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1
European Summer School PPST 2008
WITOLD GULBIŃSKI
Institute of Mechatronics, Nanotechnology
and Vacuum Technique
Koszalin University of Technology, PL
Physical Vapour Deposition of Thin Film CoatingsPart II
Magnetron sputtering
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2Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
OutlineInteraction of charged particles with electric and magnetic field. Magnetron effect.
Magnetron sputtering sources (coaxial, planar and other constructions).
Unbalanced magnetrons (closed field systems).
Magnetron sputtering sources for magnetic materials.
Pulsed magnetron sputtering (unipolar and bipolar sputtering, suppression of unipolar arcs)
High power magnetron sputtering – selfsputtering.
High Power Impulse Magnetron Sputtering (HIPIMS)
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3Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
MAGNETRON SPUTTERING SOURCES
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4Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Electron motion in homogeneous magnetic field
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5Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Drift of electron in inhomogeneous magnetic field.
A
A
A-A
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6Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Electron motion in so called
“magnetic mirror" area.
Magnetic „bottle”
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7Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Electron motion in crossed, homogeneous
electric (E) and magnetic (B) fields.
cathode
vdRL
ve
vR E B
anode+
-
Let’s add electric field E perpendicullar to magnetic field vector B
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8Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Basic configurations of cylindrical magnetron sputtering systems:a) the general one, b) so called post-magnetron configuration with the cathode end-plates,c) multi-trap configuration
_ _ _+ + +
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9Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Cylindrical magnetron cross section
a) discharge structure,
b) electron paths.
a)
b)
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10Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Advantages of co-axial magnetrons,
Homogeneous target erossion,
High deposition rate (when compared to diode systems)
Very large substrate mounting space
Drawbacks of co-axial magnetrons,
High thermal load to substrates dueto electron bombardment (electroncollecting grid anodes)
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11Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Inverted cylindrical magnetron.
N
S S
N
anodecathode
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12Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Planar magnetron sputtering sources: rectangular(a) and circular(b)
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13Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Electron movement over the planar magnetron cathode.
cathode
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14Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Planar magnetron source - secondary electron escape paths
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15Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Discharge voltage vs. discharge current for planar magnetron source for different magnetic field magnitude.
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16Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Discharge voltage vs. discharge current for planar magnetron source for different argon pressures.
I [A]c
B = 500 Gsgas - Artarget - Tiplanar magnetron
6.5 10 Pa-2
U [V]c
0.11-1 Pa
0.1 Pa0.08 Pa
0.065 Pa
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17Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
0
0,5
1
1,5
2
2,5
0 5 10 15 20 25 30
Power density [W/cm2]
Dep
ositi
onra
te[ µ
m/m
in]
WTiCr
AlNiPt
CuAuAgSn
1192320C
1089620C
19710640C
6310840C
19517680C
276600C
Argon40
18434220C
4816680C
Dependence of deposition rate of metals on power density at the target (planar magnetron).
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18Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Film thickness distribution for different target - substrate distance (magnetron cathode diameter: 80 mm)
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19Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Planarmagnetron source –constructiondetails
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20Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Sputter gun
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21Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Sputter gun
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22Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Sputter gun
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23Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Sputter gun
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24Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Magnetrons with rotated targets Coating of large surfaces
Continous coating of foils
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25Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Double source magnetron sputtering system – combination od planar and rotatingtarget sources (deposition of 2-component coatings)
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26Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Triple source magnetron sputtering system – for deposition of 3-component CMA coatings
2 inch planar magnetrons (Al, Cu, Fe)
Rotated and heated substrate holder
3xDC power supply in master-slavemode
LN2 trap
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27Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Planar magnetron with additionalhot filament
Thermally emited electrons areinjected into the magnetic trap
Enhanced ionization
Lower working pressure
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28Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Magnetron sputtering of ferromagnetic materials(Fe, Co, Ni…)
Ferromagnetic target
Short circuit for magnetic field
No magnetic field above the cathode(target)
TARGET SECTIONALIZATION
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29Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Advantages of planar magnetron sources
High deposition rate (up to hundreds nm/min)
DC and RF operation possible
Low discharge voltage (200-600V)
Low working pressure (1Pa)
Easy upscaling
Easy maintenance
Easy design of multisource systems
Plasma confined in target vicinity (coating oftemperature sensitive materials possible)
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30Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Unbalanced magnetrons– why and what does it mean?
For the balanced magnetic circuit: the intensities of magnetic flux through the pole faces of the outer poles and through the pole face of the inner pole are identical or comparable.
A preferred strengthening or weakening of one of the involved poles of the magnet leads to “unbalanced” magnetic circuit.
Such an effect can be obtained by:
the change of cross section surface ratio of outer and inner pole of the magnet,
external field source
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31Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Balanced (a), permanently unbalanced (b) and externally unbalanced (c) magnetic circuits of planar magnetron sputter source.
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32Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
a) Dual unbalanced magnetron closed - field system called „ionic gemini”
b) Four source, closed field sputtering system
b)
a)
Opposite poles
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33Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Advantages of unbalanced magnetrons
Plasma expanded to the substrate,
Higher (up to 10mA/cm2) ion current density at the substrate
Ion assisted deposition possible
„Closed field” multi-source systems widely used by industry for hardand wear resistant coatings deposition
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34Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Pulsed magnetron sputtering
Why?
