Download - for the semiconductor industry - isel

WAFER HANDLING COMPONENTS for the semiconductor industry

2

EFFICIENT & ECONOMICAL WAFER HANDLERSYOUR ADDED VALUE IN THE SEMI-CONDUCTOR INDUSTRY

• customer-specific solutions• high production depth made in Germany• ISO 1 Clean room certification for wafer handlers• free training for new customers• throughput analysis

33

This catalogue contains a variety of robotic products offered by the isel group. Our products are specifically designed and engineered to address the unique needs and requirements of the semiconductor, flat panel display, nano-technology, and related industries.

If you have special applications or product require-ments please contact us. With several thousand systems in field and many years of experience, we look forward to receiving your inquiries.

CONTENTGeneral ......................................................................4 Wafer handling robots .............................................8 Controller and software ...........................................20 Endeffectors ..............................................................24 Accessories ..............................................................26 Linear Track ..............................................................28 Prealigners ...............................................................30 Quality assurance and references .............................32 About us ..................................................................33 Notes .......................................................................34

Thomas VöllingerDivision manager+49 (0) 6659 [email protected]

Andreas MöllerTechnical sales+49 (0) 6659 [email protected]

Michael RaschkeService+49 (0) 6659 [email protected]

Vanessa KrackTeam assistant+49 (0) 6659 [email protected]

4

INNOVATIVE TECHNOLOGYThe ADVANCED controller has a defined path speed, so that speed and accelera-tion focus on the tool centre point (TCP) and not on the individual axes.

55

FIRST CLASS SERVICEFree training for new customers, telephone support and ongoing project support from experienced isel technicians. Our main focus is always to please our customers with excellent service. Trust our worldwide service, e.g. with long-term partners in Asia or our partner in the USA. The high spare part availability reduces your downtime to a minimum.

66

CUSTOMER-SPECIFIC SOLUTIONSYou will get the perfect handling system for your production. On request, we can tailor your handling robots individually from isel compo-nents to provide high-performance automation solutions that are optimally aligned to your production requirements and with significantly short production times. If the standard cannot meet the requirements, we offer you individual solutions.

7

INNOVATIVE ROBOT TECHNOLOGY FOR WAFER HANDLINGRobust and long-lasting-all-in-on solutions, customer-specific manufacturing, compre-hensive project support: isel Germany AG is the perfect partner for wafer handling components in the semiconductor industry.

8

WAFER HANDLING ROBOT | IWH WITH 2-LINK COMPACT ARM AND 7" BODY SERIES 1

CHARACTERISTICS• wafer handling up to 200 mm• cost-effective• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA)

versions available• customized solutions• incremental encoder• seamless integration with prealigner, linear

track and other peripheral components• including „STANDARD“ controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours

SPECIFICATIONS

Repeatability

T ±0.02°

R ±0.02 mm

Z ±0.02 mm

Working range

Z 7"

radial 10", 14"

theta 450°

Payload up to 1 kg*

Maximum speed

T 360°/s

R 1,000 mm/s

Z 450 mm/s

Power supply115 – 230 VAC 50 – 60 Hz 300 VA

Main interface RS-232 [DB9],Ethernet [RJ-45]

Weight approx. 19 kg

* depending on arm configuration

IWH TA07S10 F-1 (endeffector see page 24)

9

323,7 (S10)

430,8 (S14) 323,7 (S10)

430,8 (S14)

25

57

49

35,3 4x M3

S10

25

57

65

35,34x M3

50,84x M4

S14

323,7 (S10)

430,8 (S14) 323,7 (S10)

430,8 (S14)

25

57

49

35,3 4x M3

S10

25

57

65

35,34x M3

50,84x M4

S14

323,7 (S10)

430,8 (S14) 323,7 (S10)

430,8 (S14)

25

57

49

35,3

4x M3S10

25

57

65

35,34x M3

50,84x M4

S14

323,7 (S10)

430,8 (S14) 323,7 (S10)

430,8 (S14)

