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Address : 410, 3NA SIHWA Industrial Complex 1290-9,
Jungwangdong, Siheugsi, Kyunggi-do, KOREA
TEL : 82-31-499-4999 / FAX : 82-31-499-3094 /
E-mail : [email protected]
URL : http://www.shinduk.com
Company Profile
Contents
General Information
Organization Chart
Financial Status
Sales Revenue Status
Manufacturing Status
Quality Status
Supply Chain Status
page 2
General Information
page 3
History
1986 FEB. Established as PCB Manufacturer
1987 J UN. Recognized by U.L. for PCB(UL.FILE NO: E108545)
1990 MAR. Joined Korean Standards Association
1993 NOV. Installed a Full Automatic MFG Line
1996 J UL. Installed DS & MLB Line
1999 FEB. Approved ISO 9002
2002 OCT. Approved QS 9000
2005 SEP. Approved ISO 14001
2006 FEB. Approved Hyundai Motor SQ
2007 J AN. Approved TS 16949
2011 Dec. Awarded The Superior S&M Companies
2014 Aug. Started Plant Expansion
Major Products
page 5
TYCO AMP TYCO AMPYOUNG HWA
TECHYURA
LM SJB
4L 2/2/2/2 oz 6L 4/4 oz
T 319 UH
6L 3/3/3/3 oz
Z2XX
10L 2/12/12/2 oz
LF BLOCK
CE BOX POWER JE BOX
PIC
10L
CAM
CAMERA
12L
LF
COM
KOTEK
12L 14L
AUTO
AUTO
NoNonn
Major Products
Major Products
8• The entry in each cell denotes volume technology in production
KEY FACTORS Current Near Term (1~2 year) Long Term (3~5 year)
Min. Line Width / Spaces (mm)
-------------- Outerlayers
-------------- Innerlayers
0.1/0.1
0.1/0.1
0.075/0.075
0.075/0.075
0.050/0.050
0.050/0.050
Max. Layer Count 18 24 32
Min. Finished Hole size (mm) 0.20/24Layer 0.15/24Layer 0.10/24Layer
Min. SMD Pitch (m/m) 0.4 0.3 0.3
Min. Core Thickness (mm) 0.1 0.1 0.1
Copper thickness (Base copper)
---------- Outerlayers (oz)
---------- Innerlayers (oz)
0.5 ~12
0.5~12
0.5 ~ 25
0.5 ~ 25
0.5 ~ 25
0.5 ~ 25
Solder Mask Type PSR PSR PSR
Surface Finish
HASL / OSP /
Immersion Gold /
Immersion Tin /
Heavy Solder Coating
HASL / OSP /
Immersion Gold /
Immersion Tin /
Heavy Solder Coating
HASL / OSP /
Immersion Gold /
Immersion Tin /
Heavy Solder Coating
Impedance Control(±10%) 50 / 90 / 100Ω 50 / 90 / 100Ω 50 / 90 / 100Ω
New Material / Process Teflon, Polymide Megtron (Getek)
New Technology (Build up PCB) Micro - via Micro - via Micro – via
Technology Roadmap
Organization Chart
Organization Chart
Department 2014(New employees) 2014 Retiremett Current staff Turnover
Management 1 0 25 0%
Production 17 14 53 1.5%
Total 18 14 77 1.5%
Department MAN
General Affairs 3
Engineering 5
Facilities 3
Sales & Marketing 5
Quality Control 12
Production 82
Total 110
Administration
4%
Sales&Marketin
g
9%Quality Control16%
FACHNICAL3%
Production68%
Technical4%
Communication information Communication information
Production team Sales & Marketing
Name : Ki Jung Park
Mobile : 010-3137-5859
E-m : [email protected]
Name : Ki Jung Park
Mobile : 010-3137-5859
E-m : [email protected]
Quality Management Overseas Sales
CEOCEO
Name : Sang Chel Park
Mobile : 010-3301-4819
E- mile : [email protected]
Name : Sang Chel Park
Mobile : 010-3301-4819
E- mile : [email protected]
Name : Mun Tae Kim
Mobile : 010-8975-8313
E-m : [email protected]
Name : Mun Tae Kim
Mobile : 010-8975-8313
E-m : [email protected]
Name : Dae Yeoul Park
Mobile : 010-3315-7331
E-m : [email protected]
Name : Dae Yeoul Park
Mobile : 010-3315-7331
E-m : [email protected]
Name : Steve Yang
Mobile : 010-8748-3103
E-m : [email protected]
Name : Steve Yang
Mobile : 010-8748-3103
E-m : [email protected]
Sales Revenue Status
Sales Revenue Status
page 13
Revenue by CustomerRevenue by Customer
