Ultra Wearable Development Platform User Guide
EB100 Version 1.0, June 2015
2
Ultra Wearable Development Platform
IntroductionThe Ultra Wearable Development Platform is an easy-to-use platform that demonstrates some of the ways that the Lat-tice iCE40 Ultra and MachXO2 FPGAs can be utilized in wearable or mobile applications. Along with the evaluation board and accessories, there are several projects available to demonstrate the functionality of the boards and compo-nents.
The Ultra Wearable Development Platform consists of two boards: the Main Board and the Sensor Board. The Main Board contains the Lattice iCE40 Ultra and MachXO2 FPGAs, which drive various components on the board. The Lat-tice iCE40 Ultra focuses on driving peripheral components such as LEDs, sensors and BLE connectivity. The Lattice MachXO2 focuses on driving the MIPI DSI Display from a Quad SPI flash used for frame buffer and storage. The Sensor Board contains several sensors that are typically found in mobile and wearable devices. The Sensor Board can be removed, providing access to the power and peripheral connections.
The contents of this user guide include a description of the board features, header connection descriptions and pinouts, instructions on loading demonstration bitstreams, a complete set of schematics, and the bill of materials.
FeaturesThe Ultra Wearable Development Platform includes:
• Ultra Wearable Development Platform Main Board:— iCE40 Ultra (iCE5LP-4K-SWG36) device in a 36-ball WLCSP package— MachXO2 (LCMXO2-2000ZE-1UWG49) device in a 49-ball WLCSP package— High-current IR, White, and RGB LEDs— Stereo Microphones— Connector and driver circuitry for MIPI DSI Display— Headers for I2C, SPI, and UART— Mini-USB programming connection— Battery charger— RoHS-compliant packaging and process
• Ultra Wearable Development Platform Sensor Board:– Bluetooth Low-Energy Module– Heart-rate/SpO2 Sensor and Analog Front End– Skin temperature sensor– Pressure sensor– Accelerometer/Gyroscope– Pads for soldering on battery (charger accepts Li-Ion and Li-Po)
• Syma 652030 Battery – 3.7 V, 250 mAh Lithium-Polymer Battery provides power while the USB cable is discon-nected
• LG LH154Q01 Display – 240x240 Single Lane MIPI DSI Display. Must be attached prior to power-up
• USB Connector Cable – A mini-USB port provides power and a programming interface for the board
• Watch Strap – A watch strap comes pre-attached to the Sensor Board
Note: Static electricity can severely shorten the lifespan of electrical components. Use care while handling the Ultra Wearable Development Platform to avoid ESD damage.
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Ultra Wearable Development Platform
Figure 1 through Figure 4 show the top and bottom sides of the Main and Sensor boards, with key features high-lighted.
Figure 1. Main Board (Top Side)
Figure 2. Main Board (Bottom Side)
Reset Button
User LEDs (XO2)
RGB LED
High-Brightness LED
IR LED
Battery Charger Status LEDs
Microphone (L)
Display ConnectorMachXO2
iCE5LP Config LED MachXO2 Config LED
iCE5LP
FTDI Power JumperLED Select Jumper
Microphone (R)
Power Switch
FTDI Programming Chip
Mini -USB Socket
Battery Charger
Backlight Driver
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Ultra Wearable Development Platform
Figure 3. Sensor Board (Top Side)
Figure 4. Sensor Board (Bottom Side)
Heart Rate/Oxygen Sensor Analog Front End
Bluetooth Low -Energy Module
Pressure Sensor
Accelerometer/Gyroscope
Heart Rate/Oxygen Sensor
Skin Temperature Sensor
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Ultra Wearable Development Platform
Lattice Semiconductor DevicesThe Main Board features an iCE5LP4K and a MachXO2-2000ZE FPGA.
The iCE5LP4K has a 1.2 V core supply and is packaged in a 36-ball WLCSP package. For a complete description of this device, see DS1048, iCE40 Ultra Family Data Sheet.
The MachXO2-2000ZE has a 1.2 V core supply and is packaged in a 49-ball WLCSP package. For a complete description of this device, see DS1035, MachXO2 Family Data Sheet.
Software RequirementsThe following software must be installed before designs can be developed for this board:
• iCEcube2 2014-12 (or higher)
• Diamond® 3.4 (or higher)
• Diamond Programmer 3.4 (or higher)
This software is available at the Lattice website Design Software & IP page.
Board PowerThe Ultra Wearable Development Platform uses the USB connection as its primary source of power. It is also equipped with a battery and charger for use without a wired connection. A power switch (SW2) allows for the regu-lators to be disabled while allowing the battery to continue charging. Two status LEDs allow the battery charger to be monitored (see Table 12).
The battery charger and regulators are located on the Main Board. The battery attaches to the Sensor Board. Power is transferred between the two boards using the Power Connector header. See Table 2 for connections.
The VREG_ADJ I/O supply net for the iCE5LP is adjustable, but is an internal, reserved feature. Changing this net from 3.3 V (default) to 1.8 V will cause voltage-level mismatches that can permanently damage the iCE5LP.
To allow current measurements to be made for specific supplies, resistors with test points have been inserted into the circuit. Refer to Table 1 to see which test points correspond to which supplies.
Table 1. Supply Current Test Points
Supply TP+ TP- Resistance
MachXO2 1.2 V TP20 TP21 0.5 Ohms
MachXO2 3.3 V TP18 TP19 0.5 Ohms
iCE5LP 1.2 V TP20 TP33 0.5 Ohms
iCE5LP 3.3 V TP18 TP32 0.5 Ohms
3.3 V Regulator TP16 TP17 0.5 Ohms
Display 3 V TP25 TP24 0.5 Ohms
Display 1.8 V TP22 TP23 0.5 Ohms
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Ultra Wearable Development Platform
HeadersFour headers are used to connect the Main Board and the Sensor Board. The signals and connections are shown in the tables below:
Figure 5. Headers
Power Connector (Main Board J7, Sensor Board J5): Power connection between the two boards
Table 2. Power Connector
I2C Connector (Main Board J5, Sensor Board): Interface for pressure sensor, temperature sensor, and accelerom-eter/gyroscope
Table 3. I2C Connector
SPI Connector (Main Board J6, Sensor Board): Interface for the Analog Front-End of the Heart Beat/SpO2 sensor
Table 4. SPI Connector
Pin Number Signal Description
1 3V3 Regulated 3.3 V supply
2 BT_3V7 Unregulated ~3.7 V battery voltage
3 VREG_ADJ Adjustable I/O Voltage (3.3 V default)
4 GND Ground
Pin Number Signal iCE5LP Ball #
1 Sensor SCL C1
2 Sensor SDA E2
Pin Number Signal iCE5LP Ball #
1 AFE SCLK D6
2 AFE MISO F6
3 AFE Ready B5
4 AFE SS D5
5 AFE MOSI E6
6 GND —
SPI Connector
I2C Connector
Power Connector
BLE Connector
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Ultra Wearable Development Platform
BLE Connector (Main Board J3, Sensor Board): Contains a UART connection to iCE5LP and a configuration SPI connection for the iCE5LP
Table 5. BLE Connector
JumpersThe following jumpers can be used for adjusting board functionality:
• High-current LED select (J50): Controls whether the IR LED (1+2) or High-current White LED (2+3) is driven by the iCE5LP device
• FTDI Power (J51): To minimize power consumption and increase battery life, the FTDI programming chip can have its power supply cut-off by removing the jumper from J51. J51 must be in place prior to powering up in order to program the devices on this board.
Pin Number Signal Ball #
1 BLE Prog MachXO2 G2
2 BLE SS Config
3 BLE MISO Config
4 BLE MOSI Config
5 BLE SCLK Config
6 CRSTb —7 CDONE MachXO2 E3
8 UART Rx (out) iCE5LP F5
9 UART Tx (in) iCE5LP E5
10 GND —
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Ultra Wearable Development Platform
Test PointsSeveral test points have been included into the design to ease debug. Descriptions of these test points can be found below:
Table 6. Main Board Test Points
Test Point Signal/Function
1 Configuration Signal: CResetn_FTDI
2 Configuration Signal: iCE_CDONE
3 Configuration Signal: FTDI_TCK (XO2)
4 Configuration Signal: FTDI_TDI (XO2)
5 Configuration Signal: FTDI_TDO (XO2)
6 Configuration Signal: FTDI_TMS (XO2)
11 Configuration Signal: JTAGEN (XO2)
12 Configuration Signal: PROGRAMN (XO2)
13 Configuration Signal: INITN (XO2)
16 Current Measurement (See Table 1)
17 Current Measurement (See Table 1)
18 Current Measurement (See Table 1)
19 Current Measurement (See Table 1)
20 Current Measurement (See Table 1)
21 Current Measurement (See Table 1)
22 Current Measurement (See Table 1)
23 Current Measurement (See Table 1)
24 Current Measurement (See Table 1)
25 Current Measurement (See Table 1)
28 Configuration Signal: FLASH_MISO (iCE)
29 Configuration Signal: FLASH_MOSI (iCE)
30 Configuration Signal: FLASH_CSB (iCE)
31 Configuration Signal: FLASH_SCLK (iCE)
32 Current Measurement (See Table 1)
33 Current Measurement (See Table 1)
34 3.3 V Regulator Output Control (See TPS7A7200)
35 3.3 V Regulator Output Control (See TPS7A7200)
36 3.3 V Regulator Output Control (See TPS7A7200)
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Ultra Wearable Development Platform
Table 7. Sensor Board Testpoints
Device InterconnectsSix general purpose connections have been made between Lattice MachXO2 and iCE5LP devices for communica-tion between FPGAs. Level translators have been implemented on these lines, which limit their operation fre-quency. Table 8 lists connection ports and maximum operation frequencies:
Table 8. MachXO2 and iCE5LP Interconnections
Test Point Signal/Function
1 AFE4403: CLKOUT
2 BLE Config: SWCLK
3 LPS25H: INT1
4 AFE4403: TX3
5 AFE4403: INN
6 AFE4403: INP
7 AFE4403: ADC_RDY
8 AFE4403: LED_DRV_SUP
9 AFE4403: VCM
10 AFE4403: TXP
11 AFE4403: TXN
12 Battery Connector (+)
13 Battery Connector (-)
14 LSM330DLC: INT1_G
15 LSM330DLC: INT2_G
16 BLE Config: SWDIO
17 AFE4403: Manual Reset, short to TP18
18 AFE4403: Manual Reset, short to TP17
Net Number MachXO2 Ball iCE5LP Ball Max Frequency
1 E6 C2 20 MHz
2 E5 B1 20 MHz
3 D5 D2 100 MHz
4 D4 B2 100 MHz
5 G4 B4 100 MHz
6 F4 F4 100 MHz
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Ultra Wearable Development Platform
DisplayThe Ultra Wearable Development Platform includes an LG LH154Q01 Display and necessary driving circuitry. MIPI DSI clock and data signals are driven by the Lattice MachXO2 device, through a resistor network for achieving proper voltage levels. This display also provides a frame-sync signal, B_Sync, which is routed to a MachXO2 pin. Display supplies and the backlight driver are controlled by outputs from the MachXO2.