Deposition (direct and reactive) of insulating films means:
arcing problem (unipolar and bipolar arcs)
disappearing anode effect
low deposition rate
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35Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
What is unipolar arc?
Dielectric island(Al2O3), few nm thick+ + + + + + + + + + +
Metallic target (Al) at high negative potential
PLASMA
Cathode
Electric field higher thanbrakedown field
Local arc discharge
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36Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Fundamental capacitor model.
J. Sellers, Surface and Coatings Technology 98 (1998) 1245 - 1250
Plasma
Target A1
Al O (dielectric)2 3
(dielectric)
Plasma
Target
Dielectri c breakdown(Micro - Arcing)
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37Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Arrangements for unipolar (a) and symmetric bipolar (b) pulsed magnetron sputtering
a) b)
pulsedpower supply
pulsedpower supply
disappearing anode andarcing problem solved
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38Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Normal sputter mode
Asymmetric bipolar pulse sputtering(single source)
T0-T1 duty cycle < break down voltage buildup time
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39Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Reversal mode (neutralizationof positive surfacecharge at the dielectric)
Asymmetric bipolar pulse sputtering(single source)
+Vrev about 10% of Vsputt.
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40Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Return to sputter mode
Asymmetric bipolar pulse sputtering(single source)
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41Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Magnetron sputter source with double ring plasma on 2 electrically separated targets
Can be operatedin bipolar mode
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42Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
High power DC magnetron sputtering(self-sputtering of metals)
Due to high power dissipated at the target of „self-sputtering” source, ionisation conditions change resulting in an increased number of ionised target atoms in the plasma.
According to energy exchange model metal ions, carrying the mass equal to that of target material atoms, induce very effective sputtering.
When the power density at the cathode exceeds a „self-sputtering”threshold value, argon supply can be closed and the discharge becomes sustained by metal ions only.
In transition region between classical sputtering and self-sputtering, both these processes coexist.
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43Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Light emission spectra recorded during coppersputtering in argon, at three target currents.
Radzimski et al.: J. Vac. Sci. Technol. B, Vol. 15, No. 2, Mar/Apr 1997
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44Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
New trends:High power impulse magnetron sputtering (HIPIMS)
Very short pulse duty time (few % of AC voltage period)
Very high discharge current in pulse (in kA range)
High fraction of ionized target material in the plasma
Medium deposition rate
Hysteresis effect during reactive sputtering highly suppressed -stable reactive deposition
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45Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Peak power density: 2000 Wcm-2
Repetition frequency; 100 Hz (T = 10ms)Current pulse duty time = 200µs i.e. 2% of the pulse periodPlasma density n = 1013 cm-3 (classical magnetron: n = 1010 cm-3)
High Power Impulse Magnetron Sputtering (HIPIMS)A. P. Ehiasarian (2001)
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46Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
In conventional magnetron discharges:
HIPIMS exhibits n = 1!
nkUI =where: n = 5…10
HIPIMS
Ehiasarian, A.P. R.; Munz, W.-D.; Hultman, L.; Helmersson, U.; Kouznetsov, V., Vacuum, 65 (2002) 147-154
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47Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
HIPIMS
Eion = 20- 40 eV
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48Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
HIPIMS has been implemented successfully on industrial scale machines
HIPIMS discharges produce metal ions charged up to 2+ for Ti, Cr and Nb
The metal ion–to–neutral ratio increases continuously as a function of peak power
Metal ion etching by HIPIMS promotes local epitaxial growth and improves theadhesion of coatings without incorporation of droplets
HIPIMS pretreatment improves the corrosion performance due to defect-freeinterface of multilayer films
High Power Impulse Magnetron Sputtering (HIPIMS)
A. P. Ehiasarian
Nanotechnology Centre for PVD Research,Materials and Engineering Research Institute,Sheffield Hallam University, UK
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49Institute of Mechatronics, Nanotechnologyand Vacuum TechniqueKoszalin University of Technology, PL
Koszalin, August 18-29, 2008
European Summer School PPST 2008
Recommended literature
1. Kelly, P.J., Arnell, R.D. (2000) Magnetron Sputtering: A Review of Recent Developments and Applications, Vacuum, 56, 159-172.
2. Safi, I. (2000) Recent Aspects Concerning DC Reactive Magnetron Sputtering of Thin Films: a Review, Surf. Coat. Technol. 127, 203-219.
3. Musil, J. (1998) Recent Advances in Magnetron Sputtering Technology, Surf. Coat. Technol. 100/101, 280-286.
4. Bunshah, R.F. (1991) Handbook of Deposition Technologies for Films and Coatings: Science, Technology and Applications, Second Edition, Noyes Publ., New Jersey
5. Wasa, K., Hayakawa, S. (1991) Handbook of Sputter Deposition Technology, Noyes Publ., Park Ridge, New Jersey.
6. S. M. Rossnagel, J.J. Cuomo & W.D. Westwood (eds.) Handbook of Plasma Processing Technology, Noyes Publ. (1990) Park Ridge, New Jersey