIPI

B13 CSI_D1_P NVCC_MIPI

B14 PCIE_RX_P PCIE_VPH

B15 PCIE_TX_P PCIE_VPH

B16 CLK2_N VDD_HIGH_CAP

B17 GND -

B18 CLK1_N VDD_HIGH_CAP

B19 GND -

B20 GND -

B21 SD3_CLK/BT_UART_RTS

ALT0: SD3_CLKALT1: UART2_RTS_BALT2: FLEXCAN1_RXALT3:ALT4:ALT5: GPIO7_IO03ALT6:ALT7:

NVCC_SD3(VGEN_3V3)

The signal is onlyavailableexternally onmodules that donot haveBluetoothpopulated.

C3 KEY_COL3 ALT0: ECSPI1_SS3ALT1: ENET_CRSALT2: HDMI_TX_DDC_SCLALT3: KEY_COL3ALT4: I2C2_SCLALT5: GPIO4_IO12ALT6: SPDIF_INALT7:

NVCC_GPIO(VGEN_3V3)

Connected to MCAprocessor andPMIC. Notrecommended asmain I2C port.4,7K pull-up onmodule.

C4 LVDS0_TX2_N NVCC_LVDS_2P5




C5 CSI0_DAT6 ALT0: IPU1_CSI0_DATA06ALT1: EIM_DATA04ALT2: ECSPI1_MISOALT3: KEY_COL6ALT4: AUD3_TXFSALT5: GPIO5_IO24ALT6:ALT7: ARM_TRACE03

NVCC_CSI

C6 CSI0_DAT13 ALT0: IPU1_CSI0_DATA13ALT1: EIM_DATA09ALT2:ALT3: UART4_RX_DATAALT4:ALT5: GPIO5_IO31ALT6:ALT7: ARM_TRACE10

NVCC_CSI

C7 CSI0_DAT5 ALT0: IPU1_CSI0_DATA05ALT1: EIM_DATA03ALT2: ECSPI1_MOSIALT3: KEY_ROW5ALT4: AUD3_TXDALT5: GPIO5_IO23ALT6:ALT7: ARM_TRACE02

NVCC_CSI

C8 HDMI_D1_P HDMI_VPH

C9 GND -

C10 DSI_D0_N NVCC_MIPI

C11 GND -

C12 CSI_D2_P NVCC_MIPI

C13 GND -

C14 GND -

C15 GND -

C16 USB_H1_DN VDD_USB_CAP

C17 TAMPER VDD_SNVS_IN

C18 Reserved -

C19 MLB_SP VDD_HIGH_CAP

C20 MLB_SN VDD_HIGH_CAP




C21 SD3_DAT7 ALT0: SD3_DATA7ALT1: UART1_TX_DATAALT2:ALT3:ALT4:ALT5: GPIO6_IO17ALT6:ALT7:

NVCC_SD3(VGEN_3V3)

C22 SD3_DAT4/BT_UART_RXD

ALT0: SD3_DATA4ALT1: UART2_RX_DATAALT2:ALT3:ALT4:ALT5: GPIO7_IO01ALT6:ALT7:

NVCC_SD3(VGEN_3V3)


D2 KEY_ROW4 ALT0: FLEXCAN2_RXALT1: IPU1_SISG5ALT2: USB_OTG_PWRALT3: KEY_ROW4ALT4: UART5_CTS_BALT5: GPIO4_IO15ALT6:ALT7:

NVCC_GPIO(VGEN_3V3)

D3 KEY_ROW1 ALT0: ECSPI1_SS0ALT1: ENET_COLALT2: AUD5_RXDALT3: KEY_ROW1ALT4: UART5_RX_DATAALT5: GPIO4_IO09ALT6: SD2_VSELECTALT7:

NVCC_GPIO(VGEN_3V3)

D4 GND -

D5 CSI0_DAT9 ALT0: IPU1_CSI0_DATA09ALT1: EIM_DATA07ALT2: ECSPI2_MOSIALT3: KEY_ROW7ALT4: I2C1_SCLALT5: GPIO5_IO27ALT6:ALT7: ARM_TRACE06





D6 CSI0_DAT8 ALT0: IPU1_CSI0_DATA08ALT1: EIM_DATA06ALT2: ECSPI2_SCLKALT3: KEY_COL7ALT4: I2C1_SDAALT5: GPIO5_IO26ALT6:ALT7: ARM_TRACE05


D7 HDMI_DDCCEC HDMI_VPH

D8 GND -

D9 DSI_D1_P NVCC_MIPI

D10 GND -

D11 CSI_D3_P NVCC_MIPI

D12 Reserved -

D13 #BT_DISABLE WLAN/BT_3V3

D14 JTAG_TDI NVCC_JTAG(VGEN_3V3)

D15 #JTAG_TRST NVCC_JTAG(VGEN_3V3)

D16 USB_H1_DP VDD_USB_CAP

D17 TEST_MODE VDD_SNVS_IN 10K pull-down onmodule.

D18 ON/OFF VDD_SNVS_IN Input power on/offline of the module(active-low).

D19 SATA_TX_N SATA_VPH

D20 GND -

D21 SD3_DAT1 ALT0: SD3_DATA1ALT1: UART1_RTS_BALT2: FLEXCAN2_RXALT3:ALT4:ALT5: GPIO7_IO05ALT6:ALT7:

NVCC_SD3(VGEN_3V3)




D22 SD3_RST ALT0: SD3_RESETALT1: UART3_RTS_BALT2:ALT3:ALT4:ALT5: GPIO7_IO08ALT6:ALT7:

NVCC_SD3(VGEN_3V3)

D23 SD3_DAT5/BT_UART_TXD

ALT0: SD3_DATA5ALT1: UART2_TX_DATAALT2:ALT3:ALT4:ALT5: GPIO7_IO00ALT6:ALT7:

NVCC_SD3(VGEN_3V3)


E1 LVDS1_CLK_N NVCC_LVDS_2P5

E2 KEY_ROW0 ALT0: ECSPI1_MOSIALT1: ENET_TX_DATA3ALT2: AUD5_TXDALT3: KEY_ROW0ALT4: UART4_RX_DATAALT5: GPIO4_IO07ALT6: DCIC2_OUTALT7:

NVCC_GPIO(VGEN_3V3)

E3 KEY_COL1 ALT0: ECSPI1_MISOALT1: ENET_MDIOALT2: AUD5_TXFSALT3: KEY_COL1ALT4: UART5_TX_DATAALT5: GPIO4_IO08ALT6: SD1_VSELECTALT7:

NVCC_GPIO(VGEN_3V3)

E4 LVDS0_TX1_P NVCC_LVDS_2P5

E5 CSI0_DATA_EN ALT0: IPU1_CSI0_DATA_ENALT1: EIM_DATA00ALT2:ALT3:ALT4:ALT5: GPIO5_IO20ALT6:ALT7: ARM_TRACE_CLK

NVCC_CSI




E6 CSI0_DAT15 ALT0: IPU1_CSI0_DATA15ALT1: EIM_DATA11ALT2:ALT3: UART5_RX_DATAALT4:ALT5: GPIO6_IO01ALT6:ALT7: ARM_TRACE12

NVCC_CSI

E7 GND -

E8 HDMI_CLK_N HDMI_VPH

E9 DSI_D1_N NVCC_MIPI

E10 DSI_CLK0_N NVCC_MIPI

E11 CSI_D3_N NVCC_MIPI

E12 Reserved -

E13 Reserved -

E14 JTAG_TDO NVCC_JTAG(VGEN_3V3)

E15 Reserved -

E16 GND -

E17 BOOT_MODE0 VDD_SNVS_IN 10K pull-down onmodule.




E18 #POR VDD_SNVS_IN Active low, bi-directional linewhich is alsodriven by the PMICin an open-drainoutputconfiguration. Itcan be used aseither input oroutput:

n Input:assertingthis lineresets themoduleCPU (onlythe CPU).

n Output: lineassertedduringreset. Canbe used tosynchronizeexternalcircuitryreset.

E19 SATA_TX_P SATA_VPH

E20 VGEN_3V3 NVCC_SD3(VGEN_3V3)

E21 SD3_DAT6 ALT0: SD3_DATA6ALT1: UART1_RX_DATAALT2:ALT3:ALT4:ALT5: GPIO6_IO18ALT6:ALT7:

NVCC_SD3(VGEN_3V3)




E22 NANDF_CLE/BT_WAKE

ALT0: NAND_CLEALT1: IPU2_SISG4ALT2:ALT3:ALT4:ALT5: GPIO6_IO07ALT6:ALT7:

NVCC_NANDF(VGEN_3V3)


E23 SD3_CMD/BT_UART_CTS

ALT0: SD3_CMDALT1: UART2_CTS_BALT2: FLEXCAN1_TXALT3:ALT4:ALT5: GPIO7_IO02ALT6:ALT7:

NVCC_SD3(VGEN_3V3)


E24 SD3_DAT2 ALT0: SD3_DATA2ALT1:ALT2:ALT3:ALT4:ALT5: GPIO7_IO06ALT6:ALT7:

NVCC_SD3(VGEN_3V3)

F1 LVDS1_CLK_P NVCC_LVDS_2P5

F2 KEY_ROW3 ALT0:ALT1: ASRC_EXT_CLKALT2: HDMI_TX_DDC_SDAALT3: KEY_ROW3ALT4: I2C2_SDAALT5: GPIO4_IO13ALT6: SD1_VSELECTALT7:

NVCC_GPIO(VGEN_3V3)

Connected to MCAprocessor andPMIC. Notrecommended asmain I2C port.4,7K pull-up onmodule.

F3 GPIO_8 ALT0: ESAI_TX5_RX0ALT1: XTALOSC_REF_CLK_32KALT2: EPIT2_OUTALT3: FLEXCAN1_RXALT4: UART2_RX_DATAALT5: GPIO1_IO08ALT6: SPDIF_SR_CLKALT7: USB_OTG_PWR_CTL_WAKE

NVCC_GPIO(VGEN_3V3)

F4 LVDS0_TX1_N NVCC_LVDS_2P5

F5 GND -




F6 CSI0_DAT18 ALT0: IPU1_CSI0_DATA18ALT1: EIM_DATA14ALT2:ALT3: UART5_RTS_BALT4:ALT5: GPIO6_IO04ALT6:ALT7: ARM_TRACE15

NVCC_CSI

F7 HDMI_D2_N HDMI_VPH

F8 HDMI_CLK_P HDMI_VPH

F9 GND -

F10 DSI_CLK0_P NVCC_MIPI

F11 GND -

F12 GND -

F13 JTAG_TCK NVCC_JTAG(VGEN_3V3)

F14 JTAG_TMS NVCC_JTAG(VGEN_3V3)

F15 BOOT_MODE1 VDD_SNVS_IN 10K pull-up toVDD_SNVS_IN onmodule.

