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July/August 2012
Special ocus:Medical Electronics
Special ocus:Programmable Logic
europeanusiness press www.electronics-eetimes.com
Defning the building blocks
o tomorrows photonics
FREESHIPPING
ON ORDERSOVER 65!
DIGIKEY.COM/EUROPE
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Designing a MEMS driver ASIC for a novel
contact lens sensor
Medical applications often
have particular needs for ultra-low power consumption, high
integration, small size and
novel powering techniques.
Choosing the right EMS partner
for medical applications
Q&A with Kontron: The trends in the medical
embedded market
- PROGRAMMABLE LOGIC
Developing a 200Gbit/s line
card with 22nm FPGAs
Two key developments are
shaking up the FPGA world:
the advent of 22nm program-
mable devices and the avail-
ability of devices strongly targeted towards specific
markets through the use of hardened IP.
Expanding system control with PLDs and low
overhead serial buses
OpenCL emerges for FPGA high level design
In the debate about high-level design, a new stan-
dard is emergingfor FPGA designers
to use alongside
VHDL, Verilog and
System C to bridge
the gap.
ReadeR offeR
This month, Elliptec is offering
EETimes Europes readers the
chance to win an advanced
evaluation kit worth 999 Euros
for its high precision rotatory
and linear positioning devices.
distRibution coRneR
WHite PaPeRs
A leading reference resource for electronics engineers,
EE Times Europes White Paper library includes over
600 white papers, application notes, technical articles,
books and case studies, all downloadable free of charge
oPinion
Uncommon Market: Four reasons why its game
over for foreign chip firms in China
Last Word: New EU Data Directive will drive turning
point for security
neWs & tecHnoLoGY
Nanosys teams with 3M film
to yield less-costly LCDs
Cubic silicon carbide could
be twice as good as silicon
for solar cells
A peek at innovation from Minalogic
Displayport and HDMI in battle
for mobile link dominance
On the photonics roadmap: chip-to-chip and
intra-chip interconnects
The CEA-LETI annual
review that took place
late June was an oppor-
tunity to catch up with
the state-of-the-art in
photonics.
In the crystal ball: fast networks for smart
manufacturing lines
desiGn & PRoducts
SPECIAL FOCUS:
- POWER SUPPLIES
No magnetics required - charge pumps
can handle the Volts!
Comparing uninterruptible power supply topologies
- MEDICAL ELECTRONICS
Wafer-scale CMOS X-ray
imaging for medical applications
There is an increasing inter-
est in the use of solid-state
based X-ray medical imaging
and detection systems in the
replacement of conventional
diagnostic imaging techniques.
One of these technologies is wafer-scale CMOS-
sensor based imaging.
Ultra-low power radio drives continuous medical
monitoring with low-cost batteries
CONTENTS July/auguST 2012
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UNCOMMON MARKET
Four reasons why its game over
or oreign chip frms in ChinaBy Jk Yh
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Chip makers must survive on lower gross
margins to compete in China
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MATERIAL SCIENCES
Nanosys teams with 3M flm
to yield less-costly LCDsBy Nicolas Mokho
Nanosys and the Optical Systems Division of 3M are collabo-
rating to commercialize Nanosys Quantum Dot Enhancement
Film color LCD technology, which could result
in delivering OLED performance to LCDs, at
a fraction of the cost and with better energy
eciency. 3M and Nanosys will work together
to commercialize Nanosys QDEF technology,
a drop-in lm that LCD manufacturers can
integrate with existing production processes. It
utilizes the light emitting properties of quantum
dots to create a backlight for LCDs.
Combining the world class-technology and materials exper-
tise of Nanosys with the engineering, design and supply chain
capabilities of 3M will unlock a powerful new color viewing
experience for consumers, said Jim Bauman, Vice President
of the Optical Systems Division at 3M, here at the Society for
Information Display venue. Current LCDs are limited to display-
ing 35 percent or less of the visible color spectrum.
We are working together to improve an area of display per-
formance that has been largely neglected for the last decade,
said Jason Hartlove, President and CEO of Nanosys. Working
together with 3M and utilizing their outstand-
ing design and supply chain capabilities will
allow our QDEF technology to be widely
deployed across all product segments and
will ensure availability to all customers.
A quantum dot emits light at a very
precise wavelength. The ability to control
the spectral output of a quantum dot allows
QDEF to create an ideal white backlight
specically designed for LCDs. Trillions of these quantum dots
are packaged into a thin lm that ts inside an LCD backlight
unit. QDEF replaces a similar lm already found inside LCD
backlights, which means that adding QDEF to manufactur-
ing processes requires no new equipment or process changes
for the LCD manufacturer. The Society of Information Display
awarded Nanosys with the 2012 Display Industry Awards Gold
Display Component of the Year for its QDEF.
Cubic silicon carbide could be twiceas good as silicon or solar cellsBy Julien Happich
According to Swedish researchers at the Linkping
University, cubic silicon carbide may be capable of collecting
more than twice the solar energy than silicon based solar cells.
The cubic silicon carbide is considered a perfect material for
impurity (intermediate bandgap) solar cell. For
boron doped cubic SiC, the dopant band of B in
the bandgap of 3CSiC leads to an ecient use
of sun light so that an eciency up to 4860%
could be achieved depending on theoretical
models. But so far, cubic silicon carbide has
shown to be the black sheep of the silicon
carbide family, explains Mikael Syvjrvi, associ-
ate professor at the Linkping University. While
hexagonal silicon carbide types have been com-
mercialized for many years, cubic silicon carbide
has faced too many challenges, such as being
metastable, meaning that it does not really want
to form. One has to decrease the growth temperature to make
it form, but at the same time the growth rate is decreased. The
common approach is to use silicon as substrate, but the latticeand thermal mismatch causes defects and stress.
The Swedish researchers have applied a bulk growth ap-
proach like used in production of hexagonal silicon carbide.
According to Syvjrvi, the trick is to lower the growth tem-
perature while adjusting other parameters to maintain a high
growth rate, at 1mm/hour. The group applies hexagonal silicon
carbide as substrate, and the material is transformed to the
cubic structure during initial stage of growth. The advantage of
using hexagonal substrate is the perfect matching. Structural
measurements have showed a similar quality
like in hexagonal commercial material. The key
parameter in showing o the quality is the carrier
lifetime. Previously this had a lifetime of about
0.1 s, while the new record value is 8.2s in as
grown material, an increase of almost two orders
of magnitude. In comparison, this is even slightly
better than that in hexagonal silicon carbide.
Todays silicon solar cells have an eciency
of 20%. In order to increase the eciency of so-
lar cells, multi-junction (thin lm) solar cells with
dierent bandgaps is one of the most promising
approaches. The best eciency of such solar
cells demonstrated on the research scale is 43.5%. However,
the challenges in fabrication of multi-junction solar cells lie in
the growth of multistacked material and balance of junctioncurrents. Cubic silicon carbide in a single material which is
doped during growth, having a high growth rate such as 1 mm/
hour, could pave the way for more ecient solar cell concepts.
These results on the growth of cubic silicon carbide were pub-
lished in the Applied Physics Letter of June 18.
Cubic silicon carbide grown on
hexagonal silicon carbide.
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NEWS & TECHNOLOGY INNOVATION CLUSTER
A peek at innovation from Minalogic
By Jul HppchCreated in 2005 o bcom globl comp-
v clus h Gobl go (Fc),
Mlogc - www.mlogc.og - ghs ov
200 members all beneting from the clusters
collaborative projects in the eld of micro-
technology and embedded software. EETimes
Europe was invited to take a peek at some of the
clusters recent projects, mature enough to nd
commcl pplcos.
Among several demos set up for the day,
CyXplus was exhibiting its breakthrough X-ray
tomography solution, developed as part of
Minalogics Delpix project. CyXplus was spun o
the Cybernetix Group in 2009 and as its technical
director Olivier Franois explained us, it is only
through the combination of faster X-ray sensors,
custom data transfer protocols and improved
mg cosuco lgohms h h com-
pany was able to deliver production-line capable
3d-mgg.
