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TRANSCRIPT
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CONTENTS
WELCOME FROM THE GENERAL CHAIR ................................................................................1
CONFERENCE ORGANIZERS......................................................................................................2
CONFERENCE CHAIRS.................................................................................................................3
ADVISORY COMMITTEE .............................................................................................................3
SECRETARY GENERAL ................................................................................................................4
ORGANIZING COMMITTEE.........................................................................................................4
TECHNICAL COMMITTEE ...........................................................................................................4
Session 1 -- Advanced Packaging & System Integration ............................................................5
Session 2 -- Packaging Materials & Processes............................................................................5
Session 3 -- Packaging Design & Modeling................................................................................6
Session 4 -- High Density Substrate & SMT...............................................................................6
Session 5 -- Advanced Manufacturing & Packaging Equipment ................................................7
Session 6 -- Quality & Reliability ...............................................................................................7
Session 7 -- Solid State Lighting Packaging and Integration ......................................................8
Session 8 -- Emerging Technologies ...........................................................................................8
Poster Session..............................................................................................................................8
OVERVIEW OF CONFERENCE PROGRAM ...............................................................................9
OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE................................................10
Monday, August 8, 2011 .......................................................................................................................10
Introduction of PDC Lecturers ..................................................................................................10
OVERVIEW OF TSV / ITRS FORUM ..........................................................................................12
Monday, August 8, 2011 .......................................................................................................................12
Introduction of TSV Forum Speakers .......................................................................................13
Introduction of ITRS .................................................................................................................13
OVERVIEW OF INVITED PLENARY KEYNOTES ...................................................................14
Tuesday, August 9, 2011 .......................................................................................................................14
Introduction of Invited Plenary Keynote Speakers ...................................................................14
OVERVIEW OF INVITED SESSION KEYNOTES.....................................................................17
Wednesday, August 10, 2011 ................................................................................................................17
Thursday, August 11, 2011....................................................................................................................18
Introduction of Invited Session Keynote Speakers ...................................................................18
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OVERVIEW OF ORAL PRESENTATION SESSIONS ................................................................21
Wednesday, August 10, 2011 ................................................................................................................21
Thursday, August 11, 2011....................................................................................................................22
ORAL SESSIONS ..........................................................................................................................23
Wednesday, August 10, 8:00AM – 9:20AM .........................................................................................23
Wednesday, August 10, 10:20AM – 12:10PM......................................................................................24
Wednesday, August 10, 13:10PM – 14:50PM.......................................................................................26
Wednesday, August 10, 15:50PM – 17:30PM.......................................................................................27
Thursday, August 11, 8:00AM – 9:20AM.............................................................................................29
Thursday, August 11, 10:20AM – 12:10PM .........................................................................................30
OVERVIEW OF POSTER PRESENTATION SESSIONS ............................................................32
Poster Session 1 – August 10, Wednesday 09:20AM--10:20AM .........................................................32
Poster Session 2 – August 10, Wednesday 14:50PM--15:50PM...........................................................32
Poster Session 3 – August 11, Thursday 9:20AM--10:20AM...............................................................32
POSTER SESSION 1 .....................................................................................................................33
Wednesday, August 10, 9:20AM – 10:20AM .......................................................................................33
POSTER SESSION 2 .....................................................................................................................36
Wednesday, August10, 14:50PM – 15:50PM........................................................................................36
POSTER SESSION 3 .....................................................................................................................39
Thursday, August 11, 9:20AM – 10:20AM...........................................................................................39
CONFERENCE GUIDELINE........................................................................................................42
TRANSPORTATION......................................................................................................................44
TRANSPORTATION MAP ............................................................................................................45
LAYOUT OF CONFERENCE MEETING ROOMS.....................................................................46
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WELCOME FROM THE GENERAL CHAIR
Started in 1994, the International Conference on Electronic Packaging Technology (ICEPT), sponsored by Electronics
Manufacturing and Packaging Technology Society (EMPT), under the leadership of Chinese Institute of Electronics (CIE),
has been holding 11 times in Beijing, Shanghai, Shenzhen and Xi’an. This international conference provides a
communication platform for experts, researchers, engineers from industry and academy, to exchange the new ideas and
emerging technologies on electronics packaging.
ICEPT-HDP 2011, organized by Shanghai University and co-organized by ASTRI, Hong Kong, China, will be held in
Shanghai from August 8 to 11, 2011. More than 320 abstracts were received and approx. 280 papers were accepted for oral
and poster presentation. On behalf of the conference organizers, I would like to express our sincere welcome and thanks to
our guests, authors and delegates from more than 20 countries and regions, we look forward to meeting with you in
Shanghai.
China’s semiconductor industry was initiated in 1956 by the National Science & Technology Program. With the 50
years’ development, it becomes the pillar industry of China. Nowadays, there are over 1000 companies in the
semiconductor industry, among them over 250 companies’ key businesses are related to electronics packaging. In 2010, the
IC units shipment was approx. 65 billion with the sales revenues of approx. RMB 144 billion, while the discrete units
shipment was approx. 274 billion with the sales revenues of approx. RMB 100 billion. Over the decades, 6 key
semiconductor industrial bases were established, including Yangtze River Delta, Pearl River Delta, Around Bohai Gulf
Area, Midwest Region, Old Industrial Base of Northeast China, Guanzhong – Tianshui Economic Zone. This year is the
first year of China’s 12th Five-Year-Plan, four industrial policies, e.g., electronics production promotion, were launched,
creating new opportunities to this industry.
In order to narrow the technology gap between China and the western developed countries, China packaging industry
has to highly focus on the development of the advanced packaging technologies, such as TSV, SiP, WLP, FC, 3D
integration, etc..
We wish this conference will be a good communication platform for all the participants to exchange novel ideas,
explore new collaborations and promote the global electronics packaging industry to face the historical challenge and
opportunity.
Also, we hope this conference can enhance the long-term relationship and close collaboration on the electronics
packaging between EMPT and other international organizations, such as IEEE-CPMT, IMAPS, iNEMI, ECTC, ESTC and
EPTC.
Lastly, we are pleased to inform you that the ICEPT-HDP 2012 will be held in Guilin, China, we look forward to
seeing you in Shanghai this August and in Guilin next year.
Prof. Keyun BI, General Chair of ICEPT-HDP 2011
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CONFERENCE ORGANIZERS（会议组织结构） Directed by 会议指导单位 Department of Higher Education, Ministry of Education,
China
中华人民共和国教育部高等教育司
Department of Telecommunication, Ministry of Industry
and Information Technology, China
中华人民共和国工业和信息化部电子信息司
China International Culture Exchange Center, China 中国国际文化交流中心
Science and Technology Commission of Shanghai
Municipality, China
上海市科学技术委员会
Sponsored by 会议主办单位 Chinese Institute of Electronics, China 中国电子学会
IEEE Component, Packaging, &Manufacturing
Technology Society (IEEE-CPMT)
国际电气电子工程师联合会电子元件封装和生产技术
学会
Organized by 会议承办单位 Electronic Manufacturing & Packaging Technology
Society of the Chinese Institute of Electronics, China
中国电子学会电子制造与封装技术分会
Shanghai University, China 上海大学
Co-organized by 会议协办单位 Key Laboratory of Advanced Display and System
Applications of Ministry of Education, Shanghai
University, China
新型显示及应用集成教育部重点实验室（上海大学）
Shanghai R&D Public Service Platform for Advanced
display Design, Manufacturing and System Integration
上海市新型显示设计制造与系统集成专业技术服务平
台
Applied Science & Technology Research Institute
(ASTRI), Hong Kong, China
Beijing Faith Consulting Co., Ltd., China
中国香港特别行政区香港应用科技研究院
北京菲尔斯信息咨询有限公司
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CONFERENCE CHAIRS（大会主席） General Chair
Keyun BI Director of China Institute of Electronics (CIE), China
President of Electronics Manufacturing & Packaging
Technology Society (EMPT), CIE, China
President of Electronics Packaging Society, CSIA, China
Co-chairs Min WANG Vice President, Shanghai University, China
Rolf ASCHENBRENNER President of IEEE-CPMT, USA
Deputy Director of IZM, Fraunhofer, Germany
William T. CHEN Former President of IEEE-CPMT
Senior Director of ASE, USA
Kouchi ZHANG Senior Director and Fellow of Philips Lighting
Prof. of Delft University of Technology, Netherlands
ADVISORY COMMITTEE（顾问委员会） Shichang ZOU
Academician of CAS; President of Shanghai Integrated
Circuit Industry Association, China
Juyan XU
Academician of CAE; Honorary Director of No. 58
Institute of CETC, China
C. P. WONG
Dean of School of Eng., CUHK, Hong Kong, China
Prof. of Georgia Institute of Technology, USA
Rao TUMMALA
Pettit Chair Prof. & Director of Packaging Research Center,
Georgia Institute of Technology, USA
Michael PECHT Director of CALCE, Prof. of Univ. of Maryland, USA
James MORRIS Prof. of Portland State University, USA
Johan LIU
Prof. of Shanghai University, China; Prof. of Chalmers
Univ. of Science & Technology, Sweden; Member of Royal
Swedish Academy of Engineering, Sweden
Xuejun FAN Prof. of Lamar University, USA
Tadatomo SUGA Prof. of University of Tokyo, Japan
Guoqiang DAI
Deputy Director, Ministry of Science & Technology of the
People’s Republic of China
Wenwu DING
Deputy Director, Ministry of Industry and Information
Technology of the People’s Republic of China
Rulin LIU General Executive Director of CIE, China
Shouwen YU Former Vice President of Tsinghua University, China
Yintang YANG Vice President of Xidian University, China
Tianchun YE General Director of IME, CAS, China
Dongkai SHANGGUAN Vice President, Flextronics International, USA
Ricky S. W. LEE Prof. of HKUST, Hong Kong, China
Kees BEENAKKER Director, Delft University of Technology, Netherlands
Roger HOSKENS Director, Philips Lighting, Netherlands
Jusheng MA Prof. of Tsinghua University, China
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Yifan GUO R&D Director, Skyworks, USA
Jie XUE Director, Cisco Systems Inc., USA
Kuoning CHIANG Prof. of National Tsinghua University, Taiwan, China
Ephraim SUHIR Prof. of University of California, USA
Moowhan SHIN Prof. of Myongji University, Republic of Korea
SECRETARY GENERAL（大会秘书长） Xicheng WEI Prof. of Shanghai University, China
Qing LI EMPT, CIE, China
ORGANIZING COMMITTEE（组织委员会） Chair
Jianhua ZHANG Shanghai University, China
Co-chairs Xiang WU CETC, China
Lixi WAN Institute of Microelectronics, CAS, China
Bill LI JCAP, China
Ming LI Shanghai JiaoTong University, China
Chunqing WANG Harbin Institute of Technology, China
Yiping WU Huazhong University of Science & Technology, China
James CAI Tsinghua University, China
Fei XIAO Fudan University, China
Xingsheng LIU Xi’an Institute of Optics & Precision Mechanics,China
Tim CHEN YanTai Darbond Electronics Materials Co., Ltd, China
Hao TANG Nantong Fujitsu Microelectronics Co., Ltd, China
Secretary Xingzao HUANG Beijing Faith Consulting Co., Ltd, China
Gang HUANG Beijing Faith Consulting Co., Ltd, China
Zhen LI EMPT, CIE, China
Yan ZHANG Shanghai University, China
TECHNICAL COMMITTEE（技术委员会） Chair
Dr. Daniel SHI R&D Director, ASTRI, Hong Kong, China
Co-chairs Prof. Jianhua ZHANG Shanghai University, China
Dr. Andy TSENG ASE, USA
Prof. Chris BAILEY University of Greenwich, UK
Mr. T. ONISHI GJ Tech, HK, China
Dr. TongYan TEE Deputy R&D Director, Nepes, Singapore
Prof. Sheng LIU Huazhong University of Science & Technology, China
Dr. Chiming LAI JCAP, China
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Chiar for PDC & Forum Wenhui ZHU CTO, TSHT, China
SecretaryJinsong ZHANG Shanghai University, China
Ms. Tina YANG ASTRI, Hong Kong, China
Xiuzheng LU Shanghai University, China
Yang LIN Shanghai University, China
Session 1 -- Advanced Packaging & System Integration Chairs
Dr. Lixi WAN IMECAS, China
Dr. Bing DANG IBM, USA
Members Prof. Yufeng JIN Peking University, China
Prof. GS KIM Kangnam University, Republic of Korea
Dr. Yishao LAI ASE, Taiwan, China
Dr. Shan LEI IBM, USA
Prof. Gang DONG Xidian University, China
Dr. Wei LIN Amkor, USA
Dr. Charlie LU Altera, Taiwan,, China
Dr. Klaus PRESSEL Infineon, Germany
Dr. Ivan SHAM ASTRI, Hong Kong, China
Dr. Cheng YANG Intel, China
Dr. Charlie ZHAI Nvidia, USA
Dr. Herb HUANG SMIC, China
Dr. Daniel YU WLCSP, China
Dr. Robert LO ITRI, Taiwan, China
Dr. Yann GUILLOU ST, France
Dr. Boping WU Intel, USA
Session 2 -- Packaging Materials & Processes Chairs
Prof. Ming LI Shanghai Jiaotong University, China
Dr. Jerry LU Intel, USA
Members Dr. Kejun ZENG TI, USA
Dr. Daniel LU Henkel, China
Prof. Liangliang LI Tsinghua University, China
Dr. Xinyu DU Henkel, USA
Prof. Zhong CHEN Nanyang Technological University, Singapore
Prof. Guoyuan LI South China University of Technology, China
Prof. Guangbin DOU Imperial College of London, UK
Prof. Jeng-Gong DUH Tsinghua University, Tai Wan, China
Prof. Anmin HU Shanghai Jiaotong University, China
Prof. Changqing LIU Loughborough University, UK
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Prof. Young-Bae PARK Andong National University, Republic of Korea
Prof. Yanhong TIAN Harbin Institute of Technology, China
Mr. Itsuo WATANABE Hitachi Chemicals, Japan
Dr. Rong SUN SIAT, China
Mr. Su WANG Sinyang, China
Dr. Hengyun ZHANG Dowcorning, China
Dr. Hong Meng HO SemiWire, Singapore
Prof. Xicheng WEI Shanghai University, China
Session 3 -- Packaging Design & Modeling Chairs
Prof. Fei QIN Beijing University of Technology, China
Dr. Wenhui ZHU CTO, TSHT, China
Members Dr. Yong LIU Fairchild, USA
Dr. Juergen AUERSPERG IZM, Germany
Dr. Zhongping BAO Qualcomm, USA
Dr. Willem van DRIEL NXP, Netherlands
Prof. Haibo FAN HKUST, Hong Kong, China
Dr. Jingen LUAN ST, Singapore
Dr. Heinz PAPE Infineon, Germany
Dr. Lianxi SHEN Nvidia, USA
Dr. Bin XIE ASTRI, China
Dr. Hongfei YAN Intel, USA
Dr. Xiaohu YAO South China University of Technology, China
Dr. Xiaowu ZHANG IME, Singapore
Dr. Jeff ZHAO TI, USA
Dr. Jiangtao ZHENG IBM, USA
Dr. Jack HU Wuhan University, China
Dr. Wenchao Tian Xidian University, China
Mr. Barry BAI 3DS, China
Dr. Sommer Fraunhofer, Germany
Dr. Xiujuan ZHAO Philips, Netherlands
Prof. Hua LU Greenwich University, UK
Dr. Yan ZHANG Shanghai University, China
Prof. Xinping ZHANG South China University of Technology, China
Dr. Qing ZHOU Intel, china
Session 4 -- High Density Substrate & SMT Chairs
Dr. Paul WANG Mitac, Tai Wan, China
Prof. Mingyu LI Harbin Institute of Technology, China
Members Dr. C.Q. CUI Compass Technology, China
Prof. Mingliang HUANG Dalian University of Technology, China
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Prof. Yuming WANG Tsinghua University, China
Dr. Jianhua WU Anadigics, USA
Dr. Hong XIE Intel, USA
Dr. Youzhi XU Intel, USA
Prof. K.C. YUNG HKUST, Hong Kong, China
