Download - Investor Presentation Q4 2016s2.q4cdn.com/391606028/files/doc_presentations/Q4-2… · · 2016-11-011 | Q2 Investor Presentation | © 2016 Veeco Instruments Inc. Investor Presentation

1 | Q2 Investor Presentation | © 2016 Veeco Instruments Inc.

Investor Presentation

Q4 2016

Veeco Instruments Inc.


Veeco at a Glance

Leading deposition and etch solutions provider;

Veeco enables high-tech electronic device manufacturing

> Founded in 1989

> Based in Plainview, NY

> Operations in 10 countries

> $477 million in 2015 sales

> $337 million in cash at end of Q3 16


Delivering Cutting Edge Technology Solutions

Metal Organic Chemical

Vapor Deposition

MOCVD Metal Organic Chemical Vapor Deposition

Market leading GaN and As/P

technology solutions at

competitive cost of ownership

PSP Precision Surface Processing

Single-wafer wet processing

expertise for the most challenging

wet etch / strip applications

Metal Organic Chemical

Vapor Deposition

MBE Molecular Beam Epitaxy

Industry leader across a broad range

of compound semiconductor

production applications and advanced

materials research

Industry benchmark in magnetic

materials processing for hard disk

drives, MEMS, EUV mask blanks,

MRAM...

Ion Beam Deposition & Etch

Veeco’s technology solutions support

foundational and high growth end markets


Track Record of Technology Leadership

> Successfully expanded into new markets

> Enabled growth while maintaining market leadership

> Executing strategy to extend into new markets

Data Storage

NEXUS

IBE, DLC Systems

Scientific &

Industrial

Scientific &

Industrial

LED

MEMS & RF

WaferStorm*

Wet Etch Systems

TurboDisc

MOCVD Systems

GEN

MBE Systems

SPECTOR

IBD Systems

#1

#1

#1

#1

#1

* Hold leading position for Metal Lift-Off (MLO) applications


> Expanding our core

» Leverage technologies and end

markets

> Exploring new markets

» Work with industry leaders to apply

core technologies to new markets

> Diversifying revenue

» Drive growth through cycles

Veeco’s Strategy to Drive Growth N

ew

Ma

rkets

Veeco Core Technology V

ee

co C

ore

Ma

rkets

A

dja

ce

nt M

ark

ets

Inorganic Growth

Businesses Beyond

Core Technologies

Adjacent Technology

Organic Growth

GaN Power Electronics

Advanced Packaging


0

50

100

Q2 16 Q3 16

Q3 2016 Performance Summary

$85M

0

75

150

Q2 16 Q3 16

-4

0

4

Q2 16 Q3 16

Revenue ($M) Bookings ($M) Adjusted EBITDA ($M)

$118M $75M $2.9

($2.8) $68M

Bookings

$118M

Revenue

$85M

Adjusted EBITDA

$2.9M

Solid operational performance with improving business conditions

Swing positive, exceeded

expectations

Slightly above top end of our

guidance range

Marking a steep recovery

in our MOCVD business

Note: A reconciliation of GAAP to Non-GAAP financial measures is contained in the Back Up & Reconciliation Tables


Focused on Improving Through Cycle Profitability

$78M

Reducing cost

structure by ~$30M

Executing

restructuring plans

Lowering

ALD investments

Creating a platform for consistent adjusted EBITDA profitability

~$20M

~$10M

~8M

~$30M

~22M

COGS

OPEX

> Efforts are progressing to plan

> Consolidate 3 manufacturing

operations into 1 facility

> Slowing future development

investments due to delay in

potential revenue realization

> Quarterly adjusted EBITDA

breakeven of ~$75M by Q1 2017


14% Advanced Packaging,

MEMS & RF

Revenue Breakdown by Market and Geography

Note: Amounts may not calculate precisely due to rounding

58% Lighting, Display &

Power Electronics

16% Scientific &

Industrial

12% Data Storage

Q3 2016 Revenue by End Market

$85M

25% China

30% Rest of the World

23% EMEA

22% United States

Q3 2016 Revenue by Geography

Q3 2016 Revenue of $85M:

