Design for Reliability

Greg Caswell, gcaswell@dfrsolutions.com

Senior Member of the Technical Staff

DfR Solutions

SMTA Boston June 3, 2015

Textron Facility

1

Abstract Designing printed boards and assemblies today is

more difficult than ever before because of the increased lead free process temperature requirements and associated changes required in manufacturing. Not only has the density of the electronic assembly increased, but many changes are taking place throughout the entire supply chain regarding the use of hazardous materials and the requirements for recycling.

Much of the change is due to the European Union (EU) Directives regarding these issues. The RoHS and REACH directives have caused many suppliers to the industry to rethink their materials and processes. Thus, everyone designing or producing electronics has been or will be affected.

2

Course Outline

MODULE 1: INTRODUCTIONS

Intro to Design for Reliability

DfR & Physics of Failure

MODULE 2: COMPONENTS

Selection

Critical Components

Moisture Sensitivity Level

Temperature Sensitivity Level

Electrostatic Discharge

Plating Material

Miscellaneous

Lifetime

Derating & Uprating

MODULE 3: MECHANISMS & PHYSICS

OF FAILURE

• Identifying Field Environment

• PoF Alternatives

• PoF Models & Examples

MODULE 4: PRINTED CIRCUIT BOARDS

• Surface Finishes

• Cracking & Delamination

• Laminate Selection

• Plated Through Vias (PTVs)

• PTH Barrel Cracking

• CAF

• Strain/Flexure Issues & Pad Cratering

• Cleanliness

• Electrochemical Migration

Nathan Myhrvold

“I want you to remember that everything

I am saying may be wrong and I want

you to question everything that I’m

saying.”

Module 1: Introduction to

DfR and Physics of Failure

(PoF)

Design for Reliability (DfR)

Defined

DfR: A process for ensuring the reliability of a

product or system during the design stage

before physical prototype

Reliability: The measure of a product’s ability

to

…perform the specified function

…at the customer (with their use environment)

…over the desired lifetime

Why Design for Reliability (DfR)?

The foundation of a reliable product is a robust design

Provides margin

Mitigates risk from defects

Satisfies the customer

Why DfR? (continued) Reduce Costs by Improving

Reliability Upfront

Who Controls Hardware Design? Electrical Designer

Component selection

Bill of materials (BOM)

Approved vendor list

(AVL)

Mechanical Designer

PCB Layout

Other aspects of

electronic packaging

Both parties play a critical role

in minimizing hardware

mistakes during new product

development.

When Do Mistakes Occur?

Insufficient exchange of information

between electrical design and mechanical

design

Poor understanding of supplier limitations

Customer expectations (reliability, lifetime,

use environment) are not incorporated into

the new product development (NPD)

process

“You don’t know what you don’t know”

Reality of Design for Reliability (DfR)

Ensuring reliability of electronic designs is becoming increasingly difficult Increasing complexity of electronic

circuits

Increasing power requirements

Introduction of new component and material technologies

Introduction of less robust components

Results in multiple potential drivers for failure

Reality (continued)

Predicting reliability is becoming problematic

Standard MTBF calculations can tend to be inaccurate

A physics-of-failure (PoF) approach can be time- intensive and not always definitive (limited insight into performance during operating life)

Limitations of Current DfR Too broad in focus: not electronics focused!

Too much emphasis on techniques (e.g., FMEA and FTA) and not answers FMEA/FTA rarely identify DfR issues because of limited focus on

the failure mechanism

Overreliance on MTBF calculations and standardized product testing

Incorporation of HALT and failure analysis (HALT is test, not DfR) is too late) Frustration with ‘test-in reliability’, even HALT, has been part of

the recent focus on DfR

DfR and Physics of Failure (PoF)

Due to some of the limitations of classic DfR, there has been an increasing interest in PoF (also known as: Reliability Physics)

PoF Definition: The use of science (physics, chemistry, etc.) to capture an understanding of failure mechanisms and evaluate useful life under actual operating conditions

Why PoF is Now Important

Fail

ure

Rate

Time

Electronics: 1960s, 1970s, 1980s

No wearout!

Electronics: Today and the Future

Wearout!

PoF and Wearout What is susceptible to wearout in electronic designs?

Ceramic Capacitors (oxygen vacancy migration)

Memory Devices (limited write cycles, read times)

Electrolytic Capacitors (electrolyte evaporation, dielectric dissolution)

Resistors (if improperly derated)

Silver-Based Platings (if exposed to corrosive environments)

Relays and other Electromechanical Components

Light Emitting Diodes (LEDs) and Laser Diodes

Connectors (if improperly specified and designed)

Tin Whiskers

Integrated Circuits (EM, TDDB, HCI, NBTI)

Interconnects (Creep, Fatigue)

Plated through holes

Solder joints

• Ceramic chip capacitors with high capacitance / volume (C/V) ratios

– Can fail in less than one year when operated at rated voltage and

temperature

Wearout (Ceramic Capacitors)

Wearout (Integrated Circuits)

1995 2005 2015

0.1

1.0

10

100

1000

Year produced

Known trends for TDDB, EM and HCI degradation

(ref: extrapolated from ITRS roadmap)

Mean

Service

life, yrs. Computers

laptop/palm

cell phones

Airplanes

0.5 mm 0.25 mm 130 nm 65 nm 35 nm

Process Variability

confidence bounds

Technology

IC Wearout (continued)

180 130 90 65 45 0

2

4

6

8

10

FIT

(0

00

)

Feature size, nm

It is becoming more challenging to achieve very

high reliability for products made with advanced

technologies (90nm and smaller)

Phil Nigh, IBM Microelectronics

“failure rate increases as we scale to smaller

technologies…hard failures will present a

significant and increasing challenge in future

technology generations.”

Pradip Bose, Jude A. Rivers, et al., IBM T.J.

Watson Research Center

Figure adapted from industry published data, 2008

In

production

Future…

In design

Dielectric

breakdown

failure rate vs.

feature size

Estimated

Measured Increasing need to predict failure

behavior before incorporating

new technology in long-life

systems

IC Testing Falls Short

Limited degree of mechanism-appropriate testing

Only at transition to new technology nodes

Mechanism-specific coupons (not real devices)

Test data is hidden from end-users

Questionable JEDEC tests are promoted to OEMs

Limited duration (1000 hrs) hides wearout behavior

Use of simple activation energy, with incorrect assumption that

all mechanisms are thermally activated, can result in

overestimation of FIT by 100X or more

Solder Joint (SJ) Wearout Elimination of leaded devices

Provides lower RC and higher package densities

Reduces compliance

Cycles to failure

-40 to 125C QFP: >10,000 BGA: 3,000 to 8,000

QFN: 1,000 to 3,000 CSP / Flip Chip: <1,000

SJ Wearout (cont.)

Design change: More silicon, less plastic

Increases mismatch in coefficient of thermal

expansion (CTE)

BOARD LEVEL ASSEMBLY AND RELIABILITY

CONSIDERATIONS FOR QFN TYPE PACKAGES,

Ahmer Syed and WonJoon Kang, Amkor Technology.

Industry Testing of SJ Wearout

JEDEC

Specification body for component manufacturers

JEDEC JESD4747H, February 2011

Guidelines for new component qualification

Requires 2300 cycles of 0 to 100C

Testing is often done on thin boards

IPC

Specification body for electronic OEMs

IPC 9701A, February 2006

Recommends 6000 cycles of 0 to 100C

Test boards should be similar thickness as actual design

Implementing DfR / PoF

Many organizations have developed DfR Teams to speed implementation

Success is dependent upon team composition and gating functions

Challenges: Classic design teams consist of electrical and mechanical engineers trained in the ‘science of success’

PoF requires the right elements of personnel and tools

DfR / PoF Team Component engineer

Mechanical / Materials engineer

Electrical engineer

Thermal engineer Depending upon power requirements

Reliability engineer? Depends. Many classic reliability engineers

provide NO value in the DfR / PoF process due to over-emphasis on statistical techniques and environmental testing

Module 2: Components

Component Selection

The process of creating the bill of

materials (BOM) during the ‘virtual’ design

process

Before physical layout

For some companies, this is during the

creation of the approved vendor list (AVL)

Design-independent

Component Selection (continued)

As technology progresses, functional performance has

become a limited aspect of the part selection process

Other concerns are increasingly taking center stage

Moisture sensitivity level (MSL)

Temperature sensitivity level

Electrostatic discharge (ESD) classification

Manufacturability (Design for Assembly)

Plating material

Lifetime / Long-term reliability

Sometimes Physics of Failure is required

Critical Components Most small to mid-size organizations do not have the resources to

perform a thorough part selection assessment on every part

Does not excuse performing this activity

Requires focusing on components critical to the design

Critical Components: A narrowed list of components of most

concern to the OEM

Sensitivity of the circuit to component performance

Number of components within the circuit

Output from FMEA / FTA

Past experiences

Complexity of the component

Industry-wide experiences

Critical Components (Industry Experience)

Optoelectronics High volume controls not always in place

Wearout can initiate far before 20 years

Low volume or custom parts Part is no longer a commodity item

Memory devices Non-volatile memory has limited data retention time and

write cycles

Parts with mechanical movements (switches, relays, potentiostats, fans) Depending on environment, wear out can initiate far before 20

years

Surface mount ceramic capacitors Assembly issues

Critical Components (continued)

New technologies or state-of-the-art At the limit of the manufacturer’s capabilities

MEMS, 45-nm technology, green materials, etc.

Electronic modules Part is a miniature assembly (no longer a commodity item)

Power components

Fuses Susceptible to quality issues

Electrolytic capacitors Depending on environment, wear out can initiate far before

20 years

Popcorning Moisture can be absorbed by

polymeric material during transportation, storage and handling

Epoxy encapsulant

Die attach

Printed substrate

Trapped moisture can experience sudden liquid-gas phase transition during reflow

Sudden volume increase due to vaporization

Cracking and delamination – sometimes accompanied by popping sound

Driven by package design, materials, storage conditions and reflow parameters

Qualcomm

Sonoscan

MSL Issues and Actions (continued)

Most ‘standard’ components have a maximum MSL 3

Components with MSL 4 and higher

Large ball grid array (BGA) packages

Encapsulated magnetic components (chokes, transformers, etc.)

Optical components (transmitters, transceivers, sensors, etc.)

Modules (DC-DC converters, GPS, etc.)

