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Geometry baseline of the new Inner
Tracking System, ALICE
Chinorat KobdajSuranaree University of
Technology, ThailandOn behalf of the ALICE
CollaborationAug 8, 2013
APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
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The ALICE Detector
The Current ALICE Detector2
APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
Introduction to the Inner Tracking System upgrade
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ALICE ITS (present detector)
ALICE ITS
Current ITS 6 concentric barrels, 3 different technologies• 2 layers of silicon pixel (SPD)• 2 layers of silicon drift (SDD)• 2 layers of silicon strips (SSD)
The Current ALICE Inner Tracking System
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ALICE ITS
ALICE ITS
APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
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LoI and ITS CDR endorsed by LHCC in Sep 2012
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2013 Selection of Technology
2014 Final Design
2015-2016 Construction / Test detector modules
ALICE ITS Upgrade
2017-2018 Assembly / Installation
2019-2020 Test run / Full run
2021 Comple
te
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LongShutdown
1
EvaluationTechnology
Construction and Installation
Time Line
R &D
2012 2013 2014 2015 2016 2017 2018
Today
2019 2020 2021 2022
ConceptualDesign Report
Prototype
TechnicalDesign Report
FinalDesign
andValidation
Pb-Pbat
√sNN= 5.1 TeV
Pb-Pbat
√sNN = 5.5 TeV
LongShutdown
2Production/Construction
and Test of Detector
modulesPre-commissioning
and Assembly
LongShutdown
3Complete
Ar-Arhigh
luminosity run
p-Pbat
full energy
Run
Pb-Pb
Selectionof
Technologies Installation in the cavern
Full deployment of
DAQ/HLT
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New ITS Design goals
1. Improve impact parameter resolution by a factor of ~3• Get closer to IP (position of first
layer): 39mm 22mm • Reduce material budget: X/X0
/layer: ~1.14% ~ 0.3% (for inner layers)• Reduce pixel size
ocurrently 50mm x 425mmmonolithic pixels O(20mm x 20mm), hybrid pixels state-of-the-art O(50mm x 50mm)
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APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea 8
2. Improve tracking efficiency and pT resolution at low pT
• Increase granularity: 6 layers 7 layers , reduce pixel size
• Increase radial extension: 39-430 mm 22– 430 (500) mm
3. Fast readout• readout of Pb-Pb interactions
at > 50 kHz and pp interactions at ~ several MHz
4. Fast insertion/removal for yearly maintenance• possibility to replace non
functioning detector modules during yearly shutdown
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Upgrade optionsTwo design options have being studied A.7 layers of pixel
detectors (baseline)B.3 inner layers of pixel
detectors and 4 outer layers of strip detectors
7 layers of pixels
Option A
3 layers of pixels
4 layers of strips
Option B
Pixels: O(20x20µm2 – 50 x 50µm2) Pixels: O( 20x20µm2
– 50 x 50µm2)Strips: 95 µm x 2 cm, double sided 9
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New ITS (baseline)Inner Barrel: 3 layersOuter Barrel: 4 layersDetector module (Stave) consists of - Carbon fiber mechanical support- Cooling unit- Polyimide printed circuit board- Silicon chips (CMOS sensors)
10APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
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Inner Barrel Layers • 3 innermost layers at
r= 22, 28 and 36 mm• Same z-length: 27 cm• Assumed chip size: 15
mm x 30 mm >> 9 chips/module
• X/X0≤ 0.3%Modules Chips
Layer 1 12 108Layer 2 16 144Layer 3 20 180Total 48 432
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Middle and Outer Barrel Layers• 4 outermost layers at
r= 48, 52, 96 and 102 mm• 84 cm < z-length <
150 cm• Double chip rows per
module• X/X0≤ 0.8%
Modules
Chips
Layer 4
48 2688
Layer 5
52 2912
Layer 6
96 9600
Layer 7
102 10200
Total 298 25400
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2
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Project Coordination(PL, DPL, SPL, TC, RC,
Upgrade Tasks Coordinators)
Institute Board
(PL, DPL, SPL, TC, Team Leaders)
3. Pixel chip design4. Sensor Post Processing and Mass test
5. Characterization and Qualification6. Inner Layers Module7. Middle Layers Module8. Outer Layers Module
10.Readout Electronics
2. Detector Simulation and Reconstruction1. Physics Performance
PROJECT ORGANIZATION
ITS Operation(RC, PL, DPL, SPL, TC, QAC, CC,
experts)9. Mechanics and Cooling
UPG
RAD
E
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OrganizationParticipating Institutes• CERN• China (Wuhan)• Czech Republic
(Prague)• France IN2P3-
CNRS (Strasbourg)• Italy INFN (Bari,
Bologna, Cagliari, Catania, Frascati, Legnaro, Padova, Roma, Torino, Trieste)
• Korea (Inha, Pusan, Yonsei)
• Netherlands (Nikhef and Utrecht)
APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
• Pakistan (COMSATS)• Russia (St.