» Lighting, Display & Power Electronics sales doubled Q/Q

» Bookings increased by ~74% to $118M in Q3

23% Advanced Packaging,

MEMS & RF

18% Data Storage

26% Scientific & Industrial

33% Lighting, Display &

Power Electronics

Q2 2016 Revenue by End Market

$75M

$24M Foundational

Businesses $34M

Foundational

Businesses


P&L Highlights

($M) Q2 16 Q3 16 Q2 16 Q3 16

Revenue $75.3 $85.5 $75.3 $85.5

Gross Profit 31.4 33.5 31.9 34.4

% 41.7% 39.1% 42.4% 40.3%

R&D 21.5 19.9 20.6 18.9

SG&A & Other 20.2 19.2 17.5 15.7

Net Income (32.1) (69.6) (7.6) (1.8)

EPS ($0.82) ($1.78) ($0.19) ($0.05)

Adjusted EBITDA (2.8) 2.9

% -3.7% 3.4%

GAAP Non-GAAP

» OPEX lower than forecasted;

benefitting from accelerated

cost reduction efforts and

certain one-time items

» Adjusted EBITDA turned

positive, demonstrating

operational leverage in our

financial model

» GAAP Net Income reflects

impact of cost reduction

plans and includes ~$2M in

restructuring and ~$56M

primarily for ALD asset

impairment charges

Notes: Amounts may not calculate precisely due to rounding

A reconciliation of GAAP to Non-GAAP financial measures is contained in the Back Up & Reconciliation Tables


($M) Q2 16 Q3 16

Cash & Short-term Investments 331 337

Accounts Receivable 42 50

Inventories 91 87

Accounts Payable 35 27

Cash Flow from Operations (12) 7

Financial Highlights

DSO 50 53

DOI 189 163

DPO 72 48


» Grew cash balance by ~$6M

» Generated positive cash flow

from operations of $7M

» Reduced DOI; starting to

consume inventory to support

MOCVD demand


Q4 2016 Guidance

Revenue $85M–$100M $85M–$100M

Gross Margins 37%–39% 38%–40%

Net Income (Loss) ($13M)–($7M) ($3M)–$3M

Earnings Per

Share ($0.34)–($0.19) ($0.07)–$0.07

Adjusted EBITDA $0M–$6M

Non-GAAP GAAP

Note: A reconciliation of GAAP to Non-GAAP financial measures is contained in the Back Up & Reconciliation Tables


Summary

Leverage technology

expertise and

leadership to win

organic growth

opportunities

Continue

actively exploring

M&A opportunities

Drive

operational

leverage to

enhance

shareholder

value

Focus

on positioning

Veeco for

profitable growth


Lighting, Display &

Power Electronics


Veeco MOCVD – The Right Technology Platform for Growth

Solid State Lighting, LED Display & Automotive

• Continue to win in GaN LED with market leading

EPIK platform

• Maintaining competitive advantage through

multi-generation roadmap, already developed

ROY LED & Photonics

• Gaining traction in As/P applications with K475i

• Leveraging high performance platform to expand

wins in LED and capture opportunities in growing

photonics market (optical/fiber laser, sensors)

Advanced Power Electronics

• Single-wafer platform enabling the development

of commercially viable GaN power devices

• Focused on helping customers transition from

R&D to volume production

EPIK 700

K475i

Propel Power GaN

NOTES: GaN – Gallium Nitride

ROY – Red / Orange / Yellow

AsP – Arsenic Phosphide

https://www.google.com/url?sa=i&rct=j&q=&esrc=s&source=images&cd=&cad=rja&uact=8&ved=0ahUKEwidhrSCjuzNAhVM6iYKHSM9AWgQjRwIBw&url=https://www.youtube.com/watch?v=g1iwVoEyfFs&psig=AFQjCNGd39b2q9YdakjahR2JaAlu84yLKw&ust=1468350442849321

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&source=images&cd=&cad=rja&uact=8&ved=0ahUKEwjCr42ukuzNAhUESCYKHXoDAjQQjRwIBw&url=http://truewirelesscharging.com/new-wireless-charging-chips-power-devices-up-to-30-feet-away-running-on-ossia-technology/&bvm=bv.126130881,d.eWE&psig=AFQjCNEkhm9-df8SAzRvL-YXL8iYpqQCJA&ust=1468351646332358