MSL classification scheme in J-STD-020D is only relevant to SMT packages with integrated circuits

Does not cover passives (IPC-9503) or wave soldering (JESD22A111)

If not defined by component manufacturer, requires additional characterization

Moisture Sensitivity Level (MSL) Popcorning controlled

through moisture sensitivity levels (MSL) Defined by IPC/JEDEC

documents J-STD-020D and J-STD-033B

Higher profile in the industry due to transition to Pb-free and more aggressive packaging Higher die/package ratios

Multiple die (i.e., stacked die)

Larger components

MSL: Typical Issues and Action

Items Identify your maximum MSL

Driven by contract manufacturer (CM) capability and OEM risk aversion

Majority limit between MSL3 and MSL4 (survey of the MSD Council of SMTA, 2004)

High volume, low mix: tends towards MSL4 Low volume, high mix: tends towards MSL3

Not all datasheets list MSL Can be buried in reference or quality documents

Ensure that listed MSL conforms to latest version of J-STD-020

Cogiscan

Aluminum and Tantalum Polymer Capacitors

Aluminum Polymer Capacitor

Tantalum Polymer Capacitor

Popcorning in Tantalum/Polymer Capacitors

Pb-free reflow is hotter Increased susceptibility to popcorning

Tantalum/polymer capacitors are the primary risk

Approach to labeling can be inconsistent

Aluminum Polymer are rated MSL 3 (SnPb)

Tantalum Polymer are stored in moisture proof bags (no MSL rating)

Approach to Tantalum is inconsistent (some packaged with dessicant; some not)

Material issues Aluminum Polymer are rated MSL 3 for

eutectic (could be higher for Pb-free)

Sensitive conductive-polymer technology may prevent extensive changes

Solutions

Confirm Pb-free MSL on incoming plastic encapsulated capacitors (PECs)

More rigorous inspection of PECs during initial build

Temperature Sensitivity

Limits on process temperatures provided by component

manufacturer

Components of concern with SnPb (220C peak) included RF devices and

some optoelectronic components

Broader issue due to introduction of Pb-free processes (260C

peak)

Initially limited: SnPb reflow sensitive components, SMT connectors,

ceramic capacitors, SMT

electrolytic capacitors

Primary issue for some OEMs

Current component packaging

technology is insufficiently robust

Numerous components in a telecom /

enterprise design now have peak

temperatures below 260C

Component Selection for ESD

Industry movement to decreasing feature

sizes and high frequency technology

90nm 65nm 45nm

GaAs / SiGe desirable at high GHz

Increasing ESD risks

More parts are ESD susceptible

ESD sensitivity is increasing (is Class 0 still

sufficient?)

Design for ESD Prevention:

What Do You Need to Do?

ESD Protection is necessary at the IC, component

package and system level

Different approaches are needed to achieve reliable

protection

Designing for ESD impacts both the product design and

the manufacturing process controls

What technologies are available to assure a reliable ESD

protected product?

At the IC level

At the component package level

At the system level

Good General Design Practices

for ESD Prevention Know the ESD rating for each part, and select

parts (where possible) for the best ESD rating Identify all ESD Sensitive Parts on drawings

Mark Locations of ESD Sensitive parts on the Board with the ESD symbol

Consider the entire System (Design) as ESD Sensitive

Use ESD Protection on all susceptible parts (not just System I/Os)

Box or System I/O

ESD Rating < Class 2 IEC 1000-4-2 (4000V) MANDATORY

Internal Components (not exposed to outside connectors)

ANSI/ESDA/JEDEC JS-001-2011, Human Body Model (HBM) - Component Level

ESD Rating <= Class 1 MANDATORY

ESD Rating < Class 2 WHEREVER POSSIBLE

DfR and Tin Whiskers

The first step is to focus DfR on critical components

Critical components are based upon three pieces of knowledge

The overwhelming majority of tin-plated electronic parts are matte tin over copper

Matte tin over copper produces whiskers of a finite length

Whiskers tend to only break off during handling

Where are the Scary Whiskers? When do really long whiskers occur?

Usually bright tin and/or plating over a substrate material

other than copper (brass, bronze, steel, etc.)

NASA (Leidecker): 18 mm over +10 years DfR (Fischer): +2 mm over 6 months

Tin (bright?) over steel Tin (matte?) over brass

Critical Components

Spacings of less than 500 microns

Parts with 0.8 mm lead pitch or less

0201 chip components

Metal can housing

Contact points (connector flex circuitry)

Stress gradients could change maximum length

Welds (electrolytic capacitors)

Stress gradients could change maximum length

Note: Some organizations specify the critical spacing as 350 microns

0.65 mm pitch or less

JEDEC JESD201

How to Mitigate?

There are three basic approaches to

mitigation

Data Gathering and Monitoring

Part Manufacturer Mitigation

Steps offered by your suppliers

Equipment Manufacturer (OEM) Mitigation

Steps you have to perform yourself

Data Gathering and Monitoring

Driven by iNEMI and JEDEC (JESD22A121A, JESD201A, JP002)

Industry recommended qualification tests

Ambient (30C/60%RH, 4000 hrs)

Elevated (55C/85%RH, 4000 hrs)

Cyclic (-40 to 85C, 1500 cycles)

Shorter test times for consumer products

Use manufacturer’s data, require third-party testing, or perform your own

Visual inspection should be performed properly

http://nepp.nasa.gov/whisker/background/index.htm#q6

Few to no military/avionics manufacturers are using this approach

Part Manufacturer Mitigation Nickel underplate between the tin plating and the copper leadframe

Some question about effectiveness (IBM vs. TI)

Some question about minimum thickness

iNEMI (article) recommends 2 microns

ATIS requires 2 microns

PC manufacturer requires 1.2 microns

JP-002 March 2006 requires 0.5 microns

Might not help for ceramic substrate due to CTE mismatch

Anneal for 1 hour at 150ºC within 24 hours of plating

This is the approach for Freescale

Fusing (melting of tin through dipping in a hot oil bath)

Excellent field history; must be performed soon after plating

Minimum plating thickness

Some question about minimum thickness

Telecom manufacturer requires 10 microns

JP-002 March 2006 recommends 7 microns minimum, 10 microns nominal

Part Manufacturer Mitigation (continued)

Some component manufacturers claim proprietary whisker-free plating formulation Be skeptical; require Statistical Process Control

Tin bismuth alloy finishes Mitigation not definitive

Low melting point of SnPbBi ternary might pose problems in mixed assemblies

Some experimental evidence suggests SnPb-plating and SnBi solder is a greater risk

Request palladium (Pd) plating – NiPdAu Increasingly offered as an option, even to low volume customers

(medical, industrial controls, etc.)

Most manufacturers have moved to Pd as a standard plating for fine-pitch components

Leadframe Platings Amkor

Palladium and SnBi are seeing an

increasing market share due to

concerns with tin whiskering

Company Package Plating

Intel QFP / TSOP Sn[1]

Samsung QFP / TSOP NiPdAu

Texas Instruments QFP / TSOP NiPdAu

Toshiba

TSOP (Discretes) NiPdAu

TSOP (Memory) SnAg or SnCu

TSOP (LSI) NiPdAu or SnAg or SnBi

STMicroelectronics QFP / TSOP NiPdAu

Infineon QFP Sn or SnPb

TSOP NiPdAu

Renesas Technology QFP Mostly Sn-Cu, Sn-Bi; some NiPdAu

TSOP Mostly NiPdAu, with some Sn-Cu, Sn-Bi

Sony QFP / TSOP Pd or SnPb

Philips/NXP QFP Sn

TSOP NiPdAu

Hynix TSOP SnBi

Freescale QFP / TSOP Sn

NEC QFP / TSOP Sn, SnBi, or NiPdAu

Micron TSOP Sn, SnPb

Matsushita/Panasonic QFP Pd

TSOP SnBi

AMD QFP Sn, SnCu, or SnPb

IBM QFP N/A

Qualcomm N/A N/A

Fujitsu QFP SnBi

TSOP SnBi

Sharp QFP SnBi, NiPdAu

TSOP SnBi

Ni-Pd-Au Finish, Cypress Semiconductor

OEM Mitigation

Four Options

Procurement, Re-packaging, Post-plate or dip, Conformal

coat

Procurement / Design

Select only components with SnPb or Pd plating

May require complete change in circuit design if alternative

component required

Rarely performed (functionality trumps reliability)

Subcontract packaging or Re-packaging

SnPb or Pd plated leadframes

Rarely performed (cost, risk of damage)

Tin Whiskering – Conformal Coating

Potential to provide a dual barrier

Prevention or delay of whiskering

Some indication of a delay in whiskering (Rollins / Minter)

Short tin whiskers will eventually penetrate all current conformal coatings

No definitive trend in regards to coating properties

Buckling

Based on calculations (Leidecker, NASA)

Not experimentally proven

Limitations

Insufficient coverage at leads (gravity)

Problems with conformal coat may outweigh possible risk avoidance

Current status:

Development of whisker-resistant coating

Assessment of single vs. double coating

http://nepp.nasa.gov/WHISKER/experiment/index.html

Leadframe

Conformal Coating

Leadframe

Conformal Coating

Tin Whisker

Mitigation efforts can fail when only one

source of stress is accounted for.

For example if a Ni layer is used to

prevent stress from IMC formation, this will

not address whisker formation due to

corrosion or external pressure.

All the potential sources of stress for a

particular application should be considered

in the mitigation process.

A New Approach to Mitigation

Propose both a Checklist and Process Control be used in the mitigation effort.

Critical to fail industries such airlines and medical are used to checklists to eliminate failures.

A tin whisker checklist would confirm that all sources of stress that can induce whiskers in an application are accounted for and adequately controlled.

A New Approach to Mitigation

The proposed checklist would require at least one “Yes” per question.

Are stresses due to intermetallic formation adequately controlled? Yes, through annealing (150°C for an hour within 24 hours of plating)

Yes, through use of an appropriate underplate (nickel, silver, etc.)

Yes, the base metal is treated to limit anisotropic intermetallic growth (i.e., surface roughening)

No

Are stresses due to differences in coefficient of thermal expansion adequately controlled? Yes, the base metal is copper

Yes, the coefficient of thermal expansion is greater than or equal to nickel (13 ppm)

No

Proposed Checklist

Are stresses in the bulk plating adequately

controlled?

Requirement: The supplier measures in-plane stresses

on a monthly basis and ensures the stresses are tensile

or mildly compressive. Grain orientation is understood

and measured with diffraction.

Yes, the supplier only uses low carbon/organic content

tin plating

Yes, the plating is subjected to reflow temperatures that

melt the tin

No

Proposed Checklist

Are stresses due to oxidation or corrosion adequately

controlled?