25

57

49

35,3 4x M3

S10

25

57

65

35,34x M3

50,84x M4

S14

IWH TA 07S_F-1 IWH BA 07S_F-1DIMENSIONS

10

IWH TA10S10HD F-1

Fraunhofer

IPAT E S T E DD E V I C E

isel Germany AGIWH-BA13S14HDF-1

Report No. IS 1103-547

WAFER HANDLING ROBOT | IWH WITH 2-LINK HEAVY DUTY ARM AND BODY SERIES 1

CHARACTERISTICS• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA)

versions available• customized solutions• absolute or incremental encoder• seamless integration with prealigner,

linear track and other peripheral components• including „STANDARD“ or „ADVANCED“

controller and software• ISO 1 clean-room

environment compatible• MTBF: >70,000 operating hours

SPECIFICATIONS

Repeatability

T ±0.02°

R ±0.02 mm

Z ±0.02 mm

Working range

Z 10", 13", 17", 21"

radial 10", 12", 14", 16", 20"

theta 500°

Payload up to 3 kg*

Maximum speed

T 360°/s

R 1,000 mm/s

Z 450 mm/s

Power supply

115 – 230 VAC 50 – 60 Hz500 VA (STANDARD)550 VA (ADVANCED)


Weight approx. 25 – 32 kg


11

330 (TA13)

588,

5 (T

A13)

690

(TA1

7)

105

329,

9 (T

A13)

431,

8 (TA

17)

254

(TA1

0)

235

277 (TA10 / TA17 / TA21)

791

,5 (

TA21

) 5

33,4

(TA

21)

513,

5 (T

A10)

266,7 (S10)

365,8 (S14)

426,7 (S16)

508 (S20)

75

304,8 (S12)

259,

1 (3

13,7

)3

x M

6

341,7 (S10) 379,8 (S12)

440,8 (S14) 500,8 (S16)

583 (S20)

633,

5 (B

A10)

90

235

708,

5 (B

A13)

810

(BA1

7)

254

(BA1

0)

330,

2 (B

A13)

431,

5 (B

A17)

911

,5 (

BA21

) 5

33,4

(BA

21)

185

225

175195

266,7 (S10)

304,8 (S12)

365,8 (S14)

426,7 (S16)

508 (S20)

75

341,7 (S10) 379,8 (S12)

440,8 (S14) 501,7 (S16)

583 (S20)

4 x M6

67

25

50,8 (4x M4)

35,3 (4x M3)

IWH TA __ S __ HD F-1 IWH BA__ S __ HD F-1

330 (TA13)

588,

5 (T

A13)

690

(TA1

7)

105

329,

9 (T

A13)

431,

8 (TA

17)

254

(TA1

0)

235

277 (TA10 / TA17 / TA21)

791

,5 (

TA21

) 5

33,4

(TA

21)

513,

5 (T

A10)

266,7 (S10)

365,8 (S14)

426,7 (S16)

508 (S20)

75

304,8 (S12)

259,

1 (3

13,7

)3

x M

6

341,7 (S10) 379,8 (S12)

440,8 (S14) 500,8 (S16)

583 (S20)

633,

5 (B

A10)

90

235

708,

5 (B

A13)

810

(BA1

7)

254

(BA1

0)

330,

2 (B

A13)

431,

5 (B

A17)

911

,5 (

BA21

) 5

33,4

(BA

21)

185

225

175195

266,7 (S10)

304,8 (S12)

365,8 (S14)

426,7 (S16)

508 (S20)

75

341,7 (S10) 379,8 (S12)

440,8 (S14) 501,7 (S16)

583 (S20)

4 x M6

67

25

50,8 (4x M4)

35,3 (4x M3)


330 (TA13)

588,

5 (T

A13)

690

(TA1

7)

105

329,

9 (T

A13)

431,

8 (TA

17)

254

(TA1

0)

235

277 (TA10 / TA17 / TA21)

791

,5 (

TA21

) 5

33,4

(TA

21)

513,

5 (T

A10)

266,7 (S10)

