Design for Manufacturability 1

Design For Manufacturability ( DFM)

C.Devanathan,

200821522,

CIM II Year.

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Contents Introduction and Definition History of DFM DFM Principle Why DFM Objectives of DFM DFM activities DFM typical approach DFM Tools and methodology DFM in Electronics Industry Case study

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Introduction DFM is product design considering

manufacturing requirements DFM is the first step in which a team

approach is taken to develop the product.

DFM is an umbrella which covers a variety of tools and techniques to accomplish a manufacturable product.

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Introduction Design for manufacturability is the

process of proactively designing products to (1) Optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair.2) Assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction.

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Definition

Design for Manufacturing (DFM) is a development practice emphasizing manufacturing issues throughout the product development process.

Successful DFM results in lower production cost without sacrificing product quality.

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History of DFM

Principles of DFM are not new.– Awareness of importance of designing

parts for easy manufacturing is key for all time.

– Difference is in the use of standards and design guides during the beginning stages of the design and not later

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Eli Whitney (early 1800’s)

Made use of standardizing the design of the lock on the musket so that interchangeable parts could be used

Before him, all muskets were made by craftsmen and no two muskets were the same or used the same parts.

His parts were built to specs and a tolerances

He organized a mass production process for locks

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History Contd.,

Book edited by Richard Bolz who organized the DFM methodology

DFM was originally called producibility (1960’s) and then manufacturability (1970’s) and then Design for Manufacturability (1985)

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DFM Principles

Use of standardsUse of common componentsDesign to specifications and

tolerancesUse of manufacturing guidelines in

the early stages of design that maximize quality of manufactured part

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DFM Principles

Minimize the use of materialsMinimize the use of floor space in

plantLocate all necessary components

near functional operationUse of automated machining for

minimal errors

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Why DFM?

60% of overall product cost is determined by decisions made early in the design process

75% of manufacturing cost is determined by design drawings and specifications

70 – 80% of all products’ defects are directly related to design issues

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Why DFM?

Lower development costShorter development timeFaster manufacturing start of

buildLower assembly and test costsHigher quality

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Objective of DFM

To identify product concepts that are easy to manufacture

Focus on component design for ease of manufacture and assembly

Integrate manufacturing to ensure the best match of needs and requirements.

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Activities of DFM

An analysis of the complete product in order to simplify its design.

An analysis of each individual part to maximize its manufacturability.

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DFM Typical Approach

DesignTest Tool Build

Launch

finishstart

Product Development Steps

Product Development team making it happen!!- Product requirements and deliverables- DFM tools and methods

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DFM Typical Approach

Product Team– EE– Project Manage– Component Engineer– Purchasing– Fab., process engineer– Assembly process engineer– Test engineer– Quality engineer– Uses DFM tools and methods

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For a Sound DFM Team:

Training / Education of several types are needed:

Attitudinal training. Clear role clarification. Information – sharing. Involvement and participation

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DFM Tools and Methodology

Use of the Standard Guidelines.Design For Assembly (DFA), (IBM

experience)Failure Mode and Effect Analysis

(FMEA), (Sun example)Taguchi Method, (Hitachi

experience)

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DFM Tools and Methodology

Value Analysis--”Value Engineering” (HP example)

Quality Function Deployment (QFD), Going to the Gemba (Hitachi)

Group Technology, (IBM example)Cost management and

optimization, SPC, Six-Sigma (Motorola), TQC, etc

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DFM Tools Pro’s and Con’sTechnique Advantage Disadvantage

Guidelines Cost and Effort Management Team Approach

Exceptions to list

Taguchi Systematic Narrows

possibilities

Management “Buy-in” Designer Effort

FMEA Systematic Priortizte corrective

action Provides guidance

Management Rates only ease of

assembly

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DFM Tools: ComparisonsDFM ACTIVITY

DFM TOOLS PRODUCT SIMPLIFY PROCESS FUNCTIONALCONCEPT CONCEPT NEEDS NEEDS

DESIGN GUIDELINES X XDESIGN FOR ASSEMBLY XTAGUCHI X XCUMPUTER AIDED DFM X X X XGROUP TECHNOLOGY X XFMEA X XVALUE ANALYSIS X

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DFM in Electronics Industry

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Consideration and requirements of Electronics Components