Yes, the device will not directly exposed to corrosive conditions (residual

aqueous flux residues, corrosive gases, salt spray, etc.)

Yes, the device will be used in a vacuum

Yes, the application has sufficient power dissipation to drop the humidity

below 40%RH and the application is always on

Yes, the device is covered with conformal coating or potting material

No

Are stresses due to external loads adequately controlled?

Yes, the tin plating does not have separable mechanical load being

applied

No

Proposed Checklist

Component Selection

(Misc)

Ceramic Capacitors (Cyclic Voltage)

Reports of field failures of MLCC in AC or pulsed DC voltage

Piezoelectric effect Variant voltage will vary internal

stresses, potentially inducing fatigue behavior

With high frequency ripple current, capacitor can vibrate (resonate).

Fatigued specimens can contain scattered microcracks Decrease in capacitance;

increase in leakage current

Concern at hundreds of kHz Decreases with increasing

capacitance, X7R -> Y5V

Avoid or use AC-rated capacitors

Sang-Joo Kim and Qing Jiangy, Microcracking and electric fatigue of

polycrystalline ferroelectric ceramics, Smart Mater. Struct. 5 (1996)

English Metric

3025 7563 250 - 750 kHz

2220 5750 300 - 900 kHz

1812 4532 400 - 1200 kHz

1210 3225 600 - 1200 kHz

1206 3216 600 - 1600 kHz

0805 2012 900 - 1800 kHz

0603 1608 N/A

0402 1005 N/A

Case SizeResonance Frequency

Nippon Chemi-con, CAT.No.E1002l

http://www.avxcorp.com/docs/techinfo/parasitc.pdf

Resistors (High Resistance) Board surfaces can be susceptible

to periodic SIR drops

Especially with no-clean

Duration as short as 1 min

Down to 1 MegaOhm

Fine pitch, high voltage especially susceptible

Can interfere with high resistance resistors

Especially chip resistors

Intermittent in nature

Avoid values > 500 kOhms if used for sensing or calibration

Consider lower values in series

Use guard banding or cutouts

Sulfide Corrosion of Thick Film Resistors Sulfur dioxide (SO2) and hydrogen sulfide (H2SO4)

in environment

Sources: Black rubber, industrial pollution

Attacks silver material under passivation/ termination

Creates nonconductive silver sulfide

Drivers

Cracking/separation of coating/termination

Poor manufacturing

Thermal shock

Potting or conformal coating

Seems to act as a ‘sponge’

Holds SO2 molecules in place

Electrical opens within 1-4 years

Avoidance

Orient parallel to solder wave

Entrance side can experience thermal shock

Avoid hand soldering/rework

Sulfur-resistant PdAg material (KOA)

Electrolytic Capacitors Voltage

Maintain a minimum of 25-33% of rated voltage (maintains the dielectric)

Temperature

Maintain adequate distance from ‘hot’ components

Power resistors, IGBTs, etc.

Seems to accelerate time to failure and can induce explosive rupturing

105C rated capacitors can be an issue at lower temperatures (below -40C)

ESR increases 500X; capacitance decreases 80-90%

Ripple Current

Up to 100% or greater of rated ripple current

Need to calculate/measure case temperature rise

Equivalency on bill of materials is often not maintained

Equivalent Series Resistance (ESR)

Often not specified on the component data sheet

Separable Connectors

Separable Connectors One of the most common failure sites

First thing maintenance checks (plug / unplug)

Hardware Design Rules Blind insertion increases risk of damage or mismating (consider

flex or rigid-flex)

All connectors should be keyed

Prevents reversal of I/O pins

Use positively retained connectors

Avoid use of sockets

Specify material and thickness

Separable Connectors [Gold (Au)]

Material specifications Be-Cu or P-bronze base pins

Nickel underplate (250 min)

Soft gold (Au) plating

10 min (single insertion); 30 min (50 insertions); 70 min (hi-rel)

Porosity spec

No gold flash

Contact specifications 50-100 grams contact force

Minimum of 2 contacts; 4 preferred

Adequate contact wipe – 0.010” min.

No mating with tin plating

Connections and environments

Hi-speed digital or critical connections

Low voltage (< 5V), low current (< 10mA)

Corrosive environment (gases such as H2S, SO2, Cl2)

Risk of micromotion (< 2.5 µm)

Separable Connectors [Tin (Sn)]

Connections and environment

Power connections

Benign

Tin plating design specification

100 grams-force, 100 microinches (Tin

Commandments)

Component Selection

(Lifetime)

Component Lifetime What parts are susceptible to long-term degradation in electronic designs?

Ceramic Capacitors (oxygen vacancy migration)

Memory Devices (limited write cycles, read times)

Electrolytic Capacitors (electrolyte evaporation, dielectric dissolution)

Resistors (if improperly derated)

Silver-Based Platings (if exposed to corrosive environments)

Relays and other Electromechanical Components

Light Emitting Diodes (LEDs) and Laser Diodes

Connectors (if improperly specified and designed)

Tin Whiskers

Integrated Circuits (EM, TDDB, HCI, NBTI)

Interconnects (Creep, Fatigue)

Plated through holes

Solder joints

Lifetime Example: Memory

Devices

Parameter Minimum Guarantee Units

Endurance 100,000 Data changes per bit

Store cycles 1,000,000 Store cycles

Data retention 100 Years

Limited lifetime based on read-write cycles and retention time

Some memory devices provide data retention time for different operating temperatures (20 years at 125°C and 10 years at 150°C).

Lifetime Example: Relays/Switches Relays are an

electromechanical switch

Minimum of four I/Os Control voltage

Signal voltage

What are the major concerns in regards to relay reliability? Number of cycles to

failure

Long-term non-use

Power dissipation and contact resistance (heating and voltage drops)

Relays/Switches (continued)

Selection of appropriate plating

Idle for long periods of time: Gold contacts

Numerous cycles: AgCd contacts

Sealed packages if cleaning operations

Use of protective devices

Diode, resistor, capacitor, varistor, etc.

Prevents arcing during switching (accelerates degradation)

Must be nearby

Temperature rise

Wide range of contact resistance in specifications

Ensure margin between design life requirements and manufacturer’s specifications

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

60,000 70,000 80,000 90,000 100,000 110,000 120,000 130,000

Number of Cycles

Cu

mu

lati

ve F

ail

ure

s %

Characteristic

Life = 113,545

Catalog Life =

100,000 CyclesMean Time Between

Failures = 102,900

Wearout of Relays/Switches

Derating and Uprating

Component Ratings

Definition

A specification provided by component manufacturers that guides the user as to the appropriate range of stresses over which the component is guaranteed to function

Typical parameters

Voltage

Current

Power

Temperature

Derating Derating is the practice of limiting stress on electronic parts to levels

below the manufacturer’s specified ratings Guidelines can vary based upon environment

(“severe, protected, normal” or “space, aircraft, ground”)

One of the most common design for reliability (DfR) methods

Goals of derating Maintain critical parameters during operation (i.e., functionality)

Provide a margin of safety from deviant lots

Achieve desired operating life (i.e., reliability)

Sources of derating guidelines Governmental organizations and 3rd parties

OEM’s

Component manufacturers

Derating is assessed through component stress analysis

Derating Guidelines (Examples)

Derating Failures

Where are the derating mistakes?

Problem #1: Designers do not derate

Failure to perform component stress analysis

Problem #2: Derating does not have a

practical or scientific foundation

Extraordinary measures are taken when

inappropriate

Derating is excessive: ‘The more, the better’

rule

Failure to Derate

Analog / Power Designs

Derating is typically overlooked during

transient events

Especially turn-on, turn-off

Digital

Excessive number of components and

connections tends to limit attempts to perform

component stress analysis

The Foundation of Derating

To be effective, derating must have a practical and scientific foundation

Problem: Manufacturer’s ratings are not always based on a practical and

scientific foundation

Manufacturers’ viewpoint

Ratings are based on specific design rules based on materials, process,

and reliability testing

The reality

Ratings can be driven by tradition and market forces as much as science

Best practice

Based on data from field returns

Based on test to failure qualification (especially for new suppliers)

Scientific Approach to Derating (Ta Caps)

Self healing in Ta capacitors involves leakage paths in the MnO2 being healed by the transformation to the higher resistance compound Mn2O3

Process requires enough current to allow internal temperatures to reach 500°C

Small amounts of current (< 50 uA) will prevent self healing

Leads to degradation and potential component failure

Avoid use in circuits with impedances greater than 100 kΩ

High Impedance Circuits

Derating Decision Tree

Step 1: Derating guidelines should be

based on component performance, not

ratings

Test to failure approach (i.e., HALT of

components)

Quantifies life cycle cost tradeoffs

For smaller OEMs, limit this practice to

critical components

Derating based on Test to Failure

OEM was concerned with voltage rating of tantalum capacitors after 2 reflows and use on low resistance line

Performed step stress surge test (SSST)

Derived voltage derating based on a sub-ppm failure rate

Stress

Derived

Derating

Limit

Test

Results

Manuf.

Rating

Derating Decision Tree (continued)

Step 2: Derating guidelines should be based on

recommendations from the component manufacturer

They built it; they should know it

Don’t trust the manufacturer? Use someone else

Step 3: Derating guidelines should be based on

customer requirements

Step 4: Derating guidelines should be based

industry-accepted specification/standard

Be flexible, not absolute!

Robustness - Components

o Concerns

o Potential for latent defects after exposure to Pb-free reflow temperatures

o 215°C - 220°C peak → 240°C - 260°C peak

o Drivers

o Initial observations of deformed or damaged

components

o Failure of component manufacturers to update

specifications

o Components of particular interest

o Aluminum electrolytic capacitors

o Ceramic chip capacitors

o Surface mount connectors

o Specialty components (RF, optoelectronic, etc.)

Ceramic Capacitors (Thermal Shock Cracks)

• Due to excessive change in temperature

• Reflow, cleaning, wave solder, rework • Inability of capacitor to relieve

stresses during transient conditions.

• Maximum tensile stress occurs near end of termination

• Determined through transient thermal analyses

• Model results validated through sectioning of ceramic capacitors exposed to thermal shock conditions

• Three manifestations • Visually detectable (rare) • Electrically detectable • Microcrack (worst-case)

NAMICS

AVX

Thermal Shock Crack: Visually Detectable

AVX

Thermal Shock Crack: Micro Crack

• Variations in voltage or temperature will drive crack propagation

• Induces a different failure mode

• Increase in electrical resistance or decrease capacitance

DfR

Module 3: Mechanisms and

Physics of Failure (PoF)

Examples: Desired Lifetime Low-End Consumer Products (Toys, etc.)