F16 USB_H1_VBUS -

F17 MLB_CP -

F18 MLB_CN -

F19 GND -

F20 SD3_DAT0 ALT0: SD3_DATA0ALT1: UART1_CTS_BALT2: FLEXCAN2_TXALT3:ALT4:ALT5: GPIO7_IO04ALT6:ALT7:

NVCC_SD3(VGEN_3V3)

F21 NANDF_CS0 ALT0: NAND_CE0_BALT1:ALT2:ALT3:ALT4:ALT5: GPIO6_IO11ALT6:ALT7:





F22 #NANDF_WP ALT0: NAND_WP_BALT1: IPU2_SISG5ALT2:ALT3:ALT4:ALT5: GPIO6_IO09ALT6:ALT7:


F23 NANDF_CS3 ALT0: NAND_CE3_BALT1: IPU1_SISG1ALT2: ESAI_TX1ALT3: EIM_ADDR26ALT4:ALT5: GPIO6_IO16ALT6: IPU2_SISG1ALT7:


F24 SD3_DAT3 ALT0: SD3_DATA3ALT1: UART3_CTS_BALT2:ALT3:ALT4:ALT5: GPIO7_IO07ALT6:ALT7:

NVCC_SD3(VGEN_3V3)

G1 GND -

G2 GPIO_0 ALT0: CCM_CLKO1ALT1:ALT2: KEY_COL5ALT3: ASRC_EXT_CLKALT4: EPIT1_OUTALT5: GPIO1_IO00ALT6: USB_H1_PWRALT7: SNVS_VIO_5

NVCC_GPIO(VGEN_3V3)

G3 GPIO_2 ALT0: ESAI_TX_FSALT1:ALT2: KEY_ROW6ALT3:ALT4:ALT5: GPIO1_IO02ALT6: SD2_WPALT7: MLB_DATA

NVCC_GPIO(VGEN_3V3)

G4 GND -




G5 CSI0_PIXCLK ALT0: IPU1_CSI0_PIXCLKALT1:ALT2:ALT3:ALT4:ALT5: GPIO5_IO18ALT6:ALT7: ARM_EVENTO

NVCC_CSI

G6 CSI0_DAT19 ALT0: IPU1_CSI0_DATA19ALT1: EIM_DATA15ALT2:ALT3: UART5_CTS_BALT4:ALT5: GPIO6_IO05ALT6:ALT7:

NVCC_CSI

G7 HDMI_D2_P HDMI_VPH

G8 GND -

G9 HDMI_HPD HDMI_VPH

G10 GND -

G11 CSI_D0_P NVCC_MIPI

G12 CSI_D0_N NVCC_MIPI

G13 JTAG_MOD NVCC_JTAG(VGEN_3V3)

G14 USB_OTG_VBUS USB_OTG_VBUS

G15 #USB_OTG_CHD VDD_USB_CAP

G16 USB_OTG_DN VDD_USB_CAP

G17 USB_OTG_DP VDD_USB_CAP

G18 GND -

G19 SATA_RX_N SATA_VPH

G20 VGEN_3V3 NVCC_NANDF

G21 NANDF_D2 ALT0: NAND_DATA02ALT1: SD1_DATA6ALT2:ALT3:ALT4:ALT5: GPIO2_IO02ALT6:ALT7:









G24 NANDF_ALE ALT0: NAND_ALEALT1: SD4_RESETALT2:ALT3:ALT4:ALT5: GPIO6_IO08ALT6:ALT7:


H1 LVDS1_TX0_N NVCC_LVDS_2P5

H2 KEY_ROW2 ALT0: ECSPI1_SS2ALT1: ENET_TX_DATA2ALT2: FLEXCAN1_RXALT3: KEY_ROW2ALT4: SD2_VSELECTALT5: GPIO4_IO11ALT6: HDMI_TX_CEC_LINEALT7:

NVCC_GPIO(VGEN_3V3)

H3 GPIO_9 ALT0: ESAI_RX_FSALT1: WDOG1_BALT2: KEY_COL6ALT3: CCM_REF_EN_BALT4: PWM1_OUTALT5: GPIO1_IO09ALT6: SD1_WPALT7:

NVCC_GPIO(VGEN_3V3)

H4 LVDS0_TX0_P NVCC_LVDS_2P5

H5 GND -




H6 CSI0_DAT16 ALT0: IPU1_CSI0_DATA16ALT1: EIM_DATA12ALT2:ALT3: UART4_RTS_BALT4:ALT5: GPIO6_IO02ALT6:ALT7: ARM_TRACE13

NVCC_CSI

H19 SATA_RX_P SATA_VPH

H20 GND -

H21 NANDF_CS1/#MCA_INT

ALT0: NAND_CE1_BALT1: SD4_VSELECTALT2: SD3_VSELECTALT3:ALT4:ALT5: GPIO6_IO14ALT6:ALT7:


Connected to MCAprocessor.

H22 NANDF_D1 ALT0: NAND_DATA01ALT1: SD1_DATA5ALT2:ALT3:ALT4:ALT5: GPIO2_IO01ALT6:ALT7:


H23 NANDF_D7 ALT0: NAND_DATA07ALT1: SD2_DATA7ALT2:ALT3:ALT4:ALT5: GPIO2_IO07ALT6:ALT7:


H24 NANDF_CS2 ALT0: NAND_CE2_BALT1: IPU1_SISG0ALT2: ESAI_TX0ALT3: EIM_CREALT4: CCM_CLKO2ALT5: GPIO6_IO15ALT6: IPU2_SISG0ALT7:


J1 LVDS1_TX0_P NVCC_LVDS_2P5




J2 KEY_COL0 ALT0: ECSPI1_SCLKALT1: ENET_RX_DATA3ALT2: AUD5_TXCALT3: KEY_COL0ALT4: UART4_TX_DATAALT5: GPIO4_IO06ALT6: DCIC1_OUTALT7:

NVCC_GPIO(VGEN_3V3)

J3 GPIO_6 ALT0: ESAI_TX_CLKALT1:ALT2: I2C3_SDAALT3:ALT4:ALT5: GPIO1_IO06ALT6: SD2_LCTLALT7: MLB_SIG

NVCC_GPIO(VGEN_3V3)

J4 LVDS0_TX0_N NVCC_LVDS_2P5

J5 CSI0_VSYNC ALT0: IPU1_CSI0_VSYNCALT1: EIM_DATA01ALT2:ALT3:ALT4:ALT5: GPIO5_IO21ALT6:ALT7: ARM_TRACE00

NVCC_CSI

J20 VGEN_3V3 NVCC_SD1

J21 SD1_DAT2 ALT0: SD1_DATA2ALT1: ECSPI5_SS1ALT2: GPT_COMPARE2ALT3: PWM2_OUTALT4: WDOG1_BALT5: GPIO1_IO19ALT6: WDOG1_RESET_B_DEBALT7:

NVCC_SD1(VGEN_3V3)

The signal is onlyavailableexternally onmodules that donot have Wi-Fipopulated.

J22 SD1_DAT1 ALT0: SD1_DATA1ALT1: ECSPI5_SS0ALT2: PWM3_OUTALT3: GPT_CAPTURE2ALT4:ALT5: GPIO1_IO17ALT6:ALT7:

NVCC_SD1(VGEN_3V3)





J23 SD1_CMD ALT0: SD1_CMDALT1: ECSPI5_MOSIALT2: PWM4_OUTALT3: GPT_COMPARE1ALT4:ALT5: GPIO1_IO18ALT6:ALT7:

NVCC_SD1(VGEN_3V3)


J24 NANDF_D0 ALT0: NAND_DATA00ALT1: SD1_DATA4ALT2:ALT3:ALT4:ALT5: GPIO2_IO00ALT6:ALT7:


K1 GND -

K2 KEY_COL2 ALT0: ECSPI1_SS1ALT1: ENET_RX_DATA2ALT2: FLEXCAN1_TXALT3: KEY_COL2ALT4: ENET_MDCALT5: GPIO4_IO10ALT6: USB_H1_PWR_CTL_WAKEALT7:

NVCC_GPIO(VGEN_3V3)

K3 GPIO_1 ALT0: ESAI_RX_CLKALT1: WDOG2_BALT2: KEY_ROW5ALT3: USB_OTG_IDALT4: PWM2_OUTALT5: GPIO1_IO01ALT6: SD1_CD_BALT7:

NVCC_GPIO(VGEN_3V3)

K4 GND -

K5 CSI0_DAT10 ALT0: IPU1_CSI0_DATA10ALT1: AUD3_RXCALT2: ECSPI2_MISOALT3: UART1_TX_DATAALT4:ALT5: GPIO5_IO28ALT6:ALT7: ARM_TRACE07


K20 VGEN_3V3 NVCC_SD2




K21 SD2_DAT1 ALT0: SD2_DATA1ALT1: ECSPI5_SS0ALT2: EIM_CS2ALT3: AUD4_TXFSALT4: KEY_COL7ALT5: GPIO1_IO14ALT6:ALT7:

NVCC_SD2(VGEN_3V3)

K22 SD2_CLK ALT0: SD2_CLKALT1: ECSPI5_SCLKALT2: KEY_COL5ALT3: AUD4_RXFSALT4:ALT5: GPIO1_IO10ALT6:ALT7:

NVCC_SD2(VGEN_3V3)

K23 SD2_DAT3 ALT0: SD2_DATA3ALT1: ECSPI5_SS3ALT2: KEY_COL6ALT3: AUD4_TXCALT4:ALT5: GPIO1_IO12ALT6:ALT7:

NVCC_SD2(VGEN_3V3)

K24 NANDF_D4 ALT0: NAND_DATA04ALT1: SD2_DATA4ALT2:ALT3:ALT4:ALT5: GPIO2_IO04ALT6:ALT7:


L1 LVDS1_TX1_P NVCC_LVDS_2P5

L2 KEY_COL4 ALT0: FLEXCAN2_TXALT1: IPU1_SISG4ALT2: USB_OTG_OCALT3: KEY_COL4ALT4: UART5_RTS_BALT5: GPIO4_IO14ALT6:ALT7:

NVCC_GPIO(VGEN_3V3)




L3 GPIO_4 ALT0: ESAI_TX_HF_CLKALT1:ALT2: KEY_COL7ALT3:ALT4:ALT5: GPIO1_IO04ALT6: SD2_CD_BALT7:

NVCC_GPIO(VGEN_3V3)

L4 LVDS0_CLK_P NVCC_LVDS_2P5

L5 CSI0_DAT12 ALT0: IPU1_CSI0_DATA12ALT1: EIM_DATA08ALT2:ALT3: UART4_TX_DATAALT4:ALT5: GPIO5_IO30ALT6:ALT7: ARM_TRACE09

NVCC_CSI

L20 SD1_DAT3 ALT0: SD1_DATA3ALT1: ECSPI5_SS2ALT2: GPT_COMPARE3ALT3: PWM1_OUTALT4: WDOG2_BALT5: GPIO1_IO21ALT6: WDOG2_RESET_B_DEBALT7:

NVCC_SD1(VGEN_3V3)


L21 SD1_CLK ALT0: SD1_CLKALT1: ECSPI5_SCLKALT2:ALT3: GPT_CLKINALT4:ALT5: GPIO1_IO20ALT6:ALT7:

NVCC_SD1(VGEN_3V3)


L22 GND -

L23 MCA_SWD_CLK ALT0: -ALT1: PTA0ALT2: -ALT3: TMP0_CH5ALT4: -ALT5: -ALT6: -ALT7: SWD_CLK

LDO3_MCA Assuming NXPMKL14Z32VFT4is populated.