Dr. Xiangyin ZENG LSI, China
Dr. Youhong WU Ibiden, Japan
Session 5 -- Advanced Manufacturing & Packaging Equipment Chairs
Mr. KH Tan JCAP, China
Dr. Chang ZHOU SMEE, China
Members Dr. Li-Qiang CAO IMECAS, China
Dr. Guohua GAO Fujitsu-NT, China
Dr. Edward FENG Linde Gas, China
Prof. Xuefeng SHU Taiyuan University of Technology, China
Dr. James-Jian ZHANG Numonyx, USA
Mr. Hai WU Intel, China
Dr. Hong WANG Sinyang, China
Dr. Li GONG SUSS, China
Prof. Fuliang WANG Central South University, China
Session 6 -- Quality & Reliability Chairs
Prof. Daoguo YANG Guilin University of Electronic Technology, China
Prof. Chris BAILEY University of Greenwich, UK
Members Prof. Chunqing Wang Harbin Institute of Technology, China
Dr. Xiuzhen LU Shanghai University, China
Prof. Dongyan DING Shanghai Jiaotong University, China
Prof. H.C. CHENG Feng Chia University, Tai Wan, China
Dr. Klaus GALUSCHKI Siemens Limited China
Dr. Zezhong FU Intel, China
Prof. Fu GUO Beijing University of Technology, China
Dr. Dongming HE Intel, USA
Prof. B.T. HAN University of Maryland, USA
Dr. Xingjia HUANG Intel, China
Dr. Xiaohu LIU IBM, USA
Dr. Keith NEWMAN Sun Microsystems, USA
Prof. Jun WANG Fudan University, China
Dr. Dongji XIE Flextronics, USA
Dr. Zhen ZHANG Microsoft, USA
Dr. Liping ZHU TriQuint, USA
Ms. Gieven DAI Intel, China
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Mr. Jeffrey LEE IST, Tai Wan, China
Dr. Ming XUE Infineon, Singapore
Session 7 -- Solid State Lighting Packaging and Integration Chairs
Prof. Sheng LIU Huazhong University of Science & Technology, China
Mr. T. ONISHI GJ Tech, Hong Kong, China
Dr. ReintsBok Aernout Philips Innovation Campus Shanghai, Netherlands
Members Mr. Chunjian FENG Hebei Semi. RI, China
Prof. Xu CHEN Tianjin University, China
Prof. Yuhua CHENG PKU-SHRIME, China
Prof. Ricky LEE HKUST, Hong Kong, China
Dr. Ming LI ASM, Hong Kong, China
Prof. Peng JIN Shenzhen Graduate School of Peking Univ., China
Mr. Lebbai MOHAMED Philiphs, Singapore
Dr. Lianqiao YANG Shanghai University, China
Dr. Weiqiao Yang Shanghai Solid State Lighting Center, China
Session 8 -- Emerging Technologies Chairs
Prof. James CAI Tsinghua University, China
Dr. Andy TSENG ASE, USA
Members Prof. Jim LEU Chiao Tung University, Tai Wan, China
Prof. Jintang SHANG Southeast University, China
Prof. K. SUGANUMA Osaka University, Japan
Dr. Yinghui WANG Tokyo University, Japan
Dr. Zhenfeng WANG SIMTech, Singapore
Dr. Tieyu ZHENG Intel, USA
Prof. Le LUO CAS, China
Prof. Yiping WU Huazhong University of Science & Technology, China
Prof. Changhai Wang Heriot-Watt University, UK
Poster Session Chairs
Dr. Jinsong ZHANG Shanghai University, China
Dr. Xiuzhen LU Shanghai University, China
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OVERVIEW OF CONFERENCE PROGRAM（会议议程总览） Date Time Room 1 Room 2 Room 3
08:30--12:30 PDC-1 PDC-3 --
12:30--13:30 Lunch (for PDC only)
13:30--17:30 PDC-2 PDC-4 --
13:00--17:30 -- -- TSV / ITRS Forum
Aug. 8
18:00--20:00 Dinner
Date Time Multifunctional Hall Chair 08:30--09:30 Opening Ceremony Prof. Song WU, Vice President of Shanghai University, China
09:30--10:40 Plenary Session A (2 Plenary Keynotes) Dr. William CHEN, Senior Director of ASE, USA
10:40--11:10 Coffee Break
11:10--12:20 Plenary Session A (2 Plenary Keynotes) Dr. William CHEN, Senior Director of ASE, USA
12:20--13:30 Lunch
13:30--15:15 Plenary Session B (3 Plenary Keynotes)Prof. Johan LIU, Shanghai University, China; University of
Science & Technology, Sweden
15:15--15:45 Coffee Break
15:45--18:05 Plenary Session B (4 Plenary Keynotes) Prof. Xuejun FAN, Lamar University, USA
Aug. 9
18:30--20:30 Banquet
Date Time Room 1 Room 2 Room 3 Room 4 Room 5
08:00--09:20 Oral Session 1
(4 papers)
Oral Session 2
(4 papers)
Oral Session 3
(4 papers)
Oral Session 4
(4 papers)
Oral Session 5
(4 papers)
09:20--10:20 Poster Session 1, Exhibition & Coffee Break
(53 posters for this time slot)
10:20--12:10
Oral Session 6
(1 invited talk
+4 papers)
Oral Session 7
(1 invited talk
+4 papers)
Oral Session 8
(1 invited talk
+4 papers)
Oral Session 9
(1 invited talk
+4 papers)
Oral Session 10
(1 invited talk
+4 papers)
12:10--13:10 Lunch
13:10--14:50 Oral Session 11
(5 papers)
Oral Session 12
(5 papers)
Oral Session 13
(5 papers)
Oral Session 14
(5 papers)
Oral Session 15
(5 papers)
14:50--15:50 Poster Session 2, Exhibition & Coffee Break
(55 posters for this time slot)
15:50--17:30
Oral Session 16
(1 invited talk
+3 papers)
Oral Session 17
(1 invited talk
+3 papers)
Oral Session 18
(1 invited talk
+3 papers)
Oral Session 19
(5 papers)
Oral Session 20
(5 papers)
Aug. 10
18:00--20:00 Dinner
Date Time Room 1 Room 2 Room 3 Room 4 Room 5
08:00--09:20 Oral Session 21
(4 papers)
Oral Session 22
(4 papers)
Oral Session 23
(4 papers)
Oral Session 24
(4 papers)
Oral Session 25
(4 papers)
09:20--10:20 Poster Session 3, Exhibition & Coffee Break
(52 posters for this time slot)
10:20--12:10
Oral Session 26
(1 invited talk
+4 papers)
Oral Session 27
(1 invited talk
+4 papers)
Oral Session 28
(1 invited talk
+4 papers)
Oral Session 29
(1 invited talk
+4 papers)
Oral Session 30
(1 invited talk
+4 papers)
12:10--13:40 Lunch and Awards
Aug. 11
13:40--15:00 Technical Forum
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OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE
Monday, August 8, 2011
Venue Time Topic Speaker
Prof. Bill CHEN
Tsinghua University, China08:30--12:30
PDC-1
Signal Integrity and Power Integrity Design for
Advanced Electronic Packaging Dr. Jiangqi HE
Intel,USA 12:30--13:30 Lunch
Dr. Yong LIU Fairchild, USA
Room 1
13:30--17:30
PDC-2
Thermo-mechanical Modeling & Simulation of
Electronics Packaging & Its Applications Prof. Sheng LIU
HUST, China
Dr. Ningcheng LEE
Indium,USA 8:30--12:30
PDC-3
Achieving High Reliability of Lead-free
Soldering and Flip Chip 3D/TSV Packaging &
Materials Consideration Dr. Tim CHEN
Darbond, China
12:30--13:30 Lunch
Dr. Tong Yan TEE
Nepes, Singapore
Room 2
13:30--17:30
PDC-4
Wafer Level Package – Design for Reliability &
Advanced Failure Analysis Mr. Ming XUE
Infineon, Singapore
Introduction of PDC Lecturers Prof. Bill CHEN Tsinghua University, China
Dr. Bill Chen is a professor and the head of Department of Information Technology of Yangtze Delta Region Institute of Tsinghua University, Zhejiang. He received his BS and MS degrees from Tsinghua University, China, in 1990 and 1993 respectively, and his PhD from Texas A&M University, USA in 1996. Recently, He was a senior manager with Cisco systems Inc, worked on high performance datacenter networking product design. Previously he was an engineering manager at Andiamo Systems, Inc.. Before that, he worked for Raza Foundries, Inc., Nplab, Inc. and Texas Instruments, Inc.. His main research interests include high performance networking system architectures, high performance low power ASIC technologies, high speed system signal integrity and power integrity design methodologies.
Dr. Jiangqi HE Intel, USA
Dr. Jiangqi He is a senior staff engineer of Enterprise Platform Technology Development Division, Intel. He obtained his BS from Xiamen University and PhD from Duke University, in 1992 and 2000 respectively. After that, Dr. He has been worked on packaging technology, power integrity, signal integrity and system level electrical design for more than 10 years at Intel. He has been an active liaison working with multiple universities such as Georgia Tech, University of Arizona, University of Washington and ASU on researches for electrical packaging and system through SRC funding. Dr. He has published more than 40 papers and holds more than 45 patents. He is an IEEE senior member and his current interests are on efficient power delivery technology for high performance computing, on-die & on package power integrity and high frequency power noise versus signaling.
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Dr. Yong LIU Fairchild, USA
Dr. Yong Liu is a Senior Member Technical Staff of Fairchild Semiconductor Corp in South Portland, USA. He is also a Fairchild global team leader of electrical, thermal-mechanical modeling and analysis. His main interest area is advanced IC packaging, modeling and simulation, reliability and assembly process. He has been invited to give keynotes talks and presentations at international conferences Eurosime, ICEPT-HDP, EPTC and universities in US, Europe and China. He has co-authored over 140 papers and filed over 40 US patents. Dr. Liu obtained his BS, MS and PhD degrees in Nanjing University of Science and Technology in 1983, 1987 and 1990 respectively. After that, Dr. Liu studied and worked at different organizations including Zhejiang University of Technology, China in 1994, Tech University of Braunschweig, Germany in 1995, University of Cambridge, England in 1997, and Rensselaer Polytechnic Institute, USA in 1998 and Nortel Networks,
USA in 2000. Since he joined Fairchild in 2001, he was awarded the first Fairchild President Award in 2008, Fairchild Key Technologist in 2006 and 2009, Fairchild BIQ award in product innovation in 2005, and Fairchild award for power of pen first place in 2004. Dr. Liu is currently an IEEE Senior member and has been actively in technical committees of IEEE ECTC, EuroSime, ESREF, ESTC, EPTC and ICEPT.
Prof. Sheng LIU HUST, China
Prof. Sheng Liu is a Changjiang scholar professor of Mechanical Engineering at Huazhong University of Science and Technology, China. He once was a tenured faculty at Wayne State University, USA. He has over 18 years experience in LED/MEMS/IC packaging. He once won prestigious White House/NSF Presidential Faculty Fellow Award in 1995, ASME Young Engineer Award in 1996, NSFC Overseas Young Scientist Award in 1999, IEEE CPMT Exceptional Technical Achievement Award in 2009, and Chinese Electronic Manufacturing and Packaging Technology Society Special Achievement Award in 2009. He has been an associate editor of IEEE Transaction on Electronic Packaging Manufacturing since 1999 and an associate editor of Journal of Frontiers of Optoelectronics in China since 2007. He is currently one of 11 National Committee Members in LED under Ministry of Science and Technology of China from 2006-2011. He obtained his PhD from
Stanford University in 1992, his MS and BS degrees from Nanjing University of Aeronautics and Astronautics in 1986 and 1983 respectively. He is ASME Fellow. He has filed and owed more than 100 patents in China and USA, and has published more than 400 technical papers, has given more than 100 keynotes and invited talks, edited more than 9 proceedings in English for ASME and IEEE.
Dr. Ningcheng LEE Indium, USA
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder materials for SMT industries. He received his PhD from University of Akron in 1981, and a BS from National Taiwan University in 1973. Dr. Lee is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies”, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials”. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI and SMTA international conferences, and 2008 award from IPC for Honorable Mention Paper: USA Award of APEX conference. He was honored as 2002 SMTA Member of Distinction, and received 2003 Lead-free
Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the SMTA board of directors.
Dr. Tim CHEN Darbond, China
Dr. Tim Chen is currently the general manager of Darbond Electronic Materials, China. He is elected as a “Thousand Talents Plan” distinguished scholar by China central government, as well as a “Taishan Scholar” overseas distinguished scholar by Shandong provincial government in 2010. He was the Global Business Director of Packaging for Honeywell Electronic Materials. Prior to joining Honeywell, Dr. Chen worked at Henkel Corp in Asia as the Greater China General Manager for Electronic material business. Prior to Henkel, he had 15 years work experience in the US and held positions at Intel, BP AMOCO Polymers. Dr. Chen received his PhD from University of Nebraska-Lincoln. He had a Post-Doctor Research Associate experience with Professor Alex Jen, he has been working on electronics materials, opto-electronic materials and electronic packaging areas for 20 years. He has more than 50 scientific and technical publications in electronic materials, processes, and applications, especially in semiconductor area and holds more than 40 US patents in the field.
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Dr. Tong Yan TEE Nepes, Singapore
Dr. Tong Yan Tee has over 15 years of working experience in semiconductor industry, mainly on IC packaging in the areas of R&D management, capability development and strategic planning. He is Deputy R&D Director of Nepes Singapore, heading the R&D of 12-inch wafer bumping, wafer level packaging, and emerging technologies. Previously he has worked in Hewlett Packard, Institute of Microelectronics, STMicroelectronics, and Amkor Technology on various technical and management positions. Throughout his career, Dr. Tee has won 13 ST Corporate Awards for his achievement, 2 best paper awards, 6 US patents filed and over 150 publications in journals, conferences and book chapters. Dr. Tee is also a conference short course instructor, journal guest editor, IEEE Senior Member, and serves in the organizing and technical committees of several international conferences. He was the General Chair of EPTC 2008 conference. He is listed in Who’s Who in the World, 2007.
Mr. Ming XUE Infineon, Singapore
Mr. Ming Xue is the head of failure analysis lab of Infineon Asia Pacific. He obtained a degree in radio technology from Xi’an JiaoTong University, China in 1982. He started to work in Navigational Aids International, Shanghai in 1982, where he worked for 10 years as a product designer/project manager for products in radio receiver, radio transmitter, and wireless remote control system of navigational aids signal. In 1992, he joint Seagate technology international Singapore as a product engineer, and worked 4 years in PCBA process and FA lab. In 1995, he joint Siemens Component, now, Infineon Technologies Singapore as Senior FA engineer. Currently, he is senior manager of the failure analysis lab. In his 16 years semiconductor backend experience, his job involves IC chip and package failure analysis, package reliability characterization, process quality risk management, qualification,
customer return and printed circuit board assembly support. He is listed in Who’s Who in Science and Engineering.
OVERVIEW OF TSV / ITRS FORUM
Monday, August 8, 2011
Venue Time Chairs Topic Speakers
13:00--13:30 3D Wafer Level System Integration Dr. Wolf JURGEN IZM, Germany
13:30--14:00 Future Challenges in 3D-IC Packaging Dr. Yasumitsu ORIIIBM, Japan
14:00--14:30 TSV Key Technology for Next Generation Packaging Dr. Frank LAI Qtech, China
Room 3
(TSV)
14:30--15:00
Dr. Wenhui
ZHU
Q & A
15:00--15:30 Coffee Break
Speakers
Room 3
(ITRS) 15:30--17:30
Dr. William
CHEN
Dr. Bill BOTTOM 3MTS, USA Dr. Bernd APPELT ASE, USA Prof. Ricky LEE HKUST, HK, China Dr. Yishao LAI ASE, Global, TW, China
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Introduction of TSV Forum Speakers Dr. Wolf JURGEN IZM, Germany
Dr. Wolf Juergen received a MS degree in Electrical Engineering. In 1994, he joined Fraunhofer Institute for Reliability and Micro integration (IZM), Berlin and has worked as group & project manager in the field of wafer level packaging and system-in-package (SiP). Since 2011 he is the head of department HDI&WLP/ASSID, responsible for the coordination and management of ASSID - “All Silicon System Integration Dresden-ASSID” with its 300 mm Wafer Level Integration. He manages as well as participates in a number of research projects on European and international level. He is an European representative in the technical working group Assembly & Packaging of ITRS, JEC, JIC and a board member of EURIPIDES as well as member of IEEE and SMTA. He has authored and co-authored more than 50 papers and holds a number of patents.
Dr. Yasumitsu ORII IBM, Japan
Dr. Yasumitsu Orii received a BS from Osaka University, Japan. He is a Senior Technical Staff Member working in 3D Integration for IBM Research Tokyo. He joined the IBM Japan in 1986. In 1996, he developed Flip Chip on FPC technique for IBM Hard Disk Drive to realize the enhancement of HDD performance and the slim form factor. Since 2003 he has started the development of ultra thin SiP/PoP for Digital Consumer Electronics Products and he developed C2 as a ultra fine pitch flip chip interconnection technique. In 2009, he was transferred to IBM Research Tokyo to focus on the development of 3D-IC packaging. Dr. Orii received an Excellent Research Award from the Micro Joining Committee of Japan Welding Society in 1996 and a Best Paper Award from ICEP-2008. He was a chair of Technical Program Committee of ICEP-2009 in Kyoto, ICEP-2010 in Sapporo and ICEP-2011 in Nara. He will be a general chair of ICEP-2012 in Tokyo.
Dr. Frank LAI Q-technology, China
Dr. Frank Lai is the VP engineer of Kunshan Q technology Ltd. He worked for Ambit Ltd as process engineer in 2002, and he entered Suzhou Walton technology Ltd as process section manager and product section manager from 2003 to 2007, then he worked for Q-technology limited till now. He has rich experience in module engineering, TSV package engineering and TSV package division.
Introduction of ITRS International Technology Roadmap for Semiconductors (ITRS) serves as guideline for the global semiconductor industry,
providing a 15 year outlook for 16 sectors of the industry and a 25 years projection of technology needs for emerging research devices and materials. As the industry moves into the era of More Moore and More than Moore, the role of ITRS is becoming even more crucial and critical for continuing progress. This workshop is conducted by the 2011 ITRS Assembly and Packaging working group, focusing on the major technology developments, difficult challenges, and potential solutions for the 2011 ITRS Assembly and Packaging Chapter. The coverage will include Au & Cu wire bond, flip chip BGA and flip chip CSP, wafer level packaging technologies, 3D and 2.5D TSV technology developments, as well as special applications including Optoelectronic Packaging, Automotive Electronics, and Medical Electronics.
