Delivering the Datacenter of the Future Making the Open Compute Vision a Reality

Eric Hooper Director, Rack Scale Architecture Cloud Platforms Group Intel Corporation

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Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. - Notice revision #20110804

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel® Xeon®, Intel® Atom™, Intel® Open Network Platform, Intel® Rack Scale Architecture, Intel® Lustre*, Intel® SSD, Intel® Ethernet Controllers and the Intel logo are trademarks of Intel Corporation or in the US and other countries.

Copyright © 2014, Intel Corporation. All rights reserved.

* Other brands and names may be claimed as the property of others.

Legal Disclaimer

* Other brands and names may be claimed as the property of others. 3

Making the Open Compute Vision a Reality

3

Development

Contributions

Adoption

* Other brands and names may be claimed as the property of others.

Intel® Rack Scale Architecture Vision

• Flexible Compute Platform Support range of Intel® Xeon® or Atom® processor based nodes

• Open Network Platform & Photonics Interconnect – Network switch on standard hardware

•  Storage & Memory Systems – Modular tray with range of technologies

Modular systems

(Pooled Resources) Logical

Architecture

Enables Software Defined

Orchestration

Flexibility – Capital Efficiency – Lower TCO

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Rack Scale Architecture – Near Term

OCP Boards

Open Network Platform

Silicon Photonics

Interconnect

Remote Direct Attach

Storage Density

Up to

1.5X2

Provisioned Power

Up to

5X2

Cables

Up to

3X1

NW Downlink

Up to

25X1

So#ware  and  workloads  used  in  performance  tests  may  have  been  op9mized  for  performance  only  on  Intel  microprocessors.  Performance  tests,  such  as  SYSmark  and  MobileMark,  are  measured  using  specific  computer  systems,  components,  so#ware,  opera9ons  and  func9ons.  Any  change  to  any  of  those  factors  may  cause  the  results  to  vary.  You  should  consult  other  informa9on  and  performance  tests  to  assist  you  in  fully  evalua9ng  your  contemplated  purchases,  including  the  performance  of  that  product  when  combined  with  other  products.  Results  have  been  es9mated  based  on  internal  Intel  analysis  and  are  provided  for  informa9onal  purposes  only.  Any  difference  in  system  hardware  or  so#ware  Results  have  been  es9mated  based  on  internal  Intel  analysis  and  are  provided  for  informa9onal  purposes  only.  Any  difference  in  system  hardware  or  so#ware  design  or  configura9on  may  affect  actual  performance.  1.  Improvement    based  on    standard    rack    with  40  DP  servers,  48    port  ToR  switch,  1GE  downlink/server  and  4  x10GE  uplinks,    Cables:  40  downlink  and  4  uplink  vs  .  rack  with  42  DP  servers,  SiPh  patch  panel,  25Gb/s  downlink,  100Gb/s  uplink,  ,  Cables:  14  op9cal  downlink,    and  1  op9cal  uplink.  Actual    improvement    will  vary  depending  on  configura9on    and  actual    implementa9on.  2.  Improvement    as  compared  to  20  Dell  PowerEdge  R720,  N+1  redundant  power,  705W  PSU  x2,  peak  power  provisioned  30,000  WaZs  vs.    same  server,  shared    DC  power  using  1  power    shelf  of  7x  700W  modules  and  4200W  (N+1)  :    power  provisioned  4900  WaZs            hZp://www.opencompute.org/wp/wp-­‐content/uploads/2013/01/Open_Compute_Project_Power_Shelf_v0.3.pdf  

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3 Generations of OCP Boards

Decathlete

Certified Boards

Windmill

Panther Leopard

New Boards Next Generation Intel® Xeon® Processor E5-2600 Product Family

Intel® Atom™ Processor C2000 Product Family

First Functional Rack Scale Architecture Demo with Next Generation Intel® Xeon® Processor * Other brands and names may be claimed as the property of others.

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January 2013 January 2014

Intel Silicon Photonics What a difference a year can make

Design is

IN PROCESS….

Design Guide

DRAFT Available…

MXC connector design is COMPLETE

FUNCTIONAL Silicon Photonics interconnect in Rack Scale Architecture

OEM SAMPLING & designs

Making the Open Compute Vision a Reality

8

Development

Contributions

Adoption

* Other brands and names may be claimed as the property of others.

Supporting Community Adoption

9 * Other brands and names may be claimed as the property of others.

Partnership with the OCP Grant Richard Goldman Sachs Technology Fellow, Managing Director

* Other brands and names may be claimed as the property of others. 11

Goldman Sachs Technology At a Glance

68 Firm and Public Designed Data

Centers

500,000 Compute Cores

34 Megawatts Available

16MM+ Software changes

per month

4,000 Applications

1.2BN Lines of code

28 PB Storage

8,000+ Engineers &

Technologists

10,000 Network Devices

118,000+ Servers in the

“GS Cloud”

59,000 Databases

45,000 Servers

50,000 Remote Desktop

Sessions

Source – Internal Goldman Sachs data 12

GS Partnership with the OCP

GS is a founding member of the Board of Directors of the Facebook

Open Compute Foundation

Works with financial and other members on 19” Intel & AMD form

factor contributions

Future: Deploy OCP form factors in production

GS attends OCP formation and issues press statement supporting

Partners for formation of Hardware Management Track Assists with of C&I Track creation

2011 2014+ Open Compute Project

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How does GS leverage OCP? Requirement: " A single scale out 19” motherboard (from Intel – Decathlete) for remote desktop,

risk calculation, storage and cloud for traditional cabinets

Technical Engagement: " GS Compute Engineering members materially contributed to.. " Technical specifications " Review with CPU manufacturers detail designs " Testing of BIOS and other firmware for functionality and performance

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Supply Chain Model Transformation " Transformation in supply chain brings both disruption and benefits " New partners, vendors and ecosystem to manage

Classic Today and Tomorrow

Manufacturers

Integrators Customers

Integrators Manufacturers Customers

Bridging hyper-scale technology, which embraces Open Compute principles, with the conventional data centers and applications

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Making the Open Compute Vision a Reality

15

Development

Contributions

Adoption

* Other brands and names may be claimed as the property of others.