dispensing and jetting panel discussion bonus material
TRANSCRIPT
Dispensing and Jetting Panel Discussion Bonus MaterialQ&A Plus
and Bonus Guide
Nordson Electronics Solutions 2021
Q&A Plus Responses Question Answer
What is the smallest deposit size achievable with jetting and dispensing techniques? Does this differ for different materials, and if so what are the minimum deposit sizes for common materials?
For needle dispensing, we can dispense down to 200 µm dots. When it comes to jetting, you need to work with the fluid supplier to make sure you are using a material that is conducive to jetting. For jettable materials, we are currently able to jet 1-2 nl volumes.
Is it possible to jet 100-150 micron solder paste dots? If yes, what paste type and kind of stand-off from the substrate?
When it comes to dispensing small solder paste dots, you need to work with your fluid supplier to get the right composition. When we’re looking at really small shot sizes, we’re using a type 6 or 7 solder paste. The chemistry of the material must lend itself to small dot dispensing. That’s probably the number one thing you’ll need to look for, finding the type of paste that will successfully dispense small dots.
Referring to components, parts, and pads; how can you be sure about the amount of the solder paste being dispensed? Also, according to the IPC acceptability please.
In general, customers typically specify the amount of material they want to be dispensed per pad size to meet their tolerances. If required, an inspection can be performed after dispense to verify the correct amount of paste was dispensed. Refer to J-STD-005 – General Requirements and Test Methods for Soldering Paste.
What about integrated inspection in the dispensing system when it comes to glue or solder paste dispensing?
Onboard inspection is helpful and cost-effective when you have a small number of parts to inspect. To minimize the impact on UPH, onboard inspection should primarily be used to spot check dispensing results during the process. Nordson offers automated post-dispense inspection in some of our dispensing and conformal coating solutions.
Is there a way of measuring cartridge pressure that solder pastes will be exposed to during jetting and/or dispensing? If so, can that be adjusted on the fly if separation between the flux and solder powder occurs within a solder paste cartridge.
It’s not possible to correct the separation of flux and solder powder on the fly during the dispensing process. These elements are mixed by the fluid supplier before shipment.
4
Q&A Plus Responses Question Answer
How prevalent is jetting of solder paste in today's marketplace. For example, can 1 out of 10 contract manufacturers jet solder paste?
We have received requests to jet solder paste, but it has not been commercialized as much as you might think. Nordson does offer solder paste jetting solutions through our sister company Nordson EFD. However, there are many considerations with solder paste jetting including the type and cost of the paste you’re using. In general, it’s challenging to achieve a repeatable production-worthy solder paste jetting process.
How important is bottom-side tooling in dispensing applications? When it comes to miniaturization, bottom-side tooling is really important. For example, if you’re using vacuum tooling it allows the part to be held in place during dispensing to ensure good placement accuracy. Any slight movement in the part during dispense will sacrifice accuracy. Tooling, whether it’s heated on not heated, can help you control the flow out of dispensed material. Tooling has a significant impact on overall process outcomes.
Is it possible for a jet dispenser to meet Cp, Cpk >1.67 in terms of volume? To address this question, we need to know the type of fluid you’re using, your target volume, and the tolerance specifications. Dependencies include the stability of the material and whether several shots are needed to achieve the target volume. After assessing these factors, we can provide the Cp and Cpk values in terms of volume.
With Factory 4.0, is the plan to have external downstream dispensers talk with SPI to correct volume inadequacies? How far away is this?
Nordson currently offers integrated post-dispense inspection in our precision dispensing systems and will further develop multi-system closed-loop process controls. Cpk analyses are also available between the Select Coat® SL-940 conformal coating system and the inline automated coating inspection system in Panorama Line Solutions.
5
Q&A Plus Responses Question Answer
Do you see jetting and dispensing methods replacing stencil printing for solder pastes in the near future?
Rework, sealing, line, and dot dispense applications are commonly used today when stencil printing is not feasible. One major benefit of dispensing solder paste over stencil printing is that it offers flexibility. If parts are revised, it’s easy to add or remove material to accommodate pad changes. And you can avoid the cost and time involved in creating new stencils.
Are there any techniques to prevent material from flowing away from a component that is being underfilled?
To prevent underfill flow out, reduce the shot size and dispense smaller amounts of fluid in a multi-pass approach. This allows capillary flow to occur gradually and minimizes flow out.