Petersburg)• Slovakia (Kosice
IEP)• Thailand (Nakhon
Ratchasima SUT)• UK STFC
(Daresbury, RAL), Univ. of Birmingham
• Ukraine (Kharkov, Kiev)
• USA (Berkeley)
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Upgraded beampipe - studies
C- side Al section
A-side Al section
Central Be part
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The upgraded beampipe, drawing v4.0
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Effect of Al-extension on A sideBackground visible in Central Barrel detectors
a) Entries in (x,y) plane
b) Entries vs Radius
Extract only the secondary vertices physics events to see only the contribution from the new beampipe
PIPE
New ITS
PhysicsBackground
APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
MC with the beampipe
MC without the beampipe
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A-side Al section
C- side Al section
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Secondary vertices versus z direction
Effect of Al-extension on A sideBackground visible in Central Barrel detectors
MC settings: HiJing central PbPb, interaction diamond: 6 cmSecondary particles further out (>20cm) are clearly negligible ...
Effect ofAl-part
(|z|>40cm)is negligible
< 1 per eventAPCTP 2013 LHC Physics Workshop @ Korea, August 6-8,
2013, Konkuk Univeristy, Seoul, South Korea
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Studies: Impact of materials in forward direction
Compares number of gamma conversion between Al and Be extension on the A-side
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Results of the beampipe studies
● No impact of Al-extension in terms of background in the Central Detectors
● 80 cm is sufficient for the central part (Be) of the new beam-pipe (no significant background is observed from the Al part further away).
● Forward direction, difference between Al/Be clearly visible, up to 60% of gammas converted at eta~5.5
● Impact of Al-extension on the physics case to be answered by the Forward-Calorimeter teamAPCTP 2013 LHC Physics Workshop @ Korea, August 6-8,
2013, Konkuk Univeristy, Seoul, South Korea
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Model 0 in the CDRwith cooling pipes at the
vertices
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Stave modeling and material budgets
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Model 0 in Aliroot of the 1st layer
a = 23 degreeAPCTP 2013 LHC Physics Workshop @ Korea, August 6-8,
2013, Konkuk Univeristy, Seoul, South Korea23
Model 0 material budgetcooling pipe outer radius of 1.5 mm
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Model 1 in the CDRwith polyimide microchannel
cooling
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Model 1 in Aliroot of the 1st layer
a = 57 degreeAPCTP 2013 LHC Physics Workshop @ Korea, August 6-8,
2013, Konkuk Univeristy, Seoul, South Korea25
Model 1 material budget
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Model 2 in the CDR with pipe cooling in the
middle
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Model 2.1 in AliRoot of the 1st layer
a = 57 degree
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Model 2.1 Material budget with Cooling pipe outer radius =1.5 mm
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Model 2.2 in Aliroot of the 1st layer
a = 57 degree
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Model 2.2 Material budget with cooling pipe outer radius =1.0 mm
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Model 3 in the CDR with silicon microchannel cooling
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Model 3 in Aliroot
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Model 3 Material budget
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Material Budgets of different models
CDR(no
overlaps)
Aliroot with overlaps
Model 0
0.26% 0.324%
Model 1
0.30% 0.357%
Model 2.12.2
0.31%
-
0.378%0.282%
Model 3
- 0.257% 31APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
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The Flip-chip Mounting
Consider the interconnection between ASIC and the module PCB
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CHIP 1
CHIP 2
CHIP 3
CHIP 4CHIP 5
CHIP 6
CHIP 7
CHIP 8
CHIP 9
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APCTP 2013 LHC Physics Workshop @ Korea, August 6-8, 2013, Konkuk Univeristy, Seoul, South Korea
Mounting to the stave
PCB design – inner layer modulesContact pads distributed
over chip surface:
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Aliroot Model in TGeo
CHIP 1CHIP 2
CHIP 3CHIP 4
CHIP 5CHIP 6
CHIP 7CHIP 8CHIP 9
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Results of the flip-chip mounting • Radius of solder balls does not affect the total material budget much (0.002%) • The thickness of the flex cable contributes significantly to the total material budget
Our studies confirm the material budget for inner layers : X/X0 /layer ~ 0.3%
Conclusion
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