cts-7700 service manual
TRANSCRIPT
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DCY2.782.7700WC/E-A00
CTS-7700Digital Ultrasound Imaging System
SERVICE MANUAL
SHANTOU INSTITUTE OF ULTRASONIC INSTRUMENTS, INC.
SHANTOU, CHINA
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I
CONTENTS
1. System Composi t i on and Technical Spec i f i cat ions …………….…….… 1-1
1.1 System Composition….…………………………………………………………………………… 1-1
1.2 Technical Specifications….………………………..………..……………………………………. 1-1
2. System Working Princ iple…...…………………………..………………………………... 2-1
2.1 Brief Introduction of Working Principle……………………..…………………………………… 2-1
2.2 Introduction of PCB……………………..……..…..……..……. ……………………………….. 2-3
2.2.1 Control Panel………………………………………….……………………………………… 2-3
2.2.2 Digital Processing Board..…………………………………..………………………………. 2-6
2.2.3 Order and Amplification Board.……………………………..……………………………… 2-13
2.2.4 Probe Interface Board………………………………………..……………………………… 2-19
2.3 Interconnection Signal List Between PCBs…...………………………………………………... 2-25
2.3.1 Probe Interface Board………………………………………..………………………………. 2-25
2.3.2 Order and Amplification Board……………………………..……………………………….. 2-27
2.3.3 Industrial Control Board..…………..………..………………………………………………. 2-29
2.4 Connection Diagram Between PCBs……………………………………………………………. 2-30
2.5 Disassemble Instruction..………………………………………………………………………… 2-31
2.5.1 General………………………………………………………………………………………… 2-31
2.5.2 Disassemble Plastic Housing..……………………………………………………………… 2-32
2.5.3 Disassemble Keyboard…..………………………………………………………………….. 2-34
2.5.4 Disassemble Rear Panel….………………………………………………………………… 2-35
2.5.5 Disassemble industrial control board……...……………………………………………….. 2-36
2.5.6 Disassemble PR board and RVA board……………………………………………………. 2-37
2.5.7 Disassemble Power Supply and Hard Disk…...…………………………………………… 2-38
2.5.8 Disassemble MONIT Board…………………………………………………………………. 2-39
2.5.9 Disassemble FEP Board…………………………………………………………………….. 2-42
2.5.10 Assemble Schematic of Main Unit………………………………………………………….. 2-42
2.6 Installation Instruction for Computer Main Board (Industrial Control Board).. ……………… 2-48
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II
2.6.1 Appearance of Computer Main Board..…………………………………………………… 2-48
2.6.2 Interface Position Map..…………………………………………………………………….. 2-48
2.6.3 Installation of System Memory….…………………………………………………………. 2-49
2.6.4 USB Port……………………………………………………………………………………… 2-49
2.6.5 IDE Port……..……………………………………………………………………………….. 2-50
2.6.6 Floppy Disk Port…..…………………………………………………………………………. 2-51
2.6.7 Display Port...………………………………………………………………………………... 2-52
2.6.8 Network Port…………………………………………………………………………………. 2-52
2.6.9 Keyboard and Mouse Port..……….……………………………………………………….. 2-53
2.6.10 Power Supply Port.…….…………………………………………………………………… 2-53
2.6.11 Fan Port..……….……………………….…………………………………………………… 2-55
2.6.12 Status Indication Port……………………………………………………………………….. 2-55
2.6.13 TV Output Port……………………………………………………………………………….. 2-56
3. Troubleshooting………………………………………………..……………..…..….…….. 3-1
3.1 PCB Function and Potential Failure……………………………………………………………... 3-1
3.1.1 Main Function and Potential Failure of Probe Interface Board…………………………... 3-1
3.1.2 Main Function and Potential Failure of Order and Amplification Board………………… 3-2
3.1.3 Main Function and Potential Failure of Digital Processing Board……………………….. 3-4
3.1.4 Main Function and Potential Failure of Power Supply Module………………………….. 3-7
3.1.5 Main Function and Potential Failure of Control Panel …………………………………… 3-8
3.1.6 Main Function and Potential Failure of Computer Main Board…………………………... 3-11
3.2 Common Failure and Troubleshooting………………………………………………………….. 3-12
3.2.1 System Cannot Start Up……………………………………………………………………... 3-12
3.2.2 Lowered Image Quality………………………………………………………………………. 3-14
3.2.3 Abnormal Image………………………………………………………………………………. 3-14
3.2.4 Failure Analysis on Monitor………………………………………………………………….. 3-16
3.2.5 Other Common Failures and Troubleshooting…………………………………………….. 3-20
4. Software Maintenance....…….……………………………………………………….……. 4-1
4.1 System Update...…….……………………………………………………………………………. 4-1
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System Composition & Technical Specifications
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Chapter 1System Composition & Technical Specifications
1.1 System Composition
The system as shown below consists of a main unit, an operation panel, probes and
peripheral devices. The main unit includes Probe Interface Board, Order and Amplification
Board, Digital Processing Board, Control Platform, Monitor and Power Supply.
Fig. 1-1 Block Diagram of System Composition
1.2 Technical Specif ications
For detailed system specifications, please refer to the system operation manual.
USB Port
VideoOutput
Network Port
Operation
Panel
Ima e Data
Control
Main Unit
Power
Monitor
ControlPlatform
Digital
Processing
Board
Ultrasound
Receive/Transmit
Front-end
Probe
Interface
Board
Probe 1
Probe 2
Order
and
Ampli-
fication
Board
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System Working Principle
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Chapter 2
System Working Principle
2.1 Brief Introduct ion of Working Principle
The fundamental working principle of the main unit is as follows:
The Probe Interface Board receives transmit excitation signals from the Digital Processing
Board and generates transmit high-voltage pulse through high-voltage drive circuit. The
high-voltage pulse then is sent to the working elements of the probe to generate
ultrasound through the Probe Interface Board. The echo from the ultrasound during
propagation in human body is received by the same group of working elements and
converted into feeble echo electric signals, which will be sent to the Order and
Amplification Board through pre-amplification. There are two probe connectors available
on the Probe Interface Board, to which two probes can be connected at the same time.
The T/R control FPGA on the Digital Processing Board yields transmit excitation signals of
the current transmission based on control signals. This group of signals is then sent to the
Probe Interface Board. The pre-amplified echo signals from the Probe Interface Board is
ordered, and sent to the Digital Processing Board after two-step TGC amplification.
The echo signals are converted into digital signals via ADC by the Digital Processing
Board, and further into digital image signals after a series of processing, including beam
focusing, aperture control, dynamic apodization and beam forming, dynamic filtering,
dynamic range conversion, demodulation, persistence processing and scan conversion
and sent to the Ultrasound Control Platform through the Digital Processing Board.
The Digital Processing Board on one hand transmits the digital image signals to the
Control Platform, on the other hand receives control information from the Control Platform
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and generates corresponding control data to achieve control of the front end.
The Control Platform is the management center of the whole system control, which
receives operation commands from the control panel to manage the whole system control
in accordance with the current system state. The other functions the Control Platform
fulfills also include measurement and calculation, interface display and video processing,
management of patient data and images, control of storage, printing and communication.
The wiring diagram of the whole system is shown below:
C H 6
C H 4C H 8
X S 2
X S 3
X S 4 X S 1
X S 5
X S 6
X S 1
X S 8
X S 8
X S 2
K e y b o a r d
H a r d d i s k
M o n i t o r b o a r d
AT X p o w e r
d i g i t a l b o a r d
I n d u
s t r i a l
c o n t r o l
b o a r d
A m p l i f y
i n g b o
a r d
p r o b
e b o
a r d
X S 18
X S 11
X S 10 X S 12
X S 9 2 0 P p o w e r
R e a r p a n e l
4 P p o w e r
P o w
e r m o d
u l e b o
a r d
X S 4
X S 3
X S 3
X S 3
P R A
11
12
12
3
4
5
6
8
9
20
17
1314
15
19
18
10
16
21
C H 5
2 4 c m M o n i t o r t u b e
23
22
7
Ad j u s t i n g p l a t e
1— Internal AC Wire
2— Extended Network Card Wire
3— Extended USB Wire
4— Extended VGA Wire
5— Power Indicator Wire
6— Video Print Wire
7— PS/2 and Start-up Wire
8— COM2 Wire
9— Print Control Wire
10— Front-end Data Wire
11— Hard-disk Data Wire
12— +15, +30V Power Wire
13— +12V Fan Wire
14— +5V, +12V Power Wire
15— ±60V Power Wire
16— Hard Disk Data Wire
17— Keyboard Data Wire
18— External AC Power Wire
19— ±5V, ±12V, HVC Power Wire
20— Contrast & Brightness Adjust Control Wire
21— Contrast & Brightness Adjust DIsplay Wire
22— Deflecting Coil Connecting Wire
23— Monitor Tube High-voltage Wire
Fig. 2-1 Wiring Diagram for Whole System
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2.2 Introduction of PCB
2.2.1 Control Panel
2.2.1.1 Funct ional Descrip tion
The Control Panel as shown below in Fig. 2-2 consists of a keyboard (KB), a silicon-gel
membrane of the keyboard, a keyboard interface board (KBIF) and a trackball.