365,8 (S14)

426,7 (S16)

508 (S20)

75

304,8 (S12)

259,

1 (3

13,7

)3

x M

6

341,7 (S10) 379,8 (S12)

440,8 (S14) 500,8 (S16)

583 (S20)

633,

5 (B

A10)

90

235

708,

5 (B

A13)

810

(BA1

7)

254

(BA1

0)

330,

2 (B

A13)

431,

5 (B

A17)

911

,5 (

BA21

) 5

33,4

(BA

21)

185

225

175195

266,7 (S10)

304,8 (S12)

365,8 (S14)

426,7 (S16)

508 (S20)

75

341,7 (S10) 379,8 (S12)

440,8 (S14) 501,7 (S16)

583 (S20)

4 x M6

67

25

50,8 (4x M4)

35,3 (4x M3)


330 (TA13)

588,

5 (T

A13)

690

(TA1

7)

105

329,

9 (T

A13)

431,

8 (TA

17)

254

(TA1

0)

235

277 (TA10 / TA17 / TA21)

791

,5 (

TA21

) 5

33,4

(TA

21)

513,

5 (T

A10)

266,7 (S10)

365,8 (S14)

426,7 (S16)

508 (S20)

75

304,8 (S12)

259,

1 (3

13,7

)3

x M

6

341,7 (S10) 379,8 (S12)

440,8 (S14) 500,8 (S16)

583 (S20)

633,

5 (B

A10)

90

235

708,

5 (B

A13)

810

(BA1

7)

254

(BA1

0)

330,

2 (B

A13)

431,

5 (B

A17)

911

,5 (

BA21

) 5

33,4

(BA

21)

185

225

175195

266,7 (S10)

304,8 (S12)

365,8 (S14)

426,7 (S16)

508 (S20)

75

341,7 (S10) 379,8 (S12)

440,8 (S14) 501,7 (S16)

583 (S20)

4 x M6

67

25

50,8 (4x M4)

35,3 (4x M3)


IWH TA __ S __ HD F-1 IWH BA__ S __ HD F-1DIMENSIONS

12

IWH TA10S16 F-1

WAFER HANDLING ROBOT | IWH WITH 3-LINK HEAVY DUTY ARM AND BODY SERIES 1

CHARACTERISTICS• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA) versions available• customized solutions• absolute or incremental encoder• seamless integration with prealigner, linear track

and other peripheral components• including „STANDARD“ or „ADVANCED“ controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours

SPECIFICATIONS

Repeatability

T ±0.02°

R ±0.02 mm

Z ±0.02 mm

Working range

Z 10", 13", 17"

radial 16", 21", 24", 28"

theta 500°

Payload up to 3 kg*

Maximum speed

T 360°/s

R 1,000 mm/s

Z 450 mm/s

Power supply





13

Ø 330 (TA13)

690

(TA1

7)

Ø 235

Ø 277 ( TA10 / TA17 / TA21)

142

254

(TA1

0)

329,

9 (T

A13)

431,

8 (T

A17)

791,

5 (T

A21)

533,

4 (T

A21)

513,

5 (T

A10)

588,

5 (T

A13)

533,4 (S21)609,6 (S24)

75

731,5 (S28)

406,4 (S16)

Ø 278,2 (S16)Ø 342 (S21)

Ø 380 (S24)Ø 441 (S28)Ø

259

,1 (Ø

313,

7)3x

M6

670,

5 (B

A10)

745,

5 (B

A13)

847

(BA1

7)

127

330,

2 (B

A13)

431,

8 (B

A17)

533,

4 (B

A21)

948,

5 (B

A21)

254

(BA1

0)

Ø 235

185

225

175195

406,4 (S16)533,4 (S21)

609,6 (S24)731,5 (S28)

75

Ø 278,2 (S16)Ø 342 (S21)Ø 380 (S24)

Ø 441 (S28)

4xM6

Ø 67

25

Ø 50,8 (4x M4)

Ø 35,3 (4x M3)

