design guidelines ceramic component design

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EGIDE SA EGIDE USASite Industriel Sactar - CS20205 4 Washington Street84505 Bollène - France 21613 Cambridge, MD - USAPhone +33 4 90 30 97 11 Phone +1 410 901 6100

W.Muffato F.Disperati F.Benkoussa

DESIGN GUIDE LINE FOR CERAMIC PACKAGE

Title : CERAMIC COMPONENT DESIGN

Production15/11/2016

QualityApprovalApproval

Last Issue Date :

By : M.WILL

Established By :Previous Issue Date : 26/06/2016

Creation : 18/03/2003JF LECOEUCHE

TechnicalApproval

[email protected]

Ce document est la propriété d’Egide. Toute reproduction interdite sans autorisation écrite préalable.

This document is the property of Egide. Any reproduction prohibited without preliminary written authorization

DESIGN GUIDELINES

CERAMIC COMPONENT DESIGN

[email protected]

EGIDE CONFIDENTIAL


Package Drawing on a file format describe on the table belowTechnical Specification (PDF or Word format)

Routing Data should be at least compose by this following documents :- Routing on Gerber format 274X w/embedded apertures - Routing on DXF (1 file per layer)

Required Data for Each Layer :- Design of the Ceramic Cavity (Design of the Tape)- Design of the Conductors- Vias coming from the underneath layer

Data required for verification :- Net List on Excel Spreadsheet- Net Key on PDF- Net Key on DXF

We could read the following format:

Hardcopy

GERBER 274D w/aperture list

EGIDE CONFIDENTIALCe document est la propriété d’Egide. Toute reproduction interdite sans autorisation écrite préalable.


Solidworks format

IGES


DRAWING FILE 3D FILE

AutoCad DWG formatAutoCad DXF format (preferred)

This section can be use as a guide during the design phase of the ceramic component. Weindicate the standard data we generally apply, we also indicate our process limit. As eachproduct has his own characteristics, we encourage you to contact your Sales Representative todiscuss about your project and help you on the design phase.

Solidworks format

AutoCad DXF formatSTEP

INTRODUCTION

REQUIRED DATA

ARTWORK FILEGERBER 274X w/embedded apertures

COMPUTER FILES FORMATS

AutoCad DWG format AutoCad DWG format

PDF (preferred) SATBMP


Solidworks format


44444444

6

7777

88888

99999

10101010

1111111111

1212

Surface Distance External Edge to Conductors T

DD

CD

H

J

E

EGIDE CONFIDENTIAL

A



X


INDEX

SheetParameterDesignation

Y

Internal Via Cover Pad U

LVia Centerline to External Edge M

Via Centerline to Cavity Edge (Upper Layer)

BLength of the Package

f

Via Centerline to Cavity Edge (Same Layer) K

Surface Line Space RSurface Distance Cavity to Conductor S

Internal Line Space W

Distance Internal Conductor to Cavity Upper LayerDistance Surface Conductor to Cavity Upper Layer

Internal Distance External Edge to Conductors


Leadless Chip Carrier

Width of the PackageLength of the CavityWidth of the Cavity

BB

Internal Line Width V

NP

Internal Distance Cavity to Conductor

Pad Array - Long Grid Array

Pad Misalignment

Ground Plane Clearance to Via Cover Pad

Ground Plane Clearance to External EdgeGround Plane Clearance to Cavity

Internal Tie Bar Connexion WidthInternal Tie Bar Pitch between Connexion

EE

GG

ZAA

CC

FF

HH

G

Via Diameter

Cavity RadiusCeramic Overall ThicknessCeramic Tape Thickness

Ceramic Flatness

F

Via Centerline Pitch

Surface Via Cover PadSurface Line Width

Bonding Pad Pull Back


NLT (Never Less Than) mm inch mm inch

µm inch µm inch

190 0.0075254 0.0100

f 317 0.0125381 0.0150508 0.0200635 0.0250mm inch mm inch

*(1) Some specific formats are available in order to made longer parts, contact us with your project.*(2) Specific tolerance could be acheived with some dicing process after fire stage.

Contact us if a tighter tolerance is needed.*(3) Cavity Radii are obtained by punching, several punching tools are available.

Sharp Angle is not recommended.*(4) Thicker could be made with an adaptation of the cutting process. Conctact us with your project.*(5) Layer's Thickness is linked with the diameter of the vias. Any combination of tape thickness is

avaible for lamination. However, use the same thickness layer is preferable*(6) Specific tape thickness ≥0,150mm / 0,0060'' could be cast on request (impact on cost and lead time)

Contact us if you need a specific layer thicness on your project.*(7) Flatness depends on the design of the parts, contact us with your project.

