Proprietary and Confidential

Direct PlatingNeopactSeleo CP Plus

Proprietary and Confidential

Direct PlatingApplication Guide

Segment Application / Build-up Technology

Direct Plating Technology

Recommended Process

HDI, MLB

Advanced Materials

(PTFE, BT, High Tg FR4, PI, Ceramic…)

Organo/Pd Colloid Neopact

Standard & Advanced Materials

(High Tg FR4, halogen free, …)

Conductive Polymer Seleo CP Plus

MLB, DSStandard Materials

(Low – mid Tg FR4)

Conductive Polymer Seleo CP Plus

Proprietary and Confidential

Automotive

Reliability TCT 500 – 1000 cycles Thermal shock 3 – 9 x 288°C

Functionality Control systems e.g. engine, braking, climate Communication / navigation Entertainment systems

Cost Costs of raw materials OEM demands for lower cost

Environment RoHS / EU regulations Recycling regulations Waste water restrictions

Industry

NeopactMain Industry Requirements

Proprietary and Confidential

NeopactBackground

Market release more than 18 years ago

Direct metallization process for flex material and MLB production such as back panels for end- market like automotive and industry

High Pd adsorption of conductor on all types of laminates for good conductivity

Conductor Neopact Pd activator type A Pd activator type B

400ppm Pd 90ppm Pd 250ppm Pd

Magnification 315000x

Proprietary and Confidential

NeopactFeatures & Benefits

Tin- free Pd colloidal activation system

Highly versatile, reliable application for different technologies

Suitable for ALL base materials (PTFE / Flex)

Applicable as vertical and horizontal process

Good adhesion of acid copper on surfaces with low roughness

All customer requirements fulfilled

IPC-TM-650IPC-A-600FPerfag 3 BBosch K8 (Automotive)

MIL P-55110 MIL P-55110 D MIL P-50884 SN 57030

Proprietary and Confidential

Temp(°C)

Time(min) Process Baths

35 2 Etch Cleaner based on SPS or Etch Cleaner Securiganth C

50 5 Conditioner Neopact UX

30 2 Selector Neopact AB or Securiganth Etch Cleaner

20 1 Pre Dip Neopact

50 5 Conductor Neopact

25 1.5 Post Dip NeopactEtch Cleaner

Conditioner

Selector

Pre Dip

Conductor

Post Dip

Acid Cu Plating

NeopactProcess Sequence – Vertical Process

Proprietary and Confidential

PIC 170

DuPont Pyralux AP

Rogers R4350Tg > 280ºC

Isola DE117Tg = 170ºC

NeopactTypical Results – Base Materials

Proprietary and Confidential

FR4Ø 4mil

depth 65µm

RCCØ 4mil

depth 65µm

NeopactTypical Results – BMV

Proprietary and Confidential

Horizontal Vertical Total

No. of lines 16 28 44

Total capacity 2.000.000 m² 300.000 m² 2.300.000 m²

Europe 11 26 37

Japan 2 1 3

China 2 0 2

Taiwan 1 0 1

RoW 0 0 0

Neopact is a well established production proven process for several applications and end-user markets

Status 03/2010

NeopactReferences

Proprietary and ConfidentialProprietary and Confidential

Seleo CP Plus

Proprietary and Confidential

Direct Plating process (alternative to electroless copper) for MLB and HDI manufacturing

Based on a conductive polymer as conductive layer

Very GREEN and short process with only 4 active process steps

Seleo CP Plus – The Plus for your green conscience

What is Seleo CP Plus?