Signal not used onmodule.




L24 NANDF_D5 ALT0: NAND_DATA05ALT1: SD2_DATA5ALT2:ALT3:ALT4:ALT5: GPIO2_IO05ALT6:ALT7:


M1 LVDS1_TX1_N NVCC_LVDS_2P5

M2 GPIO_19 ALT0: KEY_COL5ALT1: ENET_1588_EVENT0_OUTALT2: SPDIF_OUTALT3: CCM_CLKO1ALT4: ECSPI1_RDYALT5: GPIO4_IO05ALT6: ENET_TX_ERALT7:

NVCC_GPIO(VGEN_3V3)

M3 GPIO_16 ALT0: ESAI_TX3_RX2ALT1: ENET_1588_EVENT2_INALT2: ENET_REF_CLKALT3: SD1_LCTLALT4: SPDIF_INALT5: GPIO7_IO11ALT6: I2C3_SDAALT7: JTAG_DE_B

NVCC_GPIO(VGEN_3V3)

M4 LVDS0_CLK_N NVCC_LVDS_2P5

M5 CSI0_DAT7 ALT0: IPU1_CSI0_DATA07ALT1: EIM_DATA05ALT2: ECSPI1_SS0ALT3: KEY_ROW6ALT4: AUD3_RXDALT5: GPIO5_IO25ALT6:ALT7: ARM_TRACE04

NVCC_CSI

M20 SD2_CMD ALT0: SD2_CMDALT1: ECSPI5_MOSIALT2: KEY_ROW5ALT3: AUD4_RXCALT4:ALT5: GPIO1_IO11ALT6:ALT7:

NVCC_SD2(VGEN_3V3)




M21 MCA_IO12 ALT0: -ALT1: PTC5/LLWU_P9ALT2: SPI0_SCKALT3: LPTMR0_ALT2ALT4: -ALT5: -ALT6: CMP0_OUTALT7: -

LDO3_MCA Assuming NXPMKL14Z32VFT4 ispopulated.Signal not used onmodule.

M22 LDO3_MCA LDO3_MCA

M23 MCA_SWD_DIO ALT0: -ALT1: PTA3ALT2: I2C1_SCLALT3: TPM0_CH0ALT4: -ALT5: -ALT6: -ALT7: SWD_DIO


M24 NANDF_RB0 ALT0: NAND_READYALT1: IPU2_DI0_PIN01ALT2:ALT3:ALT4:ALT5: GPIO6_IO10ALT6:ALT7:


N1 GND -

N2 GPIO_18 ALT0: ESAI_TX1ALT1: ENET_RX_CLKALT2: SD3_VSELECTALT3: SDMA_EXT_EVENT1ALT4: ASRC_EXT_CLKALT5: GPIO7_IO13ALT6: SNVS_VIO_5_CTLALT7:

NVCC_GPIO(VGEN_3V3)

N3 VCC_LICELL VCC_LICELL

N4 GND -

N5 VGEN_3V3 NVCC_GPIO




N20 MCA_IO/USB0_P

ALT0: ADC0_SE1ALT1: PTE16ALT2: SPI0_PCS0ALT3: UART2_TXALT4: TPM_CLKIN0ALT5: -ALT6: -ALT7: -


N21 MCA_IO13 ALT0: CMP0_IN0ALT1: PTC6/LLWU_P10ALT2: SPI0_MOSIALT3: EXTRG_INALT4: -ALT5: SPI0_MISOALT6: -ALT7: -


N22 MCA_IO7 ALT0: -ALT1: PTB16ALT2: SPI1_MOSIALT3: UART0_RXALT4: TPM_CLKIN0ALT5: SPI1_MISOALT6: -ALT7: -


N23 #MCA_RESET ALT0: RESET_bALT1: PTA20ALT2: -ALT3: -ALT4: -ALT5: -ALT6: -ALT7: -


N24 SD1_DAT0 ALT0: SD1_DATA0ALT1: ECSPI5_MISOALT2:ALT3: GPT_CAPTURE1ALT4:ALT5: GPIO1_IO16ALT6:ALT7:

NVCC_SD1(VGEN_3V3)


P1 LVDS1_TX2_N NVCC_LVDS_2P5




P2 ENET_CRS_DV ALT0: ENET_RX_ENALT1: ESAI_TX_CLKALT2: SPDIF_EXT_CLKALT3:ALT4:ALT5: GPIO1_IO25ALT6:ALT7:

NVCC_ENET

P3 GPIO_7 ALT0: ESAI_TX4_RX1ALT1: ECSPI5_RDYALT2: EPIT1_OUTALT3: FLEXCAN1_TXALT4: UART2_TX_DATAALT5: GPIO1_IO07ALT6: SPDIF_LOCKALT7: USB_OTG_HOST_MODE

NVCC_GPIO(VGEN_3V3)

P4 LVDS0_TX3_P NVCC_LVDS_2P5

P5 NVCC_CSI NVCC_CSI

P20 MCA_IO/USB0_N

ALT0: ADC0_SE5aALT1: PTE17ALT2: SPI0_SCKALT3: UART2_RXALT4: TPM_CLKIN1ALT5: -ALT6: LPTMR0_ALT3ALT7: -

LDO3_MCA Assuming NXPMKL14Z32VFT4 ispopulated.


P21 MCA_IO14 ALT0: ADC0_SE6aALT1: PTE19ALT2: SPI0_MISOALT3: -ALT4: I2C0_SCLALT5: SPI0_MOSIALT6: -ALT7: -


P22 MCA_IO8 ALT0: -ALT1: PTB17ALT2: SPI1_MISOALT3: UART0_TXALT4: TPM_CLKIN1ALT5: SPI1_MOSIALT6: -ALT7: -





P23 MCA_IO1 ALT0: ADC0_SE4aALT1: PTE21ALT2: -ALT3: TPM1_CH1ALT4: UART0_RXALT5: -ALT6: -ALT7: -


P24 SD2_DAT0 ALT0: SD2_DATA0ALT1: ECSPI5_MISOALT2:ALT3: AUD4_RXDALT4: KEY_ROW7ALT5: GPIO1_IO15ALT6: DCIC2_OUTALT7:

NVCC_SD2(VGEN_3V3)

R1 LVDS1_TX2_P NVCC_LVDS_2P5

R2 ENET_RX_ER ALT0: USB_OTG_IDALT1: ENET_RX_ERALT2: ESAI_RX_HF_CLKALT3: SPDIF_INALT4: ENET_1588_EVENT2_OUTALT5: GPIO1_IO24ALT6:ALT7:

NVCC_ENET

R3 GPIO_5 ALT0: ESAI_TX2_RX3ALT1:ALT2: KEY_ROW7ALT3: CCM_CLKO1ALT4:ALT5: GPIO1_IO05ALT6: I2C3_SCLALT7: ARM_EVENTI

NVCC_GPIO(VGEN_3V3)

R4 LVDS0_TX3_N NVCC_LVDS_2P5

R5 NVCC_RGMII NVCC_RGMII

R20 MCA_IO19 ALT0: CMP0_IN1ALT1: PTC7ALT2: SPI0_MISOALT3: -ALT4: -ALT5: SPI0_MOSIALT6: -ALT7: -

LDO3_MCA Assuming NXPMKL14Z32VFT4 ispopulated.





R21 MCA_IO16 ALT0: -ALT1: PTD4/LLWU_P14ALT2: SPI1_PCS0ALT3: UART2_RXALT4: TPM0_CH4ALT5: -ALT6: -ALT7: -


R22 MCA_IO9 ALT0: ADC0_SE11ALT1: PTC2ALT2: I2C1_SDAALT3: -ALT4: TPM0_CH1ALT5: -ALT6: -ALT7: -


R23 MCA_IO2 ALT0: ADC0_SE8ALT1: PTB0/LLWU_P5ALT2: I2C0_SCLALT3: TPM1_CH0ALT4: -ALT5: -ALT6: -ALT7: -


R24 SD2_DAT2 ALT0: SD2_DATA2ALT1: ECSPI5_SS1ALT2: EIM_CS3ALT3: AUD4_TXDALT4: KEY_ROW6ALT5: GPIO1_IO13ALT6:ALT7:

NVCC_SD2(VGEN_3V3)

T1 GND -

T2 GND -

T3 GPIO_3 ALT0: ESAI_RX_HF_CLKALT1:ALT2: I2C3_SCLALT3: XTALOSC_REF_CLK_24MALT4: CCM_CLKO2ALT5: GPIO1_IO03ALT6: USB_H1_OCALT7: MLB_CLK

NVCC_GPIO(VGEN_3V3)

T4 GND -

T5 GND -




T20 MCA_IO24 ALT0: XTAL0ALT1: PTA19ALT2: -ALT3: UART1_TXALT4: TPM_CLKIN1ALT5: -ALT6: LPTMR0_ALT1ALT7: -


T21 MCA_IO22 ALT0: ADC0_SE6bALT1: PTD5ALT2: SPI1_SCKALT3: UART2_TXALT4: TPM0_CH5ALT5: -ALT6: -ALT7: -


T22 MCA_IO10 ALT0: -ALT1: PTC3/LLWU_P7ALT2: -ALT3: UART1_RXALT4: TPM0_CH2ALT5: CLKOUTALT6: -ALT7: -


T23 MCA_IO0 ALT0: ADC0_SE0ALT1: PTE20ALT2: -ALT3: TPM1_CH0ALT4: UART0_TXALT5: -ALT6: -ALT7: -


T24 MCA_IO3 ALT0: ADC0_SE7bALT1: PTD6/LLWU_P15ALT2: SPI1_MOSIALT3: UART0_RXALT4: -ALT5: SPI1_MISOALT6: -ALT7: -


U1 LVDS1_TX3_N NVCC_LVDS_2P5




U2 ENET_TXD0 ALT0:ALT1: ENET_TX_DATA0ALT2: ESAI_TX4_RX1ALT3:ALT4:ALT5: GPIO1_IO30ALT6:ALT7:

NVCC_ENET

U3 GND -

U4 RGMII_TXC ALT0: USB_H2_DATAALT1: RGMII_TXCALT2: SPDIF_EXT_CLKALT3:ALT4:ALT5: GPIO6_IO19ALT6:ALT7: XTALOSC_REF_CLK_24M

NVCC_RGMII

U5 RGMII_TD0 ALT0: HSI_TX_READYALT1: RGMII_TD0ALT2:ALT3:ALT4:ALT5: GPIO6_IO20ALT6:ALT7:

NVCC_RGMII

U6 DISP0_DAT21 ALT0: IPU1_DISP0_DATA21ALT1: IPU2_DISP0_DATA21ALT2: ECSPI1_MOSIALT3: AUD4_TXDALT4:ALT5: GPIO5_IO15ALT6:ALT7:

NVCC_LCD

U19 EIM_DA3 ALT0: EIM_DA03ALT1: IPU1_DISP1_DATA06ALT2: IPU2_CSI1_DATA06ALT3:ALT4:ALT5: GPIO3_IO03ALT6:ALT7: SRC_BOOT_CFG03

NVCC_EIM




U20 EIM_DA0 ALT0: EIM_AD00ALT1: IPU1_DISP1_DATA09ALT2: IPU2_CSI1_DATA09ALT3:ALT4:ALT5: GPIO3_IO00ALT6:ALT7: SRC_BOOT_CFG00

NVCC_EIM

U21 EIM_LBA ALT0: EIM_LBAALT1: IPU1_DI1_PIN17ALT2: ECSPI2_SS1ALT3:ALT4:ALT5: GPIO2_IO27ALT6:ALT7: SRC_BOOT_CFG26

NVCC_EIM

U22 MCA_IO11 ALT0: -ALT1: PTC4/LLWU_P8ALT2: SPI0_PCS0ALT3: UART1_TXALT4: TPM0_CH3ALT5: -ALT6: -ALT7: -


U23 EIM_DA6 ALT0: EIM_AD06ALT1: IPU1_DISP1_DATA03ALT2: IPU2_CSI1_DATA03ALT3:ALT4:ALT5: GPIO3_IO06ALT6:ALT7: SRC_BOOT_CFG06

NVCC_EIM 10K pull-up toNVCC_EIM onmodule.

U24 MCA_IO4 ALT0: ADC0_SE14ALT1: PTC0ALT2: -ALT3: EXTRG_INALT4: -ALT5: CMP0_OUTALT6: -ALT7: -


V1 LVDS1_TX3_P NVCC_LVDS_2P5




V2 ENET_TXD1 ALT0: MLB_CLKALT1: ENET_TX_DATA1ALT2: ESAI_TX2_RX3ALT3:ALT4: ENET_1588_EVENT0_INALT5: GPIO1_IO29ALT6:ALT7:

NVCC_ENET

V3 NVCC_ENET NVCC_ENET

V4 RGMII_RX_CTL ALT0: USB_H3_DATAALT1: RGMII_RX_CTLALT2:ALT3:ALT4:ALT5: GPIO6_IO24ALT6:ALT7:

NVCC_RGMII

V5 RGMII_TD1 ALT0: HSI_RX_FLAGALT1: RGMII_TD1ALT2:ALT3:ALT4:ALT5: GPIO6_IO21ALT6:ALT7:

NVCC_RGMII

V6 DISP0_DAT16 ALT0: IPU1_DISP0_DATA16ALT1: IPU2_DISP0_DATA16ALT2: ECSPI2_MOSIALT3: AUD5_TXCALT4: SDMA_EXT_EVENT0ALT5: GPIO5_IO10ALT6:ALT7:

NVCC_LCD

V7 DISP0_DAT22 ALT0: IPU1_DISP0_DATA22ALT1: IPU2_DISP0_DATA22ALT2: ECSPI1_MISOALT3: AUD4_TXFSALT4:ALT5: GPIO5_IO16ALT6:ALT7:

NVCC_LCD




V8 DI0_PIN3 ALT0: IPU1_DI0_PIN03ALT1: IPU2_DI0_PIN03ALT2: AUD6_TXFSALT3:ALT4:ALT5: GPIO4_IO19ALT6:ALT7:

NVCC_LCD

V9 DI0_DISP_CLK ALT0: IPU1_DI0_DISP_CLKALT1: IPU2_DI0_DISP_CLKALT2:ALT3:ALT4:ALT5: GPIO4_IO16ALT6:ALT7:

NVCC_LCD

V10 DI0_PIN15 ALT0: IPU1_DI0_PIN15ALT1: IPU2_DI0_PIN15ALT2: AUD6_TXCALT3:ALT4:ALT5: GPIO4_IO17ALT6:ALT7:

NVCC_LCD

V11 VSYS VSYS

V12 PMIC_GPIO11 - PMIC.

V13 PMIC_GPIO15 - PMIC.

V14 CHG_WAKE - PMIC.

V15 EIM_OE ALT0: EIM_OEALT1: IPU1_DI1_PIN07ALT2: ECSPI2_MISOALT3:ALT4:ALT5: GPIO2_IO25ALT6:ALT7:

NVCC_EIM




V16 EIM_EB1 ALT0: EIM_EB1ALT1: IPU1_DISP1_DATA10ALT2: IPU2_CSI1_DATA10ALT3:ALT4:ALT5: GPIO2_IO29ALT6:ALT7: SRC_BOOT_CFG28

NVCC_EIM

V17 EIM_D17 ALT0: EIM_DATA17ALT1: ECSPI1_MISOALT2: IPU1_DI0_PIN06ALT3: IPU2_CSI1_PIXCLKALT4: DCIC1_OUTALT5: GPIO3_IO17ALT6: I2C3_SCLALT7:

NVCC_EIM

V18 EIM_DA11 ALT0: EIM_DA11ALT1: IPU1_DI1_PIN02ALT2: IPU2_CSI1_HSYNCALT3:ALT4:ALT5: GPIO3_IO11ALT6:ALT7: SRC_BOOT_CFG11


V19 EIM_DA9 ALT0: EIM_DA9ALT1: IPU1_DISP1_DATA00ALT2: IPU2_CSI1_DATA00ALT3:ALT4:ALT5: GPIO3_IO09ALT6:ALT7: SRC_BOOT_CFG09

NVCC_EIM

V20 EIM_DA13 ALT0: EIM_DA13ALT1: IPU1_DI1_D0_CSALT2:ALT3:ALT4:ALT5: GPIO3_IO13ALT6:ALT7: SRC_BOOT_CFG13

NVCC_EIM 10K pull-down onmodule.




V21 EIM_DA10 ALT0: EIM_DA10ALT1: IPU1_DI1_PIN15ALT2: IPU2_CSI1_DATA_ENALT3:ALT4:ALT5: GPIO3_IO10ALT6:ALT7: SRC_BOOT_CFG10

NVCC_EIM

V22 EIM_DA12 ALT0: EIM_DA12ALT1: IPU1_DI1_PIN03ALT2: IPU2_CSI1_VSYNCALT3:ALT4:ALT5: GPIO3_IO12ALT6:ALT7: SRC_BOOT_CFG12


V23 GND -

V24 EIM_DA2 ALT0: EIM_DA02ALT1: IPU1_DISP1_DATA07ALT2: IPU2_CSI1_DATA07ALT3:ALT4:ALT5: GPIO3_IO02ALT6:ALT7: SRC_BOOT_CFG02

NVCC_EIM

W1 GND -

W2 GND -

W3 ENET_MDC ALT0: MLB_DATAALT1: ENET_MDCALT2: ESAI_TX5_RX0ALT3:ALT4: ENET_1588_EVENT1_INALT5: GPIO1_IO31ALT6:ALT7:

NVCC_ENET

W4 RGMII_TX_CTL ALT0: USB_H2_STROBEALT1: RGMII_TX_CTLALT2:ALT3:ALT4:ALT5: GPIO6_IO26ALT6:ALT7: ENET_REF_CLK

NVCC_RGMII




W5 GND -

W6 DISP0_DAT20 ALT0: IPU1_DISP0_DATA20ALT1: IPU2_DISP0_DATA20ALT2: ECSPI1_SCLKALT3: AUD4_TXCALT4:ALT5: GPIO5_IO14ALT6:ALT7:

NVCC_LCD

W7 DISP0_DAT15 ALT0: IPU1_DISP0_DATA15ALT1: IPU2_DISP0_DATA15ALT2: ECSPI1_SS1ALT3: ECSPI2_SS1ALT4:ALT5: GPIO5_IO09ALT6:ALT7:

NVCC_LCD

W8 DISP0_DAT13 ALT0: IPU1_DISP0_DATA13ALT1: IPU2_DISP0_DATA13ALT2:ALT3: AUD5_RXFSALT4:ALT5: GPIO5_IO07ALT6:ALT7:

NVCC_LCD

W9 GND -

W10 DI0_PIN2 ALT0: IPU1_DI0_PIN02ALT1: IPU2_DI0_PIN02ALT2: AUD6_TXDALT3:ALT4:ALT5: GPIO4_IO18ALT6:ALT7:

NVCC_LCD

W11 VSYS VSYS

W12 VSYS VSYS

W13 PMIC_PWR_EN - PMIC.