IWH TA __ S __ F-1 IWH BA __ S __ F-1

DIMENSIONS

14

IWH TA13S24HDP F-3

WAFER HANDLING ROBOT | IWH WITH 2-LINK HDPLUS ARM AND BODY SERIES 3

CHARACTERISTICS• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA) versions available• customized solutions• absolute or incremental encoder• seamless integration with prealigner, linear track

and other peripheral components• including „STANDARD“ or „ADVANCED“

controller and software• MTBF: >70,000 operating hours

SPECIFICATIONS

Repeatability

T ±0.02° / ±0.03°

R ±0.02 mm

Z ±0.02 mm

Working range

Z 7", 10", 13", 15", 17", 21"

radial 16", 24"

theta 450°

Payload up to 5 kg*

Maximum speed

T 180°/s / 360°/s

R 800 mm/s

Z 425 mm/s

Power supply





15

7“ [3

72,5

mm

]10

“ [4

49m

m]

13“

[525

mm

]17

“ [5

76m

m]

21“[

677,

6mm

]DIMENSIONS

mou

ntin

g sc

rew

s

turning radius min. Ø 700 mm

16

WAFER HANDLING ROBOT | IWH WITH 2-LINK DUAL ARM AND BODY SERIES 3

CHARACTERISTICS• excellent structural rigidity• wafer handling up to 300mm• maximum reliability and precision• seamless integration with prealigner, linear track

and other peripheral components• very smooth running• backlash free Harmonic Drive® gears• absolute or incremental encoder• integrated 2-channel vacuum display

(STANDARD controller)• fully integrated software adjustable vacuum

sensors (ADVANCED controller)• including „STANDARD“ or „ADVANCED“

controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours• option: 2 flip modules iFM-300-3

SPECIFICATIONS

Repeatability

T ±0.02°

R ±0.02 mm

Z ±0.02 mm

Working range

Z 7", 10", 13", 15", 17", 21"

radial 10", 14"

theta 500°

Payload up to 1.25 kg (per arm)*

Maximum speed

T 360°/s

R 1,100 mm/s

Z 425 mm/s

Power supply




*depending on arm configuration

IWH F-3 dual arm robot

Vaccum displays with STANDARD controller

17

Ø330 (TA)

7"

[387

,5m

m]

10"

[464

mm

]13

" [5

40m

m]

17"

[591

mm

]21

" [6

92,6

mm

]

11,18284

10,98Ø279

7"

[177

,8m

m]

10" [

254m

m]

13" [

330m

m]

17" [

431,

8mm

]21

" [53

3,4m

m]

[0,3

9]10

2x5,25" / 7,2"

110,5

210

4xM

8

166,

2 Ø

200

Waf

er21

6,5

Ø30

0 W

afer

455 (10" Arm Ø200 Wafer)555 (14" Arm Ø300 Wafer)

530 (10" Arm Ø200 Wafer)696 (14" Arm Ø300 Wafer)

Ø30

0 3x

M6

DIMENSIONS

18

WAFER HANDLING ROBOT | IWH WITH SHD SUPER HEAVY DUTY DUAL ARM AND SHD BODY

CHARACTERISTICS• excellent structural rigidity• wafer handling of up to 450 mm• maximum reliability and precision• seamless integration with prealigner, linear track

and other peripheral components• very smooth running• backlash free Harmonic Drive® gears• absolute or incremental encoder• fully integrated software adjustable vacuum sensors

(ADVANCED controller)• including „ADVANCED“ controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours• option: 2 flip modules iFM-300-3

SPECIFICATIONSSPECIFICATIONS

Repeatability

T ±0.02°

R ±0.02 mm

Z ±0.02 mm

Working range

Z 13", 15"

radial 14"

theta 500°

Payload up to 3 kg (per arm)*

Maximum speed

T 180°/s

R 800 mm/s

Z 300 mm/s

Power supply115 – 230 VAC 50 – 60 Hz800 VA


Weight approx. 60 kg

*depending on arm configuration

IWH F-3 SHD dual arm robot (example of application, endeffectors see page 24)

