© 2006 IBM Corporation
Collaborating to Design Power Supplies
Giacomo Catucci Alfredo FappianoRick Fishbune Eric Swenson
ISC Engineering
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© 2006 IBM Corporation
IBM Customer Expectations
ValueCompetitive cost
“ Bulletproof ” ReliabilityNo downtime
Leading PerformanceDynamic workload management
Industry leading clustering
QualityFlawless hardware Installation and manufacturing
execution
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© 2006 IBM Corporation
Introduction
Power designs are becoming increasingly complex.
Today’s design requirements span a breadth of expertise not residing in any one group alone.
Multiple issues have surfaced design weaknesses due to component selection and application.
Collaboration is necessary for end product quality and customer satisfaction.
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Objective
To implement a collaborative design process between power assembly supplier, ISC Engineering, and component suppliers.
Proposed methodology will include:– Component selection
– Collaborative team meeting : Critical power train circuit review
– Qualification
Challenges and Benefits
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Power Supply Development Models Over the Years
DefinitionsBlue Box: IBM designed power supply and IBM built power supply. Main model in 1970’s for power supply assemblies.White Box: IBM designed power supply. Supplier built. Components typically consigned by IBM. Main model in 1970’s and early 1980’sGray Box: IBM designed power supply. Supplier built. Components purchased by supplier. Main model from 1980’s to today for high-end power and some mid-range assemblies.Black Box: IBM defines requirements in an engineering specification and mechanical print. Supplier designed power supply. Supplier built. Supplier owns bill of material which is reviewed and approved by IBM. Main model from 1980’s to today for low-end and mid-range power.
Development and Process Steps remain essentially the same for the various development models. Main difference is who is the owner of the step.
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Power TrendsIncreasing Requirements
– Reliability
– Power Density
– Transient Response
– Efficiency
– Current
– Hot Swap / Redundancy
Decreasing Requirements– Voltages
– Cost
– Development Cycles
1998 2000 2002 2004 2006 2008
Low EndHigh End
0
5
10
15
20
25
30
35
40
Year
Power Density (W/cu-in)
Low End High End
Processor Voltage/Current Trends
0
0.5
1
1.5
2
2.5
3
1998 2000 2002 2004 2006 2008
Year
Pro
cess
or V
olta
ge (V
)
020406080100120140160180
Pro
cess
or C
urre
nt (A
)
Voltage Current
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Brand Subsystem Plan• Subsystem Architecture• Power / Packaging Req.• Competitive Analysis
Power Products – “End to End” Process Management
KickOff
Prelim.Docs
CaptureRequirements
AnalysisDesign
Interlock
DevelopmentProcurementQualification
Suppliers
Source
RFI / RFQSuppliers
SupplierResponseEvaluation
DecisionAnalysis
DevelopmentProcurementQualification
Quality
Award ofBusiness
Develop
DesignReview
DevelopmentProcurementQualification
QualitySupplier
DevelopmentProduct Safety
EvaluationFunctionalEvaluationReliability
Plan ReviewPN/FRU Reliability
ME Doc Setup
Qualification Tests(Supplier / IBM)
Test-to-SpecVerificationComponentAssessmentSystem Level
TestingMfg. AssessmentProcess Review
Commodity SafetyAgency Approval
ReliabilityVerification
Qualify
SystemIntegrationTest (SIT)
TUC “B”Checkpoint
Supplier ProductionProcess Review
SystemSafety Approval
FOT / ELP2Support
GeneralAvailability
Track / Improve / ReportSupplier Line Fallout
IBM FFC Mfg. IQL
Customer Returns
Supplier Site Audits
Data Collection andFailure Analysis (SQMS)
Supplier Assessment and Surveillance (QIN)
Problem ManagementSupplier IBM Brand
Management Performance Reviews-Supplier performance Review-Monthly Quality Reviews-Monthly Brand Quality Reviews
Change Management-Supplier Design and Parts Control-IBM Design and Doc. Control-IBM FFC Production Control
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Strengths and Weaknesses of Current Process
StrengthsWell defined sourcing model
– Design, quality, and commercial teams involved
Design reviews early in process– Topology review
– Mechanical and connectors
– Test requirements
Development process– Design analysis checklist process
– Component derating guidelines
– Anti-smoke checklist and testing
Quickly adapting to changes– Schedule shifts
– Requirements changes
State-of-the-art reliability testing– HALT / Guardband
– Thermal imaging
Lessons learned process– Processes updated based on past issues
WeaknessesSchedule maintenance
– Not completing tests on schedule
– Incomplete testing causing extra design passes
– Reliability tests later in design process
New power assembly suppliers have difficult time with established processes
– Design verification process
– Production test requirements
– Spacing guidelines
– Derating guidelines
– Anti-smoke requirements
Limited component evaluation– Supplier sources used in critical applications
– Supplier component qualification process
– Application review
– Continuity of supply / alternate source issues
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Collaboration