W14 GND -




W15 EIM_RW ALT0: EIM_RWALT1: IPU1_DI1_PIN08ALT2: ECSPI2_SS0ALT3:ALT4:ALT5: GPIO2_IO26ALT6:ALT7: SRC_BOOT_CFG29

NVCC_EIM

W16 EIM_D29 ALT0: EIM_DATA29ALT1: IPU1_DI1_PIN15ALT2: ECSPI4_SS0ALT3:ALT4: UART2_RTS_BALT5: GPIO3_IO29ALT6: IPU2_CSI1_VSYNCALT7: IPU1_DI0_PIN14

NVCC_EIM

W17 GND -

W18 EIM_A25 ALT0: EIM_ADDR25ALT1: ECSPI4_SS1ALT2: ECSPI2_RDYALT3: IPU1_DI1_PIN12ALT4: IPU1_DI0_D1_CSALT5: GPIO5_IO02ALT6: HDMI_TX_CEC_LINEALT7:

NVCC_EIM

W19 EIM_D20 ALT0: EIM_DATA20ALT1: ECSPI4_SS0ALT2: IPU1_DI0_PIN16ALT3: IPU2_CSI1_DATA15ALT4: UART1_RTS_BALT5: GPIO3_IO20ALT6: EPIT2_OUTALT7:

NVCC_EIM

W20 EIM_D24 ALT0: EIM_DATA24ALT1: ECSPI4_SS2ALT2: UART3_TX_DATAALT3: ECSPI1_SS2ALT4: ECSPI2_SS2ALT5: GPIO3_IO24ALT6: AUD5_RXFSALT7: UART1_DTR_B

NVCC_EIM




W21 EIM_DA14 ALT0: EIM_DA14ALT1: IPU1_DI1_D1_CSALT2:ALT3:ALT4:ALT5: GPIO3_IO14ALT6:ALT7: SRC_BOOT_CFG14


W22 EIM_DA8 ALT0: EIM_DA8ALT1: IPU1_DISP1_DATA01ALT2: IPU2_CSI1_DATA01ALT3:ALT4:ALT5: GPIO3_IO08ALT6:ALT7: SRC_BOOT_CFG08

NVCC_EIM


NVCC_EIM



Y1 ENET_REF_CLK ALT0:ALT1: ENET_TX_CLKALT2: ESAI_RX_FSALT3:ALT4:ALT5: GPIO1_IO23ALT6: SPDIF_SR_CLKALT7:

NVCC_ENET




Y2 ENET_RXD0 ALT0:ALT1: ENET_RX_DATA0ALT2: ESAI_TX_HF_CLKALT3: SPDIF_OUTALT4:ALT5: GPIO1_IO27ALT6:ALT7:

NVCC_ENET

Y3 ENET_MDIO ALT0:ALT1: ENET_MDIOALT2: ESAI_RX_CLKALT3:ALT4: ENET_1588_EVENT1_OUTALT5: GPIO1_IO22ALT6: SPDIF_LOCKALT7:

NVCC_ENET

Y4 GND -

Y5 RGMII_TD2 ALT0: HSI_RX_DATAALT1: RGMII_TD2ALT2:ALT3:ALT4:ALT5: GPIO6_IO22ALT6:ALT7:

NVCC_RGMII

Y6 DISP0_DAT19 ALT0: IPU1_DISP0_DATA19ALT1: IPU2_DISP0_DATA19ALT2: ECSPI2_SCLKALT3: AUD5_RXDALT4: AUD4_RXCALT5: GPIO5_IO13ALT6:ALT7: EIM_CS3

NVCC_LCD

Y7 DISP0_DAT11 ALT0: IPU1_DISP0_DATA11ALT1: IPU2_DISP0_DATA11ALT2:ALT3:ALT4:ALT5: GPIO5_IO05ALT6:ALT7:

NVCC_LCD




Y8 DISP0_DAT10 ALT0: IPU1_DISP0_DATA10ALT1: IPU2_DISP0_DATA10ALT2:ALT3:ALT4:ALT5: GPIO4_IO31ALT6:ALT7:

NVCC_LCD

Y9 NVCC_LCD NVCC_LCD

Y10 PMIC_GPIO14 -

Y11 GND -

Y12 GND -

Y13 NVCC_EIM NVCC_EIM

Y14 EIM_EB0 ALT0: EIM_EB0ALT1: IPU1_DISP1_DATA11ALT2: IPU2_CSI1_DATA11ALT3:ALT4: CCM_PMIC_READYALT5: GPIO2_IO28ALT6:ALT7: SRC_BOOT_CFG27

NVCC_EIM

Y15 EIM_D30 ALT0: EIM_DATA30ALT1: IPU1_DISP1_DATA21ALT2: IPU1_DI0_PIN11ALT3: IPU1_CSI0_DATA03ALT4: UART3_CTS_BALT5: GPIO3_IO30ALT6: USB_H1_OCALT7:

NVCC_EIM

Y16 EIM_D21 ALT0: EIM_DATA21ALT1: ECSPI4_SCLKALT2: IPU1_DI0_PIN17ALT3: IPU2_CSI1_DATA11ALT4: USB_OTG_OCALT5: GPIO3_IO21ALT6: I2C1_SCLALT7: SPDIF_IN

NVCC_EIM




Y17 EIM_D19 ALT0: EIM_DATA19ALT1: ECSPI1_SS1ALT2: IPU1_DI0_PIN08ALT3: IPU2_CSI1_DATA16ALT4: UART1_CTS_BALT5: GPIO3_IO19ALT6: EPIT1_OUTALT7:

NVCC_EIM

Y18 EIM_D22 ALT0: EIM_DATA22ALT1: ECSPI4_MISOALT2: IPU1_DI0_PIN01ALT3: IPU2_CSI1_DATA10ALT4: USB_OTG_PWRALT5: GPIO3_IO22ALT6: SPDIF_OUTALT7:

NVCC_EIM

Y19 GND -

Y20 EIM_DA15 ALT0: EIM_DA15ALT1: IPU1_DI1_PIN01ALT2: IPU1_DI1_PIN04ALT3:ALT4:ALT5: GPIO3_IO15ALT6:ALT7: SRC_BOOT_CFG15

NVCC_EIM

Y21 EIM_DA7 ALT0: EIM_DA7ALT1: IPU1_DISP1_DATA02ALT2: IPU2_CSI1_DATA02ALT3:ALT4:ALT5: GPIO3_IO07ALT6:ALT7: SRC_BOOT_CFG07


Y22 MCA_IO27 ALT0: ADC0_SE2ALT1: PTE18ALT2: SPI0_MOSIALT3: -ALT4: I2C0_SDAALT5: SPI0_MISOALT6: -ALT7: -





Y23 MCA_IO23 ALT0: CMP0_IN5/ADC0_SE4bALT1: PTE29ALT2: -ALT3: TPM0_CH2ALT4: TPM_CLKIN0ALT5: -ALT6: -ALT7: -


Y24 EIM_EB2 ALT0: EIM_EB2ALT1: ECSPI1_SS0ALT2:ALT3: IPU2_CSI1_DATA19ALT4: HDMI_TX_DDC_SCLALT5: GPIO2_IO30ALT6: I2C2_SCLALT7: SRC_BOOT_CFG30

NVCC_EIM

AA2 ENET_RXD1 ALT0: MLB_SIGALT1: ENET_RX_DATA1ALT2: ESAI_TX_FSALT3:ALT4: ENET_1588_EVENT3_OUTALT5: GPIO1_IO26ALT6:ALT7:

NVCC_ENET

AA3 ENET_TX_EN ALT0:ALT1: ENET_TX_ENALT2: ESAI_TX3_RX2ALT3:ALT4:ALT5: GPIO1_IO28ALT6:ALT7:

NVCC_ENET

AA4 RGMII_RD0 ALT0: HSI_RX_READYALT1: RGMII_RD0ALT2:ALT3:ALT4:ALT5: GPIO6_IO25ALT6:ALT7:

NVCC_RGMII




AA5 RGMII_TD3 ALT0: HSI_RX_WAKEALT1: RGMII_TD3ALT2:ALT3:ALT4:ALT5: GPIO6_IO23ALT6:ALT7:

NVCC_RGMII

AA6 DISP0_DAT23 ALT0: IPU1_DISP0_DATA23ALT1: IPU2_DISP0_DATA23ALT2: ECSPI1_SS0ALT3: AUD4_RXDALT4:ALT5: GPIO5_IO17ALT6:ALT7:

NVCC_LCD

AA7 DISP0_DAT12 ALT0: IPU1_DISP0_DATA12ALT1: IPU2_DISP0_DATA12ALT2:ALT3:ALT4:ALT5: GPIO5_IO06ALT6:ALT7:

NVCC_LCD

AA8 DISP0_DAT8 ALT0: IPU1_DISP0_DATA08ALT1: IPU2_DISP0_DATA08ALT2: PWM1_OUTALT3: WDOG1_BALT4:ALT5: GPIO4_IO29ALT6:ALT7:

NVCC_LCD

AA9 DISP0_DAT4 ALT0: IPU1_DISP0_DATA04ALT1: IPU2_DISP0_DATA04ALT2: ECSPI3_SS1ALT3:ALT4:ALT5: GPIO4_IO25ALT6:ALT7:

NVCC_LCD




AA10 VLDO6 VLDO6

AA11 VLDO7 VLDO7

AA12 VGEN_3V3 VGEN_3V3

AA13 EIM_WAIT ALT0: EIM_WAITALT1: EIM_DTACK_BALT2:ALT3:ALT4:ALT5: GPIO5_IO00ALT6:ALT7: SRC_BOOT_CFG25

NVCC_EIM

AA14 EIM_A23 ALT0: EIM_ADDR23ALT1: IPU1_DISP1_DATA18ALT2: IPU2_CSI1_DATA18ALT3: IPU2_SISG3ALT4: IPU1_SISG3ALT5: GPIO6_IO06ALT6:ALT7: SRC_BOOT_CFG23

NVCC_EIM

AA15 EIM_D31 ALT0: EIM_DATA31ALT1: IPU1_DISP1_DATA20ALT2: IPU1_DI0_PIN12ALT3: IPU1_CSI0_DATA02ALT4: UART3_RTS_BALT5: GPIO3_IO31ALT6: USB_H1_PWRALT7:

NVCC_EIM

AA16 GND -

AA17 EIM_D25 ALT0: EIM_DATA25ALT1: ECSPI4_SS3ALT2: UART3_RX_DATAALT3: ECSPI1_SS3ALT4: ECSPI2_SS3ALT5: GPIO3_IO25ALT6: AUD5_RXCALT7: UART1_DSR_B

NVCC_EIM




AA18 EIM_EB3 ALT0: EIM_EB3ALT1: ECSPI4_RDYALT2: UART3_RTS_BALT3: UART1_RI_BALT4: IPU2_CSI1_HSYNCALT5: GPIO2_IO31ALT6: IPU1_DI1_PIN03ALT7: SRC_BOOT_CFG31

NVCC_EIM

AA19 EIM_DA5 ALT0: EIM_DA5ALT1: IPU1_DISP1_DATA04ALT2: IPU2_CSI1_DATA04ALT3:ALT4:ALT5: GPIO3_IO05ALT6:ALT7: SRC_BOOT_CFG05


AA20 MCA_IO21 ALT0: -ALT1: PTD7ALT2: SPI1_MISOALT3: UART0_TXALT4: -ALT5: SPI1_MOSIALT6: -ALT7: -


AA21 MCA_IO26 ALT0: -ALT1: PTA4ALT2: I2C1_SDAALT3: TPM0_CH1ALT4: -ALT5: -ALT6: -ALT7: NMI_b


AA22 MCA_IO25 ALT0: -ALT1: PTA1ALT2: UART0_RXALT3: TPM2_CH0ALT4: -ALT5: -ALT6: -ALT7: -





AA23 MCA_IO6/PMIC_GP_FB2

ALT0: -ALT1: PTA2ALT2: UART0_TXALT3: TPM2_CH1ALT4: -ALT5: -ALT6: -ALT7: -


AB3 RGMII_RD1 ALT0: HSI_TX_FLAGALT1: RGMII_RD1ALT2:ALT3:ALT4:ALT5: GPIO6_IO27ALT6:ALT7:

NVCC_RGMII

AB4 GND -

AB5 DISP0_DAT17 ALT0: IPU1_DISP0_DATA17ALT1: IPU2_DISP0_DATA17ALT2: ECSPI2_MISOALT3: AUD5_TXDALT4: SDMA_EXT_EVENT1ALT5: GPIO5_IO11ALT6:ALT7:

NVCC_LCD

AB6 DISP0_DAT9 ALT0: IPU1_DISP0_DATA09ALT1: IPU2_DISP0_DATA09ALT2: PWM2_OUTALT3: WDOG2_BALT4:ALT5: GPIO4_IO30ALT6:ALT7:

NVCC_LCD

AB7 DISP0_DAT6 ALT0: IPU1_DISP0_DATA06ALT1: IPU2_DISP0_DATA06ALT2: ECSPI3_SS3ALT3: AUD6_RXCALT4:ALT5: GPIO4_IO27ALT6:ALT7:

NVCC_LCD




AB8 DISP0_DAT3 ALT0: IPU1_DISP0_DATA03ALT1: IPU2_DISP0_DATA03ALT2: ECSPI3_SS0ALT3:ALT4:ALT5: GPIO4_IO24ALT6:ALT7:

NVCC_LCD

AB9 PMIC_GPIO7 - PMIC line.