Table 9. Display Signals
Note: For the high-speed differential signals (Clock HS, Data HS) only the positive channel must be assigned, the negative channel will be automatically placed.
Clock SourcesThe Main Board has a single 27 MHz clock source that connects to the Lattice MachXO2 device. To use this exter-nal clock with the iCE5LP device, the 27 MHz clock can be routed from the MachXO2 via one of the six general purpose interconnects. These connections can be found in Table 8.
Table 10. Clock Sources
Reset ButtonA button (SW1) is included for performing resets of systems on board the Ultra Wearable Development Platform. By default, this button will perform a configuration reset of the iCE5LP and the Bluetooth module. Reset functional-ity can be added to the MachXO2 by inserting a resistor as described below:
Table 11. Reset Resistors and Pins
Note: If VREG_ADJ (See Board Power section) is changed, R62 and R63 must be removed.
Signal MachXO2 Ball I/O Type
Clock HS+ C4 LVDS25
Clock HS- D3 (Auto) LVDS25 (Auto)
Clock LP+ C7 LVCMOS12
Clock LP- C6 LVCMOS12
Data HS+ C1 LVDS25
Data HS- D2 (Auto) LVDS25 (Auto)
Data LP+ A7 LVCMOS12
Data LP- B6 LVCMOS12
Reset B2 LVCMOS33
B_Sync A3 LVCMOS33
Backlight PWM C3 LVCMOS33
3 V Enable C2 LVCMOS33
1.8 V Enable E2 LVCMOS33
Source Frequency XO2 Ball iCE Ball
Oscillator 27 MHz E4 —
Device Resistor FPGA Ball
MachXO2 R110 B3
iCE5LP R62 —Seeed BLE R63 —
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Ultra Wearable Development Platform
LEDsThe Main Board has four system status LEDs, two user LEDs, an RGB LED, an IR LED, and a flashlight LED. These functions are detailed below:
Table 12. Main Board LEDs
Sensors and PeripheralsThe Ultra Wearable Development Platform utilizes several third-party devices. Links for more information can be found below:
Table 13. Main Board Sensors and Peripherals
LED Number XO2 Ball iCE Ball Function
D1 — — Power Source Connected
D2 — — Battery Charging
D3 Config — XO2 CDONE
D4 E7 — User LED
D5 F7 — User LED
D8 — Config iCE CDONE
D9 (R) — C6 RGB LED (Red)
D9 (G) — B6 RGB LED (Green)
D9 (B) — A6 RGB LED (Blue)
D10 — A2* IR LED (See Jumpers Section)
D11 — A2* Flashlight LED (See Jumpers Section)
NameReference Number Interface
FPGA Connections Part Number Link
Microphone U6, U7 I2S iCE5LP: Clock (F3), Data (E3)
MP34DB01 http://www.st.com/web/en/catalog/sense_power/FM125/SC1564/PF250941
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Ultra Wearable Development Platform
Table 14. Sensor Board Sensors and Peripherals
Flash Memory DevicesThe Lattice MachXO2 and iCE5LP are each equipped with an external SPI Flash memory device.
Table 15. Flash Devices
The iCE5LP external Flash memory is intended for holding configuration data, while the MachXO2 external Flash memory is intended for storing data, such as images for the included display. Because of the target application, the Flash device connected to the MachXO2 is capable of using the higher-bandwidth Quad-SPI protocol.
Table 16. Flash Connections
NameReference Number Interface
FPGA Connections Part Number Link
Temperature Sensor
U7 I2C See Table 3 TMP112 http://www.ti.com/prod-uct/tmp112
Pressure Sensor U3 I2C See Table 3 LPS25H http://www.st.com/web/catalog/sense_power/FM89/SC1316/PF255230
Accelerometer/Gyroscope
U4 I2C See Table 3 LSM330DLC http://www.st.com/web/en/catalog/sense_power/FM89/SC1448/PF252427
Heart Rate & Oxygen Sensor
U6 — — SFH7050 http://www.osram-os.com/osram_os/en/products/product-promo-tions/infrared-products/sensor-family/biomon-sensor-sfh-7050/index.jsp
Analog Front End
U2 SPI See Table 4 AFE4403 http://www.ti.com/prod-uct/afe4403
BLE Module U5 UART See Table 5 Seeed 113050012
http://www.seeedstu-dio.com/wiki/BLE_Micro
Master Device Reference Number Part Number
MachXO2 U5 Micron N25Q032A13ESC40G
iCE5LP U10 Micron M25P80-VMN6TP
Master Device Reference Number Signal FPGA Ball
MachXO2 U5 DQ0 G1
DQ1 F5
DQ2 F3
DQ3 G3
SCLK F6
CS G7
iCE5LP U10 MISO F2
MOSI D1
SCLK E1
CS F1
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Ultra Wearable Development Platform
Board Configuration and ProgrammingLattice MachXO2The Lattice MachXO2 features internal configuration Flash. This allows configuration data to be stored internally while the external Flash memory device is used for auxiliary functions.
1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position.
2. Plug in the mini-USB cable (J1).
3. Launch Diamond Programmer.
4. Select Create a new project from a scan and click Detect Cable.
5. Select the FTUSB-1 Port.
6. Select MachXO2 and LCMXO2-2000ZE in the Device Family and Device columns.
7. Double click on the Operation column and select the appropriate operation.a. Internal Flash: Flash Programming Mode: SPI Flash Erase, Program, Verifyb. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify
8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 6.
9. Select the programming bitstream in the “File Name” column.
10. Click the Program Icon or select Program from the Design dropdown menu.
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Ultra Wearable Development Platform
Figure 6. MachXO2 External Flash
Lattice iCE5LPThe Lattice iCE5LP can be directly programmed, however, unless single-time programmable NVCM is used, the configuration data will be lost when the device is powered down.
1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position.
2. Plug in the mini-USB cable (J1).
3. Launch Diamond Programmer.
4. Select Create a new project from a scan and click Detect Cable.
5. Select the FTUSB-0 Port.
6. Select iCE5LP and iCE5LP4K in the Device Family and Device columns.
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Ultra Wearable Development Platform
7. Double click on the Operation column and select the appropriate operationa. Direct Program: CRAM Programming: Fast Program (Volatile)b. NVCM (Single-use): NVCM Programming Mode: NVCM Program, Verify, Securec. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify
8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 7.
9. Select the programming bitstream in the File Name column
10. Click the Program Icon or select Program from the Design dropdown menu
Figure 7. iCE5LP External Flash
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Ultra Wearable Development Platform
Pre-Loaded Demonstration DesignThe Ultra Wearable Development Platform comes pre-loaded with the Parallel-to-MIPI DSI demo. In order to run the demo, follow these steps:
1. Ensure that the display is attached in the proper orientation, with the connector ribbon extending toward the right edge of the device (see Figure 8).
Figure 8. Display Connector
2. Plug a mini-USB cable into the mini-USB port (J1) to supply power to the device.
3. Switch power switch to the on position.
4. The screen should alternate between two images, with the User LEDs (D4, D5) indicating the demo mode.
For more detailed operation instructions, please refer to the Quick Start User Guide included with the demo design.
This demo design can be reprogrammed onto the board by downloading the project (see Additional Demonstration Designs section) and following the documented instructions. Please note that in this demo, the MachXO2 uses its internal Flash to store configuration data and the external Flash to store image data, so two programming proce-dures must be performed.
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Ultra Wearable Development Platform
Additional Demonstration DesignsSeveral additional demonstration designs have been developed for the Ultra Wearable Development Platform. These designs can be found under the Design File Tab of the Documentation section of the board web page here: http://www.latticesemi.com/ultrawearable.
Ordering Information
Technical Support AssistanceSubmit a technical support case via www.latticesemi.com/techsupport.
Revision History
© 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
Description Ordering Part Number China RoHS Environment-Friendly Use Period (EFUP)
Ultra Wearable Development Platform ICE5LP4K-WDEV-EVN
Date Version Change Summary
June 2015 1.0 Initial release.
