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Outline
• Materials Processing Parameters
• Process Description
• Mechanisms of Laser Cutting
ME 677: Laser Material Processing
Instructor: Ramesh Singh2
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Process Variables for Material
Processing
• The other important process variables:
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Interaction Time and Empirical Process
Chart• Interaction time, τ = 2 r/v
where r = beam radius and v = velocity
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Structural Steel
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Cutting
• Laser cutting is able to cut faster and with a
higher quality then competing processes: – Punch, plasma, abrasive waterjet, ultrasonic,
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• Can be automated
• 80% industrial lasers in Japan are used for
metal cutting
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ME 677: Laser Material Processing
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Process Characteristics• It is one of the faster cutting processes.
• The work piece does not need clamping but workholding is advisable toavoid shifting with the table acceleration and for locating when using aCNC program
• Tool wear is zero since the process is a non contact cutting process.• Cuts can be made in any direction polarization may affect process
efficiency
• The noise level is low.
•
ME 677: Laser Material Processing
Instructor: Ramesh Singh
control in the future.• No expensive tooling changes are mainly "soft". That is they are only
programming changes. Thus the process is highly flexible.
• Some materials can be stack cut, but there may be a problem withwelding between layers.
• Nearly all engineering materials can be cut. They can be friable, brittle,electric conductors or non conductors, hard or soft. – Only highly reflective materials such as aluminium and copper can pose a
problem but with proper beam control these can be cut satisfactorily.
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Process Response• The cut can have a very narrow kerf width giving a substantial saving in
material. (Kerf is the width of the cut opening)
• The cut edges can be square and not rounded as with most hot jetprocesses or other thermal cutting techniques.
• The cut edge can be smooth and clean. It is a finished cut, requiring nofurther cleaning or treatment.
• The cut edge can be directly re-welded with little to no surfacepreparation.
•
ME 677: Laser Material Processing
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adhesion can usually be avoided.• There is a very narrow HAZ (Heat Affected Zone) and very thin re-
solidified layer of few µm, particularly on dross free cuts. There isnegligible distortion.
•Blind cuts can be made in some materials, particularly those whichvolatilise, such as wood or acrylic.
• Cut depth depends on the laser power. 10-20mm is the current range forhigh quality cuts. Some very high power fiber lasers could cut 50 mm.
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Dross
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Process Mechanisms
• The beam is traversed over a programmed path and materialremoval occurs due to multiple mechanisms
• Melting
– Material exhibiting molten phase of low viscosity, notably metals andalloys, and thermoplastics, are cut by the heating action of a beam of power density on the order of 104 Wmm−2
– The melt is assisted by shearing action of a stream of inert or activeassist gas, results in formation of a molten channel through the
ME 677: Laser Material Processing
Instructor: Ramesh Singh
mater a ca e a er s ot .
• Vaporisation – Suitable for materials that are not readily melted (some glasses,
ceramics and composites)
– Materials can be cut by vaporization that is induced by a higher beam
power density (~104
Wmm−2
)• Chemical Degradation – A kerf can be formed in many organic materials by chemical
degradation caused by the heating action of the beam.
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Material Removal Mechanism in
Different Materials
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Inert Gas Melt Shearing or Melt and Blow
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Viewed from Top
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Modeling of the Process
[ ]v f p
v f p
Lm LT C wtV P
Lm LT C wtV P
'
'
++∆=
++∆=
η ρ
ρ η
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Melt and Blow• The group [P/tV] is constant for the cutting of a given
material with a given beam.
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Reactive Fusion ..• The amount of energy supplied by the burning reaction
varies with the material – with mild/stainless steel it is 60%; with stainless
– with a reactive metal like titanium it is around 90%.• Cutting speeds could be doubled using this technique.
• Typically, the faster the cut, the less heat penetration and
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• A chemical change in the workpiece may happen due toreactive fusion. – With titanium this can be critical since the edge will have
some oxygen in it and will be harder and more liable to
cracking. – With mild steel there is no noticeable effect except a very
thin re-solidified layer of oxide on the surface of the
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Striations in Reactive Fusion Cutting
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Controlled Fracture Process• Brittle material are vulnerable to thermal fracture canbe quickly and neatly severed by guiding a crack with afine spot heated by a laser
• The laser heats a small volume of the surface causing itto expand and hence to cause tensile stresses allaround it
ME 677: Laser Material Processing
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• I t ere s a crac n t s space, t w act as a stressraiser and the cracking will continue in direction of thehot spot
• The speed at which a crack can be guided is of the
order of m/s• When the crack approaches an edge, the stress fieldsbecome more complex
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Processing Range for Controlled
Fracture
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Vaporization Cutting
• The focused beam in vaporization cutting first heats up thesurface to boiling point and generates a keyhole.
• The keyhole causes a sudden increase in the absorptivity due
to multiple reflections and the hole deepens quickly.• As it deepens so vapor is generated and escapes blowing
ejecta out of the hole or kerf and stabilizing the molten walls
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• This is the usual method of cutting for pulsed lasers or in the
cutting of materials which do not melt such as wood, carbon,
and some plastics.
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Vaoporization
• The rate of penetration of the beam into the
workpiece can be estimated from a lumped
heat capacity calculation assuming – 1D heat flow
–
ME 677: Laser Material Processing
Instructor: Ramesh Singh
– The penetration rate is similar to or faster than
the rate of conduction
– volume removed per second per unit area =
penetration velocity, V m/s
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Effect of Spot Size• The principle parameters are laser power,
traverse speed, spot size and material thickness .
• Spot size acts in two ways:
– Firstly, a decrease in spot size will increase the power
ME 677: Laser Material Processing
Instructor: Ramesh Singh
density which affects the absorption and – Secondly, it will decrease the cut width.
• Lasers with stable power and low order modes -
usually true TEMoo modes cut considerablybetter than other modes
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