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    DIFFUSION

    Jobin Mathew

    Master of Nanoelectronic Engineering

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    What is Diffusion?

    Diffusionis the net movement of a substancan atom, ion or molecule) from a region of h

    concentrationto a regionof low concentratio

    is also referred to as the movement of a subs

    down a concentration gradient.[1]

    http://en.wikipedia.org/wiki/Concentration_gradienthttp://en.wikipedia.org/wiki/Concentration_gradienthttp://en.wikipedia.org/wiki/Concentrationhttp://en.wikipedia.org/wiki/Concentration_gradienthttp://en.wikipedia.org/wiki/Concentration
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    Where is diffusion used?

    Introduce impurities such as boron ,phosphorus ,antimony etc into silicon majority type and resistivity of layers formed in wafer(Doping) .

    Today, diffusion is used in the formation of deep layers exceeding few t

    micron in depth.

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    How is it done?

    Deposition of shallow high concentration layer of impurity through wetched in protective barrier layer.

    Predeposition: doping often proceeds by an initial predep step to introd

    required dose of dopant into the substrate.

    Drive-In: a subsequent drive-in anneal then redistributes the dopant giv

    required junction depth and surface concentration.

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    How it happens ?

    At high temperature impurity moves down (900 -1200) via substitutiinterstitial diffusion

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    Diffusion Flux

    Used to quantify how fast diffusion occurs. The flux is defined as either thatoms diffusing through unit area per unit time (atoms/m2-second) or the m

    diffusing through unit area per unit time, (kg/m2-second).

    For example, for the mass flux we can write

    Diffusion Flux

    J = M / At (1/A) (dM/dt) (Kg m-2 s-1)where M is the mass of atoms diffusing through the

    area A during time t.

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    Steady State diffusion

    Ficks First Law-

    Proportionality constant is the diffusivity D in cm 2sec -1. D is related t

    hops over an energy barrier (formation and migration of mobile species

    exponentially activated. D is isotropic in the silicon lattice.

    Negative sign indicates that the flow is down the concentration gradient

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    Non steady state Diffusion

    In many real situations the concentration profile and the concentration gra

    changing with time. The changes of the concentration profile can be descr

    case by a differential equation, Ficks second law.

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    Thermally activated process

    To jump from lattice site to lattice site, atoms need energy to break b

    neighbors, and to cause the necessary lattice distortions during jump.

    necessary for motion, Em, is called the activation energyfor vacanc

    The average thermal energy of an atom (kBT = 0.026 eV

    for room temperature) is usually much smaller that the

    activation energy Em (~ 1 eV/atom)

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    Arrhenius

    The probability of such fluctuation or frequency of jumps, Rj, depends exp

    temperature and can be described by equation that is attributed to Swedish

    R0 is the attempt frequency proportional to atomic vibrations

    From this relation the diffusion coefficient can be estimated as

    Where EAis the activation energy of the neutral vacancy and Do is the me

    frequency with which an atom attempts to make a jump over the barrier

    1014Hz).

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    Advantages

    Many wafers can be done simultaneously.

    if there already are dopants in the silicon crystal, they can diffuse out

    processes due to high process temperatures.

    Comparatively inexpensive than ion implantation.

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    Limitations

    Limited to solid solubility(Upper limit of an impurity that can be abs

    silicon).

    Low surface concentration hard to achieve.

    dopants in the crystal are spreading not only in perpendicular orienta

    laterally, so that the doped area is enlarged in a unwanted manner

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    Silicon Nanophotonics

    Study and application of photonic systems which use silicon as optic

    Used to replace the electrical interconnects with optical interconnects

    Because of Loss,delay ,power consumption.

    Requirements

    on chip Laser source is required

    have to be fabricated with standard CMOS foundryCMOS compatible

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    New developments

    In 2013, a startup company named "Compass-EOS", based in Califor

    Israel, was the first to present a commercial silicon-to-photonics rout

    Researchers at Sandia, Kotura, NTT, Fujitsu and various academic in

    been attempting to prove this functionality. A prototype 80 km, 12.5

    transmission has recently been reported using microring silicon devic

    Enhanced magnetic data storage with a capacity of one Tb/inch2

    Diagnosis , Therapy and drug delivery[3] [4]

    http://en.wikipedia.org/wiki/Fujitsuhttp://en.wikipedia.org/wiki/Nippon_Telegraph_and_Telephonehttp://en.wikipedia.org/wiki/Sandia_National_Laboratorieshttp://en.wikipedia.org/wiki/Israelhttp://en.wikipedia.org/wiki/Californiahttp://en.wikipedia.org/w/index.php?title=Compass-EOS&action=edit&redlink=1http://en.wikipedia.org/wiki/Startup_company
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    Limitations of Silicon

    Cannot be realized as a laser because it has indirect band gap

    Si need smaller bandgap material for integration with it.

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    Dopant enhanced diffusion in Ge[5]

    highly n-type doped ,tensile strained (Shrink bandgap) Ge , permissib

    for si photonics.

    n-type doping increase gain of Ge [7]

    ion implantation not used because of irrecoverable lattice damage an

    optical loss.

    P doping can be as high as 1021 compared to the possible limit of 1019

    ion implantation. Diffusion model taking loss into consideration of the out diffusion of

    is more efficient than ion implantation method.

    Enhanced doping of Ge by a factor of 100 .

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    References

    [1] http://en.wikipedia.org/wiki/Diffusion

    [2] Compoud semiconductor integrated circuits p 334

    [3] . W. Chen, R. BardhW. Chen, R. Bardhan, M. Bartels, C. Perez-Torres

    Pautler, N.J. Halas, A. Joshi, Mol. CancerTher.,9, 1028 (2010)

    [4] Nanoelectronics Photonics report

    [5] Dopant enhanced diffusion for high n-typed doped Ge[6]High phosphorous doped germanium: Dopant diffusionand modeling

    [7]X. C. Sun, J. F. Liu, L. C. Kimerling, and J. Michel, IEEE J. Sel. Top.

    Quantum Electron. 16, 124131 (2010)

    http://en.wikipedia.org/wiki/Diffusionhttp://en.wikipedia.org/wiki/Diffusion
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    Terms

    out diffusion-The undesired diffusion of dopant atoms from a mater

    higher doping level to that with a lower doping level, when sufficient

    applied. This may occur, for instance, during the formation of epitaxi

    the temperature is not properly maintained.

    in situ-dopant atoms are introduced into the semiconductor during it

    most commonly during epitaxial growth of semiconductor layers.

    Epitaxy-Epitaxy means the growth of a single crystal film on top of

    substrate.

    http://www.dictionaryofengineering.com/definition/temperature.htmlhttp://www.dictionaryofengineering.com/definition/level.htmlhttp://www.dictionaryofengineering.com/definition/doping.htmlhttp://www.dictionaryofengineering.com/definition/dopant.htmlhttp://www.dictionaryofengineering.com/definition/diffusion.html