The company uses new software and a special
data transfer protocol to yield a synchronized,
l-m 3d mg cosuco s h X-y
scans are being acquired, eectively transferring
data directly for volume reconstruction, cross-
section by cross-section with no data storagedelays. With this approach, CyXplus claims a 20x
speed improvement over previous generation 3D
X-ray scanners. This means that a production
part that would take several minutes to inspect
can now be fully reconstructed and analysed
in only a few seconds. In the past, because it was taking too
long to reconstruct the object in 3D, manufacturers would only
use X-ray tomography to characterize and validate a production
process, based on one successful part. Now, each part on the
production line can be scanned and fully inspected internally,
with automated quality inspection and defect detection com-
mented Franois. This also means that a complete 3D digital
proof of every produced part can be kept for future reference. In
case of insurance claims, a manufacturer could prove that a part
was shipped defect-free he added. The 3D image resolution is in
h 0.1mm g.
Delivering a spectrum analysis with a resolution of
10pm over a wide portion of the visible and NIR range,
from 630 to 1100nm, Resolution Spectra Systems
claims that its SWIFTS (Stationary Wave Integrated
Fourier Transform Spectrometer) is 100 times more
powerful than existing mini-spectrometers and 2,000
times smaller than high-end spectrometers or mono-
chromators oering a similar level of performance.
Combining integrated optics, nanotechnology, micro-
electronics and embedded software, the new instru-
ment is described by Etienne Le Coarer, technicaldirector of the Institute of Planetology and Astro-
physics of Grenoble (IPAG), as an ultra-compact
static Fourier Transform Spectrometer (FTS) that can
operate over a wide wavelength range. The SWIFTS
is capable of measuring wideband spectra or multi-
l soucs, mul-l bsopo, o
can be used in laser spectroscopy with
one or more laser sources for materi-
als analysis. In his research, Le Coarer
presented several papers on the use of
gold nanowires to probe a Lippmann
interferogram within a waveguide, ef-
fectively relying on near-eld detection to
sample the evanescent standing wave in
the waveguide. The researcher was able
to demonstrate that small gold wires
deposited along the waveguide surface
can both scatter the light and sample the
interferogram, allowing its detection by a
simple CCD sensor. In 2007, the proof of
concept was obtained with a waveguide
about 0.5mm long. In further research
not made public, the aim was to replace
the gold nanowires with specially
designed detectors set every quarter of
the standing wavelength to enlarge the
spectral bandwidth of the fully inte-
grated spectrometer. Resolution Spectra
Systems now has two products on oer
(shown in gure 2), the linear Zoom
Spectra and the rectangular shaped Ma-trix Zoom. The Zoom Spectra uses the
same demonstrated FTS principle but on
a 30mm-long waveguide, whereas the
rectangular shaped Matrix Zoom com-
bines 256 Zoom Spectra waveguides
cleverly arranged side by side to augment the spectrometers
overall spectral bandwidth. Such micro-spectrometers could nd
use in space-borne spectrometry, chemical sensors and parallel
spectral imaging to name a few applications.
Intriguing transparent sapphire wafers were on display at the
Arnano booth. Directly inspired by the microform process, each
200mm wafer can store up to 10,000 pages of A4 documents,
micro-etched from a layer of titanium nitride (TiN) cast between
two atomically sealed plates of synthetic sapphire. So why would
you convert your digital data into analogue frames physically
etched onto an optical substrate? For durability and reliability,
Fig. 1: CyXplus offers production-
line capable 3D X-ray tomographyfor production part inspection and
numerical archiving.
Fig. 2: A SWIFT unit, the 30mm-long Zoom
Spectra waveguide and the rectangular
shaped Matrix Zoom spectrometer from
Resolution Spectra Systems.
Fig. 3: Under the project Nanoform, Arnano high density analog storage
consists of 200mm atomically sealed glass or sapphire wafers enclosing
micro-etched data. The Nanoviewer optical scanner eases data retrieval in a
numerical format.
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Top performance on small surface areas wiTh low-ohmic precision resisTors
By v t gt t t t, Vlx t v g g tt , gvg t:
_ btt t t, rt < 20K/w
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_ signifcant increase in mechanical stability
low ohmic precision and power resisTors
ibtt h Gbh & c. KG
eb wg 35 35683 dbg T 0049 02771 934-0 fx 0049 02771 23030
.t@btt. .btt.
a real Broadside!
Innovation by Tradition
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NEWS & TECHNOLOGY
Displayport and HDMI in battle
for mobile link dominanceBy Rick Merritt
A NEW BATTLE has broken out over how to bring high denition
video to mobile devices. The Video Electronics Standards Asso-
ciation (VESA) formally announced Mobility DisplayPort (MyDP)
today, a new competitor for Silicon Images MHL high-denition
video interconnect. Analogix has discrete chips for the spec,
STMicroelectronics is said to be planning them and vendors of
mobile applications processors are expected to integrate the
technology in future SoCs. MyDP is based on DisplayPort 1.2,
a 5.4 Gbit/s max link now used in a wide range of products to
support up to 1920x1080-progressive resolution video at 60 Hz
with 24 bit color. It also supports the 1.1a version at 2.7 Gbits/s
that delivers 720p video.
The link supports power so phones can charge while sending
video. It uses the existing micro USB connectors on handsets.Analogix has developed a discrete bridge chip supporting
MyDP and linking to HDMI interfaces in existing mobile apps
processors. It delivers 1080p video while consuming less than
300 milliwatts for both the transmitter and bridge and adds less
than two dollars to the bill of materials, said Andre Bouwer, vice
president of marketing at Analogix.
Bouwer expects MyDP will nd its way into handsets, TVs,
notebooks and - using a Mbit/s sideband channel - links to
keyboards and mice as handsets become used as mobile PC
replacements in the next several years. It also supports audio
and stereo 3-D for 1080p at 30 Hz per eye as well as adapters
to connect to existing DVI and VGA interfaces.
VESA created an online video demonstrating MyDP at the
Consumer Electronics Show. The new link arrives at a time
when Silicon Image claims its MHL, a mobile variant of HDMI,
is already enabled in 50 million devices including handsets from
more than a dozen vendors including HTC, LG and Samsung
and TVs from LG, Samsung, Sharp and Toshiba. The MHL
group which includes chip makers such as Mediatek, Mstar,Texas Instruments and Qualcomm expects more than 100 mil-
lion MHL-enabled devices will ship this year.
In May, Silicon Image announced MHL 2.0 supporting full
1080p video at 60Hz at as little as 30mWatts. The new link also
supports power and micro USB connectors.
answers Anarnos Director Alain Rey,
explaining that very important documents
like nuclear site information or strategic
defence archives, but also civil or land
registers for administrations, cannotsafely be left to the evasive and unreliable
realm of digital storage. Ever since we
have entered the digital age, digital le
formats keep evolving rapidly and current
digital storage solutions still require their
content to be regularly refreshed, either
transferred to a new support or converted
into new formats so they can still be read
by current PCs. All this implies recurring
costs just to keep that data accessible
and readable.
Reys argument is that no current
digital data storage solution is guaranteed beyond 5 to 10 years,
and important territorial or administrative documents that need
to be stored reliably and accessed by several generations of
administrators should not be put at risk of loss by lack of funds or
by data format obsolescence. Currently, it costs administrations
between 10 and 50 Euro cents per page to store documents on
microforms estimates Rey. These documents must be stored
at controlled humidity and temperature levels to ensure century-
long data conservation. Yet, that type of archiving is not immune
to re incidents, ooding, excessive light or even pests. If you
look at the total cost of ownership, our solution costs from 35
cents to 1 euros per archived page, but then, there are no recur-
ring costs explains Rey. Once archived, you dont need to wor-
ry about your documents accessibility or preservation. Impos-
sible to counterfeit, scratch-resistant and maintenance-free, thepremium sapphire solution can withstand up to 1200C and will
last several millennia. Reading can be done with any magnifying
opcl ools, o usg h novw,
optical scanner that eases data retrieval
in a numerical format.
The NOMAD (Navigation on Mobile
Objects and 3D Access) project, leadmainly by the Myriad Group on ST-Eric-
ssons hardware together with Moveas
MEMS sensor fusion algorithm solu-
tions, is about enabling richer and more
intuitive user interfaces for mobile users
to navigate content in 3D. The four-year
collaborative R&D project yielded new
hum-mch co chqus
for future smartphones or tablets,
adapted to more complex usages and
sophisticated applications. The deliver-
ables include an Interaction software
toolbox that allows the creation of innovative user interfaces with
integrated 2D and 3D graphics rendering. It is not just buttons,
but even dynamic text and contextual menus can be rendered
in 3D, oering a richer interface than the traditional window,
icon, menu and pointing-device interfaces. A motion software
toolbox was developed to uses motion sensors (accelerometers,
magnetometers, gyroscopes) for implementing new in-air cur-
sor control and gesture-based media content navigation. This
was complemented by a new hardware and software platform
(Linux & Android) and the Snowball development kit (jointly
launched by Calao Systems and ST-Ericsson) accompanied by
h igloo op- souc wb commuy - www.gloocommuy.
org. The Myriad Group developed demonstration systems for
using smartphones and tablets as home remote controls, and for
the 3D visualization of Twitter message streams. CEA-Leti andMovea established a joint lab where they continue to co-develop
low-cost, energy ecient motion-sensor applications.