Applications Enabled by Veeco’s MOCVD Technology Are Expanding

EPIKTM LED Lighting, Display

K475iTM ROY* LED, IR Sensor,

Laser Diode, Solar

PropelTM GaN Power Device

System Target Applications

Solar AsP Device

* ROY – Red, Orange, Yellow

Smart-lighting IR Sensors LiFi

Lighting Blue LED

Display Blue LED Micro-inverter

Power Device

Hybrid

Vehicle Power

Device

5G

Communication Power Device

Blue

LED

ROY

LED

Horticulture Blue LED, ROY LED

Display Blue

LED

http://www.airsensewireless.com/partners/





Veeco MOCVD – A Winning Value Proposition

Delivering value through our differentiated technology

Leveraging our winning technology to capture breadth of LED opportunities

> Recognized MOCVD leader in lighting/display LEDs

> Industry benchmark for Cost of Ownership

EPIK 700 GaN System

“We have achieved superior yield results and

lowered manufacturing costs” –President, Epistar

“Veeco continues to drive innovation with

MOCVD technology ” –General Manager, Changelight

“Sanan chose the EPIK700 due to its industry leading cost of ownership model ” –Vice Chairman & CEO, Sanan

K475i AsP System

> Rapidly gaining momentum for R/O/Y and IR LEDs

> Best-in-class film uniformity and repeatability

Notes: R/O/Y – Red, orange, yellow

IR – Infra-red


GaN Technology Being Adopted for Power Electronics

Servers

Alt. Energy Consumer

Electronics

Automobile

Source – Yole

> Versus Silicon, GaN power devices are:

» 50% Smaller

» 10% More efficient

» 2-3X More power density

» 10X Faster at switching

> Revenues ~$500M in 5 years

» Target IT and Consumer applications

» Additional applications likely once cost parity

achieved


Propel Topples GaN Power Device Adoption Barriers

> Single wafer design targeting

current Epi gaps:

» Deposition uniformity

» Run-to-run control

» Wafer bow

» Particles

» Production availability

> Scalable path from R&D to

high volume manufacturing


Veeco Serves LED and Power Device Industry Leaders

Note: Universe of target companies; logos do not necessarily reflect current customers; trademarks are property of respective owners


Advanced Packaging,

MEMS, RF


Veeco PSP – Versatility Generating Multiple Growth Levers

Expand

Served

Markets

Extend

Global

Reach

Capture

New

Applications

» Market leader for single-wafer solvent clean with unique

ImmJET™ technology

» Leveraging process advantages and existing infrastructure

to expand into under-represented regions in Asia

» Established positions in core markets: MEMS, RF and

Compound Semi (i.e. LED, power electronics, IR sensors)

» Demonstrating our unique technology + process advantage

to expand in Advanced Packaging (2.5D and 3D)

» Single-wafer technology and process flexibility make PSP

ideal for the most complex applications (result in precise

process control)

» Device trends towards higher densities and tighter

dimensions require precise process control (new

opportunities)

Compound Semi

MEMS & RF

Advanced

Packaging


RF Filter demand is growing Advanced Packaging density increasing

Veeco PSP – Market Trends Playing to our Strengths

> Tighter dimensions require resist films which are more challenging to remove

> Veeco offers COO advantage over batch tools

Fan-out Packaging

Leader in single-wafer solvent solutions with proprietary

ImmJET™ technology

> Next gen wireless and carrier aggregation require more RF Filters / phone

> Veeco is well positioned across RF device makers

Source: Qualcomm, Veeco estimates

Notes: COO – Cost of Ownership

Chip Scale Packaging

Ball Grid Array

2015 2020

# RF Filters ~50 ~100


Flexibility to Deliver Wide Range of Process Solutions

Application FO WLP TSV RF /

MEMS

Metal Lift Off

Flux Clean

Photo resist strip

Dry film resist strip

Application FO WLP TSV RF /

MEMS

UBM* Seed layer

etch

RDL** Seed layer

etch

Wafer thinning

TSV Reveal

WaferStorm

Proprietary ImmJETTM technology

• Thick resist removal in dense arrays

• Precision clean for tight spaces

Patented triple strainer

• Lower chemical use, lower cost

PSP differentiated results, cost effective solution

WaferEtch

Flexible design

• High etch rate, good selectivity

WaferChekTM Endpoint detection

• Tighter etch process control

*UBM – Under Bump Metal

*RDL – Redistribution Layer


Veeco PSP Advantage for Through Silicon Via Reveal

0%

20%

40%

60%

80%

100%

Incumbent Process Flow Veeco PSP Process

% T

ota

l P

roc

es

s C

os

t

2 x Metrology

1 x Clean

TSV Reveal

(Plasma Etch)