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Ultra Wearable Development Platform
Appendix A. Main Board Schematic DiagramsFigure 9. Block Diagram
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
BQ24
232
Batt
ery
Char
ger
Regu
lato
rs
XO2-
2000
ZEW
LCS4
9
Bank
0
5035
4812
20M
IPI D
SID
ispl
ay C
onne
ctor
Bank
2
Bank
5
N25
Q03
2AN
OR
FLA
SHVi
deo
Fram
e Bu
ffer
LED
s
iCE4
0 U
ltra
SWG
36
Bank
0
Bank
2
Bank
1
FT22
32H
FTD
I USB
SPI C
onfig
JTA
G C
onfig
Port
0
Port
1
SPI Header J6
SPI UART CFG Header J3
M25
P80
CFG
SPI
Fla
sh
I2C Header J5
ASC
SM-2
7.00
0MH
Z27
Mhz
Osc
illat
or
MP3
4DB0
1Le
ft M
icro
phon
e
MP3
4DB0
1Ri
ght M
icro
phon
e
RGB
LED
Voltage Header J7
Min
i USB
Conn
ecto
r
ON
/OFF
Switc
h
Wea
rabl
e (T
op) M
ain
Boar
d
Rese
tPu
sh B
utto
n
Y2 U6
U7
U9
D9
SW1
U10
J2U
4
U5
D4-
D5
U2
J1
U1
SW2
U13
,U14
,U16
2X3 1X2
2X5
2X6
IR L
ED
D10
LED
D11
2X2
Conn
ect t
o W
eara
ble
(Bot
tom
) Sen
sor B
oard
Conn
ect t
o W
eara
ble
(Bot
tom
) Sen
sor B
oard
Conn
ect t
o W
eara
ble
(Bot
tom
) Sen
sor B
oard
Connect to Wearable(Bottom) Sensor Board
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Ultra Wearable Development Platform
Figure 10. Mechanical Design
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Mic
3.3
Reg
Batt
ery
Chg
LED
Driv
er
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A. F
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LED
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OM
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play
Con
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SPI+
UA
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Volta
ge
Sens
or B
oard
Mai
n Bo
ard
SPI
SPI+
UA
RT
J2
J5
J3
Cutout
Cuto
ut
BLE
Cutout
Boos
tRe
gula
tor
Cutout
Cutout
PPG
Tem
pCu
tout
Flas
h
Leve
lSh
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LED
Sel
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rFT
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FDTI U
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Mag
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Ultra Wearable Development Platform
Figure 11. Battery Charger Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Batt
ery
Char
ger C
onne
ctio
ns
Iterm
is s
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be
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A.
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timin
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re u
sed
for t
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pro
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min
g.
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ur fa
st c
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d 30
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prec
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t Cur
rent
Lim
it is
set
to b
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AFa
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e cu
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set t
o be
200
mA
+5V
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B
BT
_3V
7
+5V
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UT
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Manufacturer = Lite-On IncPART_NUMBER = LTST-C193KSKT-5A
1 2
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F16
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1 2
R2
2K R04
025%
R7
DN
LR
0402
BQ24
232
U1
BQ
2423
2M
anuf
actu
rer
= T
IP
AR
T_N
UM
BE
R =
BQ
2423
2RG
TT
TS
1
BA
T1
2
BA
T2
3
CE
_L4
EN
25
EN
16
PG
OO
D_L
7
VS
S8
CH
G_L
9
OU
T1
10
OU
T2
11IN
13
EP
AD
17
TM
R14
ITE
RM
15
ILIM
12
ISE
T16
WEA
RABL
E SO
LUTI
ON
- M
AIN
BO
ARD
21
Ultra Wearable Development Platform
Figure 12. USB-FTDI Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
US
B-B
MIN
I
USB
-FTD
I Con
nect
ions
60m
A
150m
A
EE
DA
TA
EE
SK
EE
CS
VC
C18
FT
V3P
3_F
TD
I
V3P
3_F
TD
I
+5V
_US
B
V3P
3_F
TD
I
V3P
3_F
TD
I
V3P
3_F
TD
I
V3P
3_R
EG
V3P
3_R
EG
V3P
3_F
TD
I
FT
DI_
TC
K[5
]
FT
DI_
TM
S[5
]F
TD
I_T
DO
[5]
FT
DI_
TD
I[5
]
FT
DI_
SC
LK[6
]F
TD
I_D
O[6
]F
TD
I_D
I[6
]
CR
ES
ET
n_F
TD
I[6
]iC
E_C
DO
NE
[6]
FT
DI_
SS
B[6
]
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47
Mon
day,
Feb
ruar
y 16
, 201
5
U3
93LC
56B
T
Man
ufac
ture
r =
Mic
roch
ip T
echn
olog
yP
AR
T_N
UM
BE
R =
93L
C56
BT
-I/O
T
CS
5
DIN
3
DO
UT
1
VC
C6
CLK
4
VS
S2
TP
1
C12
0.1u
F
C04
0216
V
C9
0.1u
F
C04
0216
V
R11
4.7K
5% R04
02
R17
10K
R04
025%
12
R68
2.2k
R04
025%
R18
10K
R04
025%
12
TP
4
R15
0
TP
2
Y1
12M
Hz
13
2
4
C11
10uF
10V
C04
02
5VD
-D
+ID
G
US
B P
WR
J1
1
2
3
4
S2
5
S1
S3
S4
C14
0.1u
F
C04
0250
V
C10
0.1u
F
C04
0216
V
C7
4.7u
F
C04
0216
V
C17
0.1u
FC
0402
16V
R10
4.7K
5% R04
02
TP
5
R13
0
C16
27pF
50V
C04
02
R16
1K 5% R04
02
C8
0.1u
F
C04
0216
V
R20
2.2K
5%R
0402
12
R9
4.7K
5% R04
02
R8
12k
1%R
0402
C13
10uF
10V
C04
02
L1 600o
hm, 5
00m
A
L060
3
R12
0
L3 600o
hm, 5
00m
A
L060
3
R19
10K
R04
025%
12
C15
27pF
50V
C04
02
J51
1X2
HE
AD
ER
_RT
_AN
GLE
PA
RT
_NU
MB
ER
= M
22-5
3302
05M
anuf
actu
rer
= H
arw
in In
c
1
2
TP
3
TP
6
R14
0
FT22
32H
FTD
I Hig
h-Sp
eed
USB
FT
2232
HQ
U2
PA
RT
_NU
MB
ER
= F
T22
32H
QM
anuf
actu
rer
= F
TD
I
VR
EG
IN50
VR
EG
OU
T49
DM
7
DP
8
RE
F6
RE
SE
T#
14
EE
CS
63
EE
CLK
62
EE
DA
TA
61
OS
CI
2
OS
CO
3
TE
ST
13
AD
BU
S0
16
AD
BU
S1
17
AD
BU
S2
18
AD
BU
S3
19
VPHY4
VPLL9
VCORE112
VCORE237
VCORE364
VCCIO120
VCCIO231
VCCIO342
VCCIO456
AGND10
GND11
GND25
GND311
GND415
GND525
GND635
GND747
GND851
PW
RE
N#
60
SU
SP
EN
D#
36
AD
BU
S4
21
AD
BU
S5
22
AD
BU
S6
23
AD
BU
S7
24
AC
BU
S0
26
AC
BU
S1
27
AC
BU
S2
28
AC
BU
S3
29
AC
BU
S4
30
AC
BU
S5
32
AC
BU
S6
33
AC
BU
S7
34
BD
BU
S0
38
BD
BU
S1
39
BD
BU
S2
40
BD
BU
S3
41
BD
BU
S4
43
BD
BU
S5
44
BD
BU
S6
45
BD
BU
S7
46
BC
BU
S0
48
BC
BU
S1
52
BC
BU
S2
53
BC
BU
S3
54
BC
BU
S4
55
BC
BU
S5
57
BC
BU
S6
58
BC
BU
S7
59
L260
0ohm
, 500
mA
L060
3
WEA
RABL
E SO
LUTI
ON
- M
AIN
BO
ARD
22
Ultra Wearable Development Platform
Figure 13. MachXO2-2000ZE Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
XO2-
2000
ZE C
onne
ctio
ns
Dut
y Cy
cle
is =
80%
NO
R Fl
ash
0201
LED
DRI
VER
DO
NE
Plac
e Fl
ash
part
as
clos
e to
XO
2 as
pos
sibl
e
27M
HZ
Cloc
k
MIP
I_C
lock
_out
_HS
_PM
IPI_
Clo
ck_o
ut_H
S_N
MIP
I_D
ata_
0_ou
t_H
S_P
MIP
I_D
ata_
0_ou
t_H
S_N
CD
ON
E
RE
SE
T_X
O2
JTA
GE
N
XO
2_LE
D1
XO
2_LE
D2
B_S
ync
Dis
play
_res
et_L
T
PW
M_C
TR
L
PR
OG
RA
MN
LED
+LE
D-
XO
2_S
CLK
XO
2_C
S
PW
M_C
TR
L
XO
2_D
Q0
XO
2_D
Q1
XO
2_D
Q2
XO
2_D
Q3
INIT
N
MIP
I_C
lock
_out
_PM
IPI_
Clo
ck_o
ut_N
MIP
I_D
ata_
0_ou
t_P
MIP
I_D
ata_
0_ou
t_N
B_S
ync
LED
+LE
D-
MIP
I_D
ata_
0_ou
t_N
MIP
I_D
ata_
0_ou
t_P
MIP
I_C
lock
_out
_N
MIP
I_C
lock
_out
_P
MIP
I_D
ata_
0_ou
t_LP
MIP
I_D
ata_
0_ou
t_LN
MIP
I_C
lock
_out
_LP
MIP
I_C
lock
_out
_LN
Ena
ble_
LED
_1V
8E
nabl
e_LE
D_3
V0
MIP
I_D
ata_
0_ou
t_LP
MIP
I_D
ata_
0_ou
t_LN
MIP
I_C
lock
_out
_LP
MIP
I_C
lock
_out
_LN
XO
2_iC
E3_
LTX
O2_
iCE
4_LT
Dis
play
_res
etD
ispl
ay_r
eset
_LT
XO
2_iC
E3
XO
2_iC
E5
XO
2_iC
E6
XO
2_iC
E3_
LT
XO
2_iC
E5_
LTX
O2_
iCE
6_LT
XO
2_iC
E4_
LTX
O2_
iCE
4
XO
2_C
LK
XO
2_iC
E1_
LTX
O2_
iCE
2_LT
TS
_CLK
BLE
_MO
D_C
DO
NE
MIP
I_D
ata_
0_ou
t_H
S_P
MIP
I_D
ata_
0_ou
t_H
S_N
MIP
I_C
lock
_out
_HS
_P
MIP
I_C
lock
_out
_HS
_NX
O2_
CS
XO
2_C
LK
XO
2_S
CLK
XO
2_D
Q1
TS
_CLK
XO
2_D
Q0
XO
2_D
Q2
BLE
_MO
D_p
rog
XO
2_iC
E6_
LT
XO
2_iC
E5_
LTX
O2_
DQ
3
XO
2_iC
E1
XO
2_iC
E2
XO
2_iC
E1_
LT
XO
2_iC
E2_
LT
V3P
3_X
O2
V3P
3_X
O2
V3P
3_X
O2
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
VD
D_V
3P0
VE
E_V
1P8
V1P
2_X
O2
V3P
3_X
O2
V1P
2_X
O2
VE
E_V
1P8
V3P
3_R
EG
VR
EG
_AD
JV
3P3_
RE
G
V3P
3_R
EG
V3P
3_R
EG
VR
EG
_AD
JV
1P2_
RE
G
FT
DI_
TD
O[4
]F
TD
I_T
DI
[4]
FT
DI_
TC
K[4
]F
TD
I_T
MS
[4]
RE
SE
T_X
O2
[6] Ena
ble_
LED
_1V
8[7
]E
nabl
e_LE
D_3
V0
[7]
XO
2_iC
E3
[6]
XO
2_iC
E6
[6]
XO
2_iC
E5
[6]
XO
2_iC
E4
[6]
BLE
_MO
D_C
DO
NE
[6]
BLE
_MO
D_p
rog
[6]
XO
2_iC
E2
[6]
XO
2_iC
E1
[6]
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5
C21
1uF
C04
0216
V
BANK2
LCM
XO2-
2000
ZESE
C 2
/4
LCM
XO
2-20
00Z
E-1
UW
G49
U4B PB
3AE
7
PB
3BF
7
PB
5A ||
CS
SP
ING
7
PB
8A ||
MC
LKF
6
PB
8B ||
SO
F5
PB
11A
|| P
CLK
TE
4
PB
11B
|| P
CLK
CE
3
VC
CIO
2G
6
PB
12A
F4
PB
12B
F3
PB
16A
|| P
CLK
TG
4
PB
16B
|| P
CLK
CG
3
PB
25A
|| S
NG
2
PB
25B
|| S
IG
1
C62
690.