FPGA
Trackball
Encoder 1
Encoder n
Decoder 1
Decoder n
8 Gain control
potentiometers
ADC0809
Additional
logic
circuit
Serial
Interface
Single chip
Micro-
Computer
FEP Board
ADC0809
Control
logic
Operation Panel Main Unit
Key Array
Toggle Switch
Scanning
Logic
IndustrialControl Board
Fig. 2-2 Diagram of Control Panel
The keyboard mainly includes a printed circuit board (PCB) key array. Two key contact
points that are directly formed by exposed copper with gold plating on the printed circuit,
and an LED on each key for backlight. The keyboard button silicon gel membrane covers
on the keyboard. When the key on the silicon gel membrane is pressed, the conductive
silicon under the keys will connect the two contact points on the PCB to complete the key
operation for other circuit inspection.
The Keyboard Interface Board is the primary connection of control knobs, TGC adjust
potentiometers, and the required control circuit for the control panel. The primary task of
the Keyboard Interface Board is to monitor all the actions on the receiving panel, converts
them into established protocols and sends them to the main unit. Meanwhile, it receives
various control signals from the main unit and controls the related circuits on the Keyboard
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Interface Board.
The displacement signals directly outputted from the trackball are PS/2 protocol signals,
which will be combined with other signals to XS4 via XS8 plug on the Keyboard Interface
Board. XS4 plug is connected to the FEP board via a 34-core cable, and XS10 plug on the
FEP board is connected to the PS/2 port on the Industrial Control Board via another cable.
There are several control knobs and subsection gain controls on the keyboard. Configure
an FPGA (XCS10XL-TQ100) as a logic interface, a single chip microcomputer (also called
micro controller unit, MCU) AT89C51-24JI as the overall control and protocol conversion,
and RS-232 as the communication interface. Use an MAX232 as switchover between TTL
level and RS-232 level.
The MCU of the keyboard controls the FPGA to output line-scanning signals, reads array
signals from P1 on the MCU to obtain key information, converts it into established
protocols and sends it to the main unit. All the line and array signals on the Interface Board
are connected to the keyboard via XS1.
All the interfaces are connected to the FEP board through XS4 on the Interface Board,
and XS4 also provides the power supply for the keyboard board. The power input is +5V,
and the measuring point is +5V. All kinds of signals are connected to the corresponding
ports on computer main board via the FEP board.
Because the working voltage of FPGA is +3.3V, the voltage converting circuit is configured
to convert the voltage from +5V to +3.3V required by the FPGA. The converting
component adopted is MIC39100.
The control knobs are placed on the keyboard panel. Using encoder OAK-700, 5 pairs of
orthogonal signals outputted from 5 encoders are connected to the FPGA for decoding.
The encoder actions are converted into enumerated data by using the FPGA built-in
decoder as an interface. The enumerated results are read in by the MCU, converted into
established protocols and sent to the main unit via the serial interface.
The subsection gain controls use sliding potentiometers, which are installed on the
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System Working Principle
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Fig. 2-3 Pin Encapsulation of major Components
2.2.2 Digital Processing Board
The primary functions of the Digital Processing Board (DPB) include transmitting and
receiving controls, A/D conversion, digital beam forming, dynamic filtering, tissue imaging
processing, digital scan conversion, system control, PCI bus interface and also circuit for
voltage transform. The DPB receives multi-channel analog ultrasound echo signals from
the front-end processing module, goes through A/D conversion, and forms a channel of
digital signals through digital beam-forming in combination with control signals from the
Control Interface Module. After signal processing such as dynamic filtering and tissue
imaging, these signals then will be sent to the DSC part and converted into corresponding
display frame shape. Finally, the image will be sent to the Control Interface Module frame
ADC0809CN
LM1084IS-ADJ
AT89C51
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by frame. The Control Interface Module is a bridge between the Computer Module and the
Ultrasound Part. For the computer module at the upper level, it receives all kinds of data
from computer software via PCI bus, decomposes and distributes them to modules and
simultaneously yields control signals per requirements to control working of the whole
Ultrasound Part; for the Ultrasound Part at the lower level, it receives full frame image
signals from the DSC module and sends the image signals to the Computer Module via
PCI bus.
Based on Y_SYNC signals from the system control module and a series of parameters,
the T/R Control Module will configure the states of high voltage switch and folding matrix
switch at the front end according to related parameters when Y_SYNC is at low level.
When Y_SYNC signals turn high from low level, multi-channel transmit pulses are
outputted from FPGA and converted into high-voltage pulse excitation probe via the
high-voltage exciting circuit on the Probe Interface Board, thus to achieve an ultrasound
transmission. The ultrasonic signals reflected from tissues are amplified through the
pre-amplifier on the Probe Interface Board, and transmitted through two-level time gain
compensation amplification circuit on the Amplification Board, and the output echo signals
after symmetric folding are sent to the Digital Processing Board.
Having been sent to the Digital Processing Board, the multi-channel analog echo signals
are converted into multi-channel digital signals via A/D conversion, and sent to the
Beam-forming Module. As per relevant control parameters, the multi-channel digital
signals are delayed and added by the Beam-forming Module to achieve focusing function
of ultrasound receiving.
One essential problem of ultrasound diagnosis is that the relationship between
parenchyma (soft tissue) ultrasound attenuation and frequency is approximately in
linearity. Because the probes used for the system are broad-brand, center frequency of
transmit excitation signals will shift down as ultrasonic pulse transmits deeper. In order to
improve image quality, the near field receives high-frequency echoes only to improve
resolution, while the far field only receives low-frequency echoes to improve S/N ratio. A
time-variable band-pass filter is required, thus a Dynamic Filter Module is configured to
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achieve this function.
The data going through dynamic filtering are sent to the Tissue Imaging Processing
Module, the functions of which are to optimize ultrasound images. The functions, including
dynamic range conversion, logarithm compression, gray scale mapping, smoothness
enhancement and lateral filtering, significantly improve ultrasound image display quality,
which are conducive to better clinical diagnosis. There is an additional transmit voltage
control signal D/A output on the Dynamic Filter Module. The Dynamic Filter receives 8-bit
control information from the system Control Module and outputs it to the D/A part, sends to
the Power Module to control the transmit voltage outputted from the Power Module.
Meanwhile, Time Gain Compensation curve is sent out from the same module. After D/A
conversion and buffering, it is sent to the Amplification Board to control the corresponding
time gain compensation circuit.
Having been processed by the Tissue Imaging Processing Module, the ultrasonic signals
are sent to the Digital Scan Conversion Module in the form of scanning lines. The Digital
Scan Conversion Module coverts the image signals in line form to images in the same
geometric shape of the actual ultrasound scanning range (e.g. sector image of the convex
probe, rectangular image of the linear probe), as per the current probe and other control
parameters. At the same time, the image will be processed with interpolation when
required. Finally, an image is acquired for display.
The system Control Module receives image signals from the Digital Scan Conversion
Module and buffers them before sending them to the PCI Interface Module frame by frame
at an appropriate time. Meanwhile, the system Control Module receives and processes
the control parameters from the PCI Interface Module and yields the overall control
signals for ultrasound scanning and distributes some of the parameters to the modules
that need these parameters.
The PCI Interface Module is an important bridge in the whole ultrasound system. It via the
communicates with the computer via the PCI bus and acquires all kinds of settings and
control commands from the computer system; at the same time it reads in various state
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information from the Digital Processing Board and sends them to the computer via the PCI
bus. The most important task of it is to receive image signals from the system Control
Module and send them to the computer via the PCI cable, and to obtain a real-time
ultrasound image in the computer. The ultrasound image will be displayed on the screen
after being processed in the computer application.