Size, form, fit, functionCost and availabilityInitial quality and long term

reliabilityMoisture sensitive device (MSD)

considerations and requirementsSolderability and solder joint

requirements

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Consideration and requirements of Electronics Components

Component to board edge spacing requirements

Component body to body spacing requirements

Component to board CTE requirements

All IC (PGA, BGA, DIP, SIP, SIMM, DIMM, etc.) pins correctly identified

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circuit requirements DCNoise, cross talk, interferenceMicro stripBuried Micro stripAnalogR/FEMIShielding type ImpedanceHigh powerThermal

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PCB material considerations as required

ImpedanceDielectric constantOverall board construction

requirementsDielectric withstanding voltageMoisture and insulation resistanceDielectric breakdown voltageHigh power requirementsR/F and EMI requirements

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Guidelines for DFM in Electronics Industry

More important guidelines for designers of Electronics products:

1. Standardization: Standardize circuit board sizes and dimensions.

2. Utilize the standard components3. Standardize the orientation of the

devices on the board.4. Product simplification

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Guidelines for DFM

5. The number of different hole sizes on the printed board – minimized.

6. The location of identification labels on components – standardized.

7. Minimize / eliminate the adjustments

8. It is advisable to use only one component placement method.

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Guidelines for DFM

9. Provide sufficient spacing between leads, vias, and traces – to avoid solder short circuit.

10.Componets that require a press to install- avoided.

11. When flexible circuit boards are used, avoid bends that are sharp so as not to crack copper conduction paths.

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Guidelines for DFM

12. Consider the environment in which the product will be manufactured and used.

13. Designers should be aware of the stack-up of positional tolerances.

14.SMT boards require proper size and spacing of mounting pads.

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Guidelines for DFM

15.Via holes should not be placed under metal conditions.

16.For, through hole boards, most traces should be on the component side, fewest on the solder side.

17.Use of even number of circuit board layers to reduce the possibility of the circuit board warping when the heat for soldering is applied.

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Case Study in Electronics industry

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Beyond Prototypes!! : Design for Manufacturing Concerns for Pico Radio

Test bed Must add draft angle and fillets to

part. This will add complexity to the model and slightly increase the size of the part. Part will be slightly conical instead of perfectly cylindrical to allow part removal from the injection mold.

Currently two sliders are required to form the serial port access hole and the power switch hole. Both holes need to be designed out.

We will need to use larger screw bosses to account for draft angle - PCB cut-outs (hopefully) have been enlarged to account for this.

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Beyond Prototypes!! : Design for Manufacturing Concerns for Pico Radio

Test bed Add a feature to screw the

PCB directly to the casing??

Case lid should be stiffer.

Casing design is small enough to be shot on our in-house injection press.

EDM will be required to make this mold. We must located an external vendor for this.

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Our MCAD tools

AutoCAD, SolidworksSDRC’s IDEAS, OpenCascade

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Our ECAD tools

Cadence’s ORCAD– Will be used for Bluetooth radio boards,

schematics and PCB designs– (Old BWRC CAD tools were Zuken Redac for

Layout, Routing, Manufacturing and Viewlogic for the schematics)3

Checking that these new tools can export and import new standards from the ISO

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ECAD MCAD

MOSISchip fab/pack.

PCB Assembly(Outsource)

Moldable Part

Mold Fill

DUCADE

Cut Mold (Out source/In-House)

AP 210

AP 203

AP 203

AP

210 Mold

Cut-ability

Feature Manager

Cybercut Pipeline

{DfM Pipelines (right side of ASU/UCB chart)

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STEP

The Standard for the Exchange of Product model (STEP) Provides a common method of defining product data

Application Protocols (APs) define the content, scope and information requirements of a designated application area

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STEP protocols AP203 and AP210

All mechanical CAD systems export and import STEP files in the AP203 protocol

Electronic assembly interconnect and packaging design is now described in AP210

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STEP AP210

April 1999– ISO (International Organization for

Standardization) accepted STEP Application Protocol as International Standard

• Electronic Assemblies, Interconnection and Packaging

• Printed Wiring Assemblies (PWA)

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Some Industries Following DFM

AT&TBoeingLockheed MartinGE IntelGMFord

ToyotaYahooMicrosoft IBMCisco SystemsHPSonic

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References

Design for Manufacturability Hand book - James G.Bralla.

www.toodoc.com

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