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KEMET Electronics Italia
D l t f B ttD l t f B ttDevelopment of Battery Development of Battery Manufacturing TechnologiesManufacturing TechnologiesManufacturing TechnologiesManufacturing Technologies
December 7 2011Joint EC / European Green Cars Initiative Workshop 2011Joint EC / European Green Cars Initiative Workshop 20111
December 7, 2011Joint EC / European Green Cars Initiative Workshop 2011Joint EC / European Green Cars Initiative Workshop 2011
Bruxelles 7 December 2011Bruxelles 7 December 2011
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KEMET Electronics Italia
Headquarters: Simpsonville SC
Corporate Statistics
Headquarters: Simpsonville, SC Manufacturing: 23 facilities worldwideSquare feet: 3 millionEmployees: 10 000Employees: 10,000Revenue: ~$1 billion
Kemet Electronics Italia /Arcotronics (Machinery) Statistics
Headquarters: Sasso Marconi, Italy Manufacturing: Sasso Marconi, ItalySquare feet: 200 000Square feet: 200,000Employees: ~100
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KEMET Electronics ItaliaKEMET Electronics Italia
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KEMET Electronics Italia
EQUIPMENT KEY FACTORS
High Flexibility for different cell foot print and thickness
Six Sigma process with In-line process control and data collection
Yield optimisation
Ultimate state of the technologygy
Each machine is provided with the following main features: Ethernet connection for remote control / data collection and batch handling with bar code reader
from a supervisor Host
Maintenance counters for each wearing movable part for preventive maintenanceg
Large and movable HMI color pannel for easy operation
Process parameters recipe handling to facilitate size changeover
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KEMET Electronics ItaliaTYPICAL AUTOMOTIVE
POUCH CELL PRODUCT RANGEMin
(mm)Max (mm)(mm) (mm)
Cell Lenght (without tabs)
115 250
Cell Width 70 150
Cell Thickness
3 13
Tab 6 20extension
Tab config Axial Radial
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOW
TABS TRIMMING& CURRENT COLLECTORS
MONOCELL ASSEMBLING LAMINATION & FOLDING
WELDING
SOFT PACK HALF-SHELLS FORMING
CELL INSERTION &
FORMING
ELECTRODE NOTCHING GENERAL LAYOUT
SOFT PACK SEALING
ELECTROLYTESOFT PACK DEGASSING ELECTROLYTEFILLING & SEALING
SOFT PACK DEGASSINGAND FINAL SEALING
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KEMET Electronics Italia
In line SPCELECTRODE NOTCHINGELECTRODE NOTCHING
Quality dataQuality dataOverall performancesOverall performances
Rewinding
Notching Dust collection
Electrode unwinding
Protection film
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KEMET Electronics ItaliaMONOCELL ASSEMBLY AND FOLDINGMONOCELL ASSEMBLY AND FOLDING
WindingIn line SPC
MONOCELL ASSEMBLY AND FOLDING MONOCELL ASSEMBLY AND FOLDING Quality dataQuality data
In line SPC
U th d
Overall performancesOverall performances
LaminationUpper cathode cutting and feeding
Cell extraction and sealing
Monocell assembly
Lower cathode cutting Anode electrode cutting and
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and feedingcutting and feeding
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KEMET Electronics ItaliaTAB TRIMMING & WELDINGTAB TRIMMING & WELDINGTAB TRIMMING & WELDING TAB TRIMMING & WELDING
Quality dataQuality dataOverall performancesOverall performances
Cell loading Tab Tape protection
Electrical testElectrical testTab trimming
1Cathode Tab Welding
Anode Tab Welding
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KEMET Electronics ItaliaSOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING and SEALING MACHINE SOFT PACK FORMING and SEALING MACHINE
Quality dataQuality dataOverall performancesOverall performances
Inkjet printing
Cell unloading
Cell trimming
Tab side Half shell trimming
g
Cold forming unit
Lateral side sealing
Cell insertion
Multilayer material unwinding
Tab side and bottom side sealing
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KEMET Electronics ItaliaELECTROLYTE FILLING MACHINE ELECTROLYTE FILLING MACHINE
Quality dataQuality dataOverall performancesOverall performances
C ll l di
Cell Unloadingin trays
Cell loadingfrom trays
Post weight & bar code reading
Cell pre-weight
code reading
Filling cycleVacuum chamber
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KEMET Electronics ItaliaCELL DEGASSING AND FINAL SEALINGCELL DEGASSING AND FINAL SEALINGCELL DEGASSING AND FINAL SEALING CELL DEGASSING AND FINAL SEALING
Quality dataQuality dataOverall performancesOverall performances
Cell loadingCell Unloading
g
Electrical test -
Degassing chamber
ect ca test
D i
v+
Final sealing and trimming
Degassing cycle
Vacuum
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWELECTRODE NOTCHING
• From reel to reel• From reel to magazine for notched an cutted electrodes• Electrodes vacuum cleaning after cuttingg g• Flexible notching tool• In line SPC• Incoming material Bar Code reader DIE CUTTING TECHNOLOGY - BURS CONTROL
<10 µm
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWMONOCELL ASSEMBLY LAMINATION & FOLDING
• Flexible assembly process (for different foor print and thickness)• High electrode placement accuracy (Cpk > 2)
M i i d P i ld• Maximised Process yield • In Line SPC• Stack wound assembly process• Minimum size parts required• Minimum size parts required• Incoming material Bar Code reader
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOW
Target of our Wound Stack assembly processTarget of our Wound Stack assembly processLaminate lithium battery electrodes to standard separators utilizing surface activation treatments (SAT) on the separators.