Tip or valve? What to choose? The material will dictate which direction to take. Look at the rheology of the fluid, the viscosity, and the dot sizes you want to achieve. That information will help you determine whether you should go with needle dispensing or jetting. Lower viscosity materials tend to be easier to jet and offer higher productivity. For higher viscosity materials, you might consider needle dispensing with pumps or time pressure valves.
What are the advantages of jetting vs. pin transfer for sub 150 µm deposits? Conductive epoxy and non-conductive epoxy without filler can be dispensed at a 0.15 mm dot size with the Nordson DV-7000 Heli-Flow® auger pump.
It’s possible to dispense type 6 solder paste at a 0.2 mm dot size and achieve production-worthy reliability.
What is the dispensing time per dot using a jet valve? The valve open time is 1 ms or less.
Two-Part Dispensing Success
Achieving accurate mix ratios, selecting the right static mixer, and keeping fluids separate before mix and dispense are critical to the success of two- part dispensing applications.
If fluids come into contact too soon or mix ratios and times are inaccurate, fluid properties are affected, and process outcomes are affected.
Nordson addresses critical concerns with the Vortik® Progressive Cavity Pump.
1. Our unique, award-winning, patent-pending ARC™ Technology in Fluidmove® software takes the guesswork out of application setup. Enter basic information including mix ratio, specific gravity, and volume target to quickly determine the optimal setup configuration for your application – eliminating manual calculations and time-consuming test iterations.
2. All two-component Vortik pumps are equipped with a patent-pending Quick Disconnect Manifold that prevents contact between part A and part B materials for easy transition between calibration, production, and overnight modes. Calibrate the ratio to ensure a consistent ratio.
3. The suck back feature offers excellent fluid break-off.
6
Learn More
Now our unmatched dispensing technologies are available in a large-volume format. Brimming with functional features, the Helios SD-960 Series delivers the advanced performance you’ve come to expect. What’s more, our solutions include everything you need to initiate your process. Dispense large-volumes of one- (1K) or two-component (2K) structural, thermal, bonding, sealing or potting materials with our all-in-one solutions.
Compatible with the large-volume Vortik progressive cavity pump for single- and two-part applications
The suck back feature offers excellent fluid break-off.
Choose from dual-drawer batch or conveyorized in-line configurations equipped with Nordson ASYMTEK dispense valves or fully integrated Nordson SEALANT metering systems.
Options include time-pressure valves, closed-loop process control, and servo-controlled positive displacement systems.
7
Consider needle dispensing with an auger pump to achieve repeatable, production-ready solder paste dispense results. For needle dispensing, we can dispense down to 200 µm dots.
Learn More:
Nordson DV-7000
Performance
Repeatable results
Ease of use – maintenance and change over. Designed with fewer parts!
Controlled by dedicated fluid dispensing software
The most significant jetting challenge is dispensing to miniaturized geometries with speed and accuracy.
Nordson offers the IntelliJet® Jetting System with patented ReadiSet® Jet Cartridge for cutting-edge reliability and micro-dot dispensing.
The IntelliJet jets up to 5000 dots over a 10-second interval with a maximum 1000 Hz frequency
Jet actuator reliability is up to six times longer than other jets on the market
The IntelliJet fully-integrates into ASYMTEK's top three precision dispensing systems – Vantage® Series, Forte™ Series, and Spectrum® II Premier
9
IntelliJet® Jetting System and Easy Change Over with two-piece ReadiSet® Jet Cartridge
High-Speed Jetting Success Learn More
The Nordson NE Connect™ API integrates into our dispensing and coating software applications – Fluidmove®, EasyCoat®, and Canvas® – and with traceability systems and protocols across SMT, PCB, PCBA, and SEMI industries.
The architecture offers:
Overall equipment efficiency
Support for product and material validation, program and material changeover, and program mapping
10
By helping ensure that fluid is dispensed to parts according to specific tolerances and quality standards, Nordson’s automated post-dispense inspection enables you to perform “sample inspection” to keep your process on track and minimize UPH impact.
The most significant challenge with automated inspection is the time that it takes to perform the inspection step. It could easily double your cycle time.
Nordson offers sampled inspection, instead of 100% inspection to reduce any negative UPH impact.
