Psi Corporate and Business Introduction Aug. 2018
Phoenix Silicon International Corporation Confidential 1
Safe Harbor Notice
• Psi’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements.
• Information as to those factors that could cause actual results to vary can be found in PSI’s Annual or Quarterly Report filed with Taiwan Stock Exchange Corporation (TWSE) and such other documents as PSI may file with, or submit to the TWSE from time to time.
• Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.
Corporate Highlights
Specialty MEOL Process Services
Phoenix Silicon International Corporation Confidential 3
FEOL TSMC, GF, UMC
BEOL ASE, SPIL
• Reclaim / Thin wafers
• Power MOSFET • Power IC • Bio chip • MEMS sensor
• Front side circuit printed wafers
MEOL Psi , Xintec, Chipbond
Three Growing Business
Phoenix Silicon International Corporation Confidential 4
Reclaim
Wafer Materials
Thinning
Power Semi
MEMS
Sensor
• Stable Growth • Cash Cow
• Widespread use • Emerging
• Strong demand • Fast Growing
Market 14% CAGR
Market 9% CAGR
Market 6% CAGR
Semiconductor Thinning Trend
Phoenix Silicon International Corporation Confidential 5
50
120
725
~ ~ MEMS
Mobile Memory
Diode
Optical MEMS
MOSFET IGBT
CIS
Flash Memory
25
(um)
Reclaim
10
Enhance Product Function
Phoenix Silicon International Corporation Confidential 6
• Improve electrical performance,
:Lower Rds_on • Low heat dissipation
• Very thin packaging
MOSFET Thinning Technology roadmap
Key Investment Highlights
Key Investments Highlights
1. Clear Beneficiary of Growing SEMI Market
2. IDM Outsourcing Share constantly increasing
3. Strong Partnerships With Industry Leaders on Core Tech. & Services
4. Leading Power semi MEOL Foundry
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Source: World Forecast report (NOV. 2016,SEMI)
0
5
10
15
China Americas Taiwan SE Asia Europe&mideast
Japan Korea
New Facilities & Lines Starting Operation (Front End, all probabilities)
2017
2018
2019
2020
• Reclaims demand keep growing as
SEMI grows
• China fab fever will continue, especially SMIC, YMTC/XMC
• China market Phase I Low volume from Taiwan Phase II High volume operation in China
Clear Beneficiary of Growing Fab
Clear Beneficiary of Growing MEMS /Sensor
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Average 14% CAGR
Source: Yole
PZT PZT
PZT
Optical Optical
• DM still dominate MEMS market while
foundry business is highly selective
• Choose the OEM products base on Psi’s core competence, Thin Wafer Process
• Collaborative rather redundant foundry mode could sustain win-win relationship
Driven by Automotive, Industry 4.0, New Energy
Phoenix Silicon International Corporation Confidential 11
0
5
10
15
20
25
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024
Average 8% CAGR IGBT
11% CAGR
IT electronics
Infrastructure
Transportation
New energy
Source: Lux Research Inc.
Total discrete electronics market is set to reach $23billion in 2024 Power discretes and modules
total market in 2016: $15.9bn
2.6%
2.6%
4.1%
4.2%
4.6%
4.7%
4.9%
5.3%
9.2%
18.5%
Semikron
Rohm
Renesas
Fuji
Vishay
Toshiba
Mitsubishi
STMicro
ON Semi
Infineon
Accelerating Trend of Outsourcing
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0.0%
2.0%
4.0%
6.0%
8.0%
10.0%
12.0%
14.0%
IDM System Total Foundry Fabless
2017-2021 CAGR
IDM client should see 12.9% CAGR over 2017-2021, Strongly outpacing total foundry growth of 6.8%
12.9% CAGR
Source: Gartner, Nomura
• Asset-light strategy of global IDMs
• In the next 5years, Infineon frontend outsourcing share will increase from ~22% to ~30%.
• Power semi IC fabless is fast growing
Major Customers: Tier-1 in Each Field
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Thinning
Reclaim
MEMS
Business Model: Direct or Turnkey
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End customer
Foundry
PSI
End customer
Foundry PSI
Turnkey Direct
Because of IP Protection
Leading Power semi MEOL Foundry
• Unique etching material
• Thinning wafer OEM Capacity WW NO.1, Continue Expanding
• Quality and Yield rate meet Tier-1 IDM’s specification
• Thin wafer mass production experience ( > M pieces)
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Financial Highlights
Continue Growing
Phoenix Silicon International Corporation Confidential 17
0
500
1,000
1,500
2,000
2015 2016 2017
PBC
Psi(SEMI)
-
100,000
200,000
300,000
400,000
500,000
600,000
2015 2016 2017
EBIT
EBITDA
Thinning Capacity Grows Revenue Grows
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20,000
25,000
30,000
35,000
40,000
45,000
50,000
55,000
60,000
120,000
130,000
140,000
150,000
160,000
170,000
180,000
190,000
Jan-18 Feb-18 Mar-18 Apr-18 May-18
薄化產量 月營收
NTD K Piece, 8inches
Summary
Specialty MEOL Process Service Power Semi & MEMS
Core Competence
• Unique Etching Material • > 50 𝜇m ultra thin MP Experience
• Meet Tier-1 IDM’s Specification
• Competitive Cost Structure
• WW NO.1 Efficient Reclaim Wafer foundry
• WW NO.1 Power device MEOL foundry
• WW No.1 MEMS automation foundry
Phoenix Silicon International Corporation Confidential 19
Business Model Thinning
Business Outlook
20
• Capacity optimization
• Acoustics, Optical, Bio Sensor
• Advanced Reclaim Wafer
• Power Semi for Vehicle Spec
• Pay attention to CN • Cultivation TW
Phoenix Silicon International Corporation Confidential
Thinner Is Better
Thinning Is the King
Q & A