2222ndnd IEEE VLSI Test IEEE VLSI Test SymposiumSymposium(VTS 2004)(VTS 2004)
Napa Valley, CANapa Valley, CA
Welcome MessageWelcome Message
André IvanovAndré Ivanov
General ChairGeneral Chair
Keynote AddressKeynote Address
Ulrich SeifUlrich SeifSenior VP & Chief Information Officer Senior VP & Chief Information Officer
National SemiconductorNational Semiconductor
Program Program IntroductionIntroduction
Irith PomeranzIrith Pomeranz
Program ChairProgram Chair
The VTS ContentsThe VTS Contents Technical Paper SessionsTechnical Paper Sessions Special SessionsSpecial Sessions Innovative Practices TrackInnovative Practices Track
Technical Paper SelectionTechnical Paper Selection
Expert reviewers recommended by Expert reviewers recommended by the program committeethe program committee
At least three reviews for every At least three reviews for every submitted papersubmitted paper
Multi-site program committee Multi-site program committee meeting (Fremont, CA; Princeton, meeting (Fremont, CA; Princeton, NJ; Stuttgart, Germany)NJ; Stuttgart, Germany)
ThanksThanks 38 program committee members38 program committee members 13 organizing committee member13 organizing committee member 7 steering committee members7 steering committee members 237 reviewers237 reviewers 747 reviews747 reviews
Special ThanksSpecial Thanks Program committee membersProgram committee members
Hans ManhaeveHans Manhaeve Subhasish MitraSubhasish Mitra Sudhakar ReddySudhakar Reddy
Organizing committee membersOrganizing committee members Pritha RoyPritha Roy Burnie WestBurnie West
Technical Paper SessionsTechnical Paper SessionsTest Data Compression & Low-Speed ATEMemory Testing I,II Issues in Reliability
Logic BISTMEMs Testing and FPGA Testing
Wireless and System Testing
Current Based Testing
SoC Testing
Pattern Debug, Yield Analysis and FPGA Testing
Low-Voltage and Thermal Testing
Defect-Oriented Testing
Defect Analysis and Fault Simulation
DelayTesting
Analog Testing I,II,III
IP TrackIP Track Silicon Debug and DiagnosisSilicon Debug and Diagnosis Test and Repair of Large Memory SystemsTest and Repair of Large Memory Systems Test CompressionTest Compression Latest Results in Wireless TestLatest Results in Wireless Test SoC Test Practice in JapanSoC Test Practice in Japan Leading Edge Practices for Yield Leading Edge Practices for Yield
EnhancementEnhancement Optimizing Manufacturing ProcessOptimizing Manufacturing Process
Special SessionsSpecial Sessions Embedded Tutorials:Embedded Tutorials:
Challenges in Embedded Memory Test and DiagnosisChallenges in Embedded Memory Test and Diagnosis Advances in Wafer Probe TestAdvances in Wafer Probe Test Reliability and DependabilityReliability and Dependability Design for YieldDesign for Yield Design for ManufacturabilityDesign for Manufacturability
Hot Topics:Hot Topics: Testing of Nanocircuits with High Defect DensitiesTesting of Nanocircuits with High Defect Densities Advances in 3D PackagingAdvances in 3D Packaging Software Based Embedded TestSoftware Based Embedded Test
Panels:Panels: Elevator TalksElevator Talks Process Variation: How Severe is the Problem of D&T?Process Variation: How Severe is the Problem of D&T? Defect-Based Testing and Burn-In: A Test Solution for Scaled Defect-Based Testing and Burn-In: A Test Solution for Scaled
Technology?Technology?
Invited KeynoteInvited Keynote
Kamalesh RuparelKamalesh RuparelSenior DirectorSenior Director
Cisco SystemsCisco Systems
TTTC Ned Kornfield TTTC Ned Kornfield Memorial Memorial
PresentationPresentation
Yervant ZorianYervant Zorian
TTTC Senior Past ChairTTTC Senior Past Chair
AwardsAwards
TTTC Naveena Nagi TTTC Naveena Nagi AwardAward
TTTC Most Successful TTTC Most Successful Technical Meeting Technical Meeting
AwardAward
TTTC Most Populous TTTC Most Populous Technical Meeting Technical Meeting
AwardAward
VTS 2003 Best Paper VTS 2003 Best Paper AwardAward
VTS 2003 Best Panel VTS 2003 Best Panel AwardAward
VTS 2003 Best IP VTS 2003 Best IP Session AwardSession Award