Revenue by CustomerRevenue by Customer
Telecommunication25%
Electron15%
Automotive60%
DELCOM18.8%
LG Electornics3%
Young Hwa7.4%
VISSEMELECTRONICS
4.3%
TEConnectivity
48.4%
OTHERINDUSTRIES
11.3%
Revenue by Industry Revenue by Industry
millon in US$
0
5
10
15
20
25
millon in us$ 20 21 21 25
2012 2013 2014 2015
Investment Planning and Performance
page 14
• Investment millon
10,000 in US$
2014
New Construction Ltd( 신축건물 공사 ) 1 $90
$120Stacking ( 면취기 , 스텍킹 ) 1 $9
AUTO BBT CHECK 1 $11
TOTAL 28 254
Manufacturing Status
Manufacturing LocationsDomestic plant
Division 1 plant
Company Name ShinDuk Electronics
Address 1290-9 Jeongwan-Dong Shiheung-City Gyeonggi-do
Factory size(m²)Earth 3,500m²
Floor Space 5,126m²
Year of Establishment February 25, 1986
Main Products Printed Circuit Board
Capacity 25.000 m²
Utilization rate 75%
Self / rent Self
Capa / Month
Film Plotter 1 ea 7,000ea
Manufacture
Line
DES 1 Line /
Month
Inner 20,000 Out 15,000
Hot Press Line Press 3ea 10,000 /Month
Drill Line N.C 6ea 15,000 /Month
Cu Plating Line Electrical Immersion
1 Line 1 Line
15,000 /Month
20,000 /Month
Printing Line 3 Line 20,000 /Month
Inspection
Equipment A.O.I 4 Line
/Mont
h
Inner 20,000
Out 15,000
B.B.T 4 ea 20,000 /Month
NO Year 2012 Year 2013 Year 2014 2015
ITEM D/S MLBOthers(BUILD) D/S MLB
Others(BUILD) D/S MLB
Others(BUILD) MLB
/
14,000
(70%)
5,000
(20%)
10%
12,000
(50%)
8,000
(40%)
10%
12,000
(45%)
12,000
(45%)10%
50% Up
TOTAL 20,000 21,000 25,000
D/S , MLB
Manufacture Capacity
Manufacturing Facilities and Equipment• Manufacturing Equipment
page 18
Division Name of Equipment Quantity
CAM Plotter 1EA
Drill LineDrill 6EARouters 2EA
Plating line
Desmear 1 Line
Non-electrolytic plating 1 Line
Electroplating 1 Line
Forming line circuit
Layered oxide 1 LineLaminated Press 3EA
Formed D / F circuit 1 Line
Print line
PSR Print 3 LinePSR exposure 1 LinePrint Making 3 LineDrying 2EA
Testing Equipment
FILM AOI 1EAHole AOI 1EAAOI circuit 2EAHOLE CHECK 1EA
AUTO BIT CHECK 1EA
B.B.T 4EA
Manufacturing ProcessesCAM (Plotter) HOT PRESS CNC DRILL Copper plating Auto Exposure
Circuit Formation AOI PSR Printing Auto Exposure Mraking Printing
Final Drying Router Final Finish TIN BBT Test Final Inspection
QUALITY SYSTEM
page 21
CONTENTS
CERTIFICATE Organization Quality System Flow Chart Incoming Inspection Process Supplier Management Process Internal Audit SYSTEM Nonconforming Management Process Process Change Notification Process Reliability Assurance Process- Reliability Assurance Item List Outgoing Inspection Process Visual Inspection Method Customer Complain Management System Document Control System Statistical Techniques
CERTIFICATE
Quality Organization
Quality/Reliability
AssuranceQuality/Reliability
Assurance
DocumentDocument VendorVendor EducationEducationInspectionInspection AnalysisAnalysis
• Incoming Inspection
• Outgoing Inspection
• Reliability Analysis
• Customer Incidents Analysis
• Document Control
• Standardi- zation
• Vendor Audit
• SPC Training
• QC Training
Quality System Flow
Customer Sales
Purchase
Manufacture
Customer
Design
Vendor
Production Plan
Production engineer
Reliability test
Incoming Inspect
Outgoing InspectProcess Quality Control
NG
Good
Nonconforming handling
Data Update
NG
NG
Good
Good
Customer discontent handling
Process Audit & Nonconforming handling
Nonconforming material handling
VENDOR PURCHASEQuality Assurance ENGINEER
Purchase Order
Request of Specification Approval