1uF
C04
0216
V
C62
650.
1uF
C02
01
D3
GR
EE
N
1 2
330
R30
5%R02
01
C22
0.1u
F
C02
0116
V
BANK0
LCM
XO2-
2000
ZESE
C 1
/4
U4A
LCM
XO
2-20
00Z
E-1
UW
G49
PT
17B
|| P
CLK
CD
3P
T17
A ||
PC
LKT
C4
PT
16C
|| T
CK
B4
PT
16D
|| T
MS
B5
PT
10A
D5
PT
10B
D4
PT
12C
|| T
DO
A6
PT
12D
|| T
DI
C5
PT
18C
B3
PT
18D
|| S
DA
C3
VC
CIO
0_1
A2
VC
CIO
0_2
A5
PT
20A
A3
PT
20B
B2
PT
20C
|| J
TA
GE
NF
2
PT
20D
|| P
RO
GR
AM
NF
1
PT
23A
E2
PT
23B
C2
PT
24A
C1
PT
24B
D2
PT
24C
|| IN
ITN
B1
PT
24D
|| D
ON
EA
1
C23
1uF
16V
C04
02
U15
1-B
IT_T
RA
NS
LAT
OR
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
SN
74A
UP
1T34
DS
FR
VC
CA
1
A2
GN
D3
VC
CB
6
B4
NC
5
R24
2k2
5% R04
02
30R33
R02
015%
LCM
XO2-
2000
ZE
LCM
XO
2-20
00Z
E-1
UW
G49
U4C
PL2
A ||
GP
LLT
_IN
A7
PL2
B ||
GP
LLC
_IN
B6
PL3
AC
7
PL3
BC
6
VC
CIO
5B
7
PL5
AE
6
PL5
BE
5
U8
TP
S61
061
Man
ufac
ture
r =
TI
PA
RT
_NU
MB
ER
= T
PS
6106
1
SW
6
GN
D1
FB
4
VIN
8
VO
UT
7
EP9
ILE
D3
EN
2P
GN
D5
TP
11
D5
Red
1 2
C62
730.
1uF
C04
0216V
TP
12
C62
660.
1uF
C02
01
330
R34
5%R02
01
R40
10k
R04
025%
C62
710.
1uF
C04
0216
V
30R32
R02
015%
30R36
R02
015%
Y2
27.0
00M
Hz
PA
RT
_NU
MB
ER
= A
SC
SM
-27.
000M
HZ
-LR
-TM
anuf
actu
rer
= A
brac
on
TS
1
GN
D2
VC
C4
OU
T3
R41
0R04
02
J2 5035
48-1
220
Man
ufac
ture
r =
Mol
ex In
c
PA
RT
_NU
MB
ER
= 5
0354
8122
0
2 4 6 8 10 12
1 3 5 7 9 11
C34
1uF
16V
C04
02
C62
700.
1uF
C04
0216
V
330
R31
5%R02
01
C27
0.1u
F
C02
0116
V
U12
2-B
IT_T
RA
NS
LAT
OR
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
TX
B01
02Y
ZP
R
GN
DB
1
VC
CA
C1
A1
D2
OE
C2
VC
CB
B2
B1
A2
B2
A1
A2
D1
LCM
XO2-
2000
ZESE
C 4
/4
LCM
XO
2-20
00Z
E-1
UW
G49
U4D VC
CD
1
VC
CD
7G
ND
A4
GN
DD
6
GN
DE
1
GN
DG
5
C35
1uF
35V
C12
06
R67
33 R04
025%
C20
0.1u
F
C02
0116
VR
271K R
0402
5%
C18
1uF
16V
C04
02
C28
0.1u
F
C02
0116
V
C24
0.1u
F
C02
0116
V
C29
0.1u
F16
VC
0402
30R25
R02
015%
TP
13
U5
NO
R F
lash
PA
RT
_NU
MB
ER
= N
25Q
032A
13E
SC
40G
Man
ufac
ture
r =
Mic
ron
CS
_L1
DQ
05
SC
LK6
DQ
23
DQ
37
VC
C8
VS
S4
DQ
12
U11
4-B
IT_T
RA
NS
LAT
OR
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
TX
B01
04Y
ZT
R
GN
DD
2
VC
CA
B2
A1
A3
OE
C2
VC
CB
A2
B1
A1
B2
B1
A2
B3
A3
C3
A4
D3
B3
C1
B4
D1
C62
720.
1uF
C04
0216
V
L422
uHL0
805
D4
Red
1 2
DN
LR
111
R04
02
330
R35
5%R02
01
C19
0.1u
F
C02
0116
V
R42
12 R04
025%
R26
1K R04
025%
SEC
3/4
BANK5
WEA
RABL
E SO
LUTI
ON
- M
AIN
BO
ARD
23
Ultra Wearable Development Platform
Figure 14. iCE5LP4K Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Plac
e N
ear F
PGA
Pin
Plac
e N
ear F
PGA
Pin
Plac
e N
ear F
PGA
Pin
Plac
e N
ear F
PGA
Pin
Plac
e N
ear F
PGA
Pin
iCE5
LP4K
Con
nect
ions
DO
NE
CRST
Push
But
ton
NO
R Fl
ash
SPI S
ENSO
R
BLE
MO
DU
LE
I2C
SEN
SOR
Tri C
olou
r
RIG
HT
MIC
LEFT
MIC
500m
A tr
aces
100mA trace Pl
ace
0 oh
m re
sist
ors
for S
PI fl
ash
as c
lose
to th
e iC
E pa
rt a
s po
ssib
le
CR
ES
ET
_iC
EiC
E_C
DO
NE
MIC
_CLK
MIC
_DA
TA
AF
E_S
PI_
SC
LK
BLE
_MO
D_F
LAS
H_C
SB
BLE
_MO
D_i
CE
40_M
OS
IB
LE_M
OD
_iC
E40
_MIS
O
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_C
RS
Tb
CR
ES
ET
n_F
TD
I
FLA
SH
_SC
LK
FLA
SH
_MO
SI
FLA
SH
_MIS
O
FLA
SH
_CS
B
FLA
SH
_SC
LK
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_F
LAS
H_C
SB
FLA
SH
_CS
B
SP
I_S
CLK
SP
I_C
S
BLE
_MO
D_i
CE
40_M
ISO
BLE
_MO
D_i
CE
40_M
OS
I
FLA
SH
_MIS
O
FLA
SH
_MO
SI
SP
I_M
OS
I
SP
I_M
ISO
MIC
_CLK
MIC
_DA
TA
MIC
_CLK
MIC
_DA
TA
AF
E_S
PI_
ST
E
AF
E_S
PI_
MIS
O
CR
ES
ET
_iC
E
SP
I_M
ISO
SP
I_S
CLK
SP
I_C
S
SP
I_M
OS
I
AF
E_S
PI_
ST
E
AF
E_S
PI_
MIS
OA
FE
_SP
I_M
OS
IA
FE
_SP
I_S
CLK
iCE
40_I
RLE
D
AF
E_S
PI_
MO
SI
UA
RT
_RX
UA
RT
_TX
Sen
sor_
SD
A
Sen
sor_
SC
L
BLE
_MO
D_C
RS
Tb
UA
RT
_TX
UA
RT
_RX
Sen
sor_
SC
LS
enso
r_S
DA
RE
SE
T_X
O2
AF
E_R
DY
AF
E_R
DY
V1P
2_iC
E
V1P
2_iC
E
V3P
3_iC
E
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_iC
E
V3P
3_iC
E
VR
EG
_AD
J
VR
EG
_AD
J
VD
D_M
IC1
VD
D_M
IC2
VR
EG
_AD
JV
RE
G_A
DJ
VR
EG
_AD
JV
DD
_MIC
1
VD
D_M
IC2
iCE
40_B
LUE
[6] iC
E40
_GR
EE
N[6
]iC
E40
_RE
D[6
]
iCE
_CD
ON
E[4
]
iCE
40_B
LUE
[6]
iCE
40_G
RE
EN
[6]
iCE
40_R
ED
[6]
CR
ES
ET
n_F
TD
I[4
]
FT
DI_
SS
B[4
]
FT
DI_
SC
LK[4
]
FT
DI_
DI
[4]
FT
DI_
DO
[4]
BLE
_MO
D_C
DO
NE
[5]
BLE
_MO
D_p
rog
[5]
RE
SE
T_X
O2
[5]
XO
2_iC
E3
[5]
XO
2_iC
E4
[5]
XO
2_iC
E1
[5]
XO
2_iC
E2
[5]
XO
2_iC
E5
[5]
XO
2_iC
E6
[5]
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Dat
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67
Mon
day,
Feb
ruar
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, 201
5
C42
0.1u
F
C02
0116
V
R46
10k
R04
025%
R37
0R
0402
0R
50R
0402
0R
52R
0402
R43
0 R04
02
J6
2X3
HE
AD
ER
Man
ufac
ture
r =
Mol
ex In
cP
AR
T_N
UM
BE
R =
001
5910
100
1 2
4 5 63