19

420 (TA)

350

13" [

542m

m]

15" [

614m

m]

10

13" [

330m

m]

15" [

400m

m]

156

,5

7,2" [182,9mm]

120

260

4x M

8

217

,5

300

23,54" [598 mm]

24,80

27,8" [705,8mm]

3903xM6

DIMENSIONS

mou

ntin

g sc

rew

s

turning radius min. Ø 630 mm

20

CONTROLLER & SOFTWARE | „ADVANCED“

The ADVANCED controller is based on a continuous path control with integrated safety PLC which incorporates state-of-the-art technology. The innovative path control guaranties a constant and maximum speed on the TCP which ensures additional safety during handling substrates. The controller runs internally with the Powerlink real time bus system which improves performance even further.

CHARACTERISTICS• innovative user interface• powerful control electronics „State of the Art“• integrated safety control according

to DIN EN ISO 10218-1• resolver or EnDat-2.2 encoder• 19" rack 4HE or desk version• interface: Ethernet, RS232 • dimensions: 392 x 169 x 415 mm• weight: 10 kg• option: teach pendant• third party certified by TÜV for

- ISO 10218-1 (Robot safety) - USA compliance - Korea compliance

ADVANCED controller front

ADVANCED controller back

21

ACCESSORYTEACH PENDANT for ADVANCED controller• optimal support when setting up an isel wafer handler

with ADVANCED controller• GUI on a 6,5" VGA colour display• ergonomic multi-grip for fatigue-free work• hand wheel for jogging operation• enable switch and stop button for safe

manual operation (complies with EN ISO 13850)

The supported high voltage technology offers very dynamic behavior when using an additional linear motor axis. isel ADVANCED controllers complies with current international standards for industrial robots. The operating interface integrated into the controller can be visualized on any PC with a VNC viewer. It provides an innovative and intuitive GUI for setting up and managing the ADVANCED robot system. The ADVANCED robot controller is made by isel.

SOFTWARE

22

CONTROLLER & SOFTWARE | „STANDARD“

The controller is completely integrated into wafer handler body. It is in widespread use for over 15 years and proved in the semiconductor industry.

Because there is no separate external controller the handling system requires only very little space. It is also well suited for replacing other robot systems (emulations are available on request).

CHARACTERISTICS• less wiring• large range of functions• alignment on the fly function (OTF)• integrated electronic (all in one design)• 15 years field experience• interface: RS232, Ethernet• option: hand terminal

isel STANDARD robot controllerAll-in-one-design

23

RCC software

ACCESSORYHAND TERMINAL for STANDARD controller• optimal support while teaching

an isel wafer handler • keyboard layout optimized

for isel wafer handlers• terminal function• teach function

SOFTWAREThe Windows-based RCC software supplies support for setting up and management of the robot system and its extensive functions. The "STANDARD" hardware and software provides a huge range of pre-installed macro programmes.

24

END EFFECTORS | IEE SERIES

CHARACTERISTICS• for wafer sizes up to 18" (450 mm)• high rigidity• good cost/performance ratio• PTFE SafeCoat (Standard) for each of our robots• TAP to EE 30 mm (Standard bracket)

OPTIONS• different wafer mapping sensors• several surface coatings• special designs: pocket - friction wafer -

edge grip - exclusion zone vacuum

Paddle with mapping sensor

Horse shoe without mapping sensor

Double with through beam mapping

Exclusion zone vacuum with mapping sensor

Customized Filmring

Our end effectors are designed for wafer handling between the different stations. iselROBOTIK end effectors are available for wafer sizes from 2“ (50mm) up to 18“ (450mm). Each of our end effector fits each of our robots.

25

OPTIONS• different wafer mapping sensors• several surface coatings• special designs: pocket - friction wafer -

edge grip - exclusion zone vacuum

ACCESSORYVACUUM CONTROL• fast response• free programmable• resolution of 0.001 bar• integrated in endeffector• bicoloured display• useable for all vacuum

end effectors

Extended version

Ceramic

Edge grip

Vacuum exclusion zone

The end effectors are optionally available with many different contact materials such as PTFE (SafeCoat), PEEK, VITON, KALREZ. In addition to this we also offer many special designs for your special wafers and substrates. For your individual end effector requirements we will find the solution.

