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LCD TVSERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91J
MODEL : 26LK310/310Y 26LK310/310Y-TAMODEL : 26LK311 26LK311-TB
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62461531 (1104-REV01)
Proporcionado por: Carlos Alexis Ortz Colmenares (Tcnico en Electrnica) San Salvador, El Salvador.
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LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING............................................................................14
BLOCK DIAGRAM...................................................................................17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
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LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phone
jacks, etc.If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1M and 5.2M.When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure)Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument'sexposedMETALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
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LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication ofcontacts in not required.5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor Device
Removal/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directlyconnected to the affected copper pattern.3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
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LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement .
4. Electrical specification4.1. Model Specification
1. Application rangeThis spec sheet is applied to LCD TV used LP91J chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C2) Relative Humidity : 6510%3) Power Voltage: Standard input voltage(100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed
each drawing and specification by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
No Item Specification Remark
1. Market NON EU
2. Broadcasting system PAL/SECAM B/G/D/K,
PAL I/II, NTSC-M
3. Available Channel BAND PAL NTSC China(DK) Australia(BG)
VHF/UHF E2-C69 2~78 C1~C62 C1~C75
CATV S21~S47 1~71 S1~S41 S2~S44
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC 22LK310/311 : Rear 1EA,
26/32LK310/311 : Rear 1EA, Side 1EA
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear
7. RGB Input RGB-PC, S/W Upgrade Rear
8. HDMI Input HDMI-DTV, Only PCM MODE 26/32LK310/311 Rear 2EA
22LK310/311 Rear 1EA
9. Audio Input (4EA) PC Audio, Component, AV (2EA) L/R Input (22LK310/311: AV Audio Input 1EA)
10. RS-232C Remote control, Commercial control Rear
11. USB Input (1EA) Divx, MP3, JPEG Only Side
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- 7 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. Component Video Input (Y, P B, P R)
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50 Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50 Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50 Hz
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
NoSpecification
Proposed RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
6. RGB(Analog PC, RGB-DTV - NOT SUPPORT)
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- 8 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
7. HDMI input - PC(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
8. HDMI input (DTV)
No
Specification
Proposed RemarksResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1 280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
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LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
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ADJUSTMENT INSTRUCTION1. Application Range
This specification sheet is applied to all of the LCD TV, LP91Jchassis.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25 C 5 C of temperature and 65 % 10 % of relativehumidity if there is no specific designation.
4) The input voltage of the receiver must keep 100-220 V,50/60 Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.(3) Download the EDID
- EDID datas are automatically download when adjustingthe Tool Option2
(4) ADC Calibration - RGB / Component(4) Check SW Version.
3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Intelligent Sensor Inspection Guide(5) Preset CH information(6) Factoring Option Data input
4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig
(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack
(2) Download steps1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened.2) Click the Connect button and confirm Dialog Box.
3) Click the Config. button and Change speed I2C Speed
setting : 350 Khz ~ 400 Khz.
4) Read and write bin file.Click (1)Read tab, and then load download file(XXXX.bin) by clicking Read.
1
Fi
1
Filexxx.binilexxx bin
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5) Click (2)Auto tab and set as below.6) Click (3)Run.7) After downloading, you can see the (4)Pass message.
4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the USB port.2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message Copy the file from the Memory
4) After Finished the Download, Automatically DC Off -> On
5) If the TV is turn on, check the updated SW Version and tooloption.
4.2. Input tool optionAdjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process
After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because beingdifferent with some setting value depend on modulemaker, inch and market.
(2) Equipment : adjustment remote control.
(3). Adjustment method- The input methods are same as other chassis.(Use IN-
START key on the Adjust remote control.)(If not changed the option, the input menu can differ themodel spec.)
Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option valueCaution : Dont Press IN-STOP key after completing thefunction inspection.
4.3. EDID Download methodRecommend that dont connect HDMI and RGB(D-SUB) cablewhen downloading the EDID. If not possible, recommend thatconnect the MSPG equipment.There are two methods of downloading the EDID data.
4.3.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2 seconds.