Do they ever work?

Cell Phones: 18 to 36 months

Laptop Computers: 24 to 36 months

Desktop Computers: 24 to 60 months

Medical (External): 5 to 10 years

Medical (Internal): 7 years

High-End Servers: 7 to 10 years

Industrial Controls: 7 to 15 years

Appliances: 7 to 15 years

Automotive: 10 to 15 years (warranty)

Avionics (Civil): 10 to 20 years

Avionics (Military): 10 to 30 years

Telecommunications: 10 to 30 years

Identify Field

Environment Approach 1: Use of industry/military

specifications

MIL-STD-810,

MIL-HDBK-310,

SAE J1211,

IPC-SM-785,

Telcordia GR3108,

IEC 60721-3, etc.

Advantages

No additional cost!

Sometimes very comprehensive

Agreement throughout the industry

Missing information? Consider standards from other industries

Disadvantages

Most more than 20 years old

Always less or greater than actual (by how much, unknown) IPC SM785

MIL HDBK310

Field Environment (continued)

Approach 2: Based on actual measurements of similar products in similar environments

Determine average and realistic worst-case

Identify all failure-inducing loads

Include all environments Manufacturing

Transportation

Storage

Field

Failure Inducing Loads • Temperature Cycling

– Tmax, Tmin, dwell, ramp times • Sustained Temperature

– T and exposure time • Humidity

– Controlled, condensation • Corrosion

– Salt, corrosive gases (Cl2, etc.) • Power cycling

– Duty cycles, power dissipation • Electrical Loads

– Voltage, current, current density – Static and transient

• Electrical Noise • Mechanical Bending (Static and Cyclic)

– Board-level strain • Random Vibration

– PSD, exposure time, kurtosis • Harmonic Vibration

– G and frequency • Mechanical shock

– G, wave form, # of events

Field Environment (Best Practice)

Use standards when… Certain aspects of your environment are common

No access to use environment

Measure when… Certain aspects of your environment are unique

Strong relationship with customer

Do not mistake test specifications for the actual use environment Common mistake with vibration loads

PoF and Wearout What is susceptible to long-term degradation in electronic designs?

Ceramic Capacitors (dielectric breakdown)

Electrolytic Capacitors (electrolyte evaporation, dielectric dissolution)

Resistors (if improperly derated)

Silver-Based Platings (if exposed to corrosive environments)

Relays and other Electromechanical Components (wearout models

not well developed)

Connectors (if improperly specified and designed)

Tin Whiskers

Integrated Circuits (next generation feature size)

Interconnects (Creep, Fatigue)

Plated through holes

Solder joints

PoF Example: Silver and Sulfur Immersion silver (ImAg)

introduced in the 1990’s as the ‘universal finish’

Benefits Excellent flatness, low cost, long-

term storage

Problem Sulfur reacts with silver

Induces creeping corrosion

ImAg (Creeping Corrosion)

Failures observed within months

Sulfur-based gases attacked exposed immersion silver

Non-directional migration (creeping corrosion)

Occurred primarily in environments with high sulfur levels

Rubber manufacturing

Gasoline refineries

Waste treatment plants

Findings Analysis identified copper as

the creeping element (not silver)

Cross-sections identified corrosion sites near areas with no or minimal immersion silver

Galvanic reaction was initiating and accelerating corrosion behavior

What went wrong?

PoF and Testing Failure #1

Test coupons were not representative of actual product

No solder mask defined pads, no plated through holes

Failure #2

Industry test environments are limited to 70%RH (chamber

limitations)

Actual use environment can be more severe

Telcordia

PoF and Immersion Silver

The Final Failure?

Acknowledging the reactivity of silver with

sulfur and moving beyond ‘test to spec’ to

truly capture potential risks

The ‘physics’ was not well enough understood

before the new material was released

Alternatives to PoF

Step 1: Rules of Thumb

Step 2: Best Practice

Follow part selection guidelines

Step 3: Norris-Landzsberg

Rules of Thumb (Constant

Temperature)

Electrolytic Capacitor lifetime becomes an issue when ambient temperatures begin to exceed 40C on a constant basis

85C/2000 hour ratings tend to be insufficient for more than 5 year life

Many companies limit solder joint temperature to a maximum of 75ºC – 85ºC

Some limit IC junction temperature to a similar range

Rules of Thumb (Temperature Cycling)

In nominal environments, solder joint wearout is unlikely

Low power, diurnal cycling

∆25C, 1 cycle per day

Lifetime of less than 10 years

Greater concerns in more severe environments

Diurnal heat sources with sufficient fluctuation (∆40C)

Diurnal power dissipation of ∆40C and greater

Power cycling greater than 4 cycles/day (mini-cycling)

Rules of Thumb (Temp Cycling)(cont.)

If a solder joint fatigue is a concern, manage package styles MELF parts (SMA and SMB available)

Crystals on ceramic substrates (especially large ones)

Chip resistors greater than 1812 or capacitors greater than 2225

Large memory devices (44, 56, 66 I/O) with Alloy 42 leadframes

Large I/O (≥ 44) quad flat pack no-lead (QFN)

Rules of Thumb (Vibration)

Maintain high board natural frequency

Two to three times greater than low frequency peaks (>250-300 Hz)

Use of attachments, stiffer rail guides

When peaks in the power spectral density (PSD) curve exceeds 0.01 G2/Hz

Lower threshold for higher frequency peaks

Vibration (continued)

Failures primarily occur when peak loads occur at similar frequencies as the natural frequency of the product / design

Natural frequencies

Larger boards, simply supported: 60 – 150 Hz

Smaller boards, wedge locked: 200 – 500 Hz

Gold wire bonds: 2k – 4kHz

Aluminum wire bonds: >10kHz

Norris-Landzberg (SnPb)

f is cycling frequency, DT is change in temperature, and Tmax is the maximum temperature

“o” refers to operating environment and “t” refers to test environment

Provides comparison of test results to field reliability

Usable if the component manufacturer provides accelerated life testing (ALT) results for 2nd level interconnects

Warning: Component manufacturers can cheat (use very thin boards)

Can not provide an absolute prediction

too

t

t

o

t

o

TTT

T

f

f

N

NAF

max,max,

23/1

111414exp

Norris-Landzberg (SAC)

too

t

o

t

t

o

TTt

t

T

T

N

NAF

max,max,

136.065.2

112185exp

t is the hot-side dwell time, DT is change in temperature, and Tmax is the maximum temperature

“o” refers to operating environment and “t” refers to test environment

Not yet widely accepted Found to be inaccurate within some datasets

1 N. Pan et al, “An Acceleration Model For Sn-Ag-Cu Solder Joint Reliability Under Various Thermal Cycle Conditions”.

pp. 876-883, SMTAI, September 2005, Chicago, IL

Long-Term Reliability

Rules of Thumb, Best Practices, and

Norris-Landzberg are not always sufficient

Good first pass

When the risk is too high, physics of failure

(PoF) calculations are irreplaceable

PoF Example: SnAgCu Life Model

Modified Engelmaier Semi-empirical analytical approach

Energy based fatigue

Determine the strain range (Dg)

C is a correction factor that is a function of dwell time and temperature, LD is diagonal distance, a is CTE, DT is temperature cycle, h is solder joint height

Th

LC

s

D

PoF Example – SAC Model (cont.)

aGGA

h

GA

h

AE

L

AE

LFLT

bcc

c

ss

s

9

2

221112

Determine the shear force applied to the solder joint

F is shear force, L is length, E is elastic modulus, A is the

area, h is thickness, G is shear modulus, and a is edge

length of bond pad

Subscripts: 1 is component, 2 is board, s is solder joint, c

is bond pad, and b is board

Takes into consideration foundation stiffness and

both shear and axial loads

PoF Example – SAC Model (cont.)

Determine the strain energy dissipated by

the solder joint

Calculate cycles-to-failure (N50), using

energy based fatigue models for SAC

developed by Syed – Amkor

10019.0

WN f

sA

FW 5.0

Validation – Chip Resistors

100

1000

10000

100 1000 10000

Cycles to Failure (Experimental)

Cy

cle

s t

o F

ailu

re (

Pre

dic

ted

)

PoF Example – SAC Reliability

(cont.)

How to ensure 10 year life in a realistic

worst-case field environment

for industrial controls?

American Southwest (Phoenix)

Dominated by diurnal cycling

+10C at max temperature due to solar loading

PoF Example – SAC Reliability (cont.)

Total damage in desert environment over 10 years

Total damage in one cycle of -40C to 85C test environment

Total cycles at -40C to 85C to replicate 10 yrs in desert

0.02604

0.00012

222 cycles

At 1 cycle/hour, approximately 1 day of test equals 1 year in the field

Module 4: Printed Circuit Boards

Surface Finishes

113

Importance of Surface Finish

The selection of the surface finish to be used on your PCBs could be the most important material decision made for the electronic assembly.

The surface finish influences the process yield, the amount of rework necessary, field failure rate, the ability to test, the scrap rate, and of course the cost.

One can be lead astray by selecting the lowest cost surface finish only to find that the total cost is much higher.

The selection of a surface finish should be done with a holistic approach that considers all important aspects of the assembly.

Surface Finishes - Post Pb-Free Multiple Pb-Free Surface Finish Options Now Exists.

No clear winner, no ideal solution.

Each PCB surface has different advantages and disadvantages that affects fabrication, solderability, testability, reliability, or shelf life.

The 5 most popular Pb-Free Surface Finishes are:

Electroless nickel/immersion gold (ENIG) And ENEPIG (electroless Pd added)

Immersion silver (ImAg)

Immersion tin (ImSn)

Organic solderability preservative (OSP)

Pb-free HASL.

These finishes (except for Pb-free HASL) have been in use for several years.

Newer finishes are currently being developed (direct Pd, PTFE-like coatings, etc.

18%

Surface Finishes,

Worldwide

2003

2007

Ref: J. Beers

Gold Circuits

Surface Finish Selection Approach

Component Procurement: Select the cheapest one and let

the engineers figure out how to use it.

PCB Engineer: Select the finish that is easiest for the

suppliers to provide (their sweet spot); let the assembler

figure out how to use it.

Assembly Engineer: Select the finish that provides the

largest process window for assembly and test.

Sustaining Engineer: Select the finish that minimizes field

failures.

CEO: Select the finish that minimizes the overall cost

(including reliability risk).