ValueEnable implementation of “wound stack assembly process” with “standard” separators providing higherEnable implementation of wound stack assembly process with standard separators providing higher precision, higher throughput assembly capabilities compared to a standard stack or z-folding assembly.
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KEMET Electronics Italia
WOUND STACK / LAMINATED ADVANTAGES GREATER PERFORMANCE GREATER SAFETY
•Creates a strong bond between the active materialsin the cell. This intimate connection between anodeand cathode maximizes cycling efficiency and
•The physical bonding of the electrodes ensure a fixing oftheir relative position over the lifetime of the cell. Constantexpansion and contraction of the electrode due to the Liy g y
reduces fade.
•The strong bonding maintains a constant ESR withless degradation due to cycling.
pshuttle will not cause the electrodes to shift, therebyeliminating potential shorts.
•Since the melting temperature of PVDF coating is greaterg y g
•The higher surface tension of the PVDF coating canassist in wetting the cell with electrolyte.
g p g gthen that of the polyethylene membrane, there is an addedstructural integrity of the separator during a thermal shut-down situation.
•Stress releaving of the electrodes over time isdimensionally contained
• Separator shrinkage in the „feeding direction“ is
GREATER OUTPUT
• The wound stack process provide a troughput atl t 2 ti f t th t diti l t k Separator shrinkage in the „feeding direction is
intrinsecally overcome by the cell design.least 2 times faster than any traditional stack process
• Continuous product flow vs the intermittent flow willprovide more stable and capable output
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWTABS TRIMMING & CURRENT COLLECTORS WELDING
• Flexible assembly process (for different foor print and thickness)• High cell placement accuracy (Cpk > 2)• Robots & visual inspection features for cell alignment• Robots & visual inspection features for cell alignment• Ultrasonic welding process for tab to current collector welding• Machine designed uptime = 100%• In Line SPCe S C• Incoming material Bar Code reader
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWSOFT PACK HALF-SHELLS FORMING, CELL INSERTION AND SOFT PACK SEALINGAND SOFT PACK SEALING
• Flexible assembly process (for different foor print and thickness)• High cell placement accuracy (Cpk > 2)• Robots & visual inspection features for cell alignment• Robots & visual inspection features for cell alignment
• “Deep Drawing” Cold forming process• Soft pack sealing based on “Fixed Gap” sealing processSo t pac sea g based o ed Gap sea g p ocess• In Line SPC• Bar code printing• Incoming material Bar Code reader
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWELECTROLYTE FILLING & SEALING
• Electrolyte filling in vacuum chamber• Different dispensing cycles available for customisation (recipes for
process aparameters recording)process aparameters recording)• Multiple cell filling station• Pre-post filling cell weight control• Different cell handling (from trays, in-line,…)e e t ce a d g ( o t ays, e, )• In Line SPC• Bar code reader for data traceability & Batch control
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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWSOFT PACK DEGASSING AND FINAL SEALING
• Degassing in vacuum chamber• Multiple cell degassing station• Sealing process based on fixed Gap method• Sealing process based on fixed Gap method• Different cell handling (from trays, in-line,…)• In Line SPC• Bar code reader for data traceability & Batch controla code eade o data t aceab ty & atc co t o
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KEMET Electronics Italia
ELECTRODE NOTCHINGELECTRODE NOTCHINGELECTRODE UNWINDINGELECTRODE UNWINDING•• Electrode unwinding from reel with adjustable tension controlElectrode unwinding from reel with adjustable tension control•• Maximum reel weight of 100 KgMaximum reel weight of 100 Kg•• Electrode edge alignmentElectrode edge alignment
M l l t d li iM l l t d li i•• Manual electrodes splicingManual electrodes splicing•• Splicing detection & flag detection systemSplicing detection & flag detection system
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BACKElectrode unwinding