4.3.2. 2nd Method* Caution :
Must be checked that the tool option is right or not.If tool option is wrong, HDMI EDID data could not bedownloaded well.
1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key( G )3) Press the right direction key( G ) at Start.4) After about a few seconds, appear OK, then complete.
4.3.3. RS-232C command Method(1) Command : AE 00 10
* CautionDont connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of EDID could befailed.
- 10 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
Filexxx bin
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4.3.4. EDID data(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
4.4. ADC Calibration4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments- Remote control for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60 Hz 100 % Color Bar
YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on Remote control for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : Component by using D / E
(CH +/-) and press ENTER( A ).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear.
4.4.2. ADC Calibration - RGB4.4.2.1. Method of Using External pattern
(1) Required Equipments- Remote control for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60 Hz Horizontal Color Bar
signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on remote control for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : RGB by using D / E (CH +/-)
and press ENTER( A ).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear.
- 11 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
OK
OK
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 15 01 03 08 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B A1 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
40 35 00 BC 88 21 00 00 1C 0E 1F 00 80 51 00 1E 30
50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 00 55
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C280 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 20 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 1A
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4.4.2.1. Method of Using Internal pattern(1) Apply model : 22/26/32LK310/311(2) Process
1) Change the Input to RGB mode..2) Press ADJ key on remote control for adjustment.3) Enter Password number. Password is 0 0 0 0.4) Select 0. ADC calibration : RGB by using D / E (CH +/-)
and press ENTER( A ).5) ADC adjustment is executed automatically .6) When ADC adjustment is finished, this OSD appear.
* Caution : No need to connect external input cable.* Caution : Adjustment result is applied after SET Off/On.
4.5. Check SW Version(1) Method
1) Push In-star key on Adjust remote-control.2) SW Version check
Check SW VER : V3.xx
5. PCB assembly adjustment method5.1. Input Area-Option
(1) Profile : Must be changed the Area option value becausebeing different of each Countrys Language andsignal Condition.
(2) Equipment : Adjustment remote control.(3) Adjustment method
- The input methods are same as other chassis.(Use IN-START Key on the Adjust Remote control.)
Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance(For Automatic Adjustment)- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm- Required Equipment
1) Remote control for adjustment2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV(ch : 9)(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2.1 Adjustment of White Balance (For automatic adjustment)
* LP91J Support RS-232C & I2C Interface For ADC/DDCAdjustment.
(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with agingcommand (F3, 00, 00)
(4) Release the adjust mode of white balance- Enter the white balance adjustment mode with agingcommand(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warmmode(For LCD)
- 12 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
OK
MODEL : 32LK310SW VER : V3.04Mode : Home Use UTT 6
ADC CAL. RGB : NGRGB: OK HDMI1 : NGCompo nent SD : OK HDMI2 : NGComponent HD : OK
Tool Option 1 816Tool Option 2 4181Area Option 40Option 1 0Option 2 0System ControlSystem Control 2Power Off HistoryDavinci/Auto Test
Area Option ETCLang. Group NTSC-ALL
MODEL : 32LK310SW VER : V3.04Mode : Home Use UTT 6
ADC CAL. RGB : NGRGB: OK HDMI1 : NGCompo nent SD : OK HDMI2 : NGComponent HD : OK
Tool Option 1 816Tool Option 2 4181Area Option 40Option 1 0Option 2 0System ControlSystem Control 2Power Off HistoryDavinci/Auto Test
Area Option ETCLang. Group NTSC-ALL
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5.2.2. Adjustment of White Balance (for Manual adjustment)(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.(3) For manual adjustment, it is also possible by the following
sequence.1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push Exit key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter 0000 (Password)6) Select 3. W/B ADJUST7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD / E (CH +/-) key on Adjustment remote control.
9) Adjust R/G/B Gain using F / G (VOL +/-) key on
Adjustment remote control.10) Adjust three modes all (Cool/ Medium/ Warm) : Fix theone of R/G/B gain and change the others
11) When adjustment is completed, Enter COPY ALL.12) Exit adjustment mode using EXIT key on Adjustment
remote control.
* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target
i) Decrease the R, G.2. x, y < target
i) First decrease the B gain,ii) Decrease the one of the others.
3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment
- 22LK310/311(Small size inchs color coordinate is differentfrom others, so use below table.)
- To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : Select Vivid and change Dynamic Contrast :Off, Dynamic Colour : Off -> Picture Mode change ->Vivid(User)(If you miss the upper condition, the coordinates of W/B canbe lower than the spec.
- 13 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
CoordinateMode x y Temp uv
Cool 0.269 0.002 0.273 0.002 13,000 K 0.000
Medium 0.285 0.002 0.293 0.002 9,300 K 0.000
Warm 0.313 0.002 0.329 0.002 6,500 K 0.003
CoordinateMode x y Temp uv
Cool 0.285 0.002 0.293 0.002 9,300 K 0.000
Medium 0.295 0.002 0.305 0.002 8,000 K 0.000
Warm 0.313 0.002 0.329 0.002 6,500 K 0.003
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 14 -
TROUBLESHOOTING
No power(LED indicator off)
Check 24V, 12V, 3.5Vof Power B/D
Check short of Main B/Dor Change Power B/D
Pass
Check Output ofIC1001, IC1003, IC1007
Check P400 Connector
Change LED Assembly
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assembly
Change IC1002, IC1008, Q1003
Pass
Check short of IC1001,IC1003, IC1007
Fail
Re-soldering or Change defectpart of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED statusOn Display Unit Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802Fail
Change Inverter ConnectorOr InverterFail
Pass
Fail
Pass
Change ModuleFail
Check LVDS Cable
Pass
Check Panel Link CableOr Module
Change Panel Link CableOr Module
Check Inverter ConnectorOr Inverter
Pass
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 15 -
No Raster on PC Signal
Check Input source CableAnd Jack
Pass
Re-soldering orChange the defect part
Pass
Check the Input/OutputOf IC201 Fail
Re-soldering orChange the defect part,Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/OutputOf J202 Fail
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering orChange the defect part
Pass
No Raster on COMMPONENT Signal
Check Input sourceCable And Jack
Pass
Re-soldering orChange the defect part
Check the Input/OutputOf IC800 Fail
Pass
Re-soldering orChange the defect part
Repeat [A], & [B] Process
Check The Input/OutputOf JK101 Fail
Pass
No Raster on HDMI Signal
Check Input sourceCable And Jack
Pass
Check the Input/Outputof JK301, JK302 Fail
Re-soldering orChange the defect part
Pass
Pass
Check the Input/Outputof IC300, IC301 Fail
