SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
Goal
FOGALE nanotech provides standard and customized
systems well suited to new metrology requirements for
MEMS and semiconductor applications
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
4 patents /year
Installed base for optics, MEMS and semiconductor > 400 units
Web site: www.fogale-semicon.com
Turnover: 8M€
Staff: 47 (Headquarter)
World-class specialist for conception and manufacturing of
non-contact dimensional metrology systems
Capacitive, eddy currents and optical technologies
Engineering and studies
Conception and manufacturing of standard products
Founded 1983, spin-off of a French national research laboratory: CEA & ONERA
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
Compagny organization
FOGALE Headquarter: 47 employees: 80% are scientists & engineers
Optical
&
semiconductor
Touchless
HMI
System for
Bioprocess
key technologies: Capacitive, Interferometry, optics and Inductive
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
FOGALE Nanotech
•Hardware development
•Software development
•Integration
•Tool development (Beta)
•Automation
•New applications/market
analysis & potential
solutions review
R&D
Applications
Technology Beta tools &
upgrades
Applications/technologies
Common lab in Orsay:
IEF/FOGALE
Research
FOGALE Headquarter
NIMES Application Lab
Aix en Provence
Manufacturing
Toulouse
ORGANIZATION
Subsidiaries:
FOGALE Inc.
Boston USA
FOGALE Asia
Tainan Taiwan
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
FOGALE
DISTRIBUTORS & FIELD SERVICE
WORLDWIDE Network
FOGALE ASIA
Taipei
Tainan: Field Service
FOGALE nanotech France Headquarter
Ville Active – Acti +
125, Rue de l’Hostellerie
30900 NIMES
FOGALE nanotech Inc.
Main Office:
1714, Lombard Street
San Francisco, CA 94123
Tel: 818 206 8525
Fax: 818 518 1085
Dean Turnbaugh NVT VTC
Engineering: Boston Mass.
South East Asia
India
APP System
China
First Technology China
Korea
Jung Wong Corporation Japan
APPEX Corporation
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
Semicon market
3D integration: Stacking of multiple chips on top of each
other within a single semiconductor package
MEMS: Micro Electro Mechanical System
Substrate dimensional control
TTV, bow, warp and surface topography
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
R&D Labs
Technology center, pilot lines & MEMS medium size facilities
Large size facilities
PRODUCTS: FROM LAB TO FABS
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
DEEPROBE
Qualified and certified by IMEC
Technology Low coherence IR interferometry for step height measurement
(Patented)
Applications High A/R TSV depth measurement for 200 and 300 mm wafer
(Via first & middle)
Benefits Non destructive technology
Fast and easy to use
CCD camera for spot positioning and pattern recognition
Adjustable metrology spot size
TSV diameter > 2 µm A:R up to 30
Calibration and maintenance free
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
T-MAP
Technology Optical Metrology: single or dual sensor configuration
Multi sensor configuration
IR and/or White Light
Applications Substrate Thickness, TTV, bow and warpage
Wafer on temporary carrier: inspection & metrology
Multi layer substrates
Thickness, TTV of mono and SOI wafers: Si,III-V, InP, Sapphire, Glass, Pyrex, Polymers, CdTe, etc
Microscopy and pattern recognition for measurement on product wafers
Surface profiling
Benefits Microscopy and pattern recognition for measurement on product wafer.
Multiple sensor configuration depending on applications.
Refractive index calculation in DUAL configuration mode
Signal quality factor calculation
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
T-MAP MEMSCAN
Technology IR transmission microscopy for inspection and metrology spot positioning (Patented)
Low Coherence IR interferometry
Confocal Chromatic (optional)
Applications Visual Inspection and defect detection by IR microscopy
Profiling and high A:R trench/Via depth measurement.
Membrane thickness mapping
SU8 resist thickness
Detection of membrane non planarity after wafer level packaging
MEMS WLP applications
IR bonded alignment control
Benefits Inspection and metrology performed in one shot with one tool: unique on the market
Tool configuration entirely designed for MEMS applications
Edge contact
vacuum chuck
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
T-MAP DUAL 3D
Unique solutions for R&D and pilot lines
3D IC TSV
FEOL
Transistor manufaturing
TSV formation
Through Silicon Vias
BEOL
Transistors interconnection
Wafer Thinning Backside processing and
Die stacking PROCESS FLOW:
FOGALE Solutions:
Std process New process
TSV depth
measurement
Thickness & Bonding inspection
copper nails dimensional control & die stacking process control
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
3D PROFILER
3D Profilers and MEMS Solution The Optical 3D surface topography is performed by optical interferometry with vertical resolution down to 0.1
nm. All kind of materials can be measured (from 1% to 100% reflectance)..
Technology Full field White light interferometer: z-scan and phase shifting mode
Stroboscopic full field phase and amplitude vibration measurement
Phase shifting measurement for small step height and nanometer level roughness measurement
Applications Bumps process control
Surface topography
MEMS in motion analysis: in-plane and out-of-plane
Analysis under controlled atmosphere (vacuum, temperature or pressure)
Membrane shape
Benefits Sub-nanometer resolution
Fast results
System stability
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
In collaboration since 10 years
Competences Micro and NanoSystems. Focused on innovative micro and nano electromechanical or
electromagnetic devices Strong competences allow the study and realization of test
microdevices, microsensors and MEMS/NEMS in different technologies.
Means Metrology platform and micro & nano technologies center MINERVE: MEMS fab facility, and
Metrology & instrumentation laboratory.