Fig. 4: Myriad enables service providers to offer
an immersive, customizable and contextualized
user experience with 3D dynamic updates from
social-networks or news streams.
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AgilentBasic InstrumentsJune August 2012
Agilent Our Distributor NetworkRigt Instrument.
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NEWS & TECHNOLOGY CEA-LETI ANNUAL REVIEW
On the photonics roadmap: chip-to-chip
and intra-chip interconnectsBy J Hpph
tHe cea-leti annual review h ook p J s
oppoy o h p h h s-of-h- mosys-
ms d moos. amog h my s g
p, my b s h ho foo ssso o
photonics would ll-up my curiosity on the topic.
The dierent presenters all acknowledged that copper alone
would not suce to match the speed and data density required
by f gos of osm ds, h d sms
xpd h tFlOPS g (1000 Gg Fog Op-
os p Sod). th g s h h f of hgh-
bandwidth chip interconnection lays in photonics, at dierent
ompo s.
D. H. Yok fom Shko e idss dsosd
op oo poym gd gd o h
PcB yo of m-hp mods. H h pkg od
so s h op y, h gd mos g h
sg fom mod vcSels (-y sf-mg
lasers) or transmitting it to photodiode arrays see gure 1. The
ompy sd sm mod o 10Gbps h
sg dgdo h gd, sd Yok. a -
mod s so sd o 10Gbps/h. Shko e
idss hs so pooypd 10m2 d op
m-hp mod bg s op hs h hgd y bd o h PcB boh d d
ps o bypss h ds mog pos. ths
m s y podo hs h ompy o-
s fomo bo h x go of pkgs d s
k h op oo dsy pys.
Kos ceO & Psd, J-os Mg, psd
gh dso mpxg (wDM) ppoh o op
os. ady ogzd pod of so opo-
o gd s, h ompy s shppg b
op os (vOas) d wDMs sppog 100Gb/s (4
ghs x25Gb/s). Kos hoogy pfom sppos
ip-chip bonding of lasers for transceivers and its WDM solu-
os sb, mg hy od h 40 ghs
x25Gb/s to enable data transfers of 1 Terabit on a single ber,
bosd Mg. ry, h ompy hs dmosd
wDM msg oy 16x11.5mm, h gd
Gmm-bsd dos oy 3mm d dy opd
o h so gds hogh pd so. i hs so
dopd G phoodods d mo-s modos o
b mbddd o h so ds h h mpxs d
gds hd. Fo hp o hp op os,
Mg poposd sg soo, y ops
that could be used in 3D module architectures see gure 2.
th y ops oss of pd mod sfom,
gg, d hd gds h md by mo
ops.
Dr. Bert-Jan Orein, manager of photonics at IBMsZh rsh lb s so popo of so phoos
fo op os ompg ppos. aodg
to Orein, we must move the optical link deeper inside the pro-
ssg h o s h ommo bddh
s of ompg sysms, fom -k, o bkp, o
cards and ultimately into chips see gure 3. Currently, optical
oos mosy sd h bods dg. Mog h
optical signal chain deeper means additional assembly eortsare required by the many optical components (transceivers) and
hgh-pso ssmby sps h h by d os
sss h go h hm. H, phoos hps od omb
the modulators, drivers, detectors, ampliers, WDM lters and
cMOS os o o d. thogh, h hp- ssmby
Fig. 1: A package acting as the optical layer, with integrated
mirrors receiving or transmitting the signal from mounted
VCSELs and photodiode arrays.
Fig. 2: Interlayer couplers consisting of a tapered modetransformer, a grating, and etched waveguides each
terminated by mirror couplers.
Fig. 3: Moving the optical link deeper inside the processing chain.
Fig. 4: Integrated electrical and optical interconnects on the
chip carrier and the board.
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NEWS & TECHNOLOGY
of so phoos ds s o y b d odys phoo-
s soos d o b pkgd o s hosg fo
ssmby o bods.
O iBMs odmp s h ssmby of so phoos
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dsy h smpfyg h ssmby poss. th soo o
o h op sgs od b o bd h hp-
fos (cMOS og d S phoos) h gd
d op os (boh o h hp d
the board as shown in gure 4). This integration would allow
o-sp mg of d op oos. ths
so ms h d bod- gds ms b
mbddd o h sbss o dsb h op sgs.
th FP7 poj FireFlY sd h d of s y gos
o h do, ookg 3D o-sd ms d
components for the ecient guiding of light. IBM has already
dmosd -hgh dsy (62.5mm h ph) -
gds o op of PcBs d op opgs b poy-
m gds d so phoos hogh h s of 45
mos d o oss (0.4dB) ss h good ssmby
os (20mm gm fo 1dB ddo oss d
100mm s-o-s ds o fo 1dB ddo oss).
Further in the future, Orein would like to see a photonics layer
sg o op of skd mmoy d og ds, g s
o-hp op ok pb of og os os
but also able to route the data trac.
i hs pso o 3D go d so phoos,
hd of dsg pogms d sh do cea-l D.
ahmd Jy mphszd h h 3D os
increase bandwidth in a single chip, o-chip I/Os will soon be
h bok, g fo hp-o-hp b so o-hp (sobod) S-phoos o h s. ths od o h d
sfs h 1tFlOP/s g pb po s.
Data transfer density and energy eciency in Watts consumed
p GFlOPs ms b sd by s fo of 50 f
o h h obj of 1tFlOP/w by 2016, sd J-
y. whs os h i/O dsy m,
silicon photonics could still be ecient for distances less than
f ms s ommoy fod o Socs, xpd h
sh. ths od b hd hogh h s of g
dob-sdd phoos poss pb of og
mp ds. Sh poss od b dopd dp-
dy (s fo mmos d possos) d shod b d
by ic dsg o mms oss d po osmpo s
gure 5.
Maurizio Zuada, the spokesperson for STMicroelectronics
sh o h op, dsbd S phoos s fdm-
hoogy o h ompys poss odmp. i f,
pshp h lx, St hs dy sd dopm
of its rst generation of photonics devices on 300mm Si wafers.
The rst results are expected for mid-Q4 of 2012 with full
characterization before the end of the year. Zuada also hinted
hybd soo h phoos d kg h i/Os o og
hogh opp ps f opo- sg oso
see gure 6. The rst generation devices will target 25Gbps/link
h bddhs o 100Gbps o hps sm h 160mm3.
Hd of h cMOS Phoos lb cea-l, Sy
Mzo dsssd h d fo go of boh pss d op fos, dg gh msso sh s s
sos d e/O o O/e oso hogh modos d
phoodos. ths s omfod by h og fom
h leti so pfom, J-M Fd ho d h
os bdg boks of h od b omoos phoo-
s s fd d hzd h b. to so h hpo ss, Fd poposd d f go
hby phoos iP f od b bodd o -
o SOi f, mg g h sh 3D op g-
tion would not depend on the specic node used to produce
the electronic wafer see gure 7.
Fig. 5: Large double-sided photonics interposers capable of
interconnecting multiple dies.
Fig. 6: A photonics die linking to logic through copper pillars
after opto-electrical signal conversion.
Fig. 7: In direct wafer bonding, InP dies are bonded on a
CMOS wafer before substrate removal.
CEA-LETI ANNUAL REVIEW
-
7/29/2019 EETimes July-August 2012
13/56
SPOTLIGHT
Its the never-ending dilemma:trying tokeep your equipment costs as low as possible in
the short term, knowing that your next generation
o designs will probably require aster and more-
advanced test and measurement capabilities.
Deciding how much to buy andwhen to upgrade
Oscilloscopes, or instance, present a airly linear
tradeo between price and bandwidth, a key
perormance specifcation. More bandwidth is great
to have, but budget pressures oten limit you to
buying only as much as you need or your immediate
projects.
In addition to the price/perormance question, its
vital to have a clear understanding o how much
bandwidth your currentand utureapplications
really require.