Re-soldering orChange the defect partCheck HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/Outputof IC800 Fail
Re-soldering orChange the defect part
Repeat [A], & [B] Process
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 16 -
No Sound
Check The Input Sourse
Check The Input/OutputOf IC600
Re-soldering orChange the defect partFail
Pass
Pass
Check The Speaker Change SpeakerFail
Check The Speaker Wire
Pass
Change The Source InputFail
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source
Cable And Jack
Pass
Check Input sourceCable And Jack
Pass
Check The Input/Outputof JK102
Re-soldering orChange the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Pass
Check the Input/Outputof IC800 Fail
Re-soldering orChange the defect part
Pass
Check The Input/OutputOf TU500
Re-soldering orChange the defect part
Pass
Fail
Pass
Check the Input/Outputof IC800 Fail
Re-soldering orChange the defect part
Repeat [A], & [B] Process
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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 17 -
BLOCK DIAGRAM
R G B - P C ( J K 2 0 2 )
T U N E R ( T U 5 0 0 )
C O M P O N E N T / A V 1 A u d i o o u t ( J K 1 0 2 )
A V 2
( J K 2 0 1 )
A V
_ L I N / R I N :
5 0 0 m V r m s
S P K
_ L
S P K
_ R
C O M P O N E N T
_ L / R :
5 0 0 m V r m s
A V
_ V I N :
1 V p p
N T P 3 2 0 0 L
C
O M P
_ Y / P b / P r
I R & L E D ( P 2 0 1 )
H D M I_ D A T A 0
T
U_ M
A I N
C O M P O N E N T
_ Y / P b / P r :
1 / 0 . 7
V p p
A
V_ V
I N
C
O M P
_ L I N / R I N
L_ C
H
R_ C
H
A
V_ L
I N / R I N
P C - S O U N D ( J K 2 0 3 )
I 2 S
_ M C L K
I 2 S
_ S D O
I 2 S
_ W S
I 2 S
_ S C K
T M D S
L I P S
R L
_ O N / I D I S P
_ E N
P A N E L
_ S T A T U S
E - D
I M
O P C
_ O U T
E E P R O M
( 2 4 L C 2 5 6 )
S e r
i a l F l a s h
( M X 2 5 L 6 4 )
E E P R O M
H D C P
( 2 4 W C 0 8 )
E E P
_ S C L / S D A
E E P
_ S C L / S D A
T X C E 2
T X C E 3
T X C L K E
T X C E 1
T X C E 0
T X C O 1
T X C O 3
T X C O 2
T X C O 0
T X C L K O
M_ S C L / S D A
M A I N S C L A E R
M a t r i x
( L G E 4 7 6 7 A )
( I C 8 0 0 )
E E P R O M
2 4 C 0 2
I C 3 0 2
T U 5 0 0
I C 8 0 2
I C 8 0 3
I C 8 0 1
I C 6 0 0
P 4 0 2
P 4 0 3
M_ S
C L / S D A
S
I D E
R E A R
H D M I 3
( J K 3 0 3 )
U S B
( J K 2 0 4 )
R S - 2 3 2 C ( J K 2 0 0 )
U S B ( S V C ) ( J K 2 0 5 )
H D M I 1 ( J K 3 0 1 )
H D M I 2 ( J K 3 0 2 )
E E P R O M
2 4 C 0 2
I C 3 0 1
E E P R O M
2 4 C 0 2
I C 3 0 0
E E P R O M
2 4 C 0 2
I C 3 0 0
D D C
_ S C L 1 / S D A 1
D D C
_ S C L 2 / S D A 2
D D C
_ S C L 3 / S D A 3
C o n
t r o
l l e r
S T 3 2 3 2 C D R
I C 2 0 0
R X D / T X D
E E P R O M
2 4 C 0 2
I C 2 0 1
D S U B
_ S C L / S D A
P 4 0 1