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OVERVIEW OF INVITED PLENARY KEYNOTES
Tuesday, August 9, 2011
Multifunctional Hall Time Topic Speaker Organization
09:30--10:05 Molding Technologies – A New Way for System Integration
Dr. Rolf ASCHENBRENNER Fraunhofer, Germany
10:05--10:40 Novel Grapheme for Ultra-capacitors Energy Storage Applications
Prof. C.P. WONG Georgia Institute of Technology, USA
10:40--11:10 Coffee Break
11:10--11:45 Product Oriented Photonics Packaging Solutions
Dr. Enboa WU ASTRI, HongKong, China
11:45--12:20 From LEDification to Digitalization- Challenges and Solutions
Dr. Guoqi ZHANG Philips, Netherlands
12:20--13:30 Lunch
13:30--14:05 Future of Electronics Packaging and Advanced Manufacturing for It
Prof. Rao TUMMALA Georgia Institute of Technology, USA
14:05--14:40 A New Approach to Qualification For the Electronics Industry
Prof. Michael PECHT University of Maryland, USA
14:40--15:15 Thermal Packaging of Optoelectronic Devices
Prof. Moo-Whan SHIN Yonsei University, Republic of Korea
15:15--15:45 Coffee Break
15:45--16:20 A New Approach Towards Nano- packaging Technology
Prof. Tadatomo SUGA University of Tokyo,Japan
16:20--16:55 JCET and Its Latest Packaging Technologies
Dr. Weiping LI JCET, China
16:55--17:30 Emerging Technologies: CMOS Image Sensor Wafer Level Packaging
Dr. Thorsten MATTHIAS EV Group, Austria
17:30--18:05 Organic Light Emitting Diodes (OLEDs): New Generation Display and Lighting Technology and Their Packaging Solutions
Prof. Min WANG (Vice President) Prof. Jianhua ZHANG
Shanghai University, China
Introduction of Invited Plenary Keynote Speakers Dr. Rolf ASCHENBRENNER Fraunhofer, Germany
Dr. Rolf Aschenbrenner received his B.S and M.S. degrees from the University of GieBen, Germany in 1986 and 1991, respectively. From 1991 to 1992, he worked at the University of GieBen and was engaged in a project for the German Space Lab Mission D2. In 1993, he joined the Research Center of Microperipheric Technologies at the Technical University of Berlin. Since 1994, he has been employed at the Fraunhofer Institute of Reliability & Micro-integration Berlin (IZM), where he is presently head of the department of System Integration & Interconnection Technologies. From 2000, he was Deputy Director of the Fraunhofer Institute IZM. In 2005, he was awarded the “iNEMI International Recognition Award”. As a member of the IEEE CPMT Society Board of Governors, Dr. Aschenbrenner has worked as a European representative on the Conference Advisory Board Committee, and played an active role in the globalization of IEEE CPMT in terms of membership and
chapter development. He is a Senior Member of IEEE and served as Technical and IEEE CPMT Vice President of Conferences. In 2010, he became IEEE CPMT President.
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Prof. C.P. WONG GT, USA
Prof. C.P. Wong is currently Dean of the Faculty of Engineering at the Chinese University of Hong Kong. He is on a no-pay long leave from Georgia Institute of Technology (GT). Prior to joining GT in 1996, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992. His research interests lie in the fields of polymeric electronic materials, electronic, photonic and MEMS packaging and interconnect, interfacial adhesions, nano-functional material syntheses and characterizations, nano-composites. He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Educational Activity Board Outstanding Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award, the IEEE CPMT Field Award in 2006 and the IEEE
CPMT David Feldman Award in 2009. He holds over 50 U.S. patents, and has published over 1,000 technical papers, co-authored and edited 10 books and is a member of the National Academy of Engineering of the USA since 2000.
Dr. Enboa WU ASTRI, Hong Kong, China
Dr Enboa Wu joined ASTRI in 2005. As Vice President and Group Director, and Founder of the Material & Packaging Technologies Group, he is responsible for development and commercialization of technologies in areas of LED chips, packaging, and applications to lighting and display; renewable energy harvest by piezo, wind and CPV; batteries; CMOS image sensor TSV packaging and compact cameras; printed electronics; healthcare electronics; and micro-systems. Dr Wu has over 20 years of experience in electronics, opto-electronics, materials, and precision metrology areas. In his previous post as Deputy General Director of ERSO/ITRI in Taiwan, Dr Wu founded ERSO's Advanced Packaging Technologies Center and managed its Flat Panel Display Technologies Center. Dr. Wu received his PhD degree from the University of California, Berkeley. Prior to joining ASTRI, he had also served as a professor at National Taiwan University for 15 years. Dr. Wu is an ASME Fellow.
Dr. Guoqi ZHANG Philips, Netherlands
Dr. G.Q. Zhang is Philips’ fellow for SSL and Sr. Director for SSL open innovation, mainly working on SSL technology strategy, roadmap and partnership. Within Delft University of Technology, the Netherlands, as the director of DIMES centre for SSL technologies, he is heading a multi-disciplinary research team working on solutions for various fundamental and application challenges related to SSL. Prof. Zhang has been playing active and renowned role in shaping the global technology landscape of Semiconductors and SSL.
Prof. Rao TUMMALA GT, USA
Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech since 1994. Prior to joining Georgia Tech, he was an IBM Fellow He is known as the father of LTCC having developed 61-layer LTCC with copper and copper-polymer thin film materials. He has received many industry, academic and professional society awards including Industry Week’s award for improving U.S. competitiveness, IEEE‘s David Sarnoff, Major Education and Sustained Technical awards, etc.. He was recently honored by the Indian Semiconductor Association with the 2011 TechnoVisionary Award, received the highest IEEE award in packaging at the 61st ECTC for his contributions in package integration research, cross-disciplinary education and globalization of packaging. Prof. Tummala has published 426 technical papers, holds 74 patents and inventions; authored several books. He is a Fellow of IEEE, IMAPS, and the American Ceramic
Society, and a member of the National Academy of Engineering in USA and in India. He is past President of both IEEE-CPMT and the IMAPS Societies.
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Prof. Michael PECHT University of Maryland, USA
Prof. Michael Pecht is a world renowned expert in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, a SAE Fellow and an IMAPS Fellow. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is chief editor for Microelectronics Reliability and an associate editor for the IEEE Transactions on Components and Packaging Technology. He is the founder and Director of CALCE at the University of Maryland. The CALCE Center received the NSF Innovation Award in 2009. He is also a Chair Professor in Mechanical
Engineering and a Professor in Applied Mathematics at the University of Maryland. He has written more than twenty books on product reliability, development, use and supply chain management and over 400 technical articles. He has also written a series of books of the electronics industry in China, Korea, Japan and India.
Prof. Moo-Whan SHIN Yonsei University, Republic of Korea
Prof. Moo Whan Shin is one of world-wide leaders in thermal design & packaging of optoelectronics including high power LEDs and solar cells. He received M.S. and PhD degrees from the North Carolina State University, USA in 1988 and 1991, respectively. He is currently a Professor in the School of Integrated Technology at Yonsei University, Korea. He holds 28 patents and published more than 185 papers on thermal packaging and high power semiconductor devices. He worked for the Seoul Semiconductor Company for two years as a Technical Consultant. He has given more than 30 invited talks at international conferences and seminars on the subject of thermal packages of optoelectronic devices. He has received an excellent green technology research award from the Ministry of Education and Science and Technology. He is currently a President of Korea Society of Optoelectronics. He serves Korean government as a member of Presidential Committee on Green Growth. He is a director of ISA (International Solid State Lighting Alliance) as well.
Prof. Tadatomo SUGA University of Tokyo, Japan
Prof. Tadatomo Suga received PhD degree from the University of Stuttgart in 1983, while performing his PhD research at the Max-Planck Institute für Metallforschung, Stuttgart. In 1984, he became a member of Faculty of Engineering, the University of Tokyo, and since 1993, he has been professor of the School of Engineering. He was also a director of National Institute of Materials Science (NIMS) conducting Interconnect Design Group and the chair of IEEE CPMT Society Japan Chapter. His researches focus on micro-systems integration and packaging, and development of interconnect technology, especially a room temperature bonding technique for 3D integration: Surface Activated Bonding (SAB). He has advocated also the importance of environmental aspects of packaging technology and is well-known as the key organizer of Japanese roadmap of lead-free soldering and International Eco-design Conference.
Dr. Weiping LI JCET, China
Dr. Weiping Li is the Corporate VP of Laminate Packaging and Overseas Sales of JCET. Prior to his current responsibility, he was GM of JCET’s North American Operations. Dr Li graduated from Georgia Institute of Technology with a PhD in Materials Science and worked at Delphi Delco, Motorola Semiconductor and Amkor in R&D and product management areas. He was selected as one of the “1000 Elite Overseas Chinese Returnees” by the Central Government in 2009 and is a member of the Steering Committee for the National Key Lab for High-Density Packaging.
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Dr. Thorsten MATTHIAS EV Group, Austria
Dr. Thorsten Matthias is the director of business development at EV Group headquarters in St. Florian, Austria. In this role he is responsible for overseeing EVG’s worldwide business development. Dr. Matthias received his PhD degree in Technical Physics in 2002 from Vienna University of Technology, Austria. He started working at EV Group in October 2002. In his current position he works in 3D integration, MEMS, photovoltaics, LED, and nanotechnology. Since 2002, Dr. Matthias is involved in the field of 3D integration. He has co-authored 3 books and multiple papers on 3D integration with a special focus on thin wafer handling and chip stacking.
Prof. Jianhua ZHANG Shanghai University, China
Prof. Jianhua Zhang is one of leading scholar of Photoelectronic and Mechanical Engineering in Shanghai University. She is the head of LED&OLED Centers, and the leader of Shanghai Research Platform for New Display Design,Fabrication and System Applications. From 2001 to 2002, she was Research Associate at City University of Hong Kong. From 2002 to 2003, she was Postdoctoral Research Fellow at Heriot-Watt University. She has been studying on the advance packaging technology and process, optoelectronic devices, organic elcetronics in Shanghai University. She established LED Packaging & Reliability Center in 2007 and OLED University-Industires Joint Center in 2008. She occupied over 90 papers and 40 Chinese patents. In 2010, she and her team was awarded by Shanghai government for their achievements in hight density chip interconnection technology and applications.
OVERVIEW OF INVITED SESSION KEYNOTES
Wednesday, August 10, 2011
Session Venue Time Topic Speaker
Room 1 10:20--10:50 Trends in MEMS Packaging Dr. C.H. WANG Heriot-Watt University, UK
Session A
Room 1 15:50--16:20 Bottom-up Through Silicon Via (TSV) FillingMr. Han Yu Sinyang, China
Room 2 10:20--10:50 An Overview of Room Temperature Wafer Direct Bonding: Alignment, Mechanism and Application
Dr. Chenxi WANG Tokyo University, Japan
Session B
Room 2 15:50--16:20 Three Years of Fine Copper Wire Bonding in High Volume Manufacturing
Mr. Bernd APPELT ASE, USA
Room 3 10:20--10:50 Reliability Modeling for Electronic Packages Dr. Yishao LAI ASE, USA
Session C
Room 3 15:50--16:20 Design and Reliability of Power Electronics Modules
Prof. Hua LU University of Greenwich, UK
Session D Room 4 10:20--10:50 Effect of Substrate Surface Treatment on the Bondability of Wire Bonding
Dr. Lingwen KONG SCC, China
Session F Room 5 10:20--10:50 Reliability Modeling of Power Electronics Components
Prof. Chris BAILEY University of Greenwich, UK
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OVERVIEW OF INVITED SESSION KEYNOTES (Cont.)
Thursday, August 11, 2011
Session Venue Time Topic Speaker
Session G Room 1 10:20--10:50 LED Packaging Study by Tear-down Approaching Dr. T. ONISHI
GJ Tech, HK, China
Session B Room 2 10:20--10:50 Advanced Epoxy Molding Compound Technology
& Marketing Trend
Mr. Tom XIE
Henkel, China
Session C Room 3 10:20--10:50 Advanced Package Design Driven by Simulation Dr. Minggang HOU
ANSYS, China
Session H Room 4 10:20--10:50 Several Co-design Issues Using DfX for Solid
State Lighting
Prof. Sheng LIU
HUST, China
Session F Room 5 10:20--10:50 Effect of Interfacial Reaction on Reliability of Flip
Chip Lead-free Solder Joints
Prof. Mingliang HUANG, DLUT, China
Introduction of Invited Session Keynote Speakers A01 Dr. C.H. Wang Heriot-Watt University, UK
Dr. Changhai Wang received his B.S. degree from Jilin University. He obtained his M.S. and PhD. degrees from Heriot-Watt University in Edinburgh. After several years of research work in nonlinear optical materials, electro-optic devices and optical sensors at Heriot-Watt University, he moved to Imperial College, London, to work on copper column based bumping methods for flip-chip assembly. He returned to Heriot-Watt University in 2000 to take up a lecturer position in Microsystems engineering. His key research interests include development of assembly and packaging techniques for MEMS and microsysms, fabrication of metallic and polymer structures for RF-MEMS and micro-fluidic devices, and integrated sensors for package reliability and environmental monitoring applications. In1997 he was awarded a one-year Enterprise Fellowship in Optoelectronics by the Royal Society of Edinburgh. He has published more than 90 papers across several research fields and holds two patents in MEMS packaging.
A02 Mr. Han YU Sinyang, China
Mr. Han Yu is the Deputy Director of Marketing Dept. of Shanghai Sinyang Semiconductor Materials Co., Ltd, which is focusing on the research and development, design, manufacturing, sales and services in electronic materials and its relevant surface treatment equipments. Mr. Yu has rich knowledge and experience in advanced packaging and semiconductor front-end manufacturing fields. Prior to joining Shanghai Sinyang, Mr. Yu was the senior engineer for several years in Global Foundries Singapore.
B01 Dr. Chenxi WANG Tokyo University, Japan
Dr. Chenxi Wang received his B.E. and M.E. degrees from Harbin Institute of Technology, China, in 2002 and 2004, respectively, and his PhD degree from the University of Tokyo in 2009. He is currently working as a research fellow at The University of Tokyo awarded by Japan Society for the Promotion of Science (JSPS). From 2001 to 2004, He worked on microjoining techniques for electronic packaging and modeling of flip chip solder joint. From 2005, he joined Microsystem integration and packaging laboratory of The University of Tokyo. He has published more than 30 papers and holds 2 Japan patents. He received many awards, including the Best Paper Awards of ICEPT in 2003, 2007 and 2010, Chinese Government Award for Outstanding Student Abroad in 2007, Young Award of IEEE CPMT Symposium Japan 2010, and the Dean Award of School of
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Engineering at The University of Tokyo in 2010, the Best Presentation Award of 2nd AWJTC in 2011. He is an active member in IEEE, CPMT society, Japan Institute of Electronics Packaging (JIEP) and The Electrochemical Society (ECS).
B02 Dr. Bernd Appelt ASE, USA
Dr. Bernd Appelt got his PhD degree from the U of Mainz, Germany. He worked in IBM for 23 years in polymer systems characterization. He held various management positions in product and process development as well as manufacturing engineering. In 2003 he joined ASE Group as director of substrates engineering. His current position is director of business development and product promotion. Bernd holds more than 50 patents in electronic packaging and is a frequent presenter at electronics conferences. He is also a member of the roadmap committees of the ITRS Packaging & Assembly Group, IPC Substrates group and iNEMI Substrates Working Group.
B03 Mr. Tom XIE Henkel, China
Mr. Tom Xie is working for Henkel Huawei Electronics Co., Ltd. as R & D Manager. He has nearly 10 years experience in research and development of epoxy molding compounds. As the main inventor, he had participated in national 863 project and obtained 4 China national patents and 2 PCT international patents. At the same time, more than 20 of his academic papers were published in various domestic and international academic conferences and journals, including three papers which were awarded city natural science second prize and third prize. During his R&D career, he developed lots of new EMC products, including KL-G100/S, GR360A-ST, GR640HV-L1/S4, GR640A, KL-G900HC / P and other Henkel core products. These products are widely used in discrete devices, IC and other semiconductor market to achieve high sales revenue for Henkel.
C01 Dr. Yi-shao LAI ASE Group, Taiwan, China
Dr. Yi-Shao Lai received his PhD degree from the University of Texas at Austin in 2002, and M.S. and B.S. degrees from National Central University, Taiwan. Dr. Lai is a Director with Group R&D of Advanced Semiconductor Engineering (ASE), Inc., where he is leading Central Product Solutions with a focus on strategic planning and development of next-generation and mainstream electronic and photonic packaging, substrate technologies, as well as profitable new technologies. He is an Associate Editor for Microelectronics Reliability, a Guest Editor for IEEE Transactions on Components and Packaging Technologies and ASME Transactions Journal of Electronic Packaging, the Editor for ASE Technology Journal, and serves on the Editorial Advisory Board of Recent Patents on Electrical Engineering. Dr. Lai is an IEEE Senior Member and a recipient of the Outstanding Technical Achievement Award by IEEE Tainan Section. He was named Outstanding Young Engineer by Electronic & Photonic Packaging Division of American Society of Mechanical Engineers, Chinese
Institute of Engineers, and Chinese Society of Mechanical Engineers. Dr. Lai has over 550 technical publications and is the inventor of more than 45 patents.
C02 Prof. Hua LU University of Greenwich, UK
Dr. Hua Lu is a Reader (Associate Professor) in computational science at the University of Greenwich, UK. He received his PhD degree in Computational Physics from the University of Edinburgh, UK, in 1992 and M.S. degree in Condensed Matter Physics from Wuhan University, China, in 1988. He has worked in many research areas in the field of physics and engineering in his career. Currently his research interests are numerical analysis of electronics devices and reliability prediction methods, design and manufacturing optimization methods and their applications in industries.