26

IMS-MDW1

Separate through beam unit

PD45

Through beam sensor

WAFER MAPPING SENSORS

IMS-MDW1• LED light source• measuring distance 45 mm (1.75")• PNP / NPN switchable

PD45• laser (class 2) light source• measuring distance 200 mm or 300 mm• small laser dot and housing

THROUGH BEAM SENSOR• optional to reflective Sensor• integrated in endeffector• or as separate unit • more suitable for thin wafer mapping

FLIP MODULE IFM-300-3• precise wafer flipping by adjustable

mechanical stops• universal endeffector adapter• adjustable hard stop damping• adjustable flip speed• option: lateral mapping sensor• TAP to EE 100 mm

ACCESSORIES

27

YAW AXIS• 4th axis upgrade for a three-axis system

(yaw angle in the R axis)• in-line handling of rectangular substrates • in-line handling without a linear track• upgrade for existing isel HD arm wafer

handling robots

ALIGNMENT ON THE FLY• wafer centering without prealigner• offset centering during PUT movement• no alignment station necessary• time efficient wafer centering

END EFFECTOR CHANGER(ADVANCED controller only)

• full automatically endeffector changing system

• software endeffector management • for all endeffector types

= laser sensors

28

CHARACTERISTICS• speed up to 4,5m/s• acceleration up to 10 m/s²• total length up to 32 m• repeatability +/- 0.01 mm• option: top or side mounting• fully integrated into the robot system• direct drive motor• low-maintenance• MTBF: >70,000 operating hours

SPECIFICATIONSRepeatability ±0.01 mm

Motor direct drive

Maximum speed 4.5 m/s

Maximum length 32 m

Maximum acceleration 10 m/s²

In order to increase the robot's radius of action, the handling system can simply be expanded by adding a further axis that is fully integrated into the system. Depending on the application, it can be mounted below the wafer handler or with the wafer handler mounted on the side. Due to the use of linear motors, the linear axes are very dynamic, low-maintenance and smooth-running. They achieve high acceleration values and speeds, approach positions very precisely and work practically wear-free due to the omission of mechanical connecting links. Due to the segment design, lengths of up to 32 meters with absolute encoders can be realized.

top mounted

side mounted

LINEAR TRACK | ILD SERIES

29

111

50

14.58.1

12 7

37.5

150

A

211

Length

260

50150

235

~ 26

50

190 148

Accessories: assemble set

111

50

14.58.1

12 737.5

150

A

211

Length

260

50150

235

~ 26

50

190 148

Accessories: assemble set

DIMENSIONS

ACCESSORY

ASSEMBLE SET for aligning the axes (consisting of two adapter plates, four nuts, two leveling bolts and mounting material)

30

PREALIGNERS | LPA SERIES

FEATURES

THREE-AXIS PREALIGNERS• innovative all-in-one design• alignment times < 3.5 seconds• repeatability: linear 0.025 mm,

circular 0.02°• contactless measurement using LED

and CCD sensor• integrated scanning electronics• standalone capability• chuck or pin load and change to another

wafer size without rebuild• transparent, semi-transparent, holed and

opaque wafers can be aligned• SEMI, flat and notch wafer specifications• for wafer sizes from 2" to 18"• connection fields available from the side

and from below• option: external (notch sensor) • option: dual layer for bonded wafer

SINGLE AXIS PREALIGNER• alignment times < 2.5 seconds• contactless measurement using LED

and CCD sensor• integrated scanning electronics• chuck load• change to another wafer size without rebuild• transparent, semi-transparent, holed and

opaque wafers can be aligned• All, flat and notch wafer specifications• for wafer sizes from 3" to 12"• connection panel available at the side

and from below

The LPA series prealigners are an innovative, high-precision, class 1 clean room solution with integrated scan electronics. These prealigners make it possible to align objects from 45 mm to 480 mm, regardless of their degree of transparency. They centre wafers, masks and other substrates, detect notches, flats or other marks and align the object exactly and independently. The prealigners are developed and produced by Logosol Inc. USA. isel Germany AG is the exclusive authorised distributor for Europe.