S P
I_ C Z / D O
S P I_ C L K / D I
H D M I_ D A T A 1
H D M I_ D A T A 2
U S B D N / D P
P C
_ R / G / B
P C
_ V S / H S
T X D / R X D
P C
_ A U D
_ L / R
T X C O 4
T X C E 4
F H D L V D S c o n n e c t o r
H D L V D S c o n n e c t o r
D D R 2 S D R A M
( 5 1 2 M B y t e )
I C 9 0 0
D D R 2_ C K E
D D R 2_ W E Z
D D R 2_ D Q S 0
D D R 2_ M C L K
D D R 2_ B A 0 / 1
D D R 2_ D Q S 1
D D R 2_ O D T
D D R 2_ D Q M 0 / 1
S I D E
_ V I N
S I D E
_ L I N / R I N
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- 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.Only for training and service purposes
L V 1
8 0 0
1 2 0
1 2 2
5 0 0
3 0 0
5 1 0
A 2
A 2 1
A 5
A
1 0
5 4 0
5 2 1
5 3 0
4 0 0
8 1 0
9 1 0
5 5 0
9 0 0
2 0 0
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW.It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CVBS_LIN
ZD100SD05
ZD103SD05
ZD105SD05
CVBS_VIN
CVBS_RIN
ZD104SD05
ZD101SD05
ZD102SD05
D10130V
D10030V
D10430V
D10530V
COMP2_Y
COMP2_PB
COMP2_PR
COMP2_L
COMP2_R
R10975
R10875
R10775
R104220K
R11812K
R11712K
R11912K
R12012K
R113
10K
R115
10K
R116
10K
R100220K
R111220K
R112220K
R11075
R114
10K
R121
75
JP102
C1045600pF50V
ZD10630V
ZD10730V
C101 10uF16V
Q105RT1C3904-T112
EBC
MUT
R124
1K
C1035600pF50V
R1220
R123
1K
Q103RT1C3904-T112
EBC
Q106RT1C3904-T112
EBC
Q104RT1C3904-T112
EBC
C102 10uF16V
R1250
MUT
JK101
PPJ238-01
NON_AUDIO_OUT
5D [GN2]O-SPRING
6D [GN2]E-LUG
4D [GN2]CONTACT
7E [BL2]E-LUG-S
5E [BL2]O-SPRING
7F [RD2]E-LUG-S
5F [RD2]O-SPRING_1
5G [WH2]O-SPRING
4H [RD2]CONTACT
5H [RD2]O-SPRING_2
6H [RD2]E-LUG
6A [YL1]E-LUG
5A [YL1]O-SPRING
4A [YL1]CONTACT
5B [WH1]O-SPRING
4C [RD1]CONTACT
5C [RD1]O-SPRING
6C [RD1]E-LUG
JK102
PPJ239-03
AUDIO_OUT
5J [GN2]O-SPRING
6J [GN2]E-LUG
4J [GN2]CONTACT
7K [BL2]E-LUG-S
5K [BL2]O-SPRING
7L [RD2]E-LUG-S
5L [RD2]O-SPRING_1
5M [WH2]O-SPRING
4N [RD2]CONTACT
5N [RD2]O-SPRING_2
6N [RD2]E-LUG
6D [WH1]E-LUG
5D [WH1]O-SPRING
7E [RD1]E-LUG-S
5E [RD1]O-SPRING_1
7F [YL1]E-LUG-S
5F [YL1]O-SPRING_1
4F [YL1]CONTACT_1
5G [WH1]O-SPRING_2
4H [RD1]CONTACT_2
5H [RD1]O-SPRING_2
6H [RD1]E-LUG
COMPONENT / AV IN / AV AUDIO OUT
POP NOISE
POP NOISE
AUDIO_OUT O
LP91J
EAX64045802
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U S
B D
OWN
STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_LIN
SIDE_RIN
ZD2035.6BSIDE_AV
SIDE_VZD2025.6B
SIDE_AV
IR_OUT+3.5V_MST
TXD
R2044.7K
IC200ST3232CDR
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7T2OUT
8R2IN
9 R2OUT
10 T2IN
11 T1IN
12 R1OUT
13 R1IN
14 T1OUT
15 GND
16 VCC
R2054.7K
RXD
+3.5V_MST
IC201CAT24C02WI-GT3
RGB_EEPROM_CATAL
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