As an example, lets say your last embedded designused DDR1 memory (which clocks data into and out
o memory on both the rising and alling edges o the
clock signal) with data transer rates in 200 Mbps
range. I you used a scope with 500 MHz bandwidth
to capture and veriy critical timing parameters, this
instrument probably oered sufcient measurement
accuracy.
However, your next design will be based on higher
speed DDR2 technology. Will that 500 MHz band-
width still do the job?
The eye diagram, which provides a composite pictureo signal quality by overlaying high and low bits to
determine when data is valid, is a common measure-
ment perormed on read and write data signals o
DDR memory.
Figure 1shows an example o an eye-diagram
measurement using a 500 MHz scope on a
data signal representative o DDR2-667 memory.
While the clocking rate o DDR2-667 memory is
667 MHz, both the clock signal and the maximum
toggle rate o the data signal are only 333 MHz.
One might assume, then, that a 500 MHz scope
would provide sufcient bandwidth to capture andmeasure these signals.
But as you can see in Figure 1, a 500 MHz scope
essentially turns your digital bit stream into what
appears to be an overlay o sinusoids, obscuring vital
signal details. Clearly, a bandwidth o only 500 MHz
cant capture and measure these signals accurately.
Figure 2, made on the same signal with a 1 GHz
scope, gives a much more realistic representation o
the bit stream, thereby accelerating your search or
the insights you need.
Moving up without starting over
The Agilent InfniiVision 3000 X-Series oscilloscopes
are built on the premise that you need to man-
age your budgets careully today and anticipate
perormance requirements on uture projects, too.
The newest 1 GHz model starts at the lowest price in
the industry. And i you plan to buy or already own a
lower bandwidth 3000 X-Series scope, your invest-
ment is protectedthey are all ully upgradable to
the new 1 GHz level. Buy as much perormance asyou need or todays designs, then easily upgrade to
meet tomorrows requirements.
To learn more about how to identiy the necessary
bandwidth or your specifc measurement
applications, visit
www.agilent.com/fnd/evaluatingbandwidth
and download Evaluating Oscilloscope
Bandwidths for your Application.
Can You Meet Todays
Budget Requirements
While Anticipating Tomorrows
Bandwidth Requirements?
Figure 1
A 500 MHz scope proves inadequate or
this DDR2-667 signal; the eye diagram
presents what appears to be an overlay
o sinusoids but should really be a digital
bit stream.
Figure 2
Heres that same DDR2-667 signal
measured with a 1 GHz scope; the eye
diagram now clearly displays the overlaid
digital bit stream.
InfniiVision 3000 X-Series
oscilloscopes
New! 100 MHz to 1 GHz bandwidth, up to4 Mpts memory, DSO and MSO models
8.5-inch WVGA display is 50% largerand 3x the resolution o competitive scopes
Hardware-based measurement applications including serial decode
Up to 1,000,000 waveorm updates/second with MegaZoom technology
Fully upgradablebandwidth, MSO, memory up to 4 Mpts, measurementapplications, WaveGen built-in 20 MHz unction and arbitrary waveormgenerator, and integrated digital voltmeter
Get a quick quote today at
www.agilent.com/find/quick-quote
-
7/29/2019 EETimes July-August 2012
14/5614 Electronic Engineering Times Europe July/August 2012 www.electronics-eetimes.com
NEWS & TECHNOLOGY IEEE TECHNOLOGY TIME MACHINE
In the crystal ball: fast networks for smart
manufacturing linesBy Chsph Haschd
From ColleCtive intelligenCe sa pw ad f
cyb physca syss fuu b wk chs,
h ieee tchy t mach cfc whch k
pac d f may Dsd spad acss a wd a f
pcs. th ps f hs aua cfc h fuu f
chy was pd a s f h chs byd
2020. Hw h pss, scss ad s, p-
fd k dp h cysa ba bu sad a
h ws h ay a fuu.
In his plenary presentation, Inneon CEO Peter Bauer high-
lighted the role of the semiconductors for energy eciency in
a. thuh ay a w pc, Bau dw a s-
ing timeline until 2020 and beyond for eciency gains in energy
generation and distribution as well as in specic automotive
appca ss. Sc 1973, h wds cc y
csup has ha pd ad h dad s cu-
s a cas spd. Aas hs backud, y
eciency indeed seems an urgent topic for industrial as well as
f pa csus.
th hhs y sas pa s h, ap-
pacs ccs, syss, ad sda HvAC
syss, Bau xpad. isy, hs appca
ss h dp f h cc syss qudto drive eciency higher quickly remunerates as the devel-
p s chap ha h y sas b achd.
Progress in power electronics will accompany the development
as a ab f hh pw dsy ad w sss. th
pw dsy f dcs such as s pw ds w
cu cas u 2020 abu 120 kW/c2, Bau
pdcd. Wh days wd-badap scducs such
as SiC are perceived as innovations which drive the eciency
f, f sac, sa s a f 98%, fuu y
unknown semiconductor technologies could drive the eciency
99 pc ad byd. i wd pw a, h
pw p a cud s 10mW f days
6mW, accpad by uch hh aby ad sc f.
i au ccs, scducs ab h ds
f w safy asssa syss such as ada-basd cus
c. Wh Sg w cu pa as h scduc-
chy f chc, w fucs such as cc
ba f ad a f aa fucay w ab
sa d asssa syss wh fucay, Bau
pdcd. Sa psas ad dscusss addssd h
fuu f aufacu. i hs cx, cyb physca syss
s cuy h ubquus buzzwd. Cyb physca syss
(CPS) are huge, complex agglomerations of networked, intelli-
s such as sa cs day cd facs.
ths sa s cud ak pduc ss
aady chaaczd by a hh d f aua such as
h scduc dusy.Dirk Wristers, Vice President Technology R&D for chipmaker
gbafuds aady ppaad hs s f a lhs-u
operation, a fab where the lights can be switched o since no
hua bs a wk h pduc ay. Bsds
the extremely high degree of automation associated to CPS,
Wss skchd h fuu f h scduc dusy wh
a-fabs, cak u ha a wafs p ya -
450 wafs, f cus.
th u ha kps sa cs ad sa facs h
s cucas - wss, s cass. ghad F-
ws, pfss a h Dsd tchca usy ad sa
pu, hd a sups psa, pac Saash
Alamouti from Vodafone R&D. Fettweis did not only link CPS
ad x-a b cucas chy, h
as pdd a ps h chy ha cud ab hs
xy a cuca sch. F hs pspc,
x-a b wk ds f lte huhhs chy s s fa f b ady aaab acss eu-
p bu wha h cas 5g wks. F appcas such
as dusa cs w d udp days h cy f
1 scd, h sad. Up w, a wss wks a
dsd f cuca appcas. th fas wks f
h fuu w b dsd f c appcas sad.
For trac control, cars equipped with these networks could
be guided through intersections without trac light - the real-
daa xcha bw a h ad uss w ab
the vehicles to steer through the densest trac without hu-
a ac. ths w d away wh wa f f h
d h, Fws sad. th g5 wk w as byd
days ca--fasucu cuca appachs, basd
a aa f h kw WF chy. ths chy
has b dsd wa cas f accds f bad ad cd-
s ahad, Fws xpad. F appcas such as
sc c, h acy s uch sw.
th sa hds u f dusa aua. g5 wks
cud f h ss k f a aua appach cu-
y dpd dubbd idusy 4.0 f h hh d f
machine autonomy and exibility intended. This approach pro-
vides for materials and semi-nished products communicating
with tool machines and autonomously nding their way through
h pduc . ths pcss qus ay daa xcha
processes - an ideal application eld for Fettweis real-time
wks.
of cus h a chas. o s h badwdh -qud: Fws sad ha huh h s us hs
cuca schs w y xcha ay sh daa
packs, h badwdh qus w cas by a fac
f 100 1000. ipssb? A h f physcs, h s
shw spp sh, Fws sad.
From left to right: William Tonti, IEEE Future Directions Committee;
Roberto Boisson de Marca, Future Directions Committee Chair,
Maurizio Dcina, General Chair of the IEEE TTM 2012, and Prof.Gerhard Fettweis, Program Chair of TTM 2012.
-
7/29/2019 EETimes July-August 2012
15/56
FREQUENCY COUNTERSFUNCTION/ARBITRARY
WAVEFORM GENERATORS
INTM E A s U R E M E N T
Function/arbitrary waveform generators can produce a variety of
pulse-width modulation (PWM) signals to emulate analog control signals.