CMP**

(5 Steps, 4 Tools) (2 Steps, 1 Tool)

INTERPOSER

SUBSTRATE

CHIP

TSV

~60% Veeco cost advantage

vs. incumbent

> Fewer process steps and fewer tools,

lower cost and reduce risk

TSV Reveal Process Cost Comparison

>60% Cost Advantage*

*Based on SavanSys Solutions model, including capital, process and labor related costs

**CMP – Chemical Mechanical Planarization

Integrated approach provides

greater process control to

maximize yield

> High uniformity and repeatability

with onboard metrology and

selectivity


Veeco PSP Serves Top MEMS and OSAT Names

Note: Universe of target companies; logos do not necessarily reflect current customers; trademarks are property of respective owners

http://www.avagotech.com/

http://www.bosch.us/en/us/startpage_1/country-landingpage.php


Foundational

Business


Thin Film Process Expertise Forms Solid Foundation

Ion Beam Etch Advanced Dicing Molecular Beam

Epitaxy

Ion Beam

Deposition

Data Storage

Hard Disk Drives

Industrial

Optical

Coatings

Scientific

Advanced Research IR Sensors

Laser

Diode


Strengthening Our Foundational Business

> Leader in advanced materials research

> Winning incremental production opportunities

#1 in Molecular Beam Epitaxy (MBE)

Wireless (4G/5G) Industrial

Lasers for

Materials

Processing

pHEMTS IR Detectors

Defense

#1 in Ion Beam Deposition & Etch

> Leader in hard-disk drive (HDD) manufacturing

> Expertise in magnetic materials processing pull

Microphones/

Sensors

MEMS Semiconductor

MRAM Memory/

EUV Blank Masks

Data Storage

HDD Heads

Leveraging technology expertise to capture adjacent market opportunities

while responsibly managing mature markets

Note: pHEMTS - Pseudomorphic high-electron-mobility-transistors

https://www.google.com/url?sa=i&rct=j&q=&esrc=s&source=images&cd=&cad=rja&uact=8&ved=0ahUKEwi53ceQn8rPAhVJNj4KHWe6B4cQjRwIBw&url=https://www.linkedin.com/topic/magnetic-sensors&psig=AFQjCNGUnJCIxRb3WgL-yiubUUG1y7C3sQ&ust=1475982875861461


Reconciliation

Tables


Safe Harbor

To the extent that this presentation discusses expectations or otherwise

makes statements about the future, such statements are forward-looking

and are subject to a number of risks and uncertainties that could cause

actual results to differ materially from the statements made.

These items include the risk factors discussed in the Business Description

and Management's Discussion and Analysis sections of Veeco's Annual

Report on Form 10-K for the year ended December 31, 2015 and

subsequent Quarterly Reports on Form 10-Q and current reports on Form

8-K. Veeco does not undertake any obligation to update any forward-

looking statements to reflect future events or circumstances after the date

of such statements.


Note On Reconciliation Tables

These tables include financial measures adjusted for the impact of certain items; these financial measures are

therefore not calculated in accordance with U.S. generally accepted accounting principles (“GAAP”). These Non-

GAAP financial measures exclude items such as: share-based compensation expense; charges relating to

restructuring initiatives; non-cash asset impairments; certain other non-operating gains and losses; and

acquisition-related items such as transaction costs, non-cash amortization of acquired intangible assets, and

incremental transaction-related compensation.

These Non-GAAP financial measures may be different from Non-GAAP financial measures used by other

companies. Non-GAAP financial measures should not be considered a substitute for, or superior to, measures of

financial performance prepared in accordance with GAAP. By excluding these items, Non-GAAP financial

measures are intended to facilitate meaningful comparisons to historical operating results, competitors' operating

results, and estimates made by securities analysts. Management is evaluated on key performance metrics

including adjusted EBITDA, which is used to determine management incentive compensation as well as to

forecast future periods.