SW
1
PB
Man
ufac
ture
r =
E-S
witc
hP
AR
T_N
UM
BE
R =
TL1
015A
F16
0QG
C31
0.1u
F
C04
0216
V
C53
0.1u
F
C04
0216
V
R61
10k
R04
025%
R45
10k
R04
025%
0R
58R
0402
C50
0.1u
F
C02
0116
V
0R
113
R04
02
D8
GR
EE
N
1 2
U10
NO
R-F
LAS
H
PA
RT
_NU
MB
ER
= M
25P
80-V
MN
6TP
Man
ufac
ture
r =
Mic
ron
CS
1
SD
I5
SC
K6
WP
3
HO
LD7
VCC8
GND4
SD
O2
J50
1X3
R/A
HE
AD
ER
Man
ufac
ture
r =
Har
win
Inc
PA
RT
_NU
MB
ER
= M
22-5
3303
05
1 2 3
R10
710
k
R02
015%
C47
0.1u
F
C02
0116
V0
R54
R04
02
C32
10uF
10V
C04
02
MP3
4DB0
1
U6
MIC
_LE
FT
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
MP
34D
B01
TR
CLK
1
LR2
VD
D3
DO
UT
4
GN
D5
TP
28
DN
LR
110
R04
02
R56
1K R02
015%
C37
10nF
16V
C02
01
C39
10nF
16V
C02
01
0R
63R
0402
0R
59R
0402
TP
29
0R
48R
0402
C43
1uF
C04
0216
V
R97
0R
0201
C33
0.1u
F
C04
0216
V
C40
0.1u
F
C02
0116
V
TP
30
BAN
K0
BAN
K1
BAN
K2
iCE5
LP4K
iCE
5LP
4K
U9
Man
ufac
ture
r =
Latti
ceP
AR
T_N
UM
BE
R =
iCE
5LP
-4K
-SW
G36
IRLE
DA
2
IOB
_10A
B4
IOB
_11B
_G5
F4
CR
ES
ET
_BD
3
IOB
_16A
F3
IOB
_20A
E3
IOB
_25B
_G3
C2
IOB
_26A
B1
IOB
_27B
D2
IOB
_29B
E2
IOB
_30A
C1
IOB
_31B
B2
IOB
_32A
_SO
_MIS
O_S
PI1
F2
IOB
_33B
_SI_
MO
SI_
SP
I1D
1
IOB
_34A
_SC
K_S
CK
_SP
I1E
1
IOB
_35B
_SS
_MC
SN
O_S
PI1
F1
SP
I_V
CC
IO1
C3
IOB
_12A
_G4_
CD
ON
EE
4
IOB
_2A
_MIS
O_S
PI2
F6
IOB
_3B
_G6_
MO
SI_
SP
I2E
6
IOB
_4A
_SC
K_S
PI2
D6
IOB
_5B
_MC
SN
0_S
PI2
D5
IOB
_6A
F5
IOB
_7B
E5
VC
CIO
_2C
4
VC
CP
LLB
3
IOT
_46B
_G0
B5
RG
B2
A6
RG
B1
B6
RG
B0
C6
VC
CIO
_0A
4
VP
P_2
V5
D4
VC
CA
5
GN
D1
A3
GN
D2
C5
VS
SIO
_LE
DA
1
C41
1uF
C04
0216
V
C38
10nF
16V
C02
01
0R
62R
0402
0R
53R
0402
0R
51R
0402T
P31
C46
1uF
C04
0216
V
C45
0.1u
F
C02
0116
V
R39
DN
L
R38
DN
L
J5
1X2
SO
CK
ET
Man
ufac
ture
r =
Sul
lins
PA
RT
_NU
MB
ER
= N
PP
C02
1KF
XC
-RC
1 2
C36
0.1u
F
C04
0216
V
0R
112
R04
02
C48
10nF
16V
C02
01
0R
55R
0402
0R
57R
0402
R94
0R
0201
D10
IR_L
ED
Manufacturer = OSRAMPART_NUMBER = SFH 4645
1 2
R44
1K R04
025%
C49
10nF
16V
C02
01
R47
100
1% R04
02
D11
LED
Manufacturer = Cree IncPART_NUMBER = XBDAWT-00-0000-00000LCE3
1 2
R95
0R
0201
0R
60R
0402
BLUE
GREE
N
RED
D9 TR
ICO
LOU
R_L
ED
Man
ufac
ture
r =
Kin
gbrig
htP
AR
T_N
UM
BE
R =
AP
TF
1616
SE
EZ
GQ
BD
C
1
234
MP3
4DB0
1
U7
MIC
_RIG
HT
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
MP
34D
B01
TR
CLK
1
LR2
VD
D3
DO
UT
4
GN
D5
0R
49R
0402
C51
1uF
C04
0216
V
J3
2x5
HE
AD
ER
PA
RT
_NU
MB
ER
= 0
0159
1010
0M
anuf
actu
rer
= M
olex
Inc
1 2 3 4 5678910
C30
10uF
10V
C04
02
R10
610
k
R02
015%
D12
CD
BU
05201
2C
440.
1uF
C02
0116
V
WEA
RABL
E SO
LUTI
ON
- M
AIN
BO
ARD
24
Ultra Wearable Development Platform
Figure 15. Regulator Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
POW
ER C
ON
NEC
TOR
ON
/OFF
SW
ITCH
3.3V
@ 2
A
Regu
lato
r Con
nect
ions
Inpu
t / O
utpu
t cap
acito
r's re
quire
men
t- E
SR <
1 o
hms,
X7R
/ X5
R ty
pe is
reco
mm
ende
d
�Dan
ger:
This
resi
stor
opt
ion
supp
orts
1.8
V fo
r ban
k 1
of th
e iC
E5LP
4K.
The
SEEE
D B
LE, F
TDI,
FLA
SH a
nd X
O2,
stil
l are
pow
ered
by
a 3.
3V ra
il.It
is re
quire
d to
als
o pu
ll al
l 0 o
hm re
sist
ors
rela
ted
to th
e BL
E, F
TDI a
nd F
LASH
that
are
con
nect
ed to
the
SPI b
us.
It is
als
o re
quire
d th
at th
e XO
2 be
un-
prog
ram
med
or h
ave
sign
als
conn
ecte
d be
twee
nth
e XO
2 an
d iC
E pa
rt s
et to
hig
h im
peda
nce.
If th
is a
ctio
n is
not
per
form
ed th
e iC
E5LP
4Kco
uld
beco
me
perm
anen
tly d
amag
ed
1.2V
@ 3
.0m
A1.
8V @
1.5
mA
3.0V
@ 1
.5m
A
Ena
ble_
LED
_1V
8E
nabl
e_LE
D_3
V0
RE
G_E
NA
BLE
RE
G_E
NA
BLE
RE
G_E
NA
BLE
V3P
3_X
O2
VO
UT
_BT
VD
D_V
3P0
VE
E_V
1P8
VO
UT
_BT
VO
UT
_BT
V1P
2_X
O2
VR
EG
_AD
J
V3P
3_iC
E
V1P
2_iC
E
V1P
2_R
EG
V3P
3_R
EG
V3P
3_R
EG
BT
_3V
7
VO
UT
_BT
V3P
3_R
EG
VE
E_V
1P8
V3P
3_R
EG
VR
EG
_AD
J
Ena
ble_
LED
_1V
8[5
]E
nabl
e_LE
D_3
V0
[5]
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ruar
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5
R10
30.
5
R11
40.
5
J7
2X2
HE
AD
ER
Man
ufac
ture
r =
Mol
ex In
cP
AR
T_N
UM
BE
R =
001
5910
100
1 2
3 4
TPS7
A72
00
U14
TP
S7A
7200
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
TP
S7A
7200
RG
TT
SN
S1
FB
2
PG
3
SS
11
EN
12
IN1
13
IN2
14O
UT
115
OU
T2
16
GN
D7
EP
AD
117
50m
V4
100m
V5
200m
V6
400m
V8
800m
V9
1.6V
10
C62
0.1u
FC
0402 16V
TP
16
C67
1uF
C04
0216
V
TP
22
R10
00.
5
TP
23
TP
17
C56
220p
F
C04
0225
V
C62
741u
F16
VC
0402
C63
1uF
C04
0216
V
R11
50.
5M
IC55
04
U16
PA
RT
_NU
MB
ER
= M
IC55
04-1
.2Y
MT
TZ
Man
ufac
ture
r =
Mic
rel I
nc
1.2E
N3
1.2V
O1
VIN
4
GN
D2
EP
5
C61
1uF
C04
02 16V
C68
1uF
C04
0216
VR
104
0.5
C69
1uF
C04
0216
V
TP
33
R10
80 D
I
C60
1uF
C04
0216
V
TP
34
TP
24
TP
20
TP
25
TP
21
C71
4.7u
F10
VC
0402
R10
20.
5
R10
10.