For flatness on a cavity, the flatness is considered on a smaller area; a gap of 0,25mm (0,010'') betweenthe ceramic cavity wall and the area of measurement. Contact us for obtain a estimation of the value.


FCeramic Total Thickness 5.08

Cavity Length & Width

0,05/25,4mm NLT 0,03

0,0020'' / 1'' NLT 0,0012''


G


± 5%NLT ±0,0016

Layer or Tape Thickness *(5)

± 10%NLT ±0,002

± 5%NLT ±0,038

*(6)

± 10%NLT ±0,05

C & D

Tolerance on Thickness

EGIDE CONFIDENTIAL

*(7)Ceramic Flatness


F

OVERALL DIMENSIONS & TOLERANCES

±1% NLT ±0,005''

101x101

0,200

Cavity Length & Width

(as Fired)

A & B

( Maximum Thickness )

≥ 0,40

Define by Customer Define by Customer

Cavity Radius

Overall Length & Width( Maximum Size )

*(4)

±1% NLT ±0,002''

±1% NLT ±0,05mm

≥ 0,016Define by Customer

*(3)

Specific

4x4

Standard

E

A & B

C & DTolerance on ±1% NLT

±0,13mm

Tolerance on Length & Width

*(1)

±1% NLT ±0,05mm

±1% NLT ±0,002''

*(2)


EGIDE CONFIDENTIAL



Title :




The vias are holes punched in a raw alumina sheet so the diameters of the vias correspond to thepunching tools available. This punching process is limited by the thickness of the tape of ceramicin order to avoid breaking the punching tools.

The following table gives the available Ø of vias :

mm inch

Ø 0,25 Ø 0,0100Ø 0,17 Ø 0,0067Ø 0,13 Ø 0,0051Ø 0,10 Ø 0,0039

The next tables give you the relation between Ø of vias and layer thickness:

mm inchØ0,10 0.0039Ø0,13 0.0051Ø0,17 0.0067Ø0,25 0.0100

µm inch190 0.0075254 0.0100317 0.0125381 0.0150508 0.0200635 0.0250

Only one diameter of vias should be use per layer. A part can use different diameter of via on differentlayer. Use only one diameter of vias per part is preferrable.

The design rules of the pitch between vias centerline need to be followed to minimize the risk ofcracks between via after cofirring process. A staggered implantation of the vias is also preferredcompared to an implantation in line.

Via columns moving continuously from top to bottom of the ceramic package presents some risk for the hermeticity of the package. The via columns are limited at 3 layers maximum. The via must bestaggered, the displacement of the via is equal to the via to via centerline distance (pitch).

inch0,0039 to 0,01000,0051 to 0,01000,0051 to 0,0100

Ø0,17 to Ø0,25

VIAS STACKING

Ø0,13 to Ø0,25Ø0,13 to Ø0,25


Ø0,25


190 to 381 0,0075 to 0,0150190 to 317

0,0075 to 0,0250


STANDARD

0,0075 to 0,0125

SPECIFICSPECIFIC

Layer Thickness

Layer Thickness Via Diameter

EGIDE CONFIDENTIAL

0.0100Ø0,25

190 to 635

0,0067 to 0,01000,0100

Ø0,10 to Ø0,25

VIAS DESIGN RULES

Title :

Available diameter of Vias Ø H


Via Diameter

STANDARD

mm

190µm

Available Via Diameter from the Layer Thickness

Available Layer thickness from Via Diameter

inch0.0075


ØH correspond to the diameter of the via.*(1) Depending on the number of the vias, the via size and the thicknessof the layer, the via pitch can be reduce. Contact us with your requirementfor more information.*(2) This dimension depends of the cutting process and of the cuttingreference. This dimension is at least 4 x ØH. Contact us with yourrequirement for more information.