AB10 GND -

AB11 Reserved -

AB12 EIM_BCLK ALT0: EIM_BCLKALT1: IPU1_DI1_PIN16ALT2:ALT3:ALT4:ALT5: GPIO6_IO31ALT6:ALT7:

NVCC_EIM

AB13 EIM_CS0 ALT0: EIM_CS0ALT1: IPU1_DI1_PIN05ALT2: ECSPI2_SCLKALT3:ALT4:ALT5: GPIO2_IO23ALT6:ALT7:

NVCC_EIM

AB14 PMIC_ADCIN1/GPIO0

- PMIC line.

AB15 EIM_A18 ALT0: EIM_ADDR18ALT1: IPU1_DISP1_DATA13ALT2: IPU2_CSI1_DATA13ALT3:ALT4:ALT5: GPIO2_IO20ALT6:ALT7: SRC_BOOT_CFG18

NVCC_EIM




AB16 EIM_A20 ALT0: EIM_ADDR20ALT1: IPU1_DISP1_DATA15ALT2: IPU2_CSI1_DATA15ALT3:ALT4:ALT5: GPIO2_IO18ALT6:ALT7: SRC_BOOT_CFG20

NVCC_EIM

AB17 EIM_D28 ALT0: EIM_DATA28ALT1: I2C1_SDAALT2: ECSPI4_MOSIALT3: IPU2_CSI1_DATA12ALT4: UART2_CTS_BALT5: GPIO3_IO28ALT6: IPU1_EXT_TRIGALT7: IPU1_DI0_PIN13

NVCC_EIM

AB18 EIM_D18 ALT0: EIM_DATA18ALT1: ECSPI1_MOSIALT2: IPU1_DI0_PIN07ALT3: IPU2_CSI1_DATA17ALT4: IPU1_DI1_D0_CSALT5: GPIO3_IO18ALT6: I2C3_SDAALT7:

NVCC_EIM

AB19 PMIC_PWR1_EN

AB20 #PMIC_VDD_FAULT

AB21 GND -

AB22 #PMIC_OFF

AC4 RGMII_RD2 ALT0: HSI_TX_DATAALT1: RGMII_RD2ALT2:ALT3:ALT4:ALT5: GPIO6_IO28ALT6:ALT7:

NVCC_RGMII




AC5 RGMII_RD3 ALT0: HSI_TX_WAKEALT1: RGMII_RD3ALT2:ALT3:ALT4:ALT5: GPIO6_IO29ALT6:ALT7:

NVCC_RGMII

AC6 DISP0_DAT14 ALT0: IPU1_DISP0_DATA14ALT1: IPU2_DISP0_DATA14ALT2:ALT3: AUD5_RXCALT4:ALT5: GPIO5_IO08ALT6:ALT7:

NVCC_LCD

AC7 DISP0_DAT7 ALT0: IPU1_DISP0_DATA07ALT1: IPU2_DISP0_DATA07ALT2: ECSPI3_RDYALT3:ALT4:ALT5: GPIO4_IO28ALT6:ALT7:

NVCC_LCD

AC8 DISP0_DAT0 ALT0: IPU1_DISP0_DATA00ALT1: IPU2_DISP0_DATA00ALT2: ECSPI3_SCLKALT3:ALT4:ALT5: GPIO4_IO21ALT6:ALT7:

NVCC_LCD

AC9 DISP0_DAT1 ALT0: IPU1_DISP0_DATA01ALT1: IPU2_DISP0_DATA01ALT2: ECSPI3_MOSIALT3:ALT4:ALT5: GPIO4_IO22ALT6:ALT7:

NVCC_LCD




AC10 MCA_VREFH VREFH - Not used onmodule.A 100nF capacitorconnected to GNDis placed close tothis pin onConnectCore 6SOM.

AC11 Reserved - Output power rail.

AC12 GND -

AC13 GND -

AC14 PMIC_ADCIN2/GPIO1

- PMIC line.

AC15 EIM_CS1 ALT0: EIM_CS1ALT1: IPU1_DI1_PIN06ALT2: ECSPI2_MOSIALT3:ALT4:ALT5: GPIO2_IO24ALT6:ALT7:

NVCC_EIM

AC16 EIM_A21 ALT0: EIM_ADDR21ALT1: IPU1_DISP1_DATA16ALT2: IPU2_CSI1_DATA16ALT3:ALT4:ALT5: GPIO2_IO17ALT6:ALT7: SRC_BOOT_CFG21

NVCC_EIM


NVCC_EIM

AC18 GND -





NVCC_EIM

AC20 EIM_D23 ALT0: EIM_DATA23ALT1: IPU1_DI0_D0_CSALT2: UART3_CTS_BALT3: UART1_DCD_BALT4: IPU2_CSI1_DATA_ENALT5: GPIO3_IO23ALT6: IPU1_DI1_PIN02ALT7: IPU1_DI1_PIN14

NVCC_EIM

AC21 MCA_IO28 ALT0: -ALT1: PTE25ALT2: -ALT3: TPM0_CH1ALT4: -ALT5: I2C0_SDAALT6: -ALT7: -

LDO3_MCA Not used onmodule.For K10 and K20processors, thispin is VBAT.ConnectCore 6SOM has an 0Rresistor foreseenon this pin forconnecting thissignal to LDO3_MCA. By default,the resistor is notpopulated andMCA_IO28 isavailable onmodule pad.1x 100nF + 1x1µFcapacitorsconnected to GNDare placed close tothis pin onConnectCore 6SOM.




AD5 RGMII_RXC ALT0: USB_H3_STROBEALT1: RGMII_RXCALT2:ALT3:ALT4:ALT5: GPIO6_IO30ALT6:ALT7:

NVCC_RGMII

AD6 DISP0_DAT18 ALT0: IPU1_DISP0_DATA18ALT1: IPU2_DISP0_DATA18ALT2: ECSPI2_SS0ALT3: AUD5_TXFSALT4: AUD4_RXFSALT5: GPIO5_IO12ALT6:ALT7: EIM_CS2

NVCC_LCD

AD7 DISP0_DAT5 ALT0: IPU1_DISP0_DATA05ALT1: IPU2_DISP0_DATA05ALT2: ECSPI3_SS2ALT3: AUD6_RXFSALT4:ALT5: GPIO4_IO26ALT6:ALT7:

NVCC_LCD

AD8 DI0_PIN4 ALT0: IPU1_DI0_PIN04ALT1: IPU2_DI0_PIN04ALT2: AUD6_RXDALT3: SD1_WPALT4:ALT5: GPIO4_IO20ALT6:ALT7:

NVCC_LCD

AD9 DISP0_DAT2 ALT0: IPU1_DISP0_DATA02ALT1: IPU2_DISP0_DATA02ALT2: ECSPI3_MISOALT3:ALT4:ALT5: GPIO4_IO23ALT6:ALT7:

NVCC_LCD

AD10 VLDO4 -




AD11 VLDO8 -

AD12 PMIC_GP_FB3 - PMIC.

AD13 PMIC_GP_FB1/GPIO13

- PMIC.

AD14 PMIC_ADCIN3/GPIO2

- PMIC.

AD15 EIM_A16 ALT0: EIM_ADDR16ALT1: IPU1_DI1_DISP_CLKALT2: IPU2_CSI1_PIXCLKALT3:ALT4:ALT5: GPIO2_IO22ALT6:ALT7: SRC_BOOT_CFG16

NVCC_EIM

AD16 EIM_A19 ALT0: EIM_ADDR19ALT1: IPU1_DISP1_DATA14ALT2: IPU2_CSI1_DATA14ALT3:ALT4:ALT5: GPIO2_IO19ALT6:ALT7: SRC_BOOT_CFG19

NVCC_EIM

AD17 EIM_A24 ALT0: EIM_ADDR24ALT1: IPU1_DISP1_DATA19ALT2: IPU2_CSI1_DATA19ALT3: IPU2_SISG2ALT4: IPU1_SISG2ALT5: GPIO5_IO04ALT6:ALT7: SRC_BOOT_CFG24

NVCC_EIM

AD18 EIM_D27 ALT0: EIM_DATA27ALT1: IPU1_DI1_PIN13ALT2: IPU1_CSI0_DATA00ALT3: IPU2_CSI1_DATA13ALT4: UART2_RX_DATAALT5: GPIO3_IO27ALT6: IPU1_SISG3ALT7: IPU1_DISP1_DATA23

NVCC_EIM

About the ConnectCore 6 Signal usage limitations



AD19 EIM_D26 ALT0: EIM_DATA26ALT1: IPU1_DI1_PIN11ALT2: IPU1_CSI0_DATA01ALT3: IPU2_CSI1_DATA14ALT4: UART2_TX_DATAALT5: GPIO3_IO26ALT6: IPU1_SISG2ALT7: IPU1_DISP1_DATA22

NVCC_EIM

AD20 EIM_D16 ALT0: EIM_DATA16ALT1: ECSPI1_SCLKALT2: IPU1_DI0_PIN05ALT3: IPU2_CSI1_DATA18ALT4: HDMI_TX_DDC_SDAALT5: GPIO3_IO16ALT6: I2C2_SDAALT7:

NVCC_EIM

Note Electrical and timing characteristics of the processor (i.MX6 DualLite/Dual/Quad), PMIC(DA9063), and MCA (MKL14Z32VFT4) can be found in the corresponding datasheets, which are publiclyavailable from the manufacturer.