5
R10
90 D
NI
TP
35
C62
751u
F16
VC
0402
C55
4.7u
F10
VC
0402
TP
32
R11
610
K
R04
025%
12
TP
18
SW
2
ON
/OF
F S
WIT
CH
Man
ufac
ture
r =
C&
KP
AR
T_N
UM
BE
R =
PC
M12
SM
TR
11
22
33
44
55
66
77
C70
100u
F10
VC
1206
MIC
5320
U13
PA
RT
_NU
MB
ER
= M
IC53
20-P
GY
MT
TR
Man
ufac
ture
r =
Mic
rel I
nc
3.0V
O6
3.0E
N4
1.8E
N3
1.8V
O5
VIN1
GND2
EP7
TP
19
TP
36
C54
1uF
16V
C04
02
WEA
RABL
E SO
LUTI
ON
- M
AIN
BO
ARD
25
Ultra Wearable Development Platform
Appendix B. Sensor Board Schematic DiagramsFigure 16. Block Diagram
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
LPS2
5HPr
essu
re S
enso
rA
FE44
03A
nalo
g Fr
ont E
nd
LSM
330D
LCA
ccel
. & G
yro
BLE
Mod
ule
SPI
TMP1
12Te
mpe
ratu
re S
enso
rI2
C
I2C
I2C
SPI
SFH
7050
Hea
rt R
ate
&
Oxy
gen
Sens
or
Sold
erab
le
Batt
ery
Cont
act
I2C Header J4
SPI Header J2
SPI/UART CFGHeader J3
Voltage Header J5
3.3V
GN
D
Wea
rabl
e (B
otto
m) S
enso
r Boa
rd
Sold
erab
le
Batt
ery
Cont
act
BT_3
V3
U4
U7
U3
U2
U6
U5
VREG
_AD
JFr
om M
AIN
Boa
rd
1.8V
or 3
.3V
1X2 2X2
2X3 2X5
Titl
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15
Thu
rsda
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ary
12, 2
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ary
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ary
12, 2
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Wea
rabl
e_S
enso
r_B
oard
26
Ultra Wearable Development Platform
Figure 17. Mechanical Design
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Mic
3.3
Reg
Batt
ery
Chg
LED
Driv
er
VLED
3, 1
.8 R
eg
1.2
Reg
SPI J4
Volta
geI2
C
A. F
ront
End
Pres
sure
Acc
/G
yro
Osc
Top
Bott
om
Bott
omTo
p
IR L
ED
RGB
LED
Flas
h
Butt
on
Switc
h
iCEX0
2
EEPR
OM
Osc
Osc
Dis
play
Con
n.
Batt
ery
Conn
. Pad
s
Mic
I2C
SPI+
UA
RT
Volta
ge
Sens
or B
oard
Mai
n Bo
ard
SPI
SPI+
UA
RT
J2
J5
J3
Cutout
Cuto
ut
BLE
Cutout
Boos
tRe
gula
tor
Cutout
Cutout
PPG
Tem
pCu
tout
Flas
h
Leve
lSh
ifter
LED
Sel
ecto
rFT
DI P
ower
FDTI U
SBM
agM
ag
Mag
Mag
J5J6J3
J7
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015
Wea
rabl
e_S
enso
r_B
oard
27
Ultra Wearable Development Platform
Figure 18. Sensor Connections - 1
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Tem
pera
ture
Sen
sor
Acc
eler
omet
er
I2C
Add
ress
: 001
1001
b
Seee
d BL
E M
odul
e
Pres
sure
Sen
sor
Sens
or C
onne
ctio
ns -
1
I2C
Add
ress
: 101
1100
b
I2C
Sock
et
BLE
MO
DU
LE
Plac
e te
mpe
ratu
re s
enso
r far
aw
ayfr
om b
atte
ry a
nd c
harg
ing
circ
uit
I2C
Add
ress
: 100
1000
b
UA
RT
_RX
UA
RT
_TX
Sen
sor_
SC
L
Sen
sor_
SD
A
BLE
_MO
D_p
rog
Sen
sor_
SC
L
Sen
sor_
SD
A
BLE
_MO
D_C
DO
NE
Sen
sor_
SC
L
Sen
sor_
SD
A
BLE
_MO
D_F
LAS
H_C
SB
UA
RT
_RX
UA
RT
_TX
BLE
_MO
D_i
CE
40_M
OS
IB
LE_M
OD
_iC
E40
_MIS
O
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_F
LAS
H_C
SB
BLE
_MO
D_i
CE
40_M
OS
IB
LE_M
OD
_iC
E40
_MIS
O
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_C
RS
Tb
BLE
_MO
D_C
DO
NE
BLE
_MO
D_C
RS
Tb
BLE
_MO
D_p
rog
Sen
sor_
SC
LS
enso
r_S
DA
3V3
3V3
3V3
VR
EG
_AD
J
3V3
VR
EG
_AD
J VR
EG
_AD
J
VR
EG
_AD
J
VR
EG
_AD
JV
RE
G_A
DJ
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ent N
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Thu
rsda
y, F
ebru
ary
12, 2
015
J4
1X2
Hea
der
PA
RT
_NU
MB
ER
= 0
0159
1010
0M
anuf
actu
rer
= M
olex
Inc
1 2
TP
151
R3
0 R04
02
�������������
���������
����
����
�
U4
LSM
330D
LC
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
LS
M33
0DLC
TR
GN
D1
1
GN
D2
6
VD
D1
7
VD
D2
8
VD
D3
9
CA
P15
DE
N_G
16
DR
DY
_G/IN
T2_
G17
INT
1_G
18
INT
2_A
19
INT
1_A
20
CS
_G22
CS
_A23
RE
S1
2
RE
S2
3
RE
S3
4
RE
S4
5
RE
S5
10
RE
S6
11
RE
S7
12
RE
S8
13
RE
S9
14
VD
D_I
O1
21
VD
D_I
O2
25
SC
L_A
/G24
SD
O_G
26
SD
O_A
27
SD
A_A
/G28
C2
0.1u
FC
0402
16V
C8
4.7u
FC
0603
16V
R4
0R
0402
C1
10uF
16V
C08
05
C9
0.1u
FC
0402
16VR
50
R04
02
TP
31
R10
0 R04
02
C3
0.1u
FC
0402
16V
C10
0.1u
FC
0402
16V
R6
0R
0402
R9
0 R04
02
C4
0.1u
FC
0402
16V
R7
0R
0402
����
��
U7
TM
P11
2M
anuf
actu
rer
= T
IP
AR
T_N
UM
BE
R =
TM
P11
2AID
RLT
SC
L1
GN
D2
ALE
RT
3
AD
D0
4
V+
5
SD
A6
R13
0R
0402
R8
0R
0402
C5
0.01
uFC
0402
16V
R12
10K
R04
02
R14
0R
0402
C6
0.1u
FX
5R16
VC
0402
����
��
U3
LPS
25H
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
LP
S25
HT
R
VD
D_I
O1
SC
L_S
PC
2
Res
erve
d3
SD
A_S
DI_
SD
I/SD
O4
SD
O_S
A0
5
CS
6
INT
17
GN
D1
8
GN
D2
9
VD
D10
J3
2X5
SO
CK
ET
Man
ufac
ture
r =
Sul
lins
PA
RT
_NU
MB
ER
= N
PP
C05
2KF
MS
-RC
1 2 3 4 5678910
TP
141
TP
2 1
C7
0.1u
FC
0402
16V
TP
16 1
R16
0 R04
02
BLE
Mic
ro
U5
See
edB
LEM
anuf
actu
rer
= S
eeed
PA
RT
_NU
MB
ER
= 1
1305
0012
GN
D27
SW
CLK
26
SW
DIO
25
VC
C24
p12
22p1
323
p11
21
p919
p818
p717
p616
p515
p414
p313
p212
p111
p010
p10
20
GN
D1
p18
2
p17
3
p23
4
p24
5
p25
6
p28
7
p29
8
p30
9
R15
10K
R04
02
R17
0 R04
02
R2
0 R04
02
R1
10K
R04
02
R11
0 R04
02
Wea
rabl
e_S
enso
r_B
oard
28
Ultra Wearable Development Platform
Figure 19. Sensor Connections - 2
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
LED
_DRV
_SU
P
RX
_AN
A_S
UP
R
X_D
IG_S
UP
T
X_CT
RL_S
UP
Sens
or C
onne
ctio
ns -
2
SPI p
ins
will
go
to G
PIO
pin
son
mai
n bo
ards
iCE
devi
ce
SPI S
ENSO
R
LED
_DR
V_S
UP
TX
_LE
D_N
TX
_LE
D_3
TX
_LE
D_P
TX
_LE
D_3
LED
_DR
V_S
UP
TX
_LE
D_N
AF
E_S
PI_
SC
LKA
FE
_SP
I_M
OS
IA
FE
_SP
I_M
ISO
AF
E_S
PI_
ST
E
AF
E_R
DY
INN
INP
TX
_LE
D_P
AF
E_S
PI_
MO
SI
AF
E_S
PI_
SC
LKA
FE
_SP
I_S
TE
AF
E_S
PI_
MIS
OIN
P
INN
AF
E_R
DY
3V3
3V3
V5P
0_A
FE
V5P
0_A
FE
3V3
V5P
0_A
FE
VC
M_O
UT
3V3
3V3
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ary
12, 2
015
Y1
8MH
z
TP
61T
P8 1
C16
0.1u
FC
0402
16V
R26
10K
R04
02
Green LED Red LED Infrared LED
Photodiode
����
���
U6
SF
H70
50M
anuf
actu
rer
= O
SR
AM
PA
RT
_NU
MB
ER
= S
FH
7050
GC
1
GA
2
RA
3
PA
4
PC
5
RC
6
IA7
IC8
R22
0.00
1R
1206
C18
0.1u
FC
0402
16V
J2
2X3
SO
CK
ET
PA
RT
_NU
MB
ER
= N
PP
C05
2KF
MS
-RC
Man
ufac
ture
r =
Sul
lins
1 2
4 5
36
TP
41
TP
9
1
C15
8pF
C04
02
TP
111
R20
DN
LR
0402
C23
1uF
C04
0216
V
R18
DN
LR
0402
C20
0.1u
FC
0402
16V
C13
2.2u
F16
VC
0402
R24
1KR
0402
R23
0R
0402
C17
0.1u
FC
0402
16V
TP
51
TP
101
R25
10K
R04
02
C11
2.2u
FC
0402
16V
C14
8pF
C04
02
TP
18T
PO
INT
R
R21
0R
0402
TP
11
C19
0.1u
FC
0402
16V
TP
17T
PO
INT
R
TP
71
����
���
U2
AF
E44
03M
anuf
actu
rer
= T
IP
AR
T_N
UM
BE
R =
AF
E44
03Y
ZP
T
DN
C_A
1A
1
TX
_CT
RL_
SU
PA
2
LED
_DR
V_S
UP
A6
TX
_RE
FB
1
VC
MD
1
VS
SD
2
DN
C_D
3D
3
DN
C_E
3E
3
DN
C_F
5F
5
DN
C_B
5B
5
DN
C_B
6B
6
DN
C_C
1C
1
XIN
F3
XO
UT
F4
RX
_AN
A_S
UP
_E4
E4
RX
_AN
A_S
UP
_F2
F2
RX
_DIG
_SU
PE
5
SC
LKC
6
SP
ISIM
OC
4
SP
ISO
MI
C5
SP
IST
ED
6
INP
E1
INN
F1
DIA
G_E
ND
B4
AD
C_R
DY
D5
AF
E_P
DN
_LC
3
RX
_DIG
_GN
D_B
2B
2
RX
_DIG
_GN
D_F
6F
6
LED
_DR
V_G
ND
A3
RX
_AN
A_G
ND
E2
TX
PA
5
TX
NA
4
TX
3B
3
BG
C2
RE
SE
T_L
D4
CLK
OU
TE
6
C12
0.01
uFC
0402
16V
R19
0R
0402
Wea
rabl
e_S
enso
r_B
oard
29
Ultra Wearable Development Platform
Figure 20. Boost Regulator
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Thro
ugh
hole
test
pad
s fo
r bat
tery
sol
derin
g
Regu
lato
r Con
nect
ions
Pow
er C
onne
ctor
BT
_3V
3
3V3
V5P
0_A
FE
3V3
BT
_3V
3V
RE
G_A
DJ
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ent N
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ary
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heet
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Thu
rsda
y, F
ebru
ary
12, 2
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Titl
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rsda
y, F
ebru
ary
12, 2
015
TP
1380
_MIL
_PA
D1
J5 2X2
SO
CK
ET
PA
RT
_NU
MB
ER
= M
20-7
8702
46M
anuf
actu
rer
= H
arw
in In
c
1 2
3 4
C22
22uF
C06
036.