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C03 Mr. Minggang HOU ANSYS, China
Mr. Minggang Hou joined Ansys Corporation as a Senior Application Engineer in 2010 focusing in Signal Integrity, Power Integrity and EMI. He supports tools such as Ansoft Designer™, Nexxim™, SIwave™, HFSS™ and Q3D™. Mr. Hou worked in high speed design for over 11 years. Prior to joining Ansys, he held the position of a Senior Technical Marketing Engineer in Mentor Graphics for Hyperlynx™ serial, including Signal Integrity, Power Integrity, Analog and Thermal productions. Before join Mentor, he worked as Hardware Design and Signal Integrity Engineer at Huawei Corporation where he was responsible for the Signal and Power Integrity analysis of PCB and ASIC. He also focused on high speed electrical interconnect testing and modeling research. He received B.S. degree in Control Engineering from Harbin Industry Technology University, China.
D01 Dr. Lingwen KONG SCC, China
Dr. Lingwen Kong graduated from HUST, China. He is the chief engineer of SCC and responsible for investment, business development and R & D of new product of PCB. He has 10+ patents in China and 20+ papers published. Dr. Kong has rich experience in characteristic impedance matching, processing of high density, materials development, heat sink technologies, machining and packaging substrate, etc.
F01 Prof. Chris BAILEY University of Greenwich, UK
Prof. Chris Bailey received his PhD degree in Computational Modeling in 1988, and an MBA in Technology Management in 1996. He has published over 200 papers on Design and Simulation of micro/nano-technology based processes and products and has worked on many UK and EU projects. Chris is a member of the NAFEMS Multi-Physics Modelling working group, a member of the Board of Governors of IEEE-CPMT society, and a UK Committee member of IMAPS. In 2007 he was and Programme Chair for High Density Packaging Conference in Shanghai, China, and also the local organizer of the IEEE sponsored EuroSime conference in London. In 2008 he was the General Chair for the Electronics System-integration Technology Conference (ESTC-2008) in Greenwich, London. Chris is also a member of the Board of Governors for IEEE CPMT. In 2011, Chris is the Technical Chair for
IEEE Nanotechnology conference in Portland (USA).
F02 Prof. Mingliang HUANG DLUT, China
Prof. M.L. Huang received his PhD degree from Dalian University of Technology. From 1998 to 2000, he worked at Electronic Packaging Center, City University of Hong Kong, as a Research Associate. From 2003-2004, he worked at Center for Electronic Packaging Materials, Korea Advanced Institute of Science and Technology, as a Research Fellow. From 2004 to 2006, he worked at Fraunhofer IZM, Germany, as a Humboldt Research Fellow. Since 2006, he has been a professor and the director of Electronic Packaging Materials Lab at Dalian University of Technology. Now his researches focus on the interfacial reaction, electro migration, reliability of fine-pitch lead-free solder interconnects, and co-deposition of eutectic Au-Sn alloys for LED packaging.
G01 Mr. T ONISHI GJ Tech, Hong Kong, China
Mr. Onishi is the managing director of Grand Joint Technology Ltd, formed in Hong Kong in 1997. Grand Joint Technology Ltd. is a microelectronics assembly process consulting company involved in Materials, Design, Process, and Analysis for Bare Die Product, COB, SMT, Packaging, COF, LCD Modules, EL products, LED packaging & LED device. Mr. Onishi received the “Die Products Industry Achievement award” at the 8th Annual International KGD Packaging and Test Workshop.
H01 Prof. Sheng LIU HUST, China
(See Page 11 for short biography)
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OVERVIEW OF ORAL PRESENTATION SESSIONS
Wednesday, August 10, 2011
Room 1 Room 2 Room 3 Room 4 Room 5 Oral Session 1
(Session A) Oral Session 2
(Session B) Oral Session 3
(Session C) Oral Session 4
(Session D) Oral Session 5
(Session F)
Chairs Prof. Yufeng JIN Prof. G.S. KIM
Prof. Jintang SHANG Prof. Peng JIN
Prof. Fei QIN Dr. Wenhui ZHU
Dr. Paul WANG Dr. Lingwen KONG
Prof. Daoguo YANG Dr. Zikai HUA
08:00--09:20A-001, A-002, A-003, A-004,
B-002, B-005, B-010, B-011,
C-002, C-003, C-005, C-006,
D-006, D-009, D-013, D-015,
F-001, F-002, F-003, F-005,
09:20--10:20 Poster Session 1 (53 papers), Exhibition & Coffee Break
Oral Session 6
(Session A) Oral Session 7
(Session B) Oral Session 8
(Session C) Oral Session 9
(Session D) Oral Session 10
(Session F)
Chairs Dr. Yishao LAI
Prof. Gang DONG Dr. Hengyun ZHANG
Prof. Fei XIAO Dr. Tongyan TEE Dr. Heinz PAPE
Prof. Mingyu LI Prof. Mingliang HUANG
Prof. Chunqing Wang Dr. Xiuzhen LU
10:20--10:50 Invited Talk Invited Talk Invited Talk Invited Talk Invited Talk
10:50--12:10A-006, A-013, A-030, A-020,
B-014, B-015, B-016, B-026,
C-007, C-008, C-012, C-014,
D-016, D-017, D-018, D-019,
F-006, F-007, F-011, F-060,
Lunch: 12:10--13:10 Room 1 Room 2 Room 3 Room 4 Room 5
Oral Session 11 (Session A)
Oral Session 12 (Session B)
Oral Session 13 (Session C)
Oral Session 14 (Session E)
Oral Session 15 (Session F)
Chairs Dr. Lionel CADIX
Dr. Daniel YU Prof. Liangliang LI
Prof. Mingyu LI Dr. Haibo FAN
Dr. Hongfei YAN Mr. K.H. TAN Dr. Li GONG
Prof. Dongyan DING Dr. Klaus GALUSCHKI
13:10--14:50A-022, A-025, A-026,
A-028, A-014, B-018, B-019, B-028,
B-029, B-031, C-016, C-017, C-022,
C-025, C-034, E-011, E-010, E-007,
E-006, E-003, F-018, F-019, F-020,
F-021, F-023, 14:50--15:50 Poster Session 2 (55 papers), Exhibition & Coffee Break
Oral Session 16
(Session A) Oral Session 17
(Session B) Oral Session 18
(Session C) Oral Session 19
(Session F) Oral Session 20
(Session F)
Chairs Dr. Ivan SHAM
Dr. Klaus PRESSE Dr. Ningcheng LEE
Dr. J.G. DUH Dr. Jianqi HE
Dr. Jiangtao ZHENG Dr. Zezhong FU Prof. Jun WANG
Dr. Ming XUE Prof. Kailing PAN
Invited Talk Invited Talk Invited Talk 15:50--17:30
A-038, A-040, A-042, B-032, B-033, B-036, C-035, C-036, C-039, F-027, F-028, F-038,
F-039, F-042, F-043, F-044, F-046,
F-051, F-052,
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OVERVIEW OF ORAL PRESENTATION SESSIONS (Cont.)
Thursday, August 11, 2011
Room 1 Room 2 Room 3 Room 4 Room 5 Oral Session 21
(Session G) Oral Session 22
(Session B) Oral Session 23
(Session C) Oral Session 24
(Session F) Oral Session 25
(Session F)
Chairs Dr. Barry ZHONG Dr. Xiaobing LUO
Prof. Liqiang CAO Prof. Yanhong TIAN
Prof. Bill CHEN Prof. Hua LU
Dr. Boyi WU Dr. Ivan SHAM
Dr. Chenxi WANG Dr. Min MIAO
08:00--09:20G-010, G-004, G-005, G-008,
B-039, B-044, B-055, B-061,
C-042, C-043, C-045, C-047,
F-053, F-054, F-057, F-058,
F-062, F-063, F-065, F-070,
09:20--10:20 Poster Session 3 (52 papers), Exhibition & Coffee Break
Oral Session 26
(Session G) Oral Session 27
(Session B) Oral Session 28
(Session C) Oral Session 29
(Session H) Oral Session 30
(Session F)
Chairs Mr. T. ONISHI Prof. Xu CHEN
Prof. Hao TANG Dr. Bing AN
Dr. Yan ZHANG Dr. Qing ZHOU
Prof. James CAI Dr. Andy TSENG
Prof. Chris BAILEY Dr. Yanrong ZHANG
10:20--10:50 Invited Talk Invited Talk Invited Talk Invited Talk Invited Talk
10:50--12:10G-012, G-016, G-017, G-020,
B-065, B-067, B-072, B-074,
C-052, C-054, C-060, C-061,
H-001, H-002, H-004, H-008,
F-071, F-077, A-024, A-037,
23
ORAL SESSIONS Note: Only the contact information of the first author is provided because of the length limitation of the conference program.
Wednesday, August 10, 8:00AM – 9:20AM
Session1: Advanced Packaging & System Integration
Date Wednesday, August 10, 2011 Time 8:00AM-9:20AM Venue Room 1
Chairs Prof. Yufeng JIN Prof. G. S. KIM
A-001 8:00 –8:20 Highly reliable silicon or glass package to printed wiring board interconnections Xian Qin1,Nitesh Kumbhat, Venky Sundaram, Rao Tummala Georgia Institute of Technology, USA A-002 8:20 –8:40 Challenges in Developing Cost-effective System-in-Package (sip) for Tire Pressure Monitoring System(TPMS) Ivan M.L. SHAM1, Carlos S.W.CHOW, Ling JING, Jack Y.YEUNG, Supen Chen Hong Kong Applied Science & Technology Research Institute, Hong Kong, China A-003 8:40 –9:00 Electromigration Performance of Through Silicon Via (TSV) Zhicheng Lv1, Run Chen, YuZhe Wang, Xuefang Wang, Sheng Liu Huazhong University of Science & Technology,China A-004 9:00 –9:20 Challenges in 3D Integration Due to Differences in Silicon and System Design Environments Tsunwai Gary Yip1, Benedict Lau Rambus Inc., USA
Session2: Packaging Materials & Processes Date Wednesday, August 10, 2011 Time 8:00AM-9:20AM Venue Room 2
Chairs Prof. Jintang SHANG Prof. Peng JIN
B-002 8:00 –8:20 Growth Behavior of Prismatic Cu6Sn5 and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints Ming Yang, Mingyu Li1, Ling Wang, Yonggao Fu, Jongmyung Kim Shenzhen graduate school, Harbin Institute of Technology, China B-005 8:20 –8:40 High Temperature Lead-Free Solder Joints Via Mixed Powder System Hongwen Zhang, Ning-Cheng Lee1 Indium Corporation, USA
B-010 8:40 –9:00 Comparison of nano-additives influence on properties of the bi-modal solder pastes for special applications Janusz Sitek1, Yan Zhang, Shiwei Ma, Johan Liu, Yulai Ga, Qijie Zha, Marek Koscielski, Krystyna Bukat, Aneta Arazna, Malgorzata Jakubowska, A.Mlozniak Tele and Radio Research Institute, Poland B-011 9:00 –9:20 Investigation of Palladium Coverage on Bonded Balls of Palladium-coated Copper Wires Kay-Soon Goh1, Teck-Kheng Lee, Wei Koh, Hun-Shen Ng, Hong-Meng Ho Semicon Fine Wire Pte Ltd., Singapore
Session3: Packaging Design & Modeling Date Wednesday, August 10, 2011 Time 8:00AM-9:20AM Venue Room 3
Chairs Prof. Fei QIN Dr. Wenhui ZHU
C-002 8:00 –8:20 Thermal performance of high power LED package based on LTCC Mingsheng Ma, Zhifu Liu, Yongxiang Li1 Shanghai Institute of Ceramics, Chinese Academy of Sciences, China C-003 8:20 –8:40 A Test Structure Designed for Vias in Multi-layer Package Substrate SUN Ling1, YANG Ling-ling, Sun Hai-yan Nantong university, China C-005 8:40 –9:00 Computer Simulation of the Electro-migration and Optimization of Assembly Designs Xiaoxin ZHU1, Hua Lu, Chris Bailey University of Greenwich, UK C-006 9:00 –9:20 A novel Wirebond-BGA CPU package
WANG Qidong1, CAO Liqiang, LI Jun, GUO Xueping, GAO Wei, LIU Shuhua, GUIDOTTI Daniel, WAN Lixi Institute of Microelectronics, Chinese Academy of Sciences, China
Session4: High Density Substrate & SMT Date Wednesday, August 10, 2011 Time 8:00AM-9:20AM Venue Room 4
Chairs Dr. Paul WANG Dr. Lingwen KONG
D-006 8:00 –8:20 Solder Preform Application
24
Hu yu1, Gong yihua, Lu shijun, Shen ming Siemens Center Shanghai, China D-009 8:20 –8:40 Study on the Thermal Fatigue Reliability of Plated Through Holes in PCB Xiong Ji1 Beihang University, China D-013 8:40 –9:00 Silver Nitric-An Innovative Process Indicator for Oxidation of PCB with OSP Surface Finish Eric Hou, DF Chung, Paul Wang1 Mitac Technology Development Center, China D-015 9:00 –9:20 Research on Dimensional Change Characteristics of Printed Circuit Board Films Liangjie Zhou1, Dong Liu, Zaifei Tao, Rubin Zou, Weisheng Xia, Fengshun Wu Huazhong University of Science & Technology, China
Session5: Quality & Reliability Date Wednesday, August 10, 2011 Time 8:00AM-9:20AM Venue Room 5
Chairs Prof. Daoguo YANG Dr. Zikai HUA
F-001 8:00 –8:20 The stress-strain behaviors of solder joints during thermal fatigue process Geng Zhiting1, Heqing, Cheng Guohai, Ma Jusheng North China Electric Power University, China F-002 8:20 –8:40 In situ measurement of stress evolution in Sn-based solder joint under electromigration based on X-ray diffraction technique Hongwen He1, Haiyan Zhao, Guangchen Xu, Limin Ma and Fu Guo Tsinghua University, China F-003 8:40 –9:00 Non-Destructive Diagostics of Electronic Devices Ping Li1, Yuan Chen National Key Laboratory of Reliability Physics and Application of Electronic component, China F-005 9:00 –9:20 Residual Stress in NCF-Bonded COG Packages during Manufacturing Process Jie Guo1, Guanghua Wu, Xiancai Chen, Bo Tao Huazhong University of Science & Technology, China
Wednesday, August 10, 10:20AM – 12:10PM
Session6: Advanced Packaging & System Integration
Date Wednesday, August 10, 2011 Time 10:20AM-12:10PM Venue Room 1
Chairs Dr. Yishao LAI Prof. Gang DONG
Invited Talk 10:20 –10:50 Trends in MEMS packaging Dr. C.H. WANG Heriot-Watt university, UK A-006 10:50 –11:10 Thermal Analysis and Improvement of High Power Electronic Packages Zhimin Wan1, Ling Xu, Yang Zhang, Mingxiang Chen, Xiaobing Luo, Junjie Chen, Sheng Liu Huazhong University of Science & Technology, China A-013 11:10 –11:30 Design and optimization of Redistribution Layer (RDL) on TSV interposer for high frequency applications Qinghu Cui, Yunhui Zhu, Shenglin Ma, Jing Chen, Min Miao, Yufeng Jin1 Peking University, China A-030 11:30 –11:50 System in Package(SiP) Development for Universal Transport Interface Application electronic products XIE Jianyou, GUO Xiaowei, ZHU Wenhui, WANG Yongzhong, LI Xizhou, XIA Guofeng1 and QIN Fei Beijing University of Technology, China A-020 11:50 –12:10
Formic acid vapor treated Cu-Cu direct bonding at low temperature Wenhua Yang1, Hiroyuki Shintani, Masatake Akaike, Tadatomo Suga The University of Tokyo, Japan
Session7: Packaging Materials & Processes Date Wednesday, August 10, 2011 Time 10:20AM-12:10PM Venue Room 2
Chairs Dr. Hengyun ZHANG Prof. Fei XIAO
Invited Talk 10:20 –10:50 An Overview of Room-Temperature Wafer Direct Bonding: Alignment, Mechanism and Application Dr. Chenxi WANG Tokyo University, Japan B-014 10:50 –11:10 Pitting corrosion behavior of Sn-07Cu alloy in simulated marine atmosphere environment and the effect of trace gallium Aiping Xian1, Zhong Yan Institute of Metal Research, Chinese Academy of Sciences, China B-015 11:10 –11:30 The application of inkjet direct writing in solar cell fabrication: an overview Zhaoting Xiong1, Changqing Liu Loughborough University, UK B-016 11:30 –11:50
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Electromigration Behavior in In-situ Cu6Sn5 Reinforced Eutectic SnAg Composite Solder Joints Xiaoya Wang1, Mengting Han, Limin Ma, Guangchen Xu, Fu Guo Beijing University of Technology, China B-026 11:50 –12:10 Formation and Migration of Au-Pd-Ni-Sn Quaternary Intermetallic Compound in the Microbumps with A Au/Pd/Ni(P) Surface Finish Wei-Hsiang Wu, Y.C.Lin, Cheng-En Ho1 Yuan Ze University, Taiwan, China
Session8: Packaging Design & Modeling Date Wednesday, August 10, 2011 Time 10:20AM-12:10PM Venue Room 3
Chairs Prof. Tongyan TEE Dr. Heinz PAPE
Invited Talk 10:20--10:50 Reliability Modeling for Electronic Packages Dr. Yishao LAI ASE, USA C-007 10:50--11:10 High Density Packaging for Automotive Applications Sommer Johann-Peter1, Michel B., Hofmann,Thomas, Gottwald,Th, Neumann,A, Podlasly,A Fraunhofer Research Institute for Electronic Nano Systems, Germany C-008 11:10--11:30 Study of Joule Heating Effects in Lead-Free Solder Joints under Electromigration Guangchen Xu1, Fu Guo, Andre Lee, K.N. Subramanian, Neil Wright Beijing University of Technology, China C-012 11:30--11:50 3D Modeling and Electrical Characteristics of Through-Silicon-Vias (TSVs) in 3D Integrated Circuits Lei Liang, Min Miao1, Zhensong Li, Shufang Xu, Xin Sun Peking University, China C-014 11:50--12:10 Simulation of Reconfigurable Antenna Based on RF Switch Tian Wenchao1, Cao Yanrong, Sun Hao Xidian University, China
