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SBC Corporate Office & IntegratedTechnologies Division - Chandler, AZ.
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Presentation Menu
• Contacting South Bay Circuits • Integrated Technologies Division• Process Capabilities• PCB Manufacturing Division• Design Guidelines for Manufacturability and Assembl
y
Click on a Link to view a specific area of interest, Click on a Link to view a specific area of interest, otherwise the presentation will continue in the order otherwise the presentation will continue in the order above shortly.above shortly.
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How To Contact SBC• South Bay Circuits – Chandler, Arizona
Phone (480) 940-3125 Fax (480) 940-
4270 • South Bay Circuits – San Jose, California Phone (408) 978-8992 Fax (408) 723-
0916
• FTP (file transfer protocol) Call: John Lundin - 480-940-3125 ext: 150
• Web page: www.sbcinc.com
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People To Know At South Bay CircuitsChandler, Arizona FacilityRoland Satterlee – President/CEO 480-940-3125 ext.
124Randy Langston – Director of Sales 480-940-3125 ext.
191Dan Farrell – VP of Manufacturing 480-940-3125 ext.
176Mike Malles – Director of Operations 480-940-3125
ext. 107Amy Kryzak – Customer Service 480-940-3125 ext. 106Kristi Wiley – Western Regional Sales Mgr. 408-579-
8225Eddie Rocha – Director of Technology 408-579-8282
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South Bay Circuits, Inc.Established 1981
• Multiple Manufacturing Facilities - 220,000 Total Square Feet
• All facilities ISO-9002 Registered by Underwriters Laboratories since 1996
• PCB’s, Assemblies & Backplanes• Time Critical Requirements in 24
Hours• Pre-Production & Production Volumes
in 72 Hours
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Integrated Technology Division
Assembly Pre-Production Engineering• Design Rules Check and Capabilities
Review• Process Route Generation• Machine Programming• Assembly Tooling Design• Stencil Design• New Process Development
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Integrated Technology Division
Assembly Materials Storage• Secured Material Storage• Separate Consigned Materials Area• Full ESD and Moisture Sensitivity
Precautions
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Integrated Technology Division
Assembly Test Capabilities• Level II, III and IV Available• ICT or Flying Probe• Burn-in and Environmental Stress
Screening
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Integrate Technology Capabilities
• SMT• Wave Soldering• IPC Certified Hand Soldering• Custom Component Installation• Hardware Installation• Card Cage and Chassis Assembly• Electro Mechanical Assembly• Cable and Harness Assembly• Backpanel Press-Fit Assembly• ICT, Functional, ESS Testing
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Integrated Technologies Division
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Integrated Technologies Division
MPM AP-36 Screen Printer*Fully Automatic with Vision
*28 x 28 Printable Area*Fine Pitch Capable
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Integrated Technologies Division
Fuji SMT Line
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Integrated Technologies DivisionFuji SMT Line
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Integrated Technologies Division
MyData MY12 SMT Placement*Prototype and/or Large Board Capability
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Integrated Technologies Division Conceptronic Convection Oven
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Integrated Technologies Division* Box Build Assembly and Staging Area
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Integrated Technologies Division* Back Panel Assembly
* Press Fit Connectors & Component Assembly
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Integrated Technologies Division * Bare Board Assembly
* Complete Box Build Integration
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Integrated Technologies DivisionYour Logo
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Integrated Technologies Division*Soltec-Wave Solder *3 Zone bottom heat*Pulse top heat *Lambda and Chip Wave
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Integrated Technologies Division*GPD Aqueous Wash
*Complete DI Water System - Closed Loop
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Integrated Technologies Division*Teradyne Z1860VP ICT Tester
*Multi-Scan Package*2048 Points
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Integrated Technologies Division
*Press Fit Assembly
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Integrated Technologies Division* QC / Inspection
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PCB Manufacturing Capabilities