The power supply changeover circuit transforms the inputted +5V voltage on the Power
Module into +3.3V and +2.5V for low-voltage parts like FPGA or SRAM on circuit boards.
The power changeover adopted is TPS76833QPWP and TPS76825QPWP manufactured
by TI. The schematic is shown below.
Fig. 2-4 Schematic of Power Supply Changeover Circuit
Indicators for the major power supplies on the circuit boards are for indicating whether the
voltages are proper or not. If any of the indicators is off, please use a multimeter to
measure the corresponding measured points to verify if the voltage meets the rated
values.
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Component composition:
The components on the Digital Processing Board mainly include power supply
changeover, A/D converter part, FPGA part and its configured FLASH ROM, signal drive
parts, SRAM part, resistors and capacitors.
The layout of major components:
C 1 6 4
1 0 4
C 1 6 3
1 0 4
C 9 1
1 0 4
R 8 9
2 2 0
R 8 8
3 3 1
R 8 7
2 0 1
C 9 0
1 0 4
C53 104
C50
156/25V
C63 104
C 3 7 9
1 5 6 / 2 5 V
C 3 8 0
1 5 6 / 2 5 V
C381
101
C382
1 5 6 / 2 5 V
C383
1 5 6 / 2 5 V
R 6 7 3 3 1
R 6 8
2 0 2
R 6 9
2 0 2
R70
152
R71
152
R72
152
R73152
R 7 4 1 5 2
R 7 5
1 0 1
R76
470
R 7 7
2 0 2
R 7 8
2 0 2
C 9156/25V
R 7 9 5 1 2
C8 1 5 6 / 2 5 V
C7
156/25V
C 6 1 0 4
C5
1 5 6 / 2 5 V
R 4 9
0 0 0
R 4 8
4 7 2
R 4 7
4 7 2
R 4 6
4 7 2
R 4 5
4 7 2
R 4 4
4 7 2
R 4 3
4 7 2
R 4 2
4 7 2
R 4 0
4 7 2
R 3 5
4 7 2
R 3 4
4 7 2
R33
472
R30
472
R 2 9
4 7 2
R 2 8
4 7 2
R 2 6
4 7 2
R 2 4
4 7 2
R 2 0
4 7 2
R 1 9
4 7 2
R 1 8
4 7 2
R 1 7
4 7 2
R 1 6
4 7 2
R 1 5
4 7 2
R 1 2
4 7 2
R 1 1
4 7 2
R 1 0
4 7 2
R 9
4 7 2
R 4 6 4
6 8 1
C142
104
C 1 4 0
1 0 4
C 1 3 9
1 0 4
C 1 3 8
1 0 4
C 1 3 7
1 0 4
C 1 3 5
1 0 4
C 1 3 3
1 0 4
C 1 3 0
1 0 4
C129
104
C162
104
C161
104
C160
104
C159104
C158104
C157
104
C155
104
C154
104
C153
104
C152
104
C 1 5 1
1 0 4
C150
104
C 1 4 9
1 0 4
C 1 4 8
1 0 4
C147
104
C146 104
C145
104
C144
104
C141 104
C 1 3 6
1 0 4
C 1 3 2
1 0 4
C 1 2 8
1 0 4
C 1 2 7
1 0 4
C126
104
C125
104
C 1 2 4
1 0 4
C122 104
C121
104
C 1 2 0
1 0 4
C 1 1 9
1 0 4
C 1 1 8
1 0 4
C 1 1 7
1 0 4
C 1 1 6
1 0 4
C 1 1 5
1 0 4
C114
104
4 7 3 / 5 0 0 V X 3
C110
104
C105
1 0 4
C104
1 0 4
C102
1 0 4
C101
1 0 4
C100
1 0 4
C99
1 0 4
C98
1 0 4
C97
1 0 4
C96
1 0 4
C95
1 0 4
C94
1 0 4
C92
1 0 4
C89
104 C 8 8 1 0 4
C87
104
C 8 6 1 0 4
C85104
C56
104
C55
104
C 5 4 1 0 4
C52
104
C 5 1
1 0 4
C 4 9
104
C48
104
C 4 7
1 0 4
C 4 6
1 0 4
C 4 5
1 0 4
C44
104
C 4 3
1 0 4
C42
104
C 4 1
1 0 4
C40
104
C 3 9
1 0 4
C38104
C37
104
C30
104
C29104
C28 104
C 1 3 4
1 0 4
C131
104
C65
104
C1
C2
C3
C 4
156/25V
C 2 1
1 5 6 / 2 5 V
C 3 3 1 0 4
C 3 4
1 0 4
C 3 5
1 0 4
C 3 6 1 0 4
C81
156/25V
C 8 2
1 0 4
C 8 3
1 0 4
C 9 3
1 0 4
C 1 0 3
1 0 4
C 1 1 1
156/25VC112104
C113104
C123104
C 2 3 1
1 0 4
C232
1 5 6 / 2 5 V
C233
156/25V
C 2 3 4
1 0 4
C 2 3 5
1 0 4
C 2 3 6
1 0 4
C 2
4 1
1 5
6 / 2 5 V
C 2
4 2
1 5
6 / 2 5 V
C 2 4 3
1 0 4
C 2 4 4
1 0 4
C 2 4 5
1 0 4
C 4 7 1
1 0 4
C472
104
C 4 7 3
2 2 2
C481
104
C482104
C 4 8 3
2 2 2
C511
1 5 6 / 2 5 V
C 5 1 3
1 0 4
C521
1 5 6 / 2 5 V
C 5 2 3
1 0 4
C 5 3 3
1 0 4
C 5 4 3
1 0 4
C 5 5 3
1 0 4
C 5 6 3
1 0 4
C 5 7 3
1 0 4
C 5 8 3
1 0 4
C 5 9 3
1 0 4
C 6 0 3
1 0 4
L3
2 2 0 u H
L4
2 2 0 u H
L5
2 2 0 u H
L6
2 2 0 u H
L7
2 2 0 u H
L8
2 2 0 u H
L9
2 2 0 u H
L10
2 2 0 u H
L11
2 2 0 u H
L12
2 2 0 u H
R 2 1
5 1 1
R22103
R 2 5 4 7 2
R 2 7 1 0 1
R 3 1
6 8 1 R 3 2 6 8 1
R 3 9
0 0 0
R 5 1
6 8 1
R 5 2
6 8 1
R 5 3 6 8 1
R 8 1
2 0 1
R 8 2
2 0 1
R83
472
R 9 1
2 0 1
R 9 2
2 0 1
R 1 0 1
2 0 1
R 1 0 2
2 0 1
R111201
R112331
R121201
R122331
R 1 3 1
6 8 1
R 1 3 2
6 8 1
R 1 3 3
6 8 1
R 1 6 1
6 8 1
R 1 6 2
6 8 1
R 1 6 3
6 8 1
R 2 1 1
6 8 1
R 2 1 2
6 8 1
R 2 1 3
6 8 1
R 2 2 1
6 8 1
R 2 2 2
6 8 1
R 2 2 3
6 8 1
R 8
1 0 3
R7 103
R6103
R 2 3 1
2 0 2
R 2 3 2
2 0 2
R 2 4 1
2 0 2
R 2 4 2
2 0 2
R 4 1 1
6 8 1
R 4 1 2
6 8 1
R 4 1 3
6 8 1
R 4 2 1
6 8 1
R 4 2 2
6 8 1
R 4 2 3
6 8 1
R 4 3 1
6 8 1
R 4 3 2
6 8 1
R 4 3 3
6 8 1
R 4 5 1
4 7 2
R 4 6 3
6 8 1
R 4 6 5
6 8 1
R471
152
R472
101
R
4 7 3
1 5 2
R474 102
R475
681
R477
470
R481
152
R482
101
R483152
R484102
R 4 8 5
1 0 2
R487
470
C13 104
C14 104
C 1 5
1 0 4
C16 104
C17
104
C 1 8
1 0 4
C 2 5 1 0 4
C26
104
C 2 7
1 0 4
C 7 0 1 0 4
C71 104
C 7 2 1 0 4
C73104
C 7 8 1 0 4
C79
1 0 4
C80
104
C84104
C 4 9 1
1 5 6 / 2 5 V
C 4 9 3
1 0 4
C501
1 5 6 / 2 5 V
C 5 0 3
1 0 4
C531
1 5 6 / 2 5 V
C541
1 5 6 / 2 5 V
C551
1 5 6 / 2 5 V
C561
1 5 6 / 2 5 V
C571
1 5 6 / 2 5 V
C581
1 5 6 / 2 5 V
C591
1 5 6 / 2 5 V
C601
1 5 6 / 2 5 V
L1
2 2 0 u H
L2
2 2 0 u H
C10104
C11
104
C 1 2
1 0 4
C 5 8
1 0 4
C60 104
C 6 2 1 0 4
C64104
C 6 6 1 0 4
C67 104
C 6 8 1 0 4
C 6 9
1 0 4
R5 103
R4 470
R3 470
R2 470
R1 470
R 3 6
0 0 0
R 3 7
0 0 0
C 1 4 3
1 0 4
R 3 8
0 0 0