Session9: High Density Substrate & SMT Date Wednesday, August 10, 2011 Time 10:20AM-12:10PM Venue Room 4
Chairs Prof. Mingyu LI Prof. Mingliang HUANG
Invited Talk 10:20--10:50 Effect of Substrate Surface Treatment on the Bondability of Wire Bonding Dr. Lingwen KONG
SCC, China D-016 10:50 –11:10 Design for Manufacturability of PTH Solder Fill in Thick Board with OSP Finish Shing Chang, Rocky Wang, Yu Xiang, William Shi, Paul Wang1 Mitac Technology Development Center, China D-017 11:10 –11:30 Investigation on cracked solder ball of BGA component Miao Cai1, Boyi Wu, Dongji Xie, Daoguo Yang, Yuan Tao, Fei Zhou Guilin University of Electronic Technology, China D-018 11:30 –11:50 Void mechanism research and control in solder joint Xie xiaoqiang1, Zhao Zhenqing Samsung Semiconductor D-019 11:50 –12:10 Direct and Indirect Strain Measurement of Flexible PCBs Luciano Arruda1, Luciano Sahdo, Cristiano Coimbra Nokia Institute of Technology, Brazil
Session10: Quality & Reliability Date Wednesday, August 10, 2011 Time 10:20AM-12:10PM Venue Room 5
Chairs Prof. Chunqing WANG Dr. Xiuzhen LU
Invited Talk 10:20--10:50 Reliability Modeling of Power Electronics Components Prof. Chris BAILEY University of Greenwich, UK F-006 10:50 –11:10 Investigation on soldering reliability in terminal electrodes of MLCC GuangHua Shi1, ShengXiang Bao University of Electronic Science & Technology of China, China F-007 11:10 –11:30 Migration of Silver and Copper on Power Packaging Substrates Yunhui Mei1, Guo-Quan Lu, Xu Chen, Gang Chen, Susan Luo Tianjin University, China F-011 11:30 –11:50 Study on embedded-type MCM temperature field analysis and thermal placement optimization Huang Chunyue1, Wei Hegeng Guilin University of Electronic Technology, China F-060 11:50 –12:10 An advanced solder ball impact test method and its system
Zhang Yanbo1 The Hong Kong University of Science & Technology, Hong Kong, China
26
Wednesday, August 10, 13:10PM – 14:50PM
Session11: Advanced Packaging & System Integration
Date Wednesday, August 10, 2011 Time 13:10PM-14:50PM Venue Room 1
Chairs Dr. Lionel CADIX Dr. Daniel YU
A-022 13:10--13: 30 Electrical Characterization of Cylindrical and Annular TSV for Combined Application Thereof Xin Sun, Qinghu Cui, Yunhui Zhu, Zhiyuan Zhu, Min Miao, Jing Chen, Yufeng Jin1 Peking University, China A-025 13:30--13:50 Investigation of various options of CTBGA adhesives for bend performance enhancements in portable electronic products SHI Hongbin1 and UEDA Toshitsugu WASEDA University, Japan A-026 13:50--14:10 Reliability Optimization for Multilayer Circuits for Active RFID Tag on Rigid and Flexible Substrates Huang Jingyuan1, Zhang Zheming, Chen Haibin and Wu Jingshen The Hong Kong University of Science & Technology, Hong Kong, China A-028 14:10--14:30 Halogen-free corner bond adhesive for array-based SMT packages and the impact on board-level solder joint reliability SHI Hongbin1 and UEDA Toshitsugu WASEDA University, Japan A-014 14:30 –14:50 Low temperature thermocompression bonding based on copper nanostructure for 3D packaging Mingxian Cai1, Mingxiang Chen, Sheng Liu Huazhong University of Science and Technology, China
Session12: Packaging Materials & Processes Date Wednesday, August 10, 2011 Time 13:10PM-14:50PM Venue Room 2
Chairs Prof. Liangliang LI Prof. Mingyu LI
Co-chair B-018 13:10--13:30 Preparation of rod-shaped and spherical Silver nanoparticles & application for Packaging materials Jinting Jiu1 and Masaya Nogi Osaka University, Japan B-019 13:30--13:50 Mechanical and Thermal Analysis of TSV interposer Filling with Pure Sn, Cu and Cu-Cored Solder Ran He1, Huijuan Wang, Jing Zhou, Xueping Guo, Daquan Yu and Lixi Wan
Institute of Microelectronics Chinese Academy of Sciences, China B-028 13:50--14:10 Large-scale synthesis of silver nanoparticles by polyol process for low temperature sintering-bonding application Jianfeng Yan1, Guisheng Zou, Xiaoyu Wang, Hailin Bai, Fengwen Mu and Aiping Wu Tsinghua University, China B-029 14:10--14:30 Influence of nano-TiO2 reinforcements on the wettability and interfacial reactions of novel lead-free Sn3.5Ag0.5Zn composite solder/Cu solder joints S. Y. Chang, L. C. Tsao1, F. S. Wang and L. P. Feng Pingtung University of Science & Technology, Taiwan, China B-031 14:30--14:50 Properties of ferroelectric thin film capacitor for embedded passive applications Ning Zhao1, Lixi Wan and Shuhui Yu Institute of Microelectronics, Chinese Academy of Sciences, China
Session13: Packaging Design & Modeling Date Wednesday, August 10, 2011 Time 13:10PM-14:50PM Venue Room 3
Chairs Dr. Haibo FAN Dr. Hongfei YAN
C-016 13:10--13:30 Optimisation of Heatsink Design for a Ruggedised LCD Display Hua Lu1, Chris Bailey University of Greenwich, UK C-017 13:30-13:50 The electrical design of high-speed and high-density ASIC package Tao Wenjun1, Li Jun, Zhou Yunyan, Wang Qidong, Cao Liqiang, WAN Lixi Institute of Microelectronics, Chinese Academy of Sciences, China C-022 13:50--14:10 Drawing the packaging landscape for CFL applications E.P.B.J. de Bruin1, P.Dijkstra, F.J. Sluijs, J.H.J. Jansen NXP Semiconductors, Netherlands C-025 14:10--14:30 Diffusion-induced Stresses in the Intermetallic Compound Layer of Solder Joints XIA Guofeng, QIN Fei1, AN Tong, LI Wei Beijing University of Technology, China C-034 14:30--14:50 Development of Low-cost Wafer Level Package through Integrated Design and Simulation Analysis Tong Yan Tee1, Glen Siew, Haoyang Chen, Serine Soh, In Sook Kang, Jong Heon Kim, Hun Shen Ng, Teck Kheng Lee, Germaine Hoe, Shan Gao
27
Nepes, Singapore
Session14: Advanced Manufacturing Technologies & Packaging Equipment
Date Wednesday, August 10, 2011 Time 13:10PM-14:50PM Venue Room 4
Chairs Mr. K.H. TAN Dr. Li GONG
E-011 13:10--13:30 Channel Quality Comparison for OOG IO Bus Designs Y. L. Li1, Xiaoning Ye Intel Corporation, Taiwan, China E-010 13:30--13:50 Simulations for a novel fluid dispensing technology based on the gas-liquid slug flow Peng Peng, Jianhua Zhang, Jinsong Zhang1 Shanghai University, China E-007 13:50--14:10 Laser Bonding System for Semiconductor Device and MEMS Encapsulation Yuanhao Huang, Maoyu Li, Yuneng Lai, Jianhua Zhang1 Shanghai University, China E-006 14:10--14:30 Investigation of high speed microbump formation through electrodeposition enhanced by megasonic agitation Yingtao Tian, Changqing Liu1, David Hutt, Bob Stevens, David Flynn, Marc P.Y. Desmulliez Loughborough University, UK E-003 14:30--14:50 Multi-layer transparent film cut mark detection visual system design Bangmao Xiang1, Jiankui chen, Yongan Huang, Zhoupin Yin Huazhong University of Science & Technology, China
Session15: Quality & Reliability Date Wednesday, August 10, 2011 Time 13:10PM-14:50PM Venue Room 5
Chairs Prof. Dongyan DING Dr. Klaus GALUSCHKI
F-018 13:10--13:30 Failure Analysis of Thick Film Resistors on Stainless Steel as Sensing Elemnets Zongyang Zhang1, Zhimin Wan, Simin Wang, Sheng Liu Huazhong University of Science & Technology, China F-019 13:30--13:50 Effects of combined thermal and vibration loadings on the wire bond integrity K.A. Kamaludin, M. Mirgkizoudi1, C. Liu, S. Riches Loughborough University, UK F-020 13:50--14:10 Size Effects in Microscale Solder Joint of Electronic Packaging L.M. Yin1, W.Y. Li, S.Wei, Z.L. Xu Chongqing University of Science & Technology, China F-021 14:10--14:30 Bonding Wire Options and Their Impact on Product Reliability Charles J. Vath, III1 and Richard Holliday ComSol Consulting Pte. Ltd., Singapore F-023 14:30--14:50 Correlation between Ag Content and Cu Pad Consumption in Lead-Free Solder Joints under Electron Current Stressing C. N. Chen, B. Z. Chen, W. H. Wu, and C. E. Ho1 Yuan Ze University, Taiwan, China
Wednesday, August 10, 15:50PM – 17:30PM
Session16: Advanced Packaging & System Integration
Date Wednesday, August 10, 2011 Time 15:50PM-17:20PM Venue Room 1
Chairs Dr. Ivan SHAM Dr. Klaus PRESSE
Invited Talk 15:50–16:20 Bottom-up Through Silicon Via (TSV) Filling Mr. Han Yu Sinyang, China A-038 16:20--16:40 Nanoprecision Aligned Wafer Direct Bonding and Its Outlook Chenxi Wang1 and Tadatomo Suga The University of Tokyo, Japan A-040 16:40--17:00
Printed Circuit Board Electrical Design for Wafer-Level Packaging (WLP) Boping Wu1 and Tingting Mo Intel Corporation, USA A-042 17: 00--17:20 The Flip Chip market and supply chain is being reshaped by new requirements and technologies Lionel Cadix1 and Christophe Zinck Yole Developpement, France
Session17: Packaging Materials & Processes Date Wednesday, August 10, 2011 Time 15:50PM-17:20PM Venue Room 2
Chairs Dr. Ningcheng LEE Dr. J. G. DUH
Invited Talk 15:50–16:20
28
Three Years of Fine Copper Wire Bonding in High Volume Manufacturing Mr. Bernd APPELT ASE, USA B-032 16: 20--16:40 Towards Quantitative Microstructural Modeling for 3D Electronic Packaging Zhiyong Wu and Zhiheng Huang1 Sun Yat-sen University, China B-033 16:40--17:00 Conjecture on The Chemical Stability and Corrosion Resistance of Cu-Al and Au-Al Intermetallics in Ball Bonds C. D. Breach1 and T.K. Lee ProMat Consultants, Singapore B-036 17:00--17:20 Improving Plated Copper Adhesion for Metallisation of Glass PCBs Baofeng He1, Dennis Patrick Webb and Jon Petzing Loughborough University, UK
Session18: Packaging Design & Modeling Date Wednesday, August 10, 2011 Time 15:50PM-17:20PM Venue Room 3
Chairs Dr. Jianqi HE Dr. Jiangtao ZHENG
Invited Talk 15:50–16:20 Design and Reliability of Power Electronics Modules Prof. Hua LU University of Greenwich, UK C-035 16: 20--16:40 Heat dissipation design for a high density-high power chip package Jing zhou1, Liqiang Cao, Xueping Guo, Qidong Wang, Daquan Yu, Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, China C-036 16:40--17:00 Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers Wang Dianxiao1, Wang Xiaojing, Wang Jia, Li Zongshuo, Fu Yifeng, Liu Johan Shanghai University, China C-039 17:00--17:20 The elastic anisotropy of Sn-based intermetallics in solder joints: A first-principles calculation Rong An1, Wei Liu, Chunjin Hang, Yanhong Tian, Chunqing Wang Harbin Institute of Technology, China
Session19: Quality & Reliability Date Wednesday, August 10, 2011 Time 15:50PM-17:30PM Venue Room 4
Chairs Dr. Zezhong FU Prof. Jun WANG
F-027 15:50 –16:10 Dynamic Bending Test and Simulation of PBGA PackagesLin LONG1, Guoyuan LI, Pengfei ZHANG, Bin XIE, Xunqing SHI South China University of Technology, China F-028 16:10 –16:30 Leakage failure Analysis of pole pieces used for traveling wave tube Li Peng1, Bao Sheng Xiang, Shi Guanghua, Lai Weiming, Rao Zhenzhen School of microelectronics and Solid-State Electronics, China F-038 16:30 –16:50 Plasma Decapsulation of plastic IC packages with copper wire bonds for failure analysis J. Tang1, H. Ye, J.B.J. Schelen and C.I.M. Beenakker Delft University of Technology, Netherlands F-039 16:50 –17:10 Reliability analysis on the solder joints in space cable connectors Zhang Xiao-chao1, Zhang Zhen-ming, Yangmeng Beijing Spacecrafts, China F-042 17:10 –17:30 Numerical Simulation and Experiments on the Performance of LED Subjected to Thermal Shock Xulong Gui1, Xiaobing Luo, Sheng Liu Wuhan National Lab for Optoelectronics, China
Session20: Quality & Reliability Date Wednesday, August 10, 2011 Time 15:50PM-17:30PM Venue Room 5
Chairs Dr. Ming XUE Prof. Kailing PAN
F-043 16:10 –16:30 Transmission Electron Microscopy Investigations on the Growth of Tin Whiskers from CeSn3 Substrate Cai-Fu Li ,Zhi-Quan Liu1, Jian-Ku Shang Institute of Metal Research, Chinese Academy of Sciences, China F-044 16:30 –16:50 A General Weibull Model for Reliability Estimate of Anisotropic Conductive Adhesive Joining technology using Accelerated Degradation Data Guang-hua Wu1, Xian-cai Chen, Bo Tao, Zhou-ping Yin Huazhong University of Science & Technology, China F-046 16:50 –17:10 Electrochemical Corrosion Behavior of Sn-0.75Cu Solder Joints in NaCl Solution Y. F. Gao, C. Q. Cheng, M.L. Huang, L.H. Wang, J. Zhao1 Dalian University of Technology, China F-051 17:10 –17:30 In situ electro-mechanical experiments and mechanics modeling of tensile cracking in indium tin oxide thin films on polyimide substrates Cheng Peng, Zheng Jia, Dan Bianculli, Teng Li1, Jun Lou
29
University of Maryland, USA F-052 17:10 –17:30 Prognostics and Reliability Assessments of Light Emitting Diode Packaging Thamo Sutharssan, Chris Bailey1, Stoyan Stoyanov and
Yasmine Rosunally University of Greenwich, UK
Thursday, August 11, 8:00AM – 9:20AM
Session21: Solid State Lighting Packaging & Integration
Date Thursday, August 11, 2011 Time 8:00AM-9:20AM Venue Room 1
Chairs Dr. Barry ZHONG Dr. Xiaobing LUO
G-010 8:00–8:20 3D Silicon-Based Integration Packaging for Light Emitting Diodes Bin Cao1, Mingxiang Chen, Kai Wang, Xiaogang Liu, Feng Jiao, Shengjun Zhou, Sheng Liu Wuhan National Laboratory for Optoelectronics, China G-004 8:20--8:40 Effects of YAG: Ce Phosphor Paricle Size on Optical Performance of White LEDs Zongyuan Liu1, Sheng Liu, Cheng Li and Binghai Yu Foshan Nationstar Optoelectronics Co. Ltd., China G-005 8:40--9:00 Study of high power light-emitting diode module failure mechanism under an accelerated aging test Bulong Wu, Xiaobing Luo1 and Sheng Liu Huazhong University of Science & Technology, China G-008 9:00--9:20 Freeform Lens Design for Uniform Illumination with Extended Source Dan Wu, Kai Wang, Sheng liu1 Wuhan National Laboratory for Optoelectronics, China
Session 22: Packaging Materials & Processes Date Thursday, August 11, 2011 Time 8:00AM-9:20AM Venue Room 2
Chairs Prof. Liqiang CAO Prof. Yanhong TIAN
B-039 8:00--8:20 A study on the low temperature sintering-bonding through Ag nanoparticles in-situ formed from Ag2O microparticlesFengwen Mu1, Guisheng Zou, Jianfeng Yan, Hailin Bai and Aiping Wu Tsinghua University, China B-044 8:20–8:40 Effect of electromigration on interfacial reaction of Ni/Sn-3.0Ag-0.5Cu/Cu solder joint in flip chip package L. D. Chen, M. L. Huang1, S. Ye, S. M. Zhou, Y. M. Ye, J. F. Wang, X. Cao Dalian University of Technology, China
B-055 8:40–9:00 Employment of electroplated and sputtered Ni-Zn films for under bump metallization with Sn-3.0Ag-0.5Cu solder attached during liquid reactions H.M. Lin, J.G. Duh1 National Tsing-Hua University, Taiwan, China B-61 9:00–9:20 Viscosity and thermal conductivity of alumina microball/epoxy composites Hui Yu, Liangliang Li1, Longhao Qi Tsinghua University, China
Session 23: Packaging Design & Modeling Date Thursday, August 11, 2011 Time 8:00AM-9:20AM Venue Room 3
Chairs Prof. Bill CHEN Prof. Hua LU
C-042 8:00–8:20 Vibration and bondability analysis of fine-pitch Cu wire bonding Chang-Lin Yeh1, Ying-Chih Lee , Yi-Shao Lai Advanced Semiconduct Engineering Inc. Taiwan, China C-043 8:20--8:40 Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder joints under high current stressing S. Ye, M. L. Huang1, L. D. Chen, S. M. Zhou Dalian University of Technology, China C-045 8:40--9:00 Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface Xiancai Chen1, Bo Tao,Zhouping Yin Huazhong University of Science & Technology, China C-047 9:00--9:20 Wire sweep study for SOT package array matrix molding with simulation and experimental analysis Jiale Han1, Haibin Chen, Ke Xue, Fei Wong, Karina Leung, Ivan Shiu, Jingshen Wu The Hong Kong University of Science & Technology, Hong Kong, China