D20030V
D20130V
D20630VSIDE_AV
D20530VSIDE_AV
C2030.1uF16V
C2000.1uF16V
C2010.1uF16V
C2020.1uF16V
R202
100
R203
100
R22775
SIDE_AV
R223220K
READY
R222220K
READY
R22612K
SIDE_AV
R22812K
SIDE_AV R216100
R217100
R218100
C2080.1uF50V
OCP_READYC20910uF16V
OCP_READY
L200
120OHM
OCP_READY
+5V_USB
R2091K
OCP_READY R2104.7K
OCP_READY
R237
0
Non_OCP
C21010uF6.3V
L201
500C212220uF16V
C214100uF16V
D213OCP_READY
AAC
C
R238510
OCP_READY
R224
10K
SIDE_AV
R22510K
SIDE_AV
JK200SPG09-DB-009
1
2
3
4
5
6
7
8
9
10
JK201PPJ235-01
SIDE_AV
4A [YL]O-SPRING
5A [YL]E-LUG
3A [YL]CONTACT
4B [WH]O-SPRING
3C [RD]CONTACT
4C [RD]O-SPRING
5C [RD]E-LUG
JK202
SPG09-DB-0106630TGA004Q
RED
1
GREEN
2
BLUE
3
GND_1
4
DDC_GND
5
RED_GND6
GREEN_GND7
BLUE_GND8
NC9
SYNC_GND10
GND_2
11
DDC_DATA12
H_SYNC13
V_SYNC14
DDC_CLOCK15
SHILED16
JK203PEJ027-01
6B T_TERMINA
7B B_TERMINA
5 T_SPRING
4 R_SPRING
7A B_TERMINA
6A T_TERMINA
3 E_SPRING
D20730V
USB_DN
USB_DP
ZD20430V
READYZD20530V
READY
JK205KJA-UB-0-0037
REAR_USB
1
2
3
4
5
R229
0
REAR_USB
USB_DL_P
R230
0REAR_USB
USB_DL_N
USB_DL_P
USB_DL_N
IC202AP2191SG-13
OCP_READY
3IN_2
2IN_1
4EN
1GND
5FLG
6OUT_1
7OUT_2
8NC
+3.5V_MULTI
JK204KJA-UB-4-0004
SIDE_USB
1
2
3
4
5
IC201-*1R1EX24002ASAS0A
RGB_EEPROM_RENESAS
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
USB Its possibel to 27~47ohm
** 1A Design
SIDE AV
RS-232C
PC EDID
PC SOUND
Close to SIDE_USB
PC
LP91J
EAX64045802
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_HDMI_2
HPD_MST_2
TMDS2_RX2-
CECTMDS2_RXC-
TMDS2_RXC+ TMDS1_RXC-
TMDS2_RX0+
+5V_HDMI_2
HPD_MST_1
CEC
TMDS1_RX2+
TMDS2_RX1+
+5V_MULTI
+5V_HDMI_1
TMDS2_RX0-
TMDS1_RX1-
TMDS2_RX1-
TMDS1_RX2-
TMDS1_RX0-
TMDS1_RX1+
TMDS1_RX0+
TMDS2_RX2+
TMDS1_RXC+
DDC_SDA2DDC_SCL2
JP301
JP300
Q3012SC3875S
RT1C3904-T112
E
B
C
Q300
2SC3875SRT1C3904-T112
E
B
C
D301KDS184S
A 1
C
A 2
IC301CAT24C02WI-GT3
HDMI2_EEPROM_CATAL
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
IC300CAT24C02WI-GT3
HDMI1_EEPROM_CATAL
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
DDC_WP
R30110K
R303
1K
R30010K
R3021K
R305 1 0 0
R304 1 0 0
C3010.01uF
R327 100
R30910K
R31110K
JK302YKF45-7058V
14 NC
13 CEC
5 DATA1_SHIELD
20
SHIELD
12 CLK-
11 CLK_SHIELD
2 DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4 DATA1+
1 DATA2+
17 DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16 SDA
7 DATA0+
6 DATA1-
15 SCL
JK301YKF45-7058V
14 NC
13 CEC
5 DATA1_SHIELD
20
SHIELD
12 CLK-
11 CLK_SHIELD
2 DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4 DATA1+
1DATA2+
17 DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16 SDA
7 DATA0+
6DATA1-
15 SCL
R31910K
+5V_HDMI_3
+5V_MULTI
