The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.196
091416
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint AMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 197
091416
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint AMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.198
091416
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
3
3 3 3 3
33333
3 3 3 3
22
Multilayer Organic (MLO®)
Footprint AMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 199
091416
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint BMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.200
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint BMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 201
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Multilayer Organic (MLO®)
Footprint BMechanical Specifications, Pad Layout, and Mounting Recommendations
3
3 3 3 33
3 33333
3 3 3 3 3
22
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.202
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint CMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 203
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint CMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.204
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Multilayer Organic (MLO®)
Footprint CMechanical Specifications, Pad Layout, and Mounting Recommendations
3
3
3
3
31 2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 205
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint DMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.206
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint DMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 207
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Multilayer Organic (MLO®)
Footprint DMechanical Specifications, Pad Layout, and Mounting Recommendations
3
3
3 3 3 3 3 3 3
3 3 3 3 3 3 3
3 3 3 3 3 3 3
1 2
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.208
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint EMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 209
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint EMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.210
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Multilayer Organic (MLO®)
Footprint EMechanical Specifications, Pad Layout, and Mounting Recommendations
3
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 31 2
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 211
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint E1Mechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.212
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint E1Mechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 213
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in black.Dimensions in inches [mm]
Multilayer Organic (MLO®)
Footprint E1Mechanical Specifications, Pad Layout, and Mounting Recommendations
3
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 31 2
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.214
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint E2Mechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 215
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint E2Mechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.216
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in Black.Dimensions in inches [mm]
Multilayer Organic (MLO®)
Footprint E2Mechanical Specifications, Pad Layout, and Mounting Recommendations
3
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 31 2
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 217
MECHANICAL SPECIFICATIONS
Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed
Multilayer Organic (MLO®)
Footprint FMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.218
SUGGESTED PCB LAYOUT
Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.
Multilayer Organic (MLO®)
Footprint FMechanical Specifications, Pad Layout, and Mounting Recommendations
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 219
PAD CONNECTIONS
Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]
Multilayer Organic (MLO®)
Footprint FMechanical Specifications, Pad Layout, and Mounting Recommendations
3 3 3 3 3 3 3 3 3 3
3 3 3 3 3 3 3 3 3
3 33 3 3 3 3 3 3
3
1 2
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.220
MOUNTING RECOMMENDATIONS
AUTOMATED SMT ASSEMBLYThe following section describes the guidelines for automated SMT assembly of MLO® RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages.Control of solder and solder paste volume is critical for surface mount assembly of MLO® RF devices onto the PCB.
Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO® devices onto the PCB.
SMT REFLOW PROFILECommon IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO® devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and
slower preheating time may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below.
Critical ZoneTL to Tp
Ramp-down
Ramp-up
Ts max
25t 25ºC to Peak
Ts min
tsPreheat
Tptp
TL tL
Time
Tem
per
atur
e
Figure A. Typical Lead Free Profile and Parameters
Profile Parameter Pb free, Convection, IR/ConvectionRamp-up rate (Tsmax to Tp 3ºC/second max.Preheat temperature (Ts min to Ts max) 150ºC to 200ºCPreheat time (ts) 60 – 180 secondsTime above TL, 217ºC (tL) 60 – 120 secondsPeak temperature (Tp) 260°CTime within 5ºC of peak temperature (tp) 10 – 20 secondsRamp-down rate 4ºC/second max.Time 25ºC to peak temperature 6 minutes max.
Multilayer Organic (MLO®)Mechanical Specifications, Pad Layout, and Mounting Recommendations