The system inspects for:
Fluid contamination on top of the die
Keep out zone violation
11
Contact Us
Submit an Online Sales Information Request
Contact Us
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Nordson Electronics Solutions 2021
Q&A Plus Responses Question Answer
What is the smallest deposit size achievable with jetting and dispensing techniques? Does this differ for different materials, and if so what are the minimum deposit sizes for common materials?
For needle dispensing, we can dispense down to 200 µm dots. When it comes to jetting, you need to work with the fluid supplier to make sure you are using a material that is conducive to jetting. For jettable materials, we are currently able to jet 1-2 nl volumes.
Is it possible to jet 100-150 micron solder paste dots? If yes, what paste type and kind of stand-off from the substrate?
When it comes to dispensing small solder paste dots, you need to work with your fluid supplier to get the right composition. When we’re looking at really small shot sizes, we’re using a type 6 or 7 solder paste. The chemistry of the material must lend itself to small dot dispensing. That’s probably the number one thing you’ll need to look for, finding the type of paste that will successfully dispense small dots.
Referring to components, parts, and pads; how can you be sure about the amount of the solder paste being dispensed? Also, according to the IPC acceptability please.
In general, customers typically specify the amount of material they want to be dispensed per pad size to meet their tolerances. If required, an inspection can be performed after dispense to verify the correct amount of paste was dispensed. Refer to J-STD-005 – General Requirements and Test Methods for Soldering Paste.
What about integrated inspection in the dispensing system when it comes to glue or solder paste dispensing?
Onboard inspection is helpful and cost-effective when you have a small number of parts to inspect. To minimize the impact on UPH, onboard inspection should primarily be used to spot check dispensing results during the process. Nordson offers automated post-dispense inspection in some of our dispensing and conformal coating solutions.
Is there a way of measuring cartridge pressure that solder pastes will be exposed to during jetting and/or dispensing? If so, can that be adjusted on the fly if separation between the flux and solder powder occurs within a solder paste cartridge.
It’s not possible to correct the separation of flux and solder powder on the fly during the dispensing process. These elements are mixed by the fluid supplier before shipment.
4
Q&A Plus Responses Question Answer
How prevalent is jetting of solder paste in today's marketplace. For example, can 1 out of 10 contract manufacturers jet solder paste?
We have received requests to jet solder paste, but it has not been commercialized as much as you might think. Nordson does offer solder paste jetting solutions through our sister company Nordson EFD. However, there are many considerations with solder paste jetting including the type and cost of the paste you’re using. In general, it’s challenging to achieve a repeatable production-worthy solder paste jetting process.
How important is bottom-side tooling in dispensing applications? When it comes to miniaturization, bottom-side tooling is really important. For example, if you’re using vacuum tooling it allows the part to be held in place during dispensing to ensure good placement accuracy. Any slight movement in the part during dispense will sacrifice accuracy. Tooling, whether it’s heated on not heated, can help you control the flow out of dispensed material. Tooling has a significant impact on overall process outcomes.
Is it possible for a jet dispenser to meet Cp, Cpk >1.67 in terms of volume? To address this question, we need to know the type of fluid you’re using, your target volume, and the tolerance specifications. Dependencies include the stability of the material and whether several shots are needed to achieve the target volume. After assessing these factors, we can provide the Cp and Cpk values in terms of volume.
With Factory 4.0, is the plan to have external downstream dispensers talk with SPI to correct volume inadequacies? How far away is this?
Nordson currently offers integrated post-dispense inspection in our precision dispensing systems and will further develop multi-system closed-loop process controls. Cpk analyses are also available between the Select Coat® SL-940 conformal coating system and the inline automated coating inspection system in Panorama Line Solutions.
5
Q&A Plus Responses Question Answer
Do you see jetting and dispensing methods replacing stencil printing for solder pastes in the near future?
Rework, sealing, line, and dot dispense applications are commonly used today when stencil printing is not feasible. One major benefit of dispensing solder paste over stencil printing is that it offers flexibility. If parts are revised, it’s easy to add or remove material to accommodate pad changes. And you can avoid the cost and time involved in creating new stencils.
Are there any techniques to prevent material from flowing away from a component that is being underfilled?
To prevent underfill flow out, reduce the shot size and dispense smaller amounts of fluid in a multi-pass approach. This allows capillary flow to occur gradually and minimizes flow out.
