Download - Activité LPNHE en 2012 et 2013
Activité LPNHE en 2012 et 2013
G.Calderini
Tracker upgrade
IBL Phase-0- Simulations of sensors and evaluation productions (during the last few years, now over for IBL)- Testbeams- IBL stave loading, testing and commissioning at Uni-GE and CERN - Mechanics (see Didier’s transparencies)Phase-2 and core R&D- Development of sensor simulations models- Edgeless sensors- Testbeam organization- Electronics and R&D on interconnections- ATLAS Track trigger (AM chip)
The LPNHE group is involved both in Phase-0 (IBL)and Phase-2 activities
Planar Slim Edgesensors (CiS)- Oxygenated n-in-n- 200 um thick- guard rings under
pixels - 215um inactive
reg.
3D Slim Edgesensors (FBK +CNM)- p-type- 230 um thick- 200 um inactive
reg.
(Option 1: 100% planar pixel sensors)Option 2: 75% planar pixel, 25% 3D
Activities Starting Ending
FEI4-B Sept 11: Submission Dec 11 for wafer tests
Bump bonding Aug 11: pre-production Sept 12: Completion
Module assembly Feb 12: 1st modules ready for loading
Oct to Dec 12
Module loading Feb 12: 4 staves to be ready by Apr/May 12
Jan 13: Completion
Stave loading Sep 12: starting with the 1st available staves
Feb – Mar 13: Completion
Final tests and commissioning
Sep 12 Jul 13: IBL Installation
IBL schedule key dates
LPNHE group should contribute to about two weeks ofshifts (2012) and 3 weeks (2013) in the UNI-GE cleanroom
2012 testbeam effort In 2012: 5 test-beams, about 30 persons in total to evaluate PPS and 3D (+DBM)
The LPNHE group contributed with persons andhardware from our electronics pool.
Mechanics
See Didiers’ transparencies
Phase-2 and core R&D Device simulations (Silvaco)General expertiseDevelopment of specific modelsWork to extend to n-in-p sensors the model of interface defect traps developed for n-in-n devices Insertion of intermediate levels in the gap to reproduce theSi/SiO2 interface defectsAfter radiation and better describe the leakage currentand breakdown behavior
Good agreement with Measurements on ourn-in-p device production
Edgeless sensors with DRIE (FBK/LPNHE project)
Deep trench diffusion(to prevent electricalfield on the damagedcut)
Cut lineTrench definition is critical:- aspect ratio: 20:1- deep etching: 200-230um- trench width: 8-12um
● Goal: make the rim zone equipotential● How: DRIE as for 3D process● Trench doped by diffusion
Electronics
Interest for 65nm electronicsLPNHE is also part of the AIDA EU project(providing a number of IP blocks for WP3)
Expertise in radiation tests from previous experiments of people (BaBar / ILC)
Fastening to shuttle
TOP
BOTT
OM
Support card for OmegaPix irradiation tests
Contributions to OmegaPix2 chips
One slide on track trigger FastTracKer : a hardware track finder for ATLAS
Trigger Full silicon detector acceptance,
pT > 1 GeV Tracks with ~offline quality reconstructed
parameters available to level-2 processors FTK reads hits at L1 rate and reconstructs the
event in ~100 μs Two step algorithm:
Pattern recognition with Associative Memory (ASIC)
Linear PCA-based track fit with FPGAs
Associative Memory (AM) ASIC: the core processor of the pattern recognition stage.
Evolution of the AMchip03 of SVT (CDF)Current prototype AMchip04 done and
under testing: 65 nm technology (SVT chip was
180 nm) 8k patterns/chip (5k patterns/chip) Ternary logic for variable resolution
(new feature)AMchip05 (FTK final chip candidate): 32k – 64k patterns Serial links
Persons involved at LPNHE T.Beau (MdC, P7)M. Bomben (CDD-HN)G.Calderini (DR2 CNRS)J.Chauveau (PR, P6)G.Marchiori (CR2 CNRS)P.Schwemling (PR, P7)D. Laporte (IE, CNRS)F. Crescioli (IR, CNRS)F. Dematos (IR, CNRS)O.Le Dortz (IR, CNRS)J.F. Genat (IR, CNRS)
Funding / support expected/obtained from: ATLAS and laboratory (IN2P3)EUDET and AIDA EU projectsEmergence (UPMC Project)EU FP7 (IAPP already approved project)
L. Bosisio (invited from Univ.Trieste)R. Kass (invited from Ohio State U.)
Realizations/expenses 2012 1) Phase-0 achievements using funds
5 KE
Testbeam and commissioningMechanics prototyping
Expenses IBL (missions excluded)
Cleanroom material
2) Phase-2 achievements using funds
3 KE FE-I4 wafer procurement4 KE Thin detector production (MPI)10 KE Semiconductor parameter analyzer
(cards still to buy)
FBK sensor production support Participation to n-in-p slim productions (MPI, down to 150um) as support for interconnectionstudies (see Abdenours’ talk)
Total of 22KE engaged out of 21 received
Funding requests for 2013 1) ATLAS related general needs
0 KE2) Strictly IBL-related
5 KE cleanroom ordinary metabolism(+ 18KE asked to Christophe to equip the Semiconductorparameters analyser with SMUs)
Funding requests for 2013 3) More general R&D 0* KE interconnections30 KE edgeless R&D (bump-bonding of produced devices, already mentioned last year)5 KE SIMS on produced devices4 KE Support to ATLAS track trigger work 4 KE Mechanics
TOTAL: 50KE
4) Participation in RD502 KE participation
(Missions not dicussed here)
backup
• Installation of a 4th pixel layer inside the current pixel detector:
• performance of current pixel detector will degrade before main tracker upgrade (Phase 2)
• maintain physics performance in high occupancy environment (higher granularity, r/o bandwidth)
• increase radiation hardness (IBL fluence ~ 5x B-Layer fluence)
• Insertable B-Layer
• 250 Mrad TID and 5x1015 neqcm-2
• installation originally planned for 2015-2016… advanced (in 2011) to 2013 (Fast-track IBL)
• IBL mounted on new beam pipe• Length: ~64cm • Envelope: Rin = 31mm, Rout=40mm• 14 staves, 32 pixel sensors / stave.• Front-end chip:
• FE-I4 (IBM 130 nm CMOS tech.)
• 50μm x 250μm• 80(col) x 336 (rows) = 26880
cells.• 2cm x 2cm!
IBL
Pixel
A word on RD50 We have been contacted several times and invited to join the RD50 collaboration We think that this point has to be discussed more generally at ATLAS (/IN2P3) level. The fee is ~negligible (1400 CHF/year/group) but then sooner or later we will need to contribute to at least some of the RD50 detector productions (each time the contribution is typically of order of 5-10KE)
Scientifically it would probably be worthwhile, but the funding aspect has to be discussed in ATLAS