Signal usage limitationsThe following signals available on ConnectCore 6 pads have a limited usage:

n SD1_CLK (pad L21), SD1_CMD (pad J23), SD1_DAT[3:0] (pads L20, J21, J22 and N24) are onlyavailable externally on modules that don't have Wi-Fi populated.

n SD3_DAT4/BT_UART_RXD (pad C22), SD3_DAT5/BT_UART_TXD (pad D23), SD3_CLK/BT_UART_RTS (pad B21), SD3_CMD/BT_UART_CTS (pad E23) are only available externally on modulesthat don't have Bluetooth populated.

n NANDF_CLE/BT_WAKE (pad E22) is only available externally on modules that don't haveBluetooth populated.

n I2C2_SCL/KEY_COL3 (pad C3) and I2C2_SDA/KEY_ROW3 (pad F2) are used on the module asI2C signals connected to the PMIC and MCA processor. Using these signals externally should bedone with caution, since it could prevent the module from working properly. It is recommendedthat you use another I2C port for connecting external devices to the ConnectCore 6 i.MX6QPmodule in order to avoid excessive bus load.

About the ConnectCore 6 Signal usage limitations


n NANDF_CS1/#MCA_INT (pad H21), CSI0_DAT11/ECSPI2_SS0 (pad A6), CSI0_DAT8/ECSPI2_SCLK (pad D6), CSI0_DAT10/ECSPI2_MISO (pad K5) and CSI0_DAT9/ECSPI2_MOSI (pad D5) areconnected to MCA processor. #MCA_INT is a signal reserved as interrupt between MCAprocessor and i.MX6QP processor. The other signals are a SPI bus shared between i.MX6QPand MCA processor. The usage and availability of these signals is depending on the firmwarerunning in the MCA processor.

n ON/OFF (pad D18) signal is connected to PMIC and MCA.

n #POR (pad E18) is connected to PMIC and i.MX6QP processor.

Specifications for the ConnectCore 6

Electrical characteristics 85Power consumption 85Mechanical specifications 86Environmental specifications 88


Specifications for the ConnectCore 6 Electrical characteristics


Electrical characteristics

Voltage supplies

Parameter Min Typ Max Unit

5 V supply 4.2 5 5.5 V

VCC_LICELL 2.0 3.0 TBD V

LDO3_MCA 1.71 3.3 3.6 V

Note No specific ESD protection components have been implemented on the ConnectCore 6 module.ESD protection level on the module’s I/Os is the same as what is specified in the NXP datasheet. Anyrequired ESD protection must be implemented on the carrier board.

Power consumptionThis section contains data on the power consumption of the ConnectCore 6 system-on-module. Thepower is measured at the input of the SOM, i.e. VSYS input power rail. The power architecture of theSOM requires some of the PMIC regulators to be externally powered. These regulators are powereddirectly from some of the outputs of the PMIC itself (which are fed from VSYS).No external circuitry is powered from any of the output power rails of the SOM, so that the powermeasured at VSYS corresponds to the consumption of the SOM alone.

Note These power consumption numbers should be considered guidelines only, never as fixed orabsolute values. Actual values will depend entirely upon individual setup and system application.

Power consumption use casesThis sections describes the use cases that were used to measure power consumption of theConnectCore 6 system-on-module.

n Suspend System in suspend-to-RAM mode

n Power-off System in power-off with RTC enabled. RTC is running in the PMIC

n IDLE System up and running. Ethernet and wireless disabled

n Decoding video System up and running with the following configuration:l Ethernet and wireless disabled

l HDMI display connected to the system

l CPU decoding 1080p video

n CPU stress System up and running with the following configuration:l Ethernet and wireless disabled

l Hanoi application running

Specifications for the ConnectCore 6 Mechanical specifications


Global power consumptionThe following table list the global power consumption of the ConnectCore 6 system-on-module whenthe system is under the use cases described above:

Digi Embedded Yocto 2.4

Power consumption (mA@5V)

Use case ConnectCore 6

Suspend 144

Power-off 4.8

IDLE 380

Decoding video 577.94

CPU stress 1210

Digi Embedded Yocto 2.2

Power consumption (mA@5V)

Use case ConnectCore 6

Suspend 146

Power-off 4.8

IDLE 380

Decoding video 582

CPU stress 1260

Mechanical specificationsNote that all dimensions are in millimeters.

Specifications for the ConnectCore 6 Mechanical specifications


ConnectCore 6 module weight is 27 grams.There must be a recess in the host PCB to accommodate the components on the bottom side of theSOM.All dimensions are in millimeters.For additional information, see Digi Application Note #31-31-14-x on the Digi technical supportwebsite.

http://ftp1.digi.com/support/documentation/CC6_Carrier_Board_Routing_Pattern.pdf

Specifications for the ConnectCore 6 Environmental specifications


Host PCB footprint

Note Minimum thickness of the host board shall be 2 mm.

Environmental specificationsThe i.MX6QP thermal specification is based onmaximum junction temperature (Tj) of the specificapplication processor variant used. In order to support thermal management assistance throughsoftware, the i.MX6QP processor has a built-in junction temperature sensor/monitor.The table below outlines the three temperature-related operational threshold modes with severityrelated recovery actions as defined in software.

Mode Temperature (Tj) Recovery action

Critical > Max Tj - 5oC Automatic system reboot to protect i.MX6QP from damage

Hot > Max Tj - 15oC i.MX6QP core and GPU frequencies are reducedAdditional actions may be initiated depending on actual systemimplementation

Active < Max Tj - 25oC Limitations applied in Hot mode are removed again

Specifications for the ConnectCore 6 Environmental specifications


Linux - Android usersAt any time, the processor junction temperature can be measured by entering the following shellcommand:

cat /sys/class/thermal/thermal_zone0/temp

Note Depending on the operating system, the junction temperature is displayed in milli °C or °C.

The ConnectCore 6 multichip module was designed to provide customers with unique options tosimplify and support the implementation of thermal management approaches in their designs, asneeded:

n The ConnectCore 6 offers a fully shielded design (including internal thermal compounds) withoptimized heat transfer and heat spreading for specific internal components (processor andPMIC). It is ideally suited for more efficient heat dissipation by providing a single, uniformsurface for thermal management via enclosures, heat sinks or other means.

n The surface mount design of the ConnectCore 6 allows for additional dissipation of heatthrough the carrier board it is mounted on.

Evaluation of the ConnectCore 6 thermal performance has successfully demonstrated that theambient operating temperatures specified can be support by the module. However, actualambient operating temperature performance may vary and is highly dependent on the specificuse-case, such as, enclosure design, system design, i.MX6QP processor variant, GPU/VPUactivity, on-module peripherals used. Your specific system design and application may requireadditional thermal management such as passive (heatsink/-spreader) or active (airflow)cooling at elevated temperatures.

ConnectCore 6 variantAmbient operatingtemperature Storage temperature

Industrial -40 to 85o C -40 to 125o C

Commercial 0 to 70o C -40 to 125o C

Please note that ambient operating temperature ratings are highly dependent on the specific use-case, e.g. enclosure design, system design, i.MX6QP processor variant, GPU/VPU activity,peripherals used. Your specific system design and application may require additional thermalmanagement such as passive (heatsink/-spreader) or active (airflow) cooling.Running over 70° C ambient typically requires the implementation of thermal managementstrategies.

Contact Digi if you need information and/or guidance related to thermal management in your specificapplication.

Assembly instructions Environmental specifications


Assembly instructions

Moisture sensitivity and shelf life 91Mounting 91Solder paste print 91Stencil 91Coplanarity 92SMT pick and place 92SMT process parameter reference 92Reflow profile 92

Assembly instructions Moisture sensitivity and shelf life


Moisture sensitivity and shelf lifeThe ConnectCore 6 module is classified as a Level 3 Moisture Sensitive Device in accordance withIPC/JEDEC J-STD-020.

1. Calculated shelf life in sealed packaging: 12 months at <40° C and <90% relative humidity (RH).

2. Environmental condition during production: 30° C /60% RH according to IPC/JEDEC J-STD -033A, paragraph 5.

3. Maximum time between opening of the sealed packaging and reflow process must not exceed168 hours, based on condition b), IPC/JEDEC J-STD -033A, paragraph 5.2.

4. Baking is required, if conditions 3) or 4) do not apply.

5. Baking is required, if the packaging humidity indicator indicates 10% RH or higher.

6. If baking is required, bake modules in trays 4-6 hours at 125° C; maximum stacking height is 10trays.

MountingThe ConnectCore 6 module has been designed with easy integration into existing SMT processes inmind. Guidance for mounting the module on your carrier board is given in this section of the document.The ConnectCore 6 module is specified for one (1) soldering cycle only. Modules are also not sealedand therefore they should not be subjected to a wash cycle or similar treatment where condensationcould occur. Contact Digi International for additional guidance to discuss conformal coatingapproaches and options, if needed.

Solder PasteThe following solder paste type has been approved for mounting the module on a carrier board:

n SAC305 (Lead-free: Alpha OM-340 Type 4 or equivalent)

Solder paste printThe following solder paste printing parameters are recommended:

n Stencil Thickness: 0.15 mm/5 mil

n Stencil Diameter: One to one of Pad diameter (to +20% of pad)

n Paste alignment: 20% off the padmax (offset <20% pad diameter)

StencilThe recommendation is to use a laser cut and/or electro-formed stencil for placing the ConnectCore 6module. Based on the actual coplanarity characteristics of your carrier board, adjustments may berequired to determine the optimal solder paste volume.It is also recommended to perform an X-ray analysis of the initial production run of your assembly withthe ConnectCore 6. Please contact Digi for additional support.

Assembly instructions Coplanarity


CoplanarityThe coplanarity measured on the ConnectCore 6 is <0.003" bow and twist (98% confidence interval). Itis important that the carrier board is also coplanar. If the carrier board is thinner than theConnectCore 6 it is recommended that the assembly be supported during the reflow process, i.e.reflow fixture should be used to minimize the potential bow of the carrier card.Bow and twist measurements have been done with SmartScope Flash 500 equipment which has a Zaccuracy up to (2.0 + 8L/1000) µm.

SMT pick and placen Placement Nozzle: Large is available on the machine

n Nozzle Pick Surface: Center of Shield on i.MX6QP SOM

n Placement Speed: Slowest speed for the machine

n Placement alignment: 10% of pad diameter (compensating for module weight and supportingalignment). The module should be placed last as part of the assembly/mounting process toeliminate unexpected shifting.