R 5 0
0 0 0
R 5 4
0 0 0
R 5 5
0 0 0
R 5 6
0 0 0
R 5 7
0 0 0
R 5 8
0 0 0
R 5 9
0 0 0
R 6 0
0 0 0
R 6 1
0 0 0
R 6 2
0 0 0
R 6 3
0 0 0
R 6 4
0 0 0
R65 470
R66 470
C57104
C59104C61 104
R 8 4
0 0 0
R 8 5
5 1 2
R80
000
Fig. 2-5 FEP Welding Surface
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R 5 5 1
1 0 1
R 5 6 1
1 0 1
R 5 7 1
1 0 1
R 5 8 1
1 0 1
R 5 9 1
1 0 1
R 6 0 1
1 0 1
C 4 9 2
1 0 4
C 4 9 4
1 0 4
R 4 9 1
1 0 1
U41
XC2S200-5PQ208
U42
XC2S200-5PQ208
U43
XC2S200-5PQ208
U 4 7
AD712JR
U 4 8
AD712JR
U49
AD9057
U50
AD9057
U51
AD9057
U52
AD9057
U53
AD9057
U54
AD9057
U55
AD9057
U56
AD9057
U57
AD9057
U58
AD9057
U59
AD9057
U60
AD9057
U69
74LVC245A
U70
74LVC245A
U71
74LVC245A
C 5 0 4
1 0 4
R 5 0 1
1 0 1
A61
B48
A49A1
B2 B62
XS1
RJB60DCHN-S578
V 8
V 7
LIGHT2
D25 20 15 10 5 D1
1A510152025A
XS2
DHB-RB100-S13NN
25A 20 15 10 5 1A
D15101520D25
XS3
DHB-RB100-S13NN
2 5 A 2 0 1 5 1 0 5 1 A
D 1 5 1 0 1 5 2 0 D 2 5
XS4
DHB-RB100-S13NN
2 5 A 2 0 1 5 1 0 5 1 A
D 1 5 1 0 1 5 2 0 D 2 5
XS5
DHB-RB100-S13NN
XS7
2 1
3 4 3 3
XS8
L H - 3 4 R
1
XS9
B H - 1 0 S
GND
GND
GND
GND
GND
U46
XC2S200-5PQ208
U 6 5
7 4 L V C 2 4 5 A
U 6 6
7 4 L V C 2 4 5 A
U 6 7
7 4 L V C 2 4 5 A
U 6 8
XCF02S
U72
74LVC245A
U 1
I S 6 3 L V 1 0 2 4 L - 1 2 H
U2
AD712JR
U3
DAC0800LCM
U5
XC2S200-5PQ208
U6
XCF02S
U7
74LVC245A
U8
LM1084
U9
LM1084
U10
LM1084
U11
L M 1 0 8 4
U12
L M 1 0 8 4
U13
XC2S200-5PQ208
U 1 4
I S 6 3 L V 1 0 2 4 L - 1 2 H
U 1 5
IS63LV1024L-12H
U16
XC2S200-5PQ208
U17
74LVC245A
U18
74LVC245A
U19
74LVC245A
U20
74LVC245A
U21
XC2S200-5PQ208
U22
XC2S200-5PQ208
U23
DAC0800LCM
U24
DAC0800LCMU2550.0000MHz U26
IS63LV1024L-12HU27
IS63LV1024L-12H
U 2 8
I S 6 1 L V 1 2 8 1 6 L
U 2 9
I S 6 1 L V 1 2 8 1 6 L U30
XCF02S
U31
XCF02S
U32
XCF02S
U33
XCF02S
U34
XCF02S
U35
XCF02S
U36
XCF02S
U73
74LVC245A
U74
74LVC245A
U76
74LVC245A
N F 1
473
N F 2
473
N F 3
4 7 3
NF4
4 7 3
U81
IDT74FCT3807
V 1 0
V 1 1
V 1 2
V13
HZ5C1
V 9
X S 1 3
N S - 1 * 2
X S 1 4
N S - 1 * 2
X S 1 5
N S - 1 * 2
X S 1 6
N S - 1 * 2
X S 6
N S - 1 * 2
C22
104
C 2 3
1 0 4
C31 104
C 3 2
1 0 4
1
6
X S 1 8
J S - 1 0 0 1 - 6
WW17-215 X 6
1 0 4
1 6JS-1001-6
U4
LM1084
1
D45
AT27C020-70JI
1
D40
AT27C1024-70JI
N F 5
473
GND
1
11
XS12
J S - 1 0 0 1 - 1 1
14
1
XS11
J S - 1 0 0 1 - 1 4
1
10XS10
J S - 1 0 0 1 - 1 0
LIGHT1
V4
WW17-215 X 6
V3
V2
V1
U75
74LVC245A
C 5 0 2
C 5 1 2
1 0 4
C 5 1 4
1 0 4
C 5 2 2
1 0 4
C 5 2 4
1 0 4
C 5 3 2
1 0 4
C 5 3 4
1 0 4
C 5 4 2
1 0 4
C 5 4 4
1 0 4
C 5 5 2
1 0 4
C 5 5 4
1 0 4
C 5 6 2
1 0 4
C 5 6 4
1 0 4
C 5 7 2
1 0 4
C 5 7 4
1 0 4
C 5 8 2
1 0 4
C 5 8 4
1 0 4
C 5 9 2
1 0 4
C 5 9 4
1 0 4
C 6 0 2
1 0 4
C 6 0 4
1 0 4
R 5 1 1
1 0 1
R 5 2 1
1 0 1
R 5 3 1
1 0 1
R 5 4 1
1 0 1
Fig. 2-6 FEP Component Surface
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For the specific sockets, other circuit boards or modules, please refer to Fig. 2-1.
2.2.3 Order and Amplification Board
2.2.3.1 General
The Order and Amplification Board consists of the impedance transform circuit 3904, the
order folding matrix switch circuit MT8816 or CD22M3494, the two-step TGC amplification
circuit AD602, the drive and amplitude control circuit AD817 and the control signal
interface circuit SN74LVC245. The diagram for the Order and Amplification Board is
shown below in Fig. 2-8. After the echo signals are sent from the Pre-amplification Circuit
on the Probe Interface Board and before the signals enter the Folding Circuit, the emitter
made up of primary 3904 audion follows the circuit, in order to enhance loading capacity
of the Pre-amplification Circuit output, which also serves for impedance transform.
Impedance
Transform
3904
Audion
Array
Resettle
-ment
and
Folded
Circuit
MT8816
Array
AD602
Array
TGC
Amplifier
ADC
Driver
AD817
Array
EchosEchos RF Echos
Output
Echos
Control signals
Preamp
Output
Fig. 2-8 Circuit Diagram of Order and Amplification Board
The power voltages on the Order and Amplification Board are ±5 and ±12V. The
voltages of MT8816 or CD22M3494 and AD602 are ±5V. The voltages of 3904 and
AD817 are ±12V. The voltage of the Bus Interface Circuit SN74LC245 is +5V.
The channel parallel echo signals on the Probe Interface Board, after being pre-amplified
are ordered, with channel symmetry superposed and amplified, are finally sent to the
Digital Processing Board for A/D and following processing.
2.2.3.2 Order and Folding Circuit
The circuit adopted by the Order and Folding Circuit is CD22M3494E-MQ or MT8816
manufactured by INTERSIL, the chip of which has 16×8=128 analog switches. Its
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appearance is shown below in Fig. 2-9. The chip has 44 pins, which is very convenient for
connection. It can be connected with 16 inputs and 8 outputs, or 8 inputs and 16 inputs.