Review & Approve of Specification
Accept of Purchase Order
Materials/product
Warehousing of Materials/product
Incoming Inspect
Materials put in manufacture line
Materials/product
NG
GoodNonconforming Materials/product handling (Notice of Supplier & Receive of Countermeasure)
Incoming Inspection Process
Supplier Exploitation
N
Regular Valuation Operation
support & After Management
A,B Level
Supplier Improvement
Operation
Registration Cancel
C, D Level
Relation Countersignature Conference
Feed Back
NY
Quality AssuranceRelation Countersignature Supplier
Supplier Valuation
Relation paper
presentation
Result Decision
Y
Contract & After Management
1. Supplier information & Supplier actual condition Report2. Supplier Valuation Operation Valuation Sheet3. Supplier Valuation Operation Valuation Sheet4. Corrective measure request5. Improvement counterplan
1
2
34
45
Supplier Management Process
Internal Audit SYSTEM
Internal Audit Dept. Related Dept. CEO
Review and approve
Prepare a written correction arrangement
Auditing
Notify auditing date
Preparation
Notify corrected arrangement
Record MBO
Notify detailed mistakes
Inspect the check lists for next audit
Add more detail on the check lists for next audit
System Audit : Planning teamProcess Audit : QRA team5S Audit : Manufacturing
Organize team
Non-conforming Management ProcessProduction Control Quality Assurance
Check of phenomenon &
Analyze root cause
Record/Register/Distribution
Scrapping review
Individual management & Rework (light
inferior)
Prevent Reoccurrence
Incongruity make a report (fatal,
medium incongruity)
NG
Good
Event of Non-conformity
lot
Discernment & Isolation
(fatal, medium , light division)
Non-conformity Management method
Meeting & Lot Progress yes or no
decision
Process Conditional
set Rework or
Select
1.D+ 3hr Management after In department head report 2. D+ 1day Management after In departme nt head report 3. D+ 2day Management after In
department head report 4. D+ 3day Management after In
departmen t head report
1
2
3
4
Scrapping
Process Change Notification ProcessProduction engineering
Change Initiating Team Customer
Apply to the process
Yes
No
Related TeamCirculation
QRA
Examine the change of process
Classification
Approval check
Process change plan notify
Evaluation for process
Review
YesNo
Evaluate mass production
Register and distribute the document (ECN)
Review No
Yes
Class 1,2
Class 3
ReviewYesN
oNo Yes
Class 3
Class 3
Class 1 : Case of Process developmentClass 2 : Case of trivial process change that don’t need reliability testClass 3 : Case of process change that needs engineering test and evaluation
Reliability Assurance Process
Engineering Team (Process changing)
DEG Team (New device development)
Marketing Team (Cliental
request)
Wafer selection
Sampling & Assembly(Random sampling)
Nonconforming management system
Periodically Test
Data Update
Reliability Test
Good
NG
Reliability Assurance Test
Test Item Standard & ConditionNumber of
samplesCriteria
Thermal Stress
No change appearance and condition
after X-section 288±5/10 sec, Oil Pot
3Card / 1Lot No failure
Electrical Test B.B.T Test(100% Check) Total / 1LotNone Open,
Short
Solderability Wetting performance : Min. 95%, 260±5, 3~5 sec
2Card / 1Lot No failure
PTH Condition
Thick. Min. 0.025 No crack ,smear and blister both before and after thermal
stress, microscopic examination after X -section :X200
2Card / 1Lot No failure
Solvent Resistance
For Solder Resist
No peel off and discolorate.