3VR
2710
KR
0402
����
����
U1
FA
N48
610
Man
ufac
ture
r =
Fai
rchi
ldP
AR
T_N
UM
BE
R =
FA
N48
610U
C50
X
VO
UT
1A
1
VO
UT
2A
2V
INA
3
SW
1B
1
SW
2B
2
EN
B3
PG
ND
1C
1
PG
ND
2C
2
AG
ND
C3
C21
10uF
C06
036.
3VL1 0.
47uH
L201
6
TP
1280
_MIL
_PA
D1
Wea
rabl
e_S
enso
r_B
oard
30
Ultra Wearable Development Platform
Appendix C. Main Board Bill of MaterialsFigure 21. Main Board Bill of Materials
Item Reference Qty Part PCB Footprint Part Number Manufacturer Description1 C1,C5,C55 3 4.7 uF C0402 C1005X5R1A475K050BC TDK CAP CER 4.7UF 10V
10% X5R 0402
2 C2,C3,C6,C6269,C6270,C6271,C6272
7 0.1 uF C0402 C1005X5R1C104K050BA TDK CAP CER 0.1UF 16V 10% X5R 0402
3 C4 1 1 uF C0402 GRM155R61C105KE01D Murata CAP CER 1UF 16V 10% X5R 0402
4 C7 1 4.7 uF C0402 C1005X5R1A475K050BC TDK CAP CER 4.7UF 10V 10% X5R 0402
5 C8,C9,C10,C12,C14,C17,C29,C31,C33,C36,C53,C62,C6273
13 0.1 uF C0402 C1005X5R1C104K050BA TDK CAP CER 0.1UF 16V 10% X5R 0402
6 C11,C13,C30,C32 4 10 uF C0402 CL05A106MP5NUNC Samsung CAP CER 10UF 10V 20% X5R 0402
7 C15,C16 2 27 pF C0402 CL05C270JB5NNNC Samsung CAP CER 27PF 50V 5% NP0 0402
8 C18,C23,C34,C41,C43,C46,C51,C54,C60,C61,C63,C67,C68,C69,C6274,C6275
16 1 uF C0402 GRM155R61C105KE01D Murata CAP CER 1UF 16V 10% X5R 0402
9 C19,C20,C21,C22,C24,C27,C28,C40,C42,C44,C45,C47,C50
13 0.1 uF C0201 C0603X5R1C104K030BC TDK CAP CER 0.1UF 16V 10% X5R 0201
10 C35 1 1 uF C1206 GMK316BJ105KLHT Taiyo Yuden CAP CER 1UF 35V 10% X5R 1206
11 C37,C38,C39,C48,C49 5 10 nF C0201 GRM033R61C103KA12D Murata CAP CER 10000PF 16V 10% X5R 0201
12 C56 1 0.01 uF C0402 GRM155R61C103KA01D Murata CAP CER 10000PF 16V 10% X5R 0402
13 C6265,C6266 2 0.1 uF C0201 C0603X5R1E104M030BB TDK Corporation CAP CER 0.1UF 25V 20% X5R 0201
14 D1 1 YELLOW LED0603 LTST-C193KSKT-5A Lite-On Inc LED YELLOW RECT CLEAR 0603
15 D2 1 GREEN LED0603 LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603
16 D3,D8 2 GREEN LED0603 LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603
17 D4,D5 2 Red LED0603 LTST-C190KRKT LITE-On INC LED SUPER RED CLEAR 0603 SMD
18 D6 1 SCHOTTKY BAT54KFILM_SOD523 BAT54KFILM STMicroelectronics DIODE SCHOTTKY 40V 0.3A SOD523
19 D9 1 TRICOLOUR_LED APTF1616SE_RGB APTF1616SEEZGQBDC Kingbright LED RED/GREEN/BLUE WTR CLEAR SMD
20 D10 1 IR_LED SFH4645_2SMD SFH 4645 OSRAM EMITTER 950NM MIDLED SIDELK SMD
21 D11 1 LED XBDAWT_2SMD XBDAWT-00-0000-00000LCE3
Cree Inc LED HIGH BRIGHT-NESS
22 D12 1 CDBU0520 DIODE_SOD523F CDBU0520 Comchip DIODE SCHOTTKY 20V 500MA 0603
23 J1 1 USB PWR CONN_S5P1RMINIUSBB_MOLEX
67503-1020 Molex CONN RECEPT MIN-IUSB R/A 5POS SMD
24 J2 1 503548-1220 2X6HDR_5035481220 5035481220 Molex Inc CONN RCPT BTB 12POS DL VERT SMD
25 J3 1 2x5 HEADER 2X5_HDR803_SMD 803-43-010-30-001000 Mill-Max CONN SOCKET DBL 10POS .100" SMD
26 J5 1 1X2 HEADER 1X2_HDR349_SMD 349-10-102-00-560000 Mill-Max CONN HEADER 2POS SMD SNGL ROW
27 J6 1 2X3 HEADER 2X3_HDR803_SMD 803-43-006-30-001000 Mill-Max CONN SOCKET DBL 6POS .100" SMD
28 J7 1 2X2 HEADER 2X2_HDR803_SMD 803-43-004-30-001000 Mill-Max CONN SOCKET DBL 4POS .100" SMD
29 J50 1 1X3 R/A HEADER 1X3_HDRRA_2MM 951103-7622-AR 3M CONN HEADER 3POS 2MM R/A T/H
30 J51 1 1X2 HEADER_RT_ANGLE
1X2_HDR803_SMD 830-10-002-40-028000 Mill-Max CONN HDR 2POS .100 HORIZ SMD
31 L1,L2,L3 3 600ohm, 500mA L0603 MMZ1608R601A TDK Corp FERRITE CHIP 600 OHM 500MA 0603
32 L4 1 22 uH L0805 AIML-0805HC-220M-T Abracon Corporation HIGH CURRENT CHIP IND 22.0UH 20%
33 L5 1 2.2 uH L1008 MAMK2520T2R2M Taiyo Yuden FIXED IND 2.2UH 1.9A 117 MOHM
31
Ultra Wearable Development Platform
34 R1,R2 2 1K R0402 ERJ-2GEJ102X Panasonic RES SMD 1K OHM 5% 1/10W 0402
35 R3 1 10K R0402 ERJ-2GEJ103X Panasonic RES SMD 10K OHM 5% 1/10W 0402
36 R4 1 4.32K R0402 ERJ-2RKF4321X Panasonic RES SMD 4.32K OHM 1% 1/10W 0402
37 R5 1 2.94K R0402 ERJ-2RKF2941X Panasonic RES SMD 2.94K OHM 1% 1/10W 0402
38 R6 1 3.57K R0402 ERJ-2RKF3571X Panasonic RES SMD 3.57K OHM 1% 1/10W 0402
39 R7 1 DNL R0402 - - -
40 R8 1 12k R0402 ERJ-2GEJ123X Panasonic RES SMD 12K OHM 5% 1/10W 0402
41 R9,R10,R11 3 4.7K R0402 ERJ-2GEJ472X Panasonic RES SMD 4.7K OHM 5% 1/10W 0402
42 R12,R13,R14,R15,R37,R43,R112,R113
8 0 R0402 ERJ-2GE0R00X Panasonic RES SMD 0.0 OHM JUMPER 1/10W 0402
43 R16,R26,R27,R44 4 1K R0402 ERJ-2GEJ102X Panasonic RES SMD 1K OHM 5% 1/10W 0402
44 R17,R18,R19,R40,R45,R46,R61
7 10k R0402 ERJ-2GEJ103X Panasonic RES SMD 10K OHM 5% 1/10W 0402
45 R20,R68 2 2.2k R0402 ERJ-2GEJ222X Panasonic RES SMD 2.2K OHM 5% 1/10W 0402
46 R24 1 2k2 R0402 ERJ-2GEJ222X Panasonic RES SMD 2.2K OHM 5% 1/10W 0402
47 R25,R32,R33,R36 4 30 R0201 ERJ-1GEJ300C Panasonic RES 30 OHM 1/20W 5% 0201 SMD
48 R30,R31,R34,R35 4 330 R0201 CRCW0201330RJNED Vishay RES 330 OHM 1/20W 5% 0201 SMD
49 R38,R39 2 DNL R0402 - - -
50 R41 1 0 R0402 ERJ-2GE0R00X Panasonic RES SMD 0.0 OHM JUMPER 1/10W 0402
51 R42 1 12 R0402 ERJ-2GEJ120X Panasonic RES SMD 12 OHM 5% 1/10W 0402
52 R47 1 100 R0402 ERJ-2RKF1000X Panasonic RES SMD 100 OHM 1% 1/10W 0402
53 R48,R49,R50,R51,R52,R53,R54,R55,R57,R58,R59,R60,R62,R63
14 0 R0201 ERJ-1GN0R00C Panasonic RES SMD 0.0 OHM JUMPER 1/20W 0201
54 R56 1 1K R0201 ERJ-1GEJ102C Panasonic RES SMD 1K OHM 5% 1/20W 0201
55 R67 1 33 R0402 ERJ-2GEJ330X Panasonic RES SMD 33 OHM 5% 1/10W 0402
56 R94,R95,R97 3 0 R0201 ERJ-1GN0R00C Panasonic RES SMD 0.0 OHM JUMPER 1/20W 0201