Session 24: Quality & Reliability Date Thursday, August 11, 2011 Time 8:00AM-9:20AM Venue Room 4
Chairs Dr. Boyi WU Dr. Ivan SHAM
30
F-053 8:00–8:20 Thermomigration in Lead-Free Solder Joints at low Ambient Temperature Lan Ding, Yuan Tao, Yiping Wu1 Huazhong University of Science & Technology, China F-054 8:20--8:40 Improved Humidity Resistance of Leaded Packages through Solder Dip Process Yeoh Lai Seng1, Ng Eng Keat, Gooi Boon Hooi Spansion Inc., Malaysia F-057 8:40--9:00 Crosstalk Analysis and Optimization of High-Speed Interconnects Haidong Wang1, Jian Song, Fengman Liu, Haifei Xiang, Wei Gao, Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, China F-058 9:00--9:20 Characterization of the hot-cutting defects produced during the processing of alumina green tape Zeng Chao, Wang Chunqing, Tian Yanhong1, Liu Wei, An rong, Hang Chunjing Harbin Institute of Technology, China
Session 25: Quality & Reliability Date Thursday, August 11, 2011 Time 8:00AM-9:20AM Venue Room 5
Chairs Dr. Chenxi WANG Dr. Min MIAO
F-062 8:00--8:20 Comparison of charge injection in SiO2 and Si3N4 for Capacitive RF MEMS switches Gang Li1, Ulrik Hanke and Xuyuan Chen Vestfold University College, Norway F-063 8:20--8:40 Finite element simulation of interfacial crack propagation behavior in BGA solder interconnects Hong-Bo Qin1, Bin Li, Xun-Ping Li, Xin-Ping Zhang South China University of Technology, China F-065 8:40--9:00 Effect of rapid thermal cycles on the microstructure of single solder joint Jibing Chen, Yiping Wu1, Bing An Wuhan National Laboratory for Optoelectronics, China F-070 9:00--9:20 Theoretical analysis on the element diffusion during thermomigration Yuan Tao, Lan Ding, Yiping Wu1, Boyi Wu Huazhong University of Science & Technology, China
Thursday, August 11, 10:20AM – 12:10PM
Session 26: Solid State Lighting Packaging & Integration
Date Thursday, August 11, 2011 Time 10:20AM-12:10PM Venue Room 1
Chairs Mr. T. ONISHI Prof. Xu CHEN
Invited Talk 10:20–10:50 LED packaging study by tear down approaching Mr. T. ONISHI GJ Tech, HK, China G-012 10:50--11:10 Static and Dynamic Analysis for High Power Light Emitting Diodes Street Lamp under Wind Load Xiaogang Liu1, Zhaohui Chen, Sheng Liu Wuhan National Lab for Optoelectronics, China G-016 11:10--11:30 Effect of Plating Parameters on the Au-Sn Co-electrodeposition for Flip Chip-LED Bumps J. L. Pan, M. L. Huang1 Dalian University of Technology, China G-017 11:30--11:50 Effects of die-attach materials on the optical durability and thermal performances of HP-LED Luqiao Yin, Lianqiao Yang, Guangming Xu, Weiqiao Yang, Shuzhi Li, Jianhua Zhang1 Shanghai university, China
G-020 11:50--12:10 Novel Cooling Solutions for LED Solid State Lighting Kai Zhang1, David G. W. Xiao, Haibo Fan, Xiaohua Zhang, Zhaoli Gao, Matthew M. F. Yuen The Hong Kong University of Science & Technology, Hong Kong, China
Session 27: Packaging Materials & Processes Date Thursday, August 11, 2011 Time 10:20AM-12:10PM Venue Room 2
Chairs Prof. Hao TANG Dr. Bing AN
Invited Talk 10:20–10:50 Advanced Epoxy Molding Compound Technology & Marketing Trend Dr. Tom XIE Henkel, China B-065 10:50--11:10 Microstructure and mechanical properties of Sn3Ag0.5Cu3Bi0.05Cr/Cu joints Fei Lin, Wenzhen Bi, Guokui Ju, Xicheng Wei1 Shanghai University, China B-067 11:10--11:30 Design, fabrication of through silicon vias based on suspended photoresist thin film and its application in silicon interposer
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Ziyang Wu, Chuanguo Dou, Yanhong Wu, Heng Yang1 Shanghai Institute of Microsystems and Information Technology, Chinese Academy of Sciences, China B-072 11:30--11:50 Three Years of Fine Copper Wire Bonding in High Volume Manufacturing B. K. Appelt1, Louie Huang, Yi-Shao Lai and Scott Chen ASE Group Inc., USA B-074 11:50--12:10 Investigation of various pad structure influence for copper wire bondability Qiang Chen1, Zhenqing Zhao, Hai Liu, Jonghyun Chae, Myungkee Chung Samsung Semiconductor China R&D, China
Session 28: Packaging Design & Modeling Date Thursday, August 11, 2011 Time 10:20AM-12:10PM Venue Room 3
Chairs Dr. Yan ZHANG Dr. Qing ZHOU
Invited Talk 10:20–10:50 Advanced package design driven by simulation Dr. Minggang HOU ANSYS, China C-052 10:50–11:10 Main cause of resonance appeared around 7.5GHz on the frequency response of S-parameters of PWB Zhang Nian Yong, Men Chuan, Takeshi Kawai1, Ren Wei, Wu Xiao Qing Xi’an Jiaotong University, China C-054 11:10--11:30 Solder Ball Drop Reliability Investigations: BGA versus WLP Amarinder Singh Ranouta, Xuejun Fan1 Lamar University, USA C-060 11:30--11:50 On the analysis of dynamic effect in the impact stage of die pick-up process Bo Peng1, YongAn Huang, ZhouPing Yin and YouLun Xiong Huazhong University of Science & Technology, China C-061 11:50--12:10 A new RF Capacitive Accelerometer Embedded in LTCC Packaging Substrate Rui Cao, Zhe Wang, Yufeng Jin1, Min Miao, Hua Gan Peking University, China
Session 29: Emerging Technologies Date Thursday, August 11, 2011 Time 10:20AM-12:10PM Venue Room 4
Chairs Prof. James CAI Dr. Andy TSENG
Invited Talk 10:20–10:50 Several Co-design Issues Using DfX for Solid State Lighting Prof. Sheng LIU
HUST, China H-001 10:50--11:10 Copper Pillar Bump (CPB) Technology Progress OverviewWei Koh1, PhD, Barry Lin Powertech Technology Inc. H-002 11:10--11:30 Mechanical testing and analysis of polymer based flexible solar cell and full cell packaging Xing Chen1, Sheng Liu Wuhan National Lab for Optoelectronics, China H-004 11:30--11:50 Die Bonding of Single Emitter Semiconductor Laser with Nano-Scale Silver Paste Yi Yan, Xu Chen1, Xing-Sheng Liu, Guo-Quan Lu Tianjin University, China H-008 11:50--12:10 Packaging of High Power Density Double Quantum Well Semiconductor Laser Array using Double-side Cooling Technology Jingwei Wang1, Pu Zhang, Lingling Xiong, Xiaoning Li, Chenhui Peng, Zhenbang Yuan, Lu Guo, Xingsheng Liu Xi’an Focuslight Technologies Co., Ltd., China
Session 30: Quality & Reliability Date Thursday, August 11, 2011 Time 10:20AM-12:10PM Venue Room 5
Chairs Prof. Chris BAILEY Dr. Yanrong ZHANG
Invited Talk 10:20–10:50 Effect of Interfacial Reaction on Reliability of Flip Chip Lead-free Solder Joints Prof. Mingliang HUANG DLUT, China F-071 10:50--11:10 TEM Study on the Cu Wire Stitch Bonding Interface XingJie Liu1, TeChun Wang, YuQi Cong, JiaJi Wang, Fudan University F-077 11:10--11:30 The Effect of Thermal aging on the mechanical properties of molding compounds and the reliability of electronic packaging Daoguo Yang1, Zaipu Cui Guilin University of Electronic Technology, China A-024 11:30--11:50 Investigations on microstructures and properties of low Ag content Sn-Ag-Cu lead-free solder alloys Wei guoqiang1, Wan zhonghua South China University of Technology, China A-037 11:50--12:10 Chip-on-board (COB), Wafer-level Packaging of LEDs Using Silicon Substrates and Hot-formed Glass-bubble Caps Hui Yu, Jintang Shang1, Chao Xu, Xinhu Luo, Jingdong Liu and Li Zhang Southeast University, China
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OVERVIEW OF POSTER PRESENTATION SESSIONS
Poster Session 1 – August 10, Wednesday 09:20AM--10:20AM
Area 1 Area 2 Area 3 Area 4 Area 5 (Session A) (Session B) (Session C) (Session D) (Session F)
Chairs: Dr. Jinsong ZHANG
Dr. Xiuzhen LU
A-007, A-008, A-009, A-011, A-012, A-015, A-016, A-019,
B-001, B-004, B-006, B-007, B-009, B-012, B-013, B-017, B-020, B-021, B-022, B-023, B-024, B-025, B-027,
C-001, C-009, C-010, C-013, C-015, C-018, C-019, C-020, C-021, C-024, C-026,
D-001, D-002, D-003, D-005, D-007, D-008, D-010, D-012,
F-004, F-008, F-010, F-012, F-013, F-014, F-015, F-016, F-017, F-022, F-024,
Poster Session 2 – August 10, Wednesday 14:50PM--15:50PM
Area 1 Area 2 Area 3 Area 4 Area 5 (Session A) (Session B) (Session C) (Session E) (Session F)
Chairs: Dr. Jinsong ZHANG
Dr. Xiuzhen LU
A-021, A-023, A-027, A-031, A-032, A-033, A-034, A-036, A-043,
B-037, B-040, B-041, B-042, B-043, B-045, B-046, B-047, B-048, B-049, B-050, B-051, B-052, B-053, B-054,
C-027, C-028, C-029, C-030, C-031, C-033, C-037, C-038, C-040, C-041, C-044, C-046,
E-002, E-004, E-005, E-008, E-009,
F-025, F-029, F-030, F-031, F-032, F-033, F-035, F-036, F-041, F-045, F-047, F-048, F-049, F-050,
Poster Session 3 – August 11, Thursday 9:20AM--10:20AM
Area 1 Area 2 Area 3 Area 4 Area 5
(Session G) (Session B) (Session C) (Session H) (Session F)
Chairs: Dr. Jinsong ZHANG
Dr. Xiuzhen LU
G-001, G-003, G-006, G-007, G-013, G-014, G-015, G-018, G-019,
B-056, B-057, B-058, B-059, B-060, B-064, B-066, B-070, B-071, B-073,
C-048, C-049, C-050, C-053, C-056, C-057, C-058, C-059, C-062,
H-003, H-005, H-007, H-009, H-010, H-011, H-012, H-013, H-014, H-015,
F-055, F-056, F-059, F-061, F-064, F-066, F-069, F-074, F-075, F-076, F-079, F-080, F-081, F-082,
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POSTER SESSION 1 Note: Only the contact information of the first author is provided because of the length limitation of the conference program.
Wednesday, August 10, 9:20AM – 10:20AM
Area 1 (Session A): Advanced Packaging & System Integration
A-007 Finite element stress analysis of 3D TSV stack subject to large temperature loading Zhiyuan Zhu, Wenping Kang, Yunhui Zhu, Min Yu, Min Miao, Jing Chen, Yufeng Jin1 Peking University, China A-008 A Low Cost TSV Interposer Fabrication Process and Its Modeling Yunhui ZHU, Shenglin MA, Qinghu CUI, Wenping KANG, Zhiyuan ZHU, Xin SUN, Guanjiang WANG, Mengmeng ZHANG, Jing CHEN, Min MIAO, Yufeng JIN1 Peking University, China A-009 3D integration of Pressure Sensor System with Through Silicon Via (TSV) Approach Tao WANG1, Jian CAI, Qian WANG, Hao ZHANG, Zheyao WANG Tsinghua University, China A-011 Experimental study on EFO process of thermosonic wire bonding by using high-speed video record
Xiang Kang1, Han Lei Central South University, China A-012 The Effect of Polyethylene Glycols upon Copper Electrodeposition in Methanesulfonate Electrolytes Chunhua Ji1, Huiqin Ling, Ming Li, Dali Mao Shanghai JiaoTong University, China A-014 Low temperature thermocompression bonding based on copper nanostructure for 3D packaging
Mingxian Cai1, Mingxiang Chen, Sheng Liu Wuhan National Lab for Optoelectronics, China A-015 Ultra-Low Leak Detection of Cu/Sn SLID for High Density Wafer Level Packaging
Ani Duan1, Knut Aasmundtveit, Nils Hoivik Vestfold University College, Norway A-016 Development of deep reactive ion etching of tapered via holes for TSV interconnection Xiao CHEN1, Jiajie TANG, Wenguo NING, Gaowei XU, Le LUO Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China A-019 Fabrication of Integrated Microwave Passive Devices
Using Thick BCB as Dielectric at Wafer Level Jiajie Tang1, Xiao Chen, Xiaowei Sun, Le Luo Shanghai Institute of Microsystem and Information Technology, China
Area 2 (Session B): Packaging Materials & Processes
B-001 The Improvement of Bondability and Die-Shear force of Chips Thermosonically Bonded to Flex Substrates by Depositing a Nickel Layer Cheng-Li Chuang1, Jong-Ning Aoh, Chi-Chuan Pan Chung Shan Medical University, Taiwan, China B-004 Effect of organic acid fluxes on wetting of Sn-Bi solder on Cu surface H. C. Shi, A. P. Xian1 Institute of Metal Research, Chinese Academy of Sciences, China B-006 Fragility Suppression Via BGA With SAC105Ti Ball Weiping Liu, Ning-Cheng Lee1, Simin Bagheri, Polina Snugovesky, Jason Bragg, Russell Brush, Blake Harpe Indium Corporation, USA B-007 Superhydrophobic nickel films fabricated by electro/electroless deposition Feifei Tian1, Anmin Hu, Ming Li, Dali Mao Shanghai Jiao Tong University, China B-009 Preparation and Microstructure of Functionally Gradient Diamond/SAC Composite Solder Bumps Zhong Ying1, Zhang Wei, Wang Chunqing, Wang Chunyu Harbin Institute of Technology, China B-012 Retarding the Electromigration Effects on the Sn-Ag-Cu Solder Joints by Micro-sized Metal-Particles Reinforcement Limin Ma, Guangchen Xu, Fu Guo1, Xitao Wang Beijing University of Technology, China B-013 Galvanic Corrosion of Couple with Different Metal Substrates and Ni-C Fill Conductive Silicon Rubber Hu Zhou1, Zhidong Xia, Zhe Li, Xiaohei Liu, Fu Guo Beijing University of Technology, China B-017 Polymer nanocomposites for screen printed electronic interconnections Kamil Janeczek1, Aneta Arazna, Konrad Futera, Grazyna Koziol, Malgorzata Jakubowska, Anna Młozniak, Wojciech Steplewski Tele and Radio Research Institute, Poland
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B-020 Nanoindentation for measuring mechanical properties of Sn-Ag-Cu-RE BGA solder joints Wang Lifeng1, LIU Meirna, Tian Chong jun, Yang Wenxuan Harbin University of Science & Technology, China B-021 Influence of rare earth addition on the microstructure of Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu microscale solder joints Wei Li1, Min-Bo Zhou, Xiao Ma, Xin-Ping Zhang South China University of Technology, China B-022 Electroless and Eletroplating Copper on Liquid Crystal Polymer (LCP) for High Frequency Applications Meisheng Zhou1, Wenlong Zhang, Ming Li, Dongyan DingShanghai Jiao Tong University, China B-023 Preparation and properties of conductive polymer doped with Ag-coated fiber glass for EMI shielding Xiaohei Liu1, Zhidong Xia, Bo Yuan,Mengke Zhao, Fu Guo Beijing University of Technology, China B-024 Preparation and deposition process of Cu/Al powder in conductive polymer for EMI shielding
Xing zhang1, Zhidong Xia, Shaofan Zhao, Yong Gao Beijing University of Technology, China, B-025 Enhanced thermoelectric figure of merit of Bi2Te3-based thin-film microcooler with non-planar barrier structure Leilei Han1, Chunqing Wang Harbin Institute of Technology, Nangang, China B-027 Size Effect on Coalescence of Intermetallic Compounds in Reflowed Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/Cu Solder Joints Min-Bo Zhou1, Xiao Ma, Xin-Ping Zhang South China University of Technology, China
Area 3 (Session C): Packaging Design & Modeling
C-001 The Copper Stud Bumping Shaping Simulation Based on Thermal-Solid couple analysis Zhang Shanshan1 Anyang Institute of Technology, China C-009 Signal Integrity Simulation for SiP Using GTLE Jia Jia1, Liqiang Cao, Lixi Wan Institute of Microelectronics, Chinese Academy of Science, China C-010 Modeling of kink effect for undoped polycrystalline silicon thin-film transistors Hongyu He1, Xueren Zheng Guangdong University of Technology, China