Proprietary and Confidential

Environmentally friendly Very short & simple process Low chemistry usage per m² cut board Low generation of waste water Low consumption of fresh water No usage of harmful chemicals as e.g. formaldehyde, cyanide

Economical advantages No dependence on Pd price Low space requirement Reduced investment costs Low running costs (chemistry / fresh water / waste water)

Technical benefits Selective process with excellent reliability BMV & direct pattern plating capable Horizontal & vertical application possible Robust conductive layer – 2 time holding time possible Copper particle free production

Pd

CN– HCHO

Why use Seleo CP Plus?Features and Benefits

Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

Proprietary and Confidential

Etch Cleaner

Adhesion Promoter

Conditioner

Polyconduct

Metallization (E’lytic Cu)

MnO2 + 2 + 4H+ + Mn2+ + 2 H2OS S

SMnO2

Seleo CP Plus Process Description

Proprietary and Confidential

Seleo CP Plus reduces the risk of a gap developing in the conductive layer near to inner layers which can occur if non selective direct plating processes are used which require etching to clean innerlayers (e.g. carbon/graphite and some conductive palladium processes)

Etching

gap In the conductive layer

Seleo CP Plus A Truly Selective Process

Proprietary and Confidential

Calculation Basis: Uniplate Seleo CP (UTS-s, 1.5m/min), Triple Rinses

18.1 m

10.8 m

E’less Copper

1

2

3

4

5

6

Etch Cleaner(optional)

Conditioner

Adhesion Promoter

Polyconduct

Cleaner

Etch Cleaner

Pre Dip

Activator

Reducer

E’less Copper

Seleo CP Plus

3x

3x

3x

1x + 2x

3x

1

2

3

4

3x

3x

1x + 3x

3x

Reduced line length

2 less active modules

1 less cascade rinse

Horizontal Process Comparison Footprint

Proprietary and Confidential

Environmental BenefitsTotal Chemistry & Water Consumption

9618

4487 4700

228

12208

1380

0 25 4 2 0 0425313821140 1158

0

2000

4000

6000

8000

10000

12000

14000

City water

DI wate

r

Soft wate

r

Oxidan

t

Inorganic Acid

Organic

Complexant

Inorganic Bas

e

Metal C

omponent /

Salt

Reducing Agen

t

g/m

² c.b

.

E'less Cu

Seleo CP Plus

Uniplate (UTS-s, 1.5m/min), Triple Rinses

60% less chemistry consumed28% less fresh water consumed (5.2kg/m²)

- 69% - 100%- 31% - 82% - 97% - 90%

+ 27%

- 100% - 100%- 93%

Proprietary and Confidential

Environmental BenefitsTotal Wastewater Generated Rinses & Active Modules

74087820

1464 1362908

327

9940

2414

1293

46 0 830

2000

4000

6000

8000

10000

12000

Rinse WaterAcidic/Alkaline

Rinse WaterComplex

Conc. Oxidizing Conc. Complex Conc. Alcaline Conc. Acidic

g/m

² c.b

.

E'less CuSeleo CP Plus

Uniplate (UTS-s, 1.5m/min), Triple Rinses

- 75%

- 69%

- 12% - 97% - 100%

+ 34%

29% less generated wastewater (5.5kg/m²)

Proprietary and Confidential

Reliability – SST

Solder shock test, up to 9x at 288ºC, passed !

Solder Shock Test & ICD Performance

Hole diameter 1.0mm9x @ 288°C (ISOLA E-Cu 114)

Hole diameter 1.0mm6x @ 288°C (acc. IPC-TM-650 #2.6.7.1)

Proprietary and Confidential

Reliability – TCT

Ø 1.0mm ML 1.7mm (Panasonic R1566)1000 cycles TCT and soldering

Ø 1.0mm ML 2.4mm (ISOLA IS 400) 1000 cycles TCT and soldering

Temperature Cycle Test 1000 cycles & ICD Performance

Temperature cycle test, up to 1000cycles and soldering, passed !

Proprietary and Confidential

Reliability – IST

Interconnect stress test, up to 2000 cycles, passed !