TMDS3_RX1-
DDC_SCL3
HPD_MST_3 Q3022SC3875SRT1C3904-T112
E
B
C
TMDS3_RX0+
+5V_HDMI_3
R312
10K
DDC_WP
R318 100
TMDS3_RXC+
JK303KJA-ET-0-0032
14 NC
13 CEC
5 DATA1_SHIELD
20
JACK_GND
12 CLK-
11 CLK_SHIELD
2 DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4 DATA1+
1 DATA2+
17 DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16 SDA
7 DATA0+
6 DATA1-
15 SCL JP305
TMDS3_RXC-
DDC_SDA3
R32010K
R314
1K
TMDS3_RX1+
CEC
TMDS3_RX2+
R 3 17 1 00
JP304
C3000.01uF25V
TMDS3_RX2-
R 3 29 1 00
IC302CAT24C02WI-GT3
HDMI3_EEPROM_CATAL
3A2
2A1
4VSS
1A0
5 SDA
6 SCL
7 WP
8 VCC
D302KDS184S
A 1
C
A 2
TMDS3_RX0-
IC301-*1R1EX24002ASAS0A
HDMI2_EEPROM_RENESAS
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
IC3R1EX2
HDMI1_E
3A2
2A1
4VSS
1A0
IC302-*1R1EX24002ASAS0A
HDMI3_EEPROM_RENESAS
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
LP91J
EAX64045802
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN_SIF
0.01uFC501
50V
M_SDA
C50227pF50V
+5V_TUNER
TV_MAIN
M_SCL
+5V_TUNER
C50450V
READY
C50027pF50V
L502READY
10uH
C50782pF50V
READY
C50810uF16V
L500
120-ohm
READY
Q502ISA1530AC1
E
BC
R5024.7K
R506220
R507220
C505100uF16V
READY
C506100uF16V
READY
R505
47
R504
47
C5030.1uF50V
R500
0
R5010
TU500TAFJ-Z001D
PAL_TUNER
5 MOPLL_AS
11 VIDEO
2 NC_2
10 NC_4
4 RF_AGC
1 NC_1
9 SIF
8 NC_3
3 +B[5V]
7 SDA
6 SCL
12 GND
13
SHIELD
TU500-*1
TAFJ-H001F
5MOPL
11VIDEO
2NC_2
10NC_4
4RF_AG
1NC_1
9SIF
8NC_3
3+B[5V
7SDA
6SCL
12GND
13
SHIELD
Near the pin
LP91J
EAX64045802
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THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C6440.1uF
C6370.1uF
M_
S D A
C6061000pF
C61622000pF
C623 22000pF+1.8V_DVDD
C6511000pF50V
C6320.47uF
MULTI_PW_SW
C6050.1uF
+1.8V_DVDD
C6150.1uF50V
C6290.1uF
+3.3V_MULTI_MST
C6430.1uF
C6170.1uF50V
C6020.1uF
C6470.01uF
SPK_R+
M_
S C L
C6100.1uF
C611 2200 0pF
SPK_L+
+1.8V_AVDD
SPK_L-
C6690.1uF
+16V_NTP
+16V_NTP
SPK_R-
C601100pF
C62522000pF
+1.8V_AVDD
C6720.01uF
C6480.01uF
C6031000pF
SW_RESET
C6730.47uF
C6710.01uF
C6260.1uF
C6130.01uF50V
+1.8V_DVDD
+1.8V_AVDD
+1.8V
I2S_MCLK
I 2 S
_ S D O
I 2 S
_ W S
I 2 S
_ S C K
C619390pF
C621390pF
C630390pF
C634390pF
C6081uF
C6181uF
C6241uF
C6141uF
C6070.1uF50V
C64210uF35V
C60010uF16V
C60410uF16V
C60910uF 16V
R6043.3
R60812
R61112
R61012
R63812
R6634.7K
R6234.7K
R6263.3
R625
3.3
R601 100
R6003.3K
R 6 7 6
1 0 0
R 6 7 7
1 0 0
R 6 7 8
1 0 0
R602100
R603100
R65812
R65312
R62112
R65412
R6284.7K
R6674.7K
R6713.3
R6353.3
L605
MLB-201209-0120P-N20LCML00003B
120-ohm
L606
MLB-201209-0120P-N2
0LCML00003B
120-ohm
C63833pF
50VREADY
C63933pF
50VREADY
+3.3V_MST
R63010K
Q603RT1C3904-T112E
BC
R 6 29 1 0 K