C-013 FE simulation of joint volume effect on fracture behavior of BGA structure Sn3.0Ag0.5Cu solder interconnects under lap shear loading J.M. Xia1, X.P. Li, X. Ma, X.P. Zhang South China University of Technology, China C-015 Investigation of bulk resistance for metal-coated polymer particles used in anisotropic conductive adhesive Xiancai Chen1, Bo Tao, Zhouping Yin Huazhong University of Science & Technology, China C-018 A Study of Thermal Behavior of High Power Double-Quantum-Well Semiconductor Laser Pu Zhang1, Xiaochen Ding, Jingwei Wang, Xiaoning Li, Lingling Xiong, Chenhui Peng, Xiang Ou, Xingsheng Liu Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, China C-019 Investigation on Lead-free Solder Joint Reliability of Edge-Bonded CBGA under Temperature Cycling Y. Sing Chan, Fubin Song, S. W. Ricky Lee1 The Hong Kong University of Science and Technology, Hong Kong, China C-020 Design optimization on the CoB LED module Gong Yu-bing1 Guilin University of Electronic Technology, China C-021 Molecular Dynamics Simulation for the Bonding Energy of Metal-SWNT Interface Yahui Zhang1, Zhili Hu, Yan Zhang, Lilei Ye, Johan Liu Shanghai University, China C-024 A Constitutive Model for Lead-free Solders by Considering Damage Effects at High Strain Rates WANG Xuming, QIN Fei1, AN Tong Beijing University of Technology, China C-026 Influence of Interfacial Delamination on Temperature Distribution of QFN Packages BAN Zhaowei, QIN Fei1, WANG Xuming Beijing University of Technology, China
Area 4 (Session D): High Density Substrate & SMT
D-001 Study on Solder Joint Image Segmentation Techniques Based on Matlab ZHU Shao-hua1,WU Zhao-hua,SUN Yu-feng Guilin University of Electronic Technology, China D-002 Pad Design, Soldering Technology and Reliability of Package on Package Yuming Wang1, Jian Cai, Wang Beibei, Yang Xinghua Tsinghua University, China D-003 SMD Reliability Research Base on Stolkarts Fatigue
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Model Zhao Wang1, Heming Zhao, Wenzhong Lou, Liu Chuanqin , Hanwei Li, Li Jin North university of China, China D-005 Study on Intelligent Identification Technology of Solder Joints Defects Based on LMBP Neural Network WU Zhao-hua1 GuiLin University of Electronic Technology, China D-007 Study on the Heat Dissipation of the Thermal Via in T/R Modules Based on BP-GA Tang-wen Bi1, De-jian Zhou GuiLin University of Electronic Technology, China. D-008 The intelligent detection method study of PQFP solder joint defects based on improved neural network Tianxiang Yan1, Dejian Zhou Guilin University of Electronic Technology, China D-010 Mechanical and Thermal Analysis of 3D embedded capacitor filling with conductive adhesive Huijuan Wang1, Daquan Yu, Ran He, Fengwei Dai, Xueping Guo, Lixi Wan Institute of Microelectronics Chinese Academy of Sciences, China D-012 A new measurement method and electrical design for high density optoelectronics integration Fengman Liu1, Baoxia Li, Yunyan Zhou, Wei Gao, Haifei Xiang, Haidong Wang, Jian Song, Zhihua Li, Kun Yang,Liqiang Cao,Lixi Wan Institute of Microelectronics, Chinese Academy of Science, China
Area 5 (Session F): Quality & Reliability F-004 A Damage model for SnAgCu Solder under Thermal Cycling Hui Xiao1, Xiaoyan Li, Na Liu, Yongchang Yan, Beijing University of Technology, China F-008 Irregular tin whisker growth on the surface of Sn-3.8Ag-0.7Cu-1.0RE solder joints Hu Hao1, Jun Tian, Guangchen Xu, Fu Guo, Yonglun Song Beijing University of Technology, China F-010 In situ measurement and binning system of LED for
improved color consistency Shengjun Zhou1, Sheng Liu Shanghai Jiao Tong University, China F-012 Tensile Properties of PV ribbons with Sn-Pb-X Coating Xuewei Wu, Dongyan Ding1, Yanting Zhou, Bai Han, Yunhong Yu, Xulin Sun, Ming Li, Dali Mao Shanghai Jiao Tong University, China F-013 Tin whisker formation on electroless tin films deposited on lead-frame alloys Ting Liu, Yiqing Wang, Dongyan Ding1, Klaus-Peter Galuschki, Yu Hu, Angela Gong, Ming Li, Dali Mao Shanghai Jiao Tong University, China F-014 Influence of Reflow Atmosphere on the Lead-Free Solder Joints Yanting Zhou, Dongyan Ding1, Bai Han, Xuewei Wu, Xulin Sun, Yunhong Yu, Ming Li, Dali Mao
Shanghai Jiao Tong University, China F-015 Phase Segregation under Reversed Current Stressing in Eutectic Sn-based Solder Joints Sihan Liu1, Guangchen Xu, Fu Guo, Andre Lee, K.N. Subramanian, Beijing University of Technology, China F-016 Simulation and Experimental Investigation for Board Level Package-on-Package in Drop Test Zerui Fan, Xiaohu Yao1
South China University of Technology, China F-017 Preparation and Properties of Electroless Deposited NiP, NiWP as Barrier Layer on p-type Si Yuhang Xin1, Anmin Hu, Ming Li, Dali Mao Shanghai Jiao Tong University, China. F-022 Application of Response Surface Methods in Lead-free Solder Joints of Plastic Ball Grid Array Thermal Fatigue Life Prediction Zhao Qiang1, Dejian Zhou GuiLin University of Electronic Technology, China F-024 Oxidation behavior of Sn-9Zn-3Bi-XCr solders under high-temperature condition Jing Hu1, Anmin Hu,Ming Li, Dali Mao Shanghai Jiao Tong University, China
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POSTER SESSION 2
Wednesday, August10, 14:50PM – 15:50PM
Area 1 (Session A): Advanced Packaging & System Integration
A-021 An Application of System in Package Technology: UTI ZHU Wenhui1, GUO Xiaowei, WEI Jianyou, WANG Yongzhong, LI Xizhou, QIN Fei, XIA Guofeng Tian shui Hua tian Microelectronics Co., Ltd, China A-023 Thermal cycling reliability of edge and corner bonded package stackable very thin fine pitch ball grid array assemblies SHI Hongbin1 and UEDA Toshitsugu. WASEDA University, Japan A-027 Development Process of Phosphor Coating with Screen Printing for White Light Emitting Diode Packaging Shan Yu1, Liang Yang, Feng Jiao, Huai Zheng, Mingxiang Chen, Sheng Liu Wuhan National Laboratory for Optoelectronics, China A-031 Process characterization and optimization of copper TSV interconnection Shenglin Ma, Yunhui Zhu, Xin Sun, Min Miao, Jin Chen, Yufeng Jin1 Peking University, China A-032 Process development of multi-layer stacked chip module Shenglin Ma, Xin Sun, Yunhui Zhu, Wenping Kang, Qinghu Cui, Min Miao, Jin Chen, Yufeng Jin1 Peking University, China A-033 Wafer Level Vacuum Packaging for MEMS Device by Solder Sealing Bing An1, Gan-ran Tang, Ya-nan Sun, Yi-ping Wu Huazhong University of Science & Technology, China A-034 Wafer-level Chip-to-Wafer Integration of High-Sensitivity MEMS and IC Gaowei Xu1, Peili Yan, Xiao Chen, Wenguo Ning, Le Luo, Jiwei Jiao Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China A-036 Preparation of Micro-nano Glass Cavities by a Novel Hot Forming Process Xinhu Luo, Jintang Shang1, Hui Yu, Jingdong Liu Southeast University, China A-043 Solution to Leakage of Polyimide-structural Wafer Level Package Dong Chen1, CM Lai, KH Tan, Li Zhang, XinJiang Long Jiangyin Changdian Advanced Package Co., LTD, China
Area 2 (Session B): Packaging Materials & Processes
B-037 Improving the Thermal Conductivity of Epoxy Resins with Mesogenic Units for Electronic Packaging Jingfeng Hao1, Dayong Gui, Jianhong Liu, Wentao Zeng Shenzhen University, China B-040 Deformation characteristics of micrometer coarse-grained aluminum wires exposed under ultrasonic at room temperature Hongjun JI, Mingyu LI1 Shenzhen Graduate School, Harbin Institute of Technology, China B-041 Synthesis and Characterization of Benzocyclobutene- Functionalized Siloxane Thermoset with a Cyclic Structure Jun Yang1, Mingfei Sun, Yuanrong Cheng, Fei Xiao Fudan University, China B-042 The study on the shaping of electroplated Copper Pillar Bumping Ying Han1, Hongqi Sun, Su Wang, Ming Li, Jiangyan Sun Shanghai Jiaotong University, China B-043 Solder wetting on the substrates with Tin finish Cai Chen, Lei Zhang1 and J. K. Shang Institute of Metal Research, Chinese Academy of Sciences, China B-045 Elecromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ ENEPIG flip chip solder joint S.M. Zhou, M.L. Huang1, L.D. Chen, S. Ye, Y.M. Ye, J.F. Wang, X. Cao Dalian University of Technology, China B-046 Effect of Solder Volume on Interfacial Reaction Between Sn-3Ag-0.5Cu Solder Ball and Cu Pad After Multiple Reflows Luwei Liu, Mingliang Huang1 Dalian University of Technology, China B-047 Mechanical Properties and Electrochemical Corrosion Behavior of Al-Cu Solder Joints with solder alloys of Sn-Zn-Al, Sn-Zn-Ag, Sn-Zn-Ag-Al N. Kang, M. L. Huang1 Dalian University of Technology, China B-048 Recent progress in the studies of low melting Sn-based Pb-free solder alloys Yang Lin1, Luqiao Yin, Xicheng Wei Shanghai University, China B-049 Effects of soldering time and cooling rates on microstructures of intermetallic compounds in Sn-Ag/Cu
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soldering reaction L. Y. Gu, L. Qu, H. T. Ma1 Dalian University of Technology, China B-050 Effect of Electromigration on Creep Rupture Life of Sn-Ag-Cu Solder Joints H. Y. Liu, Q. S. Zhu1, Z. G. Wang, J. K. Shang Institute of Metal Research, Chinese Academy of Sciences, China B-051 Thermal and Dielectric Properties of Bismaleimide- Triazine resin/Boron Nitride Composite Xiaoliang Zeng, Shuhui Yu1, Rong Sun, Ruxu Du Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China B-052 Carboxyl-Terminated Polyesterimide/Epoxy Resin System: Preparation and Thermomechanical Properties Dayong Gui1, XinMiao, Jingfeng Hao, Wentao Zeng, Jianhong Liu Shenzhen University, China B-053 Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints Lina Niu, Yanhong Tian1, Chunqing Wang Harbin Institute of Technology, China B-054 Dielectric properties of BaTiO3 -based mu ltilayered thin films for capacitors prepared by sol-gel technique Bin Li1, Chunqing Wang, Wei Zhang, Ying Zhong, Weiwei Wu Harbin Institute of Technology, China
Area 3 (Session C): Packaging Design & Modeling
C-027 Morphology and nano-indentation properties of intermetallic compounds in solder joints ZHONG Weixu, QIN Fei1, AN Tong Beijing University of Technology, China C-028 3D Modeling and Simulation of Heat Transfer for Internal Channel Cooling of 3D-Chip Stacks Jing Zhang1，Guidotti.Daniel, Xueping Guo, Jing Zhou, Liqiang Cao, Daquan Yu, Lixiwan Institute of Microelectronics, Chinese Academy of Sciences, China C-029 Modeling and Finite-Element Full-wave Simulation of Glass Interposer with TGVs (Through-Glass-Vias) for 3D packaging Zhang jing1, Sun xiaofeng, Yu daquan, Cao liqiang, Wan lixi Institute of Microelectronics, Chinese Academy of Sciences, China
C-030 Ultra-Wideband Noise Isolation on Power Distribution Network of High-speed Package Substrate Baoxia Li1 and Lixi Wan Institute of Microelectronics, Chinese Academy of
Sciences, China C-031 A novel cooling structure for electronic package Jun Li1, Xueping Guo, Jing Zhang, Liqiang Cao, Lixi WanInstitute of Microelectronics, Chinese Academy of Sciences, China C-033 Power Integrity Simulation for Multilayer Power Distribution Networks Based on GTLE and Via Model Yunyan Zhou1, Lixi Wan, Shuhua Liu, Liqiang Cao, Jia jiaInstitute of Microelectronics, Chinese Academy of Sciences, China C-037 Geometric optimization of Carbon nanotubes(CNTs) microchannel with liquid flow Wang Dianxiao1, Wang Xiaojing, Wang Jia, Li Zongshuo Shanghai University, China C-038 Current optimization of different chips for High Power Light-emitting diodes Liang Yang, Sheng Liu1, Run Chen, Zhicheng Lv Huazhong University of Science & Technology, China C-040 Effects of Package Type, Die Size, Material and Interconnection on the Junction-to-Case Thermal Resistance of Power MOSFET Packages Cong Yue1, Jun Lu, Xiaotian Zhang, Yueh-Se Ho Agape Package Manufacturing Ltd., China C-041 Modeling and Design of Coplanar Structure in QFP80 Package for RFIC Applications Sun haiyan1, Wu jianhui Southeast University, China C-044 Thermal Stress Simulation of PBGA under Natural Convection Using A Fluid-solid Coupling Method Zhimin Wan, Ling Xu, Xiaobing Luo1, Sheng Liu Huazhong University of Science & Technology, China C-046 Low Electromagnetic Interference Optoelectronic Packaging of a 40Gbps Optical Transceiver WAN Lixi1, LI Zhihua, LI Baoxia, LIU Fengman, LI Jun, SONG Jian, XIANG Haifei & ZHONG Hanmei Institute of Microelectronics, Chinese Academy of Sciences, China
Area 4 (Session E): Advanced Manufacturing Technologies & Packaging Equipment
E-002 Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices Lei Yang1, Wei Liu, Chunqing Wang, Yanhong Tian Harbin Institute of Technology, China E-004 Technology of Embedded Capacitance And Resistance Hu Shaohua1 Shennan Circuit Co., China E-005 An Experimental Investigation on Thermal Contact Resistance Across Metal Contact Interfaces Xiaobing Luo1, Han Feng, Jv Liu, Minglu Liu and Sheng
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Liu Huazhong University of Science & Technology, China E-008 Novel Design of Handling System for Silicon Wafer Thinning Cao Li1, Xuefang Wang, Shengjun Zhou, Chang Hu, Sheng Liu Huazhong University of Science & Technology, China E-009 Study of GaN-based light-emitting diodes with double roughened surfaces Lianqiao Yang1, Jianzheng Hu, Meijuan Fu, Jianhua Zhang Shanghai University, China
Area 5 (Session F): Quality & Reliability F-025 SOP Package Surface Discoloration after PCT Test Mu-Chun Wang1, Hsin-Chia Yang, Chuan-Hsi Liu, Ren-Hau Yang Minghsin University of Science & Technology, Taiwan, China F-029 The solder volume effect on the creep behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints X.P.Li1, J.M. Xia, X.P. Zhang South China University of Technology, China F-030 Reliability of discoloration of silver colloid for microelectronic package Rao zhenzhen1, Bao Shengxiang, Shi Guanghua, Li Peng,, Ye Jianhai University of Electronic Science & Technology of China, China F-031 The Technology Study of BGA Solder Joint Two-dimensional Shape in the Information Extraction Wan Yuan1, Zhou De-jian, Zhu Shao-hua Guilin University of Electronic Technology, China F-032 Kirkendall Voids Evolution in Sn-Ag-In Solder Bumps and Its Effect on Reliability Dongliang Wang1,Yuan Yuan, Qiuping Huang, Wenguo Ning, Le Luo Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, China F-033 Effect of indium addition on the formation of large Ag3Sn plate in Sn-Ag solder bumps
Dongliang Wang1,Yuan Yuan, Le Luo Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, China F-035 Effect of Fixation Method on Solder Joint Vibration Fatigue Reliability of High Density PCB Assembly Xueli. Qi1, Bin. Zhou, Yijun. Xu, Yunfei. En, Guoyuan. LI South China University of Technology, China F-036 Study on the adhesion and reliability of epoxy molding compound and shaped Pd preplated leadframes Mingzhi Ni1, Wenjing Zhang, Ming Li, Dali Mao Shanghai Jiao Tong University, China F-041 The Common Failure Mechanisms of Plastic Encapsulated Devices Induced by Package Defect Yuan Chen1, Ping Li The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China F-045 The impact of wire bonding on the transmission performance of high-speed links in SiP YANG Kun1, GAO Wei, LI Zhihua, WAN Lixi Institute of Microelectronics, Chinese Academy of Science, China F-047 Vibration Reliability Test and Analysis for Vibration- Induced Solder Joint Failure of PBGA Assembly Bin ZHOU1, Yunfei EN, Xueli QI Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China F-048 Study of Junction Temperature with degradation of High Power Light-emitting diodes Quan Chen, Xiaobing Luo1, Run Chen, Sang Wang, Zhaohui Chen, Sheng Liu Huazhong University of Science & Technology, China F-049 Drop Impact Test on High Power Light Emitting Diodes Module Tao Peng, Xuefang Wang, Run Chen, Qin zhang, Sheng Liu1 Huazhong University of Science & Technology, China F-050 Application of silicon stress sensor in flip chip packaging system Chengjie Jiang1, Fei Xiao, Heng Yang, Chuanguo Dou Fudan University, Shanghai China
