Transcript
Page 1: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

MIPI Alliance Specifications Roadmap:

The Wires for Wireless

Rick Wietfeldt, Ph.D.

Qualcomm Technologies, Inc.

Chairman, Technical Steering Group, MIPI Alliance Inc.

Page 2: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

Agenda

•  Introduc)on• MIPIandtheMobileG’s…2003-2016+…• RoadmaptoTomorrow…Moremobile;IOT,auto…

• Conclusion

2

Page 3: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

MIPI Alliance 2003-2016

3

Sophia-An?polis

Amsterdam

Dallas

ParisLondon

SanFrancisco

Osaka

Helsinki

Montreal

Seoul

Phoenix

Brussels

HongKongMiami

LasVegas

Prague

Lisbon

SanDiego

Athens

Frankfurt

Chicago

Vancouver

Berlin

Bangkok

Warsaw

Toronto

Budapest

Shanghai

Hawaii

Copenhagen

Barcelona

Taipei

SeaSle

NewOrleans

2013mee)ngsandMIPIAlliance

forma)on

Page 4: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

MIPI Technical Steering Group (TSG) •  The TSG serves as the steward and guiding influence for

specification work within the MIPI Alliance.

•  TSG defines and maintains the MIPI Technology Roadmap, tracking future work for each specification, and introducing new interfaces/technology into the Roadmap.

•  TSG now works with newly formed Marketing Steering Group (MSG), driving coordination across all WGs; and both report to the Board of Directors.

4

Page 5: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

Mobile Terminal Evolution and MIPI Formation

5

2020

5G++

4G(all-IP&morebands)

3G(mobilebroadband)

2G(digital&data)

1G(analog)

10G

10M

1M

10k App

roximatewire

lessspe

edsinbps

1G

100M

100k

First2G(GPRS,1xRTT)Phone

MIPIAllianceForms

FirstCameraPhone

201520102005200019951990

Page 6: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

MIPI Interface Evolution with the Mobile Gs

6

1 2 3 4

Page 7: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

MIPI and Mobile G evolution vectors

7

I.Wireless

TechnologyEvolu?on

II.User

ExperienceEvolu?on

MIPISpecGroups:IPC:InterProcessCommunica?ons;C&D:Control&Data;MM:Mul?media;D&T:Debug&Trace[1]OtherindustrystandardIPCinterfacesinclude:USBHSIC,USB3,PCIe[2]ThepredecessorofUFSise.MMCthatcon?nuesselec?veindustryuse

Common

Page 8: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

8

Page 9: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

9

MIPISpecifica-onsFramework

Mul?media

Chip-to-Chip(M-PHY)InterProcess

Communica?ons

Debug&

Trace

Control&

Data

Page 10: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

10

MIPI Spec Framework and Key Specs

•  CSI (camera) •  DSI (display) •  SLIMbus/

SoundWire (audio) •  UniPro (UFS)

•  RFFE •  I3C •  VGI (Virtual GPIO)

10 Chip-to-chip IPC •  UniPro (UniPort-M)

•  LLI

UpdatedSpecBrandNewSpec(2016)

Mul?media

Chip-to-Chip(M-PHY)InterProcess

Communica?ons

Debug&

Trace

Control&

Data

•  GbD IP Sockets •  NIDnT •  HTI •  SyS-T (software)

Page 11: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

11

MIPI Specifications: Protocol Layering (1)

Mul$media Chip-to-Chip

Page 12: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

12

MIPI Specifications: Protocol Layering (2)

Control&Data

Page 13: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

13

MIPI Interface Development Pillars

Page 14: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

Product Developer Choices

14

PHY

AP-Centric

Networked(UniPort-M)

D-PHY

M-PHY

C-PHY

Page 15: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

15

•  ManyMIPIInterfacesareusedtodayinAutomo?ve–includingMul?media,Storage,Sensor,andWirelessconnec?vity(WWAN,WLAN,GNSS,BT,NFC)

•  MIPIInterfacesmaybefedtoaBridgedevicefortransportonlongerdistances

Page 16: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

MIPI Roadmap to Tomorrow •  Continued focus on mobile terminal interfaces to 5G

•  I: Wireless Technology; II. Multimedia

•  Increased focus on leveraging MIPI Interfaces for use in mobile-influenced Markets •  IOT, Automotive, Industrial

•  Examples: •  Extended Lengths for longer reach applications

•  PHY, RFFE, I3C

•  Lower RFFE latency for (Pre)5G wireless •  Lower speed Modem interface (VGI) •  I3C for touch and control applications

16

Page 17: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

Conclusion •  Footprint… MIPI is now in every smartphone, and

soon in every phone (i.e. including featurephone ! smartphone)

•  Expanding… Rapidly expanding into mobile-influenced markets as mobile SOC manufacturers and OEMs leverage (reuse) their interface IP assets •  New “terminals”: Wearables, VR, Drones, Connected Vehicles

• Optimizing… With assistance from new industry members and developers, evolving specs to address specific requirements of the mobile-influenced markets

17

Page 18: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

DevCon Topics General•  MIPIinAutomo?ve…•  MIPIBeyondMobile–industrialComputer-on-Module…

Low-speedInterfaces•  Developer’sGuidetoMIPII3CImplementa?on…•  I3CHighDataRateModes…•  MIPIMobileTouch…•  Verifica?onofMIPISoundWire…•  MobilesystemGPIOminimiza?onusingVirtualGPIOInterface…

High-speedInterfaces•  ImpactofHigherDataRateRequirementsonMIPICSI&DSI…•  CSI-2forVisionandSensorFusion…•  CSI-2CameraAggrega?oninFPGAs…•  D-PHYTestandMeasurement…•  C-PHYfromTheorytoPrac?calImplementa?on…•  MIPIDebugSpecsHelptoDevelopSystemSohware…

Manyothers…

18

Page 19: MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

Thank You


Top Related