• High Temperature FR4 > 170 Tg• Getek / FR408 / Polyimide• Rogers 3000 & 4000 Series• Copper Foil - HTE 1/8 oz. - 4 oz.• Multilayers Down to 0.015” thick• 0.230” thick PCB’s• 18x24, 19x25, 21x24 Panel Sizes• Buried / Blind Vias• Electroless Nickel Immersion Gold• Hard Gold• Soft Bondable Gold• Entek 106A• Hot Air Solder Leveling (SMOBC)• Solder Reflow
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PCB Manufacturing Capabilities• White Tin Immersion• Resistive Inks• Electrical Testing• Edge Plating• 10:1 Aspect Ratio• Soldermask Registration to 0.002”• Soldermask Dams between SMT features with 0.007”
space• Soldermask Colors - Green, Blue, Red, Black and
Clear• Impedance - Single-Ended & Differential +/- 10%• Thru holes with pad 0.008” over drill• Prototype Line Capability - Internal (0.003”) -
External (0.004”)• 0.010” Pitch SMT (TAB) / BGA’s• 0.010” Thru Hole Drill / 0.008” Blind Via Drill• Micro-ViasReturn to menu Next Section
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Cam / Programming* Valor ODB++ Software
* Sun Sparc Ultra 7 & 10 Workstations* Customer Data Reviewed & Prepared for Fab
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Inner Layer Material Prep/Clean Line
*ISS Mechanical Pumice Scrubber
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Inner Layer Dryfilm Coat* Dupont Automated Cut Sheet Laminator
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Inner Layer Imaging* Colight Exposure Units
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Conveyorized D.E.S. Line* Develop ---> Etch ---> Strip ---> Durabond
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White Oxide Line for I/L’s
*Durabond
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Post Etch Tooling Punch* Automatic Optical Alignment to Post-Etch
Targets
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Inner Layer Optical Inspection
* New Camtech AOI Machines Capable of Comparing Scanned Image to Supplied
Gerber(AOI – Automated Optical Inspection)
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Inner Layer Lamination*Internal Layers are Stacked and Dielectric
Material(Pre-Preg) Added Between Layers for Bonding
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TMP Hydraulic / Vacuum Assist
Lamination Presses* Computer Controlled / Pre-Set Lamination
Cycles
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Primary Drilling - Excellon Century 2001
*Six Spindles with Auto Bit Exchange *Capable of Drilling Oversized Panels
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Pluritec Inspecta X-ray Vision System
*Confirms Internal Registration Prior to Drilling
*Drills “New” Tooling Holes as Required
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PENC Electroless Copper Plating Line
* Computer Controlled - Increased Productivity* Agitation - Vibrator for High Aspect Ratio PCB’s
* Bumper - for Copper Process Only
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In Process Cross Section Lab * X-section’s are Reviewed for Process
Controls*400x Micro-scope for Viewing X-Section’s
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Outer Layer Imaging * Colight Exposure Units
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Automated PAL Plating Line*11 Acid Copper Plating Stations*Twin Rectifier Units Per Station
* Automated Twin Hoist / High Repeatability
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Strip - Etch - Strip Line - Outer Layers
* Fully Conveyorized Three Station Line* Strip Plating Resist ---> Etch Copper ---> Strip
Tin
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Solder Mask * DP-10 & DP-100 Auto-Screeners * Tack Dry
* UV Expose
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Micro - Plate Line* Hard Gold & Nickel Plating of Edge
Connectors
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Fabrication* Routing of Individual PCB’s - Single up or Array
Format * Edge Beveling & Scoring*Secondary Drilling as Required
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Electrical Test Programming & Fixture Assembly
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Electrical Test Department* All orders are 100% Netlist tested
* Everett Charles 9090 - Dual Access Tester
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A Winning Combination
•Commitment to On-Time Deliveries
•Technical Expertise and Support
•Vertical Integration•Team Selling and
Engineering•Commitment to Quality
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Document Links• Please click on document
link to access the following documents
• SBC Design Guidelines for Manufacturability
• SBC Design Guidelines for PCB Assembly
ManufacturabilityManufacturabilityGuidelinesGuidelines
Printed Circuit BoardsPrinted Circuit Boards
FOR
South Bay Circuits, Inc.210 Hillsdale Av.San Jose, CA. 95136(408) 978-8992 By: Edward Rocha
GL-0700
South Bay Circuits
Acrobat DocumentReturn to menu
Exit Presentation
Printable VersionManufacturability Guidelines for PCB’s