Surface Finish Selection

Considerations

Cost sensitivity

Volume of product (finish availability)

SnPb or LF process

Shock/Drop a concern?

Cosmetics a concern?

User environment (corrosion a concern)?

Fine pitch assembly (<0.5 mm)

Wave solder required (PCB > 0.062”)

High yield ICT is important?

Surface Finish Selection Guideline

Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Is not required

for the Product

Attributes

Wire bonding to

Finish is Required

SF

Type

Surface Finish Selection Guideline Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Attributes

Wire bonding to

Finish is Required

OSP

Is not required

for the Product

OSP Issues: Plated Through-Hole

Fill • Solder fill is driven by capillary action

• Important parameters • Hole diameter, hole aspect ratio, wetting

force

• Solder will only fill as long as its molten (key point)

• OSP has lower wetting force • Risk of insufficient hole fill

• Can lead to single-sided architecture

• Solutions: • Changing board solderability plating

• Increasing top-side preheat

• Increasing solder pot temperature (some go as high as 280ºC)

• Not recommended!

• Changing your wave solder alloy

P. Biocca, Kester

In Circuit Test w/ OSP – test via challenges Probing through HT OSP is not recommended.

Solder paste is printed over OSP test pads/vias (leaving flux residue with no-

clean paste).

OSP Metallic Finishes

Test Pad

Test Via

Space constraints on PCB make it difficult to eliminate test vias.

Flux residue pools

in dimple and limits

probe contact.

Flux residue on

surface (small

issue)

Surface Finish Selection Guideline Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Product

Attributes

Wire bonding to

Finish is Required

ImAg

Is not required

for the Product

Immersion Silver Ag (ImAg)

• Single material system • Specified by IPC-4553

• Thickness is typically 6-20 u”

• Benefits • Good flatness & coplanarity

• Good shelf life if packaged properly.

• Good oxidation resistance & shelf life.

• Good wettability and reflow performance.

• Good testability

• Low cost

ImAg Trace Etching

Solder mask

Galvanic etching can occur SM edge if PCB

rinsing and drying not adequately performed.

ImAg - Microvoids Void under silver causes void at interface.

Ref: Mukadam, “Planar Microvoids in LF Solder Joints”, SMTA, 2006.

Microvoids survived shock

testing but cause early

failure in thermal cycling.

Typical Creep Corrosion

• Corrosion product is poorly conductive (resistance of about 1Mohm).

• Conductivity is higher when the humidity is high.

• Field returns often function fine – since corrosion product has dried out.

• Features most sensitive to leakage current will trigger the system failure (failing

symptoms can vary system-to-system).

• Visual inspection is often required to diagnose.

ImAg Creep Corrosion - Affected

Locations Paper mills

Rubber manufacturing (tires for example).

Fertilizer

Waste water treatment

Mining/smelting

Cement or asphalt production

Petrochemical

Clay modeling studios

Regions of the world with poor air quality

Etc. - includes companies nearby such industries

• Product is less impacted if airflow to PCBA is restricted.

Impact of Tarnish

Shelf life can be an issue

If not stored in protective bags

Significant degradation when

exposed to corrosive gases

Tarnish after assembly is mostly cosmetic – but will

impact perception of quality.

If PCBA is visible to user tarnish may be an issue.

Scrap costs may increase considerably if PCBAs are

repaired and sent back into service.

Boards that appear black but are still functional are often thrown

out.

-400

-300

-200

-100

0

100

200

300

400

0 2 4 6 8 10 12

Time (sec)

Wett

ing

Fo

rce (m

N/m

m)

0 Months Shelf HASL

6 months Shelf HASL

0 months Shelf ImmAg

0 months Field ImmAg

6 months Shelf ImmAg

Surface Finish Selection Guideline Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Product

Attributes

Wire bonding to

Finish is Required

Is not required

for the Product

ImSn

Immersion Sn (ImSn)

• A single material system • Specified by IPC-4554

• Standard thickness: 1 micron (40 microinches)

• Some companies spec up to 1.5 microns (65 microinches)

• Benefits • Excellent flatness, low cost

• Not as popular a choice with PCB fabricators. • Environmental and health concerns regarding thiourea

(a known carcinogen)

• Some concern regarding tin whiskering (minimal)

ImSn: Quality Issues & Failure

Mechanisms

0

10

20

30

40

50

60

70

80

90

100

0 20 40 60 80 100 120

Time (Days)

Ox

ide

Th

ickn

ess

(n

m)

30°C

65°C

85°C

65°C/85%RH

• Insufficient thickness.

• Decreases solderability during storage or after 2nd reflow – due to IMC growth through the thickness.

• Solderability problems with Oxide thickness greater than 5 nm.

• Excessive oxide thicknesses (50-100nm) periodically observed.

• Drivers of oxidation.

• Exposure to humid conditions (>75%RH)

• Greatly accelerates oxide growth through the creation of tin hydroxides.

• Use sealed moisture/air tight wrapping for shipping and cool, low humidity storage.

• Cleanliness of the raw board.

• Contaminates breaks down self-limiting nature of tin oxides.

• Accelerates oxide growth.

Surface Finish Selection Guideline Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Product

Attributes

Wire bonding to

Finish is Required

Is not required

for the Product

ENIG

ENEPIG

ENIG: Primary Reliability Risks

• Black pad drivers

• Phosphorus content

• High levels = weak, phosphorus-rich region after soldering

• Low levels = hyper-corrosion (black pad) Insufficient Phosphorous will not prevent corrosion during the highly acidic immersion gold (IG) process.

• Cleaning parameters

• Gold plating parameters

• Bond pad designs

• Causes a drop in mechanical strength

• Difficult to screen

• Can be random (e.g., 1 pad out of 300)

• Ni-Sn intermetallic produces a brittle interface when used with SAC solder.

Images of Black Pad

Phosphorus-Rich Dark Streak

ENIG - Ni Interface Issues w/ SAC

Brittle SnNi intermetallics fail more easily with a high modulus LF solder ball.

These cracks resulted from product handling.

Electroless Nickel/Immersion Gold (ENIG) • Two material system.

• Defined by IPC-4552 Specification for Electroless Nickel/Immersion Gold.

• Electroless nickel. • 3 – 6 microns

• Thin Immersion gold top coat • 0.08-0.23 microns

• Benefits • Excellent flatness and long-term storage (shelf life).

• Excellent oxidation resistance and wetting properties.

• Robust for multiple reflow cycles,

• Supports alternate connections (wirebond, separable connector) & electrical testability.

• Moderate costs.

• Gold readily dissolves into solder and does not tarnish or oxidize making it an excellent choice for a surface finish.

• But gold cannot be directly plated onto copper, since copper diffuses into gold, which allows the Cu to reach the surface and oxidize which reduces solderability.

• Nickel is serves as a barrier layer to copper, the thin gold coating protects the nickel from oxidizing.

ENIG: Mechanical Shock with SAC305 solder

• ENIG Less Robust than OSP.

• SAC less robust than SnPb

• Plating is an important driver

• SnNi vs. SnCu intermetallics

1.00 100.0010.00

1.00

5.00

10.00

50.00

90.00

99.00

R eliaSoft's W eibull++ 6.0 - w w w .W eibull.c om

Probability - Weibull

Number of Drops

Unre

liability

, F(t

)

7/29/2005 10:27DfR SolutionsCraig Hillman

WeibullPb-Free on ENIG

W3 RR3 - SRM MEDF=6 / S=0

Pb-Free on OSP

W3 RR3 - SRM MEDF=5 / S=1

SnPb on OSP

W3 RR3 - SRM MEDF=3 / S=3

35x35mm, 312 I/O BGA

SAC305 on ENIG

SAC305 on OSP

SnPb on OSP

ENEPIG

Electroless Ni – Electroless Pd – Immersion

Au

Addition of the electroless palladium layer

provides two primary advantages.

1. It prevents black pad (since gold bath doesn’t

come in contact with Ni).

2. It enhances the wire bondability of the finish.

Pd thickness is typically in the range 2-30

microinches.

Surface Finish Selection Guideline

Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Product

Attributes

Wire bonding to

Finish is Required

Is not required

for the Product

Pb-Free

HASL

Pb-Free HASL (Hot Air Solder

Leveling) • Good choice when excellent solderability is required

• Thick boards that require LF wave soldering.

• Robust in multiple reflow cycles.

• Long shelf life required

• Flatness not as good as other finishes (but an improvement

over SnPb HASL).

• Could potentially be a problem with very fine pitch components

• High volume equipment is not yet in production.

• Horizontal LF lines are available but few are in production since high

volume demand is needed to make them cost effective.

Pb-Free HASL: Ni-modified SnCu Alloy selection is critical.

Sn-Cu will result in high Cu dissolution and poor planarity.

SnCuNiGe provides high fluidity and reduced Cu dissolution.

Role of constituents

Cu creates a eutectic alloy with lower melt temp (227C vs. 232C),

forms intermetallics for strength, and reduces copper dissolution

Ni suppresses formation of -Sn dendrites, controls intermetallic

growth, grain refiner

Ge prevents oxide formation (dross inhibitor), grain refiner

SnCuNiGe Alloy SnCu Alloy

LF HASL – Critical

Parameters Pre-Clean: Micro-etching rate

Flux

HASL: LF Alloy

Pot temperature (~265C)

Front & Back air knife pressure

Front & Back air knife angle

Distance between air knife & PCB

Lifting speed

Dwell time (~ 2-4 sec)

Post-Clean:

Final flux clean and rinsing

Newer Finishes to the Market

Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Product

Attributes

Wire bonding to

Finish is Required

Is not required

for the Product

EPd

Needs verification

Lower cost than ENIG

Electroless Pd Process Sequence

Rin

se

Dry Micro

etch Activator E-Palladium

Rin

se

Rin

se

Rin

se

Rin

se

Acid

Cleaner

Pre

-Dip

Courtesy of OMGI

Newer Finishes to the Market

Cost Sensitive

Product

High Volume

Required

Pb-Free

Shock/Drop is a

Concern

Cosmetics of

Finish is

Important

Corrosion Failure

is Possible

Fine Pitch

Components

Used

Pb-Free Wave

Solder

(PCB > 62mil)

High Yield ICT

Required

Is Important

to Product

Product

Attributes

Wire bonding to

Finish is Required Is not required

for the Product

Plasma

Coating

These will become more

favorable with time.

Plasma Coated Finish Coated in plasma chamber.

Many panels coated simultaneously.

Film is 60 nm thick.

Flux breaks through film at elevated

temperature.