Tip or valve? What to choose? The material will dictate which direction to take. Look at the rheology of the fluid, the viscosity, and the dot sizes you want to achieve. That information will help you determine whether you should go with needle dispensing or jetting. Lower viscosity materials tend to be easier to jet and offer higher productivity. For higher viscosity materials, you might consider needle dispensing with pumps or time pressure valves.
What are the advantages of jetting vs. pin transfer for sub 150 µm deposits? Conductive epoxy and non-conductive epoxy without filler can be dispensed at a 0.15 mm dot size with the Nordson DV-7000 Heli-Flow® auger pump.
It’s possible to dispense type 6 solder paste at a 0.2 mm dot size and achieve production-worthy reliability.
What is the dispensing time per dot using a jet valve? The valve open time is 1 ms or less.
Two-Part Dispensing Success
Achieving accurate mix ratios, selecting the right static mixer, and keeping fluids separate before mix and dispense are critical to the success of two- part dispensing applications.
If fluids come into contact too soon or mix ratios and times are inaccurate, fluid properties are affected, and process outcomes are affected.
Nordson addresses critical concerns with the Vortik® Progressive Cavity Pump.
1. Our unique, award-winning, patent-pending ARC™ Technology in Fluidmove® software takes the guesswork out of application setup. Enter basic information including mix ratio, specific gravity, and volume target to quickly determine the optimal setup configuration for your application – eliminating manual calculations and time-consuming test iterations.
2. All two-component Vortik pumps are equipped with a patent-pending Quick Disconnect Manifold that prevents contact between part A and part B materials for easy transition between calibration, production, and overnight modes. Calibrate the ratio to ensure a consistent ratio.
3. The suck back feature offers excellent fluid break-off.
6
Learn More
Now our unmatched dispensing technologies are available in a large-volume format. Brimming with functional features, the Helios SD-960 Series delivers the advanced performance you’ve come to expect. What’s more, our solutions include everything you need to initiate your process. Dispense large-volumes of one- (1K) or two-component (2K) structural, thermal, bonding, sealing or potting materials with our all-in-one solutions.
Compatible with the large-volume Vortik progressive cavity pump for single- and two-part applications
The suck back feature offers excellent fluid break-off.
Choose from dual-drawer batch or conveyorized in-line configurations equipped with Nordson ASYMTEK dispense valves or fully integrated Nordson SEALANT metering systems.
Options include time-pressure valves, closed-loop process control, and servo-controlled positive displacement systems.
7
Consider needle dispensing with an auger pump to achieve repeatable, production-ready solder paste dispense results. For needle dispensing, we can dispense down to 200 µm dots.
Learn More:
Nordson DV-7000
Performance
Repeatable results
Ease of use – maintenance and change over. Designed with fewer parts!
Controlled by dedicated fluid dispensing software
The most significant jetting challenge is dispensing to miniaturized geometries with speed and accuracy.
Nordson offers the IntelliJet® Jetting System with patented ReadiSet® Jet Cartridge for cutting-edge reliability and micro-dot dispensing.
The IntelliJet jets up to 5000 dots over a 10-second interval with a maximum 1000 Hz frequency
Jet actuator reliability is up to six times longer than other jets on the market
The IntelliJet fully-integrates into ASYMTEK's top three precision dispensing systems – Vantage® Series, Forte™ Series, and Spectrum® II Premier
9
IntelliJet® Jetting System and Easy Change Over with two-piece ReadiSet® Jet Cartridge
High-Speed Jetting Success Learn More
The Nordson NE Connect™ API integrates into our dispensing and coating software applications – Fluidmove®, EasyCoat®, and Canvas® – and with traceability systems and protocols across SMT, PCB, PCBA, and SEMI industries.
The architecture offers:
Overall equipment efficiency
Support for product and material validation, program and material changeover, and program mapping
10
By helping ensure that fluid is dispensed to parts according to specific tolerances and quality standards, Nordson’s automated post-dispense inspection enables you to perform “sample inspection” to keep your process on track and minimize UPH impact.
The most significant challenge with automated inspection is the time that it takes to perform the inspection step. It could easily double your cycle time.
Nordson offers sampled inspection, instead of 100% inspection to reduce any negative UPH impact.
The system inspects for:
Fluid contamination on top of the die
Keep out zone violation
11
Contact Us
Submit an Online Sales Information Request
Contact Us
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Slide Number 5
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Slide Number 10
Slide Number 11