The input and output pins are controlled separately. AX0~3 control pins X0~15, and
AY0~2 control pins Y0~Y7. The DATA pin can be disconnected against access. When
DATA is “0”, the addressed switch is disconnected. When DATA is “1”, the addressed
switch is connected. The RESET signal can reset all the switches. When RESET is high,
all the switches are disconnected.
Fig. 2-9 Outside Drawing of CD22M3494E-MQ
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Fig.2-10 Sequence Chart of CD22M3494E-MQ
The configured sequence chart of CD22M3494E-MQ or MT8816 chip is shown above in
Fig. 2-10.
And the truth tables are showed below in Table 2-1.
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Table 2-1 Truth Table of CD22M3494E-MQ or MT8816
As the central element for each transmission varies with the difference in each line, the
task of order and folding is to link echoes of the Amplification Circuit corresponding to the
current transmitted central elements to the channel center, to link the echoes of the
Amplification Circuit corresponding to echoes of the current transmitted edge elements to
the edge channel, and the rest may be deduced by analogy. The channels not to be
compounded are linked to pin XX12, which is linked to 0.1uF capacitance to ground.
Finally, the output signals from CD22M3494E-MQ or MT8816 chip are the channel echo
signals going through channel symmetric superposition and ordering.
2.2.3.3 Two-step TGC Amplification Circuit
The output signals of the echo signals from the folding circuit are pre-amplified by the
two-step TGC Amplification Circuit composed of AD602 part array.
The internal block diagram of one channel of AD602 is shown below in Fig. 2-11.
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Fig. 2-11 Internal Block Diagram of AD602
Table2-2 Pin Definition of AD602
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The pin definition of AD602 is shown above in Table 2-2.
a) Main features of AD602:
Each AD602 has two independent channels, namely two amplifiers;
The gain dB value of each channel is in direct proportion to the control voltage;
Low input noise 1.4nV/ Hz ;
High bandwidth, with -3dB bandwidth at DC~35MHz;
Each channel consists of a precise passive input attenuator and a fixed gain
amplifier (31dB);
The input attenuator is controlled by control voltage (CHI-CLO), the control
sensitivity is: 31.25mV/dB;
Power consumption of each channel is 125mW;
Gain control range of each channel is: -10dB~+30dB.
b) Calculation equation ofAD602 gain control:
Gain (dB)=32Vg+10
Vg (V)=CHI-CLO
Range of Vg: -625mv ~ +625mv
If: CHI1=0V~1.35V
CHI2= 0.312V~1.35V
When CLO is about 0.625V, the gain that first-step AD602 acquires is about
–10dB~+31.07dB, and the gain that the second-step AD602 acquires is about
0~+31.07dB. The second control voltage works only if the gain in the first stage runs out.
Including pre-amplification, in theory the maximum gain of the entire channel can reach
82.14dB, and the gain variable range is -10dB~62.14dB. Due to the resistance between
steps, the gain may decrease several dB.
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After processed by the folding circuit and the two-step TGC, the RF echoes are driven by
high speed operational amplifier comprised by AD817, the output echo range is limited
below 1.2 p p
V −
to meet requirements of the latter analog parts.
2.2.3.4 Input Power Supply
a) +5VA:
+5V analog power supply for AD602, interface circuit and CD22M3494E-MQ or MT8816
b) –5VA:
–5VA analog power supply for AD602 and CD22M3494E-MQ or MT8816
c) ±12V: For AD817 chip circuit.
2.2.4 Probe Interface Board
2.2.4.1 Introduct ion of the Probe Interface Board (PIB)
The Probe Interface Board provides connectors between the transducers and the main
unit. Two probe connectors are available on the PIB of CTS-7700. Each connector has a
corresponding high-voltage switch, which is HV232 or like products from Hitachi. Each
PIB has a SIUI912x2 pre-amplification and high-voltage pulse drive thick- film circuit.
There are several power voltages on the PIB:+5, ±12V, high-voltage switch power over
±60V and +HV. +5V voltage is used for logical configuration of high voltage switch, ±
12V for SIUI912x2 T/R circuit, +HV for transmit high voltage, the value of which is variable
between 0V~60V and above. The main unit provide excitation high-voltage pulse to
piezoelectric crystal array of the probe via the high-voltage switch array on the PIB,
pre-amplifies the ultrasound from the probe, and sends it to the Order and Amplification
Board. Another function of the high-voltage switch is selection of the current working
probe.
The top-level connection block diagram of the PIB is follows:
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d) Control Signal Pin:
Pin 36 is connected to chip selection signal CLR. When connecting this pin to “0” is
selected, Pin36 of the high-voltage switches corresponding to each probe are
connected together as a select signal for the working probe.
Pin 35 is a logical input enabled port/LE. When “1” is connected, parameter setup
this chip for is allowed.
Pin 34 is a logical input clock. The control data series shifts 1 bit whenever a clock
comes.
e) Void Pin:
Pins 2, 4, 6, 7, 9, 11, 13, 15, 17, 19, 21, 23, 26, 30, 31, 32, 38, 40, 42, 44, 46, 48
are void, which are suspended.
The internal logical circuit of HV232 is shown below in Fig. 2-14:
Fig. 2-14 Internal Logic Circuit of HV232
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2.2.4.3 Transmit Drive and Echo Pre-amplification
In the CTS-7700, the yield of transmit drive high-voltage pulse and the echo
pre-amplification are processed in the SIUI912x2 array. A piece of MOS field-effect tube in
each transmit circuit serves as a switch, with one end connected to transmit high voltage
and the drive pulse of which is 0~12V. This tube is ducted as drive pulse comes, and
forms high-voltage pulse, which will connect to probe elements via high-voltage switch.
The ultrasound received is also from the same path. The echo will have about 20dB
amplification in the pre-amplification Circuit SIUI912x2. Then the echo signals are sent to
the subsequent TGC Amplification Circuit for amplification.
2.2.4.4 Interface Circuit of the Probe Interface Board (PIB)
The Interface Circuit on the PIB consists of two pieces of SN74LVC245. U18 is for driving
probe select signals PRS1~2 and probe code select signals PIDS1~2. The driven
PROBE1~2 are linked respectively to Pin 36 of two groups of high-voltage switches as
selection signals of the working probe, and the driven PIDSEL1~2 is linked respectively to
Pin19 of U19 and U20 as the probe code gating circuit for the two probes. When any of
the signals of PIDSEL1~2 is at low level, the probe code of SN74LVC245 is sent to the
bus, otherwise the output of it is at high resistance. U17 is for driving high-voltage switch
data DIND0~DIND3, clock STROBEP and enabling signal LED.
Description of input and output signals on the PIB: There are two 100-pin sockets on the
PIB linking to 2 corresponding sockets on the Digital Board.
Description of input power
a) VCC:
+5V analog power to Pin29 on high-voltage switch;
b) ±12V:
To Pin7 and Pin8 on SIUI912x2 respectively;
c) Above ±60V:
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To Pin24 and P25 on high-voltage switch respectively;
d) +HV:
Variable input high voltage, varying from above 0V~60V, linked to Pin2 of SIUI912X2 for
generating transmit high-voltage pulse.