Lab team FOGALE: 2 R&D Engineer
IEF: 4 scientists, 2 Phd, 1 Technicien
Goal Development of new and advanced technologies for killer applications.
Common lab FOGALE/IEF
The Institute of Fundamental Electronic
White Light interferometry
MEMS in motion analysis
Environmental chamber for MEMS analysis
Long working distance interferometric objectives
Wafer Level Packaging
Hermiticity
Contacts: Alain Bosseboeuf
Gilles Fresquet/ Philippe Coste
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
Market: MEMS
Killer applications: wireless, smart phones,
medical, industrial, imagers, defense, automotive …
MEMS products: accelerometers, resonnators,
Pressure sensors, bioMEMS, micromirors…
FOGALE Solutions: Development of new sensors, wafer level packaging of MEMS and MEMS
above CMOS require advance metrology products. MEMS manufacturers require multiple
functions in one tool.
FOGALE offers such solution: The MEMSCAN
Membrane Thickness Membrane shape and inspection
After WLP MEMS above CMOS inspection IR microscopy
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
FOGALE MEMS Process control versatile solutions
Membrane thickness mapping (IR interferometry)
Out of the Plane registration (Moire)
Bonding process control (IR microscopy, IR interferometry, Confocal chromatic)
Through Si cap membrane shape (IR microscroscopy + IR interferometry)
Long distance (few cm) CD measurement (Pattern rec, High precision stage
displacement)
High A/R cavity depth and top CD measurement (patented IR method)
Surface profiling (Confocal chromatic or WLI)
MEMS in motion analysis (WLI with stroboscopic illumination)
Measurement under controlled atmosphere (P, Vacuum, T°c…)
IR inspection
Customized solutions
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
3D Surface Profiling: Full Field White Light Interferometer
Objective
Step height, 3D metrology and Roughness
Z-scan
A
B
h
For step height > 500 nm z-scanning
Accuracy: 1 to 10nm
For step height < 500 nm Phase shifting
Accuracy: 0.1nm
Example: Pilar height measurement
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
1) 3D Surface Profiling: Full Field White Light Interferometer
Some Results
PZT Membrane Copper RDL
Top and bottom CD of a line
3D measurement of interconnect metal layer Micro accelerometer
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
1) 3D Surface Profiling: Full Field White Light Interferometer
Film Thickness measurement and buried surface 3D profiling
ng x d
film (ng)
Substrat
d
Sample
650 µm
~4 µm
Objective
A
Example: 3D Profile through 120µm Thick layer
Surface Buried layer
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
1) 3D Surface Profiling: Confocal Chromatic technology
Spectrometer
Light source
Control unit
Probe
Object surface Measurement range
Optical fiber
FPGA Calculator
Single point method: no z-scan required due to multi confocal points
x,y scan only
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
1) 3D Surface Profiling: Confocal Chromatic technology
Low cost solution for high speed surface profiling:
Step height
Full scanning across the entire wafer diameter
Bump height and co-planarity
Capability to measure surface shape at the same time.
Accuracy down to 10nm depending on sensor measurement range
Speed: Up to 2KHz
Example:
Trench depth and profile across a wafer diameter and substrate flatness: 10000 data points obtained in 30 seconds
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
2) MEMS in motion metrology
CCD
Camera
Sample
Objective
Reference
mirror
Beam
splitterStroboscopic
Light source
Beam splitter
Mirau
Interferometric
Objective
Tube
lens
Image
processing
Interferogram
analysis
In-plane
motion
Out-of-plane
motion
CCD
Camera
Sample
Objective
Reference
mirror
Beam
splitterStroboscopic
Light source
Beam splitter
Mirau
Interferometric
Objective
Tube
lens
Image
processing
Interferogram
analysis
In-plane
motion
Out-of-plane
motion
Fringes
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
2) MEMS in motion metrology
Thermally actuated silicone membrane (courtesy Barcelone University)
Phase shifting stroboscopic interferometry
Test device with out of plane actuation
Test device with in plane electrostatic actuation
Electrostatic actuation study
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
3D and Wafer Level Packaging process control
Wafer Level Packaging: IR Inspection and metrology after bonding
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
3D and Wafer Level Packaging process control
Wafer Bonding: Thickness and TTV of individual wafer of a stack
IR microscopy combined with IR interferometry allowed to detect voids at the interfaces and to measure all layers
Bow/Warp measured at the same time than TTV
Layer Bow (um) Warp (um) Average
Thickness (um)
TTV (um)
All -328.706 375.119 1509.816 13.865
Si 779.947 <1um
Glue + Glass 729.869 14.858
Full wafer surface inspection Courtesy of Nanda Tec
Bow/ warp Glue + Glass TTV
Bonding deffects
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
3D and Wafer Level Packaging process control
28 to 29
µm
Spot positioning
6.92 µm
Spot positioning
4 to 8 µm
3D TSV: Metrology to adjust TSV release for 3D stack
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
Demo: Copper Pillar height and co planarity after TSV reveal
Measurement location within a die
IR microscopy with T-MAP Measurement position
Confidential
Courtesy of SEMATECH
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
Copper nails height and co-planarity within a die
Mean plane D
Note: Co planarity within a field of view <<100nm
Confidential
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
Copper nails height within a wafer
Mean: 3.172 µm Sigma: 0.36µm
Max: 4.040µm Min: 2.109 µm (center of wafer)
Confidential
Courtesy of SEMATECH
SEMICONDUCTOR & OPTICAL
METROLOGY SOLUTION
Company Products Applications Organisation Technologies R&D Road map 3D IC customers
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