Interconnect Stress Test & ICD PerformancePost interconnect (power circuit)

Hole diameter 1.0mm2000 cycles IST (Shengyi S1000)

Proprietary and Confidential

ReliabilitySeleo CP Plus Summary

Specifications Base Material

Solder Shock Test (SST)

solder float

9x288°C, 10s ISOLA E-CU 114, IS 405

6x288°C, 10s ISOLA E-CU 114, IS 405

6x228°C, 10s PI- Flex

3x288°C, 10s HITACHI CHEMICAL MCL-BE-67G(H)

solder dip

8x288°C, 10sSHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33, 22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya Anti-CAF R1766G // PANASONIC R1566W

6x288°C, 10s TUC TU662 // ISOLA IS 402 , IS 420

5x288°C, 10s HITACHI CHEMICAL MCL-BE-67G(H) // PANASONIC R1566W // ISOLA FR-370 Turbo, NELCO N4000-13 , N4000-6

Temperature Cycle Test

(TCT)

-40°C (10’) - +125°C (10’)

200 cycles and 3x reflow as pre-cond. ISOLA IS402

500 cycles ISOLA IS402, IS405

1000 cycles and soldering 1x288°C, 10s

ISOLA IS400 // PANASONIC R1566W

-40°C (15’) - +125°C (15’) 500 cycles

SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33, 22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya Anti-CAF R1766G // PANASONIC R1566W

Interconnect Stress Test

(IST)

800 cycles 3x reflow as pre-cond. ISOLA IS402

1000 cycles - ISOLA IS402

2000 cycles - SHENGY SYL-S1000

Proprietary and Confidential

Customer ExperiencesHorizontal / Panel Plating

16 layers 3.2mm / 0.65mm AR 1:5 6 layers 1.6mm / 0.9mm AR 1:1.8 2.0mm / 0.11mm AR 1:18

layers8 1.6mm / 0.2mm AR 1:8

Seleo CP Plus and smooth leveling down the hole

4 layers 1.6mm / 1.1mm AR 1:1.5

Proprietary and Confidential

Customer ExperiencesHorizontal / Full Pattern Plating

Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

6 layers 1.6mm / 0.35mm AR 1:4.6

6 layers 1.6mm/0.7mm AR 1:2.3 10 layers 1.6mm / 0.3mm AR 1:5.3

detail

4 layers 1.6mm / 0.3mm AR 1:5.3

Compatible with Direct Imaging

Proprietary and Confidential

Customer ExperiencesHorizontal / Mechanical Drilled BV

µ

250µm / 250µm

400µm / 500µm1.0mm / 1.2mm

90µm / 100µm

90µm / 100µm

300µm / 300µm

Panel & Pattern Plating

Proprietary and Confidential

Customer ExperiencesHorizontal / Laser Drilled BMV

Large Window

2 A/dm², 10 minutes , 4µm Copper

100 / 75 µm µm

1.0 / 1.2mm

100 / 75µm

100 / 75 µm

Inpulse 2HF

100 / 75µm 100 / 75µm 100 / 75µm

100 / 75 µm

Proprietary and Confidential

Customer Experiences Horizontal Qualification Results

4 layer 6 layer 8 layer

10 layer 12 layer 1 week, 3 shifts13380 panels ~1915 p./day 4335 m² ~620 m²/day

Thickness: 1.0 2.4 mmDrill dia: 0.25 ~4.0 mm Aspect ratio: 1:10MLB: 2 12 layerBasematerial: Tg 130 Tg 170

Proprietary and Confidential

Customer ExperiencesBase Material Compatibility

Supplier Material Tg [°C] Lead free processible

Halogen free

RoHS compliance Resin Type Flame retardant/Filler

FR 25N 190 yes yes yes woven fiberglass reinforced ceramic fillerDiClad 522/725 300 yes flourine yes woven Glass/Teflon no fillerPyralux AP8525 220 yes yes yes Polyimide no fillerPyralux AP8525R 220 yes yes yes Polyimide no filler