2.3 Interconnection Signal List Between PCBs
2.3.1 Probe Interface Board
Table 2-4 Interconnection Signal List for Probe Interface Board XS4
Probe Interface Board XS4 (XS4)
Pin Signal Pin Signal Pin Signal Pin Signal
A25 GND B25 GND C25 GND D25 GND
A24 GND B24 GND C24 GND D24 GND
A23 +5VA B23 +5VA C23 +5VA D23 +5VA
A22 +5VA B22 +5VA C22 +5VA D22 +5VA
A21 GND B21 GND C21 GND D21 GND
A20 GND B20 GND C20 GND D20 GND
A19 -12V B19 -12V C19 -12V D19 -12V A18 -12V B18 -12V C18 -12V D18 -12V
A17 GND B17 GND C17 GND D17 GND
A16 GND B16 GND C16 GND D16 GND
A15 +12V B15 +12V C15 +12V D15 +12V
A14 +12V B14 +12V C14 +12V D14 +12V
A13 GND B13 GND C13 GND D13 GND
A12 -NV B12 -NV C12 -NV D12 -NV
A11 -60V B11 -60V C11 -60V D11 -60V
A10-NV
B10-NV
C10-NV
D10-NV
A9 GND B9 GND C9 GND D9 GND
A8 +PV B8 +PV C8 +PV D8 +PV
A7 +60V B7 +60V C7 +60V D7 +60V
A6 +PV B6 +PV C6 +PV D6 +PV
A5 GND B5 GND C5 GND D5 GND
A4 GND B4 GND C4 GND D4 GND
A3 +PV B3 +PV C3 +PV D3 +PV
A2 +HV B2 +HV C2 +HV D2 +HV
A1+HV
B1+HV
C1+HV
D1+HV
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Table 2-5 Interconnection Signal List for Probe Interface Board XS5
Probe Interface Board XS5 (XS5)
Pin Signal Pin Signal Pin Signal Pin Signal
A25GND
B25PID0
C25GND
D25PID1
A24 GND B24 PID2 C24 GND D24 PID3
A23 GND B23 PID4 C23 GND D23 PID5
A22 GND B22 PID6 C22 GND D22 PID7
A21 GND B21 STROBEP C21 GND D21 LE
A20 GND B20 PRS1 C20 PRS3 D20 DIN0
A19 GND B19 PRS2 C19 PIDS3 D19 DIN1
A18 GND B18 PIDS1 C18 GND D18 DIN2
A17 GND B17 PIDS2 C17 GND D17 DIN3
A16 GND B16 DH2 C16 GND D16 DH1
A15 GND B15 DH4 C15 GND D15 DH3
A14 GND B14 DH6 C14 GND D14 DH5
A13 GND B13 DH8 C13 GND D13 DH7
A12 GND B12 DH10 C12 GND D12 DH9
A11 GND B11 DH12 C11 GND D11 DH11
A10 GND B10 DH14 C10 GND D10 DH13
A9 GND B9 DH16 C9 GND D9 DH15
A8 GND B8 DH18 C8 GND D8 DH17
A7 GND B7 DH20 C7 GND D7 DH19
A6 GND B6 DH22 C6 GND D6 DH21
A5 GND B5 DH24 C5 GND D5 DH23
A4 GND B4 DH26 C4 GND D4 DH25
A3 GND B3 DH28 C3 GND D3 DH27
A2 GND B2 DH30 C2 GND D2 DH29
A1 GND B1 DH32 C1 GND D1 DH31
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Table 2-7 Interconnection Signal List for Order and Amplification Board XS3
Order and Amplification Board XS3 (XS3)
Pin Signal Pin Signal Pin Signal Pin Signal
25AGND
B25RF10
C25GND
D25DCS4
24A GND B24 RF16 C24 GND D24 DCS3
23A GND B23 RF16 C23 GND D23 DCS3
22A GND B22 RF10 C22 GND D22 DCS2
21A GND B21 RF15 C21 GND D21 DCS2
20A GND B20 RF15 C20 GND D20 DCS1
19A GND B19 RF10 C19 GND D19 DCS1
18A GND B18 RF14 C18 GND D18 DAX3
17A GND B17 RF14 C17 GND D17 DAX3
16A GND B16 RF10 C16 GND D16 DAX2
15A GND B15 RF13 C15 GND D15 DAX2
14A GND B14 RF13 C14 GND D14 DAX1
13A GND B13 RF10 C13 GND D13 DAX1
12A GND B12 RF12 C12 GND D12 DAX0
11A GND B11 RF12 C11 GND D11 DAX0
10A GND B10 RF10 C10 GND D10 DAY2
9A GND B9 RF11 C9 GND D9 DAY2
8A GND B8 RF11 C8 GND D8 DAY1
7A GND B7 RF10 C7 GND D7 DAY1
6A GND B6 RF10 C6 GND D6 DAY0
5A GND B5 RF10 C5 GND D5 !TGATE
4A GND B4 GND C4 GND D4 RESSET
3A GND B3 RF9 C3 GND D3 DDATA
2A GND B2 RF9 C2 GND D2 STROBE
1A GND B1 GND C1 GND D1 STROBE
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2.3.3 Industrial Control Board
Table 2-8 Interconnection Signal List for Industrial Control Board
Industrial Control Board (XS1)
Pin Signal Pin Signal
A1 +5VP 1B NC
A2 NC 2B GND
A3 +5VP 3B GND
A4 +5VP 4B NC
A5 +5VP 5B +5VP
A6 INTA 6B NC
A7 NC 7B NC
A8 NC 8B NC
A9 NC 9B NC
A10 NC 10B REQ
A11 NC 11B NC
A12 GND 12B GND
A13 GND 13B GND
A14 GNT 14B NC
A15 RST 15B GND
A16 NC 16B CLK
A17 NC 17B GND
A18 GND 18B NC
A19 NC 19B NC
A20 AD30 20B AD31
A21 NC 21B AD29
A22 AD28 22B GND
A23 AD26 23B AD27
A24 GND 24B AD25
A25 AD24 25B NC
A26 NC 26B C_BE3
A27 NC 27B AD23
A28 AD22 28B GND
A29 AD20 29B AD21
A30 GND 30B AD19
A31 AD18 31B NC
A32 AD16 32B AD17
A33 NC 33B C_BE2
A34 FRAME 34B GND
A35 GND 35B IRDY
A36 TRDY 36B NC
A37 GND 37B DEVSEL
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Industrial Control Board (XS1)
Pin Signal Pin Signal
A38 STOP 38B GND
A39 NC 39B NC
A40 NC 40B PERR A41 NC 41B NC
A42 GND 42B SERR
A43 PAR 43B NC
A44 AD15 44B C_BE1
A45 NC 45B AD14
A46 AD13 46B GND
A47 AD11 47B AD12
A48 GND 48B AD10
A49
AD949B
GND A50 NC 50B NC
A51 NC 51B NC
A52 C_BE0 52B AD8
A53 NC 53B AD7
A54 AD6 54B NC
A55 AD4 55B AD5
A56 GND 56B AD3
A57 AD2 57B GND
A58 AD0 58B AD1
A59 NC 59B NC
A60 NC 60B NC
A61 NC 61B NC
A62 NC 62B NC
2.4 Connection Diagram Between PCBs
For the connection diagram between PCBs, please refer to Fig. 2-1. The Industrial Control
Board diagram is shown below in Fig. 2-15:
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Example 2: screws assemblies, spec M4, expressed as: sc rews assemblies M4.
2.5.1.3 All the screws for disassembling are Phillips screws, so the operator of the
disassembly shall use corresponding Philips screwdrivers. Due to the heads of Phillips
screws have two types: shallow and deep, to avoid any damage to the screws and
consequent failure of screw disassembling, please select appropriate screwdrivers for the
screws when disassembling the screws. A small slotted screwdriver may be required
when disassembling some special parts.
Note: Generally, the screws we use are M3 or under M3 pan screws, as well as
under M3 (excluding M3) cheese head screws, whose Philips head are
shallow, while the others are deep.
2.5.1.4 Before disassembly, make sure that the power cable is unplugged, and all the
probes are disconnected and laid aside properly.
2.5.1.5 When unplugging the cables from the system, please mark the corresponding
plugs and sockets to facilitate plugging the plugs into the right sockets during reassembly.
2.5.1.6 During disassembly, the exterior plastic parts and the keyboard silicon-gel
buttons demounted shall be placed upon a bubble wrap bag or a PE foam, keeping them
away from the work area as far as possible to avoid any disfigurement caused by
disassembling other structural parts.
2.5.1.7 Due to updates of system parts and consequent structure changes, there might
be some tiny differences in disassembly of systems from different lots. This instruction
may not cover all these differences.
2.5.2 Disassemble Plastic Housing
2.5.2.1 Disassemble lower cover of back housing from main unit
The lower cover shall be disassembled following the steps below:
a) Unclench the left, right rubber stoppers on the back enclosure cover with a slotted
screwdriver. Remove two M4X8 pan screws fixing the back enclosure cover, and
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Note: The left and right rubber stoppers are not symmetric. Please be cautious to
distinguish the left and the right ones for the sake of reassembling them
properly.