Three-axis prealigner LPA series with lateral connectors and

PEEK-pin/chuck

Three-axis edge handling prealigner with lateral connectors

Single-axis prealigner LPA series

with bottom connectors configuration

31

CHARACTERISTICS

26-3 38-3 58-3 312-3 812-3 1218-3 25-1E 38-1E 58-1E 312-1E 812-1E 1218-1E

N/A N/A

10mm 9mm

W

L 404mm 328mm

H

More than 70000 hours

267mm 317mm

Specifications Standalone Embedded

450mm

Square Substrates

Wafer Diameter

MTBF

Host Interface

Flat/Notch Compatibility

Wafer Opacity

Cleanliness

RS 232, Ethernet

Semi Standards Compliant

Edge Handling

PREALIGNER MODEL

150mm

200mm

300mm

100mm

3“

2“

125mm

Type

4EH, 45EH

5EH, 45EH, 56EH

6EH, 56EH

8EH, 8ET

173mm

1.7mm to 2.0mm10mm

0.06º

0.04º

50um

Edge Handling

190mm to 206mm

267mm or 317mm

95mm

266mm

191mm

12ET

N/A

Centering Accuracy

Facilities Required

12mm

0.04º

173mm

190mm

Weight

Servo Axes

Handling

0.02º

0.04º

0.02º

25um 25um

5.3kg to 6.0kg

Transparent, Semi-Transparent

Class 1

10000 CPREncoder

24000 CPREncoder

Angular Accuracy (3 Sigma)

(3 Sigma)

BodyDimensions

Max Initial Offset

3.4kg to 3.8kg

One

5.0kg to 5.7kg

Three Three

Vacuum Chuck and Pins Vacuum Chuck

100-240VAC, 50/60Hz; 48VA or 24 DC/2A, Vacuum 12“ Hg for vacuum retention

32

HSEB

INNOLASInnovative

Lasertechnologie

HSEB

INNOLASInnovative

Lasertechnologie

REFERENCESSubsequently you'll find a selection of companies that participated in a successful co-operation with us and that successfully use our products:

QUALITY ASSURANCEThe quality assurance system for our products includes all areas which contribute to the attainment of quality objectives. It is based on statutory requirements, customer requirements and the internal quality requirements of isel Germany AG.

The quality assurance system ensures that the production processes are controllable and that only products that meet the respective specifi-cations are forwarded to the next working stage. We hold DIN ISO 9001:2015 certification.

33

isel Germany AG was founded in 1972 and is the core company of the global isel Group. The company develops, manufactures, markets, sells and services systems and components used for automation, automation control systems, robots and related handling systems. The company supports the global market needs of the Semiconductor Equipment and related industries, its activities are centered on the company‘s expertise in automation and inter-related technologies and include a broad array of customer applications using the isel product line as the foundation to address those needs. isel Germany AG is located in Eichenzell (Hesse) and Dermbach (Thuringia), Germany.

Plant Dermbach

Plant Eichenzell

Plant Eiterfeld

Plant Berlin

ELECTRONICS SOFTWARE SYSTEMSMECHANICS

WWW.ISELROBOTIK.COM

Tech

nica

l spe

cifica

tions

sub

ject

s to

cha

nge.

2020

0626

_TK_

Robo

tik

As at: october 2019

Robotic Department Bürgermeister-Ebert-Straße 40 36124 Eichenzell / Germany Phone: +49 (0) 66 59 / 981-0 E-Mail: [email protected]

development, production and sales of components and systems in the sectors mechanics, electronics, software and systems

PROGRAM OF THE -GROUP

Download - for the semiconductor industry - isel

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