IBM
Power Assembly Supplier Component Supplier
Collectively leverage our individual core competencies
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Proposed Methodology (Collaboration)
Component Selection
Use of Preferred SuppliersComponent supply base should be reviewed and agreed upon by the collaborative teamDefine criteria and process to adopt a new supplier
Cost and delivery schedule should not be the only deciding factors in component selection
Component supplier should demonstrate component performance withmeasured electrical, thermal, and reliability data
Reliability stress should simulate worst case application conditionsWell defined quality and reliability support structureField Applications Engineering support
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Proposed Methodology (Collaboration)
Collaborative team meeting : Critical power train circuit reviewIBM, Power Assembly Supplier, and Component Supplier to ensure:
Early involvement to review critical circuits for optimum resultsDerating / Anti-Smoke application requirements are met
IBM Derating Specification 97P3214IBM Anti-Smoke Specification 97P4412 and checklist
Use of lessons learned and judgment based on experienceSingle point of failure eliminationComponents to be selected such that sufficient margin is available with respect to design requirementsComponent application approvalBest technology/best practices are employedTechnology is well matched to the application (suitable)
Topology vs. component technologyRuggedness
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Qualification
Define qualification requirements for critical components and power assembly:Key MOSFETs, Caps (Bulk, Filter, etc.), PCBs, Magnetics, Power ICs (controllers, switching regulator, etc)Requested tests may be in addition to industry standard qualification testingAll component types should have a minimum qualification standardCollaborative FMEA Review and corrective actions for HALT testingIncorporate smoke testing earlier in design processEarly thermal testing using both thermocouples and IR thermal analysis
Qualification matched to system level needsDifferent systems may require different levels of qualificationCorner testing
Testing should be performed under high and low combinations of voltage, temperature, load, etcWorst case component environment should be considered
Voltage, temperature, humidity, elevation (due to cooling effectiveness)
Define the process to review and approve changesPCNs and additional sources
Agreed to definition of a critical PCN or source changeTo test, or not to test?
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ChallengesImplementation
Reviews can be time consuming and it may take time to get final approvalsGetting appropriate component supplier subject matter expert to attend
– Many different key suppliers in a design– Will require many meetings – one per critical component supplier
Alternate sources – How do you deal with multiple suppliers for critical components?Adding tasks to the current design process – change can be hard
Resources
Collecting information for reviewRedirecting the resources in the process
– To perform and/or review component qualification work– To monitor supplier processes and changes
Travel – audits and other supplier visits
Business
Sharing proprietary information – 3 way NDA’sAdded direct cost for qualification and reviewsMay reduce the available approved component supplier setBuy-in… is it really worth the added time and effort?
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Main Benefit – Fewer Component IssuesThe main benefit of all this work is to eliminate field issues like:
Misused MOSFET
Core Material Issue
Good Material Bad Material
Cracked Capacitor – Layout Issue Overstressed Capacitor
Tantalum < 3X Voltage Derating
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Return on Investment
Improved Customer Satisfaction
Improved Customer Satisfaction
Improved Customer Satisfaction
Ongoing successOngoing successOngoing success
Improved relationshipImproved relationshipImproved relationship
Improved reliabilityImproved reliabilityComponent reliability feedback process
Reduced warranty costsReduced warranty costs(reduced RMA requests)
Reduced warranty costs (reduced RMA requests)
Reduced customer returns & expended FA resources
Reduced customer returns & expended FA resources
Reduced customer returns & expended FA resources
Reduced power assembly cost
Reduced BOM cost through optimized component usage
Reduced manufacturing costs by designing in newer technologies/products
IBMPower Assembly Supplier
Component Supplier
Red
uced
Cos
tsC
ustS
at &
Gro
wth
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Summary
Today’s design requirements span a breadth of expertise not residing in any one group alone. We need to leverage the resources we have.
A collaborative design process was reviewed which includes component selection, a collaborative team review meeting of the critical power train circuits, and qualification that would improve end product quality and customer satisfaction.
We acknowledge the investment but recognize the benefits for everyone. Our collective success depends on our ability to collaborate.