2.5.3 Disassemble Keyboard
2.5.3.1 Disassemble keyboard fo rm main unit
The disassembly of the keyboard from the main unit shall follow the steps below:
a) Unfold the keyboard by pressing the buttons at the top of the front frame and lay it
down horizontally. Unclench the two rubber stoppers at the top of the keyboard
upper housing with a slotted screwdriver, and remove two M3X12 cheese head
screws.
b) Turn the keyboard 45 degrees proximately. Hold on the projection of the lower
cover of the keyboard tightly. Press upon the left and right edge of the upper cover
of keyboard with two thumbs, and draw the lower cover of keyboard toward the
operator to displace it from the upper cover of keyboard. And then unclench the
fixing buckles on the left and the right with a slotted screwdriver to remove the
lower cover of the keyboard.
c) Turn the keyboard vertically. Remove three M3X10 screw assemblies at the bottom
left, then withdraw the left turning shaft.
d) Unplug all the flat cables connecting to the main unit, withdraw the left side of the
keyboard slightly, remove the right turning shaft from the right supporting fixture of
keyboard, and then remove the keyboard.
2.5.3.2 Disassemble parts from the keyboard
After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),
the parts of the keyboard shall be disassembled following the steps below:
a) Unplug the cable of the trackball. Remove two M3X8 screw assemblies fixing the
trackball to remove the trackball.
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b) Remove five knobs and eight slides on the keyboard with a slotted screwdriver, and
seven M3×20 screw assemblies of the KBIF board at the back of the keyboard.
Then remove the KBIF board.
Note: Please be cautious not to scratch the knobs or the keyboard surface
when unclenching the keyboard knobs. After the KBIF board is
removed, keep the seven braces of the KBIF board in place for
reassembly.
c) Having finished steps a) & b), remove all M3×6 screw assemblies on the KB board
at the back of the keyboard to remove the KB board.
Note: During disassembling the KB board, when splitting the positioning
nails at the back of the silicon-gel buttons embedded in the KB board,
special attention shall be paid to avoid breaking the positioning gel
nails.
d) Having removed the KB board, withdraw the silicon-gel buttons through the holes
on the plastic housing carefully.
Note: To prevent any scratch, the silicon-gel surface of the keyboard shall be
placed with the buttons upward.
2.5.4 Disassemble Rear Panel
2.5.4.1 Disassemble rear panel from main unit
After completing the operation in Section 2.5.2 (disassemble plastic housing), the rear
panel shall be disassembled following the steps below:
a) Remove six M3X6 screw assemblies in the right, left and upper parts.
b) Unplug all the cables connecting the real panel with the main unit, then
disassemble the real panel.
2.5.4.2 Disassemble platelets of the rear panel
After completing the operation in Section 2.5.4.1 (disassemble rear panel from main unit),
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all the platelets on the real panel shall be disassembled following the steps below:
a) Unplug the plug connecting the Fan Patch Board. Remove two M3×6 screw
assemblies and then remove the Fan Patch Board;
b) Unplug the plug connecting the Net Port Board. Remove two M3×6 screw
assemblies and then the Net Port Board;
c) Unplug the plug connected to the USB board. Remove four M3X6 screw
assemblies, and then take out USB board.
d) Unplug the plug connected the LED board. Remove M3X6 screw assembly, and
then take out LED board.
e) Unplug the plug connecting the Print Control Interface Board. Remove two M3X6
screw assemblies and then remove the Print Control Interface Board.
2.5.5 Disassemble Industrial Control Board
2.5.5.1 Solution 1:
After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),
follow the steps below to disassemble the Industrial Control Board:
a) Unplug all plugs on the top of the Industrial Control Board connecting to other
components;
b) Remove four M3×6 screw assemblies fixing the Industrial Control Board shield
enclosure, then remove the shield enclosure.
c) Unplug all plugs connecting to the Industrial Control Board.
d) To withdraw the Industrial Control Board from the slot, remove two M3×6 screw
assemblies fixing both corners of the Industrial Control Board.
2.5.5.2 Solution 2:
After completing the operation in Section 2.5.2 (Disassemble plastic housing), follow the
steps below to disassemble the Industrial Control Board:
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2.5.7 Disassemble Power Supply and Hard Disk
2.5.7.1 Disassemble hard disk
After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),
follow the steps below to disassemble the hard disk:
a) Unplug all the plugs connecting to the hard disk;
b) Remove two M3×6 screw assemblies fixing the Hard Disk Fixture to withdraw the
hard disk together with the fixture;
c) To remove the IDE interface board, remove two M3×6 screw assemblies;
d) Remove four M3×8 screw assemblies on both sides to take out the hard disk from
the fixture.
2.5.7.2 Disassemble power supply module from main un it
After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),
follow the steps below to disassemble the power supply:
a) Unplug all the plugs connecting to the power supply module and the plugs
connecting to the FEP Board;
b) Remove two M3×6 screw assemblies through the gap at the top of the Monitor
Board Fixture, and two M3×6 screw assemblies on the left of the frame through two
holes on the Industrial Control Board shield enclosure. Withdraw the power supply
module from the main unit.
Note: If it is too tight between the power supply module and the frame, loosen four
screw assemblies fixing the monito r back supporting board, then to withdraw
the power supply module from the frame.
2.5.7.3 Disassemble ATX power supply
After completing the operation in Section 2.5.7.2 (Disassemble power supply from main
unit), follow the steps below to disassemble the ATX power supply:
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a) Unplug all the plugs connecting the ATX power supply with the PW board;
b) Follow the process in Section 2.5.7.1(Disassemble hard disk) to withdraw the hard
disk together with the fixture from the hard disk box.
c) Remove three M3×6 screw assemblies to disassemble the fan and the fan fixture;
d) Remove four M3×6 screw assemblies and two M3×6 countersunk head screws of
the hard disk box to disassemble the ATX power supply cover;
e) Remove four M3×6 screw assemblies to withdraw the ATX power supply.
2.5.7.4 Disassemble PW board
After completing the operation in Section 2.5.7.2 (Disassemble power supply module from
main unit), follow the steps below to disassemble the PW board:
a) Remove eight M3×6 screw assemblies at the front and the back to disassemble the
power supply frame cover board and the hard disk box;
b) Remove four M3×6 screw assemblies and a M3×6 pan head screw on the right
side, then withdraw the PW board.
2.5.8 Disassemble MONIT Board
2.5.8.1 Disassemble front frame
2.5.8.1.1 Disassemble color filter
The color filter shall be disassembled as the following:
Unfold the keyboard and then level it. Toggle up the right and left buckles locking the top
of the color filter on the front frame, when the buckles are in place, the top of the color filter
will be ejected automatically with the bounce of the post at the top of the color filter. Then
draw out the whole color filter from the top.
Note: The operator shall wear gloves during the whole disassembly process. Dust
or fingerprint on the surface of the color filter, if any, could be wiped off with
lens cleaning paper. Attention shall be paid to prevent any scratch upon the
color filter.
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2.5.8.1.2 Disassemble front frame from main unit
After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),
the front frame shall be disassembled following the steps below:
a) Remove six M3X10 screw assemblies fixing the front frame on the left and right
sides.
b) Draw out the front frame a little bit, and unplug the cables connecting the back of
the front frame with the contrast platelet. Then remove the whole front frame.
Note: Attention shall be paid to prevent any scratch upon the color filter after
disassembly of the front frame.
2.5.8.1.3 Disassemble contrast adjust platelet
After completing the operation in Section 2.5.8.1.2 (disassemble front frame from main
unit), remove three M3X8 screw assemblies to take out the contrast adjust platelet.
Note: After disassembling the contrast adjust platelet, take out four adjust knobs
and polyester plates, then place them aside properly for reassembly.
2.5.8.2 Disassemble MONIT board and monitor tube
2.5.8.2.1 Disassemble MONIT board
After completing the operation in Section 2.5.6 (disassemble PR Probe Board and RVA
Board), the MONIT board shall be disassembled following the steps below:
a) Remove four M3×6 screw assemblies, then remove the probe shield board on the
right side of the main unit.
b) Remove two M3×6 screw assemblies and two M3×6 countersunk head screws,
then remove the front board of the probe shied board.
c) Unclench the anode cap of the monitor tube carefully.
d) Remove four M4X8 screw assemblies and then rear arm of the handle.
e) Remove two M3X6 screw assemblies and turn the MONIT board to the vertical
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position.
f) Remove a M4X8 screw assembly on the front arm of the MONIT board to loosen
the earth cable.
g) Take out the mounting plate at the tail of monitor tube.
h) Unplug all the plugs connecting the MONIT board.
i) Draw out the tail of the rotation-supporting axis at the fixture tail of the monitor
board from the slot of the back supporting plate, then draw out the whole MONIT
board fixture backward.
j) Remove four M3X6 screw assemblies and then take out the MONIT board.