Two options are varying the duty cycle of a square wave and creating
an arbitrary waveform. However, the most versatile solution is to use
a function generator with built-in PWM capabilities, such as the
Agilent 33200 or 33500 Series, which gives you quick access to
all PWM parameters.
To learn more, visit
agilent.com/find/33521A
Download a free copy of
10 Hints for Getting More
from Your Function Generator
DATA ACQUISITION/SWITCH UNITSGPIB CONNECTIVITY
34972A offers LAN built-in web interface foreasy control and interface
3 slot mainframe, built-in signal conditioning
for 11 types of input signals
Free BenchLink Data Logger software easessetup and documentation, 34830A BenchLinkData Logger Pro software also available
GPIB and RS-232 connectivity (34970A), USBand LAN (LXI-C) connectivity (34972A)
34970A/72Adata acquisitionswitch unit,
6 digit
Modular exibility and universal channels for awide range of measurements with no externalsignal conditioning
Function/arbitrarywaveformgenerators
Highest signal delity and true point-to-point arbs let you model real-world signalsmore accurately than ever
Sine waves, square, ramp, triangle, noise,pulse generation with variable edge,DC waveforms, AM, FM, and more
Linear and logarithmic sweeps and burstoperation modes
Model
Description
Connectivity
33521A 1-Channel function/arbitrary waveform generator33522A 2-Channel function/arbitrary waveform generator
16 bits, 250 MSa/s, 1 M points, with 30 MHzpulse, and less than 40 ps jitter
UsB, AN (XI-C),optional gIB
33210A10 MHz
14-bits, 50 MSa/s, 8 K points,(with Option 002), with 5 MHz edge pulse
UsB, gIB, andAN (XI-C)
33220A20 MHz
14-bits, 50 MSa/s, 64 K pointswith 5 MHz pulse
UsB, gIB, andAN (XI-C)
33250A80 MHz
12-bits, 200 MSa/s, 64 K pointswith 50 MHz pulse
GPIB, RS-232
33502A Isolated amplier, dual channel, 50 Vpp UsB, AN (XI-C)33503A BenchLink Waveform Builder Pro software
Validate your most challenging designs with realisticand robust test signals: true point-by-point arbs,variable BW noise and PRBS
Up to 20 ps single-shot time intervalmeasurements
Histograms, trending, data logging, and built-inmath and statistics functions give greater
insights into system behavior Frequency, frequency ratio, time interval,
rise/fall time, phase, and much more
Continuous, gap-free measurements, withtime stamps on signal edges (53230A only);pulse/burst microwave measurements(53230A only)
Optional 6 GHz or 15 GHz RF Channel
USB, GPIB and LAN (LXI-C) connectivity
RF and universalfrequencycounters
Achieve deep insights quickly with histograms,trend charts and statistics
Easily control instruments and exchange datawith maximum throughput
Built-in buffering for speeds up to 900 KB/s
IEEE-488 interface connects up to14 instruments
High-speed USB 2.0 with fast, easy, plug-and-play connection and auto conguration
GPIB transfer rate of up to 1.15 MB/s
Direct PC (USB) to GPIB instrumentconnection
82350B PCIhigh-performanceGPIB interface
82357B USB/GPIBinterface
-
7/29/2019 EETimes July-August 2012
16/5616 Electronic Engineering Times Europe July/August 2012 www.electronics-eetimes.com
DESIGN & PRODUCTS POwER SUPPlIES
No magnetics required -
charge pumps can handle the Volts!By Stv Knot
A chArge pump, o switd
aaito volta onvt,
ss aaitos as ny sto-
a lnts to nat an
ott volta. Fo xal,
on basi a iit,
t dobl, dobls t
input voltage, using a single y-
in aaito and fo intnal
swits divn fo a two-
phase clock. In the rst phase
of t lok, a ai of swits
charges the ying capacitor to
t int volta (VIN). In t sond as of t lok, a tid
swit onnts t nativ tinal of t aaito to VIN
f-
ftivly natin 2*VIN
at t ositiv tinal of t aai-
tor. The fourth switch connects the positive terminal of the ying
aaito to t ott aaito. und no load onditions,
a will tansf to t ott aaito on a yl ntil
t ott as to 2*VIN
ts doblin t int volta.
Wn an ott load is snt, t ott aaito o-
vides the load current during the rst phase, while the ying
aaito ovids t load nt and as t ottaaito din t sond as. Fo a tansf to o-
, t ott will lat at a volta slitly low tan 2*VIN
.
T ain and disain of t ott aaito in t two
ass of t lok nats an ott il tat is a fntion
of t ott aaito val, t lok fqny and ott
load nt.
All ot a iit ilntations follow fo
tis basi s by addin/anin swits and aaitos
as wll as t nb of ass of t lok. ca s
an dobl voltas, til voltas, alv voltas, invt
voltas, fationally ltily o sal voltas s as x3/2,
x4/3, x2/3, tta, and nat abitay voltas, dndin
on the controller and circuit topology. The eciency of charge
s an b qit ood wn na ti idal a atio.
In t dobl xal abov, t int sly will b qal to
two tis t ott load nt s tat int ow qals
output power in the ideal case. In reality the eciency will be
slitly low tan idal d to qisnt oatin nt and
other losses. In reality, the eciency will be slightly lower than
idal d to oatin nt and ot losss. T vsatility
of a s nabls ti sa in a wid vaity of a-
liations and akt snts.
Charge pumps ll a niche in the performance spectrum
between LDOs and switching regulators and oer a nice
alternative to designs tat may be indutor-averse. compared
to LDOs, arge pumps require an additional apaitor (a
y cap) to operate but do not require inductors, which aregenerally sligtly more ostly, ave iger output noise levels
and usually ave lower output urrent apability. however,
they have many benets over LDOs such as higher eciency,
good termal management due to switing ariteture and
have more exibility to step a voltage up as well as down, or
generate negative voltages. Wen ompared to onventional
switing regulators, a arge pumps output urrent apability
and eciency are lower. However, they are simpler to design
and do not require an indutor. Furtermore, advanements
in proess tenology ave enabled an expansion of arge
pump input voltage range ompared to previous generations.Table 1 provides a omparison of key performane parameters
between topologies.
Design & application challenges for chargepumpsT a sval indstial nvionnts tat av sinl-nd-
d, i volta ow slis adily availabl. howv,
ts slis a not sitabl fo divin o as and ot
iits tat qi biola ow slis s as ow-
in dal-ail, low nois i volta o as, qiin 15V
ails fo a sinl +24V sly. O as divn los to ti
nativ ail av vy oo distotion. Tfo, it is dsiabl
to av a nativ ail tat is low tan t lowst sinal lvl
in od to ovid t lowst distotion at t o a ott.
T it ty of a ay svi tis nd and lo-
ally nat an invtin ow sly to div t ails of t
o a o ot nois snsitiv iity sin low nois ost
latos.
many odn oniation dvis s snsitiv rF
ivs, bt t obination of nois natos (swit-
in ow slis) and nois-snsitiv iity an at
t otntial fo intfn. T taditional soltion as bn
to k nois natin iits away fo nois snsitiv
iity. howv, in odn andld odts, vytin is
so titly akad tat tis is no lon ossibl. Sildin is
not atial fo bot ost and siz asons. Taditional swit-
in ow slis onntat nois ny into naow-bandaonis. Yt, if on of ts aonis ans to oinid
wit a snsitiv fqny (a ivs intdiat fqny
o IF assband, fo instan), intfn is l ikly to slt.
Charge pumps oer suciently low noise thresholds and can ll
tis void.