Hydrophobic and acid resistant

600nm

Wire Bond 25um Au Wire – Pull Test

Courtesy of Semblant

Examples of Best Application Fits

OSP (but must address ICT issues)

Hand held electronics

Notebook computers

Basic desktop computers

Basic consumer electronics & power supplies

Simple Pb-free Medical or aerospace (thin

PCBs)

ENIG or ENEPIG

SnPb medical and aerospace

Pb-free that is not susceptible to shock

Examples of Best Fits

ImAg Fully enclosed hand held electronics

Basic consumer electronics – low power and airflow

ImSn Simple consumer electronics (not fully enclosed)

Simple medical or aerospace applications (1 side)

Low to moderate volume peripheral components

LF HASL Thick LF PCBs going into business environments

(servers, telecom equipment)

Complex Pb-Free medical or aerospace?

What to do if there is no SF fit?

If no SF fits your specific requirements, design modifications may be required and tradeoffs made.

For example, I need low cost, high volume, corrosion resistant, with good ICT capability.

One solution might be to use ImAg but plug the vias with soldermask to protect from corrosion (but some cost is sacrificed).

Another is to use OSP but implement cleaning to remove flux residue for probing (cost is again sacrificed).

Example

Another example might be the desire to

use ENIG for a Pb-free product where

shock is a concern.

One solution might be to underfill critical

components sensitive to shock (cost adder).

Another might be to dampen the shock by

better design of the enclosure (possible cost

adder).

Summary

The surface finish you select will have a large

influence on quality, reliability and cost.

It is a complex decision that impacts many areas

of the business.

Select a finish that optimal for the business (and

not just one function).

Know that there are engineering tricks to

improve on weak areas of each finish.

Stay current in this field because new

developments continue to be made.

Module 4: Printed Circuit Boards

Robustness Concerns

Cracking and Delamination

151

Printed Board Robustness Concerns

Increased Warpage

PTH Cracks

Land

Separation

Solder Mask Discoloration Blistering

Delamination Pad Cratering

Printed Board Damage

• Predicting printed board damage can be difficult • Driven by size (larger boards tend to experience higher

temperatures)

• Driven by thickness (thicker boards experience more thermal stress)

• Driven by material (lower Tg tends to be more susceptible)

• Driven by design (higher density, higher aspect ratios)

• Driven by number of reflows

• No universally accepted industry model

Printed Board Damage: Industry

Response

Concerns with printed board damage

have almost entirely been addressed

through material changes or process

modifications

Not aware of any OEMs initiating design

rules or restrictions

Specific actions driven by board size

and peak temperature requirements

PCB Robustness: Material Selection

The appropriate material selection is

driven by the failure mechanism one is

trying to prevent

Cracking and delamination

Plated through via fatigue

Conductive anodic filament formation

PCB Delamination

Fiber/resin interface delamination

occurs as a result of stresses

generated under thermal cycling

due to a large CTE mismatch

between the glass fiber and the

epoxy resin (1 vs. 12 ppm/ºC)

Delamination can be

prevented/resisted by selecting

resin with lower CTE’s and

optimizing the glass surface finish.

Studies have shown that the bond

between fiber and resin is strongly

dependent upon the fiber finish

Delamination / Cracking: Observations

Morphology and location of the cracking and delamination can vary Even within the same

board

Failure morphology and locations Within the middle and edge of the PCB

Within prepregs and/or laminate

Within the weave, along the weave, or at the copper/epoxy interface (adhesive and cohesive)

Delamination / Cracking: Root-Cause

Non-Optimized Process Some PCB suppliers have demonstrated improvement

through modifications to lamination process or oxide chemistry

Some observations of lot-to-lot variability

Limit to PCB Capability Difficult to overcome adhesion vs. thermal performance

tradeoff (dicy vs. phenolic)

High stresses developed during Pb-free exceed material strength of standard board material

Moisture Absorption

Cracking and Moisture Absorption

Does moisture play a role?

No DfR found delamination primarily around the

edge and away from PTH sites after MSL testing

IBM found minimal differences after a 24 hr bake

of coupons with heavy copper (>2 oz)

Delamination / cracking observed in board stored

for short (<2 weeks) periods of time

Yes DfR customer found improvement after 48 hrs at 125C

A number of companies now require 5 – 24 hour bake before reflow

IBM found improvement with coupons with nominal copper

DfR observed more rapid degradation of boards exposed to moisture, even after

multiple reflows

Some customers specifying maximum moisture absorption

Where does the moisture come from?

Cracking and Moisture (cont.)

Storage of prepregs and laminates

Drilling process

Moisture is absorbed by the side walls

(microcracks?)

Trapped after plating

Storage of PCBs at PCB manufacturer

Storage of PCBs at CCA manufacturer

PCB Trace Peeling

Delamination of trace from surface of the board

Sources of increased stress

Excessive temperatures during high temperature processes

Insufficient curing of resin

Insufficient curing of solder mask

Sources of decreased strength

Improper preparation of copper foil

Excessive undercut

Module 4: Printed Circuit Boards

Plated Through Vias (PTV)

PTH Barrel Cracking

Conductive Anodic Filament (CAF)

162

A plated through via (PTV) is an interconnect within a printed circuit board (PCB) that electrically and/or thermally connects two or more layers

PTV is part of a larger family of interconnects within PCBs

What is a Plated Through Via?

PCB Vias

Blind Microvias

(Filled or Unfilled)

Buried Microvias

(Filled or Unfilled)

PCB Vias

Plated Through Holes

The dominant failure mode in PTV tends to be barrel fatigue

Barrel fatigue is the circumferential cracking of the copper plating that forms the PTV wall

Driven by differential expansion between the copper plating (~17 ppm) and the out-of-plane CTE of the printed board (~70 ppm)

How do PTV’s Fail?

How to Design a Reliable PTV?

PTH Architecture

(height / diameter)

Plating

(thickness / material)

PCB Material

(modulus / CTE)

+

+

PTV Height Driven by the PCB thickness

30 mil (0.75 mm) to 250 mil (6.25 mm)

PTV Diameter Driven by component pitch/spacing

6 mil (150 micron) to 20 mil (500 micron)

Key Issues Be aware that PCB manufacturing has cliffs

Quantify effect of design parameters using IPC TR-579

PTV Architecture

Minimal technological progress over past 10 years

PCB Industry PTV Capability

2.3 – 3.2mm PCB Thickness

95% of Industry

5% of Industry

1.2 – 1.6mm PCB Thickness

95% of Industry

5% of Industry

DDI Tech

Roadmap 2011 PCB Thickness (mil / mm)

Via Diameter (mil / um) Standard Advanced Engineering

6 / 150 N/A 39 / 1.0 60 / 1.5

8 / 200 64 / 1.6 80 / 2 96 / 2.4

10 / 250 100 / 2.5 120 / 3 160 / 4

IBM PCB-OS Symposium 2007, Roadmap Technology Verification,

Conductor Analysis Technologies (CAT)

Data from 26 PCB manufacturers

Wide range of PCB designs 6 to 24 layer

62 to 125 mil thickness

Results after six lead-free reflows Initial defects segregated

The PTV Cliff

Courtesy of CAT

Round Robin Reliability Evaluation of Small Diameter (<20 mil) Plated Through Holes in PWBs

Activity initiated by IPC and published in 1988

Objectives Confirm sufficient reliability

Benchmark different test procedures

Evaluate influence of PTH design and plating (develop a model)

IPC TR-579

IPC TR-579 (cont.) Determine stress applied (σ)

Assumes perfectly elastic deformation when below yield strength (Sy)

Linear stress-strain relationship above Sy

h PTV Height

d PTV Diameter

t Plating Thickness

E Elastic Modululs

Coefficient of Thermal Expansion

T Temperature (oC)

IPC TR-579 (cont.)

Determine strain range (∆ε)

IPC-TR-579 (Calibration Constants)

Strain distribution factor, Kd (2.5 –5.0) 2.5 recommended

Quality index, KQ (0 –10) Extraordinary (KQ = 10)

Superior (KQ = 8.7)

Good (KQ = 6.7)

Marginal (KQ = 4.8)

Poor (KQ = 3.5)

Some companies assume KQ = 5

IPC TR-579 (cont.)

Iteratively calculate cycles-to-failure (Nf)

Df Elongation (assumed ~30%)

Su Tensile Strength (assumed ~40,000

psi)

Two key plating properties

Advantages Analytical (calculation straightforward)

Validated through testing

Provides guidance on relative influence of design/material parameters

Disadvantages No ownership

Validation data is ~18 years old

Unable to assess complex geometries (PTH spacing, PTH pads) Complex geometries tend to extend lifetime

Difficult to assess effect of multiple temperature cycles Can be performed using Miner’s Rule

Simplified assumptions (linear stress-strain above yield point)

How does one determine the quality index in the design phase?

Does not account for the effect of fill

Does not consider other failure modes (knee cracking, wall-pad separation, etc.)

Assessment of IPC-TR-579

Reduce the PTV Height (PCB Thickness) Reduce laminate/prepreg thickness (2.7 to 4 mil is current

limitation)

Results in minimal cost changes and minimal effect on design

Has the least effect on PTH reliability

Increase PTV Diameter Typically not an option due to spacing issues

An important, but significant effect (dependent on a number of other variables)

Example: Moving from 10 mil to 12 mil diameter on a 120 mil board, 50C temp cycle, will result in approximately 20% improvement

The Effect of Design

Parameters (Height / Diameter)

Effect of Design Parameters (cont.)

W. Engelmaier, Reliability Issues for Printed Circuit Boards in Lead-Free

Soldering

S. Neumann, Theoretical and Practical Aspects of Thermo Mechanical Reliability in Printed Circuit Boards

with Copper Plated Through Holes

Effect of Design Parameters (cont.) Simulation

(PTV Height = 1.6mm)

Testing

(PTV Height = 1.6mm?)

F. Su, et. al., Microelectronics Reliability, June 2012

Effect of Design Parameters (cont.)