2.5.8.2.2 Disassemble monitor tube
After completing the operation in Section 2.5.8.2.1(Disassemble MONIT board), follow the
steps below to disassemble the Video Tube:
a) Remove four M4×8 screw assemblies on the top to disassemble the front
supporting piece of the handle.
b) Hold on the bottom of the monitor tube, remove six M4×8 screw assemblies on the
left and the right to withdraw the monitor tube together with the fixing structure
forward slowly.
Note: When drawing out the monitor tube, attention shall be paid to prevent
any collision with the tail of the tube. After the monitor tube is drawn
out, it shall be placed upon spacer such as bubble wrap bag with the
surface of the tube downward to avoid any scratch upon the surface of
the tube.
c) Remove four M4×8 screw assemblies and the fixing structure. Then remove the
monitor tube.
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2.5.9 Disassemble FEP Board
After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),
2.5.5 (Disassemble Industrial Control Board) and 2.5.6 (Disassemble PR Board and RVA
Board), follow the steps below to disassemble the FEP board:
a) Unplug all the plugs linking to the FEP board;
b) Remove two screw assemblies and six countersunk head screws fixing the frame
and the base to separate the frame from the base;
c) Remove twelve M3×6 screw assemblies to take out the FEP board.
2.5.10 Assemble Schematic of Main Unit
The assemble schematics of the main unit of the main unit are shown in Fig. 2-16 and Fig.
2-17, which can be used as an auxiliary reference chart for disassemble and assemble
process.
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Table 2-9 (Continued)
No. Descrip tion Quantity
38 Fan cover 1
39 Power socket 1
40 Fan socket strips 141 LED board 1
42 USB board 1
43 Net port board 1
44 Print control port board 1
45 Switch 1
46 Fuse holder 2
47 Video output 1
48 Ground pole 1
49 MONIT board 1
50 Panel fixture (left) 1
51 Panel fixture (right) 1
52 Frame 1
53 Handle fixture (front) 1
54 KB board 1
55 KBIF board 1
56 Trackball 1
57 Reversal seating (left) 1
58 Reversal seating (right) 1
59 Slider 8
60 Keyboard knob 5
61 Keyboard silicon-gel button panel 1
62 Keyboard panel stopper 2
63 Keyboard sleeve 7
64 Keyboard housing (upper) 1
65 Keyboard housing (lower) 1
66 Color filter 1
67 Dustproof net 1
68 Dustproof net 2
69 Front frame 1
70 Cover for ventilation opening (left) 1
71 Cover for ventilation opening (right) 1
72 Cover for ventilation opening (front) 1
73 Button 2 4
74 Button 1 1
75 Hook 1
76 Hook fixing press board 1
77 Polyester spacer 178 Contrast adjust board 1
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2.6 Installation Instruction for Computer Main Board (Industrial
Control Board)
2.6.1 Appearance of Computer Main Board
Unit: mm
Fig. 2-18 Appearance of Computer Main Board
2.6.2 Interface Position Map
Fig. 2-19 Interface Position Map
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2.6.3 Installation of System Memory
2.6.3.1 Please pay attention to the following when installing memory bank:
a) To install the memory bank, match the gap of DIMM memory bank and DIMM Slot,
then press down DIMM memory bank in place.
b) The 184Pin SO-DIMM memory module adopted for the Computer Main Board
(Industrial Control Board) shall be compliant with DDR 266/DDR333 specifications,
with the maximum capacity up to 1GMB.
2.6.4 USB Port
USB1 provides two standard USB ports, and USB2 is a set of 2×5 Pin USB device pin.
USB2 needs a conversion cable to connect the USB port signal to a standard USB port.
The pin definitions of USB ports are shown in Table 2-10 and Table 2-11:
Table 2-10 Pin Definition of USB1 Port
USB1 Signal
1 +5V
2 USB Data-
3 USB Data+
4 GND
Table 2-11 Pin Definition of USB2 Port
Pin Signal Pin Signal
1 +5V 2 +5V
3 USB Data- 4 USB Data-
5 USB Data+ 6 USB Data+
7 GND 8 GND
9 VOID 10 GND
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2.6.6 Floppy Disk Port
The CPU card provides a set of 34-pin floppy drive port, which can be connected to at
most two 3.5-inch or 5.25-inch floppy disk drives. Please pay attention to the orientation of
the cables and the sockets during connection (The pin on the floppy drive cable marked in
red is first pin). See Table 2-13 and Table 2-14 for pin definition of the ports COM1, COM2,
COM3 and COM4.
Table 2-13 Pin Definition of Port COM1
Pin Signal
1 DCD, Data Carrier Detection
2 RXD, Receive Data
3 TXD, Transmit Data
4 DTR, Data Terminal Ready
5 GND, Ground
6 DSR, Data Set Ready
7 RTS, Request To Send
8 CTS, Clear To Send
9 RI, Ring Indicator
Table 2-14 Pin Definition of Port COM2/ COM3/COM4
Pin Signal
1 DCD, Data Carrier Detection
2 RXD, Receive Data
3 TXD, Transmit Data
4 DTR, Data Terminal Ready
5 GND, Ground
6 DSR, Data Set Ready
7 RTS, Request To Send
8 CTS, Clear To Send
9 RI, Ring Indicator
10 Not used
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2.6.7 Display Port
A 15-core model D VGA monitor socket can be connected to any monitor with standard
VGA port.
Table 2-15 Pin Definition of Display Port
Pin Signal Pin Signal
1 Red 2 Green
3 Blue 4 Pull up to +5V
5 GND 6 GND
7 GND 8 GND
9 +5V 10 GND
11 Pull up to +5v 12 DDCDATA
13 HSYNC 14 VSYNC
15 DDCCLK
2.6.8 Network Port
LAN1 is a 10/100Mbps Ethernet port on the Main Board. LILED and ACTLED are the
green and the yellow LEDs on both sides of the Ethernet port, which indicates LAN activity
and transmitting status. Please refer to the following status description of each LED:
Fig. 2-20 Network Port
TD+,TD-:Positive/Negative Transmitting Data Signal
RD+,RD-:Positive/Negative Receiving Data Signal
ACTLED:Network Activity Indicator
LILED:Network Link Indicator
LILED
(Green Light)
Indication State
On: Network line available
Off: Network line not available
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ACTLED
(Yellow Light)
Indication State
2.6.9 Keyboard and Mouse Port
KM1 is a 6-pin mini DIN socket for the keyboard and the mouse, which can be connected
to a PS/2 keyboard directly. A 1 to 2 PS/2 keyboard mouse cable configured with the
single-chip computer is required for connecting the keyboard and the mouse at the same
time.
Table 2-16 Pin Definition of KM1
Pin Signal
1 Keyboard data
2 Mouse data
3 GND
4 +5V
5 Keyboard clock
6 Mouse clock
2.6.10 Power Supply Port
Note:
a) To avoid any damage to the CPU card, please use the 12V (4P to 2xP standard
port) power switchover cable (attached with the CPU card) to connect the PW2
(+12V power outlet) on the CPU card with the 4P power cable of the power supply,
or connect the special power cable on P4 power supply with PW2, so as to ensure
sufficient power supply to the CPU card.
b) Before using the ATX power supply, unplug AC power (100/200V), then plug the
ATX power supply plug into the ATX power supply socket tightly. Connect other
On: Transmitting or Receiving Data
Off: No Data being transmitted or received
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related accessories properly before connecting AC power (110/220V) to the AC
power socket.
1) ATX Power Supply Port
Table 2-17 Pin Definition of ATX Power Supply
Pin Signal Pin Signal
1 +3.3V 11 +3.3V
2 +3.3V 12 -12V
3 GND 13 GND
4 +5V 14 PS-ON (power
switch control)
5 GND 15 GND
6 +5V 16 GND
7 GND 17 GND
8 Power Good 18 -5V
9 +5V SB (backup +5V) 19 +5V
10 +12V 20 +5V
2) +12V Power Supply Port
Table 2-18 Pin Definition of +12V Power Supply Port
Pin Signal
1 GND
2 GND
3 +12V
4 +12V
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2.6.11 Fan Port
The CPU card provides two sets of standard fan sockets [FAN1 (CPU fan), FAN2
(Housing fan)]. Please pay attention to the following 3 points when using the fan sockets:
a) The current for the fan shall be less than 350mA (4.2W, 12V).
b) Ensure that the connection