MULTI_PW_SW R627
0
READY
R624
0
READY
L608MLB-201209-0120P-N2
L609
MLB-201209-0120P-N2
L610MLB-201209-0120P-N2
L611
MLB-201209-0120P-N2
C61268uF35V
C64068uF35V
L607AD-9060
EAP61008401
2S
1S 1F
2F
L603AD-9060
EAP61008401
2S
1S 1F
2F
R63147K
READY
R673 0
IC600NTP-3200L
1BST1A
2VDR1A
3RESET
4AD
5DVSS_1
6VSS_IO
7CLK_I
8VDD_IO
9DGND_PLL
10AGND_PLL
11LF
12AVDD_PLL
13DVDD_PLL
14TEST0/GND
1 5
D V S S
_ 2
1 6
D V D D
1 7
S D A T A
1 8
W C K
1 9
B C K
2 0
S D A
2 1
S C L
2 2
M O N I T O R
_ 0
2 3
M O N I T O R
_ 1
2 4
M O N I T O R
_ 2
2 5
F A U L T
2 6
V D R 2 B
2 7
B S T 2 B
2 8
P G N D 2 B
_ 1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC
4 3
V D R 1 B
4 4
B S T 1 B
4 5
P G N D 1 B
_ 1
4 6
P G N D 1 B
_ 2
4 7
O U T 1 B
_ 1
4 8
O U T 1 B
_ 2
4 9
P V D D 1 B
_ 1
5 0
P V D D 1 B
_ 2
5 1
P V D D 1 A
_ 1
5 2
P V D D 1 A
_ 2
5 3
O U T 1 A
_ 1
5 4
O U T 1 A
_ 2
5 5
P G N D 1 A
_ 1
5 6
P G N D 1 A
_ 2
57
[ E P ] G N D
R6054.7K
MNT_LOUT
+12V_AUDIO
R6164.7K
C65
Q601RT1C3904-T112
EBC
C65
MNT_ROUT
MNT_L_
C6310.1uF16V
C6200.1uF16V
Q602RT1C3904-T112
EBC
MNT_R_
+12V_AUDIO
Main AMP
AMP :G
LP91J
EAX64045802
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2_A[0]
DDR2_A[12]
DDR2_A[11]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_D[0-15]
DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]
DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[13]
DDR2_D[14]
DDR2_D[15]
+1.8V_DDR
DDR2_A[0-12]
DDR2_BA0DDR2_BA1
DDR2_MCLKDDR2_MCLKZDDR2_CKE
DDR2_ODT
DDR2_RASZDDR2_CASZDDR2_WEZ
DDR2_DQS0PDDR2_DQS1P
DDR2_DQM0DDR2_DQM1
DDR2_DQS0MDDR2_DQS1M
+1.8V_DDR
+1.8V_DDR
DDR2_D[0-15]
V_REF
R900
56R901
56
R902
56R90356
R904
56R90556
+1.8V_DDR
R906150
READY
V_REF
C91910uF10V
R 9 0 7 1
K
R 9 0 8 1
K C9051000pF
C9180.1uF
C9202.2uF16V
C9040.01uF
C9080.01uF
C9070.01uF
C9060.01uF
C9030.01uF
C9020.01uF
C9100.01uF
C9010.01uF
C9090.01uF
C9000.01uF50V
IC900
K4T51163QI-HCF7
J2VREF
J8CK
H2 VSSQ_2
B7UDQS
N8A4
P8A8
L1NC_4
L2BA0
R8NC_3
K7RAS
F8 VSSQ_3
F3LDM
P3A9
M3A1
N3A5
K8CK
R3NC_5
L3BA1
J7VSSDL
L7CAS
F2 VSSQ_4
B3UDM
M2A10/AP
K2CKE
R7NC_6
M7A2
N7A6
M8A0
J1VDDL
K3WE
E8LDQS
P7A11
K9ODT
A2NC_1
N2A3
P2A7
H8 VSSQ_1
F7LDQS
A8UDQS
R2A12
L8CS
E2NC_2
E7 VSSQ_5D8 VSSQ_6D2 VSSQ_7A7 VSSQ_8B8 VSSQ_9B2 VSSQ_10
P9 VSS_1N1 VSS_2J3 VSS_3E3 VSS_4A3 VSS_5
G9 VDDQ_1G7 VDDQ_2G3 VDDQ_3G1 VDDQ_4E9 VDDQ_5C9 VDDQ_6C7 VDDQ_7C3 VDDQ_8C1 VDDQ_9A9 VDDQ_10
R1 VDD_1M9 VDD_2J9 VDD_3E1 VDD_4A1 VDD_5
B9 DQ15B1 DQ14D9 DQ13D1 DQ12D3 DQ11D7 DQ10C2 DQ9C8 DQ8F9 DQ7F1 DQ6H9 DQ5H1 DQ4H3 DQ3H7 DQ2G2 DQ1G8 DQ0
DDR2
DDR2 MEMORY
Close to DDR2 IC
Close to DDR2 IC
LP91J
EAX64045802
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