Historically, two material properties of concern Out-of-plane coefficient of thermal expansion (CTEz)

Out-of-plane elastic modulus (‘stiffness’)(Ez)

Key Assumption: No exposure to temperatures above the glass transition temperature (Tg)

The two material properties (CTE and E) are driven by choices in resin, glass style, and filler

PCB Materials and PTV

Reliability

Out-of-plane CTE (CTEz) is almost always provided on the laminate datasheet Sometimes in ppm/C above and below the Tg

Sometimes in % between 50-260C

Out-of-plane modulus (Ez) is almost never provided on the laminate datasheet Requires calculation based on in-plane

laminate properties, glass fiber properties, glass fiber volume fraction, and Rule-of-Mixtures / Halpin-Tsai models

Laminate Datasheets

1/Elaminate = Vepoxy/Eepoxy + Vfiber/Efiber

Survey of 300 Different FR-4

Datasheets

Out-of-plane

expansion

ranged from

1.4% to 4.8%

PCB laminates (and prepregs) are fabricated with a variety of glass styles

Problem: All datasheet properties are for laminate with 7628 glass style

Most laminate (and all prepreg) in complex PCBs have a low volume fraction of glass (i.e., 1080 or 106)

Glass Style Glass

Style

Resin

Volume

Content

Fiber

Volume

Content

1027 0.86 0.14

1037 0.86 0.14

106 0.84 0.16

1067 0.84 0.16

1035 0.83 0.17

1078 0.82 0.18

1080 0.79 0.21

1086 0.78 0.22

2313 0.74 0.26

2113 0.72 0.28

2116 0.71 0.29

3313 0.71 0.29

3070 0.68 0.32

1647 0.66 0.34

1651 0.66 0.34

2165 0.66 0.34

2157 0.66 0.34

7628 0.64 0.36

Glass Style and CTE Glass Style Modulus of Elasticity Ez (MPa) CTEz (ppm)

1027 4380.4 73.9

1037 4380.4 73.9

106 4478.2 72.3

1067 4478.2 72.3

1035 4528.7 71.5

1078 4580.3 70.7

1080 4742.7 68.4

1086 4799.3 67.6

2313 5040.4 64.4

2113 5170.2 62.8

2116 5237.6 62.0

3313 5237.6 62.0

3070 5450.9 59.7

1647 5603.1 58.1

1651 5603.1 58.1

2165 5603.1 58.1

2157 5603.1 58.1

7628 5764.0 56.5

More recently, additional laminate properties of concern due to Pb-free assembly Glass transition temperature (Tg)

Time to delamination (T260, T280, T288, T300)

Temperature of decomposition (Td)

Each parameter ‘supposedly’ captures a different material behavior Higher number slash sheets (> 100) within IPC-4101

define these parameters to specific material categories

Laminate Properties (cont.)

Glass transition temperature (Tg) (IPC-TM-650, 2.4.24/2.4.25c) Characterizes complex material transformation

(increase in CTE, decrease in modulus)

Time to delamination (T-260/280/288/300) (IPC-TM-650, 2.4.24.1) Characterizes interfacial adhesion

Temperature of decomposition (Td) (IPC-TM-650, 2.3.40) Characterizes breakdown of epoxy material

Thermal Parameters of

Laminate

HDI Printed Circuit Boards, NCAB Group

Thermal Parameters and IPC Slash

Sheets

189

PCB Material Selection Board thickness IR-240~250 Board thickness IR-260

≤60mil

Tg140 Dicy

All HF materials OK ≤ 60mil

Tg150 Dicy

HF- middle and high Tg materials OK

60~73mil

Tg150 Dicy

NP150, TU622-5

All HF materials OK 60~73mil

Tg170 Dicy

HF –middle and high Tg materials OK

73~93mil

Tg170 Dicy, NP150G-HF

HF –middle and high Tg materials OK 73~93mil

Tg150 Phenolic + Filler

IS400, IT150M, TU722-5, GA150

HF –middle and high Tg materials OK

93~120mil

Tg150 Phenolic + Filler

IS400, IT150M, TU722-5

Tg 150

HF –middle and high Tg materials OK 93~130mil

Phenolic Tg170

IS410, IT180, PLC-FR-370 Turbo, TU722-

7

HF –middle and high Tg materials OK

121~160mil

Phenolic Tg170

IS410, IT180, PLC-FR-370 Turbo

TU722-7

HF –high Tg materials OK ≧131mil

Phenolic Tg170 + Filler

IS415, 370 HR, 370 MOD, N4000-11

HF –high Tg materials OK

≧161mil

PhenolicTg170 + Filler

IS415, 370 HR, 370 MOD, N4000-11

HF material - TBD ≧161mil

TBD – Consult Engineering for specific

design review

1.Copper thickness = 2OZ use material listed on column 260

2.Copper thickness >= 3OZ use Phenolic base material or High Tg Halogen free materials only

3.Twice lamination product use Phenolic material or High Tg Halogen free materials only (includes HDI)

4.Follow customer requirement if customer has his own material requirement

5.DE people have to confirm the IR reflow Temperature profile

J. Beers, Gold Circuits

PTV Degradation due to Assembly

190

Maximum stress in the PTV during thermal cycling tends to be in the middle of the barrel

There is some concern that areas of high resin content in the middle of the barrel can be detrimental

Non-functional pads (NFP) Some debate as to their

influence on barrel fatigue on higher aspect ratio PTV

PCB Materials: Stackup

F. Su, et. al., Microelectronics Reliability, June 2012

Considered to be the number one driver for PTV barrel fatigue

Classic engineering conflict Better properties (greater thickness, higher plating strength,

greater elongation) typically require longer time in the plating bath

Longer time in the plating bath reduces throughput, makes PCBs more expensive to fabricate

PCB fabricators, low margin business, try to balance these conflicting requirements Key parameters are thickness, strength, and elongation

(ductility)

Plating (Thickness and Material

Properties)

Specifications tend to range from 0.8 mil (20 microns) to 1.0 mil (25 microns) to 1.2 mil (30 microns)

Plating thickness can be less of an issue than previously

New formulations to fill microvias can drive an accelerated plating process Some PCB manufacturers, depending on the design and

production volume, will plate the PTV almost closed

Plating Thickness

OEM moved to microvias for first time PCB manufacturer

recommended via fill

High plating rate process was not optimized, resulting in porous final plating layer Once a crack is initiated, rapid

failure

Case Study: Microvia Fill and PTV

Reliability

Case Study (cont.)

200x

500x 500x Crack propagating across

the entire PTH barrel

Industry Requirements (IPC-6012C) Ultimate Tensile Strength 36,000 psi (250 MPa)

Elongation 12%

Plating Mechanical Properties

Controlled measurements

from 26 different plating baths

(Top 25 PCB manufacturer)

PCB Manufacturers tend to be very

aware of test requirements specified by

larger/higher rel customers

Plating conditions are adjusted to meet the

test requirements of those industries /

customers

The Reality of PTV

Performance (cont.)

The Reality of PTV Performance

0

500

1000

1500

2000

2500

3000

5 6 7 8 9 10 11 12 13

Cy

cle

s t

o F

ail

ure

Aspect Ratio

None NoneNone NoneNone None230C*6cyc 230C*6cyc230C*6cyc 230C*6cyc230C*6cyc 230C*6cyc245C*6cyc 245C*6cyc245C*6cyc 245C*6cyc

786 Test Coupons

PTV Height: 62 – 275 mil

PTV Diameter: 12 mil

IS-410 & IT-180

Mean Hardness = 96 Knoop

One of the challenges of root-cause analysis of PTV cracking is the inability to directly measure strength/ductility of the plating

Hardness and grain size measurements are potential substitutes

Post-Plating Measurements of Plating Properties

Mean Hardness = 262 Knoop

Post-Plating Measurements Hardness data indicated good separation between two

populations

100% correlation with cross section results

Boards with cracks had high hardness

Boards without cracks had low hardness

0

1

2

3

4

5

6

7

8

9

10

60 70 80 90 100 110 120 130 140 150 160 170 180 220 260 300 340 380

Hardness (Knoop)Visual Good

Visual Bad

Mean “good” Mean “bad”

Thick nickel plating down the barrel can also extend lifetime Caveat: Poor nickel plating can result in much

shorter times to failure

Other Platings

Proof is in the PTH -- Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards, K. Knadle

S. Neumann, Theoretical and Practical Aspects of Thermo Mechanical Reliability in Printed Circuit Boards with

Copper Plated Through Holes

Other Platings (cont.)

There are currently six procedures for testing/qualifying a PTV Modeling and simulation

Cross-sectioning + solder float/shock

Thermal shock testing (also thermal cycling)

Interconnect stress testing (IST)

Printed Board Process Capability, Quality, and Relative Reliability (PCQR2)

Highly Accelerated Thermal Shock (HATS)

What does DfR recommend?

How to Test/Qualify a Reliable

PTV?

Qualifying PTV is a two-step process

The first step is to qualify the design and the PCB manufacturer Initial qualification

The second step is to initiate ongoing testing to monitor outgoing quality Lot qualification

Test / Qualify PTV

Qualify the design through simulation / modeling

DfR has implemented IPC TR-579 into our Automated Design Analysis software, Sherlock, to allow for rapid assessment of PTV robustness

First step: Define the environment (test or field or both)

Initial Qualification

Second step: Upload design information Include thermal

maps, if appropriate

Third step: Select the laminate and prepreg material Stackup and copper

percentage automatically identified

Simulation and Modeling

Results: Five Different Outputs

Qualify the design and manufacturer through PCQR2 Consists of a coupon design, a test standard, and a

database

18″ x 24″ layout with 1″ x 1″ test modules (352)

2 – 24 layers (rigid, rigid-flex)

Three panels / three non-consecutive lots

Simulated assembly (6X) and thermal cycling (HATS)

Initial Qualification (PCQR2)

Advantages Industry standard (IPC-9151)

Plug and play

Provides real data for understanding of PCB supplier capabilities and comparison to the rest of the industry through the use of an anonymous database

Disadvantages Industry-certified monopoly

$2K - $5K, not including panel costs

PCQR2 (cont.)

Interconnect stress testing (IST) is the overwhelming favorite of high reliability organizations Small (1 x 4) coupon can fit along the edge of the panel

Testing is automated

Widely used

Ability to drive barrel fatigue and post separation

Large number of holes (up to 300) and continuous resistance monitoring makes it far superior to cross-sectioning And it should be cheaper!

Lot Qualification

Coupon design is critical (IST can be prone to problems)

Need to specify preconditioning (IST or real reflow oven?)