Stv Knot is Snio podt maktin enin in t pow
podts go at Lina Tnoloy cooation -
www.lina.o
Table 1: LDOs vs. charge pumps vs. switching regulator performance
-
7/29/2019 EETimes July-August 2012
17/56
OSCILLOSCOPES HANDHELD OSCILLOSCOPESMODULAR INSTRUMENTS
Get a quick quote today at
www.agilent.com/find/quick-quote
5.7-inch VGA TFT LCD display with indoor,outdoor, and night-vision viewing modes
3-in-1 instrument: scope, DMM,and data logger
Two independent, isolated channels(100 MHz - U1610A or 200 MHz - U1620A)
Up to 2 GSa/s sample rate and up to 2 Mptsdeep memory to zoom in on critical details
Benchtop-like dual window zoom for moredetailed waveform ananlysis
U1600 SeriesHandheld Scopes
Maximum versatility to troubleshoot todayschallenges and anticipate tomorrows needs
USB modularinstruments
Mix and match the USB modular instruments,DAQ modules or switching I/O units to meet
your measurement needs Instrument and DAQ modules can be used
standalone or integrated together in theUSB modular chassis
Hi-speed USB 2.0 interfaces for easy setup,plug-and-play, and hot swappable connectivity
U2781A USB modular product chassis canhost up to six modules and synchronizemultiple instruments
Bundled Agilent Measurement Managerlets you congure and control a system withno programming
USB modular instrumentsU2701A/02A 100/200 MHz oscilloscope
U2722A/23A 3-channel source measure unit
U2741A 5 digit digital multimeter (DMM)
U2751A 4x8 switch matrix
U2761A 20 MHz function generator
U2781A Modular chassis
USB modular data acquisition
U2300A Series USB modular multi-functionDAQ devices
U2500A Series USB modular simultaneous-
sampling multi-function DAQ devicesU2100A Series USB digital I/O devices
U2600A Series USB modular isolateddigital I/O devices
U2121A-based RF switch driver
U2802A 31-channel thermocoupleinput module
Anticipate every new challenge withrecongurable portable test systems
NEW
InfniiVision2000 X-Seriesoscilloscopes
8.5-inch WVGA display offers 2x theviewing area and 5x the resolution ofcompetitive scopes
70 to 200 MHz bandwidth, 100 kpts
memory, DSO and MSO models Up to 50,000 waveform updates/second
Fully upgradablebandwidth, MSO,measurement applications, WaveGenbuilt-in 20 MHz function generator, andintegrated digital voltmeter
InfniiVision3000 X-Seriesoscilloscopes
InfniiVision7000B Seriesoscilloscopes
12.1-inch displaynearly 40%larger than competitive scopes
100 MHz to 1 GHz bandwidth, 8 Mptsmemory, DSO and MSO models
Hardware-based measurementapplications including serial decode
Up to 100,000 waveform updates/second
Upgradable MSO and measurementapplications
Breakthrough scope technology lets you see more,do more and get more for your money
NEW
1. Order N2741A for DSO701xB, N2735A
for DSO703xB, N2736A for DSO705xB,
and N2737A for DSO710xB.
2. Available on 4 channel DSO modelsand 4+16 channel MSO models only.
3. Available on MSO models only.
Now
available
to1GHz
bandwidth
Description 2000 X-Series 3000 X-Series 7000B Series
Mask/waveform limit testing DsX2MAsK DsX3MAsK N5455A
Segmented memory DsX2sgM DsX3sgM N5454A
WaveGen function generator DsX2WAVEgEN
WaveGen arb/function generator DsX3WAVEgEN
Integrated 3-digit voltmeter DsXDVM DsXDVM
Education training kit DsXEDK DsXEDK
DSO to MSO upgrade kit DsX2Ms DsX3Ms see note1
I2C/SPI trigger and decode DsX3EMBD N5423A2
RS232/UART trigger and decode DsX3CMp N5457A2
CAN/LIN trigger and decode DsX3AUT N5424A2
I2S trigger and decode DsX3AUDI N5468A2
Mil Std 1553 trigger and decode N5469A2
1553/429 trigger and decode DsX3AER
FlexRay trigger and decode DsX3FlEX N5432C2
Advanced Math DsX3ADVMATh
HDTV video analysis DsX3VID
Power measurement and analysis DsX3pWR U1881A
Xilinx FPGA dynamic probe N5406A3
Altera FPGA dynamic probe N5434A3
EW
see
PROMOpage2
see
PROMOpage2
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7/29/2019 EETimes July-August 2012
18/5618 Electronic Engineering Times Europe July/August 2012 www.electronics-eetimes.com
DESIGN & PRODUCTS POwER SUPPlIES
Any soltion to satisfy t a Ic dsin on-
straints outlined above would combine an ecient high voltagea wit latd otts and low ott nois.
A new and simple solutionLina Tnoloy as dvlod sil, yt soistiatd,
i volta invtin onoliti a Ics fo ts
aliations. T LTc3260 and LTc3261 a vsatil a
s. T LTc3261 is a i volta invtin a
tat an dliv to 100A of ott nt. Was t
LTc3260 inlds an invtin a ls bot ositiv
and nativ LDO latos tat an so to 50A ott
nt a wit low doot volta oation. T nativ
LDO ost lato is owd fo t invtin a
ott. T ositiv and nativ LDO ott voltas an b
adjstd down to 1.2V and -1.2V, stivly, sin xtnal
sisto divids. Bot dvis oat ov a wid 4.5V to 32V
input voltage range. See gures 1 and 2 for details.
T intnal a of bot t LTc3260 and LTc3261
fntions in it low qisnt nt Bst mod oation
or low noise constant frequency mode at up to 88% eciency.
In Bst mod oation, t a ott lats to
0.94 VIN
. Also, in Bst mod oation, t LTc3261 daws
only 60A of quiescent current, while the LTC3260 draws only
100A wit bot LDOs nabld. constant fqny oa-
tion oers low input and output ripple; in this mode the charge
ods an ott qal to VIN
and operates at a xed
500khz o to a oad val btwn 50khz to 500khz,
sin an xtnal sisto. Ot Ic fats inld low x-tnal ats ont wit ai aaito stability, soft-stat
circuitry to prevent excessive current ow during startup, plus
sot iit and tal ottion. T LTc3260 and LTc3261
a wll-sitd fo a vaity of aliations s as low nois
biola/invtin slis fo a i volta int, indstial/
instntation low nois bias natos, otabl dial
qint and atootiv infotainnt systs.
The LTC3260 is available in a low-prole (0.75mm) 3x4mm
14-lad DFN aka and a 16-lad mSOp aka, bot wit
a baksid tal ad. T LTc3261 is availabl in a 12-ladmSOp aka wit baksid tal ad. Oatin jntion
tat fo it dvi is -40c to +125c.
Low output rippleT LTc3260s dsin inntly ovids low nois fo-
an. T dvis i oatin fqny lads to a low
ott il. T LTc3260 LDOs ft jt tis il as
sown in Fi 3 to dliv vy low nois otts
-
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POWER SUPPLIES
Output noise as low as 1 mVp-p/0.2 mVrms
Tight 0.01% load and line regulation
Fast load transient response time (
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DESIGN & PRODUCTS POwER SUPPlIES
Comparing uninterruptible
power supply topologiesBy Mke Ems
Today, uninTErrupTiBlE powEr s (upS) sstems e
tc eme t st t cetes, cmmcts
hbs the cts sg sestve iCT eqmet. These
stts cts vbt s s ctc t the -
es svv, s ce, tete e s becmes
bsess-ctc eqemet. ue these ccmstces, e
upSs e estb the mst chce. The eve
cesse, ce e e cts tsfe t bt-
te tht e tet f the ms fs. Heve thee
e st m cts th ess ctc eqemets; these
can benet from the lower costs of an o line UPS solution.
This article therefore compares on line and o line UPS topolo-
ges, tgethe th th vt e tectve tg. as
rising energy costs sustain the demand for better energy e-
cec, ths tce s eves Ec me upS et ts
ctbt t mve puE. acts tht se upSs v
get sze s e s te. Sm esk t stmett
evces m fm tbe t th cct f t 250
VA, whereas a large data centre serving a signicant enterprise
c c f mte ts eveg t 5 MVa me.
On line UPS topology and advantages
iesectve f the sze tg, upSs ee bt-te, mes f chgg t meth f cvetg ts dC tt t aC f the ctc g ms fe. a
e upS efms these fcts th sees f e bcks
between the mains supply and the critical load - see gure 1. The
rst of these is a rectier/charger which oat charges the battery
he the ms s eset. it s ses stbe dC vtge
t the sec bck - vete hch fees the ctc .
During a mains failure the oating battery seamlessly takes over
the tsk f sg dC t the vete, t hch t s emet
cecte. Theefe, the evet ems t vsbe t the ct-
c ess the btte becmes schge. Ths semess
e ctt s ke ttct f ctc cts tht
m t be cbe f g t stchg e.
athe mj vtge ses fm the e upSs
conversion topology. The input rectier removes all the incom-
g ms skes, tsets se b cvetg t t dC.
The vete the fees the th ce e aC vefm
which is tightly regulated by the UPS. The rectier also provides
e fct cect, hch eces hgh feqec hmcs
the cet fm the ms. The e upS cts s
true power rewall, protecting sensitive instrumentation and ICT
eqmet fm ms-be bems he mvg the
esete t the ms.