SMT process parameter reference

Process SMT process Specification recommendations

Screen print Solder paste Leaded: Indium NC-SMQ92J / Lead-free: Alpha OM-340

Stencil thickness 0.15 mm / 5 mil

Stencil diameter 1.47 mm / 58mil

Paster alignment 25% off the pad (offset <0.25* diameter

PnP Placement nozzle 0>15 mm vacuum

Nozzle Pick Surface PnP cap center

Speed Slowest speed for the machine

Placement Sequence Place the SoM last

Placement Alignment 50% off the pad (offset <.5* diameter)

Reflow Belt speed 0.6-1.1 m/sec

Refer to SMT profile recommendation in the next page

Reflow profileTime Above Liquidous (TAL) is recommended to be between 56 to 63 seconds. Use of 40AWG K-typethermal couple and M.O.L.E or equivalent thermal profiler is recommended. The first recommendedthermal probe location is on the outer row of pads, to be on the out most row of pins preferably aground pad. The second thermal probe location is on the inner row of pads preferably a signal pad.The following image shows the reflow profile based on a ten-zone oven, with SAC 305 Lead-FreeSolder Paste (Alpha OM-340).

Assembly instructions Reflow profile


The reflow profile shown above is valid for the combination solder paste/reflow machine and Digireference carrier board. Optimization of a reflow profile will depend on the selected solderpaste/reflow machine (reflow or vapor phase) and carrier board design.The ConnectCore 6 i.MX6QP is approved to withstand a total of four reflow cycles. Two reflow cyclesare required for manufacturing the ConnectCore 6 i.MX6QP SOM. Two (2) reflow cycles are remainingfor mounting the module on the carrier board. Digi strongly recommends to solder the ConnectCore 6i.MX6QP module during the last reflow cycles of the carrier boardmanufacturing process.

Regulatory information and certifications

Maximum power and frequency specifications 95United States FCC 95Canada (IC) 98Europe ETSI 99Japan 101


Regulatory information and certifications Maximum power and frequency specifications


Maximum power and frequency specifications

Maximumpower Frequencies

17.5 mW 13 overlapping channels each 22 MHz wide and spaced at 5 MHz. Centered at2.412 to 2.472 MHz.

62.4 mW 165 overlapping channels each 22 or 40 MHz wide and spaced at 5 MHz. Centeredat 5180 to 5825 MHz.

United States FCCThe ConnectCore 6 module complies with Part 15 of the FCC rules and regulations. Compliance withthe labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCCCertification, the OEM must comply with the following regulations:The system integrator must ensure that the text on top side of the module is placed on the outside ofthe final product.ConnectCore 6 module may only be used with antennas approved [refer to the antenna tables in thissection].

WARNING! The Original Equipment Manufacturer (OEM) must ensure that FCC labelingrequirements are met. This includes a clearly visible label on the outside of the finalproduct enclosure that displays the contents shown below. Required FCC Label for OEMproducts containing the ConnectCore 6 module.

For WiFi/Bluetooth variantContains FCC ID: MCQ-CC1MX6BThis device complies with part 15 of the FCC Rules. Operation is subject to the following twoconditions: (1) This device may not cause harmful interference, and (2) this device must accept anyinterference received, including interference that may cause undesired operation.

For WiFi only variantContains FCC ID: MCQ-CC1MX6This device complies with part 15 of the FCC Rules. Operation is subject to the following twoconditions: (1) This device may not cause harmful interference, and (2) this device must accept antinterference received, including interference that may cause undesired operation.

FCC noticesIMPORTANT: The ConnectCore 6 module has been certified by the FCC for use with other productswithout any further certification (as per FCC section 2.1091). Modifications not expressly approved byDigi could void the user's authority to operate the equipment.IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section 15.107& 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules.IMPORTANT: The ConnectCore 6 module has been certified for remote and base radio applications. Ifthe module will be used for portable applications, the device must undergo SAR testing. Thisequipment has been tested and found to comply with the limits for a Class B digital device, pursuant

Regulatory information and certifications United States FCC


to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection againstharmful interference in a residential installation. This equipment generates uses and can radiate radiofrequency energy, and if not installed and used in accordance with the instructions, may cause harmfulinterference to radio communications. However, there is no guarantee that interference will not occurin a particular installation. If this equipment does cause harmful interference to radio or televisionreception, which can be determined by turning the equipment off and on, the user is encouraged to tryto correct the interference by one or more of the following measures: Re-orient or relocate thereceiving antenna, Increase the separation between the equipment and receiver, Connect equipmentand receiver to outlets on different circuits, or Consult the dealer or an experienced radio/TVtechnician for help.

FCC-approved antennasThe ConnectCore 6 can be installed utilizing antennas and cables constructed with non-standardconnectors (RPSMA, RPTNC, and so on).The modules are FCC approved for fixed base station andmobile applications for the channelsindicated in the tables below. If the antenna is mounted at least 20 cm (8 in) from nearby persons, theapplication is considered a mobile application. Antennas not listed in the table must be tested tocomply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247 (Emissions).The antennas in the tables below have been approved for use with this module. Digi does not carry allof these antenna variants. Contact Digi Sales for available antennas.

Antennas approved for use with the ConnectCore 6 Wi-Fi modules

Omni- directional antennas

Part number Type (description)Peak Gain2.4 GHz

Peak Gain5 GHz

Digi InternationalA24-HASM-450

Dipole (articulated RPSMA, 2.4 GHzantenna)

1.8 dBi

Linx Technologies Inc ANT-DB1-RAF-RPS

Dipole (articulated RPSMA, 2.4 GHz and5 GHz antenna)

2.5 dBi 4.6 dBi

Yageo ANTX100P001B24003 2.4 GHz PCB antenna 4 dBi (@2.4GHz)4.4 dBi(@2.45 GHz)4.1 dBi (@2.5GHz)

Ethertronics 1001932 2.4 - 5 GHz PCB antenna 1.5-2.5 dBi 3-5 dBi

Note If using the RF module in a portable application (for example - if the module is used in a hand-held device and the antenna is less than 20 cm (8 in) from the human body when the device is inoperation): The integrator is responsible for passing additional SAR (Specific Absorption Rate) testingbased on FCC rules 2.1091 and FCC Guidelines for Human Exposure to Radio FrequencyElectromagnetic Fields, OET Bulletin and Supplement C. The testing results will be submitted to theFCC for approval prior to selling the integrated unit. The required SAR testing measures emissionsfrom the module and how they affect the person.

Regulatory information and certifications United States FCC


RF exposure

CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, aseparation distance of 20 cm (8 in) or more should be maintained between the antennaof this device and persons during device operation. To ensure compliance, operations atcloser than this distance are not recommended. The antenna used for this transmittermust not be co-located in conjunction with any other antenna or transmitter. Thepreceding statement must be included as a CAUTION statement in OEM productmanuals in order to alert users of FCC RF Exposure compliance.

Regulatory information and certifications Canada (IC)


Canada (IC)This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject tothe following two conditions: (1) this device may not cause interference, and (2) this device mustaccept any interference, including interference that may cause undesired operation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exemptsde licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pasproduire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectriquesubi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Labeling requirementsLabeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label onthe outside of the final product enclosure must display the following text:

For WiFi/Bluetooth variantContains Model ConnectCore 6 Radio, IC: 1846A-CCIMX6B

For WiFi only variantContains Model ConnectCore 6 Radio, IC: 1846A-CCIMX6The integrator is responsible for its product to comply with IC ICES-003 & FCC Part 15, Sub. B -Unintentional Radiators. ICES-003 is the same as FCC Part 15 Sub. B and Industry Canada acceptsFCC test report or CISPR 22 test report for compliance with ICES-003.

Transmitters with detachable antennasThis radio transmitter (IC: 1846A-CCIMX6 / IC: 1846A-CCIMX6B) has been approved by IndustryCanada to operate with the antenna types listed in the table above with the maximum permissiblegain and required antenna impedance for each antenna type indicated. Antenna types not included inthis list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.Le présent émetteur radio (IC: 1846A-CCIMX6 / IC: 1846A-CCIMX6B) a été approuvé par IndustrieCanada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissiblemaximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus danscette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pourl'exploitation de l'émetteur.Under Industry Canada regulations, this radio transmitter may only operate using an antenna of atype andmaximum (or lesser) gain approved for the transmitter by Industry Canada. To reducepotential radio interference to other users, the antenna type and its gain should be so chosen that theequivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successfulcommunication.Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionneravec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par IndustrieCanada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autresutilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnéeéquivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communicationsatisfaisante.

Regulatory information and certifications Europe ETSI


Europe ETSI

The ConnectCore 6 module has been certified for use in several European countries. For a completelist, refer to www.digi.com.If the ConnectCore 6 module is incorporated into a product, the manufacturer must ensurecompliance of the final product with articles 3.1a and 3.1b of the RE Directive (Radio EquipmentDirective). A Declaration of Conformity must be issued for each of these standards and kept on file asdescribed in the RE Directive (Radio Equipment Directive).Furthermore, the manufacturer must maintain a copy of the ConnectCore 6 Hardware Referencemanual documentation and ensure the final product does not exceed the specified power ratings,antenna specifications, and/or installation requirements as specified in the user manual. If any ofthese specifications are exceeded in the final product, a submission must be made to a notified bodyfor compliance testing to all required standards.

OEM labeling requirementsThe CEmarking must be affixed to a visible location on the OEM product.

CE labeling requirements

The CE mark shall consist of the initials CE taking the following form:n If the CE marking is reduced or enlarged, the proportions given in the above graduated

drawing must be respected.

n The CE marking must have a height of at least 5mm except where this is not possible onaccount of the nature of the apparatus.

n The CE marking must be affixed visibly, legibly, and indelibly.

Declarations of ConformityDigi has issued Declarations of Conformity for the ConnectCore 6 module concerning emissions, EMC,and safety. For more information, see http://www.digi.com/resources/certifications.

Important noteDigi customers assume full responsibility for learning andmeeting the required guidelines for eachcountry in their distribution market. Refer to the radio regulatory agency in the desired countries ofoperation for more information.

http://www.digi.com/

http://www.digi.com/resources/certifications

Regulatory information and certifications Europe ETSI


Approved antennasThe same antennas have been approved for Europe as stated in the FCC table for use with theConnectCore 6module.

Regulatory information and certifications Japan


Japanこの製品は、周波数帯域5.15~ 5.35 GHz で動作しているときは、屋内においてのみ使用可能です。This device has been granted a designation number by Ministry of Internal Affairs andCommunications according to:Ordinance concerning Technical Regulations Conformity Certification etc. of Specified RadioEquipment (特定無線設備の技術基準適合証明等に関する規則).

n Article 2, Paragraph 1, Item 19, 19-3, 19-3-2 Category: WW, XW, YW

n Model/Name of equipment: ConnectCore 6 (i.MX6QP)

n Radio label marking: R209-J00137This device should not be modified (otherwise the granted designation number will be invalid).

connectcore® for i.mx6 hardware reference manual · pdf filedat5/ bt_uart_ txd alt0:sd3_...

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