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POSTER SESSION 3
Thursday, August 11, 9:20AM – 10:20AM
Area 1 (Session G): Solid State Lighting Packaging & Integration
G-001 Analysis of thermal spreading resistance in high power LED package and its design optimization Shaojie Dong1, Qiang Zhou, Minghua Wang, Xiaoqing Jiang, Jianyi Yang Zhejiang University, China G-003 Structural Design and Heat Dissipation Research of Integrated 3W White LED Miner’s Lamp Rongbin Ren1, Daoguo Yang, Dongjing Liu Guilin University of Electronic Technology, China G-006 Precise model of phosphor geometry of conventional dispensing in LEDs packaging Huai Zheng, Jinlong Ma1,Xiaobing Luo1 and Sheng Liu Huazhong University of Science & Technology, China G-007 Effect of the amount of phosphorous silicone gel on the optical properties of phosphor-converted white light-emitting diodes packaging Run Hu, Xiaobing Luo1 and Sheng Liu Huazhong University of Science & Technology, China G-013 Effects of grooves substrate on interfacial resistance for LED modules Tao Peng, Mingxiang Chen, Xiaogang Liu, Sheng Liu1 Wuhan National Lab for Optoelectronics, China G-014 Research on heat dissipation of high heat flux multi-chip white GaN-based LED lamp Fengze Hou1, Daoguo Yang, G.Q. Zhang Guilin University of Electronic Technology, China G-015 Study of light emitting diodes for the application of plant growth in green house Lianqiao Yang1, Jianzheng Hu, Zunmiao Chen, Jianhua Zhang Shanghai university, China G-018 The reliability of high-power LEDs under temperature cycles Fan Huang, Luqiao Yin, Lianqiao Yang, Jianhua Zhang1 Shanghai university, China G-019 Thermal Analysis of Multi-chip Module High Power LED Packaging Pan Kai-lin, Ren Guo-tao1, Li Peng, Huang Peng Guilin University of Electronic Technology, China
Area 2 (Session B): Packaging Materials & Processes
B-056 Synthesis and Characterization of a Novel Liquid Silicone Rubber (LSR) Incorporated with Phenyl-POSS Wentao Zeng1, Dayong Gui, Jianhong Liu, Jingfeng Hao Shenzhen University, China. B-057 The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization Jinglin Bi, Anmin Hu, Ming Li1, Dali Mao Shanghai Jiao Tong University, China B-058 Effect of Al2O3 addition in Sn-Ag-Cu solder balls on the microstructure and shearing strength of BGA packages with immersion Sn surface finish L. C. Tsao1, M. W. Wu, L. P. Feng Pingtung University of Science & Technology, Taiwan, China B-059 Magnetic and Dielectric Property of FeAlSi/BaTiO3/ Epoxy Composite Wenhu Yang, Shuhui Yu1, Rong Sun Shenzhen Institutes of Advanced Technology, China B-060 Research on SiCp/Cu Composites Preparation and Thixo-forming Process Simulation Kaikun Wang1 University of Science & Technology Beijing, China B-064 Improvement of Copper Wire Bonding on Pre-Plated Leadframe Bing An1, Lan Ding, Techun Wang, Tailieh Lu, Liangquan Sun, Yiping Wu Huazhong University of Science & Technology, China B-066 The application of Ni lids in ceramic hermetic package ZHANG ZhiHong1, HE KaiQuan, XIONG HuaBing, LI MaoSong, XU Yang Institue of solid state circuit, China B-070 Reliability improvement of epoxy molding compound on TO252 Hongjie Liu1, Wei Tan, Lanxia Li Jiangsu HHCK advanced material Co., Ltd., China B-071 The effect of Wax on the properties of epoxy molding compound properties Wei Tan1, Hongjie Liu, Lanxia Li,Yanshu Wan Jiangsu HHCK advanced material Co., Ltd., China B-073 Improvement of Smart Card Mechanical Properties Yi Xiao1, Jianfeng Zeng, Yucai Huang, Jonghyun Chae, Myungkee Chung Samsung Semiconductor China R&D, China
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Area 3 (Session C): Packaging Design & Modeling
C-048 A vertical distribution LTCC duplexer Xing Mengjiang1, Yang Yintang, Li Yuejin Research Institute of Microelectronics, Xidian University, China C-049 Design of Band-pass Filter based on Different Materials in LTCC/LTCF Technology Li Yuejin1, Xing Mengjiang, Yang Yintang, Research Institute of Microelectronics, Xidian University, China C-050 Optimized Design of a Novel Broadband LTCC Balun for Wireless Application Xing Mengjiang1, Zhao Yingbo, Li Yuejin, Yang Yintang Xidian University, China C-053 Complete Small Signal Equivalent Circuit Model of 10Gb/s TOSA Package EML Module ChengZhi Xu1, KunZhong Lu Huazhong University of Science & Technology, ChinaC-056 The Effect of Initial Warpage of Top Component on POP Assembly Xiang Qiu1, Jun Wang Fudan University, China C-057 The fatigue failure analysis of 3D SiP with Thouth Silicon Via Wenping Kang, Yang He, Zhiyuan Zhu, Min Miao, Jing Chen, Yufeng Jin1 Peking University, China C-058 Effect of Thermal Shock Profile on solder joint of WLCSPRongHua Hong1, Jun Wang Fudan University, China. C-059 Simulation Studies on PECVD SiO2 Process Aiming at TSV Application Fangdong Yang1, Fuyun Zhu, Min Yu, Haixia Zhang, Yufeng Jin Peking University, China C-062 Electrical Simulation and Measurement of IPD with Multilayer Thin Film Technology for WLP Glen Siew, Serine Soh, Tong Yan Tee1, Haoyang Chen, In Soo Kang, Jong Heon Kim Nepes, Singapore
Area 4 (Session H): Emerging Technologies H-003 Optimized interdigitated electrode design for GaN-based light-emitting diodes Shengjun Zhou1, Bin Cao, Pei Wang, Wei Wei, Zhiyin Gan, Sheng Liu
Shanghai Jiao Tong University, China H-005 Self-assembly of three-dimensional microstructures in MEMS via fluxless laser reflow soldering LeiYang1, Wei Liu, ChunqingWang, Yanhong Tian Harbin Institute of Technology, China H-007 A New Packaging Structure for High Power Light Emitting Diode for Projection Display Application Xiaoning Li1, Chenhui Peng, Lingling Xiong, Pu Zhang, Jingwei Wang, Xingsheng Liu Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, China H-009 Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates Xia Zhang1, Xiaorong Yan, Johan Liu, Jian Yang, James Morris Institute of Microelectronics, Chinese Academy of Sciences, China H-010 Realization of Functionalized Substrate with Embedded Active Components Xia Zhang1, Xueping Guo, Xin Gu, Lingwen Kong, Liqiang Cao, Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, China H-011 Thermal Management Characterization of Active Component Embedded into Organic Substrate Xueping Guo1, Xia Zhang, Jing Zhou, Liqiang Cao, Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, China H-012 Effects of Micron-Sized Metal Particles on the Mechanical Properties of In-Sn Thermal Interface Materials Xu Zhang1, Guangchen Xu, Fu Guo Beijing University of Technology, China H-013 Interfacial Reaction between the Thermopile Materials and Eutectic Sn-Based Solders Shen Li, Ran Zhao, Guangchen Xu1, Fu Guo Beijing University of Technology, China H-014 Thin Film Encapsulation for OLED Display using Silicon Nitride and Silicon Oxide Composite Coating R Z Sang, H Zhang, L long, B wei, Z K Hua, X Y Wu, and J H zhang1 Shanghai University, China H-015 New permeation rate measurement for thin film encapsulation of organic light emitting diodes Hao zhang, Minyan Zhang, Renzheng Sang, Li Long, Bin Wei, Jianhua Zhang1 Shanghai University, China
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Area 5 (Session F): Quality & Reliability F-055 The influence of electromigration and aging on the reliability of SnAgCu lead-free solder joint at 100C Guoqiang Wei1, Jian Yao South China University of Technology, China F-056 Effects of the hardness of Ni/Pd/Au-plated MIS leadframes on the pull force of wedge bond Optimized interdigitated electrode design for GaN-based light-emitting diodes
Rui Guo, Ming Li1, Weiping Li, Dali Mao Shanghai Jiao Tong University, China F-059 A Comparative Investigation of the Electromigration behavior between Wedge-type and Linetype Cu/Sn3.0Ag0.5Cu/Cu Interconnects
Wu Yue, Min-Bo Zhou, Xun-Ping Li, Xiao Ma, Xin-Ping Zhang1 South China University of Technology, China F-061 Failure Analysis Techniques for High Power Light Emitting Diodes Run Chen1, Qin Zhang, Tao Peng, Feng Jiao, Sheng Liu Huazhong University of Science & Technology, China F-064 Sample Preparation Device for Molding Compound Adhesion Test Qin Lu1, Wenjing Zhang, Ming Li, Dali Mao Shanghai Jiao Tong University, China F-066 Reliability Study on High Power LED with Chip on Board Dongjing Liu1, D.G. Yang, Rongbin Ren, Fengze Hou, Chao Huang Guilin University of Electronic Technology, China F-069 Study of Multilayer AlN Ceramic Package Thermal Resistance Measurement
Guo Han1, Wang Shuidi, Cai Jian, Jia Songliang Tsinghua University, China F-074 Study of internal stress on electroplating copper used in Through Silicon Via filling Xue Feng1, Haiyong Cao, Xianxian Yu, Ming Li Shanghai Jiaotong University, China F-075 Reliability Test and Simulate Analyses for High Power LED Zhu Wei-tao1, Pan Kai-lin, Li Peng Guilin University of Electronic Technology, China F-076 Numerical Analysis of Temperature and Humidity Effects on the Reliability of High Power Light Emitting Diode Huang Jing1, Pan Kai-lin, Li Peng, Wang Shuangping Guilin University of Electronic Technology, China F-079 Corrosion Behavior and Electrochemical Migration of 64Sn-35Bi-1Ag Solder Doped with Zn in NaCl Solution and High Humid Thermal Condition for Electronic Packaging L. Hua1, J. S. Zhang Hubei University of Education, China F-080 A New Commixing Sample Preparation Technology for the Interface Analysis of Second Wire Bonding with TEMXingJie Liu1, HaoNan Pu, JiaJi Wang Fudan University, China F-081 A Numerical Method on Thermal-humidity Behavior of Electronic Packaging Yue Mei, Xiaohu Yao1 South China University of Technology, China F-082 Research of the Effects of Microvia Layout on the Printed Circuit Board to the Thermal Fatigue Life of Fan-Out WCLSP Solder Joints HU Jiazheng1, WU Zhaohua Guilin University of Electronic Technology, China
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CONFERENCE GUIDELINE（温馨提示）
Welcome to ICEPT-HDP 2011. Please read this guideline carefully, we will be more than happy to serve you.
感谢各位嘉宾代表对本次大会的关注与支持，为了更好地为您提供服务，请您留意会务组温馨提示：
1. Please wear your badge at all times. 会议期间参会者请佩戴代表证，并凭此参加各项活动。 2. Prepare your coupon ready for the meals during the conference as showed in the table below. 代表凭票用餐, 会议期间用餐时间和地点如下表所示。
日期 (Date) 时间 (Time) 用餐地点 (Location)
07:00-08:30 早餐：一楼塞纳阳光西餐厅 Breakfast: Saina Sunshine Restaurant ( 1st floor)
12:30-13:30 午餐：明轩中餐厅 Lunch: Mingxuan Restaurant
August 8
Monday
18:00-20:00 晚餐：一楼塞纳阳光西餐厅 Dinner: Saina Sunshine Restaurant (1st floor)
07:00-08:30 早餐：一楼塞纳阳光西餐厅
Breakfast：Saina Sunshine Restaurant (1st floor)
12:20-13:30 午餐：一楼塞纳阳光西餐厅及明轩中餐厅
Lunch: Saina Sunshine Restaurant & Mingxuan Restaurant (1st floor)
August 9
Tuesday
18:30-20:30 晚宴：二楼宴会厅 Conference Banquet: Banquet Hall (2nd floor)
07:00-08:00 早餐: 一楼塞纳阳光西餐厅
Breakfast: Saina Sunshine Restaurant (1st floor)
12:10-13:10 午餐：一楼塞纳阳光西餐厅及明轩中餐厅
Lunch: Saina Sunshine Restaurant & Mingxuan Restaurant (1st floor)
August 10
Wednesday
18:00-20:00 晚餐：一楼明轩中餐厅
Dinner: Mingxuan Restaurant (1st floor)
07:00-08:00 早餐: 一楼塞纳阳光西餐厅
Breakfast: Saina Sunshine Restaurant (1st floor) August 11
Thursday 12:10-13:40
午餐、颁奖：一楼明轩中餐厅
Lunch and Award: Mingxuan Restaurant(1st floor)
3．Free internet is available for the participants of the conference. Other services like laundry, telephone etc should be
paid by yourself, please contact the hotel directly.
会议期间由会务组安排住宿的代表房间上网免费。其它洗衣和电话等服务，请跟总服务台联系、费用自理；
4．Please take care of your valuables including cell phones, laptops and wallet.
请妥善保管好自己随身携带手机、电脑、钱包等贵重物品；
5．Location of Tea Break, Exhibition, and Posters: On the second floor
茶歇、展览、张贴地点：二楼
6．For more details, please read the conference programs. Please switch your phone to silence during conference time
and help keep the auditoria in good order.
会议期间的具体安排请查阅会议日程安排，在会场参会的代表，请将手机调成震动状态，请不要大声喧哗，
随意走动，请您配合保持良好的会场秩序。
7．The conference ends at 14:00 on the 11th of August. Please check-out before 14:00, otherwise, the hotel will charge for
another half-day. If you need to stay longer days, please ask for helps through conference registration desk in advance
to keep your room at the same charge rate. Please mind your departure time to avoid any delay on your trip.
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会议结束时间：8 月 11 日下午 14:00，请需要退房的代表根据自已的行程清理好行李物品提前办理好退房手
续(如 14:00 前没退房，酒店将加收入住代表半天房费)；如需继续住宿的参会代表请提前向组委会说明，会务
组负责和宾馆协调保留房号，但费用自理（按会议价算）；请参会代表注意自己的返程时间，以免晚点！
8．Please contact the ticket center in the hotel for booking your return ticket in advance.
需要预订返程票的代表请直接跟您所住酒店的票务中心联系，提前预定；
9．The Riverfront Business Hotel Tel: 021-58969966
酒店联系电话：021-58969966 10．Contacts of Conference Organizers:
会议现场联系：
ORGANIZING COMMITTEE:
Xicheng Wei (Cell: 13916455151) Ronnie Li QING (Cell: 13910774338)
Fenghua Gan (Cell: 15821588261) Gang Huang (Cell: 13917571770)
组织委员会
韦习成（手机：13916455151） 李清（手机：13910774338）
甘凤华（手机：15821588261） 黄刚（手机：13917571770）
TECHNICAL COMMITTEE:
Daniel Shi (Cell: 00852-66297508) Jingsong Zhang (Cell: 13681843438)
Xiuzhen Lu (Cell: 13042180386) Maoyu Li (Cell: 13764479646)
技术委员会
史训清（手机：00852-66297508） 张金松（手机：13681843438）
路秀真（手机：13042180386） 李懋瑜（手机：13764479646）
SHORT COURSE
Tina Yang (Cell: 13428781411) Wenhui Zhu (Cell: 18809382656)
课程培训
杨冰冰（手机：13428781411） 朱文辉（手机：18809382656）
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TRANSPORTATION（交通方式）
Riverfront Business Hotel- Shanghai
上海浦东龙东商务酒店
Address: No.3000, Longdong Avenue, Pudong, Shanghai
地址：上海市浦东张江高科技园区 龙东大道 3000 号
Website: http://www.longdonghotel.com/
Airport Transportation Taking Taxi from Pudong International Airport to the hotel about 25 minutes and RMB80.
Taking Taxi from Hongqiao Airport to the hotel about 40 minutes and RMB110.
Taking MTRO Line 2 from Pudong International Airport or Hongqiao Airport to Guanglan Station and interchanging
Taxi to the hotel about 6 munites and RMB13.
机场交通
从上海浦东国际机场乘坐出租车程到酒店，单程约 25 分钟、80 元。
从上海虹桥机场乘坐出租车程到酒店，单程约 40 分钟、110 元。
从上海浦东国际机场或上海虹桥机场乘坐地铁 2 号线至广兰路站，换乘出租车，单程 6 分钟、13 元。
Public Transportation Taking Zhagnjiang Circle Line bus from Zhangjiang High-tech Station of MTRO Line 2 to Zhangdong Station.
Taking No 989 bus from Longyang Road Station of MTRO Line 2 to Yangfang Station.
公共交通：
乘坐地铁 2 号线至张江高科站，换乘张江环线巴士到张东路站下车。
乘坐地铁 2 号线至龙阳路站，换乘 989 路巴士到洋房站下车。
Tips: MTRO Line 2 runs across Huangpu River from the west to the east in Shanghai City and connects Hongqiao
Railway Station/Hongqiao Airport (Puxi) and Guanglan Station/Pudong International Airport (Pudong).
提示: 地铁 2 号线穿越黄浦江连接上海的浦西和浦东，浦西停靠虹桥火车站和虹桥机场，浦东停靠广兰路站和浦
东国际机场。
Self-drving: Driving along HuNing Thruway (A11) or HuHang Thruway (A8) to Pudong International Airport, corssing Xupu
Bridge to Outer-Ring Tunnel and away the ramp at Longdong Avenue.
自驾车：
沿沪宁高速公路（A11 公路）或沪杭高速公路（A8 公路）往浦东国际机场方向行驶，过徐浦大桥前往外环隧
道方向，龙东大道出口匝道驶下。
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TRANSPORTATION MAP
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LAYOUT OF CONFERENCE MEETING ROOMS（会场布局）