*(2)

≥ 4 x ØH

≥ 4 x ØH

≥ 4 x ØH

VIAS DESIGN RULES



M

Via Centerline to Cavity Edge(Upper Layer)

K

J Via Pitch *(1)



Title :

L

Via Centerline to External Edge

Via Centerline to Cavity Edge(Same Layer)


mm inch mm inch0.25 0,0100 ≥0,50 ≥0,0200.17 0,0067 ≥0,35 ≥0,0140.13 0,0051 ≥0,25 ≥0,0100.10 0,0039 ≥0,25 ≥0,010

mm inch mm inch

P ≥ 0,20 ≥ 0,008 ≥ 0,10 ≥ 0,004R ≥ 0,20 ≥ 0,008 ≥ 0,10 ≥ 0,004S ≥ 0,25 ≥ 0,010 ≥ 0,20 ≥ 0,008

Dimensions of Metallization for Brazed Component is taken in charge by Egide.Design with the maximum gap between two conductors is preferred

SURFACE LAYER DESIGN

Via Diameter (ØH) Via Cover Pad (ØN)

STANDARD SPECIFIC

Line WidthLine Spaces

Edge to ConductorDepends of the cutting process & of the cutting

reference / Contact us with your project


Cavity to Conductor

Title :

T




EGIDE CONFIDENTIAL


mm inch mm inch0.25 0,0100 ≥0,30 ≥0,0120.17 0,0067 ≥0,30 ≥0,0120.13 0,0051 ≥0,22 ≥0,0090.10 0,0039 ≥0,22 ≥0,009

mm inch mm inch mm inch

V ≥ 0,15 ≥ 0,006 ≥ 0,10 ≥ 0,004 ≥ 0,075 ≥ 0,003W ≥ 0,15 ≥ 0,006 ≥ 0,10 ≥ 0,004 ≥ 0,075 ≥ 0,003X ≥ 0,25 ≥ 0,010 ≥ 0,20 ≥ 0,008

Design with the maximum gap between two conductors is preferred

SPECIFIC LOCALLY

Depends of the cutting process & of the cutting reference / Contact us with your project


Via Diameter (ØH) Via Cover Pad (ØU)


Title :



INTERNAL LAYER DESIGN

STANDARD SPECIFIC

Line WidthLine Spaces

Cavity to Conductor

Y Edge to Conductor

EGIDE CONFIDENTIAL


Lines under the ceramic wallLines on Surface

Z is the distance between internal conductorsand a cavity on the upper layer.

AA is the distance between surface conductorsand a cavity on the upper layer.

mm inch mm inch

Z ≥ 0,25 ≥ 0,010 ≥ 0,20 ≥ 0,008AA ≥ 0,20 ≥ 0,008 ≥ 0,15 ≥ 0,006

Dimension AA should be considered as anon functional area and could be used by Egideto apply some specific process.

mm inch

CC ± 0,13 ± 0,005

mm inch

CC ± 0,06 ± 0,0025

Standard

BB

Standard Specific

EGIDE CONFIDENTIAL


Pad Misalignment


BB

± 0,005


WIRE BONDING PADS

Specific

Pad Misalignment

Title :

± 0,13

LAYER WITH LINES ON SURFACE & INTERNAL LINES


Bonding PadsPull Back

Tolerance on BondingPads Pull Back

≥ 0,13 ≥ 0,005


mm inch

mm inch

*(1) Internal ground planes should be limited to a maximum of 80% metal coverage.*(2) This dimension depends of the cutting process and of the cutting reference. Contact us withyour requirement for more information.

Internal Plating Tie Bar (Use in case of Diamond Saw Cutting or Laser Cutting)

Lines which are outside the partLines inside the part

mm inch

When 2 or more conductive layer are stacked, we usually use different distance betweenthe edge and the conductors.

≥ 0,006

≥ 0,25 ≥ 0,010Clearance to

Via Cover Pad

GROUND PLANE DESIGN *(1)

Clearance to Via Cover Pad

≥ 0,15

DD

Standard



EGIDE CONFIDENTIAL

EEClearance to

Cavity≥ 0,65



FFClearance to

External Edge

Standard

Specific

DD

≥ 0,025

*(2)

INTERNAL TIE BAR FOR ELECTROLYTIC PLATING

LINES STACKING

FFClearance to

External Edge

EEClearance to

Cavity≥ 0,40 ≥ 0,015

HHPitch between

Connexion1.27 0.050

GG Connexion Width 0.15 0.006

*(2)


mm inch

e 1.27 0.050L 1.27 0.050B 0.635 0.025S 0.381 0.015

mm inch

e 1.016 0.040L 1.016 0.040B 0.508 0.020S 0.381 0.015

mm inch mm inch

1.52 0.060 0.762 0.0301.27 0.050 0.635 0.0251.016 0.040 0.508 0.0200.889 0.035 0.508 0.0200.762 0.030 0.381 0.0150.635 0.025 0.381 0.015

Pitch Pad Diameter

Corner Gap

Pitch

PAD ARRAY - LONG GRID ARRAY

Pad LengthPad Width

Corner Gap



LEADLESS CHIP CARRIER

Pitch



Pad LengthPad Width

design guidelines ceramic component design

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