These Non-GAAP financial measures may be useful to investors in allowing for greater transparency of

supplemental information used by management in its financial and operational decision-making. In addition, similar

Non-GAAP financial measures have historically been reported to investors; the inclusion of comparable numbers

provides consistency in financial reporting. Investors are encouraged to review the reconciliation of the Non-GAAP

financial measures used in this news release to their most directly comparable GAAP financial measures.


Supplemental Information—GAAP to Non-GAAP Reconciliation

US$ millions Q2 16 Q3 16

Net Sales $75.3 $85.5

GAAP Gross Profit 31.4 33.5

GAAP Gross Margin 41.7% 39.1%

Add: Share-Based Comp 0.5 0.6

Add: Accelerated Depreciation — 0.4

Non-GAAP Gross Profit $31.9 $34.4

Non-GAAP Gross Margin 42.4% 40.3%

US$ millions Q2 16 Q3 16

GAAP Net Income (Loss) ($32.1) ($69.6)


Add: Acquisition Related 0.1 0.1

Add: Restructuring 2.1 1.8

Add: Amortization 5.3 5.3

Add: Asset Impairment 13.6 56.0

Add: Interest (Income)

Expense

(0.2) (0.3)

Add: Accelerated

Depreciation

— 0.4

Add: Pension Termination — 1.3

Add: Depreciation 3.4 3.1

Add: Taxes 1.0 1.1

Adjusted EBITDA ($2.8) $2.9

US$ millions, except per share data Q2 16 Q3 16

GAAP Basic EPS (0.82) (1.78)

GAAP Diluted EPS (0.82) (1.78)

GAAP Net Income (Loss) (32.1) (69.6)


Add: Acquisition Related 0.1 0.1

Add: Restructuring 2.1 1.8

Add: Amortization 5.3 5.3

Add: Asset Impairment 13.6 56.0

Add: Accelerated

Depreciation

— 0.4

Add: Pension Termination — 1.3

Add: Tax Adjustment from

GAAP to Non-GAAP

(0.6) (0.7)

Non-GAAP Net Income

(Loss)

(7.6) (1.8)

Non-GAAP Basic EPS (0.19) (0.05)

Non-GAAP Diluted EPS (0.19) (0.05)



Q3 2016 GAAP to Non-GAAP Reconciliation Non-GAAP Adjustments

In millions, except per share data GAAP

Share-Based

Compensation

Amortization Other Non-GAAP

Net Sales $85.5 $85.5

Gross Profit 33.5 0.6 0.4 34.4

Gross Margin 39.1% 40.3%

Research and Development 19.9 (1.0) 18.9

Selling, General, and Administrative and Other 19.2 (2.1) (1.4) 15.7

Net Income (Loss) ($69.6) 3.7 5.3 58.8 ($1.8)

Income (Loss) Per Common Share:

Basic ($1.78) ($0.05)

Diluted (1.78) (0.05)

Weighted Average Number of Shares:

Basic 39 39

Diluted 39 39

Other Non-GAAP Adjustments

Asset Impairment 56.0

Restructuring 1.8

Other 1.7

Non-GAAP Tax Adjustment (0.7)

Total Other 58.8


“Other” includes charges relating to Acquisition Related, Accelerated Depreciation and Pension Termination


Q4 2016 Guidance GAAP to Non-GAAP Reconciliation

Non-GAAP Adjustments

In millions, except per share data GAAP

Share-Based

Compensation

Amortization Other Non-GAAP

Net Sales $85–$100 $85–$100

Gross Profit 31–39 1 — — 32–40

Gross Margin 37%–39% 38%–40%

Net Income (Loss) ($13)–($7) 5 4 1 ($3)–$3

Income (Loss) per Diluted Share ($0.34)–($0.19) ($0.07)–$0.07

GAAP Net Income (Loss) ($13)–($7)

Share-Based Compensation 5

Amortization 4

Restructuring 1

Interest Income (Expense) 0

Depreciation 3

Income Tax Expense (Benefit) 0

Adjusted EBITDA $0–$6


Non-GAAP Adjustments

Download - Investor Presentation Q4 2016s2.q4cdn.com/391606028/files/doc_presentations/Q4-2… · · 2016-11-011 | Q2 Investor Presentation | © 2016 Veeco Instruments Inc. Investor Presentation

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