EMC EM 320(5) 150 yes yes Yes FR4MCL-BE-67G(H) 150 no yes yes FR4 NO: halogen, antimony, or red phosphorusGIA 671N 220 yes yes yes Polyimide No flow prepregDE 104 135 no bromine yes dicy no fillerIS 402 140 no bromine yes Tetrafunctunal epoxy no fillerIS 400 145 no bromine yes phenolic inorganic fillerDE 114 150 no bromine yes difunctional epoxy no fillerDE 156 155 yes Yes yes modified epoxy P, Al, Cl, Si, OIS 410 180 yes bromine yes phenolic , multifunctional epoy resin inorganic fillerIS 420 170 yes no yes Epoxy- polyfunctional Epoxy Br / inorganicFR-370 TURBO 175 yes no yes FR4G 200 185 yes no yes BT + Epoxy BrIS 620i 220 yes no yes BT + Epoxy Br / NoIS 640 220 yes no yes Epoxy No fillerP 96 260 yes no yes Polyimide + Epoxy Br/ CaIS 415 200/220 yes no yes FR4 BrIT 140 140 yes bromine yes dicy no fillerIT 158 160 yes yes yes Tetra functional epoxy no fillerIT 180 180 yes yes yes mulitfunctional epoxy Al2O3 fillerIT 200 DB S 200 yes yes yes multifunctional epoxy no filler1650 C 135 no bromine yes dicy no fillerMC 100 EX 137 no bromine yes dicy, phenolic no fillerAnticaf- R 1766 G 140 yes yes yes Difunctional Epoxy resin no fillerR 1566 148 yes yes yes Epoxy Al, P, Ca, Si, MgR 1566 W 153 yes yes yes FR4 P/ inorganicHR 02 170 yes no yes Phenolic cured system inorganic fillerH 01 > 170 "yes" bromine yes Phenolic cured (Dicy Free) system no filler22 not available not available not available not available not available not available22 B5 not available not available not available not available not available not availableHR 33 not available not available not available not available not available not availableN 4000-6 175 yes yes Yes FR4N 4000-13 210 yes bromine yes enhanced multifunctional resin no fillerN 7000 250 yes Halogen free yes Polyimide no fillerRO 3000 300 yes flourine yes ceramic-filled PTFE ceramic filler

RO 4003 C >280 yes yes yes glass-reinforced hydrocarbon/ceramic laminates

ceramic filler

RO 4350 >280 yes yes yes glass-reinforced hydrocarbon/ceramic laminates

ceramic filler

R/flex 1000 >220 yes yes Polyimide Buthyral PhenolicS 1155 135 yes yes yes epoxy no fillerS 1000 170 yes bromine yes epoxy no fillerS 1170 175 yes no yes FR4S 1141 150-170 yes bromine yes epoxy no fillerRF 35 315 yes flourine yes PTFE coated woven glass fabric no fillerTLC-32 315 yes flourine yes PTFE coated woven glass fabric no fillerNP 140 TL 140 no bromine yes dicy, phenolic no filler

CEM3 125-130 optional bromine yes glas woven core and two layer of FR4 dicy epoxy

no filler

TUC Tu 662 150 yes no yes FR4

Mica

Nelco

Rogers

Shengyi

Taconic

Technolam

Arlon

DuPont

Hitachi Chemical

Isola

ITEQ

Matsushita

All material tested or produced with standard Seleo CP Plus process parameter

Proprietary and Confidential

Customer Reference Horizontal Lines Seleo CP Plus (1)

Customer Country End Market Acid Copper Conversion/Start Up

1 04/2008

Czech Republic Prototyping, Industrial/Medical, Defensive Pattern Plating, Copper Strike Competitor

2

07/2008Hungary Consumer, Communications, Computing Pattern Plating Seleo CP

3 04/2009

Italy Consumer. Industrial/ Medical, IC Packaging, Communications, Automotive Pattern Plating Competitor

