Presto Engineering © 2011
About Presto Engineering
• Service hubs in Europe,
USA and Israel
• 70+ people expert in Test,
Qualification, Reliability
and Failure Analysis
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Leader in Integrated Test & Product Engineering and
Back-end Production services
More than 100 customers served since 2006
Presto Engineering © 2011
Company History
2011
ISO 9001 Certification
Roos Instrument RF partnership
Acquisition of NXP’s lab assets
Caen Normandy Hub
Common Lab with
CEA-LETI (RF DFT R&D)
Test Services RF collaborations WIN Semi/GaAs, IBM/SiGe
2009 2008 2007 2006
Creation in
California
Acquisition of Cypress’ engineering lab
Silicon Valley Hub
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2010
Series A Series B Series C
ISO 17025 Certification
Creation Presto Israel
ATE Infrastructure
(RF, 10-100G)
Presto Engineering © 2011
Core Differentiating Competence
A global and expert team
Offering single point know-
how for five semiconductor
value segments
Heirs of leading companies in
the industry
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Presto Engineering © 2011
Test Engineering
• Hardware development
– Circuit design, CAD, implementation
– Probe cards and FT loadboards
• Test Program development
– Test plan from datasheet & coverage
– Development and debug on ATE
– Validation, Correlation & Ramp
– Multi-site and transfer to production
– Test time reduction
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Presto Engineering © 2011
Supported Platforms
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Vendor Models RF SOC Dig Mem
Advantest T5593
T5581
T5362
X
X
X
LTX-Credence X-Series MX
D-10 (*)
X X
X
X
Teradyne uFLEX
J750 (*)
U-FLEX (*)
X
X
X
X
X
X
Verigy 93K
Inovys
X X
X
X
X
(*) With test partners
Presto Engineering © 2011
Test Engineering Expertise
• Management background in Automated Test
Equipment (ATE) & NPI
– Schlumberger/ATE, Credence
– Engineering (ATE development) and Applications
– Product introduction & SCM
• Multiple test engineering experts on staff
– Teradyne, Verigy, LTX-Credence
– RF, Analog-Mixed Signal, SOC
• Hardware designers on staff
– Loadboard development, from circuit design to qualification
• Design for Test (DFT) investment to leverage
existing ATE into new applications
– Patent pending in Ultra Wide Band high frequency connectivity
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Presto Engineering © 2011
Market Focus: RF test examples
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40-100G Ethernet
10-50Gbps
LTE wireless Backhaul
infrastructure
20-86GHz RF
UWB Mbps
transmission Mbps
8 GHz RF
NFC Payment
RFID
3G/4G LTE Platform
TX/RX
2.4GHz RF
Working with industry leading edge
customers in key RF market segments
Presto Engineering © 2011
Accelerate Time to Volume
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DESIGN
WAFER
FOUNDRIES
ASSEMBLY & TEST
OSAT (Out-Sourced Assembly & Test)
YOUR
YOUR CUSTOMERS
• Test Engineering
• Characterization
• Qualification
• Failure Analysis
• Test Production
• Assembly Mgmt
• Yield Improvement
• Turn-Key
Presto Engineering © 2011
Capabilities / Cookbook / Knowledge
Prototype testing
Fault localization (Bitmapping / Logic faults)
In house advanced product engineering tools
Non Destructive - PEM
- TIVA/OBIRCH
-SDL
- TRE
- LTP/LVP
Destructive PFA - FIB / TEM
- AFM / SIMS / AFP
- AUGER
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Presto Engineering © 2011
FUSION MX (LTX Credence)
DC
– 16 OVI Pins, 16V, 550mA/1A
– 16 High Current OVI Pins, 8V,1A,
– 32 VI16-B Pins, +42/-4V, 50mA
Analog
– 4 Sequenced Waveform Generator Pins
– 4 Digitizer HSB Pins, 14 Bit, 100Ms/sec
Digital
– 96 FX2 200MHz Digital Pins
– 16 FX High Speed Digital Pins ( 800Mhz)
RF
– 16 RF16D Ports
– 1 Dual Source and LO Generators
– 1 Low Jitter Clock Generator 6GHZ SMA100
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Presto Engineering © 2011
Digital AMS/RF SoC V93K Test Cell
• Large Test Head
• 512 Digital pins (32MB) – 12 x 3.6Gbps (PS3600)
– 84 x 800Mbps (PS3600)
– 128 x 400Mbps (PS800)
– 288 x 200Mbps (PS800)
• Analog – 1 x MBAV8 (4S / 4M)
• RF – 3 RF source, 12 RF ports
• DPS – 4 x MSDPS (32 channels)
– VI32 (16 channels)
• Software – Memory APG
– Multisite
• Prober TEL Precio – 200mm 300mm wafer Probing
– 12” and 9.5” V93K docking
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Presto Engineering © 2011
µFLEX RF (Teradyne)
RF
• 50MHz to 6GHz
• 3 sources -100 to +13 dBm , 11 Ports
• Modulated source. 40MHz Bandwidth
• On board 100MSps digitizer.
• Synchronized with other instruments
Analog
• 2 sources 23 bits 15MHz Bandwidth
• 2 sources 14 bits 400 MSps
• 2 captures 23 bits 15MHz Bandwidth
• 2 captures 14 / 12 bits 125MSps, 300MHz BW
Digital
• 96 channels
• 50 MHz, up to 200MHz
• Per pin programmable edges
• 250ps resolution
DC
• 20 VI “30V / 200mA”, 4 quadrant
• 4 VI “75V / 2A”, 4 quadrant
•Wave source capability, 16 bits
•Capture V or I @ 100kHz, 16 bits
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