delphi confidential precision bump formation mushroom type bump x-sec laser ablate plated up bump...

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Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

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Page 1: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

Precision Bump FormationMushroom type bump

X-Sec laser ablate plated up bump

Fabrication process

Page 2: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

– Simultaneous Laser Operation

» Define dot location

» Define alignment hole location

» Position tolerance +/- .002”

w

b

h

h = bump height 0.003-0.005 in.

b = bump base w + h

w = bump opening 6,8,10 mils

The bump is plated within and above the coverlay material.

Precision Bump FormationMushroom type bump

Design considerations (dot to dot spacings)

Page 3: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

Precision Bump FormationMushroom type bump

Examples of mushroom type bump partsFor military and commercial applications

Page 4: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

Photolithography Bump FormationPhotoresist defined bump

Laminate Photoresist

Photo / Develope

Plating

Strip Photoresist

Fabrication process

The shape of the bump is controlled by the photoresist image, so various shapes can be defined. Typicallyused with larger or gross opening in the coverlay.

.008”

.004”

Bump heights are 0.003-0.005 in.Bump Widths are 0.004 in. smallerthan the trace widths

Page 5: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

.008”

.004”

Photolithography Bump FormationPhotoresist defined bump

Examples of mushroom type bump partsFor military and commercial applications

Page 6: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

Precision Bump FormationEtch-a-dot type bump

Laminate coverlay

Laser coverlay openings

Plasma Clean openings

Plate mushroom bump

Etch smaller bump tipOn mushroom bump

Fabrication process

The bump is plated within and aboveThe coverlay surface.

Page 7: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

Precision Bump FormationEtch-a-dot type bump

Examples of mushroom type bump partsFor military and commercial applications

Typical bump dimensions

Page 8: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

Typical Gold dot circuit layout

Circuit Trace Capabilities: .0025/. 0025[0.0635/0.0635] Width/ Space

Calculating Contact Pitch:For Column Pitch:Pcolumn=(No rows-1) x (Trace width) + Base Pad Dia + (No Rows) x Conductor Spacing

Bump Height* Bump Base Diameter

Bump Base Pad Diameter

.0045[0.114] .008[0.216] .0145[0.368]

Column of Contacts

Rows of Contacts

Circuit Trace

Bump Base

Bump Base Pad

Page 9: Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

Delphi Confidential

Precision Bump FormationTypical Performance Characteristics

•Rated current per dot 1 amp Max @ room temp

•Contact Resistance <10mOhms

•Contact Force 0-150 gms per contact

•Vibration 10 G max. peak, 10-500 Hz

•Mechanical shock 30 G, 294 m/s peak Accel. 11 ms duration

•Operating temp. -40 to +125 C, continuous

•Bump contact Au Plated over Nickel and Copper

•Mating surface Immersion/hard gold & solder