57 R100,R101,R102,R103,R104,R114,R115
7 0.5 Current_Sens_Res_0603 RL0603FR-070R5L Yageo RES SMD 0.5 OHM 1% 1/10W 0603
58 R106,R107 2 10k R0201 ERJ-1GEJ103C Panasonic RES SMD 10K OHM 5% 1/20W 0201
59 R108,R109 2 0 R0603 ERJ-3GEY0R00V Panasonic RES SMD 0.0 OHM JUMPER 1/10W 0603
60 R110,R111 2 DNL R0201 - - -
61 R116 1 49.9K R0402 ERJ-2RKF4992X Panasonic RES SMD 49.9K OHM 1% 1/10W 0402
62 R117 1 15.8K R0402 ERJ-2RKF1582X Panasonic RES SMD 15.8K OHM 1% 1/10W 0402
63 SW1 1 PB 2psmd_eswitch TL1015AF160QG E-Switch SWITCH TACTILE SPST-NO 0.05A 12V
64 SW2 1 ON/OFF SWITCH PCM12SMTR PCM12SMTR C&K SWITCH SLIDE SPDT 300MA 6V
65 TP1,TP2,TP3,TP4,TP5,TP6,TP11,TP12,TP13,TP16,TP17,TP18,TP19,TP20,TP21,TP22,TP23,TP24,TP25,TP32,TP33
21 T POINT R TEST_POINT - - -
66 TP28,TP29,TP30,TP31 4 T POINT R TEST_POINT - - -
67 U1 1 BQ24232 BQ24232_16VQFN BQ24232RGTT TI IC LI+ CHARGER PWR MGMT 16QFN
68 U2 1 FT2232HQ FT2232HQ_64QFN FT2232HQ FTDI IC USB HS DUAL UART/FIFO 64-QFN
69 U3 1 93LC56BT 93LC56BT_6SOT23 93LC56BT-I/OT Microchip Technology IC EEPROM 2KBIT 2MHZ SOT23-6
Item Reference Qty Part PCB Footprint Part Number Manufacturer Description
32
Ultra Wearable Development Platform
70 U4 1 LCMXO2-2000ZE-1UWG49
XO2_2000ZE_49CSP LCMXO2-2000ZE-1UWG49
Lattice LCMXO2-2000ZE-1UWG49
71 U5 1 NOR Flash N25Q032A_8SOIC N25Q032A13ESC40G Micron IC FLASH 32MBIT 108MHZ 8SO
72 U6 1 MIC_LEFT MP34DB01_RHLGA MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB
73 U7 1 MIC_RIGHT MP34DB01_RHLGA MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB
74 U8 1 TPS61061 TPS61061_8QFN TPS61061 TI IC LED DRIVER WHITE BCKLGT 8SON
75 U9 1 iCE5LP4K iCE5LP4K_SWG36 iCE5LP-4K-SWG36 Lattice iCE40 Ultra family is an ultra-low power FPGA and sensor manager
76 U10 1 NOR-FLASH M25P80_SO8N M25P80-VMN6TP Micron IC FLASH 8MBIT 75MHZ 8SO
77 U11 1 4-BIT_TRANSLATOR 12DSBGA_TXB0104 TXB0104YZTR Texas Instruments IC XLATR VOLT-LVL 4B ESD 12DSBGA
78 U12 1 2-BIT_TRANSLATOR 8DSBGA_TXB0102 TXB0102YZPR Texas Instruments IC 2BIT V-TRANS-LATR W/ESD 8DSBGA
79 U13 1 MIC5320 MIC5320_6MLF MIC5320-PGYMT TR Micrel Inc IC REG LDO 3V/1.8V 0.15A 6TMLF
80 U14 1 AOZ1281 AOZ1281_8DFN AOZ1281DI Wurth Electronics IC REG BUCK ADJ 1.8A 8DFN
81 U15 1 1-BIT_TRANSLATOR 6SON_SN74AUP1T34 SN74AUP1T34DSFR Texas Instruments IC V-LEVEL XLATR UNIDIR 6SON
82 U16 1 MIC5504 MIC5504_4TDFN MIC5504-1.2YMT TZ Micrel Inc IC REG LDO 1.2V 0.3A 4TDFN
83 Y1 1 12 MHz 403C35D12M00000_4SMD 403C35D12M00000 Abracon Corp CRYSTAL 12MHZ 18PF SMD
84 Y2 1 27.000 MHz OSC_ASCSM ASCSM-27.000MHZ-LR-T
Abracon OSC XO 27.000MHZ CMOS SMD
Item Reference Qty Part PCB Footprint Part Number Manufacturer Description
33
Ultra Wearable Development Platform
Appendix D. Sensor Board Bill of MaterialsFigure 22. Sensor Board Bill of Materials
Item Reference Qty Part PCB Footprint Part Number Manufacturer Description1 C1 1 10uF C0805 C2012X5R1C106K085AC TDK CAP CER 10UF 16V
10% X5R 0805
2 C2,C3,C4,C6,C7,C9,C10,C12,C16,C17,C18,C19,C20
13 0.1uF C0402 C1005X5R1C104K050BA TDK CAP CER 0.1UF 16V 10% X5R 0402
3 C5 1 0.01uF C0402 GRM155R61C103KA01D Murata CAP CER 10000PF 16V 10% X5R 0402
4 C8 1 4.7uF C0603 EMK107ABJ475KA-T Taiyo Yuden CAP CER 4.7UF 16V 10% X5R 0603
5 C11,C13 2 2.2uF C0402 C1005X5R1C225K050BC TDK CAP CER 2.2UF 16V 10% X5R 0402
6 C14,C15 2 8pF C0402 GRM1555C1E8R0CA01D Murata CAP CER 8PF 25V NP0 0402
7 C21 1 10uF C0603 C1608X5R0J106K080AB TDK CAP CER 10UF 6.3V 10% X5R 0603
8 C22 1 22uF C0603 C1608X5R0J226M080AC TDK CAP CER 22UF 6.3V 20% X5R 0603
9 J2 1 2X3 SOCKET 2X3_SOCKET406_SMD 406-43-206-30-068001 Mill-Max CONN SOCKET 6POS .100 DBL SMD
10 J3 1 2X5 SOCKET 2X5_SOCKET406_SMD 406-43-210-30-068001 Mill-Max CONN SOCKET 10POS .100 DBL SMD
11 J4 1 1X2 SOCKET 1X2_SOCKET310_SMD 310-43-102-41-105000 Mill-Max CONN SOCKET STRIP 2PIN .100 SMD
12 J5 1 2X2 SOCKET 2X2_SOCKET406_SMD 406-43-204-30-068001 Mill-Max CONN SOCKET 4POS .100 DBL SMD
13 L1 1 0.47uH L2016 1286AS-H-R47M Toko Inductor 0.47uH DFE201612C series
14 R1,R12,R15,R25,R26,R27
6 10K R0402 ERJ-2RKF1002X Panasonic RES 10K OHM 1/10W 1% 0402 SMD
15 R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R13,R14,R16,R17,R19,R21,R23
17 0 R0402 ERJ-2GE0R00X Panasonic RES 0.0 OHM 1/10W 0402 SMD
16 R18,R20 2 DNL R0402 — — —
17 R22 1 0.001 R1206 CSNL1206FT1L00 Stackpole RES SMD 0.001 OHM 1% 1W 1206
18 R24 1 1K R0402 ERJ-2RKF1001X Panasonic RES 1K OHM 1/10W 1% 0402 SMD
19 TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9,TP10,TP11,TP14,TP15,TP16
14 TEST POINT TEST_POINT — — —
20 TP12,TP13 2 80_MIL_PAD TP_80MIL — — —
21 U1 1 FAN48610 FAN48610 FAN48610UC50X Fairchild IC REG BOOST SYNC 5V 1A 9WLCSP
22 U2 1 AFE4403 AFE4403_36DSBGA AFE4403YZPT TI IC AFE FRONT END 36DSBGA
23 U3 1 LPS25H LPS25H_10HCLGA LPS25HTR STMicroelectronics IC MEMS PRESSURE SENSOR 10HCLGA
24 U4 1 LSM330DLC LSM330DLC_28LGA LSM330DLCTR STMicroelectronics ACCELEROMETER/GYROSCOPE 28LGA
25 U5 1 SeeedBLE SeeedBLE 113050012 Seeed Low cost ARM cortex-m0 based module for Bluetooth module
26 U6 1 SFH7050 SFH7050 SFH7050 OSRAM Biomonitoring Sensor for heart rate monitor-ing, Pulse oximetry and proximity
27 U7 1 TMP112 TMP112_SOT563 TMP112AIDRLT TI IC TEMP SENSOR DGTL 5V SOT563
28 Y1 1 8MHz NX3225GD_8MHZ NX3225GD-8MHZ-STD-CRA-3
NDK CRYSTAL 8MHZ 8PF SMD