Need to specify frequency (every lot, every month, every quarter)

Need to specify maximum temperature (some debate on the validity of results when above the Tg) 130, 150, and 175C are the most common

Need to specify requirements Different markets/organizations specify different times to

failure (300, 500, and 1000 cycles are most common)

IST – Issues / Awareness

The base knowledge and understanding of PTV Fatigue is robust Decades of testing and simulation

Use of reliability physics is best practice

Detailed understanding is still missing Key expertise (process parameters, material properties, simulation,

testing) is rarely in the same organization

Not a pure science activity (significant amount of human influence)

Improvements in out-of-plane CTE and plating properties have greatly improved PTV performance Avoiding defects continues to be the biggest risk

Conclusion

PCB Conductive Anodic Filaments (CAF)

CAF also referred to as metallic electro-migration

Electro-chemical process which involves the transport (usually ionic) of a

metal across a nonmetallic medium under the influence of an applied

electric field

CAF can cause current leakage, intermittent electrical shorts, and dielectric

breakdown between conductors in printed wiring boards

214

CAF: Examples A

A A:A Cross-Section

CAF: Examples

Module 4: Printed Circuit Boards Strain Flexure Issues & Pad Cratering Cleanliness

Electro-Chemical Migration (ECM)

216

SAC Solder is More Vulnerable to Strain

PCB deflection

Ten

sile

fo

rce o

n

pad

an

d L

am

inate

PbSn

LF

PbSn limit LF limit

Laminate Load

Bearing

Capability

Loa

d (kN

)

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

SAC Sn-Pb

Solder Alloy

Each Pair

Student's t

0.05

SAC

Sn-Pb

Level

18

18

Number

0.230859

0.416101

Mean

0.056591

0.040408

Std Dev

0.01334

0.00952

Std Err Mean

0.20272

0.39601

Lower 95%

0.25900

0.43620

Upper 95%

Means and Std Dev iations

Onew ay Analysis of Load (kN) By Solder Alloy

NEMI study showed SAC is more

Sensitive to bend stress. Sources of strain can be ICT, stuffing

through-hole components,

shipping/handling, mounting to a chassis,

or shock events.

Strain & Flexure: Pad Cratering

o Cracking initiating within the laminate during a

dynamic mechanical event

o In circuit testing (ICT), board depanelization, connector

insertion, shock and vibration, etc.

G. Shade, Intel (2006)

Pad Cratering

Drivers

Finer pitch components

More brittle laminates

Stiffer solders (SAC vs.

SnPb)

Presence of a large heat sink

Difficult to detect using

standard procedures

X-ray, dye-n-pry, ball shear,

and ball pull

Intel (2006)

220

Potential Mitigations to Pad Cratering

• Design

• Non-critical pads

• Solder mask defined vs. non-solder mask defined

• Pad Geometry

• Layout & PCB thickness

• Limitations on board flexure

• 750 to 500 microstrain, component and layout dependent

• Process Control & Validation

• Corner Glue

• More compliant solder

• SAC305 is relatively rigid, SAC105 and SNC are possible

alternatives

• New laminate acceptance criteria and materials

Component Supplier Practices

Intel Example

• Pad design influences failure

• Smaller pads result in higher stress under

a given load

• Solder mask defined pads can provide

additional strength

• Increases tolerable strain

• But, moves failure location from pad crater

to intermetallic fracture

Pad Geometry

Review/perform ICT strain evaluation at fixture mfg and in process: 500 us, IPC 9701 and 9704 specs, critical for QFN, CSP, and BGA

http://www.rematek.com/download_center/board_stress_analysis.pdf

To reduce the pressures exerted on a PCB, the first and simplest solution is to reduce the probes forces, when this is possible.

Secondly, the positioning of the fingers/stoppers must be optimized to control the probe forces. But this is often very difficult to achieve. Mechanically, the stoppers must be located exactly under the pressure fingers to avoid the creation of shear points

ICT Strain: Fixture & Process Analysis

Why Contamination and

Cleanliness? Believed to be one of the

primary drivers of field issues in electronics today Induces corrosion and metal migration

(electrochemical migration – ECM)

Intermittent behavior lends itself to no-fault-found (NFF) returns Driven by self-healing behavior

Difficult to diagnosis

Pervasive Failure modes observed on batteries, LCDs, PCBAs, wiring,

switches, etc.

Will continue to get worse

Future of Contamination / Cleanliness

Continued reductions in pitch between conductors will make future packaging more susceptible

Increased use of leadless packages (QFN, land grid array, etc.) results in reduction in standoff

Will reduce efficiency of cleaning, which may lead to increased concentration of contaminants

Increased product sales into countries with polluted and tropical environments (East Asia, South Asia, etc.)

ECM occurrence very sensitive to ambient humidity conditions

Pb-Free and smaller bond pads

Require more aggressive flux formulations

The Future: Reduced Spacings Critical distance effect?

Two studies by DfR staff NaCl seeding

Conformal coating over no-clean flux residues

Over 300 coupons tested (IPC-B-25) 6.25, 12.5, and 25 mil spacings; 40C/93%RH, 65C/88%RH,

85C/85%RH

No ECM at 25 mil spacings

Experience based on older designs may not be valid

Test coupons must have the same spacing and same electric field as actual product

Parameter Spacing

Peripheral Flip Chip Solder

Bumps 5 mil (120 mm)

Thin Shrink Small Outline

Package (TSSOP) Leads 7 mil (170 mm)

PCB External Traces (low

voltage line) 4 mil (100 mm)

BGA Substrate Traces 2 mil (48 mm)

Failure Mode

Why do you care about excessive

contamination or insufficient cleanliness?

Electrochemical Migration (note: not Electromigration; completely different mechanism)

Understanding the mechanism provides

insight into the drivers and appropriate

mitigations

Electrochemical Migration

(ECM)

Defined, per IPC-TR-476A,

Electrochemical Migration: Electrically

Induced Failures in Printed Wiring

Assemblies (1997), as

“The growth of conductive metal filaments

or dendrites on or through a printed board

under the influence of a DC voltage bias”

Too narrow

What is ECM?

Alternative definition

Movement of metal through an electrolytic solution under

an applied electric field between insulated conductors

Electrochemical migration can occur on or in almost

all electronic packaging

Die surface

Epoxy encapsulant

Printed board

Passive components

Etc.

ECM Mechanisms

Some ECM Mechanisms have more definitive descriptions

Dendritic growth Descriptor for ECM along a

surface that produces a dendrite morphology

“Tree-like”, “Feather-like”

Conductive anodic filaments (CAF) Descriptor for migration within

a printed circuit board (PCB)

PCB Cleanliness: Moving Forward

Extensive effort to update PCB Cleanliness Standards

IPC-5701: Users Guide for Cleanliness of Unpopulated

Printed Boards (2003)

IPC-5702: Guidelines for OEMs in Determining

Acceptable Levels of Cleanliness of Unpopulated Printed

Boards (2007)

IPC-5703: Guidelines for Printed Board Fabricators in

Determining Acceptable Levels of Cleanliness of

Unpopulated Printed Boards (Draft)

IPC-5704: Cleanliness Requirements for Unpopulated

Printed Boards (2010)

Nominal Ionic Levels Bare printed circuit boards (PCBs)

Chloride: 0.2 to 1 µg/inch2 (average of 0.5 to 1)

Bromide: 1.0 to 5 µg/inch2 (average of 3 to 4)

Assembled board (PCBA)

Chloride: 0.2 to 1 µg/inch2 (average of 0.5 to 1)

Bromide: 2.5 to 7 µg/inch2 (average of 5 to 7)

Weak organic acids: 50 to 150 µg/inch2 (average of 120)

Higher levels

Corrosion/ECM issues at levels above 2 (typically 5 to 10)

Corrosion/ECM issues at levels above 10 (typically 15 to 25)

Corrosion/ECM issues at levels above 200 (typically 400)

General rule

Dependent upon board materials and complexity

Cleanliness Control

Incoming PCB Cleanliness Cleanliness testing performed using ROSE (resistivity of solvent

extracted) or Omega-Meter method (ionic cleanliness, NaCl

equivalent)

Consider cleanliness requirements in terms of IC

(ion chromatography) test for PCBs using WS flux Don’t use ROSE or Omegameter test as single option (at all? Risk

from dirty IPA)

Inspection method with accept/reject limit

Sampling criteria

Control cleanliness throughout the process from

start to finish.

BTC, CSP & Low Profile Cleanliness Issues

(Bottom Termination Components, Chip Scale

Components)

Low or no standoff parts are particularly

vulnerable to cleanliness / residual flux

problems

Difficult to clean under

Short paths from lead to lead or lead to via

Can result in leakage resistance, shorts,

corrosion, electrochemical migration, dendritic

growth

Recommendations – Process

Qualification

Validate compatibility of all new process

materials using SIR testing. Under revisions now: IPC-B-52 SIR TEST VEHICLE

Continue spot check testing of cleanliness using

ion chromatography under low profile SMT parts

Summary

To avoid design mistakes, be aware that

functionality is just the beginning. Design

reliability in!

Be aware of industry best practices

Maximize knowledge of your design as early in

the product development process as possible

Practice design for excellence (DfX)

Design for manufacturability

Design for sourcing

Design for reliability

Design for environment

Conclusions

Design for Reliability is a valuable process for

lowering cost, reducing time-to-market, and

improving customer satisfaction

PoF is a powerful tool that can leverage the

value of DfR activities

Successful DfR / PoF implementation requires

the right combination of personnel and tools and

time limitations

Contact Information

• Questions?

• Contact Greg Caswell,

gcaswell@dfrsolutions.com,

301-640-5825

• 443-834-9284 (cell)

• www.dfrsolutions.com

• Connect with me on LinkedIn as well!

Presenter Biography

Greg has over 40 years of experience in electronics manufacturing focusing on failure analysis and reliability. He is passionate about applying his unique background to enable his clients to maximize and accelerate product design and development while saving time, managing resources, and improving customer satisfaction.

Greg, a Senior Member of the Technical Staff for DfR Solutions, is an industry recognized expert in the fields of SMT, advanced packaging, printed board fabrication, circuit card assembly, and bonding solutions using nanotechnology. He has been well-regarded as a leader in the electronics contract manufacturing and component packaging industries for the past 40 years. Prior to joining DfR Greg was the Vice President of Engineering at Reactive Nanotechnology (RNT), where he led application development for the RNT Nanofoil® and ensured a successful transition of product technology to Indium Corporation. His previous appointments include Vice President of Business Development for Newport Enterprises, Director of Engineering for VirTex Assembly Services, and Technical Director at Silicon Hills Design. He has presented over 250 papers at conferences all over the world and has taught courses at IMAPS, SMTA and IPC events. He helped design the 1st pick and place system used exclusively for SMT in 1978, edited and co-authored the 1st book on SMT in 1984 for ISHM and built the 1st SMT electronics launched into space.

B.A., Management (St. Edwards University)

B.S., Electrical Engineering (Rutgers University)

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