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KEMET Electronics ItaliaNOTCHING TOOL NOTCHING TOOL
•• Single side notching die and single rewindingSingle side notching die and single rewindingR i t i t f d / th dR i t i t f d / th d
ELECTRODE NOTCHINGELECTRODE NOTCHING
•• Recipe storing system for anode / cathode Recipe storing system for anode / cathode handling on single machinehandling on single machine•• Easy tool changeoverEasy tool changeover
•• Flexibility of the electrode notching process. No Flexibility of the electrode notching process. No tool changeover is required for settled product tool changeover is required for settled product rangerange•• Notching tool stroke setteable on the HMI, no Notching tool stroke setteable on the HMI, no g ,g ,manual adjustmentmanual adjustment
•• Lubricant system for Aluminum foil cutting Lubricant system for Aluminum foil cutting availableavailable
Notching
availableavailable
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BACK
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KEMET Electronics Italia
Anode electrode
tti dDuring anode insertion is
t ti ll t d th
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cutting and feeding
automatically generated the increased gap between consecutive monocells.
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KEMET Electronics ItaliaExternal electrodes are placed on the inner electrode. High resolution encoders are used to control the
Upper cathode cutting and feeding
placement accuracy
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KEMET Electronics Italia
Monocell assembly
The increase gap lenght ist ll d d i th t l
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controlled during the centralelectrode introduction, andcan be set from the HMI
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KEMET Electronics Italia
LaminationLamination
Parameters can be adjusted:
Temperature
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- Temperature- Pressure- Gap
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KEMET Electronics Italia
In line SPC
A5A5
A2 A3
Gap2
W Cathode W Anode
p
• For each monocell different parameters aremeasured• All the measured value are stored into an Excel file
A1 A4
Gap1• Image saving option available (to save the scrapproduct images)• If one parameter fail, the strip is sorted out
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A1 A4
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KEMET Electronics ItaliaKEMET Electronics Italia
Winding
Strip alignment based onVision System inspection
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Vision System inspectionand servo driven frictionedroller
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KEMET Electronics Italia
A KEMET Company
Progressive Gaps
P C bilit f M ll G
Single GapLSL USL
Process DataLSL 2,60000Target *USL 3,20000 B/W C apability
B/WOverall
Process Capability of Monocell Gap
Sample N 419StDev (Between) 0,06756StDev (Within) 0,00000StDev (B/W) 0,06756StDev (O v erall) 0,06584
USL 3,20000Sample Mean 2,87874
C C pk 1,48
O v erall C apability
Pp 1,52PPL 1 41
C p 1,48C PL 1,38C PU 1,58C pk 1,38
5 0
Progressive Gaps
3,203,123,042,962,882,802,722,64
PPL 1,41PPU 1,63Ppk 1,41C pm *
5,0
4,5
4,0
3,5
3,0
O bserv ed PerformancePPM < LSL 0,00PPM > USL 0,00PPM Total 0,00
Exp. B/W PerformancePPM < LSL 18,50PPM > USL 0,99PPM Total 19,49
Exp. O v erall PerformancePPM < LSL 11,51PPM > USL 0,53PPM Total 12,05
mm
3,0
2,5
2,0
1,5
1,0
Progressive Gaps
29 Gap 8Gap 7Gap 6Gap 5Gap 4Gap 3Gap 2Gap 1
1,0
0,5
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KEMET Electronics Italia
A KEMET Company
TAB TRIMMING & WELDINGTAB TRIMMING & WELDING R b tTAB TRIMMING & WELDING TAB TRIMMING & WELDING Robot
Back
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KEMET Electronics Italia
A KEMET Company
SOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING and SEALING MACHINE SOFT PACK FORMING and SEALING MACHINE
Cell trimming
Side Sealing
Ink Jet PrintingPrinting (Bar code)
Cell Unloading in trays
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KEMET Electronics Italia
KEMET El t i It li S lKEMET Electronics Italia S.r.l.A Kemet Company
Via San Lorenzo, 19
I - 40037 Sasso Marconi (BO) Italy
Claudio Lanciotti
R&D Product Manager
Phone (+39) 051 939111
Fax (+39) 051 842890
Phone (+39) 051 939460
32www.kemet.com