Test solution CH2(C12)2Card / 1Lot No failure
Reliability Test Item (SPEC : IPC-A-600F ClassⅡ/ Test Method : IPC-TM-650))
Outgoing Inspection Process
Visual inspection (Stereo scope : x 5)
Inspection Item1. Visual Inspection2. Dimensions Check
3. Quantity Check
Manufacturing Dept. QRA Sales2Manufacturing Dept. QRA Production Control Sales
Packing
Outgoing inspection
NG
Good
Shipping
1’st item
Scrapping
NG2’nd~5’th
item
-Outgoing Inspection Method (IPC A-600F ClassⅡ)
1.1 Stereo scope : x 5, x 10
1.2 Acceptance Criteria
: MIL-STD-105D
AQL= 0.4%(Normal inspection levelⅡ)
Ex.) 1 Lot – 1,500, sample Q’ty = 125
Ac : Re=(1,2)
Outgoing Inspection Method
33
Customer Complain Management ProcessQRA & EngineeringCustomer Sales Production Control
Customer complain
Receive complain
Fill out a form
(CATS)
Receive defective samples from the
customer
Review
Record and send out counter plan
Feedback from the customer
Keep a history and apply to the
productionPaynters Chart
Analyze problem (8D)
Study problem root cause
Prepare a counter plan
Prepare a result report
Feedback from the customer
NG
Good
Document Control System
Document Control Part Related Dept. Operation Dept.
Establishment & Revision Request
Document Preparation
Relative Dept. meeting
Approval from Dept. head
Approval from Relative department heads
Approval from operation manager
Register document
Filing
Receive the document and education
Circulate changed document
No
Yes
Measurement System Analysis ProcessQuality AssuranceMeasurement target station
Gage R&R Valuation Plan establishment
Gage R&R Valuation Target & Sample
Selection
Relation Countersignature report
Gage R&R Operation
Gage R&R Report of Result
Gage R&R analysis & Report of Report
Judgment
N
Y Record Control
Improvement management & Operation
Gage R&R Revaluation Operation
Gage R&R Report of Result
Statistical techniques
Analysis Tools # Product Characteristics -Cp, Cpk, Control Chart, Pareto Diagram, Graph
# Process Capability Analysis -Cp, Cpk, Gage R&R, Control Chart, Graph Cause&Effect Diagram
# Non-conformity Trend Analysis -Cp, Cpk, Control Chart, Pareto Diagram
Supply Chain Status
39
TYCO AMP (Automotive)
DELCOM (Automotive)
Dong-A Electric (Automotive)
VISSEM (LED)
Young Hwa (Automotive)
LOGICAN (Canada)
META (Germany)
GIGARAM (USA)
MULTI CAD(Sweden)
Supplier information Supplier information
DONGAHDONGAH
DomesticDomestic
OverseaOversea
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