diffusion presentation
TRANSCRIPT
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DIFFUSION
Jobin Mathew
Master of Nanoelectronic Engineering
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What is Diffusion?
Diffusionis the net movement of a substancan atom, ion or molecule) from a region of h
concentrationto a regionof low concentratio
is also referred to as the movement of a subs
down a concentration gradient.[1]
http://en.wikipedia.org/wiki/Concentration_gradienthttp://en.wikipedia.org/wiki/Concentration_gradienthttp://en.wikipedia.org/wiki/Concentrationhttp://en.wikipedia.org/wiki/Concentration_gradienthttp://en.wikipedia.org/wiki/Concentration -
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Where is diffusion used?
Introduce impurities such as boron ,phosphorus ,antimony etc into silicon majority type and resistivity of layers formed in wafer(Doping) .
Today, diffusion is used in the formation of deep layers exceeding few t
micron in depth.
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How is it done?
Deposition of shallow high concentration layer of impurity through wetched in protective barrier layer.
Predeposition: doping often proceeds by an initial predep step to introd
required dose of dopant into the substrate.
Drive-In: a subsequent drive-in anneal then redistributes the dopant giv
required junction depth and surface concentration.
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How it happens ?
At high temperature impurity moves down (900 -1200) via substitutiinterstitial diffusion
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Diffusion Flux
Used to quantify how fast diffusion occurs. The flux is defined as either thatoms diffusing through unit area per unit time (atoms/m2-second) or the m
diffusing through unit area per unit time, (kg/m2-second).
For example, for the mass flux we can write
Diffusion Flux
J = M / At (1/A) (dM/dt) (Kg m-2 s-1)where M is the mass of atoms diffusing through the
area A during time t.
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Steady State diffusion
Ficks First Law-
Proportionality constant is the diffusivity D in cm 2sec -1. D is related t
hops over an energy barrier (formation and migration of mobile species
exponentially activated. D is isotropic in the silicon lattice.
Negative sign indicates that the flow is down the concentration gradient
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Non steady state Diffusion
In many real situations the concentration profile and the concentration gra
changing with time. The changes of the concentration profile can be descr
case by a differential equation, Ficks second law.
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Thermally activated process
To jump from lattice site to lattice site, atoms need energy to break b
neighbors, and to cause the necessary lattice distortions during jump.
necessary for motion, Em, is called the activation energyfor vacanc
The average thermal energy of an atom (kBT = 0.026 eV
for room temperature) is usually much smaller that the
activation energy Em (~ 1 eV/atom)
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Arrhenius
The probability of such fluctuation or frequency of jumps, Rj, depends exp
temperature and can be described by equation that is attributed to Swedish
R0 is the attempt frequency proportional to atomic vibrations
From this relation the diffusion coefficient can be estimated as
Where EAis the activation energy of the neutral vacancy and Do is the me
frequency with which an atom attempts to make a jump over the barrier
1014Hz).
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Advantages
Many wafers can be done simultaneously.
if there already are dopants in the silicon crystal, they can diffuse out
processes due to high process temperatures.
Comparatively inexpensive than ion implantation.
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Limitations
Limited to solid solubility(Upper limit of an impurity that can be abs
silicon).
Low surface concentration hard to achieve.
dopants in the crystal are spreading not only in perpendicular orienta
laterally, so that the doped area is enlarged in a unwanted manner
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Silicon Nanophotonics
Study and application of photonic systems which use silicon as optic
Used to replace the electrical interconnects with optical interconnects
Because of Loss,delay ,power consumption.
Requirements
on chip Laser source is required
have to be fabricated with standard CMOS foundryCMOS compatible
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New developments
In 2013, a startup company named "Compass-EOS", based in Califor
Israel, was the first to present a commercial silicon-to-photonics rout
Researchers at Sandia, Kotura, NTT, Fujitsu and various academic in
been attempting to prove this functionality. A prototype 80 km, 12.5
transmission has recently been reported using microring silicon devic
Enhanced magnetic data storage with a capacity of one Tb/inch2
Diagnosis , Therapy and drug delivery[3] [4]
http://en.wikipedia.org/wiki/Fujitsuhttp://en.wikipedia.org/wiki/Nippon_Telegraph_and_Telephonehttp://en.wikipedia.org/wiki/Sandia_National_Laboratorieshttp://en.wikipedia.org/wiki/Israelhttp://en.wikipedia.org/wiki/Californiahttp://en.wikipedia.org/w/index.php?title=Compass-EOS&action=edit&redlink=1http://en.wikipedia.org/wiki/Startup_company -
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Limitations of Silicon
Cannot be realized as a laser because it has indirect band gap
Si need smaller bandgap material for integration with it.
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Dopant enhanced diffusion in Ge[5]
highly n-type doped ,tensile strained (Shrink bandgap) Ge , permissib
for si photonics.
n-type doping increase gain of Ge [7]
ion implantation not used because of irrecoverable lattice damage an
optical loss.
P doping can be as high as 1021 compared to the possible limit of 1019
ion implantation. Diffusion model taking loss into consideration of the out diffusion of
is more efficient than ion implantation method.
Enhanced doping of Ge by a factor of 100 .
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References
[1] http://en.wikipedia.org/wiki/Diffusion
[2] Compoud semiconductor integrated circuits p 334
[3] . W. Chen, R. BardhW. Chen, R. Bardhan, M. Bartels, C. Perez-Torres
Pautler, N.J. Halas, A. Joshi, Mol. CancerTher.,9, 1028 (2010)
[4] Nanoelectronics Photonics report
[5] Dopant enhanced diffusion for high n-typed doped Ge[6]High phosphorous doped germanium: Dopant diffusionand modeling
[7]X. C. Sun, J. F. Liu, L. C. Kimerling, and J. Michel, IEEE J. Sel. Top.
Quantum Electron. 16, 124131 (2010)
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Terms
out diffusion-The undesired diffusion of dopant atoms from a mater
higher doping level to that with a lower doping level, when sufficient
applied. This may occur, for instance, during the formation of epitaxi
the temperature is not properly maintained.
in situ-dopant atoms are introduced into the semiconductor during it
most commonly during epitaxial growth of semiconductor layers.
Epitaxy-Epitaxy means the growth of a single crystal film on top of
substrate.
http://www.dictionaryofengineering.com/definition/temperature.htmlhttp://www.dictionaryofengineering.com/definition/level.htmlhttp://www.dictionaryofengineering.com/definition/doping.htmlhttp://www.dictionaryofengineering.com/definition/dopant.htmlhttp://www.dictionaryofengineering.com/definition/diffusion.html