4 04/2009

China Communications, Automotive Copper Strike Seleo CP

5 05/2009 Israel Industrial/ Medical Pattern Plating,

Copper Strike Seleo CP

6

05/2009Italy

Consumer, Communications, Industrial/Medical, Defense/Aerospace,

Computing, AutomotiveCopper Strike Competitor

7 06/2009

Germany Industrial/ Medical Pattern Plating Competitor

8

10/2010China Communications, Computing, Consumer,

AutomotiveSemi Panel

Plating Compact CP

9 03/2011

ItalyIndustrial/Medical, Automotive,

Defense/Aerospace, Communications, Consumer, IC Packaging

Copper Strike Compact CP

10 04/2011

Spain Industrial/ Medical, Consumer, Automotive Pattern Plating Seleo CP Rebuilding

Proprietary and Confidential

Customer Reference Horizontal Lines Seleo CP Plus (2)

Customer Country End Market Acid Copper Conversion/Start Up

11 09/2011

Italy Communications, Computing, Consumer, Automotive Pattern Plating New Line / Competitor

12 10/2011

Germany Industrial/ Medical Pattern Plating, Copper Strike

New line UTS-XL / Competitor

13 11/2011 Germany

Consumer, Communications, Computing, Automotive, Industrial/Medical,

Defense/AerospaceCopper Strike Seleo CP

14 03/2012

China Communications, Computing, Consumer, Automotive

Semi Panel Plating CP Rebuilding

15 07/2012 Italy Communications, Industrial/Medical,

Consumer Pattern Plating Competitor

16 09/2012 Brazil Industrial/Medical, Automotive, Defense Pattern Plating New Line / Competitor

17

03/2013China Communications, Computing, Consumer,

AutomotiveSemi Panel

Plating Compact CP

18 03/2013

India Automotive, Industrial/Medical Copper Strike Seleo CP

Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

Proprietary and Confidential

Customer Reference Vertical Lines Seleo CP Plus (1)

Customer Country End Market Acid Copper Conversion/Start Up

1 06/2008 Slovakia Prototyping, Industrial/Medical

Copper Strike New Line PPT / Competitor

2 2011 UK Prototyping, Industrial/Medical Copper Strike Seleo CP

3 2012 Canada Industrial/Medical, Consumer,

Communications Pattern Plating Seleo CP

4 2012 Canada Industrial/Medical, Consumer,

Communications Pattern Plating Seleo CP

5 2012 Canada Industrial/Medical, Consumer,

Communications Pattern Plating Seleo CP

6 02/2011 Brazil Automotive, Consumer, Computing,

Communications Pattern Plating Competitor

7 04/2011 Brazil Automotive, Communications, Computing,

Industrial/Medical, Aerospace Pattern Plating Competitor

8 04/2011 Brazil Communications, Automotive,

Industrial/Medical Pattern Plating Competitor

9 10/2011 Brazil Automotive, Communications, Computing Pattern Plating Competitor

10 11/2011 Brazil Communications, Computing,

Industrial/Medical Pattern Plating Competitor

Proprietary and Confidential

Customer Reference Vertical Lines Seleo CP Plus (2)

Customer Country End Market Acid Copper Conversion/Start Up

11 03/2012 Brazil Communications, Computing, Industrial Pattern Plating Competitor

12 03/2012 Brazil Communications, Computing, Industrial Pattern Plating Competitor

13 11/2012 Czech Republic Industrial Panel Plating New Line PPT

14 01/2013 Brazil Industrial, Automotive, Computing,

Consumer Pattern Plating New Line Competitor

15 02/2013 Brazil Automotive, Industrial Pattern Plating Competitor

16 02/2013 Brazil Industrial, Automotive, Computing,

Consumer Pattern Plating Competitor

Proprietary and Confidential

OEM Reference

Thank you for your attention!

For more information contact :Jaime Peraza OrdazPMM Atotech EuropeMobile: +34 606 372 364Email: jaime.peraza@atotech.com

Tobias SponholzGlobal Assistant Product Manager BTT PTHMobile: +49 (0)173 - 628 64 80Email: tobias.sponholz@atotech.com

Cyril ChampionProduct Marketing Manager EuropePTH-PP Mobil : +33 6 20 14 79 78Email: cyril.champion@atotech.com