Of line topologyBy contrast an o line UPS, during normal operation, feeds raw
mns to the crtc od throgh byss ne nd sttc swtch
- see gure 2. The load is therefore exposed to poor voltageregton nd ossby nose nd trnsents from the mns. if
the mns trnsgresses reset mts, the sttc swtch trnsfers
the od to the upSs nverter nd bttery chngeover brek
that can last from 2ms to 10ms. Many operators of data centres
and other sensitive equipment consider o line UPS systems
Mke Ems s Technc Ses Mnger for unnterrtbe power
Ses lmted - www.sower.co.k he cn be reched t
Fig. 2: Off line UPS topology.
Fig. 1: On line UPS operation.
-
7/29/2019 EETimes July-August 2012
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HANDHELD INSTRUMENTS DIGITAL MULTIMETERS
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22/5622 Electronic Engineering Times Europe July/August 2012 www.electronics-eetimes.com
DESIGN & PRODUCTS POwER SUPPlIES
to be nstbe for ther ctons becse of these ower
qty nd chngeover brek fctors.
Another disadvantage of a basic o line system is that, unlike
n on ne desgn, t cnnot comenste for mns sy vot-
ge mt trnsgressons. insted t mst resond mmedtey by
swtchng between byss nd the nverter for every trnsgres-
son event. Ths cn hen freqenty f the mns sy s
nstbe or the crtc od hs tght votge toernce. artfrom sbjectng the od to freqent sy nterrtons, the
battery may have its life reduced or be insuciently charged as
rest. However ctons whch cn toerte these dsd-
vantages enjoy two key cost benets from using o line topol-
ogy. Firstly, an o line UPS reduces capital costs compared with
n on ne eqvent throgh sng ower-rted comonents
and dispensing with a power rectier. Secondly, running costs
re ower becse the chrger nd nverter, wth ther nevtbe
ineciencies, are not on line during normal operation.
Line-interactive topology choicesSome UPS manufacturers also oer line-interactive UPS systems.
These use o line topology, but address the voltage transgres-
sion problems of o line systems mentioned earlier. They do so by
vg vtge egt the ms e hch ses
the load during normal operation see gure 3. This voltage
egt, b ecg the mbe f t f mt vtge evets
echg the , es the feqec f ms btte ts-
fes. at fm sbjectg the t fee e tets,
this design oers slightly better running cost eciency and less
battery wear than o line systems.
Line-interactive systems are usually implemented with buck/
boost transformers or ferro-resonant transformers. Buck/boost
tsfmes mt the vtge ve t vtge
range of +20% to -30%, however their switching involves tap
chges hch mse ste vtge chges the . le
tectve memetts bse fe-est tsfm-ers can typically supply a load voltage within 3% of nominal over
s ge f +20% t -40%. The s ve e
ctg tect fm stbces sch s eectc
e se. Heve, the ke vtge s tht the ste egh
eectc eeg t st mst pC s he the upS vete
switches on, eectively creating an on line UPS solution.
wth ts sg eeg ces, esse t mve eeg
eciency and data centre PUE has renewed interest in eco mode
et f e upSs. Ths me s ses t te
ms ect t the ctc g m et t svethe eeg tht these be st thgh the upSs ef-
ciencies. However, in exchange for this energy gain of perhaps
3%, the critical load is being exposed to mains disturbances and
transfer events, as with an o line UPS. Some users will accept
this trade-o, especially as they can choose to operate the UPS
e the th Ec me g es f cese tt
g stbces.
The bigger pictureove, ets essbe f t cetes the ctc
sestve s efe the cesse, bek e tht
e upSs c ve. Heve t mke the mst f
the tg ts tet f tect, the upSs sh be
ste s t f e scheme tht ctes f evet-
ties. For example, suppose the UPS rectier and bypass line are
fed from a common power source, which at some time suers a
power failure period exceeding the autonomy of the UPS battery.
The upS hs fthe ts, s e t the ctc s
st. i sme cts ths m be ccetbe, becse the
upS btte tm ves egh tme f the ctc
t be sht sstemtc sfe. i thes, ths t
be egh; ss f sevce s ccetbe.
One solution is to use a conguration known as a split bypass
system, in which the bypass line and UPS rectier are connected
to dierent mains supplies. This means that if the UPSs supply
fails and its battery becomes exhausted, the UPS can switch to
the st-heth bss e t eve cte thgh -tecte - e t the .
athe e se st s t cect stb gee-
t s tetve fee t the upS. if the upS etects ms
fe hch s me th tset bem, t c se
stt- sg t the geet. Ths c the t see
stbse th the upS btte tm, s the ejs
cte ce e tht tet.
as e s tectg the fm e s bems, the
upS mst s mge bems cse b the tsef. The
upSs esse t ve m be t tsfe t t bss
bt f the bss s s t vbe, ths sm eve
the f e. a bette tetve c be t the upS
t s the ve f set e; egh f tmtc
scect b tect fse cct beke. dg ths
e, the upS tsef c be tecte b beg ete
cet-mte, ece vtge me, hch s efebe t
tt ss f e.
i smm e c s tht f ctc cts thse -
vvg sestve eqmet, e upS tg s the e
st, e t ts eve f cte e semess
transfer to battery. For less critical applications, o line topology
m be stbe, s ttctve e t ts ece ct
operating costs. Line interactive systems oer an improvement on
o line topology, with better power conditioning and regulation,
ece btte e. Fe-est tsfme e tec-
tive solutions also oer seamless load transfer. Pressure to reduce
puE hs cese teest Ec me et, bt ths shesmost of the characteristics and disadvantages of o line topology.
The best ssbe e qt vbt ests cme fm
e upS sstems esge t ve e tect
stteg.
Fig. 3: Line interactive UPS with buck/boost transformer.
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23/56
The U1600 series handheld scopes get even moreversatile, and the 3000 X-Series gets a bandwidthboost to 1 GHz. See page 5.
Adding Bluetooth wireless connectivity
to handheld digital multimeters can improve
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You can now:
Viewmeasurementsmadebyuptothree
DMMs simultaneously
Workfromupto10metersawayfromhazardousor inaccessible measurement sites,
Monitorandlogdatausingyoursmartphone
or tablet
SharedataviaemailorSMS.
To enable these wireless capabilities, simply attach the
Agilent U1177A Infrared (IR)-to-Bluetooth adapter to the IR
port of any Agilent handheld DMM and install the free Agilent
Mobile Meter and Mobile ogger apps for Android devices.
To learn more, visit:
See page 7
www.agilent.com/find/hhgowireless-bluetooth
NEW
Bluetooth and the Bluetooth logos are trade-
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and licensed to Agilent Technologies, Inc.
Technical data and pricing subject to changewithout notice.
Data Source:
Agilent Technologies customer database
ublished in pain, June 1, 2012 Agilent Technologies, Inc. 2012
5991-0059EEE
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-
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24/5624 Electronic Engineering Times Europe July/August 2012 www.electronics-eetimes.com
DESIGN & PRODUCTS POwER SUPPlIES
Rugged AC/DC poer unit targets raiay
appications ith 400w outputAbsopulse Electronics has introduced the POL 400R Series railway
quality, ac/dc switch mode power supplies. The units meet rele-vant sections of EN50155 for electronic equipment used on railway
rolling stock. The devices also comply
with EN50121-3-2 and EN55022 Class
B conducted and radiated EMI and
applicable EN61000 standards. The 400
W power supplies operate from input
sources of 115 Vac (97132 Vac range)
or 230 Vac (195-264 V) and deliver
outputs of 12 Vdc, 24 Vdc, 36 Vdc, 48
Vdc or 110 Vdc. Eciency is between 80 and 90%, depending on
the input/output conguration required. The POL 400R Series has
comprehensive protection features including 3000Vdc input/out-
put isolation, overload protection and current limiting. An optional
output redundancy diode allows for parallel connection to achieve
higher output power or N+1 redundancy. Other options include
an output fail alarm and an LED adapter can be installed on the
terminal block to indicate an output ON condition. The POL 400R
units are conduction cooled and operate in a -40 to +70C cold
plate temperature range for full specication. Housed in rugged,
compact 131x66x232mm enclosures, the power supplies are fully
encapsulated in a thermally conductive MIL-grade silicon rubber
compound, which protects against high levels of shock and vibra-
tion (EN61373/IEC61373), moisture, dust and other contaminants.
ABSOPULSE Electronics
www.absopulse.com
300-w 3U CompactPCI poer suppies target
ruggedised industria and marine appicationsGresham Power Electronics has launched ruggedised versions
of the companys 300 W, 3U cPCI power supply. Available in 24
VDC, 48 VDC and universal AC input versions the ruggedised
power supply range has a conformal coat-ing for extreme industrial, MIL/COTS and
marine applications. Fully compliant to the
PICMG 2.11 Power Interface Specication
the AC 3U 300R provides 300W maximum
power in standard 3U x 8HP shelf space
with interconnection via a Positronic 47
pin connector. The new cPCI power sup-
plies are hot-swap and parallel redundant enabled. Extra-high
power density allows up to 40 A to be drawn from the +3.3 VDC
output and 30A from the +5 VDC output at 55C. The two main
outputs feature remote sense and OR-ing diodes allowing single
wire current sharing for increasing output power or n+1 redun-
dant operation. The power supply has control signals for over-
temperature, over voltage and over current protection as well
as power-good and inhibit for systems integration. Input good,
power fail and over temperature front panel LED indicators are
also tted. The new Gresham ruggedised CompactPCI power
supplies are industry standard size, 3U x 8HP, and have the
customary +5 VDC, +3.3 VDC and 12 VDC outputs. The AC
input model has a universal input from 90264 VAC and active
power factor correction. Very high eciency and power den-
sity are achieved by employing independent parallel converter
topology and state of the art synchronous rectication, low
prole magnetics and a high degree of surface mount assembly.
Gresham Power oer a very wide range of 24 VDC, 48 VDC and
AC input cPCI products including the market leading CPCI-
AC-6U-650 6U 650 W output model. The DC input versions ofcPCI power supplies are suitable for vehicle and ground station
installations while the AC models meet conventional rack based
requirements.
Gresham Power Electronics
www.greshampower.com
Open rame 40w, AC/DC poer suppies
on a 102x51mm PCBAvailable now from MicroPower Direct, the MPO-40S series
is a family of high performance 40W open frame AC/DC pow-er supplies fabricated on a compact 102x51mm PC board.
They oer the small size, robust
performance and economy required
by a wide variety of OEM applica-
tions. Eight standard models operate
from a universal input of 90 to 264
VAC, providing tightly regulated
single outputs of 3.3, 5, 9, 12, 13.8,
15, 24, or 48 VDC. Standard features
include ltering to EN55022 Class B,
compliance to EN 61000-4, and tight line/load regulation. All
models are protected for over load, and short circuit faults.
The MTBF of the MPO-40S (per MIL HDBK 217F) is greater
than 400 khours. All models are approved to EN 60950. Each
model is rated for operation over the wide operating tem-
perature range of -10C to +70C (ambient).
MicroPower Direct
www.micropowerdirect.com
3U orm-actor PSU deivers 400w o poer
confgurabe to fve DC outputsPulse Electronics 3U form-factor PSU for VPX applications
is now available with optimized Positronic P47 connections
and can be congured to deliver more than 400 W of power
plus provide an additional high
power 28 V protected output.
Pulse Electronics 3U form-factor
power supply unit (PSU) is now
available with optimised Posi-
tronic P47 connections allowing
delivery of more than 400 W of
power. The PSU, which is intended for military and aero-
space VPX-based applications, comprises a number of Pulse
Electronics high-reliability, planar technology power mod-
ules and can be congured to have up to ve DC outputs.
For example, one conguration might be: +12 V, -12 V, +5 V,
+3.3 V and an auxiliary +3.3 V; all referenced to a common
0 V. Of these output voltages, +12 V tends to be the one of
which the highest power and current are now demanded,
rather than the historic high current outputs for either the
5 V or 3V3, in light of the trend to down-regulate closer to
processors. Through the use of optimised P47 connections,
and feeding out on up to four pins rather than the single pin,
some 25 A (i.e. 300 W) of peak power can be provided on the
+12 V output. The use of P47 connections also means thePSU can be congured to provide a 28 V protected output
(rated up to 320 W).
Pulse Electronics
www.pulse-electronics.co.uk
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Sma ootprint poer suppies
are extended to 3-kVUltraVolts has increased the voltage levels of its V Series and
M Series of microsize, micropower products by up to 100%.V Series and M Series modules are now oered at 0 to 2kV,
0 to 2.5 kV, and 0 to 3 kV with 5, 12, and 24 V inputs. These
new extended voltages also come with an Enhanced Interface
(EI) Option, which adds a current monitor and enable pins. V
Series and M Series modules oer programmable regulated
output, high accuracy, and low ripple (0.01% peak to peak). The
volume for the V Series is just 13.8cm3, and the volume for the
M Series is 20.9cm3. The V Series and M Series are optimal for
handheld devices and lightweight systems. Typical applications
include avalanche
photo diodes (APD),photomultiplier tubes
(PMT), X-ray imag-
ing sensors, Pockels
cell, q-switches, and
micro-channel plates.
UltraVolt
www.ultravolt.com
www.cu .com power
Ac-Dc Power SuppliesOpen Frame l Chassis Mount l External
10W~400W
1W~2400W
0.25W~600W
Dc-Dc ConvertersBoard Mount l Chassis Mount
Digital Power ModulesIntermediate Bus l Point of Load
With a continuous focus on effi ciency,density, and system optimization,
we keep our customers on the leading-edge of the power curve.
point of loadto thefrom the wall
Efficient
SOLUTIONS
POWER
TM
150 and 200 watt IP67-
rated lED poer suppiesExcelsys Technologies LDB 150
LED and LDB 200 power supplies
provide 150 watts and 200 Watts of
constant current/constant voltagepower respectively in an IP67
rated, low prole, aluminium case.
Measuring only 198x63x35mm with
the UL8750 and CE markings, the
LDB150 and LDB 200 series each
feature two models oering 24V or
48V nominal output voltages. The
units oer constant voltage operation
up to their full load capability and
then constant current operation
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voltage. An extended universal
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active power factor correctionwith high eciency operation up
to 92.5% make these units ideal
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Additional features include -30
to +70C operating temperature,
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circuit protection high line and load
regulation, an MTBF of 1,000,000
hours per Telecordia SR-33 and
both models are backed by a 5 year
warranty. Custom output voltageand output current set-points are
available for OEM applications.
Excelsys Technologies
www.excelsys.com
-
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Exhibitor Presentations
InternationalMEM
Industry Forum
New Dynamics in t
Industry
MEMS
Exhibitor Presentations
Advanced Process Control
(APC) and Manuacturing
Secondary Equipment
and Technology Session
Advanced Packagin
Manuacturing Con
Packaging Solution
New Technologies
Wednesday
10 OctoberExhibition
10:00 17:00
Show Floor Highlights:
- Science Park
- Secondary Equipment and
Services Pavilion
- MEMS, Test and Packaging
Pavilion
- PE2012 Exhibition
Test
Exhibitor Presentations
Market Briefng
Workshop on Equipment
Assessment & Equipment
Perormance Improvements
Advanced Packagin
Manuacturing Con
Packaging Solution
New Technologies
Metrology, Process Control,
Automation and Sotware
14th European Manu
Test Conerence (E
Overcoming New Te
Challenges throug
Cooperation and In
Thursday
11 OctoberExhibition
10:00 16:00
Show Floor Highlights:
- Science Park
- Secondary Equipment and
Services Pavilion
- MEMS, Test and Packaging
Pavilion
- PE2012 Exhibition
3D IC Session Lithography Session 14th European Manu
Test Conerence (E
Overcoming New Te
Challenges throug
Cooperation and In
LED / SSL Session
Programs and Events: 8-11 October 2012
Exhibits: 9-11 October 2012
Messe Dresden, Germany
Event Schedule
Event Sponso
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g Semiconductors Business & Marketwww.plastic-electronics.org
Free Participation
PV Equipment Interace
PV Waer Traceability
PV Automation
MS
16th Fab Managers Forum
Networking Evening
MS
16th Fab Managers Forum
Conference
Press Conerence Plastic Electronics Conerence
Plenary Session
PV Ribbon
PV Silicon Materials
e
he
6th Executive Summit and
Reception
SAXONY! - Get Together
Plastic Electronics Conerence
Parallel Sessions
- OLEDs for Displays and Lighting
- Flexible and Organic PV
- Integrated Smart Systems
Photovoltaic Materials
Equipment Automation
e
he
SPECTARIS-Forum
Semiconductor Production
Technology
